JP6445882B2 - Sheet transfer apparatus and transfer method - Google Patents

Description

  The present invention relates to a sheet transfer apparatus and a transfer method.

  Conventionally, after manufacturing a chip by dicing a semiconductor wafer (plate-like member) (hereinafter simply referred to as a “wafer”) affixed to a first adhesive sheet, these chips are transferred to a second adhesive sheet. An apparatus is known (see, for example, Patent Document 1).

JP 2012-244012 A

  However, in the conventional apparatus as described in Patent Document 1, since the operation of disposing the second ring frame (frame) outside the chip and the operation of cutting the first adhesive sheet are performed separately, unit time There is an inconvenience that the hit processing capacity decreases.

  An object of the present invention is to provide a sheet transfer apparatus and a transfer method capable of suppressing a decrease in processing capacity per unit time.

In order to achieve the above object, the sheet transfer device of the present invention includes a first sheet holding unit that holds the first adhesive sheet attached to one surface of the plate-like member on the outer side in the surface direction of the plate-like member; Arrangement means for disposing a frame on the outside of the plate-like member by relatively approaching the plate-like member, and an inner sheet affixed to the plate-like member by cutting the first adhesive sheet Cutting means for dividing the first adhesive sheet into an outer sheet positioned outside the inner sheet, and an attaching means for attaching the second adhesive sheet to the other surface of the plate-like member or the inner sheet and the frame The cutting means adopts a configuration in which the first adhesive sheet is provided so as to be divided inside the frame so as to be relatively close to the plate-like member together with the arranging means. .

On the other hand, the sheet transfer method of the present invention includes a step of holding the first adhesive sheet affixed to one surface of the plate-like member on the outer side in the surface direction of the plate-like member, and an arrangement means for the plate-like member. An arrangement step of disposing a frame outside the plate-like member by approaching relatively, and cutting the first adhesive sheet by a cutting means, so that the inner sheet affixed to the plate-like member and the inner sheet A cutting step of dividing the first adhesive sheet into an outer sheet positioned outside, and a step of attaching a second adhesive sheet to the other surface of the plate-like member or the inner sheet and the frame, The cutting step employs a configuration in which the cutting means is moved relative to the plate-like member together with the disposing means to divide the first adhesive sheet inside the frame .

  According to the present invention as described above, since the first adhesive sheet can be divided into the inner sheet and the outer sheet during the step of arranging the frame outside the plate-like member, the processing capacity per unit time is reduced. Can be suppressed.

1 is a side view of a sheet transfer apparatus according to an embodiment of the present invention. FIG. 2 is an operation explanatory diagram of the sheet transfer apparatus of FIG. 1. The side view of the principal part of the sheet transfer apparatus which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Further, in this embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis and “down” being the opposite direction, “ The “left” is the X-axis arrow direction, “right” is the opposite direction, “front” is the Y-axis arrow direction, which is the front direction in FIG. 1, and “rear” is the opposite direction.

  In FIG. 1, a sheet transfer apparatus 10 includes a first sheet holding unit 20 that holds a first adhesive sheet AS1 attached to one surface WF1 of a wafer WF as a plate-like member on the outer side in the surface direction of the wafer WF. By being relatively close to the wafer WF, the placement means 30 for placing the second ring frame RF2 as a frame on the outside of the wafer WF and the first adhesive sheet AS1 are cut, so that the wafer WF is attached to the wafer WF. A cutting means 40 for dividing the first adhesive sheet AS1 into an inner sheet AS11 and an outer sheet AS12 located outside the inner sheet AS11, and the other surface WF2 of the wafer WF or the inner sheet AS11 and the second ring frame RF2. The first sheet holding means 20 is supported by the sticking means 50 for sticking the second adhesive sheet AS2 and the slider 60A. And preparative holding means 20 and a sticking means 50 and a linear motor 60 as a moving means which is a drive device for relatively moving. The first ring frame RF1, the first adhesive sheet AS1 attached so as to close all or part of the opening of the first ring frame RF1, and the entire surface or one surface of the one surface WF1 on the first adhesive sheet AS1. The first integrated object WK1 is formed with the wafer WF to which the part is attached.

  The first sheet holding means 20 is a frame height adjustment that is a driving device disposed on an inner holding means 21 having a circular outer shape when viewed from above, ie, from above, and a flange 22 provided on the outer peripheral surface of the inner holding means 21. A linear motion motor 23 as means and an annular outer holding means 24 supported by an output shaft 23A of the linear motion motor 23 are provided. The upper surfaces of the inner holding means 21 and the outer holding means 24 are an inner holding face 21A and an outer holding face 24A that can be sucked and held by a decompression means (not shown) such as a decompression pump or a vacuum ejector.

  The disposing means 30 is provided on a support body 32 supported by an output shaft 31A of a direct acting motor 31 as a drive device, and is provided so as to be movable in the vertical direction with respect to the support body 32, and is prevented from falling off from the support body 32. A shaft 33 having a shaft end 33A, an urging means 34 constituted by a winding spring for urging the shaft 33 downward, and supported by the shaft 33 and held by suction by a decompression means (not shown) such as a decompression pump or a vacuum ejector. And a suction pad 35 capable of supporting the above.

  The cutting means 40 includes an annular cutting blade 41 in plan view, a turning means 42 for turning the cutting blade 41, an ultrasonic vibration device for vibrating the cutting blade 41, an oscillating means 43 such as an eccentric motor, a vibrator, and the like. have. The turning means 42 is supported on the lower surface of the support body 32 and is provided on the outer peripheral surface of a rotary bearing 42A such as a rolling bearing or a sliding bearing that supports the cutting blade 41 so as to be rotatable, and a rotary ring 42B that constitutes the rotary bearing 42A. 42C, and a rotation motor 42D as a driving device that supports a gear 42F meshing with the meshing portion 42C by an output shaft 42E. With such a configuration, the cutting means 40 is provided so as to be able to divide the first adhesive sheet AS <b> 1 relative to the wafer WF together with the arrangement means 30.

  The affixing means 50 folds the release sheet RL by folding the release sheet RL, a support roller 51 for supporting the original fabric RS on which the second adhesive sheet AS2 is temporarily attached to the release sheet RL, a plurality of guide rollers 52 for guiding the original fabric RS. A peeling plate 53 as a peeling means for peeling the second adhesive sheet AS2 from the peeling sheet RL, and a pressing roller 54 as a pressing means for pressing and sticking the second adhesive sheet AS2 peeled from the peeling sheet RL to the wafer WF A pinch roller 56 that sandwiches the release sheet RL between the drive roller 55 that is driven by a rotation motor 55A as a drive device, and a collection roller 57 that collects the release sheet RL.

The operation of the above sheet transfer apparatus 10 will be described.
First, with respect to the sheet transfer apparatus 10 indicated by the solid line in FIG. 1 in which each member stands by at the initial position, the wafer WF is transferred to a predetermined position on the inner holding means 21 by a transfer means (not shown) such as a manual or articulated robot or a belt conveyor. The first integrated object WK1 is conveyed so as to be disposed at the position. Then, the first sheet holding means 20 drives a decompression means (not shown), and starts sucking and holding the inner holding surface 21A and the outer holding surface 24A. Further, when the second ring frame RF2 is transported by a manual or transport means (not shown) so as to be placed at a predetermined position of the suction pad 35, the placement means 30 drives a decompression means (not shown), and the suction pad 35 Adsorption holding is started.

  The cutting means 40 drives the vibration means 43 to vibrate the cutting blade 41, and the placement means 30 drives the linear motion motor 31 to lower the output shaft 31A. Thereby, after the second ring frame RF2 is placed on the upper surface of the first ring frame RF1, as shown in FIG. 2, the urging means 34 is compressed and the cutting blade 41 is applied to the first adhesive sheet AS1. Pierce. Accordingly, the first adhesive sheet AS1 is divided into the inner sheet AS11 and the outer sheet AS12. At this time, the cutting means 40 may drive the rotation motor 42D to rotate the cutting blade 41. When the first adhesive sheet AS1 is divided, after the cutting means 40 and the arranging means 30 stop driving the vibrating means 43 and the decompressing means (not shown), the arranging means 30 drives the linear motion motor 31 and the output shaft 31A. Returning to the initial position, the second ring frame RF2 is left on the first ring frame RF1. Next, the first sheet holding means 20 drives the linear motor 23 to lower the output shaft 23A so that the upper surface of the second ring frame RF2 and the other surface WF2 of the wafer WF are located on the same surface. At this time, the first sheet holding means 20 can support the second ring frame RF2 by a frame holding means such as a driving device (not shown) so that the second ring frame RF2 does not move with respect to the outer holding means 24. it can.

  Thereafter, the moving means drives the linear motor 60 to move the slider 60A leftward, and when the first ring frame RF1 reaches a predetermined position, the sticking means 50 drives the rotation motor 55A, and the moving speed of the slider 60A. The raw fabric RS is sent out in accordance with. As a result, as shown by a two-dot chain line in FIG. 1, the second adhesive sheet AS2 peeled off by the peeling plate 53 is stuck to the second ring frame RF2 and the other surface WF2 of the wafer WF by the pressing roller 54, and the second A monolith WK2 is formed. When the second integrated object WK2 is formed and the slider 60A reaches a predetermined position, the moving unit stops driving the linear motor 60, and the first sheet holding unit 20 stops driving the decompression unit (not shown). Thereafter, a manual or conveying means (not shown) conveys the second integrated object WK2 to the next process, and collects the first ring frame RF1 to which the outer sheet AS12 is attached at a predetermined position. Then, the moving means and the first sheet holding means 20 drive each driving device to return each constituent member to the initial position, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since the first adhesive sheet AS1 can be divided into the inner sheet AS11 and the outer sheet AS12 during the step of arranging the second ring frame RF2 outside the wafer WF, the unit time It is possible to suppress a reduction in the hit processing capacity.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

The first sheet holding means 20 may hold the first integrated body WK1 so that the wafer WF contacts the inner holding surface 21A. In this case, the attaching means 50 includes the inner sheet AS11 and the second ring frame RF2. The second adhesive sheet AS2 is affixed to the second adhesive sheet AS2, and the second integrated member WK2 is formed in which the inner sheet AS11 is affixed between the second adhesive sheet AS2 and the wafer WF.
The first sheet holding means 20 holds and lowers the outer holding means 24 by the frame height adjusting means before dividing the first adhesive sheet AS1 by the cutting means 40, 70 (see FIG. 3). The adhesive sheet AS1 may be pulled. In this case, for example, when the wafer WF is separated into a plurality of chips, the distance between the chips can be widened (in an expanded state) and transferred to the second adhesive sheet AS2.
At least one of the inner holding means 21 and the outer holding means 24 may be configured to hold the first integrated member WK1 by a chuck means such as a mechanical chuck or a chuck cylinder, an adhesive, a magnetic force, or the like.
The outer holding surface 24A may directly support the first adhesive sheet AS1 attached to the wafer WF without using the first ring frame RF1.
The location where the first sheet holding means 20 holds the first adhesive sheet AS1 may be one location or three or more locations.
The inner holding means 21 may be an ellipse in plan view, a triangle, a polygon more than a quadrangle, and other shapes as long as it can support the wafer WF.
The outer holding means 24 may be an elliptical shape in a plan view, a triangle, a polygon more than a quadrangle, and other shapes, as long as it can support the first ring frame RF1.
The first sheet holding means 20 does not have to place the upper surface of the second ring frame RF2 and the other surface WF2 of the wafer WF on the same surface when the second adhesive sheet AS2 is attached by the attaching means 50. .
The first sheet holding means 20 may not have a frame height adjusting means.
At least one of the inner holding means 21 and the outer holding means 24 may not be able to hold the first integrated object WK1.
The frame holding means prevents the second ring frame RF2 from moving relative to the outer holding means 24 by pressure reducing means such as a pressure reducing pump or a vacuum ejector, chuck means such as a mechanical chuck or a chuck cylinder, or an adhesive or magnetic force. The supporting structure may or may not be supported.

The placement unit 30 may stop the placement unit 30 and move the first sheet holding unit 20 closer to the wafer WF when approaching the wafer WF. Alternatively, the placement unit 30 may be arranged with the first sheet holding unit 20. You may move and approach both means 30.
The arrangement means 30 may be configured to hold the first ring frame RF1 with a chuck means such as a mechanical chuck or a chuck cylinder, an adhesive, a magnetic force, or the like.
The place where the placement unit 30 holds the first ring frame RF1 may be one place or three places or more.
The biasing means may or may not be constituted by an elastic member such as rubber or resin.

The cutting blade 41 may have an elliptical shape in a plan view, a triangular shape of a triangle or a quadrangle or more, and may have a shape that has nothing to do with the outer edge shape of the wafer WF.
The cutting means 40 may cause the swiveling means 42 to repeatedly rotate in one direction and rotate in the other direction, or may continuously rotate or intermittently rotate in one direction or the other direction. .
The cutting means 40 may not have the turning means 42.
Instead of the cutting means 40, as shown in FIG. 3, a cutting means 70 having a non-annular cutting blade 71 may be employed. In this case, the turning means 42 rotates the cutting blade 71 by 360 ° or more to change the first. What is necessary is just to divide | segment 1 adhesive sheet AS1.
The cutting means 40 and 70 may not have the vibration means 43.
The shape of the edge of the cutting blades 41 and 71 may be a straight line, or may be an irregular shape such as a rectangle, a waveform or a triangle. When the shape of the edge of the cutting blade 41 is a straight line, Inclined straight lines may be used.
The cutting means 40 may include a heating means such as a coil heater for heating the cutting blade 41 or a heating side of a heat pipe.

In addition to the second ring frame RF2 and the wafer WF, the attaching means 50 may attach the second adhesive sheet AS2 to the inner sheet AS11 portion that protrudes from the wafer WF.
The peeling means may be composed of a round bar or a roller.
The affixing means 50 can employ a pressing member made of a blade material, rubber, resin, sponge, or the like, and can also employ a configuration in which it is pressed by air blowing.
The affixing means 50 includes a flat pressing member capable of holding the second adhesive sheet AS2, and moving the pressing member in the direction of the wafer WF, thereby moving the second adhesive sheet AS2 to the second ring frame RF2 and the wafer WF. It may be provided with a drive device that presses and sticks.
The affixing means 50 may be configured to affix the second adhesive sheet AS2 that is not temporarily attached to the release sheet RL to the second ring frame RF2 and the wafer WF.
The affixing means 50 affixes the second adhesive sheet AS2 so as to block all or a part of the opening of the second ring frame RF2, or the second affixing unit 50 on the other surface WF2 of the wafer WF or the entire surface or part of the inner sheet AS11. An adhesive sheet AS2 may be attached.

When attaching the second adhesive sheet AS2 to the second ring frame RF2 and the wafer WF, the first sheet holding means 20 may be stopped, and the placement means 30, the cutting means 40, and the attaching means 50 may be moved. You may move all the 1st sheet | seat holding | maintenance means 20, the arrangement | positioning means 30, the cutting | disconnection means 40, and the sticking means 50. FIG.
When the first sheet holding unit 20 and the pasting unit 50 are relatively moved by another apparatus, the sheet transfer apparatus 10 may have no moving unit.
The first and second ring frames RF1 and RF2 may not be connected in a ring shape.

  The materials, types, shapes, etc. of the first and second adhesive sheets AS1, AS2, the plate-like member and the frame in the present invention are not particularly limited. For example, the first and second adhesive sheets AS1 and AS2 may be circular, elliptical, polygonal such as a triangle or a quadrangle, or other shapes, or may be adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When the first and second adhesive sheets AS1 and AS2 having heat-sensitive adhesive properties are employed, appropriate coil heaters or heat pipes for heating the first and second adhesive sheets AS1 and AS2 may be used. What is necessary is just to adhere | attach by appropriate methods, such as providing heating means, such as a heating side. In addition, the first and second adhesive sheets AS1 and AS2 are, for example, a single layer having only an adhesive layer, an intermediate layer between the base material and the adhesive layer, and an upper surface of the base material. It may be a three-layer or more layer having a cover layer, or a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. The intermediate layer may be a single layer or a multilayer having no intermediate layer. In addition, as the plate-like member, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. Note that the first and second adhesive sheets AS1 and AS2 are replaced with functional and application readings, for example, information description labels, decorative labels, protective sheets, dicing tapes, die attach films, die bonding tapes, recording layers. Any sheet, film, tape or the like of any shape such as a formed resin sheet can be attached to any plate-like member as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the first sheet holding means can hold the first adhesive sheet affixed to one surface of the plate-like member on the outer side in the surface direction of the plate-like member, the first sheet holding means is checked against the common general technical knowledge at the beginning of the application. However, there is no limitation as long as it is within the technical range (the description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet transfer apparatus 20 ... 1st sheet holding means 30 ... Arrangement means 40, 70 ... Cutting means 41, 71 ... Cutting blade 42 ... Turning means 43 ... Vibrating means 50 ... Pasting means AS1, AS2 ... 1st, 2nd adhesion Seat AS11 ... Inner seat AS12 ... Outer seat RF2 ... Second ring frame (frame)
WF ... Wafer (plate member)
WF1 ... one side WF2 ... the other side

Claims (2)

First sheet holding means for holding the first adhesive sheet affixed to one surface of the plate-like member on the outside in the surface direction of the plate-like member;
Arranging means for arranging a frame on the outside of the plate-like member by relatively approaching the plate-like member;
Cutting means for dividing the first adhesive sheet into an inner sheet affixed to the plate-like member and an outer sheet positioned outside the inner sheet by cutting the first adhesive sheet;
A sticking means for sticking a second adhesive sheet to the other surface of the plate-like member or the inner sheet and the frame;
The sheet transfer device, wherein the cutting means is provided so as to be able to divide the first adhesive sheet inside the frame by approaching the plate-like member together with the arrangement means. Holding the first adhesive sheet affixed to one surface of the plate-like member on the outside in the surface direction of the plate-like member;
An arrangement step of arranging a frame on the outer side of the plate-like member by the arrangement means relatively approaching the plate-like member;
Cutting the first adhesive sheet with a cutting means to divide the first adhesive sheet into an inner sheet affixed to the plate-like member and an outer sheet positioned outside the inner sheet;
Attaching the second adhesive sheet to the other surface of the plate-like member or the inner sheet and the frame,
In the cutting step, the first adhesive sheet is divided inside the frame by bringing the cutting means together with the placement means relative to the plate-like member .

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