TW201810409A - Sheet sticking apparatus and sticking method - Google Patents
Sheet sticking apparatus and sticking method Download PDFInfo
- Publication number
- TW201810409A TW201810409A TW106117053A TW106117053A TW201810409A TW 201810409 A TW201810409 A TW 201810409A TW 106117053 A TW106117053 A TW 106117053A TW 106117053 A TW106117053 A TW 106117053A TW 201810409 A TW201810409 A TW 201810409A
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- Taiwan
- Prior art keywords
- sheet
- adherend
- supporting
- support
- useless
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 38
- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 238000011084 recovery Methods 0.000 claims description 29
- 238000004064 recycling Methods 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 13
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000002716 delivery method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明，係有關於薄片貼附裝置及貼附方法。 The present invention relates to a thin-film sticking device and a sticking method.
以往，係已知一種薄片貼附裝置，其係於被黏物貼附接著薄片，並且能夠將該接著薄片切斷為預定形狀(例如，參照文獻1：日本特開2007-19239號公報)。 Conventionally, there is known a sheet attaching device that attaches an adhesive sheet to an adherend and can cut the adhesive sheet into a predetermined shape (for example, refer to Japanese Patent Application Publication No. 2007-19239).
於文獻1所記載之以往的薄片貼附裝置，係將被黏物搬入至支承被黏物的支承手段作的動作、將貼附有接著薄片的被黏物從支承手段搬出的動作、將切斷接著薄片的而產生的無用薄片回收的動作分別進行，因此在有每單位時間於被黏物貼附接著薄片的貼附能力(以下僅稱為「處理能力」)低落之缺陷。 The conventional sheet attachment device described in Document 1 is an operation of moving an adherend into a support means for supporting the adherend, an operation of removing the adherend with the adhered sheet from the support means, and cutting the The operation of recovering the unnecessary sheet caused by the broken sheet is performed separately. Therefore, there is a defect that the attaching ability (hereinafter referred to simply as "processing capability") of the adhered sheet to the adherend per unit time is low.
本發明之目的，係在於提供一種薄片貼附裝置及貼附方法，其係能夠防止每單位時間的處理能力低落。 An object of the present invention is to provide a thin-film sticking device and a sticking method, which can prevent a decrease in processing capacity per unit time.
本發明之薄片貼附裝置，係具備：支承手段，係支承被黏物；按壓手段，係將接著薄片按壓並貼附於藉由前述支承手段所支承的被黏物；切斷手段，係以使接著薄片部 分殘留於前述被黏物的方式，將貼附於該被黏物的接著薄片切斷為預定形狀；以及回收手段，係將前述接著薄片中前述接著薄片部分以外的無用薄片回收；前述支承手段，係設置為：於前述回收手段所致之前述無用薄片的回收當中，能夠容許對於前述支承手段搬入被黏物以及從前述支承手段搬出被黏物之至少一方。 The sheet attachment device of the present invention includes: a supporting means for supporting the adherend; a pressing means for pressing and attaching the subsequent sheet to the adherend supported by the supporting means; and a cutting means for Make the sheet part A method of separating the adhered material to the adherend, cutting the adhesive sheet attached to the adhered material into a predetermined shape; and a recovery means for recovering an unnecessary sheet other than the adhesive sheet portion of the adhesive sheet; the support means It is provided that, in the recovery of the useless sheet by the recovery means, at least one of the support means can be carried in and out of the support means can be allowed.
於本發明之薄片貼附裝置中，係較佳為：前述支承手段，係具備：被黏物支承手段，係支承前述被黏物；無用薄片支承手段，係位於該被黏物支承手段的外側且支承前述無用薄片；以及移動手段，係使前述被黏物支承手段及前述無用薄片支承手段作相對移動。 In the sheet attaching device of the present invention, it is preferable that the supporting means includes: an adherend supporting means for supporting the adherend; and an unnecessary sheet supporting means located outside the supporting means for the adherend. And supporting the useless sheet; and moving means for relatively moving the adherend support means and the useless sheet support means.
於本發明之薄片貼附裝置中，係較佳為：前述無用薄片支承手段，係具備能夠使前述被黏物出入的開口。 In the sheet attaching device of the present invention, it is preferable that the useless sheet supporting means includes an opening through which the adherend can pass in and out.
本發明之薄片貼附裝置，係具備：清掃手段，係清掃前述被黏物支承手段以及受到該被黏物支承手段所支承的支承對象物之至少一方的表面。 The sheet attaching device of the present invention includes cleaning means for cleaning at least one of the surface of the adherend support means and a support object supported by the adherend support means.
本發明之薄片貼附方法，其特徵為：係具備：支承步驟，係藉由支承手段支承被黏物；按壓步驟，係將接著薄片按壓並貼附於藉由前述支承手段所支承的被黏物；切斷步驟，係以使接著薄片部分殘留於前述被黏物的方式，將貼附於該被黏物的接著薄片切斷為預定形狀；以及回收步驟，係將前述接著薄片中前述接著薄片部分以外的無用薄片回收；於前述回收步驟所致之前述無用薄片的回收當中，實施對於前述支承手段搬入被黏物以及從前述支承手 段搬出被黏物之至少一方。 The sheet attaching method of the present invention is characterized by comprising: a supporting step of supporting the adherend by a supporting means; and a pressing step of pressing and attaching the subsequent sheet to the adhered member supported by the supporting means. A cutting step of cutting the adhesive sheet adhered to the adherend to a predetermined shape so that the adhesive sheet partially remains on the adherend; and a recycling step of cutting the adhesive in the adhesive sheet. Recycling of unnecessary sheets other than the sheet part; during the recovery of the unnecessary sheet caused by the foregoing recovery step, the support means is moved into the adherend and the support hand is removed from the support means. The paragraph moves out at least one of the stickies.
依據以上般之本發明，於無用薄片的回收當中，能夠進行對於前述支承手段搬入被黏物以及從前述支承手段搬出被黏物之至少一方，故能夠防止每單位時間的處理能力降低。 According to the present invention as described above, at least one of carrying in the adherend by the support means and removing the adherend from the support means can be performed during the recovery of the useless sheet, so that it is possible to prevent a decrease in the processing capacity per unit time.
另外，若將被黏物支承手段設置為能夠相對於無用薄片支承手段移動，則在將藉由無用薄片支承手段所支承的無用薄片以回收手段作回收時，能夠將接著薄片部分所貼附的被黏物從無用薄片或回收手段切離、從支承手段將被黏物搬出或是將別的被黏物搬入至支承手段，故能夠防止每單位時間的處理能力降低。 In addition, if the adherend support means is provided to be movable relative to the useless sheet support means, when the useless sheet supported by the useless sheet support means is recovered by the recovery means, the adhered part can be attached. The adherend is cut off from useless flakes or recycling means, the adherend is carried out from the support means, or another adherend is brought into the support means, so that it is possible to prevent a reduction in processing capacity per unit time.
另外，若無用薄片支承手段具備開口，則能夠透過該開口進行被黏物朝向支承手段的搬入或是從支承手段之被黏物的搬出。 In addition, if the useless sheet supporting means includes an opening, the adherend can be carried in or out of the supporting means through the opening.
另外若設置清掃手段，因能夠清掃被黏物支承手段或被黏物的被黏面，故能夠防止塵埃附著於被黏物。 In addition, if a cleaning means is provided, it is possible to clean the adhered support means or the adhered surface of the adherend, so that dust can be prevented from adhering to the adherend.
10‧‧‧薄片貼附裝置 10‧‧‧ Sheet attachment device
20‧‧‧支承手段 20‧‧‧Support
21‧‧‧內側載台 21‧‧‧Inner stage
21A‧‧‧支承面 21A‧‧‧ bearing surface
22‧‧‧外側載台 22‧‧‧outer stage
22A‧‧‧無用薄片支承面 22A‧‧‧Useless sheet bearing surface
22B‧‧‧凹部 22B‧‧‧ Recess
22C‧‧‧開口 22C‧‧‧Open
23‧‧‧直動馬達 23‧‧‧Direct acting motor
23A‧‧‧輸出軸 23A‧‧‧Output shaft
30‧‧‧送出手段 30‧‧‧ delivery method
31‧‧‧支承滾輪 31‧‧‧Support roller
32A‧‧‧導引滾輪 32A‧‧‧Guide Roller
32B‧‧‧導引滾輪 32B‧‧‧Guide Roller
33‧‧‧直動馬達 33‧‧‧Direct acting motor
33A‧‧‧輸出軸 33A‧‧‧Output shaft
33B‧‧‧按壓構件 33B‧‧‧Pressing member
34A‧‧‧測力計 34A‧‧‧ Dynamometer
34B‧‧‧剝離板 34B‧‧‧ peeling plate
35‧‧‧驅動滾輪 35‧‧‧Drive roller
35A‧‧‧直動馬達 35A‧‧‧Direct acting motor
35B‧‧‧夾壓滾輪 35B‧‧‧Pinch roller
36‧‧‧回收滾輪 36‧‧‧Recycling roller
37‧‧‧框架 37‧‧‧Frame
38‧‧‧線性馬達 38‧‧‧ Linear Motor
39‧‧‧線性馬達 39‧‧‧ Linear Motor
40‧‧‧按壓手段 40‧‧‧Pressing means
41‧‧‧線性馬達 41‧‧‧ Linear Motor
41A‧‧‧滑件 41A‧‧‧Slider
41B‧‧‧滑件 41B‧‧‧Slider
42‧‧‧托架 42‧‧‧ Bracket
43‧‧‧直動馬達 43‧‧‧Direct acting motor
43A‧‧‧輸出軸 43A‧‧‧Output shaft
43B‧‧‧托架 43B‧‧‧Carriage
44‧‧‧按壓滾輪 44‧‧‧Press the wheel
50‧‧‧切斷手段 50‧‧‧ cutting means
51‧‧‧多關節機械手臂 51‧‧‧Multi-joint robot arm
51A‧‧‧作業臂 51A‧‧‧Working arm
60‧‧‧回收手段 60‧‧‧Recycling means
61‧‧‧框架 61‧‧‧Frame
62‧‧‧直動馬達 62‧‧‧Direct acting motor
63‧‧‧驅動滾輪 63‧‧‧Drive roller
64‧‧‧夾壓滾輪 64‧‧‧Pinch roller
65‧‧‧回收滾輪 65‧‧‧Recycling roller
70‧‧‧移送手段 70‧‧‧ transfer means
71‧‧‧吸附工具 71‧‧‧Adsorption tool
80‧‧‧清掃手段 80‧‧‧cleaning means
81‧‧‧線性馬達 81‧‧‧ Linear Motor
81A‧‧‧滑件 81A‧‧‧Slider
82‧‧‧直動馬達 82‧‧‧Direct acting motor
82A‧‧‧輸出軸 82A‧‧‧Output shaft
83‧‧‧黏著滾輪 83‧‧‧ Adhesive roller
83A‧‧‧托架 83A‧‧‧Carriage
RS‧‧‧原料 RS‧‧‧ raw materials
AS‧‧‧接著薄片 AS‧‧‧thin sheet
RL‧‧‧剝離薄片 RL‧‧‧ peeling sheet
US‧‧‧無用薄片 US‧‧‧Useless sheet
WF‧‧‧被黏物 WF‧‧‧ Adhesive
WF1‧‧‧被黏面 WF1‧‧‧ Adhesive surface
第1圖，係表示本發明之一實施形態之薄片貼附裝置的側視圖。 FIG. 1 is a side view showing a sheet attaching apparatus according to an embodiment of the present invention.
第2圖，係薄片貼附裝置的動作說明圖。 Fig. 2 is an operation explanatory diagram of a sheet attaching device.
以下，根據圖式對本發明之一實施形態進行說明。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
又，本實施形態之X軸、Y軸、Z軸，係各自正交的關係，X軸及Y軸係預定平面內的軸，Z軸係正交於前述預定平面的軸。進而，於本實施形態中，在以從與Y軸平行的第1圖中的手邊方向觀察的情形為基準而表示方向時，「上」係Z軸的箭號方向而「下」係其反方向，「左」係X軸的箭號方向而「右」係其反方向，「前」係與Y軸平行的第1圖中手邊方向而「後」係其反方向。 The X-axis, Y-axis, and Z-axis of this embodiment are orthogonal to each other. The X-axis and Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in the present embodiment, when the direction is shown on the basis of the case when viewed from the hand direction in the first figure parallel to the Y axis, "up" indicates the direction of the arrow on the Z axis and "down" indicates the opposite. Direction, "left" is the direction of the arrow on the X axis and "right" is the opposite direction, "front" is the direction on the hand in Figure 1 parallel to the Y axis, and "rear" is the opposite direction.
於第1圖中，薄片貼附裝置10，係具備：支承手段20，係支承作為被黏物的半導體晶圓(以下，僅稱為「晶圓」)WF；送出手段30，係將接著薄片AS送出至緊臨藉由支承手段20所支承的晶圓WF的被黏面WF1的位置；按壓手段40，係於藉由支承手段20所支承的晶圓WF將接著薄片AS作按壓而貼附；切斷手段50，係以使接著薄片部分AS1(參照第2圖)殘留於晶圓WF的方式，將貼附於該晶圓WF的接著薄片AS切斷為預定形狀；回收手段60，係將接著薄片AS中接著薄片部分AS1以外的無用薄片US回收；以及移送手段70，係移送晶圓WF。 In FIG. 1, the sheet attaching device 10 includes support means 20 for supporting a semiconductor wafer (hereinafter, simply referred to as a “wafer”) WF as an adherend, and a sending means 30 for attaching a sheet. The AS is sent to a position immediately adjacent to the adhered surface WF1 of the wafer WF supported by the support means 20; the pressing means 40 is attached to the wafer WF supported by the support means 20 to press and adhere the next sheet AS The cutting means 50 cuts the bonding sheet AS attached to the wafer WF into a predetermined shape so that the bonding sheet portion AS1 (refer to FIG. 2) remains on the wafer WF; Unused sheets US other than the adjoining sheet part AS1 of the adhering sheet AS are recovered; and the transfer means 70 is used to transfer the wafer WF.
支承手段20，係具備：支承面21A，係能夠藉由減壓泵浦或真空抽氣機等未圖示的減壓手段作吸附保持；並具備：作為被黏物支承手段的內側載台21，係支承晶圓WF；作為無用薄片支承手段的外側載台22，係位於內側載台21的外側，並支承無用薄片US；以及作為驅動機器的直動馬達23，係使內側載台21及外側載台22作相對移動的移動手段，並藉由輸出軸23A支承內側載台21； 並設置為：於回收手段60所致之無用薄片US的回收當中，能夠容許從支承手段20搬出晶圓WF。 The supporting means 20 is provided with a supporting surface 21A capable of being adsorbed and held by a pressure reducing means (not shown) such as a decompression pump or a vacuum pump; and an inner stage 21 as a means for supporting an adherend. , Supporting the wafer WF; the outer stage 22 as the useless sheet supporting means is located outside the inner stage 21 and supports the useless sheet US; and the direct-acting motor 23 as a driving machine is the inner stage 21 and The outer stage 22 is a moving means for relative movement, and the inner stage 21 is supported by the output shaft 23A; In addition, it is provided to allow the wafer WF to be carried out from the support means 20 during the recovery of the useless sheet US caused by the recovery means 60.
外側載台22，係具備：無用薄片支承面22A，係與藉由內側載台21所支承的晶圓WF一起貼附有接著薄片AS，並支承藉由切斷手段50之切斷所形成的無用薄片US；凹部22B，係於其內部支承直動馬達23；以及開口22C，係設置於凹部22B的後側面，並能夠使晶圓WF出入；並設置為：能夠藉由未圖示的驅動機器作升降。 The outer stage 22 is provided with an unnecessary sheet supporting surface 22A, which is attached to the wafer WF supported by the inner stage 21 with an adhesive sheet AS, and supports the cutting formed by the cutting means 50 Useless sheet US; recessed portion 22B is connected to the internal motion motor 23; and opening 22C is provided on the rear side of the recessed portion 22B so that the wafer WF can be put in and out; The machine lifts.
送出手段30，係具備：支承滾輪31，係支承在剝離薄片RL的一方之面暫時接著有接著薄片AS的原料RS；導引滾輪32A、32B，係引導原料RS；作為驅動機器的直動馬達33，係將在與導引滾輪32A之間夾住原料RS的按壓構件33B藉由其輸出軸33A作支承；測力計34A，係支承導引滾輪32B，並作為能夠測定接著薄片AS的張力之張力檢測手段；作為剝離構件的剝離板34B，係從剝離薄片RL將接著薄片AS剝離；驅動滾輪35，係受到作為驅動機器的轉動馬達35A所驅動，並與夾壓滾輪35B一起將剝離薄片RL夾住；回收滾輪36，係受到未圖示之驅動機器所驅動，並以預定的張力回收剝離薄片RL；框架37，係支承構成該送出手段30的前述構成構件當中支承滾輪31及回收滾輪36以外的各構件；以及作為驅動機器的線性馬達38，係藉由未圖示之滑件將框架37作支承，且受到作為驅動機器的線性馬達39的滑件39A(參照第2圖)所支承。 The sending-out means 30 includes: a support roller 31, which is supported on one side of the peeling sheet RL, and is temporarily followed by a raw material RS adhering to the sheet AS; guide rollers 32A, 32B, which guide the raw material RS; 33. The pressing member 33B that sandwiches the raw material RS between the guide roller 32A and the guide roller 32A is supported by its output shaft 33A. The dynamometer 34A supports the guide roller 32B and can measure the tension of the sheet AS. The tension detecting means; the peeling plate 34B as a peeling member peels the adhesive sheet AS from the peeling sheet RL; the driving roller 35 is driven by a rotation motor 35A as a driving device, and the peeling sheet is pressed together with the pinch roller 35B RL is clamped; the recovery roller 36 is driven by a driving device (not shown) and recovers the peeling sheet RL with a predetermined tension; the frame 37 supports the support roller 31 and the recovery roller among the aforementioned constituent members constituting the feeding means 30 Each member other than 36; and a linear motor 38 as a driving device, the frame 37 is supported by a sliding member (not shown), and is received by the linear motor 39 as a driving device. Member 39A (refer to FIG. 2) is supported.
按壓手段40，係具備：作為驅動機器的直動馬達43，係透過托架42受到作為驅動機器的線性馬達41之滑件41A所支承；作為按壓構件的按壓滾輪44，係透過托架43B以能夠旋轉的方式受到直動馬達43的輸出軸43A所支承，並將接著薄片AS按壓於被黏面WF1。 The pressing means 40 includes a linear motor 43 as a driving device, which is supported by a slider 41A of a linear motor 41 as a driving device through a bracket 42, and a pressing roller 44 as a pressing member, which is provided through the bracket 43B. It is rotatably supported by the output shaft 43A of the linear motion motor 43 and presses the sheet AS on the adhered surface WF1.
切斷手段50，係具備：作為驅動機器的多關節機械手臂51；以及切斷刃52(參照第2圖)，係以裝卸自如的方式受到多關節機械手臂51的作業臂51A所支承。多關節機械手臂51，係能夠於其作業範圍內將裝設於作業臂51A者位移至任何位置、任何角度的所謂6軸機械手臂。 The cutting means 50 includes: a multi-joint robot arm 51 as a driving device; and a cutting blade 52 (see FIG. 2), which is detachably supported by a working arm 51A of the multi-joint robot arm 51. The multi-joint robot arm 51 is a so-called 6-axis robot arm capable of displacing a person installed on the operation arm 51A to any position and any angle within its working range.
回收手段60，係具備：框架61，係受到線性馬達41的滑件41B所支承；驅動滾輪63，係藉由受到框架61所支承的作為驅動機器的轉動馬達62所驅動，並與夾壓滾輪64一起將無用薄片US夾住；以及回收滾輪65，係藉由未圖示之驅動機器所驅動，並以預定的張力回收無用薄片US。 The recovery means 60 includes: a frame 61 supported by a slider 41B of a linear motor 41; and a driving roller 63 driven by a rotation motor 62 supported by the frame 61 as a driving device, and a pinch roller 64 clamps the useless sheet US together; and the recovery roller 65 is driven by a driving machine (not shown) and collects the useless sheet US with a predetermined tension.
移送手段70，係具備：多關節機械手臂51；以及吸附工具71，係以裝卸自如的方式受到多關節機械手臂51的作業臂51A所支承，並能夠藉由減壓泵浦或真空抽氣機等未圖示的減壓手段將晶圓WF作吸附保持。 The transfer means 70 includes: a multi-joint robot arm 51; and a suction tool 71, which is supported by the operating arm 51A of the multi-joint robot arm 51 in a detachable manner, and can be reduced in pressure by a pump or a vacuum pump The wafer WF is adsorbed and held by a pressure reducing means (not shown).
針對於以上之薄片貼附裝置10中，在晶圓WF的被黏面WF1貼附接著薄片AS的順序進行說明。 The procedure for attaching the sheet AS to the adhered surface WF1 of the wafer WF in the above-mentioned sheet attaching device 10 will be described.
首先，對於各構件配置在初始位置的第1圖中以實線所表示的狀態之薄片貼附裝置10，作業者將原料RS如該 圖中以實線所示般作裝設，並透過操作面板或個人電腦等未圖示的操作手段輸入自動運轉的訊號。如此，則送出手段30及回收手段60係驅動轉動馬達35A及62，捲取剝離薄片RL及接著薄片AS，當藉由測力計34A檢測出位於支承手段20上的接著薄片AS的張力成為預定值時，停止轉動馬達35A及62之驅動，成為待命狀態。接著，移送手段70驅動多關節機械手臂51及未圖示之減壓手段，藉由吸附工具71將晶圓WF作吸附保持後，當將吸附工具71插入至開口22C內而將晶圓WF載置於支承面21A上，支承手段20係驅動未圖示之減壓手段，將晶圓WF作吸附保持。接著，按壓手段40驅動直動馬達43，使按壓滾輪44下降而將接著薄片AS藉由預定的按壓力按壓於無用薄片支承面22A。此時，當位於支承手段20上的接著薄片AS的張力之上升受到測力計34A所偵測，則進行送出手段30驅動轉動馬達35A，並藉由捲取剝離薄片RL而將接著薄片AS送出，使該接著薄片AS的張力保持在預定值的控制。接著，送出手段30係驅動直動馬達33，以按壓構件33B與導引滾輪32A夾住接著薄片AS，而抑制該接著薄片AS的送出。 First, for the sheet attaching device 10 in a state shown by a solid line in FIG. 1 in which each member is arranged at an initial position, the operator sets the raw material RS as such. The installation is shown as a solid line in the figure, and signals for automatic operation are input through operation means such as an operation panel or a personal computer. In this way, the delivery means 30 and the recovery means 60 drive the rotation motors 35A and 62 to wind up the peeling sheet RL and the subsequent sheet AS. When the dynamometer 34A detects the tension of the subsequent sheet AS on the supporting means 20, the tension becomes predetermined. When the value is reached, the driving of the rotation motors 35A and 62 is stopped and the standby state is established. Next, the transfer means 70 drives the multi-joint robot arm 51 and a pressure reducing means (not shown), and after the wafer WF is held by the suction tool 71, the suction tool 71 is inserted into the opening 22C to load the wafer WF. The supporting means 20 is placed on the supporting surface 21A, and the supporting means 20 drives a pressure reducing means (not shown) to hold and hold the wafer WF. Next, the pressing means 40 drives the linear motion motor 43 to lower the pressing roller 44 to press the subsequent sheet AS on the useless sheet supporting surface 22A by a predetermined pressing force. At this time, when the increase in the tension of the adhesive sheet AS on the supporting means 20 is detected by the dynamometer 34A, the feeding means 30 is driven to drive the rotation motor 35A, and the adhesive sheet AS is wound out by winding the peeling sheet RL. Control to keep the tension of the adhesive sheet AS at a predetermined value. Next, the sending-out means 30 drives the linear motion motor 33 to sandwich the bonding sheet AS between the pressing member 33B and the guide roller 32A to suppress the feeding of the bonding sheet AS.
然後，支承手段20驅動直動馬達23，如第2圖所示，使內側載台21移動至上方後，按壓手段40驅動線性馬達41，使按壓滾輪44移動至右方，藉由該按壓滾輪44將接著薄片AS按壓於被黏面WF1及無用薄片支承面22A而貼附。此時，雖然伴隨著按壓滾輪44的移動而對於接 著薄片AS施加進一步的張力，然而當被測力計34A偵測到的瞬間，係進行送出手段30驅動線性馬達38、39，而以使測力計34A所檢測的張力不會偏離預定值的方式使框架37朝向左右方向及上下方向移動的控制。又，於接著薄片AS之貼附動作當中，切斷手段50係驅動多關節機械手臂51，從吸附工具71作工具替換為切斷刃52。 Then, the support means 20 drives the linear motion motor 23, and as shown in FIG. 2, after the inner stage 21 is moved upward, the pressing means 40 drives the linear motor 41 to move the pressing roller 44 to the right. 44 The adhesive sheet AS is pressed against the adhered surface WF1 and the unnecessary sheet support surface 22A and attached. At this time, although the docking is accompanied by the movement of the pressing roller 44 Further tension is applied to the sheet AS, however, at the moment detected by the dynamometer 34A, the sending means 30 drives the linear motors 38 and 39 so that the tension detected by the dynamometer 34A does not deviate from the predetermined value. A control for moving the frame 37 in the left-right direction and the up-down direction. Further, during the attaching operation following the sheet AS, the cutting means 50 drives the multi-joint robot arm 51 and replaces the suction tool 71 as a tool with a cutting blade 52.
當接著薄片AS的貼附結束，切斷手段50係驅動多關節機械手臂51，如第2圖中以兩點虛線所示，將切斷刃52刺穿接著薄片AS，並使該切斷刃52沿著晶圓WF的外周移動。藉此，接著薄片部分AS1殘留於晶圓WF上，並在該接著薄片部分AS1的外周形成無用薄片US。接著，支承手段20係驅動直動馬達23，如第2圖中以兩點虛線所示，使內側載台21復位至初始位置，並且移送手段70係驅動多關節機械手臂51，從切斷刃52作工具替換為吸附工具71。另外，回收手段60及按壓手段40係驅動轉動馬達62及線性馬達41，如第2圖中以兩點虛線所示，使框架61移動至右方向而回收無用薄片US。接著，在藉由回收手段60回收無用薄片US的當中，移送手段70係驅動多關節機械手臂51及未圖示的減壓手段，將吸附工具71插入至開口22C內而藉由該吸附工具71將晶圓WF作吸附保持，並從內側載台21將晶圓WF搬出至下個步驟。 When the attachment of the sheet AS is completed, the cutting means 50 drives the multi-joint robot arm 51. As shown by two dotted lines in FIG. 2, the cutting blade 52 pierces the sheet AS and makes the cutting blade 52 moves along the periphery of the wafer WF. Thereby, the adhesive sheet portion AS1 remains on the wafer WF, and an unnecessary sheet US is formed on the outer periphery of the adhesive sheet portion AS1. Next, the support means 20 drives the direct-acting motor 23, as shown by two dotted lines in FIG. 2 to reset the inner stage 21 to the initial position, and the transfer means 70 drives the multi-joint robot arm 51 from the cutting edge. 52 was replaced by the suction tool 71. In addition, the recovery means 60 and the pressing means 40 drive the rotation motor 62 and the linear motor 41, and move the frame 61 to the right as shown by two dotted lines in FIG. 2 to recover the useless sheet US. Next, among the unnecessary sheets US recovered by the recovery means 60, the transfer means 70 drives the multi-joint robot arm 51 and a pressure reducing means (not shown), inserts the suction tool 71 into the opening 22C, and uses the suction tool 71 The wafer WF is held by suction, and the wafer WF is carried out from the inner stage 21 to the next step.
接著，支承手段20係驅動未圖示的驅動機器，使外側載台22下降而從無用薄片支承面22A將無用薄片US 剝離。接著，送出手段30係驅動直動馬達33，解除以按壓構件33B與導引滾輪32A所致之接著薄片AS之夾持。接著，在回收手段60使轉動馬達62的驅動停止的狀態下，各手段係驅動各自的驅動機器，使各構件復位至初始位置。藉由該復位動作，預定之送出量的接著薄片AS係從剝離薄片RL被剝離而配置於支承手段20上，之後重覆於前述相同的動作。 Next, the supporting means 20 drives a driving device (not shown), lowers the outer stage 22, and removes the unnecessary sheet US from the unnecessary sheet supporting surface 22A. Peel off. Next, the sending-out means 30 drives the linear motion motor 33 and releases the nip between the sheet AS caused by the pressing member 33B and the guide roller 32A. Next, in a state where the recovery means 60 stops the driving of the rotation motor 62, each means drives its own driving device to reset each member to the initial position. With this reset operation, the next sheet AS having a predetermined delivery amount is peeled from the peeling sheet RL and placed on the supporting means 20, and then repeats the same operation as described above.
依據以上般之實施形態，於無用薄片US的回收當中，能夠進行晶圓WF朝向支承手段20的搬入以及從支承手段20之晶圓WF的搬出之至少一方，故能夠防止每單位時間的處理能力降低。 According to the above embodiment, at least one of the loading of the wafer WF toward the supporting means 20 and the carrying out of the wafer WF from the supporting means 20 can be performed during the recovery of the useless sheet US, so that the processing capacity per unit time can be prevented. reduce.
如以上般，為實施本發明之最佳的構成、方法等，雖以前述記載作揭示，然而本發明係不限於此。亦即，本發明雖係主要關於特定的實施形態受到圖示並說明，然而在不脫離本發明的技術思想及目的之範圍，能夠對於以上所述之實施形態，在形狀、材質、數量、其他詳細構成的方面，由發明所屬技術領域具有通常知識者施加各種變形。另外，前述所揭示之限定形狀、材質等的記載，係僅用以易於理解本發明之例示性的記載，而並非限定本發明者，故去除該等形狀、材質等之限定的一部分或是全部的限定之構件名稱之記載，亦包含於本發明。 As described above, although the best configuration, method, and the like for carrying out the present invention are disclosed in the foregoing description, the present invention is not limited thereto. That is, although the present invention is mainly illustrated and described with respect to a specific embodiment, within the scope of not departing from the technical idea and purpose of the present invention, the embodiment described above can be modified in shape, material, quantity, other As for the detailed structure, various modifications can be made by those skilled in the art to which the invention belongs. In addition, the above-mentioned descriptions of limited shapes, materials, and the like are only for illustrative purposes to facilitate understanding of the present invention, and are not intended to limit the present inventors. Therefore, a part or all of the restrictions on the shapes, materials, and the like are removed. The description of the limited component names is also included in the present invention.
例如，薄片貼附裝置10，係如第1圖中以兩點虛線所示，亦可具備：清掃手段80，係清掃作為受到內側載台21所支承的支承對象物之晶圓WF的表面之被黏面 WF1。如此之清掃手段80，係能夠例示一種構成，其係具備：作為驅動機器的直動馬達82，係受到設置於凹部22B內的作為驅動機器之線性馬達81的滑件81A所支承；以及作為去除構件的黏著滾輪83，係透過托架83A受到直動馬達82的輸出軸82A所支承，移送手段70將晶圓WF載置於支承面21A上之後，清掃手段80係驅動線性馬達81及直動馬達82，而能夠將黏著滾輪83一邊朝向被黏面WF1推彈一邊於左右方向往復移動。藉此，不僅能夠清掃被黏面WF1，還能夠將晶圓WF的姿勢沿著支承面21A作矯正。又，清掃手段80，係亦可清掃內側載台21的支承面21A，亦可清掃支承面21A及晶圓WF的被黏面WF1之兩方，亦可將支承對象物作為貼附有接著薄片部分AS1的晶圓WF，而清掃該接著薄片部分AS1的表面。 For example, as shown in FIG. 1 by two dotted lines, the sheet attaching device 10 may include a cleaning means 80 for cleaning the surface of the wafer WF which is a support object supported by the inner stage 21. Sticky surface WF1. Such a cleaning means 80 can exemplify a configuration including: a direct-acting motor 82 as a driving device; supported by a slider 81A as a linear motor 81 of the driving device provided in the recessed portion 22B; and as a removal The adhesive roller 83 of the component is supported by the output shaft 82A of the linear motion motor 82 through the bracket 83A. After the wafer WF is placed on the support surface 21A by the transfer means 70, the cleaning means 80 drives the linear motor 81 and the linear motion The motor 82 can reciprocate in the left-right direction while pushing the adhesive roller 83 toward the adhered surface WF1. Thereby, not only the adhered surface WF1 can be cleaned, but also the posture of the wafer WF can be corrected along the support surface 21A. The cleaning means 80 can also clean the support surface 21A of the inner stage 21, and can also clean both the support surface 21A and the adhered surface WF1 of the wafer WF. The support object can also be attached with an adhesive sheet. The wafer WF of part AS1 is cleaned, and the surface of the next sheet part AS1 is cleaned.
清掃手段80，作為去除構件亦可採用刷或刮刀材，亦可採用加壓泵浦或渦輪等氣體噴吹手段、減壓泵浦或真空抽氣機等吸引手段等，不採用亦可。 The cleaning means 80 may be a brush or a scraper material as a removing member, a gas blowing means such as a pressure pump or a turbine, a suction means such as a pressure reducing pump or a vacuum pump, or the like.
支承手段20，係亦可設置為在回收手段60所致之無用薄片US的回收當中，能夠容許晶圓WF搬入至支承手段20，此時，薄片貼附裝置10，在切斷手段50將接著薄片AS切斷為預定形狀，且移送手段70將支承面21A上的晶圓WF移送至下個步驟之後，回收手段60係驅動轉動馬達62及線性馬達41，使框架61移動至右方向而回收無用薄片US。接著，亦可在藉由回收手段60回收無用薄片US的當中，支承手段20係驅動直動馬達23，使內 側載台21復位至初始位置，並且移送手段70係驅動多關節機械手臂51及未圖示的減壓手段，藉由吸附工具71將晶圓WF載置於支承面21A上。又，亦可在藉由回收手段60回收無用薄片US的當中，如前述實施形態般，在移送手段70將支承面21A上的晶圓WF移送至下個步驟之後，將別的晶圓WF載置於支承面21A。 The supporting means 20 can also be set to allow the wafer WF to be carried into the supporting means 20 during the recovery of the useless sheet US caused by the recycling means 60. At this time, the sheet attaching device 10 will continue to the cutting means 50. After the sheet AS is cut into a predetermined shape, and the transfer means 70 transfers the wafer WF on the support surface 21A to the next step, the recovery means 60 drives the rotation motor 62 and the linear motor 41 to move the frame 61 to the right and collects Useless sheet US. Then, while the useless sheet US is recovered by the recovery means 60, the support means 20 drives the linear motor 23 to The side stage 21 is reset to the initial position, and the transfer means 70 drives the multi-joint robot arm 51 and a pressure reducing means (not shown), and the wafer WF is placed on the support surface 21A by the suction tool 71. In addition, during the recovery of the useless sheet US by the recovery means 60, as in the foregoing embodiment, after the transfer means 70 transfers the wafer WF on the support surface 21A to the next step, another wafer WF may be carried. Placed on the support surface 21A.
支承手段20，係亦可在使內側載台21移動至上方之際，以使被黏面WF1位在與無用薄片支承面22A相同平面內的方式作配置，或者，只要在能夠藉由按壓滾輪44於被黏面WF1及無用薄片支承面22A貼附接著薄片AS的範圍內，則亦可以使被黏面WF1位於比無用薄片支承面22A更上方或下方的方式作配置。 The support means 20 may be arranged so that the adhered surface WF1 is positioned in the same plane as the useless sheet support surface 22A when the inner stage 21 is moved upward, or as long as the roller can be pressed by pressing the roller 44 Within the range where the adhered surface WF1 and the unnecessary sheet support surface 22A are adhered to the sheet AS, the adhered surface WF1 can also be arranged above or below the unnecessary sheet support surface 22A.
內側載台21，係亦可設置對於支承面21A突出隱沒自如的支承銷或升降銷等收取手段，並藉由該收取手段從移送手段70收取晶圓WF。 The inner stage 21 may also be provided with a receiving means such as a support pin or a lifting pin that protrudes from the support surface 21A, and may receive the wafer WF from the transfer means 70 by the receiving means.
外側載台22，係亦可具備複數個開口22C，亦可不具備開口22C，在不具備開口22C的情形下，只要內側載台21與外側載台22之間有能夠將晶圓WF搬入、搬出的間隙即可。 The outer stage 22 may be provided with a plurality of openings 22C, or may not be provided with the opening 22C. In the case where the opening 22C is not provided, as long as there is a space between the inner stage 21 and the outer stage 22, the wafer WF can be carried in and out. Clearance.
移動手段，係亦可一邊使內側載台21固定或移動，一邊使外側載台22移動，亦可取代直動馬達23採用使內側載台21轉動的驅動機器，使內側載台21在凹部22B內轉動而使支承面21A的姿勢為垂直或傾斜，此時，亦可配合內側載台21的轉動角度，將開口22C形成為縱長或傾 斜。 The moving means can also move the outer stage 22 while the inner stage 21 is fixed or moved. Instead of using the direct-acting motor 23, a driving device that rotates the inner stage 21 can be used to place the inner stage 21 in the recess 22B. Turn inward to make the posture of the support surface 21A vertical or inclined. At this time, the opening 22C can also be formed vertically or tilted in accordance with the rotation angle of the inner stage 21. oblique.
送出手段30，係亦可為送出未暫時接著於剝離薄片RL的接著薄片AS之構成，此時，亦可不具備剝離板34B，亦可送出單片的接著薄片AS。 The sending means 30 may be configured to send out a bonding sheet AS that is not temporarily bonded to the release sheet RL. In this case, the peeling sheet 34B may not be provided, and a single bonding sheet AS may be sent out.
送出手段30，係亦可使支承滾輪31及回收滾輪36當中至少一方受到框架37支承，亦可使線性馬達38、39分別對於上下方向及左右方向傾斜而延伸設置，亦可將該等朝向不彼此正交的方向延伸設置，亦可藉由線性馬達38的滑件支承線性馬達39，並藉由線性馬達39的滑件39A支承框架37，作為張力檢測手段，可採用壓力感應器或調節器等，只要是能夠測定接著薄片AS的張力者皆可，作為藉由能夠鎖定支承滾輪31的驅動機器作支承的構成，亦可省去直動馬達33，亦可為不採用線性馬達38、39而伴隨著按壓滾輪44朝向右方的移動從支承滾輪31送出原料RS的構成。 The sending means 30 can also support at least one of the support roller 31 and the recovery roller 36 by the frame 37, and the linear motors 38 and 39 can be extended by tilting the vertical and horizontal directions, respectively. The linear motor 39 can be supported by the sliders of the linear motor 38 and the frame 37 can be supported by the slider 39A of the linear motor 39. As a tension detection method, a pressure sensor or a regulator can be used. As long as it can measure the tension of the sheet AS, as a structure supported by a driving device capable of locking the supporting roller 31, the linear motor 33 may be omitted, or the linear motors 38 and 39 may not be used. On the other hand, the raw material RS is sent out from the support roller 31 as the pressing roller 44 moves to the right.
切斷手段50，作為殘留於晶圓WF上的接著薄片部分AS1的形狀，亦可不切斷為與晶圓WF的被黏面WF1為相同形狀，而切斷為不同的形狀、切斷為比被黏面WF1更大或是切斷為比被黏面WF1更小。 The cutting means 50 may not be cut into the same shape as the adhered surface WF1 of the wafer WF as the shape of the bonding sheet portion AS1 remaining on the wafer WF, but may be cut into a different shape and cut to a ratio. The adhered surface WF1 is larger or cut to be smaller than the adhered surface WF1.
回收手段60，係亦可為不採用驅動滾輪63及夾壓滾輪64，而從外側載台22直接藉由回收滾輪65回收無用薄片US的構成，亦可為不使框架61或回收滾輪65等沿著被黏面WF1移動而回收無用薄片US的構成。 The recovery means 60 may be a configuration in which the useless roller US is directly recovered from the outer stage 22 through the recovery roller 65 without using the driving roller 63 and the pinch roller 64, and the frame 61 or the recovery roller 65 may not be used. A structure that collects the useless sheet US by moving along the adhered surface WF1.
移送手段70，係亦可先使內側載台21上升之後，不 通過開口22C而從上方將晶圓WF載置於支承面21A上，亦可為與切斷手段50為分別的獨立構成，在藉由其他裝置移送被黏物的情形下不具備亦可。 The transfer means 70 can also be performed by first raising the inner stage 21 without The wafer WF is placed on the support surface 21A from above through the opening 22C, and may be a separate structure from the cutting means 50, and may not be provided when the adherend is transferred by another device.
另外，本發明中之接著薄片AS、殘留於晶圓WF上的接著薄片部分AS1以及被黏物的材質、種類、形狀等，並未特別限定。例如，殘留於接著薄片AS及晶圓WF上的接著薄片部分AS1，係圓形、橢圓形、三角形或四角形等多角形，亦可為其他形狀，亦可為感壓接著性、感熱接著性等接著形態者，在採用感熱接著性的接著薄片AS的情形下，亦可藉由設置加熱該接著薄片的適當的線圈加熱器或熱管等加熱側等之加熱手段的適當方法作接著。另外，接著薄片AS，係例如僅接著劑層之單層者、在基材薄片與接著劑層之間具有中間層者、在基材薄片的上面具有覆蓋層之3層以上者，更有甚者，亦可為能夠從接著劑層將基材薄片剝離的所謂兩面接著薄片般者，兩面接著薄片，係亦可為具有單層或是複層之中間層者，或是不具有中間層的單層或是複層者。另外，作為被黏物，能夠以例如食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等半導體晶圓、電路基板、光碟等資訊紀錄基板、玻璃板、鋼板、陶器、目板或是樹脂板等任意形態的構件或物品作為對象。又，將接著薄片AS轉為功能性、用途性的解讀方法，係能夠將例如資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、晶片貼附薄膜、黏晶膠帶、紀錄層形成樹脂薄片等任意形狀之任意的薄片、薄膜、膠帶 等，貼附於前述般任意之被黏物。 The materials, types, and shapes of the bonding sheet AS, the bonding sheet portion AS1 remaining on the wafer WF, and the adherend in the present invention are not particularly limited. For example, the adhesive sheet portion AS1 remaining on the adhesive sheet AS and the wafer WF is a polygon such as a circle, an ellipse, a triangle, or a quadrangle, and may also have other shapes, pressure-sensitive adhesiveness, and thermal-sensitive adhesiveness. In the case of the following form, in the case where the thermally-adhesive bonding sheet AS is used, the bonding can also be performed by a suitable method such as providing a suitable coil heater or heating means such as a heat pipe to heat the bonding sheet. In addition, the adhesive sheet AS is, for example, a person having only a single layer of the adhesive layer, a person having an intermediate layer between the substrate sheet and the adhesive layer, and a layer having three or more layers on the substrate sheet, and more. It can also be a so-called two-sided adhesive sheet that can peel a substrate sheet from an adhesive layer, and two-sided adhesive sheet. It can also be a single layer or an intermediate layer without a layer, or one without an intermediate layer. Single-layer or multi-layer. In addition, as the adherend, for example, a food wafer, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, a pottery, a mask, or a resin can be used. Components and articles of any form, such as boards, are targeted. In addition, the method of converting the adhesive sheet AS into a functional and usable interpretation method can be, for example, an information recording label, a decorative label, a protective sheet, a dicing tape, a wafer attaching film, a sticky crystal tape, and a recording layer forming a resin sheet. Any sheet, film, tape, etc. of any shape And so on, affixed to the arbitrary adherends as described above.
本發明中之手段及步驟，係只要能夠達成針對該等手段及步驟所說明的動作、功能或是步驟則並無限定，更有甚者，並不受藉由前述實施形態所表示的一實施形態的構成物或步驟所限定。例如，按壓手段，係只要是於被黏物將接著薄片按壓而貼附者，按照申請當時之技術常識，紙咬在其技術範圍內者則無任何限定(針對其他手段及步驟的說明係省略)。 The means and steps in the present invention are not limited as long as the actions, functions, or steps described for these means and steps can be achieved, and moreover, they are not subject to the implementation indicated by the foregoing embodiments. The structure or steps of the form are limited. For example, as for the pressing means, as long as the sticky object presses and adheres the sheet, according to the technical common sense at the time of application, there is no restriction on the paper biting within its technical scope (the description of other means and steps is omitted) ).
另外，前述實施形態中之驅動機器，係能夠採用轉動馬達、直動馬達、線性馬達、單軸機械手臂、多關節機械手臂等電動機器、氣壓缸、油壓缸、無桿汽缸及旋轉汽缸等致動器等，並能夠採用將該等直接或間接組合者(亦有與藉由實施形態所例示者重複者)。 In addition, the driving devices in the foregoing embodiments are electric machines such as rotary motors, direct-acting motors, linear motors, single-axis robot arms, multi-joint robot arms, pneumatic cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders. Actuators and the like can be combined with those directly or indirectly (they also overlap with those exemplified by the embodiment).
於前述實施形態，在採用滾輪的情形下，亦可具備將各滾輪作旋轉驅動的驅動機器，亦可將各滾輪的表面藉由橡膠或樹脂等能夠彈性變形的構件作構成，亦可將各滾輪藉由不會彈性變形的構件作構成，在採用按壓滾輪或按壓頭等按壓手段或按壓構件的情形下，亦可取代或併用前述所例示者，採用滾輪、圓棒、刮刀材、橡膠、樹脂、海綿等所致之按壓構件，或是藉由噴吹大氣或氣體等空氣而作按壓的構成，亦可將按壓手段或按壓構件的按壓部藉由橡膠或樹脂等能夠彈性變形的構件作構成，亦可藉由不會彈性變形的構件作構成，在採用剝離手段或剝離構件的情形下，亦藉由板狀構件、圓棒、滾輪等構成，在採用支承 (保持)手段或將支承(保持)構件等被支承構件作支承或保持的構成之情形下，亦可採用藉由機械式夾具或夾持筒等把持手段、庫倫力、接著劑、黏著劑、磁力、白努力吸附、驅動機器等將被支承構件作支承(保持)的構成，在採用切斷手段或切斷刃的情形下，亦可取代或併用前述所例示者，採用裁切刀、雷射切割器、離子束、火力、熱、水壓、電熱線、噴吹氣體或液體等的切斷構件，或是藉由組合了適當的驅動機器者使切斷構件移動而進行切斷。 In the foregoing embodiment, when a roller is used, a driving device that rotates each of the rollers may be provided, and the surface of each of the rollers may be made of a member capable of elastic deformation such as rubber or resin. The roller is composed of a member that does not elastically deform. When a pressing means such as a pressing roller or a pressing head or a pressing member is used, the roller, a round bar, a scraper, rubber, Resin, sponge, and other pressing members, or the structure is made by blowing air or air, etc., the pressing means or the pressing part of the pressing member can also be made of a member that can be elastically deformed, such as rubber or resin It can also be constructed by a member that does not elastically deform. In the case of peeling means or peeling members, it is also constituted by a plate-like member, a round bar, a roller, etc. (Holding means) or a structure that supports or holds a supported member such as a supporting (holding) member, a holding means such as a mechanical clamp or a holding cylinder, a coulomb force, an adhesive, an adhesive, The structure that supports (holds) a supported member such as magnetic force, white hard suction, and driving machinery. When cutting means or cutting blades are used, it is also possible to replace or use the examples exemplified above. Cutting members such as jet cutters, ion beams, firepower, heat, water pressure, electric heating wires, spraying gas or liquid, or cutting by moving the cutting member by combining an appropriate driving machine.
10‧‧‧薄片貼附裝置 10‧‧‧ Sheet attachment device
20‧‧‧支承手段 20‧‧‧Support
21‧‧‧內側載台 21‧‧‧Inner stage
21A‧‧‧支承面 21A‧‧‧ bearing surface
22‧‧‧外側載台 22‧‧‧outer stage
22A‧‧‧無用薄片支承面 22A‧‧‧Useless sheet bearing surface
22B‧‧‧凹部 22B‧‧‧ Recess
22C‧‧‧開口 22C‧‧‧Open
23‧‧‧直動馬達 23‧‧‧Direct acting motor
23A‧‧‧輸出軸 23A‧‧‧Output shaft
30‧‧‧送出手段 30‧‧‧ delivery method
31‧‧‧支承滾輪 31‧‧‧Support roller
32A‧‧‧導引滾輪 32A‧‧‧Guide Roller
32B‧‧‧導引滾輪 32B‧‧‧Guide Roller
33‧‧‧直動馬達 33‧‧‧Direct acting motor
33A‧‧‧輸出軸 33A‧‧‧Output shaft
33B‧‧‧按壓構件 33B‧‧‧Pressing member
34A‧‧‧測力計 34A‧‧‧ Dynamometer
34B‧‧‧剝離板 34B‧‧‧ peeling plate
35‧‧‧驅動滾輪 35‧‧‧Drive roller
35A‧‧‧直動馬達 35A‧‧‧Direct acting motor
35B‧‧‧夾壓滾輪 35B‧‧‧Pinch roller
36‧‧‧回收滾輪 36‧‧‧Recycling roller
37‧‧‧框架 37‧‧‧Frame
38‧‧‧線性馬達 38‧‧‧ Linear Motor
39‧‧‧線性馬達 39‧‧‧ Linear Motor
40‧‧‧按壓手段 40‧‧‧Pressing means
41‧‧‧線性馬達 41‧‧‧ Linear Motor
41A‧‧‧滑件 41A‧‧‧Slider
41B‧‧‧滑件 41B‧‧‧Slider
42‧‧‧托架 42‧‧‧ Bracket
43‧‧‧直動馬達 43‧‧‧Direct acting motor
43A‧‧‧輸出軸 43A‧‧‧Output shaft
43B‧‧‧托架 43B‧‧‧Carriage
44‧‧‧按壓滾輪 44‧‧‧Press the wheel
50‧‧‧切斷手段 50‧‧‧ cutting means
51‧‧‧多關節機械手臂 51‧‧‧Multi-joint robot arm
51A‧‧‧作業臂 51A‧‧‧Working arm
60‧‧‧回收手段 60‧‧‧Recycling means
61‧‧‧框架 61‧‧‧Frame
62‧‧‧直動馬達 62‧‧‧Direct acting motor
63‧‧‧驅動滾輪 63‧‧‧Drive roller
64‧‧‧夾壓滾輪 64‧‧‧Pinch roller
65‧‧‧回收滾輪 65‧‧‧Recycling roller
70‧‧‧移送手段 70‧‧‧ transfer means
71‧‧‧吸附工具 71‧‧‧Adsorption tool
80‧‧‧清掃手段 80‧‧‧cleaning means
81‧‧‧線性馬達 81‧‧‧ Linear Motor
81A‧‧‧滑件 81A‧‧‧Slider
82‧‧‧直動馬達 82‧‧‧Direct acting motor
82A‧‧‧輸出軸 82A‧‧‧Output shaft
83‧‧‧黏著滾輪 83‧‧‧ Adhesive roller
83A‧‧‧托架 83A‧‧‧Carriage
RS‧‧‧原料 RS‧‧‧ raw materials
AS‧‧‧接著薄片 AS‧‧‧thin sheet
RL‧‧‧剝離薄片 RL‧‧‧ peeling sheet
US‧‧‧無用薄片 US‧‧‧Useless sheet
WF‧‧‧被黏物 WF‧‧‧ Adhesive
WF1‧‧‧被黏面 WF1‧‧‧ Adhesive surface
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016108817A JP6678516B2 (en) | 2016-05-31 | 2016-05-31 | Sheet sticking device and sticking method |
| JP2016-108817 | 2016-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201810409A true TW201810409A (en) | 2018-03-16 |
| TWI735578B TWI735578B (en) | 2021-08-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106117053A TWI735578B (en) | 2016-05-31 | 2017-05-23 | Sheet attaching device and attaching method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6678516B2 (en) |
| KR (1) | KR102329907B1 (en) |
| CN (1) | CN107452667B (en) |
| TW (1) | TWI735578B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI815066B (en) * | 2020-12-14 | 2023-09-11 | 萬潤科技股份有限公司 | Positioning method, device and application equipment for objects to be sputtered |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4475772B2 (en) * | 2000-08-08 | 2010-06-09 | 日東電工株式会社 | Protective tape application method and protective tape application device |
| CN100547752C (en) * | 2005-05-19 | 2009-10-07 | 琳得科株式会社 | Adhering apparatus |
| JP4890873B2 (en) * | 2006-02-06 | 2012-03-07 | リンテック株式会社 | Sheet pasting device |
| JP5113599B2 (en) * | 2008-04-08 | 2013-01-09 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5607965B2 (en) * | 2010-03-23 | 2014-10-15 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
| JP5562091B2 (en) * | 2010-03-29 | 2014-07-30 | リンテック株式会社 | Pressure roller |
| KR101760543B1 (en) * | 2010-08-10 | 2017-07-21 | 린텍 가부시키가이샤 | Sheet separation apparatus and separation method, and sheet attaching apparatus and attaching method |
| JP6078233B2 (en) * | 2012-01-31 | 2017-02-08 | リンテック株式会社 | Sheet pasting device |
| JP6328874B2 (en) * | 2012-07-18 | 2018-05-23 | リンテック株式会社 | Sheet pasting apparatus and method for preventing enlargement of apparatus |
| JP6100600B2 (en) * | 2013-04-26 | 2017-03-22 | リンテック株式会社 | Sheet sticking device and sticking method |
-
2016
- 2016-05-31 JP JP2016108817A patent/JP6678516B2/en active Active
-
2017
- 2017-05-23 TW TW106117053A patent/TWI735578B/en active
- 2017-05-26 KR KR1020170065453A patent/KR102329907B1/en active IP Right Grant
- 2017-05-26 CN CN201710383516.2A patent/CN107452667B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102329907B1 (en) | 2021-11-22 |
| JP6678516B2 (en) | 2020-04-08 |
| KR20170135721A (en) | 2017-12-08 |
| CN107452667A (en) | 2017-12-08 |
| TWI735578B (en) | 2021-08-11 |
| CN107452667B (en) | 2022-10-21 |
| JP2017216345A (en) | 2017-12-07 |
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