JP2019220513A - Sheet sticking device and sticking method - Google Patents

Abstract

To provide a sheet sticking device capable of surely performing separation on an interface of a release sheet and a second adhesive sheet when a process is implemented for sticking the second adhesive sheet to which the release sheet is temporarily adhered, to one face of an adherend in which a first adhesive sheet whose adhesive strength is reduced by applying predetermined energy is stuck to the other face, and performing release by pulling the release sheet, and a sticking method.SOLUTION: A sheet sticking device 10 comprises: sticking means 20 for sticking a second adhesive sheet AS2 to which a release sheet RL1 is temporarily adhered to one face of an adherend WF in which a first adhesive sheet AS1 whose adhesive strength is reduced by applying predetermined energy is stuck to the other face; release means 30 for forming a stuck body WK1 by releasing the release sheet RL1 from the second adhesive sheet AS2 which is stuck to the adherend WF, by pulling the release sheet RL1; and energy application means 40 for applying energy to the first adhesive sheet AS1 of the stuck body WK1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

  2. Description of the Related Art Conventionally, there is known a sheet sticking apparatus that applies a predetermined energy to an energy ray-curable adhesive sheet stuck to an adherend (for example, see Patent Document 1).

JP 2001-267402 A

  A conventional sheet sticking apparatus as described in Patent Literature 1 applies a predetermined energy immediately after sticking an energy ray-curable protective sheet (first adhesive sheet) to a semiconductor wafer (adherend). It is configured to cure the first adhesive sheet. Here, the adhesive used for such a first adhesive sheet generally has a reduced adhesive strength when cured. After attaching the first adhesive sheet to one surface of the adherend with such a conventional sheet attaching device, the second adhesive sheet to which the release sheet is temporarily attached is attached to the other surface, and the release sheet is pulled. When the step of peeling is performed, there is a problem that separation is not performed at the interface between the release sheet and the second adhesive sheet, and separation is performed at the interface between the adherend and the first adhesive sheet.

  An object of the present invention is to provide a second adhesive sheet on which a release sheet is temporarily adhered to the other surface of an adherend on which a first adhesive sheet whose adhesive force is reduced by application of predetermined energy is applied to one surface. Provided is a sheet sticking apparatus and a sticking method that can surely perform separation at an interface between the peeling sheet and the second adhesive sheet when the step of sticking and pulling the peeling sheet is performed. It is in.

  The present invention has adopted the configuration described in the claims.

According to the present invention, since the predetermined energy is applied to the first adhesive sheet of the bonded body from which the release sheet has been peeled, the first adhesive sheet whose adhesive strength is reduced by the application of the predetermined energy is applied to one surface. When the second adhesive sheet to which the release sheet is temporarily attached is adhered to the other surface of the adherend and the step of pulling and releasing the release sheet is performed, the release sheet and the second adhesive sheet are surely attached. The separation can be performed at the interface.
Also, if the first adhesive sheet in the bonded body is configured to apply energy at a stage before the third adhesive sheet is bonded to the second adhesive sheet and the frame member, the bonded body in which the adhesive force of the first adhesive sheet is reduced. And the frame member can be integrated.

FIG. 1 is an explanatory diagram of a sheet sticking apparatus according to an embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Further, in the present embodiment, based on the case of viewing from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the direction of the Z-axis arrow and “down” is the opposite direction, The left is the direction of the arrow on the X axis, the right is the opposite direction, the front is the front direction in FIG. 1 parallel to the Y axis, and the rear is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 10 includes a semiconductor wafer (hereinafter simply referred to as “wafer”) as an adherend to which a first adhesive sheet AS1 whose adhesive strength is reduced by application of ultraviolet light as predetermined energy is applied to one surface. ), A sticking means 20 for sticking a second adhesive sheet AS2 to which a first release sheet RL1 as a release sheet is temporarily attached on the other surface of the WF, and pulling the first release sheet RL1 to the wafer WF. A peeling unit 30 that peels off the first release sheet RL1 from the attached second adhesive sheet AS2 to form a bonded body WK1, an energy applying unit 40 that applies ultraviolet light to the first adhesive sheet AS1 in the bonded body WK1, An integrated unit in which the third adhesive sheet AS3 is pressed and attached to the second adhesive sheet AS2 and the ring frame RF as a frame member in the united WK1. And means 50, is provided above the support means 60 for supporting the wafer WF.

The sticking means 20 supports the raw material RS1 on which the first release sheet RL1 is temporarily attached on one surface of the original adhesive sheet BS and the second release sheet RL2 is temporarily attached on the other surface of the original adhesive sheet BS. The drive roller 22 is driven by a roller 21 and a rotation motor 22A as a driving device, and sandwiches the raw sheet RS1 with the pinch roller 22B. A closed loop cut CU is formed in the raw sheet RS1, and the second release sheet RL2 is formed. And an unnecessary inner release sheet RLA and a second adhesive sheet AS2 each having a predetermined shape are formed inside the cut CU of the original adhesive sheet BS, and the outside of the cut CU of the second release sheet RL2 and the original adhesive sheet BS. Cutting means 23 for forming an unnecessary outer release sheet RLB and an unnecessary adhesive sheet portion ASA, respectively, and a guide roller for guiding the material RS1. 4, a connection member attaching means (not shown) for attaching a connection member CM such as an adhesive tape or an adhesive to the unnecessary inner release sheet RLA and the unnecessary outer release sheet RLB, and an unnecessary inner sheet RS1 having the cut CU formed therein. A peeling plate 25 as a peeling member that folds and peels off the unnecessary raw fabric portion RSA including the peeling sheet RLA, the unnecessary outer peeling sheet RLB, the unnecessary adhesive sheet portion ASA, and the connecting member CM at the peeling edge 25A, and a rotation as a driving device A predetermined tension is always applied to the drive roller 26 which is driven by the motor 26A and sandwiches the unnecessary material portion RSA between the pinch roller 26B and the unnecessary material portion RSA which is driven by a driving device (not shown) and exists between the drive roller 26 and the pinch roller 26B. The roller is driven by a collection roller 27 that applies and collects the image, and a rotating motor 28A as a driving device. A drive roller 28 that sandwiches the first release sheet RL1 between the first release sheet RL1 and the first release sheet RL1 that is located between the drive roller 28 and the pinch roller 26B. A roller 28C and a frame 28D that is moved by a linear motor 29 as a driving device and supports a rotation motor 28A, a pinch roller 28B, and a collection roller 28C are provided.
The cutting means 23 includes a roller main body 23B driven by a rotation motor 23A as a driving device, a cutting blade 23C provided on an outer peripheral surface of the roller main body 23B, and a platen roller 23D that rotates synchronously with the roller main body 23B. ing.

  The peeling means 30 is constituted by a part of the members constituting the sticking means 20, and includes a rotating motor 28A, a pinch roller 28B, a driving roller 28, a collecting roller 28C, a frame 28D, and a linear motor 29.

  The energy applying means 40 includes a linear motor 41 as a driving device, a light source 42 supported by a slider 41A of the linear motor 41 via a bracket 41B and capable of emitting ultraviolet light, and an output shaft of a linear motor 43 as a driving device. 43A, a holding member 44 as a holding means having a holding surface 44A capable of being sucked and held by a not-shown depressurizing means such as a depressurizing pump or a vacuum ejector. Before the third adhesive sheet AS3 is attached to the frame RF, ultraviolet rays are applied to the first adhesive sheet AS1 of the bonded body WK1.

  The integrating means 50 includes a support roller 51 for supporting the raw material RS2 having the third adhesive sheet AS3 temporarily attached to one surface of the third release sheet RL3, a guide roller 52 for guiding the raw material RS2, The third release sheet RL3 is separated from the release sheet RL3 by the peeling plate 53 as a peeling member that peels off the third adhesive sheet AS3 from the peeling edge 53A at the peeling edge 53A and a rotating motor 54A as a driving device and a pinch roller 54B. A driving roller 54 to be sandwiched, a recovery roller 55 that is driven by a driving device (not shown) and constantly applies a predetermined tension to the third release sheet RL3 existing between the pinch roller 54B and the third release sheet RL3, and is attached to the wafer WF. Pressing roller 56 as pressing means for pressing and attaching third adhesive sheet AS3 to second adhesive sheet AS2 and ring frame RF. It is equipped with a.

  The support means 60 is supported by a linear motor 61 as a driving device supported by a slider 61A of a linear motor 61 as a driving device, and an output shaft 62A of the linear motor 62, and is not shown such as a decompression pump or a vacuum ejector. A table 63 is provided as a support member having holding surfaces 63A and 63B capable of holding by suction by a pressure reducing means (holding means).

The operation of the above-described sheet sticking apparatus 10 will be described.
First, a user of the sheet sticking apparatus 10 (hereinafter, simply referred to as “user”) displays the raw sheets RS1 and RS2 with respect to the sheet sticking apparatus 10 indicated by a solid line in FIG. After the setting as described above, a signal for starting automatic operation is input via operation means (not shown) such as an operation panel or a personal computer. Then, the attaching means 20 drives the rotating motors 22A, 23A, 26A, 28A and the connecting member attaching means (not shown) to form the cut CU in the raw web RS1 while feeding out the raw web RS1, and to remove the unnecessary inner peeling sheet. Attach the connecting member CM to the RLA and the unnecessary outer release sheet RLB. Then, the unnecessary material RSA is peeled from the material RS1 at the peeling edge 25A of the peeling plate 25, and as shown by the solid line in FIG. 1, the first second adhesive sheet AS2 temporarily attached to the first peeling sheet RL1 is removed. When reaching the predetermined position above the table 63, the sticking means 20 stops driving the rotation motors 22A, 23A, 26A, 28A and the connecting member mounting means (not shown). Further, the integration means 50 drives the rotation motor 54A to feed out the raw material RS2, and as shown by the solid line in FIG. 1, the leading end of the leading third adhesive sheet AS3 in the feeding direction is the peeling edge 53A of the peeling plate 53. When the predetermined amount is removed, the driving of the rotation motor 54A is stopped.

  Next, as shown by a solid line in FIG. 1, the user or a transfer means (not shown) such as an articulated robot or a belt conveyor places the wafer WF on which the first adhesive sheet AS1 is attached at a predetermined position on the table 63. When the ring frame RF is placed at a predetermined position on the table 63, the supporting means 60 drives the pressure reducing means (not shown) to start the suction holding of the wafer WF and the ring frame RF on the holding surfaces 63A and 63B. I do. After that, the supporting means 60 drives the linear motor 62 to raise the table 63 and bring the wafer WF into contact with the second adhesive sheet AS2 as shown by the two-dot chain line in FIG. The peeling means 30 drives the rotation motor 28A and the linear motor 29 to move the frame 28D to the left while feeding the first peeling sheet RL1 in the direction of the collection roller 28C, and the driving roller 28 transfers the second adhesive sheet AS2 to the wafer. Press on WF. As a result, the second adhesive sheet AS2 is attached to the upper surface of the wafer WF, and the first release sheet RL1 is released from the second adhesive sheet AS2, thereby forming the bonded body WK1. When the first release sheet RL1 is completely peeled off from the second adhesive sheet AS2, the sticking means 20 and the peeling means 30 stop driving the rotation motor 28A and the linear motor 29.

  Next, when the support means 60 drives the linear motion motor 62 to return the table 63 to the initial position, the sticking means 20 locks the rotation of the rotation motor 28A and the rotation motors 22A, 23A, 26A. Then, the connection member mounting means (not shown) and the linear motor 29 are driven to move the frame 28D toward the initial position. Then, similarly to the above, the raw material RS1 is fed out, and while the cut CU is formed in the raw material RS1, the connection member CM is attached to the unnecessary inner release sheet RLA and the unnecessary outer release sheet RLB, and 2. When the adhesive sheet AS2 reaches a predetermined position above the table 63, the attaching means 20 stops driving the rotation motors 22A, 23A, 26A, the connecting member attaching means (not shown), and the linear motor 29. When the support means 60 drives the linear motor 61 and moves the table 63 to a predetermined position below the holding member 44 as shown by a two-dot chain line in FIG. Then, the holding member 44 is driven down to bring the holding surface 44A into contact with the second adhesive sheet AS2. Next, when the energy applying means 40 drives the pressure reducing means (not shown) to start the suction holding of the bonded body WK1 on the holding surface 44A, the supporting means 60 stops the driving of the pressure reducing means (not shown), and the bonding on the holding surface 63A. The holding of the combined WK1 is released. Thereafter, when the energy applying means 40 drives the linear motor 43 and raises the bonded body WK1 sucked and held by the holding member 44 as shown by a two-dot chain line in FIG. 1, the linear motor 41 and the light source 42 are driven. Then, the slider 41A is moved rightward while emitting ultraviolet light from the light source 42. Thereby, the adhesive layer of the first adhesive sheet AS1 is hardened, and the adhesive strength of the first adhesive sheet AS1 decreases.

  When the application of the ultraviolet rays to the first adhesive sheet AS1 is completed, the energy applying unit 40 stops driving the light source 42, and then returns the slider 41A to the initial position. Next, when the energy applying means 40 drives the linear motor 43 and lowers the holding member 44 to place the bonded body WK1 at a predetermined position on the table 63, the supporting means 60 drives the pressure reducing means (not shown). Then, the suction holding of the bonded body WK1 on the holding surface 63A is started. Then, after the energy applying means 40 stops driving the pressure reducing means (not shown) and releases the holding of the bonded body WK1 on the holding surface 44A, the linear motion motor 43 is driven to return the holding member 44 to the initial position. .

  Next, the supporting means 60 drives the linear motor 61 to move the table 63 to the right, and when the table 63 reaches a predetermined position, the integrating means 50 drives the rotating motor 54A, and the ring frame RF and The raw material RS2 is fed out according to the moving speed of the bonded body WK1. As a result, the third adhesive sheet AS3 is peeled off from the third peeling sheet RL3 at the peeling edge 53A of the peeling plate 53, and the third adhesive sheet AS3 is pressed by the pressing roller 56 against the ring frame RF and the second adhesive sheet AS2. Attached to form an integral body WK2. Thereafter, when the leading end of the next third adhesive sheet AS3 in the feeding direction is peeled off by a predetermined amount at the peeling edge 53A of the peeling plate 53, the driving of the rotating motor 54A is stopped.

  When the table 63 reaches a predetermined position to the right of the pressing roller 56, the supporting means 60 stops driving the linear motor 61, and then stops driving the pressure reducing means (not shown), and the wafer WF on the holding surfaces 63A and 63B and The suction holding of the ring frame RF is released. Next, when the user or the conveying means (not shown) conveys the integrated object WK2 to the next step, the supporting means 60 drives the linear motor 61 to return the table 63 to the initial position, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since ultraviolet light is applied to the first adhesive sheet AS1 of the bonded body WK1 from which the first release sheet RL1 has been peeled off, the first surface in which the adhesive force is reduced by the application of ultraviolet light to one surface. When performing the step of attaching the second adhesive sheet AS2 on which the first release sheet RL1 is temporarily attached to the other surface of the wafer WF to which the adhesive sheet AS1 has been attached, and pulling and peeling the first release sheet RL1 Thus, separation can be reliably performed at the interface between the first release sheet RL1 and the second adhesive sheet AS2.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been particularly shown and described with particular reference to particular embodiments, but without departing from the spirit and purpose of the invention, the shapes, Those skilled in the art can make various modifications in materials, quantities, and other detailed configurations. In addition, the description in which the shape, material, and the like disclosed above are limited is merely an example for facilitating the understanding of the present invention, and does not limit the present invention. The description by the name of the member excluding some or all of the limitations such as is included in the present invention.

  For example, the attaching means 20 may cut the original adhesive sheet BS into a predetermined shape by the cutting means after attaching the original adhesive sheet BS to the upper surface of the wafer WF, or may adopt the second method without using the cutting means 23. 1. An original sheet provided with a closed-loop cut CU may be drawn out from an original adhesive sheet BS temporarily attached to the second release sheets RL1 and RL2, or may have a configuration similar to that of the integration means 50. The second adhesive sheet AS2 to which the sheet-like first release sheet RL1 is temporarily attached is fed out at a predetermined interval from the original sheet temporarily attached to the belt-shaped second release sheet RL2, and the first release sheet RL1 is temporarily attached. The bonded second adhesive sheet AS2 may be affixed to the wafer WF, a raw sheet RS1 to which the second release sheet RL2 is not temporarily attached may be employed, or the integrating means 50 may be used as a connecting member attaching means. Of the same configuration as The connecting member CM is held by a holding member that is supported by an output shaft of a linear motion motor as a driving device and can be suction-held by a pressure reducing device (not shown) such as a pressure reducing pump or a vacuum ejector, and held by the holding member. A member that attaches the connection member CM to the unnecessary inner release sheet RLA and the unnecessary outer release sheet RLB may be employed.

  The peeling means 30 may have a separate structure independent of the sticking means 20 or may be supported by an output shaft of a linear motion motor as a driving device, and can be suction-held by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector. The first release sheet RL1 may be held by a suitable holding member, and the first release sheet RL1 held by the holding member may be separated from the second adhesive sheet AS2. The first release sheet RL <b> 1 may be held and peeled with a tape for use.

The energy imparted by the energy imparting means 40 may be any energy such as X-rays, gamma rays, visible light, infrared rays, may be a single wavelength or multiple wavelengths, or may provide cooling energy, hot water, hot air or the like. Alternatively, any material that reduces the adhesive strength of the first adhesive sheet AS1 may be used according to the properties, material, nature, composition, and the like of the first adhesive sheet AS1.
As the light source 42, any of an LED (Light Emitting Diode) lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, and the like may be used, or a combination thereof may be used. May be.

  The integrating means 50 is provided with a closed loop-shaped cut in the original adhesive sheet temporarily attached to the third release sheet RL3, and even when the original sheet in which the inside of the cut CU is the third adhesive sheet AS3 is fed out. Alternatively, an original sheet having the original adhesive sheet temporarily attached to the third release sheet RL3 may be fed out, and the original adhesive sheet may be cut into a predetermined shape by a cutting unit. The third adhesive sheet AS3 is held by a holding member that is supported and can be sucked and held by a pressure reducing means (not shown) such as a decompression pump or a vacuum ejector, and the third adhesive sheet AS3 held by the holding member is combined with the second adhesive sheet AS2. It may be attached to the ring frame RF or may not be provided in the sheet attaching device 10.

  The support means 60 may be provided with a plurality of tables 63, may not have a holding means, and may not be provided in the sheet sticking device 10 of the present invention when supporting the bonded body WK1 with another device. .

  In addition to the ring frame RF, the frame member may be non-annular (the outer periphery is not connected), circular, elliptical, polygonal such as a triangle or more, or other shapes.

  Further, the materials, types, shapes, and the like of the adhesive sheets AS1, AS2, AS3 and the adherend in the present invention are not particularly limited. For example, the adhesive sheets AS1, AS2, and AS3 may be circular, elliptical, polygonal such as triangular or square, or other shapes, or may be of an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. If the heat-sensitive adhesive sheets AS1, AS2, and AS3 are employed, a suitable heating means such as a coil heater or a heat pipe for heating the adhesive sheets AS1, AS2, and AS3 is provided. What is necessary is just to adhere | attach by an appropriate method. Such adhesive sheets AS1, AS2, and AS3 are, for example, a single layer having only an adhesive layer, a sheet having an intermediate layer between the base sheet and the adhesive layer, and a cover on the top surface of the base sheet. Three or more layers, such as a double-sided adhesive sheet having a layer, or a so-called double-sided adhesive sheet capable of peeling a substrate sheet from an adhesive layer. And a single-layer or multi-layer having no intermediate layer. Examples of the adherend include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, resin plates, and the like. Any form of member or article can be targeted. In addition, the adhesive sheets AS1, AS2, and AS3 are replaced with functional and application-specific reading methods. For example, a label for information writing, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet. Any sheet, film, tape, or the like having an arbitrary shape such as that described above can be attached to the arbitrary adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, the attaching means may apply the second adhesive sheet on which the release sheet is temporarily attached to the other surface of the adherend on which the first adhesive sheet whose adhesive force is reduced by application of predetermined energy to one surface is attached. If it can be pasted, it is in light of the common general technical knowledge at the time of filing, and if it is within the technical scope, it is not limited at all (description of other means and steps is omitted).
The drive device in the above embodiment employs electric devices such as a rotary motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, and actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, those obtained by directly or indirectly combining them can be employed.
In the above-described embodiment, when a roller is employed, a driving device for rotating the roller may be provided, or the surface of the roller or the roller itself may be formed of a deformable member such as rubber or resin. However, the surface of the roller or the roller itself may be formed of a member that does not deform, or a device that presses a pressed object such as a pressing unit or a pressing member such as a pressing roller or a pressing head is exemplified above. Instead of, or in combination with, a member such as a roller, a round bar, a blade material, rubber, a resin, a sponge, or a configuration in which the member is pressed by blowing gas such as air or gas. It is preferable that the object to be pressed may be formed of a deformable member such as rubber or resin, may be formed of a member that does not deform, or may be a peeling member such as a peeling plate or a peeling roller or a peeling member such as a peeling member. object When a material to be peeled is employed, a member such as a plate-like member, a round bar, a roller, or the like may be employed instead of or in combination with the material exemplified above, or a material to be peeled such as rubber or resin. May be formed of a deformable member, may be formed of a member that does not deform, or may be a member that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member. In such a case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a mechanical chuck or a chuck cylinder, Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli suction, suction suction, and a driving device. And, when cutting a member to be cut such as a cutting means or a cutting member or a member that forms a cut or a cutting line in the member to be cut is employed, instead of or in combination with the above-described examples, a cutter Blade, laser cutter, ion May be used for cutting by means of spraying of heat, heat, water pressure, heating wire, gas or liquid, etc., or may be cut by moving an appropriate driving device in combination. .

REFERENCE SIGNS LIST 10 sheet sticking device 20 sticking means 30 peeling means 40 energy applying means 50 integrating means AS1 first adhesive sheet AS2 second adhesive sheet AS3 third adhesive sheet RF ring frame (frame member)
RL1 First release sheet (release sheet)
WF wafer (substrate)
WK1 bonded body

Claims (3)

Attachment means for attaching a second adhesive sheet to which a release sheet has been temporarily attached, on the other surface of the adherend on which the first adhesive sheet whose adhesive strength is reduced by application of a predetermined energy to one surface is attached,
Pulling the release sheet, peeling means for peeling the release sheet from the second adhesive sheet attached to the adherend to form a bonded body,
An energy applying means for applying the energy to the first adhesive sheet in the bonded body. Integrated means for pressing and bonding a third adhesive sheet to the second adhesive sheet and the frame member in the bonded body,
The energy applying means may apply the energy to the first adhesive sheet in the bonded body at a stage before the third adhesive sheet is attached to the second adhesive sheet and the frame member by the integrating means. The sheet sticking device according to claim 1, wherein Attachment step of attaching a second adhesive sheet to which a release sheet is temporarily attached, on the other surface of the adherend to which the first adhesive sheet whose adhesive strength is reduced by application of predetermined energy to one surface is attached,
Pulling the release sheet, a peeling step of peeling the release sheet from the second adhesive sheet attached to the adherend to form a bonded body,
Performing an energy applying step of applying the energy to the first adhesive sheet in the bonded body.

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