JPH04154109A - Apparatus and method for exfoliating protective tape - Google Patents

Abstract

PURPOSE:To surely exfoliate a protective tape from the surface of a wafer by providing a roller which pressurizes an exfoliation tape and the protective tape and brings them into close contact at the edge part of the protective tape. CONSTITUTION:A wafer 9 where a protective tape 10 has been pasted on its element formation face is sandwiched between rollers 4 together with an exfoliation tape 11. While the wafer 9 is being bonded by the adhesive of the tape 11, it is fed and rollers 5 are moved. The wafer is placed on a chuck 6, vacuum- sucked and fixed. It is heated by a heater 6a at the chuck, its bonding power is weakened, the tapes 10, 11 are pressurized and brought into close contact by using a roller 7. The roller is moved upward and only the taking-up rollers 5 are moved to the right. The protective tape 10 which has been bonded to the exfoliation tape is exfoliated from the surface of the wafer 9. The bonding power between the protective tape and the exfoliation tape can be made larger than the bonding power between the wafer and the protective tape by simply changing a structure, and the protective tape can surely be exfoliated form the surface of the wafer.

Description

[Detailed Description of the Invention] [Summary] Regarding the improvement of a tape peeling device and a tape peeling method for peeling off a protective tape pasted to protect the surface of a wafer using a peeling tape, the present invention relates to an improvement in a tape peeling device and a tape peeling method that uses a peeling tape to peel off a protective tape attached to the surface of a wafer. The purpose of the present invention is to provide a tape peeling device and a tape peeling method that can reliably peel off the tape, and [1] remove the protective tape attached to the surface of the wafer.
In a tape peeling apparatus that applies a release tape to a surface not attached to the wafer and peels the protective tape attached to the release tape from the wafer, the release tape and the protective tape are attached at an end of the protective tape. [2] A tape peeling method using the tape peeling device according to claim 1, further comprising: a pressure roller that presses and brings the protective tape into close contact with each other; In this step, the release tape and the protective tape are pressed into close contact with each other, and the adhesive force between the protective tape and the release tape is made larger than the adhesive force between the wafer and the protective tape. The device is configured to be detached from the wafer.

[Industrial application field]

The present invention relates to improvements in a tape peeling device and a tape peeling method for peeling off a protective tape attached to protect the surface of a wafer using a peeling tape.

During the backside process of semiconductor devices, which involves polishing the opposite side of the semiconductor wafer to the side on which the elements are formed, a protective tape is applied to the side on which the elements are formed to protect the elements, and after the backside polishing, this protective tape is replaced with a release tape. It is peeled off using
As the adhesion of the protective tape to the semiconductor wafer becomes stronger, a problem arises in that the protective tape may not be peelable from the surface of the semiconductor wafer.

Under the above circumstances, there is a need for a tape peeling device and a tape peeling method that can reliably peel a protective tape from a semiconductor wafer.

[Conventional technology]

The schematic structure of a conventional protective tape peeling device will be explained in detail with reference to FIG. 3, and the conventional protective tape peeling method will be explained with reference to FIG.

FIG. 3 is a diagram showing a schematic structure of a conventional protective tape peeling device.

As shown in the figure, the wafer carrier 21a of the loader 21
A wafer 9 with a protective tape pasted thereon is stored, and a peeling tape 1 is rewound from the unwinding drum 23.
The wafer 1 passes between the feed rollers 24, the surface of the vacuum chuck 26, and the take-up roller 25, and is wound up by the take-up drum 28, and the wafer from which the protective tape has been peeled off on the vacuum chuck 26. 9 is adapted to be housed in the wafer carrier 22a of the unloader 22.

The vacuum chuck 26 has a built-in heater 26a that heats the adhesive of the protective chip 110 attached to the wafer 9 placed thereon to make it easier to peel off.

FIG. 4 is a diagram showing the conventional protective tape peeling method in the order of steps. A conventional protective tape peeling method will be explained with reference to this figure.

First, as shown in FIG. 4(a), the wafer 9 with the protective tape 10 attached to its element forming surface is sandwiched between the feed rollers 24 together with the release tape 11, and the feed rollers 24 are rotated in the direction of the arrow. Then, the wafer 9 is sent to the left while the release tape 11 and the protective tape 10 are bonded together by the adhesive of the release tape 11, and the take-up roller 25 is also moved to the left as shown in FIG. 4('b). The wafer 9 is placed on the vacuum chuck 26 and fixed by vacuum suction.

In this state, the adhesive of the protective tape 10 is removed by the vacuum chuck 26.
is heated by the heater 26a built in to weaken the adhesive force, and only the take-up roller 25 is moved to the right, and the fourth
As shown in Figure (C), the protective tape 10 attached to the release tape 11 is peeled off from the surface of the wafer 9.

[Problem to be solved by the invention]

In the conventional tape peeling apparatus and tape peeling method described above, a protective tape is attached to the surface of the wafer on which elements are formed in the back process of semiconductor devices to protect the elements, and after polishing the back surface, this protective tape is replaced with a peeling tape. However, because the adhesive force of the protective tape to the semiconductor wafer is strengthened, it may not be possible to peel the protective tape from the wafer surface, reducing the operating rate of the tape peeling equipment. However, if the protective tape has to be removed manually, there is a problem in that the number of man-hours increases.

In view of the above circumstances, the present invention aims to provide a tape peeling device and a tape peeling method that can reliably peel a protective tape from the surface of a wafer.

[Means to solve the problem]

The protective tape peeling device of the present invention applies a peeling tape to the surface of the protective tape that is attached to the surface of a wafer that is not attached to the wafer, and peels the protective tape attached to the peeling tape from the wafer. The tape peeling device of the present invention is configured to include a pressure roller that presses and brings the peeling tape and the protective tape into close contact with each other at the end of the protective tape, and the protective tape peeling method of the present invention uses this roller. By pressurizing the release tape and the protective tape at the edges of the protective tape to make them stick together, and making the adhesive force between the protective tape and the release tape greater than the adhesive force between the wafer and the protective tape, this can be achieved. The protective tape is configured to be peeled off from the wafer.

[Effect]

That is, in the present invention, while feeding the wafer using a feed roller, a release tape is applied to the protective tape attached to the wafer, and the peeling of the protective tape is started with the wafer placed on a vacuum chuck. Press the surface of the release tape with a pressure roller at the desired end, and bond the release tape and the protective tape so that the adhesive force between the release tape and the protective tape is stronger than the adhesive force between the protective tape and the wafer. Because of the strong adhesion, when the take-up roller is moved to the right, the protective tape attached to the release tape can be reliably peeled off from the surface of the wafer.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS A schematic structure of a protective tape peeling device according to an embodiment of the present invention will be described below with reference to FIG. 1, and a protective tape peeling method according to an embodiment of the present invention will be explained in detail with reference to FIG.

FIG. 1 is a diagram showing a schematic structure of a protective tape peeling device according to an embodiment of the present invention.

The protective tape peeling device of this embodiment is basically the same as the conventional protective tape peeling device, but the feature of this embodiment is that the protective tape 10 is attached to the surface of the wafer 9 placed on the surface of the vacuum chuck 6. Directly above the edge where the peeling starts,
A pressure roller 7 that presses the release tape 11 attached to the surface of the protective tape 10 and the protective tape 10 is provided, for example, a roller made of silicone rubber that is energized by an air cylinder 7a.

FIG. 2 is a diagram showing the process order of a method for removing a protective tape according to an embodiment of the present invention. The protective tape peeling method of this embodiment will be explained with reference to this figure.

First, as shown in FIG. 2(a), the wafer 9 with the protective tape 10 attached to its element forming surface is sandwiched between the feed rollers 4 together with the release tape 11, and the feed rollers 4 are rotated in the direction of the arrow. The wafer 9 is sent to the left while the release tape 11 and the protective tape 10 are bonded together by the adhesive of the release tape 11, and the winding roller 5 is also moved to the left to complete the process as shown in FIG. C 9 is placed on the vacuum chuck 6 and fixed by vacuum suction.

In this state, the adhesive of the protective tape 10 is heated by the heater 6a built in the vacuum chuck 6 to weaken the adhesive force, and as shown in FIG. 11 and the protective tape 10 are pressed together by a pressure roller so as to make them adhere strongly, and then the pressure roller 7 is moved upward and only the take-up roller 5 is moved to the right, as shown in FIG. 2(d). As shown, the protective tape 10 attached to the release tape 11 is peeled off from the surface of the wafer 9.

In this way, by pressing the release tape 11 and the protective tape 10 together with the pressure roller at the peeling start position of the protective tape 10 and making them adhere strongly, the peeling force is stronger than the adhesive force between the protective tape 10 and the wafer 9 at this part. tape 11
Since the adhesive force between the protective tape 10 and the protective tape 10 is increased, it becomes possible to reliably peel the protective tape 10 from the surface of the wafer 9.

〔Effect of the invention〕

As is clear from the above explanation, according to the present invention, the adhesive force between the protective tape and the release tape can be made larger than the adhesive force between the wafer and the protective tape by extremely simple structural changes. It is possible to provide a protective tape peeling device and a protective tape peeling method that have the advantage of being able to reliably peel off the wafer from the surface of the wafer, and can be expected to have significant economical and reliability improvement effects.

[Brief explanation of drawings]

Fig. 1 is a diagram showing a schematic structure of a protective tape peeling device according to an embodiment of the present invention, Fig. 2 is a diagram showing a process order of a protective tape peeling method according to an embodiment of the present invention, and Fig. 3 is a diagram showing a conventional protective tape peeling device. FIG. 4 is a diagram showing a schematic structure of a tape peeling device. FIG. 4 is a diagram showing a conventional protective tape peeling method in order of steps. In the figure, ■ is a loader, 1a is a wafer carrier, 2 is an unloader, 2a is a wafer carrier, 3 is an unwinding drum, 4 is a feed roller, 5 is a winding roller, 6 is a vacuum chunk, 6a is a heater, and 7 is a heating roller. 7a is an air cylinder, 8 is a winding drum, 9 is a wafer, 10 is a protective tape, and 11 is a release tape. Rito

Claims (1)

[Scope of Claims] [1] A release tape (11) is attached to the surface of the protective tape (10) attached to the surface of the wafer (9) that is not attached to the wafer (9), and the Tape (11
) in which the protective tape (10) attached to the wafer (9) is peeled off from the wafer (9);
A protective tape peeling device characterized by comprising a pressure roller (7) that presses and brings the protective tape (10) into close contact with each other. [2] A tape peeling method using the tape peeling device according to claim 1, wherein the pressure roller (7) is used to peel the protective tape (10).
) at the end of the wafer (9), the release tape (11) and the protective tape (10) are pressed and brought into close contact with each other.
) and the protective tape (10), by making the adhesive force between the protective tape (10) and the peeling tape (11) larger than the adhesive force between the protective tape (10) and the wafer (9). A protective tape peeling method characterized by peeling.