JP2018198290A - Peeling device - Google Patents

Abstract

To suppress a protective member after peeling from getting bulky in the case of recovering it into a garbage can, and to reduce its recovery frequency.SOLUTION: A peeling device (1) for peeling a sheet-like protective member (P) for protecting a wafer (W) from a wafer comprises lamination means (6) for laminating the protective member after peeling in a garbage can (5). The lamination means comprises: first guide means (7) for inclining and dropping the protective member after peeling; and a pair of guide rails (80) for guiding the inclined and dropped protective member to the garbage can. The pair of guide rails are oppositely arranged with an interval smaller than the outer diameter of the protective member above the garbage can. Also, the pair of guide rails are arranged in a substantially V shape in a plane view such that the interval on one end side near the first guide means is made smaller than the interval on the other end side.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a peeling apparatus for peeling a film attached to the surface of a wafer.

  Waviness is formed on the surface of a wafer that is cut out from an ingot such as silicon. In order to remove waviness, a tape is attached to the surface of the wafer via a liquid resin as a protective member. The surface shape of the wafer is transferred to the liquid resin, and the undulation is removed by grinding the opposite surface of the wafer after the liquid resin is cured. After grinding, the cured resin and tape are peeled from the wafer.

  By the way, when the liquid resin is supplied to the surface of the wafer and the tape is attached, the liquid resin is pushed out and spreads out from the outer periphery (edge) of the wafer. As an apparatus for peeling off the resin and tape (protective member) protruding from the outer periphery of the wafer, for example, a peeling apparatus described in Patent Document 1 has been proposed.

Japanese Patent Laid-Open No. 2006-54233

  The protective member after peeling is collected in a predetermined collection box (trash box), for example. At this time, since the sheet-like protective member is easily bent, it is bulky. As a result, it is assumed that the collection box becomes full immediately, and the frequency with which the operator collects the protection member from the collection box increases.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a peeling apparatus that can suppress bulkiness when collecting a protective member after peeling into a trash can and reduce its collection frequency. One.

  A peeling apparatus according to one embodiment of the present invention includes a film having a protruding portion that protrudes from the outer periphery of a wafer in a larger area than the wafer, and a resin layer formed between the film and the other surface of the wafer. A peeling device that peels a sheet-like protective member that protects the entire other surface from the wafer and discards it in a trash can in the device, and holds and holds one surface of the wafer on which the protective member is formed on the other surface The gripping means for gripping the protruding portion of the protective member that is adhered to the wafer held by the holding means, and the gripping means, and the peeling means for moving the gripping means and the holding means in a relatively separating direction to peel the protective member from the wafer And a laminating means for laminating a protective member peeled off from the wafer by the peeling means and held by the gripping means on the trash box, the laminating means being a gripping hand peeled off from the wafer. 2 is disposed in a horizontal direction on a trash box for horizontally dropping the protective member inclined and dropped along the inclined dropping means, and for dropping the protective member into the trash box. Two horizontal bars, and the distance between the two horizontal bars is such that the other end is larger than one end close to the inclined dropping means and is formed in a letter C shape, and the two protective members that are inclined and dropped are two. When transferred to the horizontal bar, the protective member is dropped from the wider side and the protective member is stacked in the trash box.

  According to this configuration, the peeled protection member is dropped along the inclined dropping means and transferred to the two horizontal bars. Since the distance between the two horizontal bars increases toward the downstream side in the transfer direction, the peeled protective member falls into the trash box without being rounded. As a result, a plurality of protective members are stacked in the trash can, and the plurality of protective members can be prevented from being bulky in the trash can. For this reason, many protective members can be discarded in the trash box, and the collection frequency can be reduced.

  According to the present invention, it is possible to suppress bulkiness when collecting the protective member after peeling into the trash can, and to reduce the collection frequency.

It is a whole perspective view of the peeling apparatus which concerns on this Embodiment. It is a figure which shows an example of the holding process and the holding | grip process of the peeling apparatus which concerns on this Embodiment. It is a figure which shows an example of the peeling process of the peeling apparatus which concerns on this Embodiment. It is a figure which shows an example of the inclination fall preparation process of the peeling apparatus which concerns on this Embodiment. It is a figure which shows an example of the inclination fall process and lamination process of the peeling apparatus which concerns on this Embodiment.

  Hereinafter, the peeling apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is an overall perspective view of the peeling apparatus according to the present embodiment. Note that the peeling apparatus according to the present embodiment is not limited to the apparatus configuration dedicated to peeling as shown in FIG. 1, and for example, a full operation in which a series of operations such as grinding, polishing, and cleaning are performed fully automatically. It may be incorporated in an auto type processing apparatus. In FIG. 1, the front side of the X-axis direction is the front side of the peeling device, the back side of the X-axis direction is the back side of the peeling device, the front side of the Y-axis direction is the left side of the peeling device, and the back side of the Y-axis direction is the peeling device. On the right side. The wafer shown in FIG. 1 is exaggerated in size for convenience of explanation.

  As shown in FIG. 1, the peeling apparatus 1 is configured to peel a protective member P attached to a circular wafer W. The wafer W is, for example, an as-sliced wafer before a device pattern is formed, and is formed by slicing a cylindrical ingot with a wire saw.

  The wafer W is not limited to a work such as silicon, gallium burs and silicon carbide. For example, wafers can be made of ceramic, glass, sapphire inorganic substrates, ductile materials such as plate metals and resins, and various processing materials that require flatness (TTV: Total Thickness Variation) from the micron order to the submicron order. Good. The flatness referred to here indicates, for example, the difference between the maximum value and the minimum value among the heights measured in the thickness direction using the surface to be ground of the wafer W as a reference surface.

  The protective member P is configured by applying, for example, a photocurable resin layer R to the entire surface of the film F having an outer diameter equal to or larger than the outer diameter of the wafer W. That is, the protective member P has a resin layer R formed between the film F having a protruding portion E that protrudes from the outer periphery of the wafer W in a larger area than the wafer W, and the lower surface (the other surface) of the wafer W. (See FIG. 2).

  The resin layer R is cured by, for example, irradiation with ultraviolet light, and the film F is fixed to the lower surface of the wafer W via the resin layer R. Thereby, the lower surface of the wafer W is entirely covered and protected by the sheet-like protection member P. Further, on the outer peripheral side of the wafer W, a part of the resin layer R protrudes from the upper surface of the protruding portion E. In addition, the material of the resin layer R is not specifically limited, It can change suitably.

  Further, waviness is formed on the surface of the wafer W after slicing. This undulation is removed in advance by grinding the upper surface of the wafer W with the protective member P attached.

  As described above, the peeling device 1 is configured to peel the protective member P made of the resin layer R and the film F from the wafer W, and to discard the peeled protective member P in the trash box 5 in the device. Specifically, the peeling device 1 includes a holding means 2 that holds and conveys the wafer W on the side surface of the standing wall portion 11 that rises in the Z-axis direction from the upper surface of the base 10 that is rectangular when viewed from above, and a protruding portion of the protective member P. A gripping means 3 for gripping E and a peeling means 4 for peeling the protective member P from the wafer W are provided. The holding means 2 is arranged on the upper side of the standing wall portion 11, and the gripping means 3 and the peeling means 4 are arranged below the holding means 2.

  The holding means 2 is configured to hold the upper surface (one surface) of the wafer W with the protective member P facing downward. Specifically, the holding means 2 sucks and holds the upper surface of the wafer W with the transport pad 20 having substantially the same diameter as the wafer W. The conveyance pad 20 is a porous chuck that sucks and holds the wafer W, and a holding surface 21 (see FIG. 2) made of a porous material such as ceramics is formed on the lower surface of the disk-shaped frame. The wafer W can be sucked and held by the negative pressure generated on the holding surface 21.

  The transport pad 20 is supported by being suspended from the tip (left end) of the arm 22 extending in the Y-axis direction. The holding unit 2 is configured to be movable up and down in the Z-axis direction by the lifting unit 23 and is configured to be movable in the X-axis direction by the horizontal moving unit 24. The elevating means 23 moves the Z-axis table 25 that supports the base end of the arm 22 in the Z-axis direction by a motor-driven guide actuator. The horizontal moving means 24 moves the X-axis table 26 that supports the Z-axis table 25 in the X-axis direction by a motor-driven guide actuator. The elevating means 23 and the horizontal moving means 24 are not limited to motor-driven guide actuators, and may be constituted by, for example, air-driven guide cylinders.

  The gripping means 3 is configured to sandwich a part of the protruding portion E in the thickness direction of the film F by the pair of claw portions 30. A pair of nail | claw part 30 is opposingly arranged, and it is comprised so that separation | separation approach is mutually possible. The gripping means 3 is provided at the tip of an arm 40 that constitutes a part of the peeling means 4.

  The peeling means 4 has an arm 40 extending in the Y-axis direction and an X-axis table 41 that supports the base end of the arm 40. The arm 40 is configured to support the gripping means 3 so as to be rotatable about the extending direction and to be movable up and down on the X-axis table 41. The X-axis table 41 is configured to be movable in the X-axis direction by, for example, a motor-driven guide actuator. The configuration for driving the arm 40 and the X-axis table 41 is not limited to the motor-driven guide actuator, and may be configured by, for example, an air-driven guide cylinder.

  Although the details will be described later, the peeling means 4 peels the protective member P from the wafer W by moving the gripping means 3 and the holding means 2 in a relatively separating direction. That is, the peeling unit 4 constitutes a moving unit that moves the gripping unit 3 and the holding unit 2 relative to each other.

  Between the holding means 2 and the peeling means 4, a guide roller 42 that guides the peeling of the protective member P is provided. The guide roller 42 extends in the Y-axis direction and has a cylindrical shape that is longer than the diameter of the wafer W. Although details will be described later, the cylindrical surface of the guide roller 42 comes into contact with the lower surface of the film F when the protective member P is peeled off.

  Below the peeling means 4 is provided a trash can 5 for collecting the protective member P after peeling. The trash can 5 has a top view shape with the upper side being opened larger than the wafer W. In addition, the trash can 5 is provided with a pair of optical sensors 50 at the upper end of one side facing each other in the X direction. One of the pair of optical sensors 50 includes a light emitting unit and the other includes a light receiving unit. The optical sensor 50 receives light generated from the light emitting unit, and detects whether the protective member P collected in the trash can 5 is full based on a change in the amount of light received by the light receiving unit.

  The peeling device 1 configured as described above sucks and holds the upper surface of the wafer W after the waviness is removed by the holding means 2, and holds the protruding portion E on the outer periphery of the wafer W by the holding means 3. Then, the protective member P is peeled from the wafer W by moving the holding means 2 and the protruding portion E in a direction to separate them from each other. The protective member P after peeling is discarded in the trash box 5. When the trash box 5 is filled with the protection member P, the operator is notified according to the output of the optical sensor 50.

  By the way, conventionally, when the protective member after peeling is dropped freely in the trash box and discarded, the protective member is flexible, and the protective member is bent and bulky in the trash box. Depending on the material of the protective member, the protective member may be rounded in a predetermined direction, which may be a bulky factor. As a result of the bulk of the protective member in the trash can, the trash can fills up quickly. For this reason, the frequency with which an operator collects the protective member from the trash box or the frequency with which the trash box is replaced increases, which may be a factor in reducing work efficiency.

  Therefore, the present inventor controls the shape (posture) of the protective member P so that the protective member P does not bend when dropping the peeled protective member P, and guides it to the trash can 5. The idea was to stack the members P in a certain posture. Specifically, the stacking means 6 for stacking the peeled protective member P in the trash box 5 is provided above the trash box 5.

  The stacking means 6 is composed of first guide means 7 and second guide means 8 for guiding the protection member P to the trash box 5. The first guide means 7 is provided below the gripping means 3 and the peeling means 4 below the trash box 5 and is composed of a pair of guide rails 70 that incline downward toward the front.

  The guide rail 70 is formed in a rod shape having a circular cross section, for example, and has substantially the same length as the outer shape of the protection member P. Further, the tip (lower end) portion of the guide rail 70 is bent in the horizontal direction. The front end portion is arranged at the upper end portion of one side on the rear side in the X direction of the trash can 5. Further, the pair of guide rails 70 are arranged in parallel at a distance D1 sufficiently smaller than the outer diameter of the protective member P so as to face each other across the center line in the Y direction of the trash can 5 (see FIG. 5B). . Although details will be described later, the first guide means 7 constitutes an inclination dropping means for causing the protective member P after being peeled to fall.

  The 2nd guide means 8 is comprised by a pair of guide rail 80 extended horizontally so that the upper direction of the trash can 5 may be straddled forward and backward. The guide rail 80 is formed in a rod shape having a circular cross section, for example, and extends with a length larger than the outer diameter of the protective member P. One end (rear end) of the guide rail 80 is located at the upper end portion of one side of the trash can 5 on the rear side in the X direction, and the other end (front end) is located at the upper end portion of one side of the trash can 5 on the front side in the X direction. .

  Further, as shown in FIG. 5B, the pair of guide rails 80 are arranged so as to face each other across the center line in the Y direction of the trash can 5 with a smaller interval than the outer diameter of the protective member P. Further, the pair of guide rails 80 are formed in a U shape as viewed from above (in the direction of the arrow above) so that the facing distance increases from the rear toward the front. That is, the pair of guide rails 80 are arranged such that the distance D3 on the front end side is larger than the distance D2 on the rear end side (side closer to the first guide means 7). The interval D2 is larger than the interval D1, and the rear ends of the pair of guide rails 80 are arranged so as to sandwich the tips of the pair of guide rails 70 on the left and right. That is, the rear ends of the pair of guide rails 80 and the front ends of the pair of guide rails 70 overlap each other when viewed from the Y direction (see FIG. 5A). Although the details will be described later, the second guide means 8 constitutes an attitude correction means for making the attitude of the protective member P inclined and dropped along the first guide means 7 horizontal and dropping the protective member P into the trash box 5. .

  According to these structures, the protective member P after peeling is guided by the first guide means 7 and the second guide means 8 constituting the stacking means 6, so that the protective member P is horizontally spread in the trash can 5. Can be dropped. Thereby, the plurality of protective members P are stacked without being bulky in the trash can 5. As a result, many protective members P can be discarded in the trash can 5, and the collection frequency can be reduced.

  Next, the operation of the peeling apparatus according to the present embodiment, that is, the method for peeling the protective member will be described with reference to FIGS. FIG. 2 is a diagram illustrating an example of a holding process and a gripping process of the peeling device according to the present embodiment. FIG. 3 is a diagram illustrating an example of a peeling process of the peeling apparatus according to the present embodiment. 3A and 3B show operation transition diagrams of the peeling process. FIG. 4 is a diagram illustrating an example of the inclined drop preparation process of the peeling apparatus according to the present embodiment. FIG. 5 is a diagram illustrating an example of the inclined dropping process and the laminating process of the peeling apparatus according to the present embodiment. 5A shows a schematic side view of the peeling device, and FIG. 5B shows a schematic top view of the peeling device. In FIG. 5, the optical sensor is omitted for convenience of explanation.

  The protective member P peeling method according to the present embodiment includes a holding step (see FIG. 2), a gripping step (see FIG. 2), a peeling step (see FIG. 3), and an inclined drop preparation step (see FIG. 4). And an inclined dropping process (see FIG. 5) and a stacking process (see FIG. 6) in this order.

  As shown in FIG. 2, in the holding step, the upper surface of the wafer W is sucked and held by the transfer pad 20 so that the center of the transfer pad 20 and the center of the wafer W coincide with each other with the protective member P directed downward. Is done. In the gripping process, a part of the outer periphery of the protection member P (the protruding portion E) is gripped by the pair of claw portions 30. At this time, the holding means 2 is positioned so that the guide roller 42 is positioned on one end side of the wafer W (the side gripped by the pair of claw portions 30). Further, the guide roller 42 is in contact with the lower surface of the film F, and the wafer W and the protection member P are sandwiched between the transport pad 20 and the guide roller 42.

  Next, a peeling process is implemented. As shown in FIG. 3A, the holding means 2 and the gripping means 3 are moved in a direction separating from each other, and the protruding portion E is peeled off from the outer peripheral edge of the wafer. Specifically, the gripping means 3 is moved downward while rotating around a position shifted backward from the gripping position of the film F. As a result, the protective member P in the vicinity of the pair of claw portions 30 is peeled off from the outer periphery of the wafer W, and the protective member P is bent at a substantially right angle while abutting (guided) against the guide roller 42.

  Further, as shown in FIG. 3B, while adjusting the rotation angle and height of the gripping means 3, the gripping means 3 is moved forward, that is, from the outer periphery of the wafer W toward the outer periphery on the opposite side with respect to the center. The holding means 2 is also moved rearward. In this way, the entire protection member P can be peeled from the wafer W by relatively moving the holding means 2 and the gripping means 3 along the surface direction of the holding surface 21 in the direction of separating from each other. In addition, in FIG. 3, although it was set as the structure which peels the protection member P by relatively moving the holding means 2 and the holding means 3 to the front-back direction, it is not limited to this structure. For example, the gripping means 3 may be continuously moved downward without being moved forward, and the protective member P may be bent at a right angle to peel the whole.

  Next, the process proceeds to the inclined fall preparation process. As shown in FIG. 4, immediately after the protective member P is peeled off from the wafer W, the other end of the protective member P hangs down by its own weight while one end of the protruding portion E is held by the pair of claws 30. Specifically, the protective member P is bent at a right angle downward from one end of the protruding portion E gripped by the pair of claws 30 and hangs down along the vertical direction. The gripping means 3 is moved rearward in the X direction while maintaining the state of gripping the protruding portion E, and is positioned in the vicinity of the first guide means 7 (see FIG. 5).

  Next, an inclined dropping process and a lamination process are performed. As shown in FIG. 5A, the gripping means 3 that grips the protruding portion E is positioned in the vicinity of the first guide means 7, and the film F side of the protective member P is in contact with the inclined surfaces of the pair of guide rails 70. Thereby, the protection member P is slightly inclined with respect to the vertical direction along the pair of guide rails 70.

  When the pair of claw portions 30 are separated from each other in a state where the protection member P is along the pair of guide rails 70, the gripping of the protruding portion E is released. The protection member P falls obliquely downward along the pair of guide rails 70 due to its own weight. The front ends of the pair of guide rails 70 are bent in the horizontal direction, and the pair of guide rails 80 are located at the ends of the pair of guide rails 70. Therefore, the protection member P is moved by the momentum at the time of the inclined fall. The direction is changed from obliquely downward to the horizontal direction and moved (transferred) from the first guide means 7 to the second guide means 8.

  When the protective member P moves in the horizontal direction along the pair of guide rails 80, the central portion of the protective member P in the Y direction falls due to its own weight, and is bent into a U shape when viewed from the front. At this time, since the distance between the pair of guide rails 70 increases from the upstream side toward the downstream side in the movement direction, the protection member P is moved from the front end side of the pair of guide rails 80 while returning the U shape to the original horizontal shape. Dropped into the trash can 5.

  When the front side of the protective member P first falls below the pair of guide rails 80, the rear side falls later below the pair of guide rails 80. At this time, since the protective member P falls into the trash can 5 with the posture corrected so as to be horizontal as a whole, it is possible to stack a plurality of protective members P in the trash can 5 in a fixed posture. . In this way, the pair of guide rails 80 are arranged so as to be spread out, and the protective member P is dropped from the wider interval, so that the posture of the sheet-like protective member P is horizontally corrected in the trash can 5 can be laminated.

  As described above, according to the present embodiment, the peeled protective member P is dropped along the first guide means 7 (the pair of guide rails 70), and the second guide means 8 (the pair of guide rails 80). It is transferred to. Since the distance between the pair of guide rails 80 increases toward the downstream side in the transfer direction, the protective member P after peeling falls into the trash box without being rounded. As a result, the plurality of protection members P are stacked in the trash can 5, and it is possible to suppress the plurality of protection members P from being bulky in the trash can 5. For this reason, many protective members P can be discarded in the trash can 5, and the collection frequency can be reduced.

  In addition, although this Embodiment demonstrated the structure of the peeling apparatus single-piece | unit, it is not limited to this structure. The present invention may be applied to various processing apparatuses that perform various processes such as grinding, polishing, and cutting.

  In addition, as workpieces to be processed, various workpieces such as semiconductor device wafers, optical device wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, raw ceramic substrates, piezoelectric substrates, etc., may be used depending on the type of processing. May be used. As the semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation may be used. As the optical device wafer, a sapphire wafer or a silicon carbide wafer after device formation may be used. Further, a CSP (Chip Size Package) substrate may be used as the package substrate, silicon or gallium arsenide may be used as the semiconductor substrate, and sapphire, ceramics, glass, or the like may be used as the inorganic material substrate. Further, as the oxide wafer, lithium tantalate or lithium niobate after device formation or before device formation may be used.

  In the above embodiment, the guide rails 70 and 80 are formed in a rod shape having a circular cross section. However, the present invention is not limited to this configuration. The guide rails 70 and 80 may be formed of a plate-like body obtained by bending a metal plate, for example.

  Moreover, although each embodiment of the present invention has been described, as the other embodiment of the present invention, the above embodiment and modifications may be combined in whole or in part.

  The embodiments of the present invention are not limited to the above-described embodiments, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

  As described above, the present invention has the effect of suppressing the bulkiness when collecting the protective member after peeling into the trash box, and reducing the collection frequency. In particular, it is applied to the surface of the wafer. It is useful for a peeling apparatus that peels off the attached film.

W Wafer P Protective member R Resin layer F Film E Protruding part 1 Peeling device 2 Holding means 3 Gripping means 4 Peeling means 6 Laminating means 5 Garbage bin 7 First guide means (tilt dropping means)
8 Second guide means 80 A pair of guide rails (two horizontal bars)
D2, D3 interval

Claims (1)

A sheet-like shape that includes a film having a protruding portion that protrudes from the outer periphery of the wafer in a larger area than the wafer, and a resin layer formed between the film and the other surface of the wafer, and that protects the entire other surface of the wafer A peeling device that peels off the protective member from the wafer and discards it in the trash box in the device,
Holding means for sucking and holding one surface of the wafer having the protective member formed on the other surface;
A gripping means for gripping the protruding portion of the protective member to be adhered to the wafer held by the holding means;
Peeling means for moving the gripping means and the holding means in a relatively separating direction to peel the protective member from the wafer;
Laminating means for laminating the protective member peeled from the wafer by the peeling means and gripped by the gripping means on the trash can,
The laminating means includes
Tilted dropping means for tilting and dropping the protective member gripped by the gripping means peeled from the wafer;
Two horizontal rods disposed horizontally on the trash bin for placing the protective member inclined and dropped along the inclined dropping means in a horizontal posture and dropping the protective member into the trash bin,
The distance between the two horizontal bars is such that the other end is larger than the one end close to the inclined dropping means, and is formed in the shape of an arrow C.
A stripping device, wherein when the protective member that has fallen down is transferred to the two horizontal bars, the protective member is dropped from the wider side and the protective member is stacked in the trash box.

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