JPH1116862A - Sheet stripping device and method of it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To strip a sheet attached to a plate such as semiconductor wafer and the like without damaging the plate. SOLUTION: The stripping device is structured so that a protective sheet F attached to the semiconductor wafer W is stripped by making use of an adhesive tape T. A thermosensitive adhesive tape is used for the adhesive tape which is thermocompression bonded to the end of the sheet F by a heater jig 505. The adhesive tape T is cut by a cutter blade 515, held by a stripping head 400 by elevating a heat cutter section 500 and a tape supply section 300, and the sheet F is pulled and stripped by transferring the head 400. The sheet F discarded together with the adhesive tape T into a waste body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a sheet peeling apparatus and method for peeling a sheet adhered to a plate-like member such as a semiconductor wafer.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, there is a process of polishing a back surface of a semiconductor wafer (hereinafter, simply referred to as a wafer) to reduce the size of a semiconductor chip. Is protected by attaching a protective sheet made of an adhesive film or the like.
After polishing, the protective sheet is peeled off from the wafer.

[0003] As a method of peeling the protective sheet, conventionally, 2
5mm ~ 50mm width adhesive tape using a press roller,
The protective sheet was attached to the protective sheet attached to the wafer, and the protective sheet was peeled off from the wafer by pulling the adhesive tape.

[0004]

However, according to the above method, since the pressure-sensitive adhesive tape is pressed by a press roller and attached to the protective sheet, there is a possibility that the wafer may be cracked due to the pressing. In particular, in recent years, as the outer diameter of a wafer has increased, it has become necessary to consider the problem of wafer cracking.

Accordingly, an object of the present invention is to enable a sheet such as a protective sheet to be peeled from a plate member without damaging the plate member such as a wafer.

[0006]

According to the present invention, there is provided a sheet peeling apparatus and method for peeling a sheet adhered to a plate-like member using an adhesive tape. Then, the sheet was peeled off by pulling the adhesive tape.

Further, in the present invention, a heat-sensitive adhesive tape is used as an adhesive tape in a sheet peeling apparatus and method for peeling a sheet adhered to a plate-like member using an adhesive tape.

Although the present invention is particularly suitable for peeling a protective sheet stuck on a wafer, the present invention is not limited to this, and a sheet stuck to a plate member is peeled off using an adhesive tape. The present invention can be generally applied to a sheet peeling apparatus and method.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below by taking a wafer protective sheet peeling apparatus as an example. FIG. 1 is a front view of a sheet peeling device showing one embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is a plan view. The sheet peeling device is a table 100
, A table unit 200, a tape feeding unit 300, a peeling head unit 400 as a moving unit, and a heater cutter unit 500 as an adhesive unit and a cutting unit.

First, the outline of this device will be described.
The wafer to which the protection sheet has been attached is transported by the table unit 200. On the other hand, the adhesive tape T is fed from the tape feeding section 300 and pulled out by the peeling head section 400. The adhesive tape T is thermocompression-bonded to the end of the protective sheet by the heater cutter unit 500, and cut into a predetermined short length. Next, the peeling head 400
Holds the adhesive tape T and pulls the protective sheet off the wafer. Hereinafter, details of each unit will be described.

The table section 200 has two rails 201 installed on the table 100 and a table 203 cut on the rails 201. Table 203
It is movable on the rail 201 in the X-axis direction shown in the figure.
On the table 100, the belt 2 is interposed between the pulleys 205 and 207.
The pulley 205 is rotated by the motor 211. The belt 209 is connected to the table 203 by a connector 213, and the table 203 moves on the rail 201 by the rotation of the motor 211.

At the center of the table 203, a cylinder 2
An elevating table 217 that moves up and down by 15 is arranged. The table 203 has a plurality of annular suction grooves 219 formed concentrically with the elevating table 217 in accordance with the diameter of the wafer. Each suction groove 219 has a plurality of suction ports, and a negative pressure is applied to these suction ports. Then, the wafer is suction-held. Reference numeral 221 denotes a retractable positioning pin, and two standing pins are provided near the suction groove 219.
21 is positioned by contacting the edge of the wafer. When the wafer is taken out of the table 203, the cylinder 215 is driven after the suction is released, and the elevating table 217 is raised.

As the adhesive tape T, a heat-sensitive adhesive tape having a heat-sensitive adhesive layer provided on a heat-resistant film such as a polyethylene terephthalate film is used here. A tape may be used. The adhesive tape T is set on the reel 301 and sent to the tape feeding unit 300. Reel 301
A spring 302 (FIG. 2) is attached to the rotating shaft of, whereby a frictional force is applied to the rotating shaft of the reel 301 via a friction plate.

As shown in FIG. 5, the tape feeding section 300 includes a pinch roller 303 and a tension roller 305 which are in pressure contact with each other, and a guide roller 307. A tape receiving plate 309 is attached to a ball bush 311 by a shaft 310 at a lower end portion of the tape feeding unit 300. The tape receiving plate 309 is movable in the X-axis direction, and is constantly urged by a spring 313 in a protruding direction (leftward in FIG. 5). After the adhesive tape T is sandwiched between the pinch roller 303 and the tension roller 305, the direction is changed by the guide roller 307,
It is pressed by the tape holding plate 315 on the tape receiving plate 309. A cutter groove 309a is formed at the front end of the tape holding plate 315. The tape pressing plate 315 is driven by the cylinder 317. Further, a timing belt 321 is wound around the tension roller 305 from a timing pulley 319, and is driven by a motor 323. The tension roller 305 uses the adhesive tape T
Is rotated in the direction opposite to the feeding direction, and a tension (back tension) in the direction opposite to the feeding direction is applied to the adhesive tape T.

The tape feeding section 300 is movable in the vertical direction (the Z-axis direction shown in the figure). That is, as shown in FIG. 2, the substrate 101 is mounted on the base unit 100, and the tape feeding unit 300 is moved in the Z-axis direction by the cylinder 325 fixed on the substrate 101.

As shown in FIG. 2, the peeling head section 400 includes a peeling head 401 and an arm 403 for supporting the peeling head.
It is mounted movably in the axial direction. Arm 403
Is connected to a guide 405 via a power transmission mechanism (not shown).
Is driven by a motor 407 installed at the end of.
The guide 405 is mounted on the table 100 by a support plate 409.

The peeling head 401 is provided with a tape chuck 412 composed of an upper jaw 411 and a lower jaw 413. The tape chuck 412 is opened and closed by moving the upper jaw 411 up and down by a cylinder 415. Peeling head 401
A tape detection sensor 417 (for example, a photoelectric sensor or the like, see FIG. 5) for detecting whether or not the adhesive tape T exists in the tape chuck 412 is attached to the.

Next, the heater cutter section 500 will be described. FIG. 4A is an enlarged plan view of the heater cutter unit, and FIG. 4B is a side view. FIG. 8 is a front view of the heater cutter unit 500. A rod-shaped heater 503 is embedded in the heater block 501, and a heater tool 505 is fixed to a lower end of the heater block 501 with a screw 507. Irregularities as shown in FIG. 4B are formed at the lower end of the heater tool 505 to locally apply heat. In addition, heater tool 50
5 is replaceable, and a tool having a different shape can be used depending on the size of the wafer and the curvature of the outer periphery of the wafer. The heater block 501 includes two guide rods 506.
Is attached to the frame 508 so as to be vertically movable (in the Z-axis direction in the drawing), and is moved up and down by a heater vertical cylinder 509 fixed to the frame 508.

Two plate-like tape pressing guides 51 sandwich the heater block 501 from front and rear (X-axis direction).
1 is attached to the frame 508. The tape pressing guide 511 is made of a member having a heat insulating property, such as a polyimide resin or a polyetheretherketone resin. The upper end of the tape holding guide 511 is a frame 508.
, And the lower end is rounded and free to hold the adhesive tape T. A cutter moving cylinder 513 is attached to the side of one of the tape pressing guides 511 (FIG. 4A).
A cutter blade 515 is attached to the tip of the piston 13, and the cutter blade 515 reciprocates in the Y-axis direction by driving the cylinder 513. A plate-like tape retainer 517 is disposed below the cylinder 513, and the tape retainer 517 has a slit 517a through which the cutter blade 515 passes.

The heater cutter section 500 is moved vertically (Z
(Axial direction). That is, the heater cutter unit 500 moves in the Z-axis direction by the cylinder 519 (FIG. 3) attached to the substrate 101.

Next, regarding the operation of the above device, step 1
From step 8 to step 8.

(Step 1: Wafer setting) First, a wafer is set on the table 203. This may be performed manually or automatically using a suitable manipulator or automatic supply device. The wafer W is placed on the table 20
3 and is positioned in accordance with the suction groove 219 of the corresponding size on the positioning pin 221. Thereafter, a vacuum device (not shown) is operated to suck the wafer W, and the table 203 is moved directly below the tape feeding unit 300 (FIG. 5).

In the tape feeding section 300, the adhesive tape T is previously applied to the pinch roller 303, the tension roller 305, and the guide roller 307 in advance, and the tape presser 315 and the tape receiving plate 3 near the tip of the adhesive tape T.
09. The tension roller 305 is driven, and an appropriate back tension is applied to the adhesive tape T.

At this time, the tape chuck 412 of the peeling head 400 is open. Then, the peeling head unit 400 moves toward the tape feeding unit 300 in the X-axis direction. The movement of the peeling head 400 may be performed simultaneously with the movement of the table 203.

(Step 2: gripping the front end of the adhesive tape)
As shown in FIG. 6, the peeling head 400 presses the tape receiving plate 309, whereby the tape receiving plate 309 retreats, and the tip of the adhesive tape T is inserted into the opening of the tape chuck 412. When the tip of the adhesive tape T is detected by the sensor 417, the tape chuck 412 is closed and the tip of the adhesive tape T is gripped. Next, the back tension by the tension roller 305 is released, and the tape presser 315 rises and separates from the adhesive tape T.

(Step 3: Pulling Out Adhesive Tape) As shown in FIG. 7, the peeling head 400 is moved away from the tape feeding section 300 along the X-axis direction to pull out the adhesive tape T. At this time, the tension roller 30
5 is activated and back tension is applied.

(Step 4: tape thermocompression bonding, cutting) As shown in FIG. 8, the heater cutter 500 descends,
The tape pressing guide 511 pushes down the adhesive tape T to a position near the wafer W. The adhesive tape T is a tape receiving plate 309
It is pressed by the tape presses 517 and 315 above. Thereafter, the heater upper / lower cylinder 509 is driven, and the heater tool 505 presses the adhesive tape T against the protection sheet F at the front end portion of the wafer W for several seconds, and thermally bonds the adhesive tape T to the protection sheet. At this time, the position of the table 203 is adjusted according to the size of the wafer W. Table 203
Heater cutter 500 before thermocompression bonding of adhesive tape T
It is only necessary to move to just below. Then, cutter blade 5
15 moves in the Y-axis direction, and the adhesive tape T is cut into a predetermined length.

(Step 5: Tape Feeding Section, Heater Cutter Section Raising) As shown in FIG. 9, the tape feeding section 300 and the heater cutter section 500 rise. As shown in the figure, the bonding point P between the adhesive tape T and the protective sheet F is near the edge of the wafer W. For example, the distance d from the edge of the wafer W is within 3 mm.

(Step 6: Protective Sheet Peeling) FIG.
As shown in (2), the peeling head 400 is moved rightward in the figure and the table 203 is moved leftward in the figure, and the protective sheet F is held and pulled by the peeling head 400 and peeled off. At this time, it is desirable that the holding position by the peeling head 400 is as close to the protective sheet F as possible and the pulling direction is horizontal. Thereby, the wafer W
, And the suction between the wafer W and the table 203 does not easily come off. Since the table 203 moves in the opposite direction simultaneously with the movement of the peeling head 400, the peeling operation is completed in a short time.

(Step 7: Protective Sheet Discard) FIG. 11
When the peeling head 400 moves to a predetermined position, the tape chuck 412 is opened, and the adhesive tape T and the protection sheet F are dropped into the disposal box 103 stored in the table 100 as shown in FIG. At this time, high-pressure air may be blown from above.

(Step 8: Wafer Removal) When the table 203 returns to the initial position, the lifting table 217 is raised, and then the wafer W is removed. This removal may be performed manually or automatically using a suitable manipulator or automatic supply device.

As described above, since the adhesive tape T is adhered to the end of the protective sheet F, the wafer can be prevented from cracking without pressing the wafer with a press roller as in the prior art, and the size of the wafer can be reduced. It is possible to cope with the increase in diameter. As described above, as the adhesive tape, a heat-sensitive adhesive tape is preferably used as long as it can adhere the protective sheet at the edge of the wafer. Adhesive tape can also be used.

If a heat-sensitive adhesive tape is used as the adhesive tape T, only a part of the protective sheet F is thermocompression-bonded. can do. In addition, when using an adhesive tape, if abrasive dust, cutting dust, or water adheres to the surface of the protective sheet, the adhesiveness to the adhesive tape deteriorates, so that the protective tape may not be able to be removed by a single pull. Or the surface of the protective tape had to be cleaned. However, if a heat-sensitive adhesive tape is used, it can be adhered even if dust, water, or the like adheres to the surface. Moreover, since the heat-sensitive adhesive tape has no tackiness at room temperature, it is easy to handle such that the surface treatment of the transport roller is unnecessary and a release sheet is unnecessary. In addition, an inexpensive material such as a heat seal material can be used as the material, and the adhesive strength is strong, so that the amount of use is small, and resources are saved and cost is low.

Furthermore, if the end of the protective sheet is adhered and a heat-sensitive adhesive tape is used as in the above-described apparatus, the end of the wafer is generally not provided with an electronic circuit.
There is an advantage that even if thermocompression bonding is performed, the wafer is not damaged and the heat-sensitive adhesive tape can be easily used.

In the above apparatus, the cutting means (cutter blade 515) for cutting the adhesive tape to a predetermined length is provided, but this cutting means may not be provided. For example, if an adhesive tape of an appropriate length is used from the beginning, even if the adhesive tape is not cut, such an adhesive tape can be used as it is on the protective sheet F.
The protective sheet can be peeled off by adhering to the end and pulling.

[0036]

As described above, according to the present invention,
The sheet can be peeled off without damaging the plate member such as a wafer.

[Brief description of the drawings]

FIG. 1 is a front view of a protective sheet peeling device showing an example of the present invention.

FIG. 2 is a side view of the protective sheet peeling device.

FIG. 3 is a plan view of a protective sheet peeling device.

FIG. 4 is an enlarged view of a heater cutter unit.

FIG. 5 is a diagram illustrating the operation of the protective sheet peeling device.

FIG. 6 is a diagram illustrating the operation of the protective sheet peeling device.

FIG. 7 is a diagram illustrating the operation of the protective sheet peeling device.

FIG. 8 is a view for explaining the operation of the protective sheet peeling device.

FIG. 9 is a view for explaining the operation of the protective sheet peeling device.

FIG. 10 is a diagram illustrating the operation of the protective sheet peeling device.

FIG. 11 is a view for explaining the operation of the protective sheet peeling device.

[Explanation of symbols]

 100 Table section 200 Table section 300 Tape feeding section 400 Peeling head section 500 Heater cutter section 505 Heater tool 515 Cutter W Semiconductor wafer F Protective sheet T Adhesive tape

Claims (6)

[Claims] 1. A sheet peeling device for peeling a sheet adhered to a plate member using an adhesive tape, wherein the adhesive tape is adhered to an end of the sheet, and the sheet is peeled by pulling the adhesive tape. A sheet peeling device characterized by the above-mentioned. 2. A sheet peeling device for peeling a protective sheet attached to a plate member using an adhesive tape, a table for cutting the plate member, a tape feeding means for feeding the adhesive tape, and a feeding unit. A sheet peeling device, comprising: an adhesive means for adhering the adhered adhesive tape to an end of the protective sheet; and a moving means for holding the adhered adhesive tape and moving the adhesive tape with respect to the plate member. . 3. A cutting means for cutting the adhesive tape fed from the tape feeding means to a predetermined length.
3. The sheet peeling device according to 1. 4. A sheet peeling method for peeling a sheet adhered to a plate member using an adhesive tape, wherein the adhesive tape is adhered to an end of the sheet, and the sheet is peeled by pulling the adhesive tape. A sheet peeling method, comprising: 5. A heat-sensitive adhesive tape is used as the adhesive tape in a sheet peeling apparatus for bonding an adhesive tape to a sheet attached to a plate-like member and peeling the sheet by pulling the adhesive tape. A sheet peeling device characterized by the above-mentioned. 6. In a sheet peeling method of bonding a sheet affixed to a plate-like member with an adhesive tape to the sheet and pulling the adhesive tape to peel the sheet, a heat-sensitive adhesive tape is used as the adhesive tape. A sheet peeling method comprising: