JP2011233697A - Sheet peeling apparatus and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to suppress the reduction of yield due to dust falling onto an adherend such as a semiconductor wafer.SOLUTION: A sheet peeling apparatus 10 makes supporting means 11 supporting a semiconductor wafer W and a peeling tape PT relatively move by moving means 15 to peel an adhesive sheet S away from the semiconductor wafer W. In this peeling step, peeling attitude formation means 14 contacts with an adhesive surface of the adhesive sheet peeled away so as to oppose to unpeeled adhesive sheet S. The peeling attitude formation means 14 presses the semiconductor wafer W to the supporting means 11 side by the elastic force of the adhesive sheet S to form the peeling attitude of the adhesive sheet S. When the adhesive sheet S is peeled away, controlling means 17 controls the operation of the moving means 15 so that a folded sheet part is formed between the peeling attitude formation means 14 and the semiconductor wafer W from which the adhesive sheet S is peeled away in a planar view.

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention relates to a sheet peeling method in which a peeling tape is bonded to an adhesive sheet affixed to an adherend, and the adhesive sheet can be peeled through the peeling tape. The present invention relates to an apparatus and a peeling method.

  In the process of processing a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”), a protective adhesive sheet is attached to the circuit surface of the wafer, and various processes such as backside grinding are performed. After being mounted on the ring frame, the adhesive sheet is peeled off before dicing. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the step of peeling the adhesive sheet from the wafer is performed by pressing a peeling tape onto the adhesive sheet with a pressing head and pasting it, and then moving a roller around the peeling tape with respect to the wafer.

  Moreover, what is shown by FIG. 5 (A) is also known as an apparatus which peels an adhesive sheet using the tape for peeling. The peeling device 80 shown in the figure holds the supporting means 81 for supporting the wafer W to which the adhesive sheet S is attached from below and the peeling tape PT attached to the adhesive sheet S, and moves relative to the supporting means 81. A chuck 82 that can peel off the adhesive sheet S and a roller 83 that presses the adhesive sheet S folded back during peeling to the support means 81 side are provided. The lower end side of the roller 83 in the same figure is in contact with the fold position Sp of the adhesive sheet S and uses the elasticity of the adhesive sheet S to press the wafer W toward the support means 81, thereby bonding the wafer W. The sheet S is prevented from being lifted upward together with the sheet S, and is peeled off without applying stress to the wafer W.

JP 2007-36111 A

  However, in the peeling device shown in FIG. 5A, a substantially half region on the right side of the roller 83, that is, a region indicated by reference numeral D1 in the drawing protrudes from the turn-back position Sp. For this reason, dust or the like adhering to the adhesive exposed on the edge of the adhesive sheet S adheres to the roller 83 and falls onto the circuit surface of the wafer W, thereby damaging the circuit and yielding the yield of semiconductor chips. There is an inconvenience that it significantly reduces. This is because in recent semiconductor manufacturing processes, when one dust is detected, a chip that is statistically located within a circle with a radius of several tens of millimeters (for example, 25 mm) centered on the dust is treated as a defective chip. This is because an inspection standard for re-inspecting and discarding these chips is provided, and depending on the chip size, hundreds of chips treated as defective are produced. In particular, when the wafer W is separated into pieces by the tip dicing method, fine irregular shaped chips such as triangles formed on the outer periphery of the wafer W are attached to the roller 83 and rolled up, and drop onto the circuit surface. Therefore, the inconvenience is likely to occur.

  Here, although the present inventor has intensively studied to eliminate the inconvenience and devised a configuration indicated by a solid line in FIG. 5B, there is room for improvement described below.

  In the configuration shown by the solid line in FIG. 5B, the position of the roller 83 is shifted leftward as compared with the configuration in FIG. 5A, and the position of the turn-back position Sp and the right end of the roller 83 in the drawing are aligned. Yes. However, in the configuration of FIG. 5B, the lower end position of the roller 83 is shifted to the left side, so that the folding position Sp cannot be reliably pressed to the wafer W side. That is, when the lower end position of the roller 83 is shifted to the left side in the drawing, the adhesive sheet S rises in an arc shape on the right side of the lower end position of the roller 83 due to its own elasticity. There is a problem that the pressing force to be pressed to the side is insufficient, the wafer W is lifted together with the adhesive sheet S, and stress is applied to the wafer W.

  In order to solve such a problem, as shown by a two-dot chain line in the figure, if the roller 83 is made thin, the folding position Sp and the lower end position of the roller 83 can be brought close to each other so that the insufficient pressing force can be solved. Conceivable. However, in this case, the bending rigidity of the roller 83 is reduced, the roller 83 is bent upward by the elastic force of the adhesive sheet S that is folded back, and the pressing force for pressing the wafer W toward the support means 81 by the adhesive sheet S is insufficient. It becomes easy to do. In particular, when the roller 83 becomes longer as the diameter of the wafer W increases, the bending deformation of the roller 83 becomes significant, and a pressing force for pressing the wafer W with the adhesive sheet S cannot be sufficiently applied.

[Object of invention]
The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can suppress that a dust falls to a to-be-adhered body and a yield falls.
Moreover, the objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can prevent that a to-be-adhered body is lifted with an adhesive sheet at the time of peeling of an adhesive sheet.

In order to achieve the above object, the present invention is a sheet peeling apparatus for peeling an adhesive sheet affixed to one surface of an adherend via a peeling tape,
Support means for supporting the adherend, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, and an adhesive sheet peeled so as to face the unpeeled adhesive sheet A peeling posture forming means for forming a peeling posture of the adhesive sheet by pressing the adherend to the supporting means side by the elastic force of the adhesive sheet, and the support means and the peeling tape are relatively moved. Moving means for controlling, and control means for controlling the operation of each means,
When the control means peels the adhesive sheet from the adherend, a peeling posture is formed so as to form a folded sheet portion between the peel posture forming means and the adherend from which the adhesive sheet has been peeled in plan view. The configuration is such that the means and the moving means are controlled.

  In the present invention, the peeling posture forming means includes a peeling roller that is rotatable while being in contact with the adhesive surface of the peeled adhesive sheet, and the deformation of the peeling roller caused by the elastic force of the adhesive sheet in contact with the peeling roller. It is preferable to adopt a configuration including support means that can be suppressed.

  In addition, a configuration in which the support means includes an adhesive roller that adheres dust generated by peeling of the adhesive sheet is preferably employed.

  Furthermore, you may take the structure of providing the attraction | suction means which attracts | sucks the dust generated by peeling of the said adhesive sheet.

Further, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet attached to one surface of an adherend through a peeling tape,
Supporting the adherend by support means;
A step of feeding out the peeling tape;
A step of applying a peeling tape to the adhesive sheet;
Contacting the adhesive surface of the adhesive sheet peeled so as to face the unpeeled adhesive sheet, and pressing the adherend to the support means side by the peeling posture forming means by the elastic force of the adhesive sheet, the peeling posture of the adhesive sheet Forming a step;
Forming a folded sheet portion between the peeling posture forming means and the adherend from which the adhesive sheet has been peeled in plan view;
A step of relatively moving the supporting means and the peeling tape is employed.

  According to the present invention, since the folded sheet portion is formed on the adhesive sheet positioned between the peeling posture forming means and the adherend, dust generated by peeling of the adhesive sheet adheres to the peeling posture forming means and falls. However, the dust can be received on the folded sheet portion. Thereby, it is possible to prevent the dust from falling on the adherend, and when the adherend is a wafer, it is possible to prevent a decrease in the yield of the semiconductor chips.

  Further, since the peeling posture forming means has the peeling roller and the support means capable of suppressing the deformation of the peeling roller, even if the peeling roller is thinned, the peeling roller is bent and deformed by the elastic force of the adhesive sheet by the support means. This can be prevented. Thereby, it can be avoided that the pressing force of the adhesive sheet pressing the adherend toward the support means is insufficient, and it is possible to prevent the adherend from being lifted following the adhesive sheet at the time of peeling. It becomes.

  Furthermore, when the support means has an adhesive roller for adhering dust or a suction means for sucking dust, it is possible to more effectively prevent the dust from falling onto the adherend.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. The partial front view which shows the middle of peeling of an adhesive sheet. (A)-(D) are sticking operation | movement explanatory drawing of the tape for peeling. The fragmentary sectional view of the support means which concerns on a modification. (A) And (B) is explanatory drawing which shows a part of peeling apparatus which concerns on a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3, a sheet peeling apparatus 10 includes a supporting means 11 for holding a wafer W as an adherend having an adhesive sheet S attached to a circuit surface (upper surface in FIG. 1), and a strip-like peeling tape PT. The feeding means 12 for feeding out, the sticking means 13 for sticking the peeling tape PT to the outer edge side of the adhesive sheet S, and the peeling posture used for peeling the adhesive sheet S stuck to the wafer W via the peeling tape PT A forming unit 14, a moving unit 15 that relatively moves the peeling tape PT affixed to the adhesive sheet S and the supporting unit 11 in opposite directions, and a control unit 17 that controls operations of the units 11 to 15 are provided. Configured. The peeling tape PT employs a heat-sensitive adhesive tape. Further, the adhesive sheet S in the present embodiment has an adhesive layer on one surface of the base material sheet, and is adhered to the wafer W via this adhesive layer.

  The support means 11 is disposed inside the opening of the ring frame RF, and is integrated with the ring frame RF from the opposite surface (lower surface in FIG. 1) side of the circuit surface via the dicing sheet DS, and is attached to the circuit surface. It consists of a table that sucks and holds the wafer W to which S is attached on the upper surface in FIG.

  The feeding means 12 includes a support shaft 18 that supports a peeling tape PT that is supported and wound by a frame (not shown) so that the peeling tape PT can be fed, a driving roller 20 that can rotate via a motor M1 as a driving device, A pinch roller 21 that sandwiches the peeling tape PT with the drive roller 20, a plate-shaped guide member 23 that supports the peeling tape PT from below in FIG. 1, and the peeling tape PT is sandwiched between the guide member 23. A rotatable press roller 25 and an elevating cylinder 26 as a driving device for elevating and lowering the press roller 25 are provided. The guide member 23 is provided so as to be movable in the left-right direction in FIG. 1 via a cylinder 27 as a drive device, and as shown in FIG. 3A, the lead end of the peeling tape PT sandwiched between press rollers 25. The region can be guided to a position where it can be gripped by a chuck 47 described later.

  The affixing means 13 includes a linear motion motor 49 as a drive device, and a pressing head 50 having a heater 50 </ b> A provided by the linear motion motor 49 so as to advance and retract in the vertical direction. The affixing means 13 adheres the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 50 by a chuck 47 described later. It has become. On the left side of the sticking means 13 in FIG. 1, the cutter blade 53, the tape receiving plate 54 having a recess provided below the cutter blade 53, and the cutter blade 53 are moved in the direction orthogonal to the paper surface in FIG. A tape cutting means 52 comprising a cutting cylinder 55 as a driving device to be driven and an upper and lower cylinder 56 as a driving device is provided.

  The peeling posture forming means 14 includes a peeling roller 59 that is rotatable while being in contact with the adhesive surface of the peeled adhesive sheet S, and an adhesive roller 60 as a support means that is in contact with the upper left side of the peeling roller 59 in the figure, The separation roller 59 and the adhesive roller 60 are supported, and the linear motion motor 61 as a drive device that can be displaced in the vertical direction in FIG. 1 and the linear motion motor 61 are connected to the linear motion motor 61 and above the support means 11. The drive motor 61 is provided with a drive device (not shown) that can move in the left-right direction in the figure. The adhesive roller 60 is formed to have a larger diameter than the peeling roller 59 and is provided so as to be able to rotate following the rotation of the peeling roller 59. The outer peripheral surface of the adhesive roller 60 is an adhesive surface, so that dust attached to the peeling roller 59 is removed. It can be removed from the peeling roller 59 by bonding.

  The moving means 15 is provided below the sticking means 13 and a linear motion motor 44 and its slider 45 as drive devices for moving the support means 11 in the left-right direction in FIG. And a chuck 47 as a driving device that can be gripped by 47A. The chuck 47 is configured to be movable in the left-right direction in FIG. 1 via a driving device (not shown).

  The control means 17 can be constituted by a sequencer, a personal computer or the like. The control means 17 is connected to an input means (not shown) composed of an operation panel and the like, and the operating conditions and data of each of the driving devices can be input by this input means. Further, the control means 17 has a function of determining conditions such as an operation direction, an operation amount, and an operation speed of each driving device and controlling them.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, after the peeling tape PT is pulled out from the support shaft 18 and passed between the drive roller 20 and the pinch roller 21, the lead end side of the peeling tape PT protrudes from the tip of the guide member 23, and the press The peeling tape PT is sandwiched between the roller 25 and the guide member 23.

  Then, when the wafer W, which is integrated with the ring frame RF on the upper surface of the support means 11 and has the adhesive sheet S attached to the circuit surface, is supported via a conveying means (not shown), the adhesive sheet S in FIG. The linear motor 44 moves the support means 11 so that the right outer edge position stops just below the pressing head 50.

  Next, as shown in FIG. 3A, the guide member 23 is advanced in the right direction in the drawing via the cylinder 27, and at the same time, the motor M1 is operated to rotate the driving roller 20 to release the peeling tape PT. To pay out. Thereby, the guide member 23 and the lead end side of the peeling tape PT are positioned between the gripping members 47 </ b> A of the chuck 47. When the press roller 25 is retracted upward and the guide member 23 is retracted, the peeling tape PT is left between the gripping members 47A and is gripped by the operation of the chuck 47. Thereafter, the chuck 47 is moved to a position indicated by a two-dot chain line in FIG. 3A by a driving device (not shown), the peeling tape PT is pulled out, and the peeling tape PT is peeled so as to face the adhesive sheet S below the pressing head 50. The tape PT is positioned.

  Next, as shown in FIG. 3B, when the pressing head 50 is moved downward by the linear motion motor 49, the peeling tape PT is pressed down and comes into contact with the adhesive sheet S, and the peeling tape PT becomes a heater. It is heated by 50A and adheres to the adhesive sheet S. Thereafter, the peeling tape PT is sandwiched between the press roller 25 and the guide member 23, and the cylinders 55 and 56 are operated to cut the peeling tape PT with the cutter blade 53 on the tape receiving plate 54 (see FIG. 3C). ).

  After the peeling tape PT is cut, as shown in FIG. 3D, the chuck 47 is moved leftward by a driving device (not shown), and folded back so that the peeling tape PT faces the adhesive sheet S on the wafer W. . Next, the separation roller 59 is moved above the folding position via a driving device (not shown). Next, the peeling roller 59 is displaced in the vertical direction via the linear motor 61, and the distance H (see FIG. 2) between the peeling roller 59 and the wafer W is adjusted.

  Thereafter, the control means 17 moves the chuck 47 to the left in FIG. 2 via the linear motor 44 so that the peeling tape PT attached to the adhesive sheet S and the support means 11 move relative to each other in the opposite direction. The support means 11 is moved at the same speed in the right direction in FIG. As a result, the peeled adhesive sheet S and the unpeeled adhesive sheet S are folded back so that the folded position Sp of the adhesive sheet S is formed, and the adhesive sheet S is peeled from the wafer W. At this time, the folded sheet portion SA is formed between the peeling roller 59 and the wafer W from which the adhesive sheet S has been peeled in plan view.

  As shown in FIG. 2, during the peeling of the adhesive sheet S, the peeling roller 59 maintains a position apart from the turn-back position Sp by a certain distance, and abuts on the adhesive surface side of the peeled adhesive sheet S. By rotating according to the progress of peeling, the folded sheet portion SA continues to stop at a predetermined position in a state where the folded sheet portion SA is formed. Further, the upward force acts on the peeling roller 59 due to the elastic force of the folded adhesive sheet S, and the drag force is exerted by the peeling roller 59 and the adhesive roller 60. Thus, a peeling posture around the turn-back position Sp is formed while the wafer W is pressed toward the support means 11 side, that is, the lower side. At this time, since the peeling roller 59 is pressed from above by the adhesive roller 60, the peeling roller 59 is prevented from being bent and deformed by the elastic force of the folded adhesive sheet S.

  Here, as shown in FIG. 2, even if dust adhered to the peeling roller 59 or the adhesive roller 60 falls through the peeled adhesive sheet S, the folded sheet portion SA exists, so that the wafer W It is possible to prevent the dust from falling on the circuit surface and damaging the circuit surface of the wafer W. The adhesive roller 60 is also provided at a position that does not protrude to the right side of the folded sheet portion SA from the right end in FIG. As a result, dust falling from the adhesive roller 60 onto the circuit surface of the wafer W can be received.

  When the peeling of the adhesive sheet S is finished, the wafer W is transported to the next process by a transporting unit (not shown), and the adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting unit (not shown). Then, after the holding means 11, the peeling roller 59, the adhesive roller 60, and the chuck 47 are returned to the initial positions, the same operation as described above is repeated.

  Therefore, according to such an embodiment, it is possible to suppress a drop in yield due to dust falling on the wafer W. Further, it is possible to prevent the wafer W from being lifted together with the adhesive sheet S when the adhesive sheet S is peeled off. Further, since the adhesive roller 60 is in contact with the upper side of the peeling roller 59, even if the peeling roller 59 is thinned and the rigidity is lowered, the peeling roller 59 can be prevented from being bent and deformed by the elastic force of the adhesive sheet S. . Accordingly, it is possible to apply an appropriate pressing force to the wafer W via the adhesive sheet S by the peeling roller 59, and it is possible to avoid the wafer W from being broken and stressed due to lifting. In addition, by reducing the diameter of the peeling roller 59, it is possible to secure a sufficient pressing force by the peeling roller 59 and better prevent dust from falling onto the circuit surface of the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the support means can be variously modified, and a plurality of adhesive rollers 60 shorter than the peeling roller 59 are provided, or a belt member that rotates by the rotation of the peeling roller 59 is used instead of the adhesive roller 60. Also good. Further, the adhesive roller 60 does not have to have a larger diameter than the peeling roller 59 as long as the bending deformation of the peeling roller 59 can be suppressed.

  Furthermore, as shown in FIG. 4, a suction means 65 for sucking dust may be provided. The suction means 65 is provided so as to cover the adhesive roller 60 from above, and includes a chamber 66 that can accommodate dust therein, and a hose 67 that is connected to a vacuum pump (not shown) and communicates with the inside of the chamber 66. Dust adhering to the adhesive roller 60 can be discharged from the chamber 66 through the hose 67 to the outside of the apparatus.

  In the embodiment, the adhesive roller 60 in the peeling posture forming unit 14 may be omitted. However, the pressure roller 60 is provided with the adhesive roller 60 to suppress bending deformation of the peeling roller 59 and press the wafer W. This is advantageous in that it can be better exhibited.

Furthermore, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.
The peeling tape PT may employ a pressure-sensitive adhesive tape in addition to the heat-sensitive adhesive tape.

Further, the peeling operation of the adhesive sheet S is performed by stopping the movement of the chuck 47 in the horizontal direction in the drawing and moving the peeling posture forming means 14 and the support means 11 as long as the folded sheet portion SA is formed as described above. Alternatively, the control means 17 may control the support means 11 to stop the movement in the left-right direction in the figure and move the peeling posture forming means 14 and the chuck 47.
In addition, the driving device in the embodiment employs electric devices such as a rotation motor, a linear motion motor, a single axis robot, and an articulated robot, actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support means 12 Feeding means 13 Sticking means 14 Peeling attitude | position formation means 15 Moving means 17 Control means 59 Peeling roller 60 Adhesive roller (support means)
65 Suction means PT Peeling tape S Adhesive sheet SA Folded sheet W Semiconductor wafer (Substrate)

Claims (5)

A sheet peeling apparatus for peeling an adhesive sheet attached to one surface of an adherend through a peeling tape,
Support means for supporting the adherend, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, and an adhesive sheet peeled so as to face the unpeeled adhesive sheet A peeling posture forming means for forming a peeling posture of the adhesive sheet by pressing the adherend to the supporting means side by the elastic force of the adhesive sheet, and the support means and the peeling tape are relatively moved. Moving means for controlling, and control means for controlling the operation of each means,
When the control means peels the adhesive sheet from the adherend, a peeling posture is formed so as to form a folded sheet portion between the peel posture forming means and the adherend from which the adhesive sheet has been peeled in plan view. The sheet peeling apparatus characterized by controlling the means and the moving means.   The peeling posture forming means includes a peeling roller that is rotatable while being in contact with the adhesive surface of the peeled adhesive sheet, and a support that is in contact with the peeling roller and can suppress deformation of the peeling roller caused by the elastic force of the adhesive sheet. The sheet peeling apparatus according to claim 1, further comprising: means.   3. The sheet peeling apparatus according to claim 2, wherein the support means includes an adhesive roller that adheres dust generated by peeling of the adhesive sheet.   4. The sheet peeling apparatus according to claim 1, further comprising suction means for sucking dust generated by peeling of the adhesive sheet. A sheet peeling method for peeling an adhesive sheet attached to one surface of an adherend through a peeling tape,
Supporting the adherend by support means;
A step of feeding out the peeling tape;
A step of applying a peeling tape to the adhesive sheet;
Contacting the adhesive surface of the adhesive sheet peeled so as to face the unpeeled adhesive sheet, and pressing the adherend to the support means side by the peeling posture forming means by the elastic force of the adhesive sheet, the peeling posture of the adhesive sheet Forming a step;
Forming a folded sheet portion between the peeling posture forming means and the adherend from which the adhesive sheet has been peeled in plan view;
A sheet peeling method comprising: a step of relatively moving the support means and the peeling tape.

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