JP4597061B2 - How to peel off the protective tape - Google Patents

Description

  The present invention relates to a method for peeling off a protective tape attached to a wafer.

  A wafer on which a device such as an IC or LSI is formed is divided into individual devices by a dividing device such as a dicing device and used for various electronic devices. In recent years, in order to meet demands for downsizing and weight reduction of electronic devices, the thickness of the back surface of a wafer is extremely thin, such as 100 μm or less and 50 μm or less, by grinding.

  When grinding the backside of the wafer, a protective tape for device protection made of vinyl chloride or the like is affixed to the front surface of the wafer, and after grinding, the protective tape is peeled off and transported to the dicing machine. It is diced and divided into individual devices.

  As a method of peeling the protective tape from the surface of the wafer, there is a method of sticking a peeling tape formed of PET (polyethylene terephthalate) or the like to the protective tape, and peeling the protective tape by pulling the protective tape together with the peeling tape. (For example, refer to Patent Document 1).

JP 2003-197583 A

  However, in the method of peeling the protective tape by sticking the peeling tape to the protective tape and pulling it, the peeling tape is not sufficiently stuck to the outer peripheral edge of the protective tape, which causes the protective tape to peel off There is a problem that it may not be possible.

  In addition, a wafer that is extremely thin such that the thickness is 100 μm or less and 50 μm or less has a problem that the wafer is damaged when the protective tape is peeled off.

  Therefore, the problem to be solved by the present invention is to surely peel off the protective tape attached to the wafer and prevent the wafer from being damaged at the time of peeling.

  The present invention relates to a chuck table for holding a wafer, a peeling tape attaching means for attaching a peeling tape for peeling off a protective tape attached to the surface of the wafer held on the chuck table to the protective tape, and a peeling A driving means for relatively moving the tape and the chuck table, and the peeling tape attaching means includes an unused roll portion around which the unused peeling tape is wound and a used roll that winds up the used peeling tape. , A pressing part that presses the peeling tape against the protective tape between the unused roll part and the used roll part, and forward operation and use that supplies the unused peeling tape from the unused roll part to the pressing part side Of the protective tape in a tape peeling device comprising a peeling tape feeding unit capable of reverse operation to return the used peeling tape from the used roll part to the pressing part side In relation to the peeling tape feeding step of supplying an unused peeling tape to the pressing portion by the forward operation of the peeling tape feeding portion, and the pressing portion on the protective tape adhered to the surface of the wafer held by the chuck table. Affixing an unused release tape to the protective tape, and then moving the chuck table by the drive means to attach the release tape to the end of the protective tape, and a release tape feeding part The used release tape is used by operating the reverse direction to loosen the release tape and overhang the release tape on the outer peripheral side of the protective tape, and the forward operation of the drive means and release tape feed section. And a peeling step of peeling the protective tape from the surface of the wafer while being wound by the roll portion.

  In the above-described method for peeling off the protective tape, in the peeling step, before the protective tape is completely peeled from the surface of the wafer, the forward operation of the peeling tape feeding unit is stopped, and the protective tape is peeled off from the wafer surface only by the operation by the driving means. It is desirable to completely peel off.

  In the present invention, since the peeling tape is attached to the outer peripheral side surface of the protective tape in an overhang state, the protective tape is surely removed from the surface of the wafer by winding the peeling tape from the state and peeling the protective tape. Can be peeled off.

  In addition, if the feeding of the peeling tape is stopped before the protective tape is completely peeled from the wafer surface and the peeling is performed only by moving the chuck table that holds the wafer, no vertical force is applied to the wafer. Therefore, damage to the wafer can be prevented.

  A method for peeling the protective tape attached to the surface of the wafer using the tape peeling apparatus 1 shown in FIG. 1 will be described. A tape peeling apparatus 1 shown in FIG. 1 is an apparatus used to peel off a protective tape T1 attached to the surface of a wafer W for device protection. A chuck table 2 for holding the wafer W, and a chuck table 2 The peeling tape sticking means 3 for sticking the peeling tape T2 for peeling the protective tape T1 held on the tape, and the peeling tape T2 and the chuck table 2 are relatively moved in the direction in which the protective tape T1 is peeled off. Drive means 4. The protective tape T1 may be attached to the surface of a wafer integrated with a dicing frame whose back surface is attached to the dicing tape and attached to the outer peripheral portion of the dicing tape.

  The chuck table 2 can be moved in the X-axis direction by the driving means 4. The driving means 4 includes a ball screw 40 disposed in the X-axis direction, a motor 41 connected to one end of the ball screw 40 and rotating the ball screw 40, a guide rail 42 disposed in parallel to the ball screw 40, and the ball screw 40. And the base 43 slidably contacting the guide rail 42. The base 43 is guided by the guide rail 42 in the X-axis direction as the ball screw 40 is rotated by being driven by the motor 41. It is configured to move.

  The release tape attaching means 3 includes an unused roll portion 30 around which the unused release tape T2 is wound, a used roll portion 31 around which the used release tape T2 attached with the protective tape T1 is wound, Used part in which the peeling tape between the used roll part 30 and the used roll part 31 is pressed against the protective tape T1, and the protective tape T1 that is peeled off and supplied to the pressing part 32 is attached. And a peeling tape feeding section 33 for feeding the peeling tape T2 to the used roll section 31. Moreover, between the unused roll part 30 and the press part 32, the peeling tape guide part 34 which guides the peeling tape T2 is provided.

  The unused roll unit 30 has a rotation axis in the Y-axis direction orthogonal to the X-axis direction, which is the moving direction of the chuck table 2, and is a direction in which the unused release tape T2 wound around a cylindrical member is sent out (front view). In a direction opposite to the clockwise direction when viewed from the side, the peeling tape feed unit 33 is constantly rotated by a force weaker than the forward operation force of the peeling tape feed unit 33 described later to apply tension to the peeling tape T2. As a result of the forward operation, the unused peeling tape T2 is fed to the pressing portion 32 side.

  The pressing portion 32 has a configuration in which a protruding portion 32a protruding in the X-axis direction is formed at the tip of a cylindrical rod having a rotation axis in the Y-axis direction, and the tip of the protruding portion 32a is attached to the peeling tape T2. In contact.

  The peeling tape guide part 34 supports the unused peeling tape T <b> 2 between the unused roll part 30 and the pressing part 32.

  The peeling tape feeding part 33 is configured by two roll members 33a and 33b formed in a columnar shape, and the peeling tape T2 is sandwiched between the roll member 33a and the roll member 33b. The side surface of the roll member 33a is formed of a material having a relatively high friction coefficient such as rubber, and the side surface of the roll member 33b is formed of a material having a smaller friction coefficient than the roll member 33a such as Teflon (registered trademark). Is formed. By rotating the roll member 33a counterclockwise and rotating the roll member 33b clockwise, the unused release tape T2 can be sent out in the -X direction. Hereinafter, rotating the roll member 33a counterclockwise and rotating the roll member 33b clockwise is referred to as a forward operation of the peeling tape feeding unit 33. On the other hand, the peeling tape T2 can be sent out in the + X direction by rotating the roll member 33a clockwise and rotating the roll member 33b counterclockwise. Hereinafter, rotating the roll member 33a clockwise and rotating the roll member 33b counterclockwise is referred to as reverse operation of the peeling tape feeding unit 33.

  The used roll unit 31 has a rotation axis in the Y-axis direction, the tip of the peeling tape T2 is wound around a cylindrical member, and the used roll unit 31 is clockwise when viewed from the front, The used peeling tape T2 is wound by always rotating with a force weaker than the force of 33 forward operation and reverse operation.

  As shown in FIG. 2, the wafer W having the device-protecting protective tape T <b> 1 attached to the surface is held by the chuck table 2. Moreover, the unused peeling tape T2 is supplied from the unused roll part 30 to the pressing part 32 side by the forward operation of the peeling tape feeding part 33 (peeling tape supplying step). At this time, the unused release tape T <b> 2 is guided by the release tape guide portion 34, and a tension is applied to the unused release tape T <b> 2 by the force rotating in the reverse direction of the unused roll portion 30. Then, when the chuck table 2 is driven in the − direction by being driven by the driving unit 4, the wafer W is positioned at a required position below the pressing portion 32 as shown in FIG. 3.

  Next, as shown in FIG. 4, by rotating the pressing portion 32 clockwise, the tip of the protruding portion 32a presses the peeling tape T2 downward, so that the outer peripheral end on the −X side of the protective tape T1. An unused release tape T2 is applied and contacted inside. Since the adhesive surface of the peeling tape T2 faces downward, the adhesive surface is stuck to the protective tape T1 by pressing. At this time, both the roll members 33a and 33b constituting the peeling tape feeding portion 33 are stopped.

  Then, as shown in FIG. 5, the chuck table 2 is moved in the + X direction by driving by the driving means 4 while maintaining the state where the protruding portion 32a presses the peeling tape T2 against the protective tape T1, and the unused peeling tape is moved. T2 is stuck to the end of the protective tape T1 (peeling tape sticking step).

  Next, as shown in FIG. 6, the used release tape T2 is returned from the used roll portion 31 toward the pressing portion 32 by the reverse operation of the release tape feeding portion 33, and the release tape T2 is moved downward. Loosen. If it does so, peeling tape T2 will be stuck also to the outer peripheral side surface of protective tape T1, and peeling tape T2 will be stuck in an overhanging state (peeling tape overhang process).

  Then, as shown in FIG. 7, when the peeling tape feeding unit 33 is operated in the forward direction and the chuck table 2 is moved in the −X direction while the pressing by the pressing unit 32 is maintained, the used peeling is performed. While the tape T2 is wound up by the used roll part 31, the protective tape T1 attached to the peeling tape T2 is peeled off from the surface of the wafer W (peeling step). Since the peeling tape T2 is attached to the protective tape T1 in an overhang state, the protective tape T1 can be reliably peeled off.

  As shown in FIG. 8, the forward operation of the peeling tape feeding portion 33 is stopped in a state where the pressing by the pressing portion 32 is maintained, and the protective tape T1 is not completely peeled off here, and is shown in FIG. As described above, when the chuck table 2 is moved in the + X direction by the driving means 4, it is stuck to the peeling tape T <b> 2 without applying tension to the peeling tape T <b> 2 between the peeling tape feeding portion 33 and the pressing portion 32. In a state, the protective tape T1 is peeled off from the surface of the wafer W (peeling step). Accordingly, no force in the vertical direction is applied to the wafer W at the time of peeling, and the wafer W is not damaged.

It is a perspective view which shows an example of a tape peeling apparatus. It is explanatory drawing which shows the wafer hold | maintained at the chuck table, and a peeling tape sticking means. It is explanatory drawing which shows the state before a peeling tape sticking process. It is explanatory drawing which shows the time of the start of a peeling tape sticking process. It is explanatory drawing which shows the time of completion | finish of a peeling tape sticking process. It is explanatory drawing which shows a peeling tape overhang process. It is explanatory drawing which shows the time of the start of a peeling process. It is explanatory drawing which shows the middle of a peeling process. It is explanatory drawing which shows the time of completion | finish of a peeling process.

Explanation of symbols

T1: protective tape T2: peeling tape W: wafer 1: tape peeling device 2: chuck table 3: peeling tape attaching means 30: unused roll part 31: used roll part 32: pressing part
32a: Protruding portion 33: Release tape feeding portion
33a, 33b: Roll member 34: Peeling tape guide part 4: Drive means 40: Ball screw 41: Motor 42: Guide rail 43: Base

Claims (2)

A chuck table for holding a wafer, a release tape attaching means for attaching a release tape for peeling the protective tape attached to the surface of the wafer held by the chuck table to the protective tape, and the release tape Drive means for relatively moving the chuck table;
The peeling tape attaching means includes an unused roll portion around which an unused release tape is wound, a used roll portion that winds up a used release tape, and the unused roll portion and the used roll portion. A pressing portion that presses the release tape against the protective tape,
Peeling tape feed capable of forward operation for supplying unused peeling tape from the unused roll part to the pressing part side and reverse operation for returning used peeling tape from the used roll part to the pressing part side A method of peeling a protective tape in a tape peeling device comprising a portion,
A peeling tape supplying step of supplying an unused peeling tape to the pressing portion by the forward operation of the peeling tape feeding portion;
The pressing part is applied to a protective tape attached to the surface of the wafer held by the chuck table, and an unused release tape is attached to the protective tape. Thereafter, the chuck table is moved by the driving means. A peeling tape sticking step for sticking the peeling tape to the end of the protective tape,
A peeling tape overhanging step of operating the reverse direction of the peeling tape to loosen the peeling tape and overhanging the peeling tape on the outer peripheral side surface of the protective tape;
A peeling step of peeling off the protective tape from the surface of the wafer while winding the used peeling tape by the used roll portion by the forward operation of the driving means and the peeling tape feeding portion. Peeling method. In the peeling step, before completely peeling the protective tape from the surface of the wafer, the forward operation of the peeling tape feeding section is stopped, and the protective tape is completely removed from the surface of the wafer only by the operation by the driving means. The method for peeling off the protective tape according to claim 1, wherein the protective tape is peeled off.

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