JPH07263524A - Tape stretching device in semiconductor fabrication apparatus, and semiconductor fabrication apparatus including the tape stretching device - Google Patents

Abstract

PURPOSE:To provide a tape stretching device in a semiconductor fabrication apparatus including the tape stretching device, the tape stretching device being capable of stretching a tape adhered over a semiconductor wafer and a frame in a cross-web direction in the same manner as in a down-web direction. CONSTITUTION:In a tape stretching device in a semiconductor fabrication apparatus including a longitudinal tension device 5 for stretching a tape 2 pulled out from a tape roll 1 in a down-web direction on the upper side of a semiconductor wafer 3, there is provided a transverse tension device that includes a clamp device 17 for holding a one side edge of the tape in the cross-web direction, the tape being stretched in the down-web direction with the aid of the longitudinal tension device, a lamp device 17 for holding the other side edge, and a driving device 18 for opening/closing an interval between both clamp devices in the cross-web direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape expanding device for a semiconductor manufacturing apparatus, and more particularly to a tape expanding device for a semiconductor manufacturing apparatus and a tape expanding device for a semiconductor manufacturing apparatus capable of expanding a tape by averaging tension two-dimensionally. The present invention relates to a semiconductor manufacturing apparatus provided.

[0002]

2. Description of the Related Art When a semiconductor wafer is cut into a large number of semiconductor chips in a semiconductor manufacturing process, the semiconductor wafer is accurately oriented and the semiconductor chips cut from the semiconductor wafer are easily handled. Before cutting, the tape is attached to the other surface of the semiconductor wafer having the semiconductor junction structure formed on one surface thereof and the plate-shaped dicing frame surrounding the periphery of the semiconductor wafer.

As a method of adhering this tape to a semiconductor wafer and a frame, for example, in order to prevent wrinkles from occurring on the tape adhered to the semiconductor wafer, a semiconductor wafer and a plate-like member concentrically surrounding the semiconductor wafer are used. After the tension is applied on the upper side of the frame, the frame and the semiconductor wafer are raised to the lower surface of the tape, the tape is pressed against the frame and the semiconductor wafer by a roller or the like, and the portion covering the frame and the semiconductor wafer is cut out. It

As shown in FIG. 5, for example, as shown in FIG. 5, the tape tension device for tensioning the tape includes a stationary roller 103 and a moving roller 104 on the upper side of the semiconductor wafer 101 and the frame 102 at appropriate intervals in the downweb direction. They are arranged in parallel and at the same height so as to be rotatable around the horizontal axis.

The moving roller 1 of the stationary roller 103
The counter roller 105 and the stationary roller 10 are provided on the side opposite to 04.
3, a clamp pad 106 is disposed on the opposite side of the moving roller 104 to the stationary roller 103 so as to be able to move toward and away from the moving roller 104, and a central portion is formed on the upper side of the moving roller 104 to have a small diameter. A drum-shaped roller 107 is arranged.

The moving roller 104 and the hourglass roller 10
7, the clamp pad 106 and the cylinder 108 that drives the clamp pad 106 are driven back and forth by the drive device 109 in the downweb direction, that is, in the manner in which the tape 110 is fed (flow method).

The driving device 109 may be composed of an air cylinder, but the tension of the tape 110 can be adjusted by adjusting the moving amount of the moving roller 104 and the clamp pad 106 according to the type of the tape 110. In order to achieve the above, the moving roller 104 and the cylinder 108 are supported by the moving frame 111, and the driving device 109 is inserted through the screw hole formed in the moving frame 111 so as to be able to advance and retract in the downweb direction, The stepping motor 113 drives the screw shaft 112.

The tape 110 drawn from the tape roll 114 passes between the stationary roller 103 and the counter roller 105, and horizontally moves from the lower side of the stationary roller 103 to the lower side of the movable roller 104, and the movable roller 104 and the clamp pad. After being wound around the drum-shaped roller 107 through the gap between the roller 106 and 106, it is wound around the winding roll 115.

The tape 110 is spread on the drum roller 107 in the cross-web direction by being wound around the drum roller 107, whereby the tape 110 is stretched on the upper side of the semiconductor wafer 101 and the frame 102 without being wrinkled.

After the proper position of the tape 110 is clamped by the stationary roller 103 and the counter roller 105, the moving roller 104 and the clamp pad 10 are clamped.
The tape 110 is clamped with 6, and the moving roller 104, the drum roller 107, the clamp pad 106, and the cylinder 1
08 is moved over a predetermined distance in the direction away from the stationary roller 103, so that, for example, 50 is applied to a portion of the tape 110 between the stationary roller 103 and the moving roller 104.
A tension of ~ 80 kg is applied.

Thereafter, the semiconductor wafer 101 and the frame 102 are lifted to attach the tape 110, and the tape 110 in the circular portion covering the inner peripheral portion of the frame 102 and the semiconductor wafer 101 is cut out, and then the tape 110 is attached. The attached semiconductor wafer 101 and frame 102 are moved downward.

Thereafter, the counter roller 105 is separated from the stationary roller 103, the clamp pad 106 is separated from the moving roller 104, and the tape 110 is wound over a predetermined length while returning the moving roller 104 to the original position.

By repeating such a series of procedures, the tape 110 is attached to the semiconductor wafer 101 and the frame 102 one after another.

[0014]

According to this conventional tape expanding device, the tape 110 is formed by the drum roller 107.
The tension applied in the cross-web direction is about 5% of the tension in the down-web direction, which is only enough to remove the wrinkles of the tape 110.

When the semiconductor wafer 101 is cut in the dicing process after the tape 110 is attached, the tension of the tape 110 is greatly different between the downweb direction and the crossweb direction. Therefore, the distance between the semiconductor chips cut out from the semiconductor wafer 101 is increased. As a result, the position of the semiconductor chip cannot be detected when the semiconductor chip is peeled off and taken out from the tape 110 by the pickup machine after dicing, and the pickup machine is automatically stopped and the process is frequently interrupted. It is happening.

The present invention has been completed in order to solve the above technical problems, and it is possible to tension a tape adhered across a semiconductor wafer and a frame in the cross-web direction in the same manner as in the down-web direction. It is an object of the present invention to provide a tape spreading device in a semiconductor manufacturing apparatus that can be used and a semiconductor manufacturing apparatus including the tape spreading device.

[0017]

The present invention achieves the above object in a tape expanding device in a semiconductor manufacturing apparatus including a vertical tensioning device for tensioning a tape pulled out from a tape roll in a downweb direction above a semiconductor wafer. In order to do so, the following measures are taken.

That is, according to the present invention, a clamping device that clamps one side edge in the crossweb direction of a tape that is tensioned in the downweb direction by the vertical tensioning device, a clamping device that clamps the other side edge, and A lateral tensioning device having a driving device that opens and closes the space between the clamping devices in the cross-web direction is provided.

The tape used in the present invention is adhered to a semiconductor wafer and a plate-like dicing frame surrounding the semiconductor wafer, and it is made of a synthetic resin, cellophane or the like film and one surface thereof. And a supported adhesive layer.

The semiconductor wafer is placed on the elevator table with the surface on which the semiconductor junction structure is formed facing downward and concentrically with the frame.

The vertical tensioning device may be constructed so as to tension the tape pulled out from the tape roll in the downweb direction on the upper side of the semiconductor wafer. Therefore, for example, a known spreading device including the above-mentioned conventional example. The configuration may be similar to.

For example, a stationary roller and a moving roller which are arranged parallel to each other on the upper side of the semiconductor wafer and the frame in the downweb direction at a predetermined interval longer than the length of the frame, and stationary clamp means which is brought into contact with and separated from the stationary roller. It can be configured to include a moving clamp unit that is brought into contact with and separated from the moving roller, and a drive device that advances and retracts the moving roller and the moving clamp unit in the downweb direction.

The tension applied to the tape by this vertical tensioning device is
Although it may be fixed, it is preferable to optimize a plurality of types of tapes having different tensile strengths with respect to the tensile strengths. Therefore, for example, in the above-described longitudinal tension device, the moving amounts of the moving roller and the moving clamp means are variably set. It is desirable to provide tension setting means and adjust the amount of movement of the moving roller and the moving clamp means according to the type of the tape so that optimum tension can be given to the tape.

In this case, it is preferable to control the moving amount of the moving roller and the moving clamp means with high accuracy. For this purpose, the moving roller and the moving clamp means are supported on the moving frame and formed on the moving frame. It is recommended that the drive means be configured with a motor that rotationally drives a screw shaft that is inserted into a screw hole so as to be able to advance and retract.

The transverse tensioning device may be constructed so that the tape tensioned in the downweb direction by the longitudinal tensioning device is tensioned in the crossweb direction perpendicular to the downweb direction. It is necessary to have a clamp device that clamps one side edge in the crossweb direction, a clamp device that clamps the other side edge, and a drive device that opens and closes the gap between the pair of clamp devices.

Here, as a method for the drive device to open and close the gap between both clamp devices, one clamp device is fixed and the drive device moves the other clamp device, and the drive device uses both clamp devices. A method of moving it is considered.

Although any of these methods may be adopted in the present invention, in the method in which one clamp device is fixed and the drive device moves the other clamp device, three ends are fixed and one of them is eventually fixed. Since the side edge is pulled, the tension cannot be perfectly two-dimensionally averaged, and the array of semiconductor chips cut out during dicing is greatly moved to one side, and the cutting position can be detected by the dicing machine. It is often lost.

Therefore, in the present invention, it is preferable to adopt a method in which the driving device moves both clamping devices, and in particular, the driving device is configured to move both clamping devices synchronously in opposite directions. Preferably.

Further, in the present invention, it is preferable that the output of the driving device, that is, the tension applied to the tape in the cross-web direction can be adjusted according to the film thickness and width of the tape. It is recommended to provide adjusting means for adjusting the output of the drive.

As described above, when both clamp devices are moved in the opposite directions in synchronization with each other, the semiconductor chip is not offset at the time of dicing. The reason is that the center line of the tape in the cross-web direction is crossed. It is considered that this is because the tape is tensioned without moving in the web direction, and the tension is evenly applied in the downweb direction and the crossweb direction around the center of the semiconductor wafer.

A hydraulic or air cylinder may be used as a drive device for moving both clamp devices synchronously in opposite directions.

However, a hydraulic cylinder or an air cylinder is not preferable because it is difficult to perform accurate output control and accurate speed control corresponding to the tensile strength of the tape used, and particularly difficult to perform highly accurate digital control.

Further, in the case of the hydraulic cylinder, it is not preferable because oil droplets may adhere to the semiconductor wafer, the frame, the tape and the like, and in the case of the air cylinder, an air bleeding block is required, which is not preferable.

It is also possible to use a linear solenoid as the drive device, but it is possible to use a linear solenoid as in the case of the vertical tension device.
In order to obtain a large output of 0 kg or more, it is necessary to use a considerably large one, which is disadvantageous in reducing the size of the entire device.

Further, although it is conceivable that the drive device is composed of a cam for driving both clamp devices, an interlocking mechanism for interlocking the cams, and a motor, it is possible to obtain a sufficient output without a boosting mechanism. This is not preferable because it is difficult and the deterioration of the synchronization accuracy and output due to the abrasion of the cam is likely to occur, and it is also difficult to accurately control the output corresponding to the tensile strength of the tape used.

After all, the drive device used in the present invention includes a screw shaft extending in the cross-web direction and having a left screw formed from one end side and a right screw formed from the other end, and a motor for driving this screw shaft. It is optimal to employ a configuration in which the left screw of the screw shaft is inserted into one of the clamp devices so as to be able to advance and retreat, and the right screw is inserted into the other clamp so as to be able to advance and retract.

The above-mentioned screw shaft may be one, but a plurality of two or more screw shafts may be provided in parallel, and these may be synchronized by a synchronizing device such as a toothed belt or a gear.

When one screw shaft is provided, one or more guides for guiding the movement of both clamp devices should be arranged in parallel with the screw shaft in order to stabilize the movement of both clamp devices. Is preferred.

On the other hand, when a plurality of screw shafts are provided, these screw shafts perform the function of guiding each other, and thus the guide shaft can be omitted.

According to the driving device including the screw shaft and the motor, the positions of both clamping devices corresponding to the tensile strength of the tape to be used can be easily and easily controlled by digitally controlling the distance between both clamping devices. It becomes possible to control with high precision.

Moreover, in the case of driving both clamp devices by the screw shaft in this way, it is possible to apply a tension of about 200 kg to the tape, and an inexpensive tape having a strong adhesive force but a variation in the adhesive force is used. It can be used, and the manufacturing cost of semiconductor parts can be reduced.

As the adjusting means for variably setting the tape tension, it is possible to use a mechanical torque limiter capable of variably setting the limiting torque, but in order to facilitate the adjusting operation and increase the adjusting accuracy. Using a stepping motor or the like that can perform accurate digital control of the rotation angle as the motor of the drive unit, the control value of this motor corresponding to various tapes is given to a programmable microcomputer, and the rotation amount of the motor, that is, both clamps. It is preferable that the amount of movement of the device can be adjusted according to the type of tape.

In this case, the control values of the motors corresponding to various tapes are stored in the microcomputer in advance, and the optimum control value is automatically selected by giving a signal for selecting the tape type to the microcomputer. Alternatively, the control value corresponding to each tape type may be provided to the microcomputer.

In order to prevent the tape from breaking and to equalize the tension of the tape in the cross-web direction with respect to the down-web direction, each of the above-mentioned clamping devices clamps the side edges of the tape in the down-web direction for as long a distance as possible. It is preferable to be able to do so.

Therefore, each of the above-mentioned clamping devices has its both edges in the crossweb direction of the tape tensioned in the downweb direction by the longitudinal tension device on the upper side of the semiconductor wafer, preferably in the thickness direction over a predetermined length longer than the frame. It is preferable to provide a pair of clamp beams that are sandwiched from both sides of the clamp beam.

These clamping surfaces may be formed as flat friction surfaces, but if they are formed as concavo-convex surfaces that mesh with each other, the tape can be reliably held and therefore a strong tension can be applied to the tape. Is.

When the clamping surface is formed as an uneven surface,
In order to prevent the tape from slipping out from between the clamping surfaces against a strong tension, it is preferable to form striped irregularities extending in the downweb direction.

A triangular waveform, a sawtooth waveform, a rectangular waveform, and the like are conceivable as the cross-sectional shape of the unevenness of the clamping surface. Among these, the tape is particularly difficult to slip out from between the clamping surfaces and is easy to process. Waveform is recommended.

Each of the clamp devices is composed of two spline shafts that mesh with each other. Both side edges of the tape are meshed between the spline shafts, and the spline shafts of the clamp devices are rotated in synchronization with each other. Although it is possible to apply tension to the tape in the cross-web direction by this, it is difficult to improve the synchronization accuracy of the spline shafts of both clamp devices, and the center line of the tape is displaced in the cross-web direction with this configuration. It is not preferable because there is a fear that it may be disadvantageous in improving safety.

Further, in the present invention, the vertical tensioning device can be configured to apply tension to the tape in the downweb direction by synchronously pulling the tape on both sides around the semiconductor wafer and the frame. But
In this case, the vertical tension device may pull the tape in both the downweb direction and the horizontal tension device may pull the tape in both directions in the crossweb direction.

When the vertical tensioning device is constructed to pull the tape synchronously on both sides of the semiconductor wafer and the frame, the lateral tensioning device pulls the tape in one direction in the crossweb direction. It is also possible to apply a tension in the cross-web direction to the tape and then pull the tape synchronously in both the down-web direction with a longitudinal tensioning device to apply the tension in the down-web direction.

The semiconductor manufacturing apparatus of the present invention comprises the tape spreading apparatus of the present invention in order to achieve the above object.

[0053]

Since the present invention has the above-mentioned structure, the vertical tensioning device applies tension to the tape in the downweb direction, and the lateral tensioning device applies tension to the tape in the crossweb direction in the same direction as the downweb direction. This has the effect of adhering the semiconductor wafer and the frame to the tape that is given tension in the downweb direction and the crossweb direction.

[0054]

Embodiments of the present invention will be specifically described below with reference to the drawings, but the present invention is not limited to the embodiments described below.

As shown in FIG. 1, a semiconductor manufacturing apparatus according to an embodiment of the present invention is a longitudinal tension for tensioning a tape 2 pulled out from a tape roll 1 above a semiconductor wafer 3 and a frame 4 in a down web direction. A device 5 and a lateral tensioning device 6 for tensioning in the cross-web direction are provided.

The vertical tensioning device 5 is constructed in the same manner as a conventional tape stretching device, and is provided with a stationary roller 7 rotatably provided around a horizontal axis in the crossweb direction, and from the stationary roller 7 in the downweb direction. The movable roller 8 is provided so as to be rotatable in parallel with the stationary roller 7 at a distance longer than that of the frame 4.

A counter roller 9 is arranged on the opposite side of the stationary roller 7 to the moving roller 8 so as to be able to come into contact with and separate from the stationary roller 7, and a clamp pad 10 is arranged on the opposite side of the stationary roller 7 to the moving roller 8. Is arranged so that
On the upper side of the moving roller 8, a drum-shaped roller 11 having a small central portion is arranged.

The moving roller 8, the drum-shaped roller 11, the clamp pad 10 and the cylinder 12 for driving the clamp pad 10 are supported by the moving frame 13 and can be screwed back and forth in the screw holes formed in the moving frame 13. A stepping motor 15 is inserted through the inserted screw 14.
It is reciprocally driven in the downweb direction.

The tape 2 passes from the tape roll 1 between the stationary roller 7 and the counter roller 9 and the stationary roller 7
It is pulled out to the lower side, is fed horizontally, passes between the moving roller 8 and the clamp pad 10 from the lower side of the moving roller 8, passes through the hourglass-shaped roller 11, and is wound up by the winding roll 16.

The rotation of the tape roll 2, the take-up roll 16 and the stationary roller 7 is stopped at a predetermined timing, and the tape 2 is stopped by sandwiching the tape 2 between the counter roller 9 and the stationary roller 7. At the same time or after this, the rotation of the moving roller 8 is stopped and the tape 2 is sandwiched between the clamp pad 10 and the moving roller 8.

After that, the clamp pad 10 holding the tape 2 and the moving roller 8 are moved in the direction away from the stationary roller 7, so that the tape 2 is given a tension in the downweb direction.

Here, since the tension of the tape 2 can be adjusted by the type of the tape 2 and the movement amount of the clamp pad 10 and the moving roller 8, the tension of the clamp pad 10 and the moving roller 8 in the downweb direction. By numerically controlling the amount of movement by a control device including a microcomputer, the optimum tension (for example, about 50 to 200 kg) in the downweb direction corresponding to the type of tape is applied to the tape 2.

It should be noted that the microcomputer of this control device stores optimum control values for various tapes in advance, and by giving a signal for identifying the kind of tape to this microcomputer, the optimum control for the tape is performed. Although the value is selected, the amount of movement of the clamp pad 10 and the moving roller 8 can be numerically controlled by inputting the optimum control value corresponding to the tape used directly to this microcomputer. Good.

However, in the present invention, a torque limiter capable of variably setting the limit set value is interposed between the stepping motor 15 and the screw 14 without depending on such numerical control, and the tape 2 used is It is also possible to mechanically set the tension so as to adjust the tension in the downweb direction given to the tape by adjusting the limit value to a value corresponding to the optimum tension.

The lateral tensioning device 6 comprises a pair of clamp devices 17 arranged between the stationary roller 7 and the moving roller 8 so as to face each other, and a drive device 18 for opening and closing the interval between the clamp devices 17. .

Each of the clamp devices 17 prevents the tape 2 from breaking and equalizes the tension of the tape 2 in the cross-web direction with respect to the down-web direction. It is preferable to be able to pinch over a long distance.

For this reason, in this embodiment, the clamping device 17 has a predetermined length in the clamping direction both ends of the tape 2 which is tensioned in the downweb direction by the vertical tensioning device 5 on the upper side of the semiconductor wafer. length
(Here, the length is about 1.2 to 1.5 times the length of the frame 3) A pair of clamp beams 19 and 20 for sandwiching the tape 2 from above and below, and an upper clamp beam 19
An air cylinder 21 is provided for moving up and down toward the lower clamp beam 20.

The clamp surfaces of the clamp beams 19 and 20 facing each other may be formed as flat friction surfaces, but in this embodiment, in order to securely hold the tape 2 and to give a strong tension to the tape. As shown in FIG. 2, the clamping surfaces 22 and 23 have rectangular wave-shaped cross sections that mesh with each other, and are formed in a striped uneven surface extending in the downweb direction, or have a sawtooth-shaped cross section as shown in FIG. It is preferably formed on a striped uneven surface extending in the downweb direction, or formed on a striped uneven surface extending in the downweb direction having a triangular wave cross section as shown in FIG.

In this embodiment, in order to prevent the tape 2 from slipping out from between the clamping surfaces 22 and 23 against strong tension most certainly and to facilitate the processing of the clamping surfaces 22 and 23, As shown in FIG. 5, the cross-sectional shape is formed in a striped uneven surface extending in the downweb direction and formed in a rectangular wave shape.

The drive unit 18 is provided with a screw shaft 24 extending in the cross-web direction and having a left screw formed from one end and a right screw formed from the other end, and a stepping motor 25 for driving the screw shaft 24. The left screw of the screw shaft 24 is inserted into one of the clamp devices 17 so as to be able to advance and retreat, and the right screw is inserted into the other clamp device 17 so as to be able to advance and retract.

The number of the screw shafts 24 may be one or two or more. In this embodiment, both clamp devices 17 can be moved smoothly to enhance the control accuracy and the structure is simple. 2 screw shafts 24 are arranged parallel to each other in the downweb direction at appropriate intervals, and the synchronization device 26
Both screw shafts 24 are operated in synchronism with each other.

While the tape 2 is being fed, and while the moving roller 8 and the clamp pad 10 of the vertical tensioning device 5 are moving in the direction away from the stationary roller 7, the air cylinder 21 is extended so that The clamp beam 19 is separated from the lower clamp beam 20.

During this period or before this period, both the clamp devices 17 are moved by the drive device 18 so that the side edge portion of the tape 2 is located between the upper clamp beam 19 and the lower clamp beam 20. After the tension of the tape 2 in the downweb direction by the vertical tensioning device 5 is finished, the air cylinder 21 is shortened to lower the upper clamp beam 19, and the tape 2 is interposed between the upper clamp beam 19 and the lower clamp beam 20. Hold the side edge of the.

Further, thereafter, the driving device 18 drives the two clamping devices 17 in directions away from each other, and when the two clamping devices 17 have moved by a predetermined distance, the driving device 18 is stopped, so that the tape 2 is moved down the web. Direction tension
Tension in the clamp direction equivalent to (for example, about 50 to 200 kg) is applied.

Here, since the tension of the tape 2 can be adjusted by the type of the tape and the amount of movement of both clamp devices 17, the controller for the stepping motor 25 controls the stepping motor 25. By controlling the amount of rotation numerically, the optimum tension in the cross-web direction corresponding to the type of tape is applied to the tape.

It should be noted that the microcomputer of this control device stores in advance optimum control values for various tapes, and by giving a signal for identifying the type of tape to this microcomputer, the optimum control for the tape is performed. Although the value is selected, the rotation amount of the stepping motor 25 may be numerically controlled by inputting an optimum control value corresponding to the tape used directly to this microcomputer.

In the present invention, however, the tape 2 used by interposing a torque limiter capable of variably setting a limit set value between the stepping motor 25 and the screw shaft 24 without relying on such numerical control. It is also possible to mechanically set the tension so as to adjust the tension in the cross-web direction given to the tape by adjusting the limit value to a value corresponding to the optimum tension.

Since both clamp devices 17 are driven in synchronism with each other in opposite directions, tension in the cross web direction is applied without shifting the center line of the tape 2 in the cross web direction in the cross web direction.

After the space between the two clamp devices 17 is opened, the semiconductor wafer 3 and the frame 3 are lifted up to the extent that the tape 2 is slightly lifted, and the tape 2 is transferred from above to the semiconductor wafer 3 and the frame 3. The tape 2 is attached to the pressing frame 3 of the semiconductor wafer 3 by pressing, and then the tape 2 is cut out in a circular shape to cover the semiconductor wafer 3 and the inner peripheral portion of the frame 3.

The tape 2 is attached to the semiconductor wafer 3 and the frame 3.
After the semiconductor wafer 3 and the frame 3 are lowered, the upper clamp beam 19 of both clamp devices 17 is attached.
Is lifted to release the tape 2 from both clamp devices 17, and the counter roller 9 is separated from the stationary roller 7,
Further, the clamp pad 10 is separated from the moving roller 8 and the tape 2 is wound around the winding roller 16.

In the dicing process of the semiconductor wafer 3 and the frame 3 to which the tape 2 is adhered, the tension applied to the tape 2 in the down web direction and the tension applied in the cross web direction are adjusted to the same degree, so that the tape 2 is separated. There is no fear that the intervals between the semiconductor chips will be uneven, and the position of the semiconductor chips can be reliably detected when the semiconductor chips are removed by the pickup machine after dicing,
It was possible to eliminate the interruption of the process due to the inability to detect the position.

[0082]

As described above, in the tape expanding device in the semiconductor manufacturing apparatus of the present invention, in addition to the vertical tensioning device for tensioning the tape pulled out from the tape roll in the downweb direction above the semiconductor wafer, There is provided a lateral tensioning device for tensioning the tape tensioned in the downweb direction by the vertical tensioner in the crossweb direction.

As a result, in the taping process for attaching the tape to the semiconductor and the frame, the tape is applied with tension in the downweb direction by the vertical tensioning device, and the tension in the crossweb direction is applied in the crossweb direction by the lateral tensioning device. Can be given.

As a result, the arrangement of the semiconductor chips separated in the dicing process can be prevented from being disturbed, and the pickup machine can reliably detect the position of the semiconductor chips in the pickup process after dicing. The interruption of the process due to undetectability can be eliminated.

In the present invention, in the case where the driving device of the lateral tensioning device is configured to move both clamping devices in synchronization with each other in opposite directions, the tape crosses the tape without the center line of the tape shifting in the cross-web direction. Since the tension in the web direction is applied, it is possible to more reliably prevent the disorder of the arrangement of the semiconductor chips after dicing.

Further, in the present invention, when the drive device of the lateral tensioning device is provided with the tension setting means capable of variably setting the opening / closing amount of both clamp devices, the opening / closing amount of the amount clamping device is changed according to the type of tape. By doing so, optimum tension can be given to the tape, and a plurality of types of tape having different adhesive strengths and tensile strengths can be used.

Further, in the present invention, the drive device for the lateral tensioning device drives the screw shaft, which extends in the crossweb direction, has the left screw formed at one end and the right screw formed at the other end. When a left screw of the screw shaft is inserted into one of the clamp devices so that the screw can be advanced and retracted and a right screw is inserted into the other clamp device so that the screw can be advanced and retracted,
The amount of movement of both clamp devices can be easily and numerically controlled, and the tension can be adjusted in a wide range of, for example, 50 to 200 kg with a simple structure. Also, it becomes possible to use an inexpensive tape having high tensile strength.

Further, in the present invention, the clamping device holds the both edges in the cross-web direction of the tape, which are tensioned in the down-web direction by the longitudinal tensioning device on the upper side of the semiconductor wafer, from both sides in the thickness direction over a predetermined length. When a pair of clamp beams are provided, and the clamp surfaces of both clamp beams facing each other are formed into uneven surfaces,
It is possible to reliably hold both end edges of the tape in the cross-web direction in each clamp device, increase the maximum tension that can be applied to the tape, and use an inexpensive tape having high adhesive strength and tensile strength.

Further, in the present invention, the vertical tensioning device includes a stationary roller and a movable roller, which are arranged in parallel on the upper side of the semiconductor wafer and the frame in the downweb direction at a predetermined interval longer than the length of the frame, and the stationary roller. A stationary clamp means that is brought into contact with and separated from the moving roller, a moving clamp means that is brought into contact with and separated from the moving roller, and a drive device that moves the moving roller and the moving clamp means forward and backward in the downweb direction. A tension setting means for variably setting can be provided.

In this case, since the tension in the downweb direction can be adjusted in accordance with the tape type and the tension in the crossweb direction given by the lateral tensioning device, the tension in the downweb direction and the crossweb direction can be adjusted. It is possible to more surely eliminate the difference in tension, and it is possible to more surely prevent the intervals between the semiconductor chips cut during dicing from becoming uneven.

Further, in this case, the driving device of the vertical tension device drives the screw shaft into a screw hole formed in the moving frame for supporting the moving roller and the moving clamp means so that the screw shaft can advance and retreat. If the motor is equipped with a motor that is small, a powerful output can be obtained with a small and simple structure, and tension adjustment in the downweb direction can be performed easily and with high precision. Since it is possible to more reliably eliminate the tension difference in the cross-web direction, it is possible to more reliably prevent the intervals between the semiconductor chips cut during dicing from becoming uneven.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of the present invention.

FIG. 2 is a cross-sectional view of the clamp beam of the present invention.

FIG. 3 is a cross-sectional view of the clamp beam of the present invention.

FIG. 4 is a cross-sectional view of the clamp beam of the present invention.

FIG. 5 is a perspective view showing a configuration of a conventional example.

[Explanation of symbols]

 1 Tape Roll 2 Tape 3 Semiconductor Wafer 5 Vertical Tensioning Device 7 Stationary Roller 8 Moving Roller 9 Counter Roller 10 Clamp Pad 12 Air Cylinder 13 Moving Frame 14 Screw Shaft 15 Stepping Motor 17 Clamping Device 19/20 Clamp Beam 24 Screw Shaft 25 Stepping Motor

Claims (8)

[Claims] 1. A tape stretching device in a semiconductor manufacturing apparatus, comprising a vertical tension device for tensioning a tape pulled out from a tape roll in the downweb direction above a semiconductor wafer, wherein the vertical tension device tensions the tape in the downweb direction. Provided is a lateral tensioning device having a clamp device that holds one side edge of the tape in the crossweb direction, a clamp device that holds the other side edge of the tape, and a drive device that opens and closes the distance between the two clamp devices in the crossweb direction. A tape expansion device in a semiconductor manufacturing apparatus, which is characterized by being provided. 2. The tape spreading device in a semiconductor manufacturing apparatus according to claim 1, wherein the driving device moves the two clamping devices in opposite directions in synchronization with each other. 3. The tape spreading device in a semiconductor manufacturing apparatus according to claim 1, wherein the drive device comprises a tension setting means capable of variably setting the opening / closing amount of both clamp devices. 4. The drive device extends in a cross-web direction,
A screw shaft having a left screw formed from one end side and a right screw formed from the other end, and a motor for driving the screw shaft are provided, and the left screw of the screw shaft is inserted into one of the clamp devices so that the screw device can advance and retreat. The tape spreading device in the semiconductor manufacturing apparatus according to claim 1, wherein the right screw is inserted into the other clamp device so as to be able to advance and retract. 5. A pair of clamps, wherein the clamp device holds both end edges in the cross-web direction of the tape tensioned in the down-web direction by a vertical tension device on the upper side of the semiconductor wafer from both sides in the thickness direction over a predetermined length. 5. The tape spreading device in a semiconductor manufacturing apparatus according to claim 1, further comprising a beam, and the clamping surfaces of the two clamping beams facing each other are formed as uneven surfaces. 6. A vertical tensioning device is provided on the upper side of the semiconductor wafer and the frame, and is placed in contact with and separated from a stationary roller and a moving roller, which are arranged in parallel in the downweb direction at a predetermined interval longer than the length of the frame. Tension for variably setting the movement amount of the moving roller and the moving clamp means, the stationary clamp means, the moving clamp means that is brought into contact with and separated from the moving roller, and the drive device that moves the moving roller and the moving clamp means forward and backward. The tape spreading device in a semiconductor manufacturing apparatus according to claim 1, further comprising setting means. 7. The drive means comprises a screw shaft inserted into a screw hole formed in a moving frame supporting the moving roller and the moving clamp means so as to be able to advance and retract, and a motor for rotationally driving the screw shaft. 6. The tape spreading device in the semiconductor manufacturing apparatus according to any one of 6. 8. A semiconductor manufacturing apparatus comprising the tape expanding device in the semiconductor manufacturing apparatus according to claim 1.