JP2010034096A - Sheet peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device for smoothly peeling an adhesive sheet pasted on the surface of a workpiece to be adhered by using a peeling tape having the same width irrespective of the size of the workpiece. <P>SOLUTION: The sheet peeling device M includes: a holding means 1 for holding an adherend W to be adhered; a feeding means 2 for feeding a peeling tape PT; a pasting means 3 for pasting the peeling tape PT fed by the feeding means 2 to an adhesive sheet S; a gripping means 4 for gripping the peeling tape PT; and a moving means 5 for relatively moving the holding means 1 and the gripping means 4. The feeding means 2 is configured so as to feed the peeling tape PT along a direction perpendicular to the direction in which the adherend W to be adhered and the peeling tape PT relatively move. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus that affixes a peeling tape to an adhesive sheet affixed to the surface of an adherend such as a semiconductor wafer, and peels the adhesive sheet by relatively moving the adherend and the peeling tape. The present invention relates to a peeling method.

  For example, in the semiconductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter referred to as “wafer”) in order to reduce the size of a semiconductor chip (back grinding process). An adhesive sheet is attached to the formed surface) to protect the surface. After grinding, the adhesive sheet is peeled from the wafer.

  Conventionally, as a sheet peeling device for peeling an adhesive sheet, a table on which a wafer with an adhesive sheet for surface protection is placed, a tape supply unit that supplies a strip-shaped peeling tape to the wafer, and a tape supply unit Provided with an edge member (sticking member) for applying the peeling tape to the adhesive sheet on the wafer surface while being pressed and in contact with the tape, and a tape collecting section for winding the peeling tape together with the adhesive sheet. Patent Document 1 discloses a sheet peeling apparatus that peels an adhesive sheet from a wafer while being attached to the adhesive sheet.

However, in the apparatus described in Patent Document 1, for example, when the wafer size increases and the area of the adhesive sheet to be peeled becomes large, the ratio of the width of the peeling tape to the adhesive sheet becomes small. This causes inconvenience that a large tension acts on the sheet and that the sheet is cut or the adhesive sheet is cut along the widthwise edge of the peeling tape and cannot be peeled off. Such an inconvenience may be achieved by adopting a wider stripping tape as the wafer size increases, but causes another inconvenience that the running cost increases.
JP 2007-43047 A

  In view of the above, the present invention provides a sheet peeling apparatus and a peeling method capable of smoothly peeling an adhesive sheet attached to the surface of an adherend using a peeling tape having the same width regardless of the size of the adherend. The issue is to provide

  In order to solve the above-mentioned problems, the present invention applies a strip-like release tape to an adhesive sheet attached to an adherend, and peels the adhesive sheet by relatively moving the adherend and the release tape. In the sheet peeling apparatus, the holding means for holding the adherend, the feeding means for feeding the peeling tape, the sticking means for sticking the peeling tape fed from the feeding means to the adhesive sheet, and the peeling tool A gripping means for gripping the tape; and a moving means for relatively moving the holding means and the gripping means, wherein the feeding means is in a direction orthogonal to a direction in which the adherend and the peeling tape are relatively moved. The peeling tape is fed out along with the sticking means, and the sticking means sticks the peeling tape to the adhesive sheet so that one side in the width direction of the peeling tape extends from the outer edge of the adhesive sheet. The features.

  In the present invention, the sticking means includes a sticking head for sticking the peeling tape to the adhesive sheet by pressing the peeling tape, and the sticking head is provided when the adhesive sheet and the peeling tape are bonded. You may employ | adopt the structure which has a press surface of the same shape as an adhesion surface.

  Further, the gripping means may adopt a configuration for gripping the extended peeling tape.

  Furthermore, you may employ | adopt the structure further provided with the holding part formation means which forms a holding part in the width direction one side of the said peeling tape.

  In order to solve the above problems, the present invention applies a strip-like peeling tape to an adhesive sheet affixed to an adherend, and moves the adherend and the peeling tape relative to each other to move the adhesive sheet. In the sheet peeling method for peeling, a step of holding the adherend to which the adhesive sheet is affixed, and a step of feeding the peeling tape along a direction orthogonal to the direction in which the adherend and the peeling tape move relative to each other And a step of attaching the peeling tape fed from the feeding means to the adhesive sheet, a step of gripping the peeling tape, and a step of relatively moving the adherend and the peeling tape. Features.

  According to the present invention, the peeling tape is fed out along a direction orthogonal to the direction in which the adherend and the peeling tape move relative to each other, and the sticking means places one side in the width direction of the peeling tape on the outer edge of the adhesive sheet. For example, even if the wafer size is increased and the area of the adhesive sheet to be peeled is increased, a substantially wide peeling tape is employed as shown in FIG. An effect equivalent to that can be obtained. In other words, when a single type of peeling tape PT (W1 width peeling tape PT) is used to affix to adhesive sheets Sa, Sb and Sc of different sizes, the affixing width becomes wide such that Wa <Wb <Wc. Regardless of the size of the adherend, that is, the size of the adhesive sheet, the adhesive sheet can be smoothly peeled off using the peeling tape having the same width.

  In addition, the sticking head has a pressing surface having the same shape as the bonding surface when the adhesive sheet and the peeling tape are bonded, thereby preventing the peeling tape from adhering to parts other than the adhesive sheet. The adhesive sheet can be peeled off.

  Furthermore, if the structure provided with the grip part forming means for forming the grip part is employed, it is possible to prevent the adhesive from adhering to the grip means for gripping the peeling tape, for example.

  Hereinafter, a sheet peeling apparatus M according to the present embodiment for peeling off the adhesive sheet S from the wafer W will be described with reference to the drawings with the wafer W having the adhesive sheet S attached to the surface as an adherend. As shown in FIGS. 1 and 2, the sheet peeling apparatus M includes a holding unit 1 that holds the wafer W, a feeding unit 2 that feeds the peeling tape PT, and the fed peeling tape PT attached to the adhesive sheet S. An attaching means 3 for holding, a holding means 4 for holding one side in the width direction of the peeling tape PT, a moving means 5 for moving the holding means 1 and the holding means 4 relative to each other, and one side in the width direction of the peeling tape PT. A gripping portion forming means 6 that folds to form the gripping portion G and a cutting means 7 that cuts the peeling tape PT are provided.

  In the present embodiment, when the adhesive sheet S is peeled off, the holding means 1 and the gripping means 4 are relatively moved in the vertical direction (X-axis direction) in FIG. 1, and the upper side in FIG. The lower side is the downstream side. A direction orthogonal to the X-axis direction is a Y-axis direction, and a vertical direction thereof is a Z-axis direction.

  The holding means 1 includes a slider 12 slidably engaged with two rails 11 provided on the frame F1, and a plan view that is supported by the slider 12 and can hold the wafer W by a suction means (not shown). And a rectangular table 13.

  The feeding means 2 is arranged to be able to feed the peeling tape PT in the Y-axis direction, and is provided on the frame F2 and winds the peeling tape PT coated with an adhesive on one surface of the base sheet. A holding reel 21 to be held, a pair of upper and lower pinch rollers 22, guide rollers 23 and 24, and a tape support member 25 which is provided at the bottom of the frame F2 and supports the peeling tape PT, are provided so as to be separated from each other. The chuck member 27 includes a pair of upper and lower chucks 26 and is movable in the Y-axis direction by a driving means (not shown). The tape support member 25 includes a ball bush 25A, a shaft 25B, a spring 25C, and a receiving plate 25D that is urged to the left in FIG. 1 by the spring 25C, and a groove 25E is formed in the receiving plate 25D. The peeling tape PT cut by interacting with the means 7 is provided so as to be supported from below. As the adhesive for the peeling tape PT, a known adhesive such as a pressure-sensitive adhesive or a heat-sensitive adhesive is used.

  The affixing means 3 is disposed on the leading end side of the receiving plate 25D and above the moving table 12. The sticking means 3 includes a sticking head 31 and a cylinder 32 that reciprocates the sticking head 31 in the Z-axis direction. The sticking head 31 has a partial outer edge of the adhesive sheet S stuck on the wafer W and a pressing surface 31A having the same shape as the region R having a shape in which the outer edge ends are connected by a straight line. In addition, when using what used the heat-sensitive adhesive for the peeling tape PT, a heating means is assembled | attached to the sticking head 31. FIG.

  The gripping means 4 is disposed on the downstream side of the sticking means 3 and above the moving table 12, and includes a pair of upper and lower chucks 41 provided so as to be separated from each other. And a chuck member 42 movable in the Z-axis direction.

  The moving means 5 comprises a single-axis robot 51 provided below the table 13 and its slider 52, and allows the table 13 to move along the rail 11. Thereby, the relative movement of the holding means 1 and the gripping means 4 is enabled. This relative movement may be at least one of the holding means 1 and the gripping means 4.

  As shown in FIG. 3, the grip portion forming means 6 is composed of a pair of ring members 61 fitted into the guide roller 23. The interval between the pair of ring members 61 is arranged so as to be narrower than the width of the peeling tape PT. When the peeling tape PT is wound around the guide roller 23, one side in the width direction of the peeling tape PT is one side. It is hung so that it can ride on the ring member 61. Thus, when the peeling tape PT passes through the guide roller 23, one side is folded back 180 degrees to form a grip portion G.

  The cutting means 7 includes a cutter blade 71 that can move forward and backward in the groove 25E, and a known orthogonal biaxial robot 72 that can move the cutter blade 71 in the X-axis direction and the Z-axis direction.

  Next, the peeling operation of the adhesive sheet S by the sheet peeling apparatus M will be described.

First, it is assumed that the peeling tape PT fed out from the holding reel 21 is passed through as shown in FIG. 2 and the leading end side thereof is cut by the cutting means 7 and held on the receiving plate 25D. At this time, the peeling tape PT is in a state in which the grip portion G is continuously formed with a certain width on the downstream side in the width direction. In this state, when the wafer W to which the adhesive sheet S is attached is conveyed onto the table 13 by suction means (not shown) and held by suction, the table 13 is moved toward the downstream side by the single-axis robot 51. When the region R has reached a position coinciding with the application surface 31A of the application head 31 in plan view, the table 13 is stopped by detection by a detection means (not shown).

  Next, as shown in FIG. 4, the chuck member 27 is moved toward the receiving plate 25D, and the receiving plate 25D is retracted against the urging force of the spring 25B so that the chuck 26 grips the tip of the peeling tape PT. By returning to the original position, the peeling tape PT is fed out by a predetermined amount in the Y-axis direction.

  Then, as shown in FIG. 5, the cylinder 32 is operated to lower the sticking head 31 and press the peeling tape PT against the adhesive sheet S. Thereby, the peeling tape PT and the adhesive sheet S are attached to each other. At this time, the grip part G formed on one side in the width direction of the peeling tape PT is in a state of extending downstream from the outer peripheral edge of the wafer W (see FIG. 1).

  Next, as shown in FIG. 6A, the chuck member 42 is moved via a driving means (not shown), the chuck 41 holds the grip portion G, and the chuck member 42 moves as shown in FIG. 6B. A predetermined amount is raised so as not to hit the wafer W. Then, after the orthogonal biaxial robot 72 is operated to cause the cutter blade 71 to enter the groove 25E, it is moved from one side in the width direction of the tape toward the other side to cut the peeling tape PT and the chuck member 27. The release of the peeling tape 26 is released.

  Thereafter, the sticking head 31 is raised and returned to the standby position, and the adhesive sheet S is peeled from the wafer W when the table 13 is moved downstream as shown in FIG. When the peeling of the adhesive sheet S is completed, the peeled adhesive sheet S is collected by the collecting means (not shown) by the gripping means 4.

  As described above, in the present embodiment, the peeling tape PT is fed out from the direction (Y-axis direction) perpendicular to the moving direction (X-axis direction) of the holding means 1, and the sticking means 3 is aligned in the width direction of the peeling tape PT. As shown in FIG. 7, even if the wafer size is increased and the size of the adhesive sheet S to be peeled is increased, the side is substantially widened. An effect equivalent to that of using the peeling tape PT can be obtained. As a result, regardless of the size of the wafer W, that is, the size of the adhesive sheet S to be peeled, the adhesive sheet S can be smoothly peeled using the peeling tape PT having the same width.

  In addition, since the grip portion forming means 6 for forming the grip portion G is provided on one side in the width direction of the peeling tape PT, when the grip means 4 grips the grip portion G, the adhesive sheet S is collected. It is possible to prevent the peeling tape PT from being separated from the gripping means 4. Further, it is possible to prevent the adhesive from adhering to the gripping means 4.

  In the present embodiment, depending on the type of adhesive of the adhesive sheet S, there is a thing in which the adhesive strength is reduced when hot or cold air is blown, so before the adhesive sheet S is peeled off depending on the type. A configuration in which warm air or cold air is blown onto the adhesive sheet S may be employed, and when a sheet that is cured by energy rays such as ultraviolet rays or electron beams is used, energy is applied to the adhesive sheet S before the adhesive sheet S is peeled off. It is good also as a structure which irradiates a line | wire.

  Further, the shape of the sticking head 31 does not prevent the adoption of an appropriate shape corresponding to the outer edge shape of the adhesive sheet S.

  Further, the grip portion forming means 6 may be configured to form a grip portion G by attaching another sheet to one side in the width direction of the peeling sheet PT.

  In addition, the adherend is not limited to the wafer W, and can be a glass plate, a steel plate, or another adherend such as a resin plate. The semiconductor wafer is a silicon wafer or a compound wafer. There may be.

  Further, the affixing means 3 and the cutting means 7 may be composed of those other than those shown in the above-described embodiment, and the affixing means 3 is not limited as long as the peeling sheet PT can be affixed to the adherend. Is not limited as long as the sheet PT can be cut.

The top view which shows the structure of a sheet peeling apparatus. The front view which shows the structure of a sheet peeling apparatus. The perspective view explaining a holding part formation means. The front view explaining delivery of the sheet | seat for peeling. The front view which shows the state which stuck the sheet | seat for peeling on the adhesive sheet. (A) thru | or (c) is operation | movement explanatory drawing explaining the peeling operation | movement of an adhesive sheet. Explanatory drawing which shows a mode that the sticking width | variety of a peeling sheet changes by the size change of an adhesive sheet.

Explanation of symbols

M sheet peeling apparatus 1 holding means 2 feeding means 3 sticking means 31 sticking head 4 gripping means 5 moving means 6 gripping part forming means 7 cutting means PT peeling tape G gripping part S adhesive sheet W semiconductor wafer (adhered body)

Claims (5)

In a sheet peeling apparatus that affixes a strip-like peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet by relatively moving the adherend and the peeling tape.
Holding means for holding the adherend, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape fed from the feeding means to the adhesive sheet, and gripping for holding the peeling tape Means, and moving means for relatively moving the holding means and the gripping means,
The feeding means feeds the peeling tape along a direction orthogonal to the direction in which the adherend and the peeling tape move relative to each other, and the sticking means has one side in the width direction of the peeling tape bonded to the adhesive tape. A sheet peeling apparatus, wherein the peeling tape is attached to an adhesive sheet so as to extend from an outer edge of the sheet.   The sticking means includes a sticking head for sticking the peeling tape to an adhesive sheet by pressing the peeling tape, and the sticking head has the same shape as the adhesive surface when the adhesive sheet and the peeling tape are bonded. The sheet peeling apparatus according to claim 1, further comprising: a pressing surface.   3. The sheet peeling apparatus according to claim 1, wherein the gripping means grips the extended peeling tape.   The sheet peeling apparatus according to any one of claims 1 to 3, further comprising gripping portion forming means for forming a gripping portion on one side in the width direction of the peeling tape. In a sheet peeling method in which a strip-shaped peeling tape is affixed to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled by relatively moving the adherend and the peeling tape,
Holding the adherend to which the adhesive sheet is affixed;
Extending the peeling tape along a direction orthogonal to the direction in which the adherend and the peeling tape move relative to each other; and
A step of attaching the peeling tape fed from the feeding means to the adhesive sheet;
Gripping the peeling tape;
And a step of moving the adherend and the peeling tape relative to each other.

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