JP5381046B2 - Semiconductor wafer scribing apparatus and scribing system including the same - Google Patents

Description

  The present invention relates to a semiconductor wafer scribing apparatus for cleaving a semiconductor wafer into a plurality of sample pieces, and a scribing system including the scribing apparatus.

  Generally as a semiconductor wafer used for a semiconductor device, a silicon wafer made of a silicon single crystal is used. In addition, the Czochralski method (hereinafter referred to as “CZ method”) is usually employed for the production of a silicon single crystal. In the silicon single crystal manufactured by the CZ method, the top portion and the tail portion are cut and removed, and the straight body portion is further cut into a predetermined length. This straight body portion is treated as a product, and a silicon wafer is cut out therefrom. Prior to that, in order to confirm and guarantee the quality of the straight body, a wafer having a thickness of about 1 mm was cut from the straight body as a sample, and the oxygen concentration, specific resistance, OSF (oxidation-induced stacking fault) density, lifetime, etc. Quality inspection is performed.

  At that time, a plurality of sample pieces are collected from the semiconductor wafer for sample according to the inspection contents, and the quality is inspected using these sample pieces. Sample pieces were divided into two equal parts (hereinafter referred to as “1/2 divided pieces”), divided into four equal parts (hereinafter referred to as “¼ divided pieces”), 5 mm long × 14 mm wide, A rectangular shape having a length and width of about 10 mm (hereinafter referred to as “rectangular piece”) is employed. Conventionally, the method of collecting such a sample piece from a semiconductor wafer relies on manual work.

  FIG. 1 is a diagram for explaining a conventional procedure for collecting a sample piece from a semiconductor wafer. As shown in FIG. 1 (a), a diamond blade generally used for cutting a plate glass or the like is first used for a disk-shaped semiconductor wafer 1 cut out from a straight body portion, as shown in FIG. 1 (b). A scribing groove 2 that divides the wafer into two equal parts is formed on the surface of the wafer 1 by manual work using the mounted glass cutter. By manually applying a load to the wafer 1, as shown in FIG. 1C, the wafer 1 is cut along the scribe grooves 2, and a pair of ½ divided pieces 1 a is obtained.

  Next, as shown in FIG. 1 (c), the same glass cutting is performed on one of the ½ divided pieces 1a, and a scribe groove 2 is formed on the surface of the divided piece 1a to divide it into two equal parts. When the half divided piece 1a is also manually loaded, as shown in FIG. 1 (d), it is cut along the scribe groove 2 to obtain a pair of quarter divided pieces 1b.

  Further, as shown in FIG. 1 (e), the same glass cutting is used for one of the other half-divided piece 1a and the quarter-divided piece 1b, and scribe grooves 2 are formed in a lattice pattern on the surfaces thereof. Form. As shown in FIG. 1 (f), the divided pieces 1a and 1b in which these scribe grooves 2 are formed are also cut along the scribe grooves 2 to obtain a plurality of rectangular pieces 1c. It is done.

  At this time, the quarter segment 1b and the rectangular piece 1c obtained as sample pieces need to be able to be identified by the subsequent quality inspection from which straight body portion the sample is cut out and from which position on the wafer. is there. Therefore, after the scribe groove 2 is formed on the surface of each sample piece, before the separation into each sample piece, a rotationally driven scribing needle whose tip is covered with diamond is used to manually perform numbers, letters, etc. Engraved individual identification symbols consisting of

  Thus, the sample pieces each having the identification symbol applied thereto are cleaved and collected from the semiconductor wafer by all manual operations.

  However, in manually collecting sample pieces, the skill of the operator is greatly affected, and the scribe groove may be formed excessively deeply. In this case, the wafer is often divided without being loaded and separated into sample pieces before the identification symbol is given. If this occurs at the time of forming a scribe groove for obtaining a plurality of rectangular pieces, the separated rectangular pieces are not provided with identification symbols and cannot be handled as sample pieces for quality inspection. Even if the identification symbol is engraved on the separated sample piece, there is a possibility of giving an incorrect identification symbol.

  In addition, the scribing groove is not formed on the target line, and sample piece collection often fails.

  In addition, the number of samples that can be processed manually is limited, and in order to collect a sample piece from a single wafer, the formation of scribe grooves, engraving of identification symbols, and cleaving into sample pieces are repeated several times. Because it is necessary, it takes a longer time. In particular, in recent years, the production amount of the straight body part which is a material of the silicon wafer is increased, and the number of wafers to be cut is increased accordingly, so that the number of sample pieces to be collected is remarkably increased. In such a recent situation, it is extremely difficult to handle all sample pieces manually.

  As described above, since there are many problems in manually collecting sample pieces, it is strongly desired to automate the collection of sample pieces.

  For example, Patent Document 1 discloses a glass substrate cutting device used in manufacturing a liquid crystal display panel. The glass substrate cutting device disclosed in this document is a device that cuts a glass substrate to obtain a plurality of liquid crystal display panels from a large glass substrate, vibrates a scriber made of a diamond chip in the vertical direction, and moves downward. A structure for applying pressure is provided. In this document, a scribe groove is formed on the upper surface of the glass substrate by relatively feeding the glass substrate to the lower side of the scriber, and at the same time, the glass substrate is moved along the scribe groove by an impact caused by vibration of the scriber. It can be cut.

  The glass substrate cutting device forms a scribe groove as in the case of collecting a sample piece from the semiconductor wafer described above. Therefore, in order to automate the collection of sample pieces, application of a glass substrate cutting device can be considered.

  However, when a glass substrate cutting device is applied to sample pieces from a semiconductor wafer, each sample piece separated by cutting is not given an identification symbol. For this reason, the sample piece cut by the glass substrate cutting apparatus cannot be specified from which straight body part is cut out and taken from which position on the wafer, and should be handled as a sample piece for quality inspection. I can't. Therefore, it is difficult to obtain a sample piece suitable for quality inspection with a glass substrate cutting apparatus.

JP 2000-239034 A

  The present invention has been made in view of the above problems, and forms a scribe groove corresponding to the contour of each sample piece on the surface of a semiconductor wafer, and before separating the sample piece into each sample piece region. A semiconductor wafer scribing apparatus capable of obtaining a sample piece suitable for quality inspection from a wafer by engraving an identification symbol for each wafer, and capable of automating the sample piece, and the same The object is to provide a scribe system.

  In order to achieve the above object, the gist of the present invention is a semiconductor wafer scribing apparatus (1) and a semiconductor wafer scribing system (2) described below.

(1) A scribing device for cleaving a semiconductor wafer into a plurality of sample pieces, a table on which the wafer is placed and held, and a surface of the wafer held on the table. A first cutter that forms a scribe groove corresponding to the contour; a first cutter moving means that moves the first cutter relative to the table that holds the wafer in a horizontal plane; and the holder is held on the table. A second cutter that engraves an identification symbol for each of the sample pieces on the surface of the wafer, and a second cutter that moves the second cutter relative to the table holding the wafer in a horizontal plane. A semiconductor wafer scribing apparatus, comprising: a two-blade moving means. Here, the second blade is a ruler needle that is pressed against the surface of the wafer while being rotationally driven. The scribing device of (1) includes a chip removing unit that removes chips generated by forming the scribe groove by the first blade and engraving the identification symbol by the second blade.

  (2) After the semiconductor wafer scribing apparatus according to (1), a wafer carry-in apparatus for carrying the wafer into the table, and the scribing grooves are formed by the scribing apparatus and the identification symbol is engraved A wafer scribing system comprising: a wafer unloading device for unloading a wafer from the table.

In the scribing device of the above (1), it is preferable that the first cutter is a wheel cutter that rolls while being pressed against the surface of the wafer .

  In the scribing device of the above (1), the first cutter pressing adjusting means for adjusting the pressing force of the first cutter against the wafer, or the second cutter for adjusting the pressing force of the second cutter against the wafer. A pressure adjusting means can be provided.

  In the scribing system of (2), the wafer carry-in apparatus includes an entrance side stage that receives and places the wafer, and centering means that determines the center of the wafer placed on the entrance side stage; Wafer suction and loading means for sucking the wafer whose center is determined by the centering means and loading the wafer at a position where the center of the wafer and the center of the table coincide with each other can be provided.

  In this scribing system, when a crystal orientation index is formed on the outer peripheral portion of the wafer, the wafer carry-in apparatus detects the index of the wafer sucked by the wafer suction / loading means. The scribing device may include an index detection unit, and the scribing device may be configured to set a forming direction of the scribe groove by the first blade based on the position of the index detected by the index detection unit. As an index of crystal orientation, orientation flat (hereinafter referred to as “orientation flat”) or notch is applicable. As the index detecting means, a CCD camera is preferable.

  In this scribing system, the wafer carry-in device includes an entry-side carrier that stores a plurality of the wafers, and an entry-side conveyance belt that sequentially receives the wafers from the entry-side carrier and conveys the wafers to the entry-side stage. Can do.

  In the scribing system of (2), the wafer unloading device sucks the processed wafer and unloads the processed wafer unloaded from the table by the wafer sucking / unloading means. And an exit stage for receiving and mounting.

  In this scribing system, the wafer unloading device includes an exit side transport belt for transporting the processed wafer placed on the exit side stage, and an output for receiving and sequentially storing the processed wafers from the exit side transport belt. A side carrier.

  According to the scribing apparatus of the present invention, a scribe groove is formed on the surface of a semiconductor wafer corresponding to the contour of each sample piece, and an identification symbol is engraved for each region of each sample piece before separation into each sample piece. be able to. Therefore, finally, it is possible to obtain a sample piece suitable for quality inspection simply by cleaving a plurality of sample pieces each having an identification symbol applied thereto from the wafer. As a result, when a sample piece is collected from a semiconductor wafer, the formation of a scribe groove and the engraving of an identification symbol are automated, the number that can be processed increases dramatically, and the sample piece collection does not fail.

  Further, according to the scribe system of the present invention, it is possible to efficiently obtain a semiconductor wafer having a scribe groove and an identification symbol as a series of systems comprising a scribe device, a wafer carry-in device, and a wafer carry-out device. .

  Embodiments of a semiconductor wafer scribing apparatus and a scribing system including the same according to the present invention will be described in detail below. First, a scribing apparatus that forms the basis of the present invention will be described.

  FIG. 2 is a front view schematically showing an overall configuration of a semiconductor wafer scribing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the scribing apparatus 10 includes a table 11 on which a semiconductor wafer 1 is placed on an upper surface, and a scribing unit 12 is disposed above the table 11. The overall operation of the scribing apparatus 10 and the scribing system described later is performed by a command from a control unit (not shown).

  The table 11 is formed in a horizontal horizontal plane, and is configured to rotate 90 degrees with a vertical axis passing through the center as a fulcrum, and further in the front-rear direction in the horizontal plane (direction perpendicular to the paper surface in FIG. 2). Configured to move to. The table 11 is rotated and moved back and forth individually by power from an electric motor (not shown). The wafer 1 is placed on the upper surface of the table 11 so that the center of the wafer 1 coincides with the center of the table 11, and the wafer 1 is sucked from the back surface side by a suction mechanism built in the table 11. Held on.

  The scribe unit 12 includes a first blade unit 20 that forms a scribe groove on the surface of the wafer 1 and a second blade unit 30 that engraves an identification symbol. The first blade unit 20 and the second blade unit 30 are independent and configured to move up and down in the vertical direction, and further move in the left-right direction perpendicular to the direction in which the table 11 moves back and forth. Configured as follows. The first cutter unit 20 and the second cutter unit 30 are individually moved up and down and moved left and right individually by power from an electric motor (not shown).

  The first blade unit 20 includes a first base member 21 that moves up and down and moves left and right. A first blade holder 22 is connected to the first base member 21 via a first cylinder 23 so as to protrude downward in the vertical direction. A wheel cutter 24 is rotatably supported on the first blade holder 22 as a first blade for forming a scribe groove in the wafer 1. This wheel cutter 24 is a disc of cemented carbide or sintered diamond having a diameter of about 3 mm, and its outer peripheral portion is processed into a V-shaped blade.

  When the scribe groove is formed in the wafer 1 held on the table 11, the wheel cutter 24 comes into contact with the surface of the wafer 1 by the lowering of the first base member 21, and the rod of the first cylinder 23 extends. The outer peripheral blade is pressed against the surface of the wafer 1 as it comes out. When the table 11 moves in the front-rear direction in this state, the wheel cutter 24 rolls while being pressed against the surface of the wafer 1, and a scribe groove can be formed in the locus.

  At this time, the pressure for extending the rod of the first cylinder 23 can be adjusted as appropriate. By adjusting the pressure, the pressing force of the wheel cutter 24 on the wafer 1 is adjusted, and accordingly, the scribe groove The depth of cut can be controlled. As a result, the scribe groove can be formed with an appropriate depth, and the wafer 1 is not inadvertently cleaved and separated when the scribe groove is formed.

  A first intake pipe 25 is attached to the first base member 21. The first intake pipe 25 is installed so that one end thereof opens as an intake port in the vicinity of the wheel cutter 24 and the other end (not shown) is connected to the dust collector. As the scribe groove is formed by the wheel cutter 24, chips are generated, but the chips are sucked into the first intake pipe 25 and removed by driving the dust collector. Thereby, it is possible to prevent the chips generated by forming the scribe grooves from being deposited on the wafer 1, excessively adhering to the wheel cutter 24 as the first cutting tool, or scattering to the periphery.

  The second blade unit 30 includes a second base member 31 that moves up and down and moves left and right adjacent to the first base member 21. A second blade holder 32 is connected to the second base member 31 via a second cylinder 33 so as to protrude downward by inclining about 30 degrees from the vertical direction. The second cutter holder 32 is equipped with a ruler needle 34 that is rotationally driven as a second cutter for engraving the identification symbol on the wafer 1. The ruler needle 34 is rotated by an electric motor 35, and its tip is covered with diamond.

  When engraving the identification symbol on the wafer 1 held on the table 11, the ruler needle 34 comes into contact with the surface of the wafer 1 by the lowering of the second base member 31, and the rod of the second cylinder 33 extends. At the same time, the tip is pressed against the surface of the wafer 1. In this state, the table 11 moves in the front-rear direction, and the second base member 31 moves in the left-right direction, whereby the ruler needle 34 is rotationally driven by the electric motor 35 while being pressed against the surface of the wafer 1, and its locus Can be engraved with identification symbols such as numbers and letters.

  At that time, the pressure for extending the rod of the second cylinder 33 can be adjusted as appropriate. By adjusting the pressure, the pressing force of the ruler needle 34 against the wafer 1 is adjusted, and accordingly, the identification symbol The depth of cut can be controlled. As a result, the identification symbol can be engraved at an appropriate depth, and the wafer 1 does not break from the identification symbol.

  A second intake pipe 36 is attached to the second base member 31. The second intake pipe 36 is installed so that one end thereof opens as an intake opening in the vicinity of the ruler needle 34, and the other end (not shown) is connected to the dust collector like the first intake pipe 25. When engraving the identification symbol with the ruler needle 34, chips are generated in the same manner as when the scribe grooves are formed, but the chips are sucked into the second intake pipe 36 and removed by driving the dust collector. As a result, it is possible to prevent chips generated by engraving the identification symbol from accumulating on the wafer 1, excessively adhering to the ruler needle 34 as the second cutter, and scattering around the periphery.

  A specific method for collecting a sample piece from a semiconductor wafer using the scribing apparatus 10 having such a configuration will be described below.

  FIG. 3 is a diagram illustrating a process when a sample piece is collected using the semiconductor wafer scribing apparatus of the present invention. As shown in FIG. 3A, the wafer 1 is placed on the table 11 of the scriber described above and held by suction. This wafer 1 is a wafer cut from a silicon single crystal ingot grown by the CZ method, and the straight body portion of this silicon single crystal ingot is peripherally processed to a predetermined diameter (300 mm in this embodiment) as a product. An orientation flat or notch is formed as an index of crystal orientation on the outer periphery of the cylindrical straight body, and the sample wafer 1 is cut out to a thickness of about 1 mm from the straight body. is there. In FIG. 3, the orientation flat or notch is omitted.

  After holding the wafer 1 on the table 11, the first blade unit of the scribe unit described above and the table 11 are driven to correspond to the contour of the sample piece as shown in FIG. A scribe groove 2 is formed. At that time, the table 11 is moved in the front-rear direction (vertical direction in FIG. 3) while pressing the wheel cutter, which is the above-described first cutter, against the surface of the wafer 1, thereby scribing in the vertical direction in FIG. A groove 2 is formed. In forming the horizontal scribe groove 2 in FIG. 3B, the table 11 is rotated 90 degrees and moved in the front-rear direction. Further, the plurality of parallel scribe grooves 2 are formed by sequentially moving the first base member of the first cutter unit in the left-right direction (left-right direction in FIG. 3) and moving the table 11 in the front-rear direction each time. .

  When the formation of the scribe groove 2 corresponding to the contour of the sample piece is completed, the first blade unit is retracted, and then the second blade unit and the table 11 are driven, as shown in FIG. Engrave an identification symbol for each area of the sample piece. At that time, the table 11 is moved in the front-rear direction and the second base member of the second blade unit is moved in the left-right direction while pressing the rotationally driven ruler needle, which is the above-described second blade, against the surface of the wafer 1. Thus, the identification symbol is engraved. FIG. 3C shows a state in which “1A”, “1B”,... Are engraved as examples of individual identification symbols for each sample piece.

  When the formation of the scribe groove 2 and the engraving of the identification symbol are completed, the second blade unit is retracted and the wafer 1 is removed from the table 11. Then, a load is manually applied to the wafer 1 to cleave the wafer 1 along the scribe grooves 2. As a result, as shown in FIG. 3 (d), a quarter-divided piece 1b and a plurality of rectangular pieces 1c each having an identification symbol are obtained as sample pieces.

  As described above, according to the scribing apparatus of the present invention, a scribe groove is formed on the surface of the semiconductor wafer corresponding to the contour of each sample piece, and each sample piece area is identified before being separated into each sample piece. Since the symbol can be engraved, it is finally possible to obtain a sample piece suitable for quality inspection simply by cleaving a plurality of sample pieces each having an identification symbol from the wafer. For this reason, in the scribing apparatus of the present invention, when sample pieces are collected from a semiconductor wafer, the formation of the scribe grooves and the engraving of the identification symbols are automated, so that all sample pieces are collected manually as in the past. Compared with the case of performing in (1), the number that can be processed increases remarkably, and the sample piece collection does not fail.

  Next, a scribing system that includes such a scribing apparatus will be described.

  FIG. 4 is a diagram schematically showing the overall configuration of a semiconductor wafer scribe system according to an embodiment of the present invention, where FIG. 4 (a) shows a front view and FIG. 4 (b) shows a top view. ing. In the figure, for the sake of convenience, the scribe unit constituting the scribe device 10 is not shown.

  As shown in FIG. 4, the scribe system includes the above-described scribe device 10, a wafer carry-in device 40, and a wafer carry-out device 60. The wafer carry-in device 40 plays a role of carrying the wafer 1 into the table 11 of the scribe device 10. On the other hand, the wafer carry-out device 60 plays a role of carrying out the processed wafer 1 from which the scribe groove is formed by the scribe device 10 and the identification symbol is engraved from the table 11. Hereinafter, specific configurations of the wafer carry-in device 40 and the wafer carry-out device 60 will be described in order.

  The wafer carry-in device 40 includes a loader 41 that carries the wafer 1 onto the table 11. The loader 41 is composed of a support column 42 erected adjacent to the table 11 and a carry-in arm 43 that protrudes horizontally from the support column 42 and rotates 90 degrees. The swivel of the carry-in arm 43 is performed by power from an electric motor (not shown). A carry-in cylinder 44 that protrudes downward in the vertical direction is fixed to the tip of the carry-in arm 43, and an electric motor 45 is attached to a rod of the carry-in cylinder 44, and a suction mechanism is built in the tip of the main shaft of the electric motor 45. A suction cup 46 is attached. A CCD camera 47 is fixed integrally with the carry-in cylinder 44 adjacent to the electric motor 45.

  The wafer carry-in device 40 includes an entry-side stage 48 that receives and places the wafer 1. The entry stage 48 is composed of a pair of rail members, and is arranged at a position rotated 90 degrees from the table 11 around the support column 42 (position rotated 90 degrees counterclockwise in FIG. 4B). . The entrance stage 48 is provided with a pair of centering jigs 49. The centering jig 49 determines the center of the wafer 1 by moving so that the outer periphery of the wafer 1 placed on the entry stage 48 is sandwiched in a horizontal plane.

  When the wafer 1 placed on the entry stage 48 is carried into the table 11, the center of the wafer 1 is determined by the movement of the centering jig 49, and the carry arm 43 is turned together with this to move the tip of the wafer 1. Is positioned above the entry side stage 48. Thereafter, the rod of the carry-in cylinder 44 is extended to bring the suction cup 46 into contact with the center of the surface of the wafer 1, and the wafer 1 is sucked by suction by the suction cup 46.

  When the wafer 1 is adsorbed on the entry side stage 48, the rod of the carry-in cylinder 44 is pulled in to raise the wafer 1, and then the carry-in arm 43 is turned 90 degrees so that its tip is positioned above the table 11. Then, the wafer 1 can be loaded onto the table 11 by extending the rod of the loading cylinder 44, releasing the suction by the suction cup 46, and pulling the rod of the loading cylinder 44. At this time, the wafer 1 is brought into a position where the center thereof and the center of the table 11 coincide with each other. For this reason, it becomes possible to perform the formation of the scribe groove by the scribe device 10 and the engraving of the identification symbol with high accuracy.

  In the present embodiment, in the process of loading the wafer 1 described above, the wafer 1 adsorbed by the suction cup 46 above the entry side stage 48 is rotated by driving the electric motor 45, and is used as an index of crystal orientation on the outer periphery of the wafer 1. The formed orientation flat or notch is detected by the CCD camera 47. From this detection result, the cleavage surface of the wafer 1 is specified, and the wafer 1 is loaded onto the table 11 and mounted so that the scribe groove by the scribe device 10 described above is formed in a direction parallel or perpendicular to the cleavage surface. Put. Thereby, it is possible to prevent the wafer 1 from being broken in an unplanned direction due to the formation of the scribe groove.

  The wafer carry-in device 40 includes a mechanism for efficiently supplying the wafer 1 onto the entry side stage 48. This can be composed of an entrance carrier 50 that stores a plurality of wafers 1 and an entrance transport belt 51 that sequentially receives the wafers 1 from the entrance carrier 50 and transports them to the entrance stage 48.

  The entry-side carrier 50 is a rectangular parallelepiped box, and one side surface is opened over the entire area, and concave portions are formed on the upper and lower surfaces from the opened side surface. For example, about 30 wafers 1 are horizontally disposed. Each outer peripheral part can be supported and stored in a state. The entrance carrier 50 is supported by an elevator (not shown) with one open side faced toward the entrance stage 48.

  The entry-side transport belt 51 is an endless belt that is bridged by a pair of pulleys 52 between the entry-side carrier 50 and the entry-side stage 48.

  When the wafer 1 is supplied from the input carrier 50 to the input stage 48, the input conveyance belt 51 is driven as the pulley 52 is driven. The wafer 1 in the incoming carrier 50 is sent out from the opened side surface of the incoming carrier 50 by the incoming transfer belt 51 and transferred onto the incoming stage 48. The wafers 1 in the entry-side carrier 50 are sent out in order from the lower one by sequentially lowering the lifting platform.

  Next, a specific configuration of the wafer carry-out device 60 will be described with reference to the same FIG. The wafer carry-out device 60 of the present embodiment shares a part of the loader 41 that constitutes the wafer carry-in device 40 described above, and includes a carry-out arm 61 that protrudes horizontally from the column 42 and rotates 90 degrees. The carry-out arm 61 is disposed at a position rotated 90 degrees from the carry-in arm 43 around the support post 42 (position rotated 90 degrees clockwise in FIG. 4B), and is rotated integrally with the carry-in arm 43. Composed. A carry-out cylinder 62 that protrudes downward in the vertical direction is fixed to the distal end portion of the carry-out arm 61, and a suction cup 63 incorporating a suction mechanism is attached to the tip of the rod of the carry-out cylinder 62.

  The wafer carry-out device 60 includes a delivery stage 64 that receives and places the processed wafer 1 from the table 11 of the scribe device 10. The delivery stage 64 is composed of a pair of rail members, and is disposed at a position rotated 90 degrees from the table 11 around the support column 42 (position rotated 90 degrees clockwise in FIG. 4B).

  When the processed wafer 1 released from the holding by the suction on the table 11 is carried out to the delivery stage 64, the tip of the carry-out arm 61 is positioned above the table 11 and the rod of the carry-out cylinder 62 is extended. As a result, the suction cup 63 is brought into contact with the center of the surface of the wafer 1 after processing, and the wafer 1 is sucked by suction by the suction cup 63.

  When the processed wafer 1 is adsorbed on the table 11, the rod of the carry-out cylinder 62 is pulled to raise the wafer 1, and then the carry-out arm 61 is turned 90 degrees so that the tip is positioned above the delivery stage 64. . Then, the processed wafer 1 can be unloaded onto the unloading stage 64 by extending the rod of the unloading cylinder 62, releasing the suction by the suction cup 63, and pulling the rod of the unloading cylinder 62.

  At that time, the wafer 1 can be adsorbed on the entry side stage 48 at the same time that the processed wafer 1 is adsorbed on the table 11. This is efficient because the processed wafer 1 can be unloaded from the table 11 and the wafer 1 can be loaded from the entry stage 48 to the table 11 at the same time.

  In addition, the wafer carry-out device 60 includes a mechanism for efficiently discharging the processed wafer 1 from the delivery stage 64. This is composed of an exit-side transport belt 66 that transports the processed wafer 1 placed on the exit-side stage 64 and an exit-side carrier 65 that receives the processed wafers 1 from the exit-side transport belt 66 and sequentially stores them. can do.

  The outgoing carrier 65 has the same configuration as the incoming carrier 50. The exit carrier 65 is supported by an elevator (not shown) in a state where the opened side surface faces the exit stage 64.

  The delivery-side conveyor belt 66 is an endless belt that is stretched between a delivery-side stage 64 and a delivery-side carrier 65 by a pair of pulleys 67.

  When the processed wafer 1 is discharged from the delivery stage 64 to the delivery carrier 65, the delivery conveyor belt 66 is driven as the pulley 67 is driven. The processed wafer 1 on the output side stage 64 is sent out from the output side stage 64 by the output side transfer belt 66, inserted from one side surface where the output side carrier 65 is opened, and transferred into the output side carrier 65. The delivery carrier 65 sequentially raises the lifting platform so that the processed wafers 1 are sent in order from the lower stage, and for example, about 30 processed wafers 1 can be accommodated.

  As described above, one embodiment of the scribing apparatus and scribing system of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. . For example, with respect to the scribe device, the formation of the scribe groove on the wafer and the engraving of the identification symbol are performed by the back and forth movement of the table and the left and right movements of the first and second blades in the above embodiment. As long as both move relatively in the horizontal plane, only the table may be moved back and forth and left and right, or conversely, only the first and second blades may be moved back and forth and moved left and right.

  Further, a sharp diamond tip may be used instead of the wheel cutter as the first cutting tool of the scribe device.

  As for the scribing system, a multi-indirect robot can be used for loading and unloading wafers with respect to the table of the scribing apparatus.

  According to the scribing apparatus of the present invention, since the scribe groove corresponding to the contour of each sample piece and the identification symbol for each sample piece can be given to the surface of the semiconductor wafer, the wafer is finally changed from the wafer to the scribe groove. It is possible to obtain a sample piece suitable for quality inspection simply by cleaving a plurality of sample pieces along. For this reason, when a sample piece is collected from a semiconductor wafer, automation is achieved in the step of applying a scribe groove and an identification symbol, the number of pieces that can be processed increases dramatically, and the sample piece collection does not fail.

  Further, according to the scribe system of the present invention, it is possible to efficiently obtain a semiconductor wafer having a scribe groove and an identification symbol as a series of systems comprising a scribe device, a wafer carry-in device, and a wafer carry-out device. .

It is a figure explaining the conventional procedure at the time of extract | collecting a sample piece from a semiconductor wafer. 1 is a front view schematically showing an overall configuration of a semiconductor wafer scribing apparatus according to an embodiment of the present invention. It is a figure explaining the process at the time of extract | collecting a sample piece using the scribing apparatus of the semiconductor wafer of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically the whole structure of the scribe system of the semiconductor wafer which is one Embodiment of this invention, The figure (a) shows the front view, The figure (b) has shown the top view.

Explanation of symbols

1: semiconductor wafer, 2: scribe groove, 1a: 1/2 divided piece,
1b: 1/4 divided piece, 1c: Rectangular piece,
10: scribe device, 11: table, 12: scribe unit,
20: 1st blade unit, 21: 1st base member, 22: 1st blade holder,
23: 1st cylinder, 24: Wheel cutter, 25: 1st intake pipe,
30: 2nd blade unit, 31: 2nd base member, 32: 2nd blade holder,
33: Second cylinder, 34: Ruled needle, 35: Electric motor,
36: second intake pipe,
40: Wafer carry-in device, 41: Loader, 42: Support column,
43: loading arm, 44: loading cylinder, 45: electric motor,
46: suction cup, 47: CCD camera, 48: entry side stage,
49: Centering jig, 50: Incoming carrier, 51: Incoming conveying belt,
52: pulley,
60: Wafer unloading device, 61: Unloading arm, 62: Unloading cylinder,
63: suction cup, 64: delivery stage, 65: delivery carrier,
66: Delivery side conveyor belt, 67: Pulley

Claims (13)

A scribing device for cleaving a semiconductor wafer into a plurality of sample pieces,
A table for mounting and holding the wafer;
A first blade that forms a scribe groove on the surface of the wafer held on the table, corresponding to the contour of each sample piece;
First cutter moving means for moving the first cutter relative to the table holding the wafer in a horizontal plane;
A second blade that engraves an identification symbol for each area of each sample piece on the surface of the wafer held on the table;
A second cutter moving means for moving the second cutter relative to the table holding the wafer in a horizontal plane ;
The semiconductor wafer scribing apparatus , wherein the second blade is a scribe needle pressed against the surface of the wafer while being rotationally driven . A scribing device for cleaving a semiconductor wafer into a plurality of sample pieces,
A table for mounting and holding the wafer;
A first blade that forms a scribe groove on the surface of the wafer held on the table, corresponding to the contour of each sample piece;
First cutter moving means for moving the first cutter relative to the table holding the wafer in a horizontal plane;
A second blade that engraves an identification symbol for each area of each sample piece on the surface of the wafer held on the table;
A second cutter moving means for moving the second cutter relative to the table holding the wafer in a horizontal plane;
2. A semiconductor wafer scribing apparatus comprising: chip removal means for removing chips generated by forming the scribe groove by the first blade and engraving the identification symbol by the second blade. 2. The semiconductor wafer according to claim 1, further comprising chip removal means for removing chips generated by forming the scribe groove by the first cutter and engraving the identification symbol by the second cutter. Scribing device. Wherein the first tool, the semiconductor wafer scribing apparatus according to any one of claims 1-3, characterized in that a wheel cutter that rolls while being pressed against the surface of the wafer. Semiconductor wafer scribing apparatus according to any one of claims 1-4, characterized in that it comprises a first tool pressure adjusting means for adjusting the pressing force of the first tool to said wafer. Semiconductor wafer scribing apparatus according to any one of claims 1 to 5, characterized in that with a second tool pressure adjusting means for adjusting the pressing force of the second blade to the wafer. A semiconductor wafer scribing device according to any one of claims 1 to 6,
A wafer carry-in device for carrying the wafer into the table;
A semiconductor wafer scribing system comprising: a wafer unloading apparatus for unloading a processed wafer having the scribe groove formed by the scribe apparatus and engraved with the identification symbol from the table. The wafer carry-in apparatus is
An entrance stage for receiving and placing the wafer;
Centering means for determining the center of the wafer placed on the entry stage;
And a wafer suction / loading means for sucking the wafer whose center is determined by the centering means and loading the wafer at a position where the center of the wafer and the center of the table coincide with each other. Item 8. A semiconductor wafer scribing system according to Item 7. An index of crystal orientation is formed on the outer periphery of the wafer,
The wafer carry-in apparatus includes an index detection unit that detects the index of the wafer sucked by the wafer suction carry-in unit,
9. The semiconductor wafer scribing system according to claim 8, wherein the scribing apparatus sets a forming direction of the scribe groove by the first cutter based on the position of the index detected by the index detection unit.   10. The semiconductor wafer scribing system according to claim 9, wherein the index detection means is a CCD camera. The wafer carry-in apparatus is
An entrance carrier containing a plurality of the wafers;
The semiconductor wafer scribing system according to claim 8, further comprising: an entrance-side transport belt that sequentially receives the wafers from the entrance-side carrier and transports the wafers to the entrance-side stage. The wafer unloading device is
Wafer adsorption / unloading means for adsorbing the processed wafer and unloading it from the table;
The semiconductor wafer scribing system according to any one of claims 7 to 11, further comprising: an exit side stage that receives and places the post-processed wafer unloaded by the wafer sucking and unloading means. The wafer unloading device is
An exit-side transport belt that transports the post-processed wafer placed on the exit-side stage;
The semiconductor wafer scribing system according to claim 12, further comprising: a delivery carrier that receives the processed wafers from the delivery conveyor belt and sequentially stores the processed wafers.

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