JP2010087265A - Adhesive tape affixing device to substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape affixing device, which controls tension acting in the width direction of an adhesive tape, and affixes the adhesive tape to a substrate with a predetermined tension, when affixing a wide width adhesive tape to the substrate. <P>SOLUTION: The adhesive tape affixing device 1 includes a tape chuck mechanism 16 including: a pair of right-left tape holding members 69 including an upper side chuck 17 and a lower side chuck 25 and capable of approaching and leaving mutually along the width direction of the adhesive tape 6; an elastic member 18 for urging the tape holding members 69 inward in the width direction of the adhesive tape 6; and a motor 20 which drives the right-left tape holding members 69 in a manner capable of approaching and leaving mutually, and detects the tension acting in the width direction as a torque value, when holding the adhesive tape 6. The adhesive tape 6 is held by a tape holding member 16 urged at the inside end in the width direction. The tape holding members 69 are separately reacted by the motor 20 so as to become a predetermined torque value. The tension acting in the width direction of the adhesive tape 6 is controlled to become a predetermined tension. Then, the adhesive tape 6 is affixed to the substrate 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an apparatus for applying an adhesive tape to a substrate. More specifically, the present invention relates to an adhesive tape attaching device to a substrate capable of adjusting the tension in the width direction of the adhesive tape to a predetermined tension when the adhesive tape is attached to a substrate such as a semiconductor wafer.

  Conventionally, in a semiconductor chip manufacturing process, a protective tape is applied to the pattern forming surface of a wafer on which a pattern is formed, the back surface is ground and thinned, and then a die attach film is applied to the ground surface. Subsequently, the die attach film adhering surface of the wafer is mounted on a dicing tape, and the protective tape is peeled off with a peeling tape or the like, followed by dicing into chips. The semiconductor chip is mounted on a die pad via the die attach film and sealed with a sealing resin to form a semiconductor device.

  As described above, in the semiconductor manufacturing process, various adhesive tapes are attached to the wafer, but if the adhesive tape is not attached to a substrate such as a wafer with an appropriate tension when attached, The wafer is warped due to the residual stress of the tape. In particular, in the case of a recently thinned wafer (for example, 100 μm or less), the warped wafer may be damaged.

  In addition, for example, the protective tape that is applied to the pattern forming surface of the wafer is attached to the wafer by pulling the protective tape onto the wafer and pressing the protective tape with an application roller, and then along the outer periphery of the wafer. The protective tape is cut and the excess portion of the protective tape is peeled off and wound up.

  However, since the protective tape is applied to the wafer after the protective tape is applied to the wafer, the protective tape is cut along the outer peripheral portion. There is a problem that the tension difference occurs between the part that penetrates and the circular hole is opened, and the protective tape of the part with the hole shrinks in the width direction, and the protective tape of the unused part is wrinkled. It was.

  When a protective tape is applied to the wafer in this state, wrinkles and bubbles enter the protective tape, and there is a problem that the pattern surface is contaminated during the backside grinding or cannot be uniformly polished.

  Therefore, a sticking device is disclosed in which a taper roller having a convex center portion is used as a guide roller for transferring the tape drawn from the adhesive tape supply roll, and tension is applied toward the outer side in the width direction of the adhesive tape. (For example, Patent Document 1).

  It is also known that the cylinder is driven to drive the tape chuck toward the outside in the width direction so that the adhesive tape does not loosen with the adhesive tape facing outward in the width direction, and pulls the adhesive tape in the width direction ( For example, Patent Document 2).

JP 2002-124500 A JP-A-10-330022, FIG. 3, FIG.

  By the way, since the apparatus of the above-mentioned patent document 1 uses a taper roller having a fixed shape, there is a problem that the tension can be constantly adjusted only in a constant tension and in the outward direction. However, there is a problem that the taper roller must be replaced by reexamining the shape and material of the taper roller.

  Also, since the tension in the width direction of the adhesive tape cannot be adjusted, if the tensile tension is excessive, residual stress occurs in the width direction of the adhesive tape, and the wafer after pasting may be warped or damaged. When the tensile tension is too small, there is a problem that the adhesive tape is wrinkled or bubbles are generated.

  Also, as in Patent Document 2, the method of forcibly pulling the tape chuck in the width direction of the adhesive tape with the cylinder to eliminate the slack can only apply tension with a constant tension in the cylinder, and changes the type of adhesive tape. There is a problem that the cylinder pressure needs to be adjusted every time, and there is a problem that the tensile tension becomes excessive or too small because fine fine adjustment is impossible.

  If the tensile tension is too low as described above, tape loosening will occur, and there will be problems such as wrinkles and air bubbles when sticking. In a die attach film, adhesion failure may occur during die bonding.

  Further, some dry film resists have a thickness of about 30 μm, and unless the tension control in the minute width direction is performed, wrinkles easily occur and there is a problem that cannot be applied.

  In addition, it is conceivable to use a ball screw instead of the cylinder and drive the tape chuck in the width direction by a predetermined amount to control it. However, it can be driven only with the pitch of the ball screw, and it is difficult to drive finely. There is a problem that it is difficult to control the tension in the direction.

  According to the first aspect of the present invention, there is provided a sticking table for adsorbing and holding a substrate on the upper surface thereof, and gripping the vicinity of both sides in the width direction of the adhesive tape that is wider than the substrate and wound in a roll shape. A tape chuck mechanism that pulls out, a sticking roller that presses and sticks the drawn adhesive tape to the substrate, and a cutting means that cuts the adhesive tape attached to the substrate along the outer periphery of the substrate. In the adhesive tape applicator, the tape chuck mechanism includes an openable and closable upper chuck located on the upper surface side of the adhesive tape and a roll-shaped lower chuck located on the lower surface side of the adhesive tape in the width direction of the adhesive tape. A pair of left and right tape gripping members that can move toward and away from each other, and elasticity that biases the left and right tape gripping members toward the inner side in the width direction of the adhesive tape And a motor that drives the left and right tape gripping members so as to be able to approach and separate from each other and detects the tension acting in the width direction of the adhesive tape as a torque value when the adhesive tape is gripped. The upper chuck and the lower chuck are closed by closing the upper chuck in a state where the upper chuck and the lower chuck are urged toward the inner end by the elastic member along the width direction of the adhesive tape when gripping with the gripping member. While gripping the adhesive tape and controlling the tension in the width direction of the adhesive tape to be a predetermined tension by moving the left and right tape gripping members apart from each other so that the motor has a predetermined torque value An adhesive tape applying device for attaching an adhesive tape to a substrate.

  By adopting the above-described configuration, it is possible to constantly maintain an appropriate tension while detecting the tension in the width direction as a torque value with a motor when gripping the adhesive tape.

  As the motor to be used, a stepping motor, a servo motor or the like capable of detecting a torque value can be preferably used.

  Further, the invention according to claim 2 is such that the approach and separation of the left and right tape gripping members in the width direction of the adhesive tape makes the sliding resistance as close to zero as possible, and toward the inner side of the elastic member in the width direction of the adhesive tape. 2. The adhesive tape affixing device for a substrate according to claim 1, wherein the biasing force is set to be small enough to return the right and left tape gripping members to the biased inner ends.

  As described above, the width of the minute adhesive tape can be reduced by reducing the sliding resistance of the left and right tape gripping members provided in the tape chuck mechanism toward and away from each other as much as possible. The torque value can be detected by the motor without the tension in the direction being influenced by the sliding resistance of the adhesive tape gripping member.

  Furthermore, if the biasing force of the elastic member toward the inner side in the adhesive tape width direction is set so small that the left and right tape gripping members return to the inner ends, the tension in the width direction of the minute adhesive tape can be adjusted with a motor. The torque value can be detected.

  The tape chuck mechanism is composed of an openable / closable upper chuck located on the upper surface side of the adhesive tape and a roll-shaped lower chuck located on the lower surface side of the adhesive tape, and moves toward and away from each other along the width direction of the adhesive tape. A pair of left and right tape gripping members, an elastic member that urges the left and right tape gripping members toward the inner side in the width direction of the adhesive tape, and the left and right tape gripping members are driven to approach and separate from each other and adhesive tape A motor that detects the tension acting in the width direction of the adhesive tape as a torque value when gripping the adhesive tape, and when the adhesive tape is gripped by the tape gripping member, the upper chuck and the lower chuck have a width of the adhesive tape. The upper and lower chucks are used to close the adhesive tape by closing the upper chuck while being urged toward the inner end by the elastic member along the direction. And holding the left and right tape gripping members away from each other so that a predetermined torque value is obtained by the motor, and controlling the adhesive tape in the width direction to a predetermined tension while controlling the adhesive tape to the substrate. When the adhesive tape is chucked with the tape gripping member, the adhesive tape can be held with the tension set constantly, and the substrate on which the adhesive tape is attached is warped or damaged by the residual stress of the adhesive tape. There is nothing to do.

  Also, the sliding resistance of the tape gripping mechanism's left and right tape gripping members approaching and moving back and forth in the adhesive tape width direction is as close to zero as possible, and the urging force of the elastic member toward the inner side of the adhesive tape width direction By setting it so small that the gripping member returns to the inner end, the minute tension acting in the width direction of the adhesive tape when gripping the adhesive tape can be detected by the motor as a torque value, and the width of the adhesive tape in a minute range It becomes possible to control the tension in the direction.

  With the above, it becomes possible to attach the adhesive tape to the substrate with low tension, and even when the wafer is thinned, no residual stress is generated in the adhesive tape at the time of attachment, and the wafer after attachment is warped. No damage or damage.

  In addition, the adhesive tape can be pulled out onto the substrate while controlling to apply the tension in the width direction of the adhesive tape of the tape gripping member so that the appropriate tension is set in advance. Since the adhesive tape is attached to the substrate, bubbles or wrinkles may occur when it is attached to the substrate even if it is an extremely thin dry film resist (for example, 50 μm or less). There is nothing.

  In addition, since the tension in the width direction is maintained even when the adhesive tape is applied, the tension in the width direction that acts when the application roller is applied is also properly controlled, wrinkles and shrinkage force Does not work.

  Hereinafter, an embodiment of an adhesive tape attaching device of the present invention will be described with reference to FIGS. 1 to 9.

  As shown in FIG. 1, the adhesive tape applying apparatus 1 includes a wafer storage unit 4 for storing the wafer 3 before the adhesive tape 6 is applied on the machine base 5, an alignment unit 22 for positioning the wafer 3, and an adhesive to the wafer. The adhesive tape attaching unit 2 for attaching the tape 6, the attached wafer storage portion 48 for storing the attached wafer 47 to which the adhesive tape 6 is attached, and the wafers 3 are taken out from the wafer storage portion 4 one by one and conveyed. It is composed of a transfer robot 7.

  The wafer storage unit 4 is composed of a cassette for storing the wafers 3 in a multi-stage shape. The cassette is moved up and down by appropriate lifting means, and the suction hand of the transfer robot 7 enters and the wafer 3 is moved. Are picked up and taken out one by one.

  The transfer robot 7 is provided with a suction hand at the tip, and this suction hand is configured to be freely extendable and rotatable. The wafer 3 taken out from the wafer storage unit 4 is attached to the alignment unit 22 and the adhesive tape applying unit 2. The adhered wafer 47, which has been transported onto the table 40 and has been attached with the adhesive tape 6, is transported to and stored in the adhered wafer storage section 48.

  The alignment unit 22 sucks the wafer 6 on its upper surface, and rotates a rotary table 8 that is rotated by an appropriate drive source (not shown), and a notch and an orientation flat provided on the outer peripheral portion of the wafer 6 that is rotated by the rotary table 8. An alignment sensor 9 for detecting by appropriate optical means or the like is provided.

  As shown in FIG. 1 and FIG. 2, the adhesive tape attaching unit 2 includes an adhesive table 40 that sucks and holds the positioned wafer 3 on its upper surface, an adhesive tape supply reel 11 that supplies a wide and roll-like adhesive tape 6, A separator take-up reel 12 that takes up the separator 10 that is peeled off from the adhesive tape 6 by the peeling roller 49, a tape chuck mechanism 16 that grips and pulls out the adhesive tape 6, and presses the drawn adhesive tape 6 against the wafer 3. A sticking roller 14 to be bonded, a cutter unit 41 for cutting the adhesive tape 6 attached to the wafer 3 along the circumferential direction of the wafer 3, and an adhesive for winding and collecting the cut excess adhesive tape 6 It comprises a tape collection reel 13.

  As shown in FIGS. 2 and 3, the sticking table 40 is configured to suck and hold the wafer 3 on its upper surface, and is provided vertically below the rail 52 and the sticking table 40 that are erected on the machine base 5. The slider 53 provided in the support frame 51 is slidably fitted, and the cylinder 50 provided on the machine base 5 acts to move the sticking table 40 up and down.

  The height of the adhesive tape 6 attachment surface of the wafer 3 and the height of the outer peripheral upper surface of the attachment table 40 may be appropriately adjusted according to the attachment conditions, and the height of the outer and inner peripheral table surfaces is appropriately known. It may be made adjustable by means.

  Further, the adhesive tape 6 drawn out from the adhesive tape supply reel 11 is guided to the tension roller 54 via the guide roller 74, and the tension of the tension roller 54 is controlled so as to be kept parallel, and the tape tension in the drawing direction is controlled. Is maintained properly and no residual stress is generated.

  The tension when the adhesive tape 6 is pulled out is a natural force that does not cause contraction in the width direction.

  The separator 10 protecting the adhesive surface is peeled off from the adhesive tape 6 by a peeling roller 49, and is wound around the separator take-up reel 12. At this time, the winding tension of the separator 10 is controlled by the tension roller 55 so that the tension applied to the adhesive tape 6 is kept to a minimum when the separator 10 is peeled off from the adhesive tape 6. An adhesive tape 6 that does not use the separator 10 can also be used.

  The tape chuck mechanism 16 is provided inside the support frame 56 and the support frame 57 as shown in FIGS. 1 to 6, and the support frame 32 and the support frame 33 are provided between the support frames 56 and 57. The support frame 26 is suspended from the support frames 32 and 33 perpendicularly.

  Further, sliders 55 and 55 are provided outside the support frames 32 and 33 so that the rails 54 and 54 provided inside the support frame 56 and the support frame 57 and the sliders 55 and 55 can slide. At the same time, a support plate is extended above the support frame 33 of the tape chuck mechanism 16 and fastened to the belt 34 through the opening of the support frame 57, and the belt 34 is supported by the support frame 57. The tape chuck mechanism 16 is horizontally moved from the solid line position in FIG. 5 to the two-dot chain line position along the rails 54 and 54 by being rotationally driven through the drive pulley 59 and the driven pulley 61 of the motor 60 provided in the motor. It is like that.

  A shaft 30 is pivotally supported at the lower ends of the support frames 32 and 33 so as to be rotatable with respect to the support frames 32 and 33, and a roll shape is provided between the support frames 32 and 33 of the shaft 30. A pair of lower chucks 25, 25 are provided so as to be slidable with respect to the shaft 30, and the left and right lower chucks 25, 25 are engaged so as to rotate only counterclockwise with respect to the shaft 30. Pins are provided.

  Further, a peeling roller 24 is fixed to the shaft 30 between the left and right lower chucks 25, 25. The peeling roller 24 is moved together with the left and right lower chucks 25, 25 as the shaft 30 rotates. It is designed to rotate. In addition, since the lower chuck 25 and the peeling roller 24 are in contact with the adhesive surface of the adhesive tape 6, it is preferable that the lower chuck 25 and the peeling roller 24 be formed of silicone rubber or the like having a releasing action.

  The shaft 30 is extended toward the outside of the support frame 33, and a gear 35 is fixed to a side end portion. A gear 36 that engages with the gear 35 is above the gear 35. It is provided at the side end of the shaft that is pivotally supported on the outside.

  The gear 35 and the shaft 30 are provided with an appropriate clutch mechanism (not shown). When the adhesive tape 6 is gripped and pulled out by the tape chuck mechanism 16, the clutch is disconnected and the shaft 30 does not rotate. When the adhesive tape 6 of the surplus portion described later is peeled from the sticking table 40, the clutch is connected and the shaft 30 is driven to rotate.

  Above the gear 36, a rack 38 arranged side by side on the outside of the support frame 57 and a pinion 37 that engages with the gear 36 are provided, and the pinion 37 has a shaft pivotally supported on the outside of the support frame 33. It is provided at the side end.

  Therefore, the shaft 30 does not rotate when the tape chuck mechanism 16 moves forward in the pulling-out direction of the adhesive tape 6, and the shaft 30 rotates counterclockwise when the tape chuck mechanism 16 moves backward.

  Further, elastic members 18, 18 such as springs are provided outside the left and right lower chucks 25, 25 to urge the left and right lower chucks 25, 25 inwardly with the stoppers 70, 70. The left and right lower chucks 25, 25 are positioned at the inner ends 66, 66.

  The urging force of the elastic member 18 is selected appropriately depending on the urging force enough to return to the inner ends 66, 66 (for example, a spring constant of 0.01 kg / mm or less. However, it depends on the weight of the lower chuck 25 and the sliding resistance of the shaft 30). Therefore, it is preferable to keep the sliding resistance of the shaft 30 as close to zero as possible in order to control a very small tension in the width direction by the tape chuck mechanism 16.

  When the sliding resistance of the shaft 30 and the urging force of the elastic member 18 are large, it is necessary to apply torque by the motor 20 that only cancels the force, and when the tension applied in the width direction of the adhesive tape 6 is very small, the motor 20 This is because the tension in the width direction cannot be detected.

  Further, L-shaped upper chucks 17 and 17 are provided above the left and right lower chucks 25 and 25, respectively, and the left and right upper chucks 17 and 17 are provided with a slider 28 at the rear to support the front of the guide 27. A rail 29 laid on the plate 31 is slidably fitted.

  The upper chuck 17 is connected to the shaft of a cylinder 19 provided on the support frame 68 at the upper side, and can be moved up and down by driving the cylinder 19. When the upper chuck 17 is lowered, the upper chuck 17 is configured to move up and down. The adhesive tape 6 is held between the upper chuck 17 and the lower chuck 25, and a tape holding member 69 is formed by the upper chuck 17 and the lower chuck 25.

  Note that the tape gripping surface of the upper chuck 17 may be provided with a member such as silicone rubber that prevents slipping.

  The slide guide 27 is slidably provided on two upper and lower rail shafts 23, 23 suspended between the support frame 32 and the support frame 33, and the slide guide 27 is attached to the support frame 68. As a result, the upper chuck 17 can move horizontally along the rail shafts 23 and 23 in the left-right direction.

  Further, as shown in FIGS. 5 and 6, the left and right support frames 68 and 68 are connected to the belt 21 so as to be vertically symmetrical with each other, and by driving the belt 21, both support frames 68 and 68 are connected. The left and right upper chucks 17, 17 are moved toward and away from each other. The belt 21 is preferably a timing belt so that slip does not occur.

  The belt 21 is connected to a motor 20 capable of detecting a torque value. By driving the motor 20 to have a preset torque value, the left and right upper chucks 17 and 17 and the lower chuck 25 are driven. 25 are driven in the width direction with the adhesive tape 6 being gripped, and are controlled so that a predetermined tension is applied to the adhesive tape 6.

  As the motor 20, a motor capable of detecting a torque value, such as a stepping motor or a servo motor, can be used as appropriate.

  Further, it is preferable that the sliding resistance of the guide 27 with respect to the rail shaft 23 and the sliding resistance of the lower chuck with respect to the shaft 30 are as small as possible and approach zero, in terms of detecting a minute torque value with the motor 20.

  Further, it is preferable that the urging force of the lower chuck 25 of the elastic member 18 is reduced to such an extent that the lower chuck 25 returns to the inner end 67 in terms of detecting a minute torque value by the motor 20.

  The sticking roller 14 is pivotally supported by an appropriate support frame and is provided so as to be vertically movable by a cylinder 71. One end of the support frame is connected to a belt 66 through an opening of the support frame 57. Yes.

  The belt 66 is stretched between a driving pulley 63 and a driven pulley 65 of a motor 64 provided behind the support frame 57, and reciprocates on the pasting table 40 by driving the motor 64. .

  In addition, the affixing roller 14 is adapted to affix and affix to the wafer 3 while pressing and rolling the adhesive tape 6 when descending. In addition, what is necessary is just to incorporate a heater in the sticking roller 14 suitably according to the kind of adhesive tape 6. FIG.

  Further, a guide roller 15 is provided in front of the sticking roller 14 to guide the adhesive tape 6 so as not to contact the heated sticking roller 14 when the adhesive tape 6 is pulled out. In addition, when the sticking roller 14 is not heated, the guide roller 15 may not be provided.

  The cutter unit 41 includes a motor 45 provided on a support frame extending below the support plate 44, and a cutter 46 provided on a support plate connected to the shaft of the motor 45. The adhesive tape 6 is cut in the circumferential direction along the outer periphery of the wafer 3 by driving the motor 45. An orientation flat cutter or a notch cutter may be provided as appropriate.

  The support plate 44 is provided with a slider 73 at the rear, and is slidably fitted to a rail 72 laid on a support frame 57. The support plate 44 is connected to a cylinder 43 provided on a support plate 42 fixed to a support frame 57, and the cutter unit 41 moves up and down with respect to the sticking table 40 by driving the cylinder 43. It is possible.

  The adhesive tape collecting reel 13 is adapted to wind up and collect the unnecessary portion of the adhesive tape 6 peeled off by the peeling roller 24 and the lower chucks 25, 25 provided in the tape chuck mechanism 16. In conjunction with the adhesive tape supply reel 11 and the tension roller 54, the tension is controlled so that an unnecessary tension is not applied in the pulling direction.

  The above is the configuration of the adhesive tape applicator 1 of the present invention. Next, the operation mechanism of the 16 parts of the tape chuck mechanism of the present invention will be described with reference to FIG.

  After the adhesive tape 6 is affixed to the wafer 3 as shown by the solid line position in FIG. 7, the adhesive tape 6 is cut and cut along the outer shape of the wafer 3 by the action of the cutter unit 41. A difference in tension distribution occurs between the unused portions, and the adhesive tape 6 contracts in the width direction.

  In order to effectively use the adhesive tape 6, it is preferable that the position where the adhesive tape 6 is gripped by the tape gripping member 69 is brought close to the extent that it does not affect the next pasting. The part will be gripped.

  With the adhesive tape 6 contracted in the width direction as described above, the lower chucks 25 and 25 and the upper chucks 17 and 17 are close to the inner ends 67 and 67 (that is, toward the inner side in the width direction of the adhesive tape 6). The upper chucks 17 and 17 are closed by the action of the cylinder 19 and the adhesive tape 6 is chucked and held by the tape gripping members 69 and 69 in a state where no tensile force in the width direction of the tape chuck mechanism 16 is generated.

  Next, the adhesive tape 6 is controlled by operating the motor 20 and controlling it so as to have a predetermined torque value set to a predetermined value (the extent that the width of the cut-through portion of the adhesive tape 6 becomes the width of the unused portion). However, the tension in the width direction is controlled so that the width direction has a predetermined width as indicated by the two-dot chain line position in the figure.

  In the above state, the adhesive tape 6 is pulled out onto the wafer 3 held on the sticking table 40, and the adhesive tape 6 to be described later is applied in a state where the tension in the width direction is held. The tension in the width direction of the adhesive tape 6 is constantly maintained properly at the time of application to the wafer 3, and the wafer 3 is not warped or damaged by the residual stress, and further, no wrinkles or bubbles enter the adhesive tape 6. Can be pasted.

  Next, adhesion of the adhesive tape 6 to the substrate in the adhesive tape applying apparatus 1 will be described below.

  As shown in FIG. 1, the wafer storage unit 4 before bonding is moved up and down by an appropriate mechanism, the wafers 3 are sucked and taken out one by one from the upper surface of the suction hand of the transfer robot 7, and transferred onto the suction table 8 of the alignment unit 22. Included.

  The wafer 3 transferred on the suction table 8 is sucked and held on the suction table 8 and is rotated by an appropriate rotation mechanism (not shown), and the alignment sensor 9 detects notches and orientation flats provided on the outer periphery of the wafer 3. Then, the positioning is performed in preparation for the next step of applying the adhesive tape 6.

  The wafer 3 on which the positioning has been performed is transferred while being positioned on the sticking table 40 of the adhesive tape sticking unit 2 and is sucked and held on the sticking table 40.

  Next, the operation of attaching the adhesive tape 6 to the wafer 3 in the adhesive tape attaching unit 2 will be described with reference to FIGS.

  As shown in FIG. 8A, the upper chuck 17 of the tape gripping member 69 is lowered by the action of the cylinder 19, grips the adhesive tape 6 with the lower chuck 25, and holds the adhesive tape 6. At this time, the left and right lower chucks 25, 25 are urged inward by a slight urging force by the elastic member 18 until just before the adhesive tape 6 is gripped. The adhesive tape 6 is gripped in a certain state, and no tension is generated toward the outer side in the width direction of the adhesive tape 6.

  Next, by driving the motor 20 so that the motor 20 has a torque value corresponding to a preset tension value, the left and right tape gripping members 69, 69 are separated from each other toward the outside in the width direction of the adhesive tape 6. Move horizontally in the direction and keep the proper torque value.

  In addition, about the tension | tensile_strength in the width direction to the adhesive tape 6, if the pasting test etc. are beforehand performed according to various materials, thickness, etc. and the optimal conditions are calculated | required, the tension value will be input beforehand. Thus, the torque value of the motor 20 is controlled so as to obtain the tension value.

  As described above, an appropriate tension is applied toward the outer side of the adhesive tape 6 in the width direction. In this state, the tape chuck mechanism 16 is driven to the position indicated by the solid line in FIG. In the held state, the adhesive tape 6 is drawn onto the sticking table 40 on which the wafer 3 is held.

  At this time, if the tension in the pulling-out direction of the adhesive tape 6 is also controlled, the tension in the pulling-out direction can be optimized.

  Next, as shown in FIG. 8 (b), the sticking table 40 is moved up to a position that is spaced from the adhesive tape 6, and the sticking roller 14 is lowered by the action of the cylinder 39. 6 is pressed and crimped.

  The sticking roller 14 moves horizontally while pressing and rolling on the wafer 3 as shown in FIG. 8C, and ascends at the sticking terminal portion of the sticking table 40 and returns to the initial position shown in FIG.

  Subsequently, as shown in FIG. 9A, the cutter unit 41 is lowered by the action of the cylinder 43 and the motor 43 is driven to cut the adhesive tape 6 in the circumferential direction along the outer shape of the wafer 3.

  The sticking table 40 is lowered by the action of the cylinder 50 as shown in FIG.

  Subsequently, as shown in FIGS. 3 and 4, when the clutch of the gear 35 is engaged, the driving force of the rack 38 and the pinion 37 is transmitted to the gear 35 through the gear 36, and the peeling roller 24 is driven to rotate. After the upper chuck 17 is lifted and the grip of the adhesive tape 6 is released as shown in (f), the tape chuck mechanism 16 is moved horizontally toward the application terminal portion of the application table 40, and the excess part of the adhesive tape 6 is removed. After being peeled off by the peeling roller 24, the tape chuck mechanism 16 moves to the next tape chuck mechanism position (see FIG. 8A).

  The adhered wafer 47 to which the adhesive tape 6 is affixed is lifted from the affixing table 40 by a floating pin (not shown) provided on the affixing table 40 after the adhering of the affixing table 40 is released. Is stored in the pasted wafer storage section 48.

  The above is the process of applying the adhesive tape 6 to the wafer 3 in the adhesive tape applying apparatus 1 of the present invention. Next, the results of actual application using the adhesive tape applying apparatus 1 of the present invention are as follows. Shown in

  As a common condition of the embodiment, a stepping motor and a pulley having a maximum (100%) tension of 11.8 N in relation to the motor 20 and the pulley diameter are used, and the elastic member 18 has a spring constant of 0.003 kg / m. The experiment was conducted using the test piece. At this time, the load value when the lower chuck 25 was moved outward in the width direction from the inner end 67 of the shaft 30 was 0.25 N.

  Example 1 When an 8-inch wafer (thickness: 720 μm) was used and a dry film resist having a thickness of 31 μm was attached at a torque output of the motor 20 of 5%, it could be attached to the wafer without wrinkles or bubbles. At this time, the tension in the width direction is 0.59 N. When the movement resistance force 0.25 N of the lower chuck 25 is subtracted, the tension acting in the width direction of the adhesive tape is 0.34 N.

  Example 2: When an 8-inch wafer (thickness: 720 μm) was used and a protective tape having a thickness of 135 μm was applied at a torque output of the motor 20 of 15%, it could be applied to the wafer without wrinkles or bubbles. At this time, the tension in the width direction is 1.77 N, and when the movement resistance force 0.25 N of the lower chuck 25 is subtracted, the tension acting in the width direction of the adhesive tape is 1.52 N.

  Comparative Example 1: When only the elastic member 18 is changed to one having a spring constant of 0.022 kg / mm under the conditions of Example 2, the movement resistance force of the lower chuck 25 is 5.4 N, which is smaller than the movement resistance force. The tension in the width direction could not be detected by the motor 20, and the tension in the width direction was excessive, causing residual stress to act on the wafer 3 at the time of bonding, and the wafer after back grinding warped in the width direction.

  Although the above is an example of the Example of this invention, the motor 20, a pulley diameter, a spring constant, and movement resistance can be suitably selected so that it may accept | permit according to the adhesive tape 6 to be used.

  In the above embodiment, a roller is used for the lower gripping portion of the tape chuck mechanism 16 so that it can also be used as a peeling operation. However, the present invention is not limited to this, and a plate-like one is used instead of a roller. The peeling operation can also be performed using another mechanism.

  Moreover, in the said embodiment, although the wide roll-shaped tape was used without cut | disconnecting in the width direction in the middle (endless state), even if it is a roll-shaped tape which has the end part by which the front-end | tip part was cut | disconnected in the width direction, it can be used. .

  Moreover, said Example is an example and can be suitably changed according to the kind of adhesive tapes, such as the motor 20, the elastic member 18, etc. FIG.

It is a top view of the adhesive tape sticking apparatus of this invention. It is an AA direction arrow front view of FIG. It is a BB direction arrow side view of FIG. It is a principal part enlarged plan view of the adhesive tape sticking apparatus of this invention. It is explanatory drawing of the adhesive tape sticking apparatus of this invention. It is a principal part expanded rear view of the tape chuck mechanism part of this invention. It is explanatory drawing of the tape chuck mechanism part of this invention. (A) thru | or (c) It is explanatory drawing showing the adhesive tape sticking operation | movement of the adhesive tape sticking apparatus of this invention. (D) thru | or (f) It is explanatory drawing showing the adhesive tape sticking operation | movement of the adhesive tape sticking apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive tape sticking apparatus 2 Adhesive tape sticking unit 3 Wafer (board | substrate)
DESCRIPTION OF SYMBOLS 4 Wafer storage part before sticking 5 Machine stand 6 Adhesive tape 7 Transfer robot 8 Suction table 9 Alignment sensor 10 Separator 11 Adhesive tape supply reel 12 Separator recovery reel 13 Adhesive tape recovery reel 14 Adhesive roller 15 Guide roller 16 Tape chuck mechanism 17 Upper chuck 18 Elastic member 19 Cylinder 20 Motor 21 Belt 22 Alignment section 23 Rail shaft 24 Peeling roller 25 Lower chuck 26 Support frame 27 Slide guide 28 Slider 29 Rail 30 Shaft 31 Support plate 32 Support frame 33 Support frame 34 Belt 35 Gear 36 Gear 37 Pinion 38 Rack 39 Cylinder 40 Attaching table 41 Cutter unit 42 Support plate 43 Cylinder 44 Support plate 45 Motor 46 Cutter 47 Attached wafer 48 Attached wafer storage 49 Peeling roller 5 Cylinder 51 Support frame 52 Rail 53 Slider 54 Rail 55 Guide 56 Support frame 57 Support frame 58 Guide roller 59 Drive pulley 60 Motor 61 Driven pulley 62 Belt 63 Drive pulley 64 Motor 65 Pulley 66 Belt 67 Inner end 68 Support frame 69 Tape gripping member 70 Stopper 71 Cylinder 72 Rail 73 Slider 74 Guide roller

Claims (2)

A sticking table that holds the substrate on its upper surface by suction, a tape chuck mechanism that holds the vicinity of both sides in the width direction of the adhesive tape that is wider and rolls than the substrate, and draws the adhesive tape onto the substrate by a predetermined amount. In an adhesive tape affixing device to a substrate consisting of an affixing roller that presses and sticks the drawn adhesive tape to the substrate, and a cutting means for cutting the adhesive tape affixed to the substrate along the outer periphery of the substrate,
The tape chuck mechanism is
A pair of left and right left and right side chucks that are openable and closable located on the upper surface side of the adhesive tape and a roll-shaped lower chuck located on the lower surface side of the adhesive tape and that can move toward and away from each other along the width direction of the adhesive tape. A tape gripping member;
An elastic member for biasing the left and right tape gripping members toward the inner side in the width direction of the adhesive tape;
It comprises a motor that drives the left and right tape gripping members so as to approach and separate from each other and detects the tension acting in the width direction of the adhesive tape as a torque value when gripping the adhesive tape,
When gripping the adhesive tape with the tape gripping member, the upper chuck is closed by closing the upper chuck in a state where the upper chuck and the lower chuck are biased toward the inner end by the elastic member along the width direction of the adhesive tape. The adhesive tape is gripped by the lower chuck, and the left and right tape gripping members are moved away from each other so that a predetermined torque value is obtained by the motor, whereby the tension in the width direction of the adhesive tape becomes a predetermined tension. An adhesive tape affixing device to a substrate, wherein the adhesive tape is affixed to the substrate while being controlled as described above.   When the two tape gripping members approach and separate in the width direction of the adhesive tape, the sliding resistance is brought close to zero as much as possible, and the urging force of the elastic member toward the inner side of the adhesive tape width direction is the inner side of both tape gripping members. 2. The adhesive tape affixing device for a substrate according to claim 1, wherein the device is set to be small enough to return to the end.

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