WO2012073282A1

WO2012073282A1 - Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device

Info

Publication number: WO2012073282A1
Application number: PCT/JP2010/006991
Authority: WO
Inventors: 増田高之
Original assignee: 上野精機株式会社
Priority date: 2010-11-30
Filing date: 2010-11-30
Publication date: 2012-06-07
Also published as: CN103229610B; MY159459A; JP5252516B2; CN103229610A; JPWO2012073282A1; HK1183400A1

Abstract

Disclosed is an electronic component holding device capable at the same time of lifting and lowering at high speeds the means for holding the electronic component, and of precise control of the load applied to the electronic component; also disclosed are an electronic component inspecting device and an electronic component classification device provided with said electronic component holding device. An electronic component holding device (3) is provided with a suction nozzle (301), a servo motor (318) and a voice coil motor (309). The suction nozzle (301) is supported so as to be capable of vertical movement relative to a mounting position, and holds and releases an electronic component (D). The servo motor (318) moves the suction nozzle (301) vertically relative to the mounting position. The voice coil motor (309) is arranged as a separate body from the servo motor (318) and controls, through the suction nozzle (301), the load on the electronic component (D) mounted at the mounting position.

Description

Electronic component holding device, electronic component inspection device including the same, and electronic component classification device

The present invention relates to an electronic component holding device for holding an electronic component, an electronic component inspection device for transporting an electronic component to each process while holding the electronic component by the electronic component holding device, and an electronic component to be held by the electronic component holding device. The present invention relates to an electronic component sorting apparatus that conveys the sheet while transporting it.

In the manufacturing process of an electronic component such as a semiconductor element, an electronic component holding device is often used when transporting to various processing steps. For example, in the post-manufacturing process of electronic components, marking processing, appearance inspection, electrical property inspection, lead molding processing, classification of electronic components, packaging, etc. are performed. The electronic component holding device is disposed in a transport mechanism that transports the electronic component to various processing steps. In addition, an electronic component sorting apparatus that rearranges electronic components such as LED chips arranged on a wafer sheet for each quality has an electronic component holding device arranged on an arm that reciprocates between the wafer sheet and the rearrangement plate. Yes.

This electronic component holding device has a holding means that can be moved up and down with respect to the mounting position of the electronic component, and lowers the holding means to the mounting position so that the electronic component can be detached from the mounting position. Get electronic components from the position. The holding means is, for example, a suction nozzle in which the inside of the pipe communicates with a pneumatic circuit, sucks an electronic component at the mounting position by generating a vacuum, and causes the electronic component to be released to the mounting position by vacuum break.

In this type of electronic component holding device, for example, the suction nozzle is moved up and down to a mounting position by a drive mechanism configured using means such as a cam, a lever, and a rod (see, for example, Patent Documents 1 and 2). .

By the way, with the rapid development of electronic devices in recent years, the processing speed required in the manufacturing process has been increased. For this reason, the speed of raising and lowering the suction nozzle of the electronic component holding device is also required to be increased. On the other hand, since electronic parts have become thinner with the downsizing of electronic devices, the demand for load management applied to the electronic parts by the suction nozzle at the time of receipt and delivery has increased from the viewpoint of preventing damage.

Moreover, in load management, the load requested | required by a process process may differ. For example, a large load is required to fix an electronic component in an electrode cutting or processing step of the electronic component. On the other hand, a large load is not necessary for the electrical characteristic measurement process, and almost no load is necessary for the tape packing, marking, visual inspection process, and the like.

Furthermore, for example, in electrical property inspection, it is important to bring an electronic component and a probe socket into contact with each other with a constant load in order to obtain a reliable test result and good repeatability. In particular, small electronic components are often required to maintain a low load such as 2 Newton or less with high accuracy and stability.

Then, the electronic component holding device is desired to be able to accurately and stably control the load applied to the electronic component. As a mechanism for performing load control, a mechanism for performing load control using a spring or an air cylinder can be considered. In addition, a mechanism that performs load control using a servo motor and a cam mechanism capable of torque control and also functions to control the processing speed and position of the suction nozzle is conceivable.

An electronic component holding device using a servo motor and a cam mechanism will be briefly described. First, on the same axis as the suction nozzle, a rod is slidably disposed by a bearing. A cylindrical cam is rotatably fixed to the rotation shaft of the servo motor, and a cam follower is in contact with the cylindrical cam. The cylindrical cam and the cam follower convert the rotational force of the servo motor into a direction in which the rod is pushed down. When the servo motor is rotated, the rod is lowered toward the suction nozzle, and the suction nozzle is pushed down toward the mounting position of the electronic component. When the suction nozzle comes into contact with the mounting position via the electronic component, the torque of the servo motor is adjusted to apply a desired load to the electronic component. In the electronic component inspection apparatus, a desired load is applied to the electronic component for each processing step by adjusting the torque of the servo motor for each processing step for processing the electronic component.

Japanese Patent No. 2620646 Japanese Patent Laid-Open No. 2002-127064

As described above, the electronic component holding device is desired to be able to accurately and stably control the load applied to the electronic component, but there is a problem that the load cannot be easily changed in an example using a spring. In an example using an air cylinder, the response speed is slow due to its characteristics, so it cannot answer the increase in speed.

When performing load control, speed control, and position control using a servo motor and cam mechanism, it is possible to meet the requirements of variable load and high speed to some extent, but due to the characteristics of the servo motor, for example, 2 Newton If a low load in the following range is applied, the control becomes unstable. As a result, reliable test results and good repeatability may not be obtained particularly in electrical property inspection. This tendency becomes stronger in AC tests such as high-frequency characteristics.

The present invention has been proposed in order to solve the above-described problems of the prior art, and it is possible to increase both the speed of raising and lowering the electronic component holding means and the precise control of the load applied to the electronic component. It is an object of the present invention to provide an electronic component holding device, an electronic component inspection device including the electronic component holding device, and an electronic component classification device.

An electronic component holding device according to the present invention is an electronic component holding device that receives and delivers an electronic component to and from a placement position, and is supported so as to be movable up and down with respect to the placement position. The holding means for separating, the drive control means for raising and lowering the holding means with respect to the mounting position, and the load on the electronic component placed at the mounting position and arranged separately from the drive control means Load control means for controlling the above-mentioned via the holding means.

The drive control means is disposed above the holding means and a separation biasing body that biases the holding means in a direction to separate the holding means from the mounting position, and is supported to be movable up and down with respect to the mounting position. A driving body, and a motor for lowering the holding means in the direction of the mounting position via the driving body against the biasing of the separation biasing body, and the load control means includes the driving A voice coil motor that is disposed on the body and varies the pressing force according to the applied voltage value, and is disposed on the drive body so as to be positioned coaxially with the holding means, and the pressing force of the voice coil motor is And a rod that transmits to the holding means.

The load control means may further include an auxiliary biasing body that biases the rod in the direction of the holding means so as to cancel the biasing force of the separation biasing body.

The electronic component inspection apparatus according to the present invention is an electronic component inspection apparatus that performs various process processes while conveying the electronic component, and is arranged along the processing path of the electronic component, and the electronic component is placed Various process processing means each having a stage to be carried, a transport means for transporting the electronic component to the various process processing means, and disposed on the transport means and supported so as to be movable up and down with respect to the stage, The holding means for delivering the electronic component to the stage, the drive control means for moving the holding means up and down with respect to the stage, and the drive control means are arranged separately from each other and placed on the stage Load control means for controlling a load on the electronic component via the holding means.

The drive control means includes a separation urging body that urges the holding means in a direction to move away from the stage, a drive body that is disposed above the holding means and supported to be movable up and down with respect to the stage; A motor for lowering the holding means in the direction of the stage through the driving body against the urging force of the separation urging body, and the load control means is disposed on the driving body and applied A voice coil motor that varies the pressing force in accordance with a voltage value that is applied, and the driver that is disposed coaxially with the holding means, and transmits the pressing force of the voice coil motor to the holding means. And a rod.

The voltage value applied to the voice coil motor may be varied in accordance with the various process processing means having the stage for delivering the electronic component.

The electronic component classification apparatus according to the present invention picks up the electronic component from a wafer sheet on which a plurality of unclassified electronic components are arranged based on predetermined classification information, and rearranges the picked-up electronic component In the electronic component classification device to be pasted on the plate, the wafer sheet and the rearrangement plate are supported so as to be movable up and down, holding means for holding the electronic component and transporting from the wafer sheet to the rearrangement plate, Drive control means for raising and lowering the holding means relative to the wafer sheet and the rearrangement plate, and the electronic component placed on the wafer sheet and the rearrangement plate, which are arranged separately from the drive control means Load control means for controlling the load on the through the holding means.

The drive control means is disposed above the holding means, a separation biasing body that biases the holding means in a direction to separate the holding means from the wafer sheet and the rearrangement plate, and is disposed on the wafer sheet and the rearrangement plate. A driving body supported so as to be movable up and down, and a motor for lowering the holding means toward the wafer sheet or the rearrangement plate via the driving body against the biasing of the separation biasing body. The load control means is disposed on the drive body, and is disposed on the drive body so as to be positioned above the holding means, and a voice coil motor that varies the pressing force according to an applied voltage value. And a rod that transmits the pressing force of the voice coil motor to the holding means.

According to the present invention, by separating the load control means from the drive control means, it is possible to perform load control using various means capable of high-precision control with a low load while maintaining high-speed elevation of the holding means. .

It is a side view which shows the structure of an electronic component holding apparatus. It is a figure which shows the load when a voice coil motor is driven. It is a figure which shows the structure of a voice coil motor. It is a top view which shows the structure of an electronic component inspection apparatus. It is a side view which shows the structure of an electronic component inspection apparatus. It is a top view which shows the structure of an electronic component classification device. It is a side view which shows the electronic component holding | maintenance apparatus with which an electronic component classification device is equipped.

Hereinafter, embodiments of an electronic component holding device, an electronic component inspection device, and an electronic component classification device according to the present invention will be described in detail with reference to the drawings.

(Electronic component holding device)
FIG. 1 shows the configuration of the electronic component holding device 3. The electronic component holding device 3 delivers the electronic component D on the stage 4a. The stage 4 a is a mounting position of the electronic component D, and is provided in each process processing mechanism 4 that processes the electronic component D. The electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of semiconductor elements include transistors, integrated circuits, resistors, capacitors, LED chips, and the like.

The electronic component holding device 3 has a suction nozzle 301. The suction nozzle 301 moves up and down with respect to the stage 4a to hold and detach the electronic component D.

The suction nozzle 301 is a pipe having an opening at a tip 302 and having a hollow inside. The suction nozzle 301 is supported by an arm 303 having a fixed height with respect to the stage 4a, and is located above the stage 4a. The arm 303 extends substantially parallel to the stage 4a, and a bearing 304 perpendicular to the stage 4a is provided at the tip. The suction nozzle 301 is slidably supported with respect to the arm 303 by being inserted into the bearing 304 with the tip 302 facing the stage 4a.

The suction nozzle 301 communicates with the pneumatic circuit through the ejector 305 connected to the rear end, sucks the electronic component D at the tip when a vacuum is generated, and releases the electronic component D by vacuum break.

A first compression spring 306 is inserted into the suction nozzle 391 and installed at the upper edge of the bearing 304 of the arm 303. A flange 307 is provided on the rear end side of the suction nozzle 301, and the first compression spring 306 biases the suction nozzle 301 away from the stage 4a via the flange 307.

Above the suction nozzle 301, a drive body 308 having a voice coil motor 309 and a rod 310 is installed so as to be able to descend in a direction to push down the suction nozzle 301. The driving body 308 has a substantially U-shaped frame 311.

The frame lower arm 312 of the driving body 308 extends horizontally with respect to the stage 4a, and a bearing 313 perpendicular to the stage 4a is provided through the tip. The rod 310 is slidably supported by the bearing 313. The arrangement position of the rod 310 is above the suction nozzle 301 and is coaxial with the suction nozzle 301.

The rear end of the rod 310 is connected to the voice coil motor 309. The rear end of the rod 310 is the end opposite to the front end facing the suction nozzle 301. The voice coil motor 309 is fixed to the lower surface of the frame upper arm 314 of the driver 308.

A second compression spring 315 is inserted into the rod 310 on the lower surface of the frame lower arm 312. A flange 316 is provided on the distal end side of the rod 310, and the second compression spring 315 urges the rod 310 in the direction in which the suction nozzle 301 is pushed down via the flange 316. Note that the second compression spring 315 maintains a state of being compressed by the stopper.

The driving body 308 is supported by the linear guide 317 so as to be slidable in the direction in which the suction nozzle 301 is pushed down. The linear guide 317 extends in a direction perpendicular to the stage 4a and has a fixed height. The electronic component holding device 3 includes a servo motor 318, converts the rotational force of the servo motor 318 into a linear direction parallel to the linear guide 317, and lowers the driving body 308.

A cylindrical cam 319 having a circumferential surface as a cam surface is attached to the rotation shaft of the servo motor 318. A cam follower 320 that abuts on the cylindrical cam 319 is installed on the upper surface of the frame upper arm 314 of the driving body 308. The rotational force of the servo motor 318 is converted into a linear force along the linear guide 317 by the cylindrical cam 319 and the cam follower 320, and the driving body 308 descends while contacting the suction nozzle 301.

The drive body 308 is connected to a spring 321 that pulls up the frame 311, and the cam follower 320 and the cylindrical cam 319 are pressed by the spring 321.

The operation of the electronic component holding apparatus 3 will be described with reference to FIGS. FIG. 2 is a diagram illustrating a load applied to the electronic component D when the voice coil motor 309 is driven. FIG. 3 is a diagram showing the configuration of the voice coil motor 309.

The servo motor 318, the cylindrical cam 319, the cam follower 320, the drive body 308, and the first compression spring 306 serve as drive control means for moving the suction nozzle 301 up and down relative to the stage 4a. In particular, the servo motor 318, the cylindrical cam 319, the cam follower 320, and the driving body 308 lower the suction nozzle 301. The first compression spring 306 becomes a separation biasing body that raises the suction nozzle 301 by the separation biasing force A.

The voice coil motor 309, the rod 310, and the second compression spring 315 serve as load control means. The second compression spring 315 becomes an auxiliary biasing body having an auxiliary biasing force B that cancels the separation biasing force A of the first compression spring 306, and assists the thrust C of the voice coil motor 309.

In such an electronic component holding device 3, first, the servo motor 318 is driven and the cylindrical cam 319 is rotated. The cam follower 320 that is in contact with the cam surface of the cylindrical cam 319 receives a thrust toward the stage 4a. The thrust toward the stage 4 a becomes a moving force of the driving body 308 toward the suction nozzle 301, and the driving body 308 descends along the linear guide 317.

When the driving body 308 is lowered, the rod 310 comes into contact with the rear end of the suction nozzle 301. When the servo motor 318 further rotates the cylindrical cam 319, the driving body 308 pushes down the suction nozzle 301. The suction nozzle 301 starts to descend against the pushing biasing force of the first compression spring 306 and comes into contact with the stage 4a via the electronic component D.

When the electronic component D is placed on the stage 4a, the electronic component D is held in advance at the tip 302 of the suction nozzle 301 by the generation of a vacuum. When receiving the electronic component D from the stage 4a, the electronic component D is placed on the stage 4a in advance.

The lowering amount of the suction nozzle 301 is controlled by, for example, attaching an encoder to the servo motor 318 and detecting the rotation amount of the servo motor 318 by the encoder. That is, it may be determined that when the servo motor 318 rotates by a predetermined amount, the suction nozzle 301 comes into contact with the stage 4a via the electronic component D.

The spring constants of the first compression spring 306 and the second compression spring 315 are selected so that the urging force is the same. Accordingly, as shown in FIG. 2, the separation biasing force A that pushes up the suction nozzle 301 of the first compression spring 306 is offset by the auxiliary biasing force B that pushes down the suction nozzle 301 via the rod 310 of the second compression spring 315. In a state where the suction nozzle 301 is in contact with the stage 4a via the electronic component D, if the thrust C of the voice coil motor 309 is ignored, the load with which the suction nozzle 301 presses the electronic component D is 0 Newton.

It is desirable that the first compression spring 306 and the second compression spring 315 have the same spring constant. However, when it is difficult due to individual differences, the second compression spring 315 is the same as the first compression spring 306. The spring constants are the same or slightly smaller.

A voltage according to a desired load is applied to the voice coil motor 309. As shown in FIG. 3, the voice coil motor 309 includes a magnet 51 provided in a T shape, an annular coil 52, and an elevating part 53 installed below the annular coil 52. 53, the rear end of the rod 310 is fixed. The rod 310 is located on the central axis of the annular coil 52.

When a voltage is applied to the voice coil motor 309, a current flows through the annular coil 52, and a thrust C in a direction to push down the rod 310 is applied to the elevating part 53. The voice coil motor 309 has a proportional relationship between current (voltage) and thrust C. As shown in FIG. 2, the suction nozzle 301 receives a load equivalent to the thrust C of the voice coil motor 309 due to the cancellation of the separation biasing force A of the first compression spring 306 by the auxiliary biasing force B of the second compression spring 315. Communicated.

Specifically, the load Fd applied to the electronic component D is
Fd = Fc− | Fa + Fb |
Fc: Thrust C of voice coil motor 309
Fa: separation biasing force A of the first compression spring 306
Fb: auxiliary biasing force B of the second compression spring 315
It becomes.

That is, a load equivalent to the thrust C of the voice coil motor 309 is applied to the electronic component D disposed between the suction nozzle 301 and the stage 4a.

When the load that the suction nozzle 301 presses the electronic component D is set to 0 Newton, the voltage applied to the voice coil motor 309 corresponds to the difference between the urging forces of the first compression spring 306 and the second compression spring 315. Correspond to thrust.

Thus, in the electronic component holding device 3 according to this embodiment, the load applied to the electronic component D is adjusted by adjusting the voltage applied to the voice coil motor 309.

(Electronic component inspection equipment)
The electronic component inspection apparatus 1 including the electronic component holding device 3 will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is a diagram showing a schematic configuration of the electronic component inspection apparatus 1. FIG. 5 is a diagram illustrating a schematic configuration of the transport mechanism.

The electronic component inspection apparatus 1 according to the present embodiment is an apparatus that performs various process processes while aligning and conveying the electronic component D. The various process processes are mainly inspection processes after each assembly process such as dicing, mounting, bonding, and sealing, and include marking, visual inspection, test contact, sorting and sorting, and packing process. .

The electronic component inspection apparatus 1 includes various process processing mechanisms 4 for the electronic component D and a transport mechanism that transports the electronic components D to the various process processing mechanisms 4. The transport mechanism includes a turntable 21. The center of the turntable 21 is supported by a drive shaft of a direct drive motor 22 disposed below. The turntable 21 rotates intermittently at a predetermined angle as the direct drive motor 22 is driven.

A plurality of suction nozzles 301 of the electronic component holding device 3 are attached to the outer peripheral end of the turntable 21, and are spaced apart at equal intervals along the outer periphery of the turntable 21. In this transport mechanism, the outer periphery of the turntable 21 serves as a processing path for the electronic component D. The transport mechanism holds the electronic component D by the suction nozzle 301, aligns it with the outer periphery of the turntable 21, and rotates the turntable 21 to transport the electronic component D in the outer peripheral direction. The arrangement interval of the electronic component holding device 3 is equal to the rotation angle of one pitch of the turntable 21.

An inverted L-shaped frame 23 is fixed above the stop position P of each suction nozzle 301. By installing the linear guide 317 along the arm extending perpendicularly to the stage 4a, the driving body 308 is slidably supported on the outer peripheral end side of the turntable 21. The servo motor 318 is installed on the upper surface of the arm extending in parallel with the stage 4a, and the cylindrical cam 319 is installed rotatably on the lower surface of the arm.

Various process processing mechanisms 4 surround the turntable 21 and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the turntable 21. The arrangement positions of the various process processing mechanisms 4 coincide with the stop positions P of the holding means. Each of the various transport processing mechanisms is arranged at each stop position P. If the number of stop positions is equal to or greater than the number of transport processing mechanisms 4, these numbers may not be the same, and there may be a stop position P where the transport processing mechanism 4 is not disposed.

As the various process processing mechanisms 4, for example, the parts feeder 41, the test contact device 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, the taping unit 47, and the discharge of defective products are sequentially performed in the rotation direction of the turntable 21. A device 48 is arranged.

The parts feeder 41 is a device that supplies the electronic component D to the electronic component inspection apparatus 1, and supplies a large number of electronic components D in a line up to just below the outer peripheral edge of the turntable 21. The test contact device 42 has a contact that is a plate-like metal such as beryllium copper, and contacts the electronic component D with a probe socket with a constant load to pass an electric current or apply a voltage to the electronic component. Measure and inspect electrical characteristics such as voltage, current, resistance, or frequency of D.

The marking unit 43 has a lens for laser irradiation facing the electronic component D, and performs marking by irradiating the electronic component D with a laser. The appearance inspection apparatus 45 has a camera, images the electronic component D, and inspects the presence or absence of an electrode shape, surface defects, scratches, dirt, foreign matter, and the like of the electronic component D from the image.

The classification / sorting mechanism 46 classifies the electronic component D into a defective product and a non-defective product according to the results of the appearance inspection and the electrical property inspection, and classifies and shoots according to the level. The taping unit 47 intermittently transports the carrier tape in which the storage pocket of the electronic component D is formed by embossing, and stores the electronic component D determined to be non-defective in the storage pocket. The defective product discharge device 48 discharges the electronic component D that has not been taped and packed from the electronic component inspection device 1.

Such an electronic component inspection apparatus 1 operates as follows. First, one cycle of the operation of the electronic component inspection apparatus 1 includes conveyance and process processing. In the conveyance, the electronic component D is received, the electronic component D is moved, and the electronic component D is transferred in order.

In receiving the electronic component D, the suction nozzle 301 is lowered, the load and suction on the electronic component D on the stage 4a of the process processing mechanism 4 and the suction nozzle 301 are lifted in order. In the delivery of the electronic component D, the suction nozzle 301 is lowered, the load and separation of the electronic component D on the stage 4a of the process processing mechanism 4 and the suction nozzle 301 are lifted in order.

Individually, the turntable 21 rotates by a predetermined angle every cycle and stops for a predetermined time. Each suction nozzle 301 sequentially moves to each stop position P on the outer periphery of the turntable 21 by intermittent rotation of the turntable 21.

At the stop position P of the suction nozzle 301, any kind of process processing mechanism 4 is arranged. When each suction nozzle 301 moves to the stop position P, it is pushed down by the drive of the servo motor 318 through the driving body 308 and descends toward the stage 4 a of the process processing mechanism 4. In the state where the voltage is applied to the voice coil motor 309 before the electronic component D is abutted to generate a thrust C, and the suction nozzle 31 is abutted against the stage 4a via the electronic component D, the rod A desired load is applied to the electronic component D through 310 and the suction nozzle 301. The timing of voltage application to the voice coil motor 309 may be simultaneous with the start of driving of the servo motor 318, or may be immediately before the contact of the electronic component D based on the position information obtained by the encoder. Is possible.

The voltage applied to the voice coil motor 309 is varied for each electronic component holding device 3 and for each process. Specifically, the electronic component inspection apparatus 1 has a control unit (not shown). In the control unit, offset information and load information are stored in advance. The offset information is stored corresponding to each electronic component holding device 3. Load information is stored corresponding to each process mechanism 4.

The offset information indicates a thrust that fills a solid difference between the separation biasing force A of the first compression spring 306 and the auxiliary biasing force B of the second compression spring 315. The load information indicates a load applied to the electronic component D in the processing by the process processing mechanism.

The control unit applies the offset information corresponding to the electronic component holding device 3 and the load corresponding to the process processing mechanism 4 to the voice coil motor 309 of the electronic component holding device 3 positioned on the stage 4a of the predetermined process processing mechanism 4. A voltage corresponding to the total load indicated by the information is applied. As a result, a desired load is applied to the electronic component D in each processing step.

When the process processing mechanism 4 receives the electronic component D, the process processing mechanism 4 processes the electronic component D. When the processing for the electronic component D is completed, the suction nozzle 301 is lowered again toward the stage 4a, and is sucked and lifted while applying a desired load to the electronic component D. When the suction nozzle 301 holds the electronic component D, the turntable 21 moves to the next cycle and rotates by a predetermined angle.

(Electronic component classification device)
The electronic component holding device 3 according to the present embodiment can be applied to the electronic component classification device 100 in addition to the electronic component inspection device 1. Hereinafter, an application example of the electronic component classification device 100 including the electronic component holding device 3 according to the present embodiment will be described.

As shown in FIG. 6, in the electronic component sorting apparatus 100, a wafer holding stage 102 for holding a wafer sheet 101 is provided so as to be movable in three directions of an X axis, a Y axis, and a θ axis. A wafer drive mechanism is attached to the wafer holding stage 102. The wafer drive mechanism is a mechanism for moving the wafer sheet 101 on the wafer holding stage 102 in three directions of the X axis, the Y axis, and the θ axis. In the electronic component sorting apparatus 100, the wafer drive mechanism moves the wafer sheet 101 on the wafer holding stage 102, and the electronic component D to be picked up on the wafer sheet 101 is picked up in a desired posture in a predetermined pickup point. Located at P1.

A rearrangement stage 103 that can move in the X-axis and Y-axis directions is disposed adjacent to the wafer holding stage 102. A rearrangement plate 104 made of a BIN plate or the like is placed on the rearrangement stage 103. The rearrangement plate 104 aligns the electronic components D of the same rank on the adhesive sheet on the surface in a rectangular shape.

The rearrangement stage 103 is provided with a rearrangement plate driving mechanism. The rearrangement plate driving mechanism is a mechanism for moving the rearrangement stage 103 in the X-axis and Y-axis directions. In the electronic component sorting apparatus 100, the rearrangement plate 104 is pitch-shifted by the rearrangement plate driving mechanism, and the pasting target space of the rearrangement plate 104 is positioned at a predetermined pasting point P2.

A swivel arm 106 is provided between the wafer holding stage 102 and the rearrangement stage 103 as a means for transporting the electronic component D. An electronic component holding device 3 is fixed to the tip of the swivel arm 10. The turning arm 106 performs a reciprocating turning operation so as to reach above the pickup point P1 and the pasting point P2, and stops the turning operation at each of the points P1 and P2.

In addition, the electronic component classification apparatus 100 includes an imaging unit 105 that captures an image of one point on the locus of the suction nozzle 301. The imaging means 105 is, for example, a CCD image sensor or a CMOS image sensor. The imaging unit 105 captures an image of the electronic component D sucked by the suction nozzle 301 at the timing when the suction nozzle 301 reaches the imaging point. The electronic component classification apparatus 100 acquires the posture information of the electronic component D from this image, and moves the rearrangement plate 104 according to the posture information.

An electronic component holding device 3 in such an electronic component classification apparatus 100 is shown in FIG. As shown in FIG. 7, the turning arm 106 includes an upper turning arm 106a and a lower turning arm 106b. An inverted L-shaped frame 107 in which a servo motor 318, a cylindrical cam 319, a cam follower 320, and a driving body 308 are disposed is fixed to the upper turning arm 106a. An arm 303 on which the suction nozzle 301 and the first compression spring 306 are disposed is fixed to the lower turning arm 106b.

The tip of the arm 303 is at a position extending in the horizontal direction from the axial point of the rod 310. The suction nozzle 301 is supported by a bearing 304 penetrating at the tip of the arm 303, and an extension member 301 a extending to the position immediately below the rod 310 is extended at the rear end of the suction nozzle 301. The servo motor 318, the drive body 308, and the like do not exist immediately above the suction nozzle 301, and are a space portion. The imaging means 105 images the electronic component D sucked by the suction nozzle 301 through this space portion.

The first compression spring 306 is positioned on the same axis as the rod 310, and is disposed on the upper surface of the arm 303 so as to push up the extension member 301a from below. The suction nozzle 301 is biased so as to be lifted upward by the first compression spring 306 via the extension member 301a. Further, the suction nozzle 301 is pushed down toward the wafer sheet 101 and the rearrangement plate 104 via the extension member 301 a and the driving body 308.

The separation biasing force A of the first compression spring 306 and the auxiliary biasing force B of the second compression spring 315 act on the extension member 301a, but are canceled out because they are substantially the same force in the opposite direction, and the load on the suction nozzle 301 Is about 0 Newton when the voice coil motor 309 is not driven.

In such an electronic component classification apparatus 100, the electronic component holding device 3 lowers the suction nozzle 301 to the pickup point P1, and sucks the electronic component D one by one while applying a desired load, and then lifts from the pickup point P1. Let

Specifically, the suction nozzle 301 is pushed down via the driving body 308 by the rotational force of the servo motor 318, and sucks the electronic component D by generating a vacuum while applying a desired load by driving the voice coil motor 309. . After the electronic component D is attracted, the driving body 308 is raised, and the suction nozzle 301 is returned to the raised position by the separation biasing force A of the first compression spring 306.

Then, the turning arm 106 turns while maintaining the rising position of the suction nozzle 301, and stops when the suction nozzle 301 reaches above the attachment point P2. After stopping the swivel arm 106, the electronic component holding device 3 lowers the suction nozzle 301 onto the attachment point P2, and applies the electronic component D onto the rearrangement plate 104 while applying a desired load to the electronic component D. .

Specifically, the suction nozzle 301 is pushed down via the driving body 308 by the rotational force of the servo motor 318, and a desired load is applied by driving the voice coil motor 309, and the electronic component D is detached by vacuum break. . After the electronic component D is detached, the driving body 308 is raised, and the suction nozzle 301 is returned to the raised position by the separation biasing force A of the first compression spring 306.

(effect)
As described above, the electronic component holding device 3 according to the present embodiment is supported so as to be movable up and down with respect to the mounting position of the electronic component D such as the stage 4a, the wafer sheet 101, the rearrangement plate 104, and the like. Holding means for holding and releasing the suction nozzle 301 and the like, and holding the load on the electronic part D product placed at the placement position separately from the drive control means for raising and lowering the holding means relative to the placement position Load control means for controlling through the means is provided.

As the drive control means, for example, the first compression spring 306 that urges the suction nozzle 301 in a direction away from the placement position, and the suction nozzle 301 are disposed above and supported so as to be movable up and down with respect to the placement position. The servo motor 318 lowers the suction nozzle 301 in the direction of the mounting position via the drive body 308 against the bias of the drive body 308 and the first compression spring 306. Further, as the load control means, for example, it is arranged on the driving body 308 and is driven so as to be positioned above or coaxially with the voice coil motor 309 that varies the thrust C according to the applied voltage value and the suction nozzle 301. The rod 310 is disposed on the body 308 and transmits the thrust C of the voice coil motor 309 to the suction nozzle 301.

Thus, by separating the load control means from the drive control means capable of moving the suction nozzle 301 up and down at high speed, it becomes possible to control the load using various motors capable of controlling a low load. It is possible to achieve both high speed and precise load control. In particular, the voice coil motor 309 can perform load control in units of 1 g, and can perform precise load control under a low load.

Even when the first compression spring 306 is used to raise the suction nozzle 301, the low load control by the voice coil motor 309 can be effectively performed by canceling the biasing force by the second compression spring 315. to be certain.

Further, when the electronic component holding device 3 is provided in the electronic component inspection device 1, it is applied to the voice coil motor 309 according to various process processing mechanisms 4 having a stage 4a for delivering the electronic component D. By varying the voltage value, the load control desired for various process processes can be executed more precisely and stably. In particular, in the electrical characteristic inspection, the use of the electronic component holding device 3 enables highly accurate and stable low load control when the probe socket and the electronic component D are in contact with each other. Sex can be obtained.

Although the embodiment of the present invention has been described above, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

For example, in the present embodiment, the case where the servo motor 318 is used as the drive control unit has been described as an example. However, any known motor such as a stepping motor can be applied as the motor. If the load applied to the electronic component D is unified at 0 Newton and the spring constants of the first compression spring 306 and the second compression spring 315 can be made the same, the voice coil motor 308 can be eliminated. Is possible. Furthermore, if the voice coil motor 308 can generate a sufficient thrust, the second compression spring 315 as an auxiliary biasing body can be eliminated.

Further, as a holding means, instead of the suction nozzle 301 for sucking and releasing the electronic component D by generating and breaking a vacuum, an electrostatic chucking method, a Bernoulli chuck method, or a chuck mechanism for mechanically holding the electronic component D is arranged. May be.

As an example of the electronic component inspection apparatus 1, the case where various process processing mechanisms 4 are arranged on one turntable 21 has been described as an example. However, the conveyance mechanism may be a linear conveyance system, or a plurality of turntables. 21 may constitute one conveyance path. The various process processing mechanisms 4 are not limited to the types described above, and can be replaced with various process processing mechanisms 4, and the arrangement order can be changed as appropriate.

DESCRIPTION OF SYMBOLS 1 Electronic component inspection device 21 Turntable 22 Direct drive motor 23 Frame 3 Electronic component holding device 301 Suction nozzle 301a Extension member 302 Tip 303 Arm 304 Bearing 305 Ejector 306 First compression spring 307 Flange 308 Driver 309 Voice coil motor 310 Rod 311 Frame 312 Frame lower arm 313 Bearing 314 Frame upper arm 315 Second compression spring 316 Flange 317 Linear guide 318 Servo motor 319 Cylindrical cam 320 Cam follower 321 Spring 4 Process processing mechanism 4a Stage 41 Parts feeder 42 Test contact 43 Marking unit 45 Visual inspection device 46 Sorting and sorting mechanism 47 Taping unit 48 Defective product discharge device 51 Magnet 52 Ring coil 53 Lifting unit 100 Electronic component sorting device Device 101 wafer sheet 102 wafer holding stage 103 rearrangement stage 104 rearrangement plate 105 imaging means 106 swivel arm 106a upper swivel arm 106b lower swivel arm 107 frame A separation biasing force B auxiliary biasing force C thrust D electronic component P stop position P1 Point P2 Point

Claims

An electronic component holding device for receiving and delivering electronic components to and from a mounting position,
A holding means supported so as to be movable up and down with respect to the mounting position, and holding and releasing the electronic component;
Drive control means for raising and lowering the holding means relative to the mounting position;
A load control means that is arranged as a separate body from the drive control means and controls a load applied to the electronic component placed at the placement position via the holding means;
Providing
An electronic component holding device.
The drive control means includes
A separation urging body that urges the holding means in a direction to separate from the placement position;
A driving body disposed above the holding means and supported so as to be movable up and down with respect to the mounting position;
A motor for lowering the holding means in the direction of the mounting position via the driving body against the biasing of the separation biasing body;
Including
The load control means includes
A voice coil motor that is disposed in the driver and varies the pressing force in accordance with an applied voltage value;
A rod that is disposed on the driving body so as to be positioned coaxially with the holding means, and that transmits the pressing force of the voice coil motor to the holding means;
Including,
The electronic component holding apparatus according to claim 1.
The load control means includes
An auxiliary biasing member that biases the rod in the direction of the holding means so as to cancel the biasing force of the separation biasing member;
The electronic component holding device according to claim 2.
An electronic component inspection apparatus that performs various process processes while conveying electronic components,
Various process processing means arranged side by side in the processing path of the electronic component, each having a stage on which the electronic component is placed,
Conveying means for conveying the electronic component to the various process processing means;
A holding unit that is disposed on the transfer unit and supported to be movable up and down with respect to the stage, and delivers the electronic component to the stage;
Drive control means for raising and lowering the holding means relative to the stage;
A load control means arranged separately from the drive control means, for controlling a load on the electronic component placed on the stage via the holding means;
Providing
An electronic component inspection apparatus characterized by.
The drive control means includes
A separation biasing body that biases the holding means in a direction to separate the holding means from the stage;
A driving body disposed above the holding means and supported to be movable up and down with respect to the stage;
A motor for lowering the holding means in the direction of the stage via the driving body against the biasing of the separation biasing body;
Including
The load control means includes
A voice coil motor that is disposed in the driver and varies the pressing force in accordance with an applied voltage value;
A rod that is disposed on the driving body so as to be positioned coaxially with the holding means, and that transmits the pressing force of the voice coil motor to the holding means;
Including,
The electronic component inspection apparatus according to claim 4.
The load control means includes
An auxiliary biasing member that biases the rod in the direction of the holding means so as to cancel the biasing force of the separation biasing member;
The electronic component inspection apparatus according to claim 5.
Varying a voltage value applied to the voice coil motor in accordance with the various process processing means having the stage for delivering the electronic component;
The electronic component inspection apparatus according to claim 5 or 6.
In an electronic component classification apparatus that picks up the electronic component based on predetermined classification information from a wafer sheet on which a plurality of unclassified electronic components are arranged, and pastes the picked-up electronic component on a rearrangement plate.
A holding means that is supported so as to be movable up and down with respect to the wafer sheet and the rearrangement plate, and holds the electronic component from the wafer sheet to the rearrangement plate;
Drive control means for raising and lowering the holding means relative to the wafer sheet and the rearrangement plate;
A load control means arranged separately from the drive control means, for controlling a load on the electronic components placed on the wafer sheet and the rearrangement plate via the holding means;
Providing
An electronic component classification device characterized by the above.
The drive control means includes
A separation biasing body that biases the holding means in a direction to separate the holding sheet from the wafer sheet and the rearrangement plate;
A driver disposed above the holding means and supported to be movable up and down relative to the wafer sheet and the rearrangement plate;
A motor for lowering the holding means in the direction of the wafer sheet or the rearrangement plate via the driving body against the biasing of the separation biasing body;
Including
The load control means includes
A voice coil motor that is disposed in the driver and varies the pressing force in accordance with an applied voltage value;
A rod disposed on the driving body so as to be positioned above the holding means, and transmitting the pressing force of the voice coil motor to the holding means;
Including,
The electronic component classification apparatus according to claim 8.
The load control means includes
An auxiliary biasing member that biases the rod in the direction of the holding means so as to cancel the biasing force of the separation biasing member;
The electronic component classification apparatus according to claim 9.