JP5038783B2 - Film supply mechanism - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device that seals a substrate on which a semiconductor chip or the like is mounted with resin.

  Since a substrate on which a semiconductor chip or the like is mounted is easily affected by the external environment as it is, resin sealing using a thermosetting resin or the like is performed. Such resin sealing is performed by, for example, injecting a resin into the cavity part or compressing the cavity part after clamping the substrate with a resin sealing mold composed of an upper mold and a lower mold.

  Various ideas have been devised on the resin itself and on the mold surface so that the resin used does not adhere to the mold side, but it is difficult to completely prevent it. If the resin adheres to the mold, it may be difficult to remove the substrate or cause a sealing abnormality in the subsequent sealing operation. Therefore, as described in Patent Document 1, a method of interposing a release film made of a material such as PTFE on the mold surface is preferably used for resin sealing. Here, a supply roll in which a release film is wound in a roll shape and a collection roll for collecting a used release film are arranged at positions facing each other with a mold interposed therebetween, and a release film by a “roll to roll” Is being supplied.

  However, in the configuration in which the rolls are provided at the positions facing each other with the mold interposed therebetween, the compactness of the entire resin sealing device is adversely affected, the roll replacement work is complicated, and the release film is wasted. There are also inconvenient points, such as many. Therefore, a proposal has already been made to cut the release film into strips having a predetermined length and supply the strip-like release film to the tree-molding mold (see Patent Document 2). Here, when cutting a roll-shaped release film into a strip-shaped release film, one end of a release film wound in a roll shape (hereinafter sometimes simply referred to as “roll body”) is a movable plate ( The roll-shaped release film “whole” moves with respect to the movable plate after being sucked and fixed to the suction portion of the frame structure that can transport the film to the next stage while holding the film. A configuration is adopted in which the film is drawn and the drawn release film is cut.

Japanese Patent Laid-Open No. 2007-5496 JP 2000-108159 A

  As in the above-mentioned Patent Document 2, the configuration in which the release film “whole” wound in a roll shape is sequentially moved to draw out and cut the film is a roll release film with respect to the movable plate side. Since it is necessary to move the whole relatively, the number of movable parts increases, and the configuration and its control become complicated. Furthermore, even if the roll-shaped release film side is fixed, the same problem arises from the viewpoint of the configuration and the complexity of the control if a mechanism for gripping and pulling out the film is provided. On the other hand, after fixing the roll-shaped release film side, for example, if the roll body is rotated and sent out, it is possible to make a simple configuration. Therefore, the film is rounded into a roll shape simply by feeding it out, and it is difficult to unfold the film as intended.

  The present invention has been made to solve such problems, and provides a release film supply mechanism capable of delivering a roll-shaped release film as intended and developing and cutting it with a simple configuration. Is.

The present invention is a release film supply mechanism that supplies a release film to a resin-sealed mold, and cuts the release film wound in a roll shape into a strip-like film having a predetermined length. A cutting device, the cutting device sending out a release film wound in a roll shape, a guide plate for guiding the delivered release film, and being sent out on the guide plate the release film and a cutter unit capable separated from the release film wound in the roll shape, a surface of the guide plate, fed by the feed out to part, is guided the guide plate above An object of the present invention is to solve the above problem by providing an air ejection mechanism capable of ejecting air toward the release film.

  That is, without moving the entire release film wound in a roll shape with respect to the guide plate, by blowing out the release film from the guide plate toward the release film, The release film is intended to be spread on the guide plate with a simple configuration. More specifically, it is prevented from being caught on the surface of the guide plate by the blown air, and the release film can be easily developed at the intended position of the guide plate.

  In addition, if air can be sucked using the air jetting mechanism, after the release film is spread (deployed on the guide plate), the jet hole is made to act as a suction hole. It becomes possible to adsorb and fix the release film on the guide plate. As a result, accurate cutting can be performed, and there is no need to separately provide a release film holding means (holding means for the guide plate).

  Furthermore, the apparatus further comprises a transport device that transports the strip-shaped film cut by the cutting device to the resin-sealed mold, and the transport device has a semiconductor chip mounted on the resin-sealed mold. If it is configured to be provided in a substrate transport mechanism for transporting a substrate, it is possible to reduce the cost of the entire release film supply mechanism, and as a whole resin sealing device on which the release film supply mechanism is mounted. It is also possible to use the space effectively.

  By applying the present invention, a roll-shaped release film can be developed on the guide plate with a simple configuration.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  First, the entire resin sealing device on which the release film supply mechanism is mounted will be schematically described, and then the release film supply mechanism will be described.

<Schematic configuration of the entire resin sealing device>
FIG. 1 is a plan view of the resin sealing device 100 and mainly shows the flow of the substrate and the like before resin sealing. FIG. 2 is a plan view of the resin sealing device 100, and is a view mainly showing the flow of the substrate and the like after resin sealing. FIG. 3 is a front view of the resin sealing device 100.

  The resin sealing device 100 includes a resin sealing mold unit 101 including a resin sealing mold 110 (an upper mold 112 and a lower mold 114), and a resin (not shown) for the resin sealing mold unit 101. A resin supply unit 102 that can be supplied and a substrate supply storage unit 103 that supplies a substrate before resin sealing to the resin sealing mold unit 101 and stores a substrate after resin sealing. ing.

  The resin sealing device 100 according to this embodiment is a so-called “multi-press” type resin sealing device in which two rows of resin sealing mold units 101 are arranged. With respect to the resin-sealed mold units 101 arranged in parallel, the resin supply unit 102 is arranged on one side, and the substrate supply / accommodation unit 103 is arranged on the other side. The resin-sealed mold unit 101, the resin supply unit 102, and the substrate supply / accommodating unit 103 are connected to each other, and a continuous movement guide 130 is provided on the movement guide 130. The loader / unloader 140 for use (details will be described later) is movable. Further, the number of resin-sealed mold units 101 can be appropriately increased or decreased, and a single resin-sealed mold unit 101 can constitute a resin-sealed device. It is also possible to arrange three or more resin-encapsulated mold units 101 in parallel.

The resin supply part 102 is a part to which the resin charged into the resin sealing mold 110 is supplied.
The resin supplied from the resin supply unit 102 can supply resins in various states such as pellets, powders, granules, and flats. The resin supplied from the resin supply unit 102 can be supplied to the resin sealing mold 110 in the resin sealing mold unit 101 at a predetermined timing by a resin loader 122 arranged on the movement guide 130. Yes.

  On the other hand, the substrate supply / accommodation unit 103 is resin-sealed by a supply magazine 172 that is a substrate on which a semiconductor chip or the like is mounted and in which a plurality of substrates to be resin-sealed is accommodated, and a resin-sealing mold 110. A storage magazine 174 for storing the sealed substrate is disposed. Both magazines 172 and 174 are arranged at different positions in the vertical direction (see FIG. 3), and the substrates (substrate before sealing and substrate after sealing) are taken in and out via the magazine elevator 170. The substrate supply storage unit 103 includes a pre-heater unit 180 that can warm the substrate taken out from the supply magazine 172 to a predetermined temperature before transporting the substrate to the resin-sealed mold 110. A film supply mechanism 150 is provided that can cut a roll-shaped release film into a strip-shaped film having a predetermined length and supply the strip-shaped film to the resin-sealed mold 110.

  Further, a substrate loader / unloader 140 is disposed on the movement guide 130, and the substrate before sealing is carried into the resin sealing mold 110 or the substrate after sealing is replaced with the resin sealing mold 110. It is possible to carry it out. The substrate loader / unloader 140 can freely move in the X direction on the movement guide 130, and can move a part of itself (film transport unit 142, substrate transport unit 143) back and forth in the Y direction. .

<Overall action of resin sealing device>
The substrate taken out from the supply magazine 172 by the magazine elevator 170 is once heated to a predetermined temperature by the preheater unit 180. Subsequently, after being delivered to the substrate loader / unloader 140, it is transported and supplied to the resin-sealed mold 110 in the resin-sealed mold unit 101 together with the strip-shaped film (or at another timing). The resin supplied from the resin supply unit 102 by the resin loader 122 is supplied to the resin sealing mold 110 at a predetermined timing. After all the materials are put into the resin sealing mold 110, the upper mold 112 and the lower mold 114 are closed and resin sealing is performed.

  The substrate on which the resin sealing has been completed is collected by the substrate loader / unloader 140 together with the strip-shaped film, and moves to the substrate supply / storage unit 103 side. Thereafter, the strip-like film is peeled off from the substrate after resin sealing at the film peeling / recovery position E, and then stored in the storage magazine 174 via the magazine elevator 170. Moreover, the strip-shaped film which peeled is discarded suitably. Thereafter, the sealing operation is repeated by repeating the operation.

  Here, the description is based on the premise of resin sealing by a compression molding method, but a transfer molding resin sealing device may also be used.

<Configuration of release film supply mechanism>
Next, the release film supply mechanism 150 according to the present invention will be described in detail with reference to FIG. FIG. 4 is a schematic configuration diagram of a release film supply mechanism according to the present invention, and is a view showing a state before a roll-like release film is sent out. Here, for ease of understanding, the size of each part is exaggerated.

  The film supply mechanism 150 includes a cutting device 151 capable of cutting the release film 160 wound around the roll body 162 in a roll shape into a predetermined length, and a strip-like film cut into a strip shape by the cutting device 151. A transport device capable of transporting to a resin-sealed mold (lower mold 114 in FIG. 4) is provided.

  In the cutting device 151, a roll body 162 is rotatably held by a roll body holding part 152B provided upright on the support base 152A. A release film 160 is wound around the roll body 162. One end of the roll-shaped release film 160 is engaged with a feed roller (feed-out portion) 153, and the release film wound around the roll body 162 when the feed roller 153 is driven to rotate. 160 is configured to send out a necessary amount. Further, a film cutter 154 capable of cutting the release film 160 fed adjacent to the feed roller 153 is disposed so as to be able to advance and retract. In addition, a guide plate 158 for guiding the release film 160 fed by the feed roller 153 is provided at the tip of the film cutter 154. The guide plate 158 serves as a tray for the release film 160 delivered by the feed roller 153, and can be transferred to a film transport unit 142 (described later) by being driven by itself. ing.

  A support block 157 is connected to the bottom side of the guide plate 158, a first actuator 155 is connected to the support block 157, and a second actuator 156 is connected to the main body of the first actuator 155. It is connected. As a result, the guide plate 158 can freely move up and down, left and right (up, down, left and right in FIG. 4) by the action of the first and second actuators 155 and 156.

  Further, a guide plate air ejection mechanism 158A is provided on the surface of the guide plate 158, and air can be ejected from the surface of the guide plate 158 by the ejection mechanism 158A. Further, the guide plate air ejection mechanism 158A can not only eject air but also suck air.

  On the other hand, the substrate loader / unloader 140 is provided with a film transport unit (transport device) 142. The film transport unit 142 is provided with a film transport unit suction mechanism 142A capable of sucking air, and a release film. Can be adsorbed and held. Further, the film transport unit 142 moves while the substrate loader / unloader 140 moves along the movement guide 130, and moves the release film adsorbed and held by the film transport unit 142 to the lower mold 114 (resin-sealed mold). 110). As described above, the film transport unit 142 is configured to use the substrate loader / unloader 140 that carries the substrate before sealing into the resin-sealed mold or unloads the substrate after sealing. That is, by providing the substrate loader / unloader 140 with the transport device (film transport unit 142) in the film supply mechanism 150, the cost of the film supply mechanism 150 itself is reduced, and the resin on which the film supply mechanism 150 is mounted. The space as the whole sealing device 100 can be effectively used.

<Operation of release film supply mechanism>
Next, the operation of the release film supply mechanism 150 will be described with reference to FIGS. 4 to 13.

  When the release film 160 wound around the roller body 162 is cut into a strip-shaped film, the guide plate 158 first approaches the support base 152A and waits for the release film 160 sent out by the feed roller 153. To do. In this state, the release film 160 is sequentially guided to the guide plate 158 side by driving the feed roller 153. At this time, air is ejected from a guide plate air ejection mechanism 158A provided in the guide plate 158. As a result, the released release film is guided on the guide plate 158 in a so-called “floating state”. As a result, the release film 160 can be easily developed as intended without being caught on the surface of the guide plate. The amount of air ejected from the guide plate air ejection mechanism 158A is appropriately changed depending on the type of the release film 160 and the like. Further, the guide plate air ejection mechanism 158A has a plurality of ejection holes, but the amount of air ejected from each ejection hole may be appropriately changed depending on the position on the guide plate 158.

  After the release film 160 is unintentionally developed on the guide plate 158 by the action of the feed roller 153 and the guide plate air ejection mechanism 158A, the ejection of air from the guide plate air ejection mechanism 158A is stopped. Thus, air is sucked using the guide plate air ejection mechanism 158A. That is, the release film 160 developed on the surface of the guide plate 158 is sucked. In this embodiment, since air can be sucked using the guide plate air ejection mechanism 158A, after the development of the release film 160 (deployment on the guide plate 158) is completed, the ejection hole 158A is opened. The release film 158 can be sucked and fixed on the guide plate 158 by acting as a suction hole. As a result, the cutting operation described below can be performed accurately, and there is no need to separately provide a holding means for the release film 160 (holding means for the guide plate 158).

  After the adsorption, the film cutter 154 operates to cut the release film 160 into a strip shape (see FIG. 6). In this specification, the release film 160 cut into strips by the film cutter 154 will be described with reference numeral 161 called “strip-shaped film” for convenience of explanation.

  Subsequently, as shown in FIG. 7, the strip-shaped film 161 cut by the film cutter 154 is moved toward the film transport unit 142 side by the action of the first actuator 155 and the second actuator 156 while being sucked and held by the guide plate 158. Begin to. When the guide plate 158 comes into contact with the film transport unit 142, the suction of the strip-shaped film 161 on the guide plate 158 is released almost at the same time, and instead, the suction of the film transport unit 142 is started. This suction is performed by the film transport unit suction mechanism 142A. Thereby, the delivery of the strip-shaped film 161 from the guide plate 158 to the film transport unit 142 is completed.

  The strip-shaped film 161 delivered to the film transport unit 142 side is a resin-sealed mold together with the substrate before sealing (or at a different timing from the substrate before sealing) by the substrate loader / unloader 140. It is conveyed to the lower mold 114 side (FIGS. 9 and 10). At the same time, the guide plate 158 is returned to its original position.

  When the film transport unit 142 reaches a position directly above the lower mold 114, the entire lower mold 114 moves toward the film transport unit 142 by the action of a press mechanism (not shown) connected to the lower mold 114. come. Thereafter, after the lower mold 114 is raised to a position where it comes into contact with the film transport unit 142, the strip-shaped film 161 sucked and held by the film transport unit 162 is delivered (FIG. 11). When the lower mold 114 comes into contact with the film transport unit 142, the strip-shaped film is unsucked at the film transport unit 142 at the same time, and instead, suction by the lower mold suction mechanism 114A provided in the lower mold 114 is started. The When the delivery of the strip-shaped film 161 to the lower mold 114 is completed, the film transport unit 142 is retracted from the resin-sealed mold (between the upper mold 112 and the lower mold 114) together with the substrate loader / unloader 140.

  Thereafter, resin sealing is performed by the resin sealing mold 110, and the supplied strip-shaped film 161 is taken out and collected together with the substrate after resin sealing.

  As a release film supply mechanism for a resin sealing device using a strip-shaped release film, it can be widely adopted regardless of a resin sealing method (for example, a compression molding method, a transfer molding method, etc.).

It is a top view of a resin sealing device, and is a diagram mainly showing the flow of a substrate before resin sealing It is a top view of a resin sealing device, and is a diagram mainly showing the flow of a substrate after resin sealing Front view of resin sealing device It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state before a roll-shaped release film is sent out It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state after the roll-shaped release film was sent out It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state by which the roll-shaped release film was cut | disconnected It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state by which the cut release film (strip-shaped film) is hold | maintained by the guide plate It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state by which the cut release film (strip-shaped film) is delivered to the conveyance mechanism with the guide plate It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state after the cut release film (strip-shaped film) was delivered to the conveyance mechanism It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state by which the cut release film (strip-shaped film) is conveyed by the conveyance mechanism to the resin sealing metal mold | die It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state by which the cut release film (strip-shaped film) is delivered to the resin sealing metal mold | die by the conveyance mechanism It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: The figure which showed the state after the cut release film (strip-shaped film) was delivered to the resin sealing metal mold | die by the conveyance mechanism It is a schematic block diagram of the release film supply mechanism concerning this invention, Comprising: After a cut release film (strip-shaped film) is delivered to the resin sealing metal mold | die by a conveyance mechanism, a conveyance mechanism is original. The figure which showed the state which returned to the position

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 101 ... Resin sealing mold unit 102 ... Resin supply part 103 ... Substrate supply storage part 110 ... Resin sealing mold 112 ... Upper mold 114 ... Lower mold 114A ... Lower mold adsorption mechanism 122 ... For resin Loader 130 ... Movement guide 140 ... Substrate loader / unloader 142 ... Film transport unit 142A ... Film transport unit suction mechanism 143 ... Substrate transport unit 150 ... Film supply mechanism 151 ... Cutting device 152A ... Support base 152B ... Roll body holding unit 153 ... Feed roller 154 ... Film cutter 155 ... First actuator 156 ... Second actuator 157 ... Support block 158 ... Guide plate 158A ... Guide plate air ejection mechanism 160 ... Release film 161 ... Strip-shaped film 170 ... Magazine elevator 172 ... (Substrate) Supply magazine 1 4 ... (substrate) storage magazine 180 ... pre-heater unit

Claims (3)

A release film supply mechanism for supplying a release film to a resin sealing mold,
A cutting device for cutting the release film wound into a roll into a strip-shaped film of a predetermined length;
The cutting device feeds out a release film wound in a roll shape, a guide plate for guiding the delivered release film, and the release film fed on the guide plate to the roll And a cutter part that can be separated from the release film wound in a shape,
Wherein the surface of the guide plate, fed by the feed out to part away, characterized in that it jettable air ejection mechanisms provided air toward the release film that has been guided the guide plate above Mold film supply mechanism. In claim 1,
A release film supply mechanism characterized in that air can be sucked using the air ejection mechanism. In claim 1 or 2,
Furthermore, a transport device that transports the strip-shaped film cut by the cutting device to the resin-sealed mold,
The release film supply mechanism, wherein the transport device is provided in a substrate transport mechanism that transports a substrate on which a semiconductor chip is mounted with respect to the resin-sealed mold.

Images