JP5901215B2 - Tape sticking device - Google Patents

Description

  The present invention relates to a tape attaching apparatus for attaching an adhesive tape to a rectangular substrate such as a package substrate.

  A CSP (Chip Size Package) substrate having a plurality of device regions formed by arranging a plurality of semiconductor chips on which circuits such as IC and LSI are formed and further encapsulating with resin, and having a non-device region between adjacent device regions The package substrate such as is cut along a planned cutting line by a cutting device, and is formed as a package having substantially the same size as the semiconductor chip.

  A cutting apparatus for cutting a package substrate has a holding table that sucks and holds the package substrate, and a cutting unit that includes a cutting blade that cuts the package substrate held by the holding table. A plurality of suction ports corresponding to each package are provided so that the packages are not scattered.

  Japanese Patent Application Laid-Open No. 2001-196328 discloses a method of dividing a rectangular substrate using a cutting blade in a state where a rectangular substrate such as a package substrate is adhered to an adhesive tape and fixed to a ring frame.

JP 2001-196328 A

  When the ring frame is used in this way, it is necessary to use an adhesive tape larger than the size of the substrate to be attached, which is very uneconomical. Therefore, the amount of the adhesive tape is reduced by cutting the adhesive tape attached to the substrate into the same size as the substrate.

  However, the operation of cutting the tape according to the size of the rectangular substrate is complicated, and an apparatus that can cut the tape according to the substrate size and automatically stick the tape to the rectangular substrate is desired.

  This invention is made | formed in view of such a point, The place made into the objective provides the tape sticking apparatus which can stick an adhesive tape to a board | substrate automatically while cut | disconnecting a tape according to a board | substrate size. It is.

According to the present invention, there is provided a tape attaching apparatus, a cassette mounting table on which a cassette capable of accommodating a plurality of rectangular substrates is mounted, and an unloading operation for loading and unloading the rectangular substrates with respect to the cassette mounted on the cassette mounting table. Input means, temporary holding means having a reversing table capable of reversing 180 degrees having a holding surface for temporarily holding the rectangular substrate unloaded from the cassette by the loading / unloading means, and the holding surface of the reversing table. Reversing means for reversing 180 degrees between the facing state and the holding surface facing downward, and a rectangular substrate receiving the rectangular substrate from the reversing table positioned 180 degrees and reversing 180 degrees. Holding table, and a vertically moving hand that allows the rectangular substrate temporarily held by the temporary holding means to be transferred to the holding table by relatively moving the holding table and the temporary holding means in the vertical direction. And a holding table moving means for moving the holding table between a substrate delivery position immediately below the temporary holding means and an attaching position for attaching a tape to a rectangular substrate held by the holding table, and the attaching A tape unit in which a release sheet is disposed on a pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape composed of a base sheet and a pressure-sensitive adhesive layer. A feed roll mounted in a wound state, a take-up roll for taking up and collecting the release sheet of the tape unit, and the tape disposed between the feed roll and the take-up roll. A tape peeling means for pressing the release sheet side of the unit and bending the release sheet to the take-up roll side to peel the adhesive tape from the release sheet and sending it out; and the tape peeling means Therefore, a sticking means for pressing and sticking the pressure-sensitive adhesive tape to the back surface of the rectangular substrate in a state where the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape sent out is opposed to the rectangular substrate, a feeding roll and the tape peeling means; And at least the adhesive tape is completely cut from the adhesive tape side of the tape unit, and only the adhesive tape is cut into a predetermined size by cutting the release sheet to a depth that does not completely cut. It is seen including a tape cutting means, and wherein the inversion table of the temporary retaining means, temporarily holds the second rectangular substrate in back of the first retaining surface and the first holding surface for temporarily holding a first rectangular substrate A second holding surface, and temporarily holding the second rectangular substrate with the second holding surface while the adhesive tape is attached to the first rectangular substrate with the tape attaching mechanism. A tape applicator is provided. .

  ADVANTAGE OF THE INVENTION According to this invention, while cutting an adhesive tape according to the size of a rectangular substrate, the tape sticking apparatus which can automatically stick an adhesive tape to a rectangular substrate is provided.

It is a perspective view of the conveyance mechanism part of the board | substrate of a tape sticking apparatus. It is a perspective view of a temporary holding unit part. It is a side view of a tape sticking mechanism part. It is a perspective view of an adhesive tape cutting mechanism part. It is a side view explaining the delivery of the board | substrate from an inversion table to a holding table. It is a side view explaining the delivery of the board | substrate from an inversion table to a holding table.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a substrate transport mechanism portion in a tape sticking apparatus according to an embodiment of the present invention is shown. A cassette mounting table 6 is disposed on the base 4 of the tape sticking apparatus 2 so as to be movable up and down by a moving mechanism (not shown). In the cassette 8 mounted on the cassette mounting table 6, a plurality of rectangular substrates such as CSP substrates are supported by a plurality of shelves and accommodated.

  Reference numeral 10 denotes a loading / unloading unit for loading / unloading the rectangular substrate to / from the cassette 8 mounted on the cassette mounting table 6, and a clamp 12 capable of clamping the rectangular substrate is disposed at the tip of the support member 14.

  The support member 14 is configured to be movable in the Y-axis direction by a moving mechanism (not shown) along a guide groove 16a formed in the guide member 16 extending in the Y-axis direction. In the present embodiment, the clamp 12 is attached to the tip of the support member 14, but a suction pad or Bernoulli pad may be attached instead of the clamp 12.

  Referring to FIG. 2, a perspective view of the temporary holding unit 18 and the suction holding table 28 is shown. The temporary holding unit 18 is a unit that temporarily holds a rectangular substrate held and pulled out from the cassette 8 by the clamp 12 and includes a reversing table 20 that can be reversed 180 degrees.

  The reversing table 20 has a first holding surface 20a and a second holding surface 20b (see FIG. 5) opposite to the first holding surface 20a. Each of the first and second holding surfaces 20a and 20b includes a plurality of holding surfaces. A suction pad 22 is provided. Each suction pad 22 is selectively connected to a negative pressure suction source (not shown).

  Reference numeral 24 denotes a reversing unit including a belt 26 and a motor and a pulley (not shown). By driving the reversing unit 24, the reversing table 20 is reversed by 180 degrees.

  Reference numeral 28 denotes a suction holding table which is moved in the vertical direction by the vertical movement means 30 with respect to the support base 32. The suction holding table 28 is selectively connected to a negative pressure suction source (not shown). The vertical direction moving means 30 includes an air cylinder 34 housed in a support base 32 and a piston rod 36 having a tip connected to the suction holding table 28.

  In the present embodiment, the vertical direction moving means 30 is constituted by the air cylinder 34 and the piston rod 36. However, instead of this configuration, the vertical direction moving means 30 may be constituted by using a motor and a ball screw. Good.

  Referring again to FIG. 1, the suction holding table 28 mounted on the support base 32 is transferred to the substrate located immediately below the reversing table 20 by a holding table moving mechanism 42 including a ball screw 38 and a pulse motor 40. It is moved in the X-axis direction along the pair of guide rails 44 between the position and the attachment position indicated by the solid line for attaching the adhesive tape to the rectangular substrate held by the holding table 28.

  46 is a tape sticking mechanism, which has a structure as shown in FIG. The tape adhering mechanism 46 is mounted in a state where the tape unit 50 in which the release sheet 52 is disposed on the adhesive layer 50b of the adhesive tape 50 including the base sheet 50a and the adhesive layer 50b is wound in a roll shape. And a take-up roll 58 for taking up and collecting the release sheet 52 of the tape unit 54.

  An adhesive tape cutting unit 60 is disposed between the upstream roller 65 and the downstream roller 66. The adhesive tape cutting unit 60 cuts the tape unit 54 from the adhesive tape 50 side to the middle of the release sheet 52 in the thickness direction, thereby dividing only the adhesive tape 50 into a predetermined size without dividing the release sheet 52.

  As shown in FIG. 4, the adhesive tape cutting unit 60 includes a support plate 62 having a support surface 62 a that contacts and supports the release sheet 52 side of the tape unit 54, and a metal that cuts the tape unit 54 from the adhesive tape 50 side. Cutter 64, a width direction moving portion 67 that moves the cutter 64 along the width direction of the tape unit 54 to perform a cutting operation, and an advancing / retreating moving portion 68 that moves the cutter 64 forward and backward relative to the support plate 62, The contact detection unit 70 that detects contact between the support surface 62a of the support plate 62 and the cutter 64 is included.

  The support surface 62a of the support plate 62 is disposed so as to be positioned on the cutter 64 side with respect to the surface connecting the upstream roller 65 and the downstream roller 66 so that the tape unit 54 is surely in contact with the support surface 62a. ing. That is, the tape unit 54 stretched across the upstream roller 64 and the downstream roller 66 is supported by the support surface 62a of the support plate 62 while maintaining tension.

  The length of the support plate 62 in the width direction W is set to be longer than the width dimension of the tape unit 54. In the present embodiment, the length of the support plate 62 in the width direction W is set to a length that allows a plurality of types of tape units 54 having different width dimensions to be supported.

  A contact member 72 made of a conductive material such as metal is embedded in the vicinity of one end in the width direction W of the support surface 62a of the support plate 62 so as to be preferably flush with the support surface 62a. Has been. Further, in the vicinity of the contact member 72 on the support plate 62, a contact confirmation lamp 74 made of, for example, an LED or the like is disposed.

  The contact member 72 and the contact confirmation lamp 74 are connected by a wiring 76, and the contact confirmation lamp 74 and the cutter 64 are connected by a wiring 78. A power supply (not shown) is interposed in any of the wirings 76 and 78. Accordingly, when the cutter 64 comes into contact with the contact member 72, a closed circuit for connecting the wirings 76 and 78 is formed, and the contact confirmation lamp 74 is lit.

  The cutter 64 is held by the advance / retreat block 82 so as to protrude toward the support surface 62a of the support plate 62 via a rotating cylinder 80 that rotates in the direction of arrow R. The advance / retreat block 82 is disposed on the transverse block 84 constituting the width direction moving portion 67 so as to be able to advance and retreat in a direction perpendicular to the support surface 62a (in the direction of arrow P in the figure). The advance / retreat block 82 performs an advance / retreat operation with respect to the support surface 62 a of the support plate 62 by manually operating a micrometer 86 provided on the transverse block 84.

  The transverse block 84 is fixed to the distal end portion of the piston rod 90 of the air cylinder 88 constituting the width direction moving portion 67. Therefore, the transverse block 84 is smoothly reciprocated in the width direction W along a guide member (not shown).

  The air cylinder 88 can move the transverse block 84 to a position where the cutter 64 faces the contact member 72, and reciprocates the cutter 64 with a predetermined stroke according to the cutting of the plurality of tape units 54 having different widths. Is possible.

  Since the cutter 64 is mounted on the rotary cylinder 80 and is configured to be able to rotate 90 degrees, the tape unit 54 is cut in two horizontal directions and one vertical direction separated by a predetermined distance (3-line cut). The adhesive tape 50 can be cut into a desired size according to the rectangular substrate size.

  A tape peeling means 94 for peeling the adhesive tape 50 from the release sheet 52 is provided on the downstream side of the adhesive tape cutting unit 60. The tape peeling means 94 changes the course by bending the peeling sheet 52 of the tape unit 54 in which only the adhesive tape 50 is cut to a predetermined size so as to form an acute angle with respect to the tape unit 54 conveyed from the downstream roller 66. A wedge-shaped peeling claw 96 is provided. The peeling claw 96 has a plate shape wider than the width dimension of the tape unit 54, and the folded front end surface is set to form a sharp acute angle in a blade shape.

  The release sheet 52 that has passed through the leading edge of the peeling claw 96 is in a rear direction (arrow R direction) that forms an acute angle with the tape unit 54 that passes through the downstream roller 66 and reaches the leading edge of the peeling claw 96. It is forcibly conveyed and wound by the winding roll 58. Accordingly, the release sheet 52 is peeled from the adhesive tape 50.

  A sticking unit 98 is disposed on the downstream side of the tape peeling means 94. The adhering unit 98 has the adhesive layer 50 b of the adhesive tape 50 from which the release sheet 52 has been removed by the tape peeling means 94 facing the rectangular substrate 11, and presses the adhesive tape 50 toward the rectangular substrate 11 to press the adhesive tape 50. 50 is attached to the rectangular substrate 11. In the present embodiment, a CSP substrate whose back surface is sealed with a resin mold 13 is used as the rectangular substrate 11.

  The adhering unit 98 includes a holding unit 100 that sucks and holds the adhesive tape 50 peeled from the release sheet 52 by the tape peeling means 94 from the opposite surface of the adhesive layer 50b, and a tip 50A of the adhesive tape 50 held by the holding unit 100. A position detecting unit 112 that detects the position of the adhesive tape 50, and an advancing / retracting operation unit 104 that drives the advancing / retreating to stick the tip 50A of the adhesive tape 50 to the tip of the rectangular substrate 11.

  The holding part 100 is formed of a block having an elongated rectangular parallelepiped shape along the width direction of the tape unit 54. The holding unit 100 is connected to the tip of the piston rod 108 of the air cylinder 106 that constitutes the advance / retreat operation unit 104. A plurality of suction holes 110 are provided at equal intervals along the width direction of the tape unit 54 on the lower end surface of the holding unit 100. Each suction hole 110 is selectively connected to a negative pressure suction source.

  A first pressing roller 114 and a second pressing roller 116 for pressing and sticking the adhesive tape 50 against the rectangular substrate 11 are disposed on the downstream side of the sticking unit 98. The first pressing roller 114 is a relatively hard roller formed of urethane or rubber, for example, and is suitable for bringing the adhesive tape 50 into close contact with the resin mold 13 of the rectangular substrate 11. On the other hand, the second pressing roller 116 is a relatively soft roller formed of, for example, sponge, and acts to push out air remaining between the tape and the substrate following the step.

  Hereinafter, the operation of the tape sticking apparatus 2 configured as described above will be described. First, before performing the tape sticking operation with the tape sticking device 2, the tape sticking device 2 is set up. In this set-up operation, as shown in FIG. 4, first, the air cylinder 88 is driven to project the piston rod 90 to move the cutter 64 to a position facing the contact member 72.

  Next, the micrometer 86 is manually rotated to move the advance / retreat block 82 toward the support plate 62 with respect to the transverse block 84 until the cutter 64 hits the contact member 72.

  When the cutter 64 contacts the contact member 72, the contact member 72, the contact recognition lamp 74, the power source (not shown), and the wirings 76 and 78 form a closed circuit, and the contact recognition lamp 74 is lit. Thus, the operator can recognize that the tip of the cutter 64 has come into contact with the support surface 62 a of the support plate 62.

  Using this state as a reference, the micrometer 86 is operated so that the tip of the cutter 64 is retracted from the support surface 62a by a distance slightly shorter than the thickness dimension of the release sheet 52 of the tape unit 54 handled by the tape sticking apparatus 2.

  For example, when the thickness dimension of the release sheet 52 is 100 μm, when the cutter 64 is moved backward by about 80 μm from the support surface 62a, the release sheet 52 can be cut by 20 μm and the adhesive tape 50 can be completely cut.

  After performing such a setup operation, the rectangular substrate 11 is clamped and pulled out from the cassette 8 placed on the cassette placing table 6 by the clamp 12 of the carry-in / out unit 10 shown in FIG. Placed on.

  After the positioning bar 15 is moved in the direction approaching each other to center the rectangular substrate 11, the pair of positioning bars 15 are opened and the rectangular substrate 11 is placed on the first holding surface 20 a of the reversing table 20 of the temporary holding unit 18. Put.

  Then, as shown in FIG. 5A, the suction pad 22 is connected to a negative pressure suction source to suck and hold the resin mold 13 side of the rectangular substrate 11. Since the plurality of suction pads 22 are disposed on the first holding surface 20a, the rectangular substrate 11 having warpage can be sucked and held.

  Next, the reversing unit 24 including the belt 26 is driven to reverse the reversing table 20 by 180 degrees as shown in FIG. The reversing unit 24 is composed of the belt 18 and a combination of a motor and a pulley (not shown). However, the reversing unit may be constructed using an air cylinder.

  Next, the air cylinder 34 is driven, the piston rod 36 is extended as shown in FIG. 6A, and the holding surface of the suction holding table 28 is brought into contact with the rectangular substrate 11. After releasing the suction of the suction pad 22, the holding surface of the suction holding table 28 is connected to a negative pressure suction source, and the rectangular substrate 11 is transferred to the suction holding table 28.

  Next, the air cylinder 34 is driven to lower the suction holding table 28 that sucks and holds the rectangular substrate 11 as shown in FIG. 6B. Next, by driving the holding table moving mechanism 42, the suction holding table 28 that has been at the substrate transfer position is moved to the adhering position indicated by the solid line in FIG.

  At the attaching position, the adhesive tape 50 is attached to the resin mold 13 on the back side of the rectangular substrate 11 by the tape attaching mechanism 46. While the adhesive tape 50 is adhered to the back surface of the first rectangular substrate 11, the second rectangular substrate is pulled out from the cassette 8 by the carry-in / out unit 10 and placed on the second holding surface 20 b of the reversing table 20. Is done.

  Next, with reference to FIG.3 and FIG.4, the tape sticking operation | movement which sticks the adhesive tape 50 on the back surface of the rectangular substrate 11 is demonstrated easily. The tape unit 54 fed from the feed roll 56 is cut by the adhesive tape cutting unit 60 so that only the adhesive tape 50 is cut to a desired size according to the size of the rectangular substrate 11.

  Since the cutter 64 is mounted so as to be capable of rotating 90 degrees, the adhesive tape 50 is rectangular by three lines cut in two places in the horizontal direction separated by a predetermined distance and three places cut in the vertical direction after the cutter 64 is rotated 90 degrees. The adhesive tape 50 can be cut into a desired size according to the size of the substrate 11.

  After the cutting of the adhesive tape 50 is completed, the release sheet 52 is peeled from the adhesive tape 50 with the peeling claws 96 of the tape peeling means 94, and the adhesive tape is applied to the resin mold 13 disposed on the back surface of the rectangular substrate 11 with the sticking unit 98. Affix 50.

At the time of sticking, the adhesive tape 50 is sucked and held by the holding unit 100 by connecting the suction hole 110 of the holding unit 100 to a negative pressure suction source. Next, the suction holding table 28 provided with the position detection unit 112 is moved in the direction of arrow F so that the position detection unit 112 faces the holding unit 100.
At the same time as the suction holding table 28 is moved in the direction of arrow F, the adhesive tape 50 slides on the holding surface of the holding unit 100 by moving the holding unit 100 downward by operating the advance / retreat operation unit 104. The tip 50 </ b> A of the adhesive tape 50 is held on the holding surface of the holding unit 100.

  The rectangular substrate 11 held by the suction holding table 28 apparently moves in the direction of the arrow T with respect to the holding unit 100 by moving the holding unit 100 downward simultaneously with the movement of the suction holding table 28 in the direction of arrow F. Therefore, the tip 50 </ b> A of the adhesive tape 50 is attached so as to match the end of the rectangular substrate 11.

  While the suction holding table 28 is further conveyed in the direction of arrow F, the adhesive tape 50 is applied to the back surface of the rectangular substrate 11 by pressing the adhesive tape 50 against the rectangular substrate 11 with the first pressing roller 114 and the second pressing roller 116. Worn.

  The rectangular substrate 11 with the adhesive tape 50 attached to the back surface is returned to the substrate delivery position by the holding table moving mechanism 42 and then sucked and held by the first holding surface 20a of the reversing table 20 from the tape attaching device 2. Discharged.

2 Tape Adhering Device 6 Cassette Placement Table 8 Cassette 10 Carry In / Out Unit 12 Clamp 15 Positioning Bar 18 Temporary Holding Unit 20 Reversing Table 20a First Holding Surface 20b Second Holding Surface 22 Suction Pad 24 Reversing Unit 26 Belt 28 Suction Holding Table 30 Vertical direction moving means 32 Support base 34 Air cylinder 42 Holding table moving mechanism 46 Tape sticking mechanism 50 Adhesive tape 52 Release sheet 54 Tape unit 60 Adhesive tape cutting unit 62 Support plate 62a Support surface 64 Cutter 66 Width direction moving part 68 Advance and retreat Moving unit 70 Contact detecting unit 86 Micrometer 88 Air cylinder 98 Adhering unit

Claims (1)

A tape sticking device,
A cassette mounting table for mounting a cassette capable of accommodating a plurality of rectangular substrates;
Loading / unloading means for loading / unloading the rectangular substrate to / from the cassette mounted on the cassette mounting table;
Temporary holding means comprising a reversing table capable of reversing 180 degrees, having a holding surface for temporarily holding the rectangular substrate carried out of the cassette by the carry-in / out means;
Reversing means for reversing the reversing table 180 degrees between a state in which the holding surface faces upward and a state in which the holding surface faces downward;
A holding table that receives the rectangular substrate from the reversing table that is positioned immediately below the temporary holding means and is reversed 180 degrees, and holds the rectangular substrate;
A vertical movement means that allows the rectangular substrate temporarily held by the temporary holding means to be transferred to the holding table by relatively moving the holding table and the temporary holding means;
Holding table moving means for moving the holding table between a substrate delivery position directly below the temporary holding means and an attaching position for attaching a tape to a rectangular substrate held by the holding table;
A tape sticking mechanism disposed at the sticking position;
The tape sticking mechanism is a delivery roll that is mounted in a state in which a tape unit in which a release sheet is disposed on the adhesive layer of an adhesive tape composed of a base sheet and an adhesive layer is wound in a roll shape;
A winding roll for winding and collecting the release sheet of the tape unit;
The pressure-sensitive adhesive tape is disposed between the feed roll and the take-up roll, and presses the release sheet side of the tape unit to bend the release sheet toward the take-up roll. A tape peeling means for peeling off and sending out,
An adhering means for pressing and adhering the adhesive tape to the back surface of the rectangular substrate with the adhesive layer side of the adhesive tape sent out by the tape peeling means facing the rectangular substrate;
The adhesive roll is disposed between the feeding roll and the tape peeling means, and cuts at least the pressure-sensitive adhesive tape from the pressure-sensitive adhesive tape side of the tape unit and cuts the release sheet to a depth not completely cut. a tape cutting means for cutting the tape only to a predetermined size, only including,
The reversing table of the temporary holding means has a first holding surface that temporarily holds the first rectangular substrate and a second holding surface that temporarily holds the second rectangular substrate on the back surface of the first holding surface,
A tape sticking apparatus characterized in that the second rectangular substrate is temporarily held by the second holding surface while the adhesive tape is stuck to the first rectangular substrate by the tape sticking mechanism.

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