CN115140378A - Method and device for tearing film on wafer - Google Patents
Method and device for tearing film on wafer Download PDFInfo
- Publication number
- CN115140378A CN115140378A CN202210938634.6A CN202210938634A CN115140378A CN 115140378 A CN115140378 A CN 115140378A CN 202210938634 A CN202210938634 A CN 202210938634A CN 115140378 A CN115140378 A CN 115140378A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims description 79
- 238000003825 pressing Methods 0.000 claims description 39
- 238000005520 cutting process Methods 0.000 claims description 36
- 239000012528 membrane Substances 0.000 claims description 27
- 238000003466 welding Methods 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000003892 spreading Methods 0.000 claims description 10
- 230000007480 spreading Effects 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- 230000009471 action Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 description 333
- 230000001681 protective effect Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
- B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a method and a device for tearing a film on a wafer, which comprises an inviscid auxiliary film and a heating block, wherein the auxiliary film is wound into a coil, one section of the auxiliary film is positioned above a clamping piece which can be opened and closed, the wafer is positioned below the clamping piece, and the heating block moves downwards so that the auxiliary film is attached to a thinning film on the wafer and is fixed in a hot melting way; after the heating block moves upwards, the auxiliary film is cut off, and a section of auxiliary film which can be fixed by the clamping piece is left on the wafer; and moving the wafer, and pulling the thinning film on the wafer by the auxiliary film so as to separate the thinning film from the wafer. The auxiliary film and the thinning film are fixed in a hot melting mode, so that the viscosity is not reduced due to dirt on the surface of the thinning film, the wafer is not damaged, and the thinning film can be easily torn off by the auxiliary film.
Description
Technical Field
The invention relates to the technical field of semiconductor film tearing equipment, in particular to a method and a device for tearing a film on a wafer.
Background
With the progress of semiconductor technology, LED and camera technology, the requirement of users for product performance is higher and higher, and new packaging technology is emerging continuously. When the wafer comes out from a wafer manufacturing factory, the thickness of the wafer is thicker, and the wafer is thinned during packaging due to the requirement on the packaging size, so that the wafer is suitable for smaller packaging size. When the wafer is thinned, a film is pasted on the circuit layer of the wafer for protecting the circuit layer of the wafer, so that the wafer is protected from being scratched and stained when the grinding sheet is thinned. The protective film needs to be removed after the wafer is thinned, and the wafer cannot be damaged during removal.
The traditional solution method is to adsorb the wafer on a platform, manually peel one edge with tweezers, and then manually pull the film to remove the thinning film of the wafer by external force. The solution is a pure manual mode, too many human factors are caused, the control is difficult, the wafer is easy to be punctured by the tweezers, the manual film tearing force is difficult to control, and the wafer is easy to crack.
The other method is to adsorb the wafer on the table-board, stick the thinning film by using the auxiliary adhesive tape, and separate the thinning film from the wafer by pulling the auxiliary adhesive tape. However, when the wafer is ground and thinned, a lot of dust is generated, which causes a lot of dust on the thinning film, and when the thinning film is adhered by the auxiliary film, the auxiliary tape often fails to adhere to the thinning film, which causes a phenomenon that the thinning film cannot be torn off.
With the development of the technology, a method for clamping and tearing the thin film by using a manipulator is also provided, the method is that the wafer is adsorbed and fixed on a table top, the manipulator imitates tweezers to strip the thin film, and then the clamp on the manipulator clamps the thin film to slowly tear the thin film. However, the thickness of the thinning film is about 150um, the thickness of the thinning film is only about 70um, and the thinning film can be peeled off only by inserting the clamp between the thinning film and the wafer, so that the clamp is determined to be thin. The clip is easily deformed once it becomes thin, and in an environment where the position of the clip is accurate, the slight deformation of the clip causes a problem and easily touches a wafer to cause damage to the wafer. In addition, the thin reducing film is sticky, when the clamp clamps the thin reducing film and throws away the thin reducing film after the thin reducing film is torn, the thin reducing film is often stuck on the clamp and cannot be thrown away, and the subsequent operation of the machine is affected.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method and an apparatus for peeling a film from a wafer, which can quickly peel off the film without damaging the wafer.
Therefore, the first technical scheme of the invention is as follows: a method for tearing off the film of wafer includes such steps as thermally fusing the auxiliary film with the film-reducing film of wafer by heating block, and tearing off the film by auxiliary film to separate the film from wafer.
Preferably, the auxiliary film is wound into a roll, one section of the auxiliary film is positioned above a retractable clamping piece, the wafer is positioned below the clamping piece, and the heating block moves downwards so that the auxiliary film is attached to the thinning film on the wafer and is fixed by hot melting; after the heating block moves upwards, the auxiliary film is cut off, and a section of auxiliary film which can be fixed by the clamping piece is left on the wafer; and moving the wafer, and pulling the thinning film on the wafer by the auxiliary film so as to separate the thinning film from the wafer.
Preferably, the auxiliary film is arranged on a film feeding mechanism and can be fed out; the end part of the auxiliary film is pulled by the film pulling mechanism, so that the auxiliary film moves above the openable clamping piece; the wafer is arranged on the movable wafer fixing seat and can move below the clamping piece; the heating block moves downwards and drives the auxiliary film to pass through the middle of the clamping piece in an open state, the auxiliary film is attached to the thinned film on the wafer, and the auxiliary film and the thinned film are fixed through hot melting by heating the heating block; moving the heating block upwards, cutting off the redundant auxiliary film by the film cutting assembly, closing the clamping piece, and clamping and fixing the auxiliary film left on the wafer; the wafer fixing seat drives the wafer to move, the thinning film is fixed by the clamping piece through the auxiliary film, and the wafer is separated from the thinning film; and (4) loosening the clamping and film pulling mechanism, and automatically dropping the torn film reducing film and the auxiliary film.
The second technical scheme of the invention is as follows: a wafer film tearing device comprises a rack, wherein an auxiliary film and a film feeding mechanism for driving the auxiliary film to rotate are arranged above the rack, a first lead screw linear module is arranged on the rear side of the film feeding mechanism and drives the film feeding mechanism to move up and down, and a film cutting blade capable of moving horizontally is further arranged on the film feeding mechanism; a translational film drawing mechanism is arranged below the rack, the film drawing mechanism comprises a chuck and a film drawing cylinder for controlling the chuck to move, and the end part of the auxiliary film is fixed on the chuck; two clamping rollers capable of being opened and closed horizontally are arranged below the film drawing mechanism, and a wafer mounting seat capable of translating is arranged below the clamping rollers; the heating and welding mechanism is arranged on the rack and comprises a heating block and a second lead screw linear module for driving the heating block to lift, and the heating block can pass through the middle of the two clamping rollers and is close to the wafer mounting seat.
The auxiliary film is a non-adhesive film, and in order to save cost, the auxiliary film is of a narrower structure; the auxiliary film is wound on the winding drum, the film feeding mechanism is used for feeding the auxiliary film forwards, so that the auxiliary film can be clamped by a chuck of the film pulling mechanism, the film pulling mechanism can continue to elongate the auxiliary film, the auxiliary film can be pressed onto the wafer of the wafer mounting seat together when the heating block moves downwards, and the auxiliary film and the thinned film of the wafer are fixed together after being thermally melted by the heating block; at the moment, the film cutting blade can cut off the auxiliary film, the using amount of the auxiliary film is saved, only a small section of partial auxiliary film which can be pulled is left on the wafer, one end of the partial auxiliary film is fixed by the chuck, the other end of the partial auxiliary film is fixed with the thinning film of the wafer, namely, two ends of the auxiliary film are respectively positioned at the upper side and the lower side of the clamping rollers, and when the two clamping rollers are closed, the auxiliary film can be clamped; when the wafer mounting seat continues to move forwards, the auxiliary film pulls the thin reducing film, and the thin reducing film is torn off from the wafer to finish the film tearing work; simultaneously, because supplementary membrane does not have viscidity, separate when two grip rollers, the chuck shifts up, supplementary membrane and the attenuate membrane that pulls down are fallen down by the action of gravity is automatic, can be equipped with the waste material frame in the below for collect supplementary membrane and the attenuate membrane that pulls down, guarantee operational environment's clean and tidy.
Preferably, the film feeding mechanism further comprises a mounting panel, an expansion shaft and a torsion motor for driving the expansion shaft to rotate are arranged on the mounting panel, the auxiliary film is wound on a winding drum, and the winding drum is fixed on the expansion shaft; and a plurality of guide wheels are further arranged on the mounting panel and are positioned below the expansion shaft. The auxiliary film is fixed on the mounting panel through the expansion shaft, the torsion motor can drive the expansion shaft to rotate, the auxiliary film is conveyed out, and the guide wheel can change the conveying direction of the auxiliary film.
Preferably, a translatable film laying sheet and a liftable film pressing sheet are arranged below the mounting panel; the film spreading sheet is arranged on a horizontally arranged film spreading cylinder, the film pressing sheet is arranged on a vertically arranged film pressing cylinder, a film pressing cushion block is arranged below the film pressing sheet, a groove is arranged on the film pressing cushion block, and the front end of the film spreading sheet can be inserted into the groove of the film pressing cushion block; the film pressing sheet is of an L-shaped structure and is positioned on one side of the film cutting blade. The auxiliary film can be sent out forwards by the aid of the film spreading sheet, and the film spreading sheet is matched with the grooves in the film pressing cushion blocks, so that the auxiliary film can be prevented from being folded; after the film pressing sheet moves downwards, the auxiliary film can be fixed in front of the film pressing sheet and the film pressing cushion block, and the effect of fixing the auxiliary film is achieved.
Preferably, install on the mounting panel and cut membrane mechanism, cut membrane mechanism and include the sword flute plate, cut membrane cylinder, blade safety cover and safety cover cylinder, cut membrane cylinder level and set up in sword flute plate top, cut the membrane blade and install on cutting the membrane cylinder, cut membrane blade bottom and stretch into in the sword groove, the vertical setting of safety cover cylinder is in sword flute plate top, and the blade safety cover is installed on the safety cover cylinder. In the initial stage, the blade protection cover is positioned above the blade groove plate, the film cutting blade is positioned on the inner side of the blade groove plate, and the auxiliary film passes through the blade groove plate; when the auxiliary film needs to be cut off, the blade protective cover moves downwards, is pressed on the knife groove plate and fixes the auxiliary film, then the film cutting blade moves along the knife groove to cut off the auxiliary film, and then the film cutting blade and the blade protective cover reset.
Preferably, a third screw rod linear module is horizontally arranged on the side face of the rack, and the film pulling mechanism is driven by the third screw rod linear module; the film drawing mechanism further comprises a film drawing bracket and a chuck mounting seat, one end of the film drawing bracket is mounted on the third lead screw linear module, and the other end of the film drawing bracket is fixedly mounted with the chuck mounting seat; the chuck is arranged in the chuck mounting seat and driven by the tension film cylinder, and the chuck can move up and down in the chuck mounting seat to form a clamping part with the bottom surface of the chuck mounting seat. The chuck can constitute clamping part with chuck mount pad bottom surface for centre gripping, tractive auxiliary film, make things convenient for auxiliary film to move to the heating and welding mechanism below, can be fixed with the attenuate membrane hot melt of wafer.
Preferably, the clamping roller comprises a first clamping roller and a second clamping roller, the first clamping roller is fixed on the rack, two ends of the second clamping roller are slidably mounted on the guide rails on two sides of the rack, and the second clamping roller is acted by the clamping cylinder, can move horizontally along the guide rails and works in cooperation with the first clamping roller. The second clamping roller can move to be attached to the first clamping roller and is used for clamping the auxiliary film, the two clamping rollers are closer to the wafer, the stress of the thinning film is more uniform, and the thinning film can be easily torn down.
Preferably, the upper end surface of the wafer mounting seat is a microporous ceramic plate, the wafer mounting seat is connected with air suction equipment, and the microporous ceramic plate can be in a negative pressure state; and a fourth lead screw linear module is arranged below the rack and drives the wafer mounting seat to translate below the clamping roller. The wafer is fixed on the microporous ceramic sheet through negative pressure, one side with the thinning film is upward, the wafer is driven by the fourth lead screw linear module to move below the rack, and after the thinning film and the auxiliary film are fixed through hot melting, the wafer continues to move, and can be separated from the thinning film.
When in use, the method comprises the following steps:
1) The auxiliary film is fixed on the expansion shaft through a winding drum, the expansion shaft is driven to rotate through a torque motor, and the auxiliary film passes through the lower part of the film pressing sheet after being rotated backwards through the guide wheel;
2) The third screw rod linear module drives the film drawing mechanism to translate towards one side of the heating and welding mechanism; the first screw rod linear module drives the film feeding mechanism to move downwards to be level with the film pulling mechanism, and the auxiliary film is level with the chuck at the moment;
3) The torsion motor continues to convey the auxiliary film, the film spreading sheet translates to push the auxiliary film to enter the lower part of the chuck, and the film drawing cylinder drives the chuck to move downwards to clamp the auxiliary film;
4) The film pulling mechanism drives the auxiliary film to continuously translate, so that the auxiliary film passes over the first clamping roller, and the first clamping roller and the second clamping roller are in a separated state;
5) The wafer is fixed on the wafer mounting seat through negative pressure, and the fourth lead screw linear module drives the wafer mounting seat to translate towards one side of the heating and welding mechanism and moves below the heating and welding mechanism;
6) The heating welding mechanism starts to work, the heating block moves downwards and drives the auxiliary film to penetrate through the space between the first clamping roller and the second clamping roller and be attached to the thinning film on the wafer, the heating block heats, and the contact point of the auxiliary film and the thinning film is fixed through hot melting;
7) The heating and welding mechanism moves upwards to reset, the film cutting blade moves along the cutter groove, and the auxiliary film is cut off;
8) The first clamping roller and the second clamping roller are closed, and the auxiliary film left on the wafer is clamped;
9) The fourth screw linear module drives the wafer mounting seat to continuously translate, the wafer moves along with the wafer mounting seat, and the thinning film is fixed by the two clamping rollers through the auxiliary film and is separated from the wafer;
10 The two clamping rollers are separated, the film drawing cylinder drives the chuck to move upwards, and the thin film and the auxiliary film freely fall into the waste material frame.
Compared with the prior art, the invention has the beneficial effects that:
1. the auxiliary film is not sticky and is fixed with the thinning film in a hot melting mode, so that the stickiness of the thinning film is not reduced due to dirt on the surface of the thinning film, the wafer is not damaged, and the thinning film can be easily torn off by the auxiliary film; and the clamping roller and the chuck can be directly loosened after the film is torn, the film reducing film and the auxiliary film automatically fall off, the condition that the film is stuck and thrown away cannot occur, and the machine is ensured to be smoothly carried out.
2. The auxiliary film is in a narrow strip shape, a section of auxiliary film which is easy to pull and can be stressed is reserved on the wafer every time, the material consumption is less, and the cost for tearing the film is reduced;
3. the expansion shaft is used for fixing the auxiliary membrane, so that the membrane is more convenient to change; the conveying direction of the auxiliary film is changed by utilizing each guide wheel, and the auxiliary film is ensured to be smoothly pulled by the film pulling mechanism.
Drawings
The following detailed description is made with reference to the accompanying drawings and embodiments of the present invention
FIG. 1 and FIG. 2 are schematic structural diagrams of the present invention;
FIG. 3 is a schematic structural view of a film feeding mechanism according to the present invention;
FIG. 4 is a schematic structural diagram of a film cutting mechanism according to the present invention;
FIG. 5 is a schematic structural view of a heating welding mechanism according to the present invention;
FIG. 6 is a schematic structural diagram of a film drawing mechanism according to the present invention;
FIG. 7 is a partial structural view of the film drawing mechanism of the present invention;
FIG. 8 is a schematic structural diagram of a wafer mounting seat according to the present invention.
Labeled as: a frame 1, an auxiliary film 2;
the film feeding mechanism 3, the mounting panel 31, the expansion shaft 32, the torsion motor 33, the first guide wheel 34, the second guide wheel 35, the film paving cylinder 36, the film paving sheet 37, the film pressing cylinder 38, the film pressing sheet 39, the film pressing cushion block 310, the first motor 311, the first guide rail 312 and the first slide block 313;
the film cutting mechanism 4, a film cutting blade 41, a knife groove plate 42, a film cutting cylinder 43, a blade protection cover 44, a protection cover cylinder 45 and a knife groove 46;
the film drawing mechanism 5, a chuck 51, a film drawing cylinder 52, a film drawing bracket 53, a chuck mounting seat 54, a third motor 55, a third screw rod 56, a third guide rail 57 and a third slide block 58;
the heating welding mechanism 6, the heating block 61, the heating block mounting frame 62, the welding cylinder 63, the second motor 64, the second guide rail 65 and the second slide block 66;
a wafer mounting base 7, a microporous ceramic sheet 71;
a first nip roller 81, a second nip roller 82, a fifth slider 83, a fifth guide rail 84, and a nip cylinder 85.
Detailed Description
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if any, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features. Thus, a definition of "a first" or "a second" feature may, explicitly or implicitly, include one or more of the features, and in the context of this disclosure, a "plurality" or "a plurality" means two or more unless otherwise explicitly specified.
See the drawings. The wafer dyestripping device of this embodiment, including frame 1, install supplementary membrane 2, send membrane mechanism 3, cut membrane mechanism 4, draw membrane mechanism 5, heat-welding mechanism 6 and wafer mount pad 7 in the frame.
The auxiliary film 2 is a narrow strip film without stickiness, and is wound on a winding drum; the film feeding mechanism 3 comprises a mounting panel 31, an expansion shaft 32 and a torsion motor 33 for driving the expansion shaft to rotate are arranged on the mounting panel 31, the torsion motor 33 is fixed behind the mounting panel 31, and the motor shaft penetrates through the mounting panel and is connected with the expansion shaft 32; the winding drum of the auxiliary film 2 is fixed on an expansion shaft 32 and is driven to rotate by a torsion motor 33 to release the auxiliary film; the mounting panel 31 is further provided with a first guide wheel 34 and a second guide wheel 35, and the first guide wheel and the second guide wheel are both positioned below the auxiliary film. The auxiliary film is fixed on the mounting panel through the expansion shaft, the torsion motor can drive the expansion shaft to rotate, the auxiliary film is conveyed out, and the conveying direction of the auxiliary film can be changed by the first guide wheel 34 and the second guide wheel 35. The expansion shaft 32, the torsion motor 33, the first guide wheel 34 and the second guide wheel 35 are all arranged along the Y-axis direction, and the conveying direction of the auxiliary wheel is the X-axis direction.
A film laying cylinder 36 is arranged below the mounting panel 31, a film laying sheet 37 is arranged on the film laying cylinder 36, the film laying sheet 37 moves along the X-axis direction, and the film laying sheet is of a flat structure; a film pressing cylinder 38 arranged along the Z-axis direction is arranged on the mounting panel 31, a film pressing sheet 39 is arranged below the film pressing cylinder, a film pressing cushion block 310 is arranged below the film pressing sheet 39, and the film pressing cushion block 310 is fixed on the mounting panel 31; the film pressing cushion block 310 is provided with a groove, and the front end of the film paving sheet 37 can be inserted into the groove of the film pressing cushion block and used for paving the auxiliary film; the film pressing sheet 39 is of an L-shaped structure, and after moving downwards, the auxiliary film 2 can be fixed between the film pressing sheet 39 and the film pressing cushion block 310, so that the effect of fixing the auxiliary film is achieved.
The film feeding mechanism 3 is characterized in that a first lead screw linear module arranged along the Z-axis direction is arranged on the rear side of the film feeding mechanism 3, the first lead screw linear module drives the film feeding mechanism 3 to move up and down, the first lead screw linear module comprises a first motor 311, a first lead screw and a first guide rail 312, a first sliding block 313 matched with the first lead screw is arranged on the rear side of the installation panel 31, and the first sliding block can move up and down along the first guide rail.
The film cutting mechanism 4 is fixed on the mounting panel 31, the film cutting mechanism 4 comprises a film cutting blade 41, a knife board 42, a film cutting cylinder 43, a blade protection cover 44 and a protection cover cylinder 45, the film cutting cylinder 43, the knife board 42 and the protection cover cylinder 45 are fixed on the mounting panel 31, the film cutting cylinder 43 is arranged along the Y-axis direction, and the film cutting blade 41 is mounted on the film cutting cylinder 43 and can move along the Y-axis direction; the knife groove plate 42 is provided with a knife groove 46 in the Y-axis direction, and the sharp end part of the film cutting blade 41 is inserted into the knife groove 46; the guard cylinder 45 is arranged along the Z-axis direction, and the blade guard 44 is mounted on the guard cylinder 45 to be movable up and down. In the initial stage, the blade protection cover 44 is positioned above, the film cutting blade 41 is positioned on the inner side of the knife slot plate 42, and the auxiliary film 2 passes through the knife slot plate 42; when the auxiliary film needs to be cut off, the blade protection cover 44 moves downwards to press on the knife groove plate 42 and fix the auxiliary film, then the film cutting blade 41 moves along the knife groove 46 to cut off the auxiliary film, and then the film cutting blade and the blade protection cover are reset.
The heating and welding mechanism 6 is installed on the rack 1 and located on the side face of the installation panel 31, the heating and welding mechanism 6 comprises a heating block 61, a heating block installation frame 62 and a second lead screw linear module for driving the heating block installation frame to lift, the heating block 61 is arranged in the heating block installation frame 62, a welding cylinder 63 is further arranged in the heating block installation frame 62, and the heating block 61 is installed on the welding cylinder 63; when the heating block moves down, the auxiliary film can be pressed down to the wafer of the wafer mounting seat together, and then the auxiliary film and the thinning film of the wafer are fixed together after being melted by heat through the heating block 61, so that the thinning film is convenient to tear down. The second lead screw linear module comprises a second motor 64, a second lead screw and a second guide rail 65, a second sliding block 66 matched with the second lead screw is arranged on the rear side of the heating block mounting frame 62, and the second sliding block 66 can move up and down along the second guide rail 65.
A third lead screw linear module arranged along the X-axis direction is arranged on the outer side surface of the rack 1, and the film drawing mechanism 5 is driven by the third lead screw linear module and can move along the X-axis direction; the film drawing mechanism 5 comprises a chuck 51, a film drawing cylinder 52, a film drawing bracket 53 and a chuck mounting seat 54, wherein the film drawing bracket 53 is arranged along the Y-axis direction, one end of the film drawing bracket is arranged on the third lead screw linear module, and the other end of the film drawing bracket is fixedly provided with the chuck mounting seat 54; the chuck 51 is arranged in a chuck mounting seat 54 and driven by a tension film cylinder 52, and the chuck 51 can move up and down in the chuck mounting seat 54 to form a clamping part with the bottom surface of the chuck mounting seat 54. The chuck can constitute clamping part with chuck mount pad bottom surface for centre gripping, tractive auxiliary film, make things convenient for auxiliary film to move to the heating and welding mechanism below, can be fixed with the attenuate membrane hot melt of wafer. The third screw rod linear module comprises a third motor 55, a third screw rod 56 and a third guide rail 57, a third sliding block 58 matched with the third screw rod 56 is arranged at the end part of the film drawing bracket 53, the third sliding block 58 can move up and down along the third guide rail 57, and the third guide rail is positioned on the outer side surface of the rack.
Two clamping rollers capable of horizontally opening and closing are arranged below the film drawing mechanism 5, the clamping rollers are arranged along the Y-axis direction and comprise first clamping rollers 81 and second clamping rollers 82, the first clamping rollers 81 are fixed on the rack 1, two ends of each second clamping roller 82 are slidably mounted on fifth guide rails 84 on two sides of the rack through fifth sliding blocks 83, and the second clamping rollers 82 are acted by clamping cylinders 85, can move along the fifth guide rails 84 and work in cooperation with the first clamping rollers 81. The second clamping roller can move to be attached to the first clamping roller and is used for clamping the auxiliary film, the two clamping rollers are closer to the wafer, the stress of the thinning film is more uniform, and the thinning film can be easily torn down.
A wafer mounting seat 7 is further arranged below the rack 1, the upper end face of the wafer mounting seat is a microporous ceramic plate 71, the wafer mounting seat is connected with a gas suction device, the microporous ceramic plate can be in a negative pressure state, and the wafer is mounted on the microporous ceramic plate through negative pressure; a fourth screw rod linear module arranged along the X-axis direction is arranged below the rack 1, and the wafer mounting seat 7 is driven to translate along the X-axis direction below the clamping roller. The wafer is fixed on the microporous ceramic sheet through negative pressure, one side with the thinning film is upward, the wafer is driven by the fourth lead screw linear module to move below the rack, and after the thinning film and the auxiliary film are fixed through hot melting, the wafer continues to move, and can be separated from the thinning film.
The film tearing method comprises the following steps:
1) The auxiliary film 2 is sleeved on the expansion shaft 32 through a winding drum, the winding drum film is fixed through an expansion airbag, the torsion motor 33 drives the expansion shaft to rotate, the end part of the auxiliary film is drawn out, the direction is changed through the first guide wheel 34 and the second guide wheel 35, the auxiliary film sequentially passes through the film pressing cushion block 310 and the cutter groove plate 42, and the film paving cylinder 36 drives the film paving sheet 37 to move horizontally to push the auxiliary film forwards; at this time, the film pressing blade 39 and the blade protection cover 44 are both positioned above, and the film cutting blade 41 is positioned at the inner side, so that the auxiliary film does not move in an interference manner;
2) The third screw rod linear module drives the film drawing mechanism 5 to move along the Y-axis direction, cross the installation panel 31 and be positioned on the right side of the installation panel; the first screw rod linear module drives the film feeding mechanism 3 to move downwards, and the auxiliary film is opposite to the chuck at the moment, so that the chuck can conveniently clamp the auxiliary film;
3) The torsion motor 33 continues to convey the auxiliary film 2, and the film spreading sheet 37 pushes the auxiliary film forwards so as to push the auxiliary film to enter the lower part of the clamping head 51; then the film drawing cylinder 52 drives the chuck 51 to move downwards to clamp the auxiliary film;
4) The film drawing mechanism 5 drives the auxiliary film to continuously translate towards the right side, so that the auxiliary film crosses the heating welding mechanism 6 and the first clamping roller 81; at this time, the first nip roller 81 and the second nip roller 82 are in a separated state;
5) The wafer is fixed on a wafer mounting seat 7 through negative pressure, a fourth screw rod linear module drives the wafer mounting seat 7 to translate towards one side of a heating and welding mechanism 6, and the right side of the wafer is located right below the heating and welding mechanism, namely between a first clamping roller and a second clamping roller;
6) The heating welding mechanism 6 starts to work, the second lead screw linear module drives the heating block mounting frame 62 to move downwards, the heating block 61 moves downwards and drives the auxiliary film to penetrate through the space between the first clamping roller 81 and the second clamping roller 82 and be attached to the thinning film on the wafer, the heating block 61 heats, the welding cylinder 63 drives the heating block 61 to move downwards slowly, and the auxiliary film and the thinning film are fixed together in a hot melting mode;
7) The heating welding mechanism 6 moves upwards and returns to the original position, the film pressing cylinder 38 drives the film pressing sheet 39 to move downwards to fix the auxiliary film, the protective cover cylinder 45 drives the blade protective cover 44 to move downwards to fix the auxiliary film on the knife slot plate 42; then the film cutting cylinder 43 drives the film cutting blade 41 to move along the knife groove 46 to cut off the auxiliary film; then the blade protecting cover 44 and the film cutting blade 41 are reset;
8) At the moment, a small section of partial auxiliary film for pulling is left on the wafer, one end of the partial auxiliary film is fixed by the chuck, and the other end of the partial auxiliary film is fixed with the thinning film of the wafer, namely, two ends of the auxiliary film are respectively positioned at the upper side and the lower side of the clamping roller; the clamping cylinder 85 drives the second clamping roller 82 to approach the first clamping roller 81, and clamps the residual auxiliary film on the wafer;
9) The fourth screw linear module drives the wafer mounting seat 7 to continuously move towards the right side, the thinning film is fixed by the two clamping rollers through the auxiliary film, and the thinning film on the wafer is slowly torn in the process that the wafer moves along with the wafer mounting seat;
10 When the wafer is completely separated from the thinning film, the clamping cylinder 85 drives the second clamping roller 82 and the first clamping roller 81 to separate, and simultaneously, the film pulling cylinder 52 drives the chuck 51 to move upwards, so that the thinning film and the auxiliary film freely fall into the waste frame under the action of self gravity.
11 To this end, the whole work of tearing the film from the wafer is completed, the wafer with the film torn off is taken down from the wafer mounting seat, and the next wafer to be torn off can be put in for the next film tearing work.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. A method for peeling a film from a wafer is characterized by comprising the following steps: the wafer thinning device comprises an inviscid auxiliary film and a heating block, wherein the auxiliary film and the thinning film of the wafer are fixed together through hot melting by the heating block, and the thinning film is torn by the auxiliary film, so that the thinning film is separated from the wafer.
2. The wafer stripping method according to claim 1, wherein: the auxiliary film is wound into a coil, wherein one section of the auxiliary film is positioned above a clamping piece which can be opened and closed, the wafer is positioned below the clamping piece, and the heating block moves downwards so that the auxiliary film is attached to the thinned film on the wafer and is fixed in a hot melting mode; after the heating block moves upwards, cutting off the auxiliary film, and leaving a section of auxiliary film which can be fixed by the clamping piece on the wafer; and moving the wafer, and pulling the thinning film on the wafer by the auxiliary film so as to separate the thinning film from the wafer.
3. The wafer stripping method as set forth in claim 2, wherein: the auxiliary film is arranged on a film feeding mechanism and can be fed out; the end part of the auxiliary film is pulled by the film pulling mechanism, so that the auxiliary film moves to the position above the openable clamping piece; the wafer is arranged on the movable wafer fixing seat and can move below the clamping piece; the heating block moves downwards and drives the auxiliary film to pass through the middle of the clamping piece in an open state, the auxiliary film is attached to the thinned film on the wafer, and the auxiliary film and the thinned film are fixed through hot melting by heating the heating block; moving the heating block upwards, cutting off the redundant auxiliary film by the film cutting assembly, closing the clamping piece, and clamping and fixing the auxiliary film left on the wafer; the wafer fixing seat drives the wafer to move, the thinning film is fixed by the clamping piece through the auxiliary film, and the wafer is separated from the thinning film; and (4) loosening the clamping and film pulling mechanism, and automatically dropping the torn film reducing film and the auxiliary film.
4. The utility model provides a wafer dyestripping device, includes the frame, its characterized in that: an auxiliary film and a film feeding mechanism for driving the auxiliary film to rotate are arranged above the rack, a first lead screw linear module is arranged on the rear side of the film feeding mechanism and drives the film feeding mechanism to move up and down, and a film cutting blade capable of moving horizontally is further arranged on the film feeding mechanism; a translational film drawing mechanism is arranged below the rack, the film drawing mechanism comprises a chuck and a film drawing cylinder for controlling the chuck to move, and the end part of the auxiliary film is fixed on the chuck; two clamping rollers capable of being opened and closed horizontally are arranged below the film drawing mechanism, and a wafer mounting seat capable of translating is arranged below the clamping rollers; the heating and welding mechanism is installed on the rack and comprises a heating block and a second lead screw linear module which drives the heating block to lift, and the heating block can penetrate through the middle of the two clamping rollers and is close to the wafer mounting seat.
5. The wafer stripping device as claimed in claim 4, wherein: the film feeding mechanism also comprises a mounting panel, an expansion shaft and a torsion motor for driving the expansion shaft to rotate are arranged on the mounting panel, the auxiliary film is wound on a winding drum, and the winding drum is fixed on the expansion shaft; and a plurality of guide wheels are further arranged on the mounting panel and are positioned below the expansion shaft.
6. The wafer stripping device as claimed in claim 5, wherein: a translatable film laying sheet and a liftable film pressing sheet are arranged below the mounting panel; the film spreading sheet is arranged on a horizontally arranged film spreading cylinder, the film pressing sheet is arranged on a vertically arranged film pressing cylinder, a film pressing cushion block is arranged below the film pressing sheet, a groove is arranged on the film pressing cushion block, and the front end of the film spreading sheet can be inserted into the groove of the film pressing cushion block; the film pressing sheet is of an L-shaped structure and is positioned on one side of the film cutting blade.
7. The wafer stripping apparatus as claimed in claim 5, wherein: install on the installation panel and cut membrane mechanism, cut membrane mechanism and include sword flute plate, cut membrane cylinder, blade safety cover and safety cover cylinder, cut membrane cylinder level and set up in sword flute plate top, cut the membrane blade and install on cutting the membrane cylinder, cut membrane blade bottom and stretch into in the sword groove, the vertical setting of safety cover cylinder is in sword flute plate top, and the blade safety cover is installed on the safety cover cylinder.
8. The wafer stripping device as claimed in claim 4, wherein: a third screw rod linear module is horizontally arranged on the side surface of the rack, and the film drawing mechanism is driven by the third screw rod linear module; the film drawing mechanism further comprises a film drawing bracket and a chuck mounting seat, one end of the film drawing bracket is mounted on the third lead screw linear module, and the other end of the film drawing bracket is fixedly mounted with the chuck mounting seat; the chuck is arranged in the chuck mounting seat and driven by the tension film cylinder, and the chuck can move up and down in the chuck mounting seat to form a clamping part with the bottom surface of the chuck mounting seat.
9. The wafer stripping device as claimed in claim 4, wherein: the clamping rollers comprise a first clamping roller and a second clamping roller, the first clamping roller is fixed on the rack, two ends of the second clamping roller are slidably mounted on guide rails on two sides of the rack, and the second clamping roller can move horizontally along the guide rails under the action of the clamping cylinder and works in cooperation with the first clamping roller.
10. The wafer stripping device as claimed in claim 4, wherein: the upper end surface of the wafer mounting seat is a microporous ceramic plate, the wafer mounting seat is connected with a gas suction device, and the microporous ceramic plate can be in a negative pressure state; and a fourth lead screw linear module is arranged below the rack and drives the wafer mounting seat to translate below the clamping roller.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210938634.6A CN115140378A (en) | 2022-08-05 | 2022-08-05 | Method and device for tearing film on wafer |
| CN202320986470.4U CN219619578U (en) | 2022-08-05 | 2023-04-25 | Wafer dyestripping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210938634.6A CN115140378A (en) | 2022-08-05 | 2022-08-05 | Method and device for tearing film on wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115140378A true CN115140378A (en) | 2022-10-04 |
Family
ID=83414826
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210938634.6A Pending CN115140378A (en) | 2022-08-05 | 2022-08-05 | Method and device for tearing film on wafer |
| CN202320986470.4U Active CN219619578U (en) | 2022-08-05 | 2023-04-25 | Wafer dyestripping device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320986470.4U Active CN219619578U (en) | 2022-08-05 | 2023-04-25 | Wafer dyestripping device |
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| Country | Link |
|---|---|
| CN (2) | CN115140378A (en) |
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|---|---|---|---|---|
| JPH1116862A (en) * | 1997-06-20 | 1999-01-22 | Lintec Corp | Sheet stripping device and method of it |
| JP2005314100A (en) * | 2004-05-26 | 2005-11-10 | Lintec Corp | Sticking device |
| US20070227648A1 (en) * | 2004-04-28 | 2007-10-04 | Masaki Tsujimoto | Sticking Apparatus and Sticking Method |
| JP2009117509A (en) * | 2007-11-05 | 2009-05-28 | Lintec Corp | Sheet peeling device and peeling method |
| JP2009277864A (en) * | 2008-05-14 | 2009-11-26 | Lintec Corp | Sheet peeling device and method of peeling |
| JP2011066102A (en) * | 2009-09-16 | 2011-03-31 | Lintec Corp | Device and method for peeling sheet |
| CN102187448A (en) * | 2008-10-22 | 2011-09-14 | 琳得科株式会社 | Apparatus and method for peeling sheet |
| JP2012064850A (en) * | 2010-09-17 | 2012-03-29 | Lintec Corp | Sheet removal device and removing method |
| CN209434153U (en) * | 2019-01-24 | 2019-09-24 | 江苏汇成光电有限公司 | A kind of grinding wafer glue film tears glue hot type pressing plate |
-
2022
- 2022-08-05 CN CN202210938634.6A patent/CN115140378A/en active Pending
-
2023
- 2023-04-25 CN CN202320986470.4U patent/CN219619578U/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1116862A (en) * | 1997-06-20 | 1999-01-22 | Lintec Corp | Sheet stripping device and method of it |
| US20070227648A1 (en) * | 2004-04-28 | 2007-10-04 | Masaki Tsujimoto | Sticking Apparatus and Sticking Method |
| JP2005314100A (en) * | 2004-05-26 | 2005-11-10 | Lintec Corp | Sticking device |
| JP2009117509A (en) * | 2007-11-05 | 2009-05-28 | Lintec Corp | Sheet peeling device and peeling method |
| JP2009277864A (en) * | 2008-05-14 | 2009-11-26 | Lintec Corp | Sheet peeling device and method of peeling |
| CN102187448A (en) * | 2008-10-22 | 2011-09-14 | 琳得科株式会社 | Apparatus and method for peeling sheet |
| JP2011066102A (en) * | 2009-09-16 | 2011-03-31 | Lintec Corp | Device and method for peeling sheet |
| JP2012064850A (en) * | 2010-09-17 | 2012-03-29 | Lintec Corp | Sheet removal device and removing method |
| CN209434153U (en) * | 2019-01-24 | 2019-09-24 | 江苏汇成光电有限公司 | A kind of grinding wafer glue film tears glue hot type pressing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN219619578U (en) | 2023-09-01 |
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Application publication date: 20221004 |