JPS6375308U - - Google Patents
Info
- Publication number
- JPS6375308U JPS6375308U JP16973486U JP16973486U JPS6375308U JP S6375308 U JPS6375308 U JP S6375308U JP 16973486 U JP16973486 U JP 16973486U JP 16973486 U JP16973486 U JP 16973486U JP S6375308 U JPS6375308 U JP S6375308U
- Authority
- JP
- Japan
- Prior art keywords
- conical part
- cutter
- tip
- scribing
- diamond cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図はこの考案の一実施例を示すダイヤモン
ドカツタの正面図、第２図は、第１図のダイヤモ
ンドカツタの先端方向からみた平面図、第３図は
この考案のダイヤモンドカツタの使用方法を示す
説明図、第４図ａ，ｂは従来の２点カツタを示し
、第５図ａ，ｂは従来の４点カツタを示し、各々
ａ図は正面図、ｂ図は底面図である。
図において、１はカツタ、２は主軸、３は円錐
台部分、４は円錐部分、５は稜線、６は頂点部、
７は半導体ウエハである。なお、各図中の同一符
号は同一または相当部分を示す。
Figure 1 is a front view of a diamond cutter showing an embodiment of this invention, Figure 2 is a plan view of the diamond cutter shown in Figure 1 seen from the tip direction, and Figure 3 shows how to use the diamond cutter of this invention. FIGS. 4a and 4b show a conventional two-point cutter, and FIGS. 5a and 5b show a conventional four-point cutter, with figure a being a front view and figure b being a bottom view. In the figure, 1 is a cutter, 2 is a main axis, 3 is a truncated cone, 4 is a cone, 5 is a ridgeline, 6 is an apex,
7 is a semiconductor wafer. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
タにおいて、主軸の先端部に円錐台部分を形成し
、さらに、その先端部分に円錐部分を形成してな
り、前記円錐台部分と円錐部分との境界線にあた
る稜線をカツタとして用いる構成としたことを特
徴とするスクライブ用ダイヤモンドカツタ。 In a diamond cutter for scribing thin plate-like workpieces, a truncated conical part is formed at the tip of the main shaft, and a conical part is further formed at the tip, and a ridge line is the boundary line between the truncated conical part and the conical part. A diamond cutter for scribing, characterized in that it is configured to be used as a cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16973486U JPS6375308U (en) | 1986-11-05 | 1986-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16973486U JPS6375308U (en) | 1986-11-05 | 1986-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375308U true JPS6375308U (en) | 1988-05-19 |
Family
ID=31103814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16973486U Pending JPS6375308U (en) | 1986-11-05 | 1986-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375308U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129857A (en) * | 2008-11-28 | 2010-06-10 | Sumco Corp | Scribing device for semiconductor wafer, and scribing system equipped with the same |
-
1986
- 1986-11-05 JP JP16973486U patent/JPS6375308U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129857A (en) * | 2008-11-28 | 2010-06-10 | Sumco Corp | Scribing device for semiconductor wafer, and scribing system equipped with the same |