JP2008072134A - Sheet peeling device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device and method which peels a sheet pasted on a plate member such as a semiconductor wafer without imparting damage to the plate member. <P>SOLUTION: The sheet peeling device peels a protective sheet F pasted on a semiconductor wafer W by using an adhesive tape T. The adhesive tape T to be used is a thermosensitive adhesive tape, and is thermally pressed on an end of the protective sheet F with a heater tool. Thereafter, the adhesive tape T is cut with a cutter blade; a heater cutter section and a tape feeding section are raised; the adhesive tape T is grasped with a peeling head 400 and the peeling head 400 is moved to pull and peel the protective sheet F. The peeled protective sheet F is discarded in a waste box with the adhesive tape T. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and method for peeling a sheet affixed to a plate-like member such as a semiconductor wafer.

  In the semiconductor manufacturing process, there is a process of polishing and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size of the semiconductor chip. In that process, the surface of the wafer (the surface on which the circuit is formed) A protective sheet made of an adhesive film or the like is attached for protection. After polishing, the protective sheet is peeled off from the wafer.

  As a method for peeling off the protective sheet, conventionally, an adhesive tape having a width of 25 mm to 50 mm is pasted on a protective sheet stuck on a wafer using a press roller, and the protective sheet is peeled off from the wafer by pulling the adhesive tape. It was.

  However, according to the above method, the pressure-sensitive adhesive tape is pressed with a press roller and stuck to the protective sheet, so that there is a possibility that wafer cracking due to this pressing may occur. In particular, as the wafer outer diameter increases in recent years, it is necessary to consider the problem of wafer cracking.

  Then, an object of this invention is to enable peeling | peeling sheets, such as a protection sheet, from a plate-shaped member, without damaging plate-shaped members, such as a wafer.

  In order to solve the above-described problems, in the present invention, in a sheet peeling apparatus and method for peeling a sheet affixed to a plate-like member using an adhesive tape, the adhesive tape is bonded to an end of the sheet, and the adhesive tape and the plate The sheet was peeled by relative movement with the shaped member.

  Furthermore, in the present invention, a heat-sensitive adhesive tape is used as an adhesive tape in a sheet peeling apparatus and method for peeling a sheet affixed to a plate-like member using an adhesive tape.

  The present invention is particularly suitable for peeling off a protective sheet stuck on a wafer. However, the present invention is not limited to this, and sheet peeling for peeling a sheet stuck on a plate-like member using an adhesive tape. The apparatus and method can be generally applied.

  As described above, according to the present invention, a sheet can be peeled without damaging a plate-like member such as a wafer.

  Hereinafter, the present invention will be described using a wafer protective sheet peeling apparatus as an example. FIG. 1 is a front view of a sheet peeling apparatus showing an embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is a plan view. The sheet peeling apparatus includes a table 100, a table unit 200, a tape feeding unit 300, a peeling head unit 400 as a moving unit, and a heater cutter unit 500 as an adhering unit and a cutting unit.

  First, the outline of this apparatus will be described. A wafer to which a protective sheet is attached is conveyed by the table unit 200. On the other hand, the adhesive tape T is fed out from the tape feeding unit 300 and pulled out by the peeling head unit 400. The adhesive tape T is thermocompression bonded to the end portion of the protective sheet by the heater cutter unit 500 and cut into a predetermined short length. Next, the peeling head unit 400 holds and pulls the adhesive tape T to peel off the protective sheet from the wafer. Details of each part will be described below.

  The table unit 200 includes two rails 201 installed on the table 100 and a table 203 placed on the rail 201. The table 203 is movable on the rail 201 in the X-axis direction shown in the figure. On the base 100, a belt 209 is hung between pulleys 205 and 207, and the pulley 205 is rotated by a motor 211. The belt 209 is connected to the table 203 by a connector 213, and the table 203 moves on the rail 201 by the rotation of the motor 211.

  An elevating table 217 that is moved up and down by a cylinder 215 is disposed at the center of the table 203. The table 203 is formed with a plurality of annular suction grooves 219 concentrically with the lifting table 217 in accordance with the diameter of the wafer. Each suction groove 219 has a plurality of suction openings, and a negative pressure is applied to these suction openings. The wafer is sucked and held. Reference numeral 221 denotes a retractable positioning pin, which stands in the vicinity of the suction groove 219 and is positioned by contacting the end portions of the wafer against the two positioning pins 221. When picking up the wafer from the table 203, after the suction is released, the cylinder 215 is driven to raise the elevating table 217.

As the adhesive tape T, a heat-sensitive adhesive tape in which a heat-sensitive adhesive layer is provided on a heat-resistant film such as a polyethylene terephthalate film is used here, but a heat-sensitive adhesive tape having a heat-sensitive adhesive property on the substrate itself is used. May be. The adhesive tape T is set on the reel 301 and sent to the tape feeding unit 300. The rotating shaft of the reel 301 has a spring 302 (
2) is attached, whereby a frictional force is applied to the rotating shaft of the reel 301 via the friction plate.

  As shown in FIG. 5, the tape feeding unit 300 includes a pinch roller 303 and a tension roller 305 that are pressed against each other, and a guide roller 307. A tape receiving plate 309 is attached to the ball bushing 311 by a shaft 310 at the lower end of the tape feeding unit 300. The tape receiving plate 309 is movable in the X-axis direction and is always urged by the spring 313 in the protruding direction (left direction in FIG. 5). The adhesive tape T is sandwiched between the pinch roller 303 and the tension roller 305, then changed in direction by the guide roller 307, and is pressed by the tape pressing plate 315 on the tape receiving plate 309. A cutter groove 309 a is formed at the front end of the tape pressing plate 315. The tape pressing plate 315 is driven by a cylinder 317. In addition, a timing belt 321 is hung from a timing pulley 319 on the tension roller 305 and is driven by a motor 323. The tension roller 305 is rotated in a direction opposite to the feeding direction of the adhesive tape T, and tension (back tension) in the direction opposite to the feeding direction is applied to the adhesive tape T.

The tape supply unit 300 is movable in the vertical direction (Z-axis direction shown in the figure). That is,
As shown in FIG. 2, a substrate 101 is installed on the base unit 100, and the tape feeding unit 300 moves in the Z-axis direction by a cylinder 325 fixed on the substrate 101.

  As shown in FIG. 2, the peeling head unit 400 includes a peeling head 401 and an arm 403 that supports the peeling head, and the arm 403 is attached to a guide 405 so as to be movable in the X-axis direction. The arm 403 is driven by a motor 407 installed at an end of the guide 405 via a power transmission mechanism (not shown). The guide 405 is attached on the base 100 by a support plate 409.

  The peeling head 401 includes a tape chuck 412 including an upper jaw 411 and a lower jaw 413, and the tape chuck 412 is opened and closed by moving the upper jaw 411 up and down with a cylinder 415. A tape detection sensor 417 (for example, a photoelectric sensor or the like, see FIG. 5) for detecting whether or not the adhesive tape T is present in the tape chuck 412 is attached to the peeling head 401.

  Next, the heater cutter unit 500 will be described. 4A is an enlarged plan view of the heater cutter portion, and FIG. 4B is a side view. FIG. 8 is a front view of the heater cutter unit 500. A rod-shaped heater 503 is embedded in the heater block 501, and a heater tool 505 is fixed to the lower end of the heater block 501 with a screw 507. Concave portions as shown in FIG. 4B are formed at the lower end of the heater tool 505 so as to locally apply heat. Further, the heater tool 505 can be replaced, and a tool having a different shape can be used according to the size of the wafer and the curvature of the wafer outer periphery. The heater block 501 is attached to the frame 508 so as to freely move up and down (in the Z-axis direction in the figure) by two guide rods 506 and is moved up and down by a heater upper and lower cylinder 509 fixed to the frame 508.

  Two plate-like tape pressing guides 511 are attached to the frame 508 so as to sandwich the heater block 501 from the front and rear (X-axis direction). The tape pressing guide 511 is made of a heat insulating member such as a polyimide resin or a polyether ether ketone resin. The upper end of the tape pressing guide 511 is fixed to the frame 508, the lower end is formed round, and is free to press the adhesive tape T. A cutter moving cylinder 513 is attached to the side surface of one tape presser guide 511 (FIG. 4A), and a cutter blade 515 is attached to the piston tip of this cylinder 513. The cutter blade 515 is driven by the cylinder 513. Reciprocates in the Y-axis direction. A plate-like tape presser 517 is disposed below the cylinder 513, and a slit 517 a through which the cutter blade 515 passes is formed in the tape presser 517.

  The heater cutter unit 500 is movable in the vertical direction (Z-axis direction). That is, the heater cutter unit 500 moves in the Z-axis direction by the cylinder 519 (FIG. 3) attached to the substrate 101.

  Next, the operation of the above apparatus will be described in steps 1 to 8.

  (Step 1: Wafer Set) First, a wafer is set on the table 203. This may be performed manually or automatically using an appropriate manipulator or automatic supply device. The wafer W is placed in accordance with the suction groove 219 of a corresponding size on the table 203 and positioned against the positioning pins 221. Thereafter, a vacuum device (not shown) operates to suck the wafer W, and the table 203 moves to a position immediately below the tape feeding unit 300 (FIG. 5).

  In the tape feeding unit 300, the adhesive tape T is placed in advance on the pinch roller 303, the tension roller 305, and the guide roller 307 in advance, and the vicinity of the tip of the adhesive tape T is held by the tape presser 315 and the tape receiving plate 309. . The tension roller 305 is driven, and an appropriate back tension is applied to the adhesive tape T.

  At this time, the tape chuck 412 of the peeling head unit 400 is open. Then, the peeling head unit 400 moves toward the tape feeding unit 300 in the X-axis direction. The movement of the peeling head unit 400 may be performed simultaneously with the movement of the table 203.

  (Step 2: gripping the tip of the adhesive tape) As shown in FIG. 6, the peeling head 400 pushes the tape receiving plate 309, whereby the tape receiving plate 309 is retracted, and the tip of the adhesive tape T is the opening of the tape chuck 412. Inserted into the section. When the tip of the adhesive tape T is detected by the sensor 417, the tape chuck 412 is closed and the tip of the adhesive tape T is gripped. Next, the back tension by the tension roller 305 is released, and the tape presser 315 is lifted away from the adhesive tape T.

  (Step 3: Pulling out the adhesive tape) As shown in FIG. 7, the peeling head portion 400 is moved away from the tape feeding portion 300 along the X-axis direction, and the adhesive tape T is pulled out. At this time, the tension roller 305 is activated to apply back tension.

  (Step 4: Thermocompression bonding and cutting of tape) As shown in FIG. 8, the heater cutter unit 500 is lowered, and the tape pressing guide 511 pushes the adhesive tape T close to the wafer W. The adhesive tape T is pressed by the tape pressers 517 and 315 on the tape receiving plate 309. Thereafter, the heater upper / lower cylinder 509 is driven, and the heater tool 505 presses the adhesive tape T against the protective sheet F at the tip of the wafer W for several seconds, and the adhesive tape T is thermocompression bonded to the protective sheet. At this time, the position of the table 203 is adjusted according to the size of the wafer W. The table 203 only needs to be moved to just below the heater cutter unit 500 before the thermocompression bonding of the adhesive tape T. Subsequently, the cutter blade 515 moves in the Y-axis direction, and the adhesive tape T is cut to a predetermined length.

  (Step 5: Tape feeding portion and heater cutter portion rise) As shown in FIG. 9, the tape feeding portion 300 and the heater cutter portion 500 rise. As shown in the figure, the adhesion point P between the adhesive tape T and the protective sheet F is in the vicinity of the edge of the wafer W. For example, the distance d from the edge of the wafer W is within 3 mm.

  (Step 6: Protective Sheet Peeling) As shown in FIG. 10, the peeling head 400 is moved to the right in the figure and the table 203 is moved to the left in the figure, and the protective sheet F is held and pulled by the peeling head 400 to be peeled off. To go. At this time, it is desirable that the holding position by the peeling head 400 is as close as possible to the protective sheet F and the pulling direction is horizontal. As a result, the stress applied to the wafer W can be minimized, and the adsorption between the wafer W and the table 203 is difficult to come off. Since the table 203 also moves in the opposite direction simultaneously with the movement of the peeling head 400, the peeling operation is completed in a short time.

  (Step 7: Protective Sheet Disposal) As shown in FIG. 11, when the peeling head 400 moves to a predetermined position, the tape chuck 412 is opened, and the adhesive tape T and the protective sheet F are dropped into the disposal box 103 accommodated in the table 100. To do. At this time, high-pressure air may be blown from above.

  (Step 8: Wafer Removal) When the table 203 returns to the initial position, the lift table 217 is raised, and then the wafer W is taken out. This extraction may be performed manually or automatically using an appropriate manipulator or automatic supply device.

  As described above, since the adhesive tape T is bonded to the end of the protective sheet F, the wafer can be prevented from cracking without pressing the wafer with a press roller as in the prior art, and the wafer diameter can be increased. Can respond. As described above, the adhesive tape is not particularly limited as long as it can adhere to the protective sheet at the edge of the wafer, and a heat-sensitive adhesive tape is preferably used. Adhesive tape can also be used.

  If a heat-sensitive adhesive tape is used as the adhesive tape T, only a part of the protective sheet F is thermocompression bonded, so that it is possible to prevent wafer cracking without pressing the wafer with a press roller as in the prior art. it can. In addition, when using adhesive tape, if abrasive scraps, cutting scraps or water adheres to the surface of the protective sheet, the adhesiveness with the adhesive tape will deteriorate, so the protective tape may not be removed with a single pull. Or the surface of the protective tape had to be cleaned. However, if a heat-sensitive adhesive tape is used, adhesion is possible even if dust or water adheres to the surface. Moreover, since the heat-sensitive adhesive tape is not sticky at room temperature, it is easy to handle such that surface processing of the transport roller is unnecessary and a release sheet is unnecessary. In addition, an inexpensive material such as a heat seal material can be used as the material, and since the adhesive force is strong, the amount of use can be reduced, saving resources and cost.

  Furthermore, if the edge of the protective sheet is bonded and a heat-sensitive adhesive tape is used as in the above device, the wafer edge is generally not formed with an electronic circuit. There is an advantage that the heat-sensitive adhesive tape can be easily used.

  In the above apparatus, a cutting means (cutter blade 515) for cutting the adhesive tape into a predetermined length is provided, but this cutting means may not be provided. For example, if an adhesive tape having an appropriate length is used from the beginning, the protective sheet can be peeled off without being cut by bonding the adhesive tape to the end of the protective sheet F and pulling it as it is.

It is a front view of the protection sheet peeling apparatus which shows an example of this invention. It is a side view of a protection sheet peeling apparatus. It is a top view of a protection sheet peeling apparatus. It is an enlarged view of a heater cutter part. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus. It is a figure explaining operation | movement of a protection sheet peeling apparatus.

Explanation of symbols

100 stand part 200 table part 300 tape feeding part 400 peeling head part 500 heater cutter part 505 heater tool 515 cutter W semiconductor wafer F protective sheet T adhesive tape

Claims (6)

   In a sheet peeling apparatus for peeling a sheet affixed to a plate member using an adhesive tape, the adhesive tape is bonded to an end of the sheet, and the adhesive tape and the plate member are relatively moved to move the sheet. The sheet peeling apparatus characterized by peeling.    In a sheet peeling apparatus for peeling a protective sheet affixed to a plate-like member using an adhesive tape, a table for placing the plate-like member, a tape feeding means for feeding the adhesive tape, and a fed adhesive tape An adhesive means for adhering to the end of the protective sheet; and a moving means for holding and moving the adhered adhesive tape, and relatively moving the adhesive tape and the plate-like member by the table and the moving means. A sheet peeling apparatus, wherein the protective sheet is peeled off.    The sheet peeling apparatus according to claim 2, further comprising a cutting unit that cuts the adhesive tape fed from the tape feeding unit into a predetermined length.    In the sheet peeling method of peeling a sheet affixed to a plate-shaped member using an adhesive tape, the adhesive tape is bonded to an end portion of the sheet, and the adhesive tape and the plate-shaped member are relatively moved to move the sheet. The sheet peeling method characterized by peeling.    In a sheet peeling apparatus for bonding a sheet affixed to a plate-like member to the sheet and peeling the sheet by moving the adhesive tape and the plate-like member relative to each other, a heat-sensitive adhesive tape is used as the adhesive tape. A sheet peeling apparatus characterized by being used.    In a sheet peeling method in which a sheet affixed to a plate-like member is bonded to an adhesive tape to the sheet and the adhesive tape and the plate-like member are moved relative to each other to peel the sheet, a heat-sensitive adhesive tape is used as the adhesive tape. A sheet peeling method characterized by being used.

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