JP5238390B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet affixed to an adherend.

  Conventionally, in a semiconductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size of a semiconductor chip. In this grinding process, an adhesive sheet is bonded to the wafer surface (surface on which the circuit is formed), and after the grinding process, the adhesive sheet is peeled off from the wafer. And as such a peeling method of the adhesive sheet, a method is proposed in which a peeling tape is bonded to an end of the adhesive sheet, and the peeling sheet is pulled from the wafer by pulling the peeling tape (for example, a patent) Reference 1).

Japanese Patent Laid-Open No. 11-16862

  By the way, in the conventional peeling method as described in Patent Document 1, the length of the circumferential direction along the outer periphery of the wafer and the diameter toward the center of the wafer are used as the adhesive region of the peeling tape at the end of the adhesive sheet. It is defined by the length in the direction (distance d and d ≦ 3 mm in Patent Document 1), and this adhesion region is set based on a surplus region where no circuit surface is formed.

Here, as shown in FIG. 6A, when the adhesive sheet 91 is peeled off using the peeling tape T having a heat-sensitive adhesive, the adhesive is aged over time when the adhesive is welded to the adhesive region 90. There is a tendency to harden together. When the adhesive sheet 91 is peeled by pulling the release tape T thus cured, as shown in FIG. 6 (B), the adhesive region 90 pulled by the release tape T tends to rise simultaneously in a planar shape. . As a result, the stress acting on the boundary portion W1 of the wafer W adjacent to the adhesion region 90 becomes large, and the wafer W rises together with the peeling tape T at the boundary portion W1. Further, when the rising of the wafer W is increased, the wafer W may be broken in some cases. Even if the wafer W is cracked, the bonding region 90 is provided in the surplus region of the wafer W as described above, so that there is no major problem in manufacturing semiconductor chips from the wafer W.
In order to prevent such rising and cracking of the wafer W, the problem can be solved by shortening the length (distance d0) in the radial direction toward the center of the wafer W in the bonding region 90, but from the entire surface of the wafer W. The adhesive force cannot be withstood by the tension for peeling the adhesive sheet 91, and the peeling tape T is separated from the adhesive sheet 91 in the middle of peeling, which causes a disadvantage that peeling failure occurs. In particular, as the wafer outer diameter increases in recent years, the tension required for peeling off the adhesive sheet tends to increase.

  The present invention has been devised by paying attention to the above disadvantages, and its purpose is to smoothly peel off the adhesive sheet from the adherend while suppressing the rising and cracking of the adherend such as a wafer. It is providing the sheet peeling apparatus and peeling method which can be performed.

In order to achieve the above object, the sheet peeling apparatus of the present invention removes the adhesive sheet from the adherend by relative movement between the adherend having an adhesive sheet attached to the surface and the peeling tape attached to the adhesive sheet. a sheet peeling apparatus for peeling, a feeding means for paying out the front Symbol peeling tape, and attaching means for the Repetitive out the peeling tape is stuck by pressing on the adhesive sheet, for the release and the adherend Moving means for moving the tape relative to each other, and the sticking means includes at least two pressing heads including a first pressing head and a second pressing head, and the first pressing head is used for the peeling. a first adhesive area of the tape from sticking to the adhesive sheet, the and the peeling tape and the adherend are moved relative performs primary peeling, after this primary stripping by said moving means, before After sticking a second adhesive region of the peeling tape to the adhesive sheet by the second pressing head, make a secondary peel by relatively moving said tape the release and the adherend by the moving means, that The configuration is adopted.

Further, the sheet peeling apparatus of the present invention is a sheet peeling apparatus that peels the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet. a is a feeding means for paying out the front Symbol peeling tape, and attaching means for the Repetitive out the peeling tape is stuck by pressing on the adhesive sheet, relatively moving the said tape the release and the adherend And at least two pasting positions including a first pasting position and a second pasting position that move the relative position of the adherend and the pasting means to attach the peeling tape to the adhesive sheet. and a sticking position moving means for moving the, after sticking a first adhesive region of the peeling tape to the adhesive sheet by the bonding means in said first attached position, by said moving means Serial and the peeling tape and the adherend are moved relative performs primary peeling, after this primary stripping, the second adhesive region of the peeling tape by the sticking means in said second attachment position adhesive It is also possible to adopt a configuration in which, after being attached to a sheet, secondary peeling is performed by relatively moving the adherend and the peeling tape by the moving means .

  Furthermore, in the sheet peeling apparatus of the present invention, it is preferable that the peeling tape is a heat-sensitive adhesive tape, and the sticking means has a pressing head heated by a heating means. .

  In the sheet peeling apparatus of the present invention, the first adhesive region of the peeling tape is provided along an edge of the adherend, and the second adhesive region is more covered than the first adhesive region. It is preferable to be provided near the center of the body and to have a larger adhesion area than the first adhesion region.

On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which the adhesive sheet is peeled from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface thereof and a peeling tape attached to the adhesive sheet. a is a step of paying out the front Symbol peeling tape, a primary attaching step of attaching presses the Repetitive out first adhesive region of the peeling tape was on the adhesive sheet, following the primary bonding step A primary peeling step of peeling the edge of the adhesive sheet by relatively moving the adherend and the peeling tape, and a second adhesive region of the peeling tape following the primary peeling step. Secondary sticking step of pressing and sticking the adhesive sheet to the adhesive sheet, and subsequent to the secondary sticking step, the secondary peeling step of peeling the adhesive sheet by relatively moving the adherend and the peeling tape E with .

  According to the present invention as described above, the peeling tape is affixed to the adhesive sheet in a plurality of times by a plurality of pressing heads, or a plurality of times by the affixing means moved relative to a plurality of affixing positions by the affixing position moving means. The release tape can be attached to the adhesive sheet stepwise by attaching the release tape to the adhesive sheet. Accordingly, the adhesive area by the first adhesive region is set to an adhesive area sufficient to peel only the end portion of the adhesive sheet, so that the end portion of the adhesive sheet is adhered to the first adhesive region. Can be reliably peeled off from the adherend (primary peeling). That is, in an adhesion state where the adhesion area at the end of the adherend is relatively small, only the end of the adhesive sheet is first peeled from the adherend, thereby suppressing the rising of the end of the adherend. While preventing the body from rising and cracking, it can be reliably peeled off from the end of the adhesive sheet.

And by setting the bonding area of the second bonding area or the bonding area of the bonding area after the second bonding area to be equal to or larger than the bonding area required for peeling the entire bonding sheet, the entire bonding sheet Can be peeled off from the adherend. In addition, since the end of the adhesive sheet is peeled off by the primary peeling at the time of the overall peeling (secondary peeling), the adherend is not affected even if the adhesion area is increased and the surface is raised simultaneously. Even if it is an intermediate part of the adherend that requires a relatively large tension, the adhesion region can resist the pulling force, preventing the adherend from rising up. The entire adhesive sheet can be reliably peeled from the adherend.
According to the sheet peeling apparatus and the sheet peeling method of the present invention as described above, the adhesive tape is covered while suppressing the rising of the adherend by applying the peeling tape to the adhesive sheet stepwise and peeling. It can be peeled off smoothly from the body.

  Furthermore, if the peeling tape is a heat-sensitive adhesive tape, a higher adhesive force can be obtained compared to a pressure-sensitive adhesive tape, so that the adhesive area of each adhesive region can be reduced, It is possible to further suppress the rising of the body. By using a heat-sensitive adhesive tape, only a predetermined adhesive region (first adhesive region or second adhesive region) can be adhered accurately, and since there is no adhesive force at room temperature, pressure-sensitive adhesion Thus, it is not necessary to pay attention to the configuration of the apparatus, such as applying non-adhesive treatment to various parts of the apparatus, as in the case of using the adhesive tape.

Further, the first adhesive region of the peeling tape is provided along the edge of the adherend, and the second adhesive region is provided closer to the center of the adherend than the first adhesive region and wider than the first adhesive region. Thus, the entire adhesive sheet can be peeled off after the end of the adhesive sheet is reliably peeled off, and the rise of the adherend can be more effectively prevented. At this time, the bonding area of the second bonding region is preferably larger than the bonding area of the first bonding region and does not exceed the surplus region where the circuit surface is not formed when the adherend is a wafer. .
Furthermore, in the primary peeling, it is preferable to peel up to a region beyond the second adhesion region. By doing in this way, even if the adhesion part of the 2nd adhesion field rises in the shape of a plane in secondary exfoliation, an adhesion sheet can be exfoliated smoothly from an adherend without affecting an adherend. .

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In the second and subsequent embodiments, the same constituent members as those described in the first embodiment and the constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment. Those descriptions are omitted or simplified.

[First Embodiment]
FIG. 1 is a side view showing a sheet peeling apparatus 1 according to the first embodiment.
In FIG. 1, a sheet peeling apparatus 1 is an apparatus that peels an adhesive sheet S affixed to the surface of a wafer W as an adherend using a tape T that is a peeling tape, and holds the wafer W. The table 10 as the means, the feeding unit 20 as the feeding means for feeding out the tape T, the sticking unit 30 as the sticking means for sticking the fed tape T to the adhesive sheet S, and the wafer W and the tape T are relative to each other. The moving means 40 is configured to be moved. The wafer W is integrated with the ring frame 12 via the dicing tape D.

  The table 10 includes a flat table main body 11 that sucks and holds the wafer W through a suction port (not shown), and is configured to suck and hold the wafer W integrated with the ring frame 12 from the dicing tape D side. .

  The feeding unit 20 is supported by a detaching device (not shown) so as to be movable up and down, a supporting roller 22 and guide rollers 23 and 24 provided in the feeding unit body 21, and a feeding unit body 21. A tape support part 25 provided at the lower part for supporting the tape T from below, a chuck member 28 including a gripping claw 27 for holding the tape T, and a tape T provided above the tape support part 25 and cut out. And a tape cutting unit 26 for performing the above operation. The tape support portion 25 includes a bush 251 fixed to the feeding unit main body 21, a rod 252 supported by the bush 251 so as to freely advance and retract, and a tape receiving plate fixed to the tip of the rod 252 and having a cutter groove 255. 253 and a coil spring 254 that urges the tape receiving plate 253 in a direction protruding from the bush 251. The tape cutting unit 26 includes a cutter blade 261 that cuts the tape T, a vertical cylinder 262 that drives the cutter blade 261 up and down to cut the tape T and guides the cutter blade 261 into the cutter groove 255, and a cutter A cutting cylinder 263 for cutting the tape T by driving the blade 261 in the direction orthogonal to the paper surface in FIG. 1 is configured. The tape T is a heat-sensitive adhesive tape, and is supported by the support roller 22 in a state of being wound in a roll shape.

  The sticking unit 30 is supported on a unit support portion (not shown) and is provided on the left side of the feeding unit 20 in FIG. The pasting unit 30 includes a pressing motor 31 connected to the unit support portion, and a first pressing head 33 and a second pressing head 34 provided at the lower end portion of the output shaft 32 of the pressing motor 31. Has been. The first and second pressing heads 33 and 34 are pushed downward by driving the pressing motor 31. The first pressing head 33 includes a forward / backward support portion 331 fixed to the second pressing head 34, a spring (not shown) built in the forward / backward support portion 331, and a spring protruding downward from the forward / backward support portion 331. And a first head tip portion 332 that is urged by. Further, a heater 35 as a heating unit is built in the second pressing head 34 side, and by this heater 35, the first head pressing surface portion 333 at the lower end of the first head tip portion 332 and the lower end of the second pressing head 34 are set. The second head pressing surface portion 341 is heated.

  Further, in the sticking unit 30, the first head pressing surface portion 333 is provided below the second head pressing surface portion 341, and the area of the first head pressing surface portion 333 is the tip of the second head pressing surface portion 341. The size is about 1/3 of the area. When the first and second pressing heads 33 and 34 are pushed down by the pressing motor 31, the first head pressing surface portion 333 contacts the tape T before the second head pressing surface portion 341, and this tape By pressing T against the lower adhesive sheet S and further pressing down with the pressing motor 31, the first head tip 332 is immersed in the advance / retreat support 331 and retreats, and the second head pressing surface 341 is applied to the tape T. The tape T is pressed against the adhesive sheet S while abutting. In such an affixing unit 30, the first head pressing surface portion 333 of the first pressing head 33 heats and presses the tape T, thereby affixing a first adhesive region R1 of the tape T described later to the adhesive sheet S, When the second head pressing surface portion 341 of the second pressing head 34 heats and presses the tape T, a second adhesive region R2 of the tape T described later is attached to the adhesive sheet S.

  The moving means 40 includes a single-axis robot 41 provided on the back side of the drawing unit 20 in FIG. 1 and its slider 42, a single-axis robot 43 provided below the table body 11, and its slider 44. ing. The slider 42 is attached to the chuck member 28 and is movable in the left-right direction in FIG. 1, and the slider 44 is attached to the table main body 11 and is movable in the left-right direction in FIG. As a result, the chuck member 28 grips the tape T affixed to the adhesive sheet S to enable relative movement with the wafer W, and the adhesive sheet S can be peeled from the wafer W.

Next, the operation of the sheet peeling apparatus 1 will be described with reference to FIGS. 2 to 4 as a method for peeling the adhesive sheet S in the present embodiment.
As a procedure for peeling the adhesive sheet S from the wafer W, first, as shown in FIG. 1, the wafer W is held at a predetermined position of the table 10 and each part of the sheet peeling apparatus 1 is set to the initial position. The chuck member 28 moves toward the feeding unit 20 via the single-axis robot 41 after the tape cutting unit 26 and the pasting unit 30 are moved upward and retracted. When the gripping claws 27 positioned below contact the tape receiving plate 253, the tape receiving plate 253 is pushed in the direction of the bush 251 and the tip of the tape T is received between the upper and lower gripping claws 27. The chuck member 28 closes the gripping claws 27 to grip the tip of the tape T, moves in a direction away from the feeding unit 20 while gripping the tape T, pulls out the tape T by a predetermined length, and stops.

  Next, as shown in FIG. 2A, in the state where the tape T is stretched between the chuck member 28 and the tape receiving plate 253, the sticking unit 30 operates the pressing motor 31 to perform the first operation. Then, the second pressing heads 33 and 34 are pressed down, and the intermediate portion of the tape T is lowered by the first head pressing surface portion 333 of the first pressing head 33 and pressed against the adhesive sheet S. At this time, the first head pressing surface portion 333 is heated by the heater 35 and attaches the first adhesive region R1 of the tape T to the adhesive sheet S (primary attaching step). Thereafter, the tape cutting unit 26 lowers the cutter blade 261 into the cutter groove 255 by the upper and lower cylinders 262, drives the cutting cylinder 263, and cuts the tape T by the cutter blade 261.

As shown in FIG. 4 (A), the first bonding region R1 bonded in the primary sticking step is a region along the outer peripheral edge of the adhesive sheet S, and the direction along the peeling direction (of the wafer W The sticking width r1 of the first adhesive region R1 in the direction toward the center) is set to about 1 mm, and the sticking length b1 of the first adhesive region R1 in the direction orthogonal to the peeling direction (the direction along the outer peripheral edge of the wafer W). Is set smaller than the width dimension of the tape T. That is, the shape of the first head pressing surface portion 333 of the first pressing head 33 is a shape corresponding to the pasting width r1 and the pasting length b1, and by pressing the tape T with the first head pressing surface portion 333, a predetermined value is obtained. A first adhesion region R1 having an adhesion area is formed. The peeling direction is the direction toward the right side in FIG.
Further, as shown in FIG. 4B, the first adhesion region R1 may have a dot-like shape. In this case, the first head tip portion 332 is formed in an elongated rod shape. ing. That is, the shape and the bonding area of the first bonding region R1 may be sufficient as long as it is sufficient to peel the end of the adhesive sheet S from the wafer W in the following primary peeling process. Or the adhesive strength of the adhesive sheet S can be set as appropriate.

  Next, as shown in FIG. 2B, the single-axis robot 41 holds the tip of the tape T in the state where the feeding unit main body 21, the tape cutting unit 26, and the pasting unit 30 are retracted upward. By moving the member 28 in the peeling direction and pulling the first adhesive region R1 with the tape T, the edge of the adhesive sheet S is peeled from the wafer W (primary peeling step). At this time, the movement amount of the chuck member 28 in the single-axis robot 41 is set so that the end portion of the adhesive sheet S is peeled off from the outer peripheral edge of the wafer W by the peeling distance d. Is set to about 5 mm. Therefore, the edge part of the adhesive sheet S is peeled in the primary peeling step to a range exceeding a second adhesive region R2 to be described later near the center of the wafer W. And after peeling the edge part of the adhesive sheet S, the chuck | zipper member 28 moves to the opposite direction (left direction of a figure) to a peeling direction, returns to an initial position, and stops.

  Next, as shown in FIG. 3A, in the state where the end of the adhesive sheet S is along the surface of the wafer W by the tape T gripped by the chuck member 28 returned to the initial position, The pressing motor 31 is actuated to push down the first and second pressing heads 33 and 34, and the tape T is pressed against the adhesive sheet S by the second head pressing surface portion 341 of the second pressing head 34. At this time, the first head tip 332 is configured to retreat upward against the urging force of a spring built in the advance / retreat support 331. And the 2nd head press surface part 341 is heated by the heater 35, and sticks 2nd adhesion area | region R2 of the tape T to the adhesive sheet S (secondary sticking process).

  As shown in FIGS. 4A and 4B, the second bonding region R2 bonded in the secondary sticking step is located closer to the center of the wafer W than the first bonding region R1, and the first bonding region R2 is bonded to the first bonding region R1. It is formed having a larger adhesion area than the region R1. In the second adhesive region R2, the pasting width r2 in the direction along the peeling direction is set to about 3 mm, and the pasting length b2 in the direction orthogonal to the peeling direction is set to be substantially the same as the width dimension of the tape T. . That is, the shape of the second head pressing surface portion 341 of the second pressing head 34 is a flat plate shape corresponding to the pasting width r2 and the pasting length b2, and by pressing the tape T with the second head pressing surface portion 341, In the secondary peeling step, a second bonding region R2 having a bonding area sufficient to peel the entire tape T from the wafer W is formed.

  Next, as shown in FIG. 3B, in the state where the sticking unit 30 is retracted upward, the single-axis robot 41 moves the chuck member 28 in the state of gripping the tip of the tape T in the peeling direction. The axis robot 43 moves the table 10 in the direction opposite to the peeling direction. In this way, the single-axis robot 41 and the single-axis robot 43 cause the tape T and the wafer W to move in opposite directions, and the adhesive sheet S is sequentially peeled from the wafer W by pulling the adhesive sheet S with the tape T. Then, the entire adhesive sheet S is peeled off (secondary peeling step). Thereafter, the tape T to which the peeled adhesive sheet S is adhered is separated from the chuck member 28 and collected, and the wafer W from which the adhesive sheet S has been peeled is unloaded from the table 10 by an appropriate transport device, and the sheet peeler 1 Each part is returned to the initial position, and the peeling procedure of the adhesive sheet S is completed.

According to the present embodiment as described above, the following effects are obtained.
That is, the tape T is affixed to the adhesive sheet S in two steps by the first pressing head 33 and the second pressing head 34, and the adhesive sheet S is peeled from the wafer W in the primary peeling step and the secondary peeling step. Thus, it is possible to suppress the wafer W from rising together with the tape T, and the adhesive sheet S can be reliably peeled from the end portion.
Furthermore, since the edge part of the adhesive sheet S is peeled first in the primary peeling step, it is possible to reliably prevent the wafer W from rising and cracking in the secondary peeling step.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
FIG. 5 (A) shows the primary sticking step in the operation of the sheet peeling apparatus 1A, and FIG. 5 (B) shows the secondary sticking step.
In the sheet peeling apparatus 1A of the present embodiment, the configuration of the pasting unit 60 as the pasting means is different from the first embodiment in that the configuration of the pasting unit 60 is a single pressing head 64. Is substantially the same.

  In the sheet peeling apparatus 1A having such a configuration, as shown in FIG. 5A, the pressing surface portion 641 of the pressing head 64 protrudes outward from the outer peripheral edge of the wafer W and presses the tape T against the end portion of the adhesive sheet S. As shown in FIG. 5 (B), the press surface portion 641 as a whole moves left and right between the outer peripheral edge of the wafer W and the second paste position where the tape T is pressed against the adhesive sheet S as shown in FIG. It is configured to be able to. In this case, the moving means 40 also functions as a pasting position moving means. Then, at the first application position, the pressing head 64 is pressed down and the tape T is pressed against the adhesive sheet S by the pressing surface portion 641, so that a first adhesive region substantially similar to the first adhesive region R 1 is applied to the adhesive sheet S. It has come to be. In addition, when the tape T is pressed against the adhesive sheet S by the pressing head 64 at the second application position, a second adhesive region substantially similar to the second adhesive region R2 is attached to the adhesive sheet S. Yes. Thereby, the 2nd adhesion field which has a larger adhesion area than the 1st adhesion field can be formed.

  According to this embodiment as described above, the same effect as that of the first embodiment can be obtained.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above embodiment, the case where the adherend is a semiconductor wafer is shown, but the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate are used. The substrate can also be a target, and the semiconductor wafer can be exemplified by a silicon wafer, a compound wafer, and the like, and a peeling apparatus and a peeling method for peeling an adhesive sheet (sheet, film, tape, etc.) affixed to the adherend The present invention can also be applied to.
Moreover, in the said embodiment, although the tape T which is a heat sensitive adhesive tape was used as a peeling tape, it is not restricted to this, The peeling tape may be comprised with a pressure sensitive adhesive tape etc. Moreover, although the adhesive sheet S is shown as the adhesive sheet to be peeled off, it is not limited to this, and an appropriate sheet, film, tape, or the like may be used.

  Moreover, in the said embodiment, as a process of sticking the peeling tape T to the adhesive sheet S, it has a primary and secondary sticking process, and as a process of peeling the adhesive sheet S from the wafer W, primary and Although a peeling method (peeling device) having a secondary peeling step has been shown, the present invention is not limited to this, and the method in which the sticking step and the peeling step are each carried out three times or more, that is, having a tertiary or higher sticking step and a peeling step. It may be what you did. At this time, when the pasting means is configured by having a plurality of press heads as in the first embodiment, a press head suitable for the number of times the pasting process is performed may be provided. What is necessary is just to control a sticking position moving means so that it can move to a suitable sticking position like a form.

Furthermore, in the said embodiment, although illustrated and demonstrated so that the strip | belt-shaped tape T might be supplied as a delivery means, the tape T is not restricted to a strip | belt-shaped thing, For example, the sheet | seat which cut the tape T into appropriate length The tape may be used.
In the above embodiment, the moving means 40 is configured to move both the wafer W and the tape T and move them relative to each other. However, the present invention is not limited to this, and only one of the wafer W and the tape T is moved. Alternatively, the moving means 40 may be configured. Further, the relative movement of the wafer W and the tape T may be performed in both the primary peeling process and the secondary peeling process, or any one of them.

The side view which shows the sheet peeling apparatus which concerns on 1st Embodiment. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus of FIG. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus of FIG. (A), (B) is explanatory drawing of the adhesion | attachment area | region of the tape for peeling. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus which concerns on 2nd Embodiment. (A), (B) is explanatory drawing which shows the example of a conventional malfunction.

Explanation of symbols

1,1A Sheet peeling device 10 Table (holding means)
20 Feeding unit (feeding means)
30, 60 sticking unit (sticking means)
33 First pressing head 34 Second pressing head 35 Heater (heating means)
40 Moving means (Paste position moving means)
64 Pressing head R1 First adhesive region R2 Second adhesive region S Adhesive sheet T Tape (peeling tape)
W Wafer (Substrate)

Claims (3)

A sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet ,
And feeding means unwinding the previous Symbol peeling tape,
A sticking means for pressing and sticking the fed peeling tape to the adhesive sheet;
A moving means for relatively moving the adherend and the peeling tape;
The sticking means includes at least two pressing heads including a first pressing head and a second pressing head,
Affixing the first adhesive region of the peeling tape to the adhesive sheet with the first pressing head , and then moving the adherend and the peeling tape relative to each other by the moving means to perform primary peeling, After this primary peeling , the second pressing head attaches the second adhesive region of the peeling tape to the adhesive sheet, and then the moving means relatively moves the adherend and the peeling tape. A sheet peeling apparatus characterized by performing secondary peeling . A sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet ,
And feeding means unwinding the previous Symbol peeling tape,
A sticking means for pressing and sticking the fed peeling tape to the adhesive sheet;
Moving means for relatively moving the adherend and the peeling tape;
An affixing position for moving the adherend and the affixing means relative to each other and moving the affixing position of the peeling tape to the adhesive sheet to at least two affixing positions including a first affixing position and a second affixing position Moving means,
After the first adhesive region of the peeling tape is stuck to the adhesive sheet by the sticking means at the first sticking position, the adherend and the peeling tape are relatively moved by the moving means to perform primary movement. After the first peeling, after the first peeling, the second bonding area of the peeling tape is stuck to the adhesive sheet by the sticking means at the second sticking position, and then the adherend and the A sheet peeling apparatus for performing secondary peeling by relatively moving a peeling tape . A sheet peeling method for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet ,
A step of paying out the previous Symbol peeling tape,
A primary pasting step of pressing and pasting the first adhesive region of the fed peeling tape to the adhesive sheet;
Following the primary sticking step, a primary peeling step of peeling the end of the adhesive sheet by relatively moving the adherend and the peeling tape;
Subsequent to the primary peeling step, a secondary sticking step of pressing and sticking the second adhesive region of the peeling tape to the adhesive sheet;
Subsequent to the secondary sticking step, the sheet peeling method includes a secondary peeling step of peeling the adhesive sheet by relatively moving the adherend and the peeling tape.

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