JPS63155642A - Automatic sticking system for semiconductor wafer - Google Patents

Abstract

PURPOSE:To quickly take measures against a malfunction by installing a means to detect the occurrence of the malfunction at a heating stage of an automatic sticking system for a semiconductor wafer. CONSTITUTION:A wafer 2 inside cassettes 81-84 and a frame 4 inside a loader part 54 are placed on a sticking table 42, and are stuck on an adhesive tape 82 by means of a sticking roller unit 90. A cutting mechanism 108 cuts the tape 82 along the frame 4, and a mounting frame 6 is formed. The frame 6 is transferred to a heating stage 126; after it has been heat-treated at the heating stage 126, it is accommodated by cassettes 1321-1324 at an unloader part via a transfer table 130. Because a mechanism to detect the erroneous remainder of the frame 6 on the stage 126, the mechanism to detect the erroneous feeding operation of the frame 6 from the stage 126, and the mechanism to detect the erroneous receipt of the frame 6 by the transfer table 130 are installed, it is possible to detect a part where a malfunction has occurred at a system and to quickly take measures against the malfunction.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is cracked while attached to the adhesive tape. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next process, the bonding process.

Such a process of attaching a semiconductor wafer to an adhesive tape is performed as a pre-process of a semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafers to adhesive tape.

<Problems to be Solved by the Invention> The present invention has been developed in view of the above circumstances, and is directed to an apparatus for automatically attaching semiconductor wafers, in particular, if the mount frame to which the semiconductor wafer is attached can be heat-treated.
A mistake in remaining the mount frame on the tossage, a mistake in pushing out the mount frame from the heat stage, a mistake in receiving the mount frame in the mount frame transport section that receives the mount frame pushed out from the heat stage and transports it to the unrotor section. It is intended to provide a device for automatic pasting of semiconductor wafers with respective detection functions.

Such objects of the present invention will become clearer in the detailed description of the present invention that follows.

<Means for Solving the Problems> In order to achieve the above object, the present invention adopts the following configuration.

That is, the present invention allows a semiconductor wafer on which an orientation flat is formed to be aligned and attached to an adhesive tape.
The automatic attachment of semiconductor wafers is an apparatus comprising: a heat stage on which a frame (mount frame) holding an adhesive tape with the semiconductor wafer attached thereon is placed, and which can heat-process the mount frame; a first detecting means for detecting a mount frame on the heat stage; and a first detecting means for determining a frame remaining error on the heat stage based on a detection signal of the first detecting means.
an error determining means; a mount frame push-out mechanism for pushing out the mount frame placed on the heat stage; a second detection means for detecting the mount frame pushed out from the heat stage; and the second detection means. Based on the detection signal from the heat stage, the mount
a second error determining means for determining a frame extrusion error; a mount frame conveying section that receives the mount frame 1 extruded from the heat stage and conveys it toward the unrotor section; The third part detects the mount frame in the frame transport section.
The present invention is characterized in that it comprises a detection means, and -4=a third error determination means for determining whether the mount frame transport section has received an error in receiving the mount frame based on the detection signal of the third detection means.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of the automatic semiconductor wafer attachment device according to the present embodiment, and FIGS. 2 to 9 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attachment device. It is.

FIG. 10 shows a semiconductor wafer 2 that is attached to an adhesive tape by an apparatus for automatic attachment of semiconductor wafers according to this embodiment.
, a frame 4 for holding the adhesive tape to which the semiconductor wafer 2 is attached, and a mount frame 6 which is the frame to which the semiconductor wafer 2 is attached.

An orientation flange 1-OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2.

Based on this orientation flyl'0F,
An element pattern is formed on a semiconductor wafer 2.

The frame 4 is a ring-shaped metal plate or resin plate,
V-notches 43, 4□ are formed on the outer periphery of the frame 4 to be used when aligning the frame 4, which will be described later.

The automatic bonding device for semiconductor wafers according to this embodiment is as follows:
The two series of semiconductor wafers 2 are individually supplied from the wafer loader section and the frame 4 is supplied from the frame loader section and attached to the adhesive tape, and finally the mount frame 6 is stored in the unrotor section. There is.

The configuration of each part of this device will be explained below.

Reference numeral 8 (8, to 84) shown in FIG. 1 is a wafer cassette set in the wafer loader section. The wafer cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically at equal intervals. In this embodiment, there are two wafer loader sections, wafer cassettes 81 and 8□ can be loaded into the left wafer loader section, and wafer cassettes 83 and 84 can be loaded into the right wafer loader section. Each wafer loader section is configured to be movable in the vertical direction, and supplies the semiconductor wafers 2 by detecting the semiconductor wafers 2 in the wafer cassette 8 and pushing them out.

The wafer push mechanism provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a motor is installed.
The right wafer loader section is provided with a wafer pushing mechanism 12 driven by an air cylinder.

The semiconductor wafers 2 supplied from each wafer loader section are
This semiconductor wafer 2 is transported to a semiconductor wafer alignment section 14 for alignment.

The semiconductor wafer 2 is transported to the semiconductor wafer alignment section 14 by a transport belt 16 shown in FIG. This transport heald 16 is driven by a motor 18 in forward and reverse directions.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives the transferred semiconductor wafer 2 and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center of the semiconductor wafer 2. ．． Including 22□ etc.

The alignment table 20 is equipped with a vacuum chuck that holds the semiconductor wafer 2 by suction. Vl, 1 is a solenoid valve that turns on/off this vacuum chuck, PIJSW
I is a pressure switch that detects a pressure drop within the vacuum chuck and turns on.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable in the vertical direction by an air cylinder 26.

Center alignment plate 22. , 22□ are provided at positions facing each other with the alignment table 20 at the upper limit position interposed therebetween. Each center alignment plate 22, . An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposite surface side of the 22□. Temporary center alignment 22. ,22
2 is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

On both sides of the alignment table 20, there are transport healds 1.
A sea urchin hut 1 collar 30, for receiving the semiconductor wafer 2 conveyed on the sea urchin wafer 6.

There are 302. Wafer stopper 30. ．． It is swung by 30 degrees by an air cylinder (not shown). When the semiconductor wafer 2 is supplied from the left wafer loader section, the right wafer stopper 30 □ is pressed, and when the semiconductor wafer 2 is supplied from the right wafer loader section,
The left wafer stoppers 301 each rise to receive the semiconductor wafer 2 that has been transported.

Reference numeral 32 shown in FIG.
In order to detect the end of the orientation flan l-OF of the semiconductor wafer 2 which is being rotated while being sucked and held by the
This is an orientation flat end detection unit equipped with a 3Mi transmission type photoelectric element PL (SWL, 2.3).
As shown in the figure, the light emitting section 36 and the light receiving section 38 of the photoelectric element PH3W1.2.3 are configured to be openable and closable by an air cylinder 34. The reason for using these three sets of transparent iM type photoelectric elements PH3W1.2.3 is to select and use appropriate photoelectric elements according to the size of the semiconductor wafer 2. The orientation flat end detection section 32 is open in the normal state, and is used for positioning the orientation flat OF.
Closed when detecting its end.

Reference numeral 40 shown in FIG. 1 and FIG.
A reversing fork is used to transfer the semiconductor wafer 2 whose OF has been aligned to the table 42. The reversing fork 40 is equipped with a vacuum chuck for suctioning and holding the semiconductor wafer 2 from the back side. VL2 is
The solenoid valve PUSW2 that turns on/off the vacuum chuck is a pressure switch that detects a drop in pressure within the vacuum chuck and turns on.

The reversing fork 40 is driven by an air cylinder 44 to connect the alignment table 20 and the pasting table 4.
2, and is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. P.H.
3W4 is a photoelectric element for detecting whether the reversing fork 40 is in a predetermined position after performing a reversing operation.

As shown in FIG.
It includes a chuck table 48 and a frame chuck table 50 provided around the wafer chuck table 4. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 is laid on the wafer chuck table 48. Reversing fork 4
The semiconductor wafer 2 transported by the semiconductor wafer 2 is placed on the wafer chuck table 48 with its back side facing up via the protective film 52=11-. The protective film 52 is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of frames 4 in a stacked state, and a frame push-out mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. This frame extrusion mechanism, as shown in Figure 4,
an extrusion plate 58 for extruding the frame 4;
It is composed of an air cylinder 60 that drives this horizontally.

The frame 4 supplied from the frame loader section 54 is
The frame positioning section 62
It is sent out to The frame feeding section includes a frame pusher 64 that engages with the inner peripheral surface of the frame 4 pushed out from the frame stocker 56 and feeds out the frame 4, and an air cylinder 66 for raising and lowering the frame pusher 64. , an air cylinder 68 for horizontally driving the frame pusher 64, and the like. In the normal state, frame pusher 64 is lowered.

When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven to push up the frame pusher 64 and insert it into the frame 4, and then the air cylinder 68 is driven to push the frame pusher 64 up and into the frame 4. is sent out to the frame positioning section 62.

The frame positioning unit 62 has two positioning pins 70 (however,
Only one positioning pin 70 is visible in Fig. 4)
is provided. The frame 4 is positioned by engaging the positioning pin 70 with the notches 4+ and 42 of the frame 4. PH3W5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is transported to the table 42 for pasting by the frame conveying section, and the pasting is carried out by the table 42.
It is placed on the frame chuck table 50 of No. 2. As shown in FIG. 5, the frame transport section includes a frame chuck arm 72 that holds the frame 4 by suction, an air cylinder 73 that raises the frame chuck arm 72, and a frame chuck arm 72 that moves the frame chuck arm 72 horizontally. It is composed of an air cylinder 74 and the like for driving. VL3 is this frame chassis arm 72
The solenoid valve PUSW3 that turns on/off is a pressure switch that detects a drop in pressure within the frame chuck arm 72 and turns on.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport section. Fifth
VL4 shown in the figure is a solenoid valve that turns on/off the frame chuck table 50, and PUSW4 is a solenoid valve that turns on/off the frame chuck table 50.
This is a pressure switch that detects a pressure drop within the chuck table 50 and turns on. Further, PH3W6 is a photoelectric element that detects the frame 4 on the frame chuck table 50.

Next, a tape supply/winding mechanism and an adhesive tape cutting mechanism will be explained based on FIGS. 1 and 6.

The protective film 52 described above is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and taken up by a protective film take-up reel 78 provided on the other side of the table 42.

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is set on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator 84 is wound up separately from the adhesive tape 82 by a separator take-up reel 86 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a pasting roller unit consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 6, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is applied to the roller unit 90 at r3. The frame is passed in the shape of a square, and further passed to a peeling roller unit 92 arranged in parallel to the pasting roller unit 90, and then wound onto a residue tape take-up reel 88.

As shown in FIG. 7, the pasting roller unit 90 is connected to the tip of an air cylinder 94 that horizontally drives the pasting roller unit 90. Furthermore, the peeling roller unit 92 is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide on a rail 96 by means of cam followers provided above them. The rail 96 has air cylinders 9B provided at both ends thereof.
, 9B□, it is configured to be able to move up and down. A rack and pinion mechanism 100 is provided at the bottom of the roller unit 90, and this rank and pinion mechanism 100 is driven by a motor 106 coupled via a brake 102 and a clutch 104. There is.

The operations of the above-mentioned pasting roller unit 90 and peeling roller unit 92 will be explained with reference to FIGS. 7 and 8.

In the normal state, each roller unit 90, 92 is attached at the origin position to the left of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When pasting is performed, use an air cylinder 98 times, 98□
is activated and the rail 96 is lowered. Then, a cock (not shown) provided in connection with the peeling roller unit 92 is operated to maintain the peeling roller unit 92 in a stopped state. In this state, when the air cylinder 94 is activated, only the pasting roller 90 is driven in the horizontal direction, and the pasting roller rolls while pressing the adhesive tape 82 on the table 42 downward, thereby creating an adhesive. tape 8
2 and the semiconductor wafer 2 are attached.

At this time, the flange 104 is open.

When the residual tape is to be peeled off from the frame 4 or the like after cutting the adhesive tape 82, the peeling roller unit 92 is released and the brake 102 is activated. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one. The peeling roller unit 92 separates the residual tape ff111 by rotating the peeling roller while moving horizontally. Figure 8 shows each roller unit (90) at the time when such a peeling operation is completed.
．． 92 position is shown.

Returning to the origin W of each roller unit 90, 92 after the peeling operation is completed is performed as follows.

First, air cylinder 98. ．． 98□ operates to raise the rail 96 by -L. The reason why the rail 96 is raised by 1" is that each roller unit t9 is raised during the return-to-origin operation.
When the attached tape rolls on the table 42, the residual tape peeled off by the above-mentioned peeling operation is left on the frame 4.
This is because it will be re-adhered to etc. As the rail 96 rises, the brake 102 is released and the flange 104 is coupled. Then, the motor 106 operates to
By driving the pinion mechanism 100, the pasting roller unit/nose 90 and the peeling roller unit 92 are integrally moved horizontally to the left and return to the origin.

For pasting, an adhesive tape cutting mechanism 1 is provided above the table 42 for cutting the band-shaped adhesive tape 82 pasted by the above-described pasting operation into a circular shape along the frame 4.
08 is provided. This adhesive tape cutting mechanism 108
As shown in FIG. 6, pasting is done by pressing and holding the adhesive tape 82 on the table 42)11
0, a tape cutter 112 that is rotatably driven along the outer periphery of the presser plate 110, and the like. The press plate 110 and the tape cutter 112 are configured to be movable downward as a unit.

Reference numeral 114 shown in FIG. 6 is a mount/frame chuck arm for ejecting the mount frame 6 from the attachment table 42. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves the peeling operation point of the peeling roller unit 92 to the side of the pasting table 42, and
The frame 6 is held by suction, and the mount frame 6 is discharged and conveyed by the return-to-origin operation of the peeling roller unit 92 or the like. In addition, VL5 shown in FIG. 6 is a solenoid valve that turns on/off this mount/frame chuck arm 114, and PUSW5 is a solenoid valve that turns on/off the mount/frame chuck arm 114.
This is a pressure switch that detects a drop in the pressure within 14 and turns on.

The mount frame 6 suctioned and held by the mount frame chuck arm 114 is conveyed to the swing reversing unit 116 by the return-to-origin operation of each of the roller units 90 and 92. As shown in FIGS. 6 and 9, the swing reversing unit 116 includes a clamp mechanism 11 that holds the transported mount frame 6.
In addition to 8, there is also a swing mechanism 120 that swings the held mount frame 6 approximately 180 degrees in the horizontal direction, an inversion mechanism 122 that inverts the swung mount frame 6 so that the surface of the semiconductor wafer 2 faces up, and The apparatus includes a vertical drive mechanism 124 for lowering the mount frame to the heat stage 126. Note that the PHS W 7 provided in the clamp mechanism 118 is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

The heat stage 126 is provided for the purpose of increasing tape tension by heating when using an adhesive tape using a heat-shrinkable film as a support.

As shown in FIG. 9, the mount frame 6 on the heat stage 126 is adjacent to the heat stage 126.
Mount frame extrusion mechanism 12 for extruding
8 and a transport table 130 for transporting the extruded mount frame 6 to a frame cassette 132 (132, to 1324) shown in FIG. The conveyance table 130 is configured to be movable in the horizontal direction by an air cylinder 131 shown in FIG. 9, and includes a conveyor belt 134 for conveying to the unrotor section on the left side and a conveyor belt 134 for conveying to the unrotor section on the right side. The belt 136 is arranged so that the mount frames 6 can be distributed.

In addition, PH3W8 shown in FIG. 9 is heat stage 1.
A photoelectric element for detecting the mounting frame 6 on 26, P
H3W9 is a photoelectric element that detects the extrusion of the mount frame 6 on the heat stage 126, and PH5WIO is a photoelectric element that detects the reception of the mount frame 6 by the transport table 130.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equal intervals, and in this embodiment, four frame cassettes 1321 to 1324 can be stored. Frame cassette 132. ．． 132□ has frame cassette 1.3L, 1 in the left unrotor section.
32= are respectively sent to the right unrotor section. Each unrotor section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. The operation panel 138 is provided with a three-digit, seven-segment LED that displays a code corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a patrol light that displays automatic driving operations, error occurrences, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 11.

The control unit 142 includes a CPU 144. ROM146°RAM
148. Operation panel controller 150. Sensor controller 152. Actuator controller 154. It is composed of a pulse motor controller 156 and the like.

The CPU 144 controls the entire device according to a processing program stored in the ROM 146. RAM14
8, data such as the size of the semiconductor wafer to be pasted and processing conditions are written. Operation panel controller 15
0 refers to the operation panel 138, the sensor controller 152 refers to a group of various sensors 158 such as pressure switches and photoelectric elements provided in this device, and the actuator controller 15
Reference numeral 4 controls various actuator groups 160 such as motors and air cylinders provided in this apparatus, and a pulse motor controller 156 controls the pulse motor 24 that rotationally drives the alignment table 20.

Next, the operation of the automatic semiconductor wafer bonding apparatus having the above-described configuration will be explained according to the operation flowchart shown in FIG.

When the apparatus is started with each part of the apparatus having returned to its original position and with the wafer cassette 8 and frame cassette 132 installed in the wafer loader section and unrotor section, respectively, the wafer - The evaporator loader section on one side with the cassette 8 attached is lowered (step S2).

It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in the wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the conveyor belt 16 is driven, and the detected semiconductor wafer 2 is pushed out from inside the wafer cassette 8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section (step S8 ). The extruded semiconductor wafer 2 is conveyed to the semiconductor wafer positioning section 14 on the first general conveyance heald 16 .

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is confirmed whether or not it has been received (step 510).

Confirmation of receipt of the semiconductor wafer 2 is detected by a photoelectric element PH3WI provided near the alignment table 20, as shown in FIG. After a certain period of simultaneous iM, the alignment table 20 is placed on the semiconductor wafer 2.
If not received, an error display ■ is performed (step 5L2), the error display light of the patrol light 140 lights up, and the 7 segment LE of the operation panel 138 is turned on.
D displays the code corresponding to this error.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). And center alignment plate 22. , 22□ are driven to determine the center of the semiconductor wafer 2 (step 816). Once the center of the semiconductor wafer 2 has been determined, the vacuum chuck of the alignment table 20 is operated to suck the semiconductor wafer 2 (step 818). and a pressure swifter PUSWI provided in connection with the vacuum chuck.
As a result, it is confirmed whether the semiconductor wafer 2 is reliably attracted (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flat OF of the semiconductor wafer 2 is aligned (step 524).

Below, the procedure for aligning the orientation flat of the semiconductor wafer, which is performed in this step, will be explained as follows.
This will be explained based on FIG. 3 and FIG. 14.

FIG. 13 shows the center alignment plate 22. , 22□, the semiconductor wafer 2 is aligned and centered.
A state in which the table 20 has been adsorbed is shown. The end of the orientation flat OF is provided with a photoelectric element PH3W that is appropriately selected according to the size of the semiconductor wafer 2.
I, 2.3. In this figure, only the photoelectric element PH3WI is shown for convenience. The photoelectric element PH5WI is located slightly inside the radius of the semiconductor wafer 2 from the center of the alignment table 20. The output of the photoelectric element PH3WI is directly input to a pulse motor controller 156 that controls the pulse motor 24. The pulse motor controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element PH3WI. Further, the pulse motor controller 156 outputs a rotation amount to the pulse motor 24 based on a command from the CPU 144, and also provides the CPU 144 with the rotation amount until the pulse motor 24 comes to a stopped state.

FIG. 14 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 144 sets a rotation amount to rotate the pulse motor 24 by 360' counterclockwise (step 5130), and controls this via the pulse motor controller 156. It outputs to the pulse motor 24 (step 5132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation flat O
When one end of F is detected by the photoelectric element PH3WI, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

After completing step 5132, the CPU 144 monitors whether the pulse motor 24 has stopped (step S
134).

After confirming that the pulse motor 24 has stopped, the CPU
144 sets the amount of rotation for rotating the pulse motor 24 clockwise 360 degrees (step 5136), and sets the rotation amount to rotate the pulse motor 24 through the pulse motor controller 156.
4 (step 5138). As a result, the semiconductor wafer 2 is rotated clockwise. Then, when the other end of the orientation flat OF is detected by the photoelectric element PH3WI, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

When the CPU 144 confirms that the pulse motor 24 has stopped (step 5140), the CPU 144 determines the clockwise rotation amount θ at that time.
is read (step 5142).

Then, the amount of rotation for rotating the pulse motor 24 in the counterclockwise direction by θ/straddle is set (step 5144), and this is output to the pulse motor 24 via the pulse motor controller 156t-. As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat OF intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element PH3WI.

The above is the basic procedure for aligning the orientation flat OF, but depending on the model of the semiconductor wafer 2,
Final positioning may be completed by further rotating the semiconductor wafer 2 by 90° or 180°.

Hereinafter, referring back to FIG. 12, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 526). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step S22 described above and an error display (2) is displayed.

By the way, after the above-mentioned step S14 is completed, the process moves to step S16 and also moves to step 828. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530). At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction.

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). The presence or absence of suction is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If the adsorption is not performed, an error message ■ is displayed (step 534), and the bar 1-write 140 is
The error display light on the control panel 138 lights up.
The 7 segment LED will display the code corresponding to this error.

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 53).
6). Then, it is determined whether or not the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 40 is reversed is determined based on the detection signal of the photoelectric element PH3W4 provided in relation to the reversing fork 40. If the reversing fork 40 has not been reversed to the predetermined position, an error message ■ will be displayed (step 5).
40) The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the reversing fork 40 is correctly reversed, the suction of the semiconductor wafer 2 is confirmed again (step 54).
1) If it is not absorbed, the above error message will be displayed.
(step 534).

When the semiconductor wafer 2 is confirmed to be attracted, the reversing fork 4
0 is pasted and retreats to the table 42 side (step 542
). Then, the reversing fork 40 releases the suction of the semiconductor wafer 2 and transfers the transferred semiconductor wafer onto the wafer chuck table 48 covered with the protective film 52 (step 544). The back side of the semiconductor wafer 2 is facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. As a result, the frame 4 stored in the frame stocker 56 is pushed out by the frame push-out mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 548), and moves forward while engaging the inside of the pushed-out frame 4 (step 550). As a result, the frame 4 is sent out to the frame positioning section 62, and the V notches 49, 4□ of the frame 4 are moved to the frame positioning section 62.
The frame 4 is positioned by engaging with a positioning pin 70 provided in the frame 4 .

Then, it is confirmed whether the frame 4 has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element P)ISW5 provided in the frame positioning section 62. If frame 4 is not aligned, an error message ■ is displayed (step 554).
, the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the frame 4 has been positioned, the frame chuck arm 72 that conveys the frame 4 to the table 42 is lowered (step 556) and sucks the positioned frame 4 (step 858). Next, it is determined whether the frame 4 has been picked up by the frame 7 arm 72 (step 560). This is determined based on the detection signal of the pressure gas islet PUSW3 provided in relation to the frame chuck arm 72. If the frame 4 is not attracted, an error display ■ is displayed (step 562), the error display light of the patrol light 140 lights up, and the 7
segment) LED displays the code corresponding to this error.

When it is confirmed that the frame 4 is attracted, the frame chuck arm 72 is raised (step 564).
). Then, it is checked again that frame 4 has been attracted (step 565), and if it has not been attracted, the above-mentioned error display (2) is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the attachment table 42 (step 3).
66). Then, the frame chuck arm 72 descends and transfers the frame 4 to the frame chuck table 50 (step 567).

When the transfer of the frame 4 is confirmed, the frame chuck table 50 is operated to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably sucking the frame 4 (step 571). This is determined based on the detection signal of the pressure switch PUSW4 provided in association with the frame chuck table 50.

If the frame 4 is not attracted, an error display (2) is performed (step 572), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

After confirming that the frame 4 is attracted to the frame/chuck table 50, the frame/chuck arm 7
In order to release the suction of the frame chuck arm 72 (step 573), the frame chuck arm 72 rises (step 574).

Through the above steps, the semiconductor wafer 2 and frame 4 are placed on the attachment table 42.

When the frame chuck arm 72 is raised, the pasting roller unit 90 is lowered (step 575). As a result, the adhesive tape 82 placed on the roller unit 90 also descends, and this adhesive tape 82 is attached to the wafer.
It comes into contact with the back surface of the semiconductor wafer 2 on the chuck table 48. When the pasting roller unit 90 is lowered, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, the roller of the roller unit 90 presses lightly while rolling on the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2, and the semiconductor wafer 2, the adhesive tape 82, and the frame 4 are attached. (step 576).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, by rotating the tape cutter 112 once around the presser plate 110, the adhesive tape 82 is cut so as to be slightly smaller than the outer shape of the frame 4 (step 8).
78).

When cutting of the adhesive tape 82 is completed, the wafer chuck table 48 is lowered (step 580), the protective film take-up reel 78 is driven to wind up the protective film 52, and a new protective film 52 is transferred to the wafer chuck table 48. − (step 582)
.

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residue of the adhesive tape 82 stuck to the periphery of the frame 4 is peeled off from the frame 4 (step 584).

After the adhesive tape has been peeled off, the mount/frame chuck arm 114 for ejecting the mount frame 6 on the table 42 is attached to step 886.
). Adsorb the mount frame 6 (step 388
). Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). This is determined based on the detection signal of the pressure switch PUSW5 provided in connection with the mount/frame chuck arm 114. If the mount frame 6 is not attracted, an error message X is displayed (step 592), and the patrol light 1
Error indicator light 40 lights up and operation panel 1
38 7-segment LEDs display the code corresponding to this error.

When it is confirmed that the mount frame 6 is attracted, the mount frame chuck arm 114 is raised (step 594). After the mount/frame chuck arm 114 is raised, check again whether the mount/frame 6 is attracted (step 595), and if it is not attracted, an error message X is displayed (step 592). When the suction of the mount frame 6 is confirmed, the pasting roller unit 90 and peeling roller unit 92, which have moved to the pasting table 42, return to their original positions (origins) (step 596). For pasting, the roller unit 90 and peeling roller unit 92 return to their origin, and
The mount/frame chuck arm 114 that has attracted the mount frame 6 also moves toward the swing reversing unit 116 (step 598), and the mount/frame chuck arm 114 moves toward the swing reversing unit 1.
After moving to the position where one end of the mount frame 6 is inserted into the clamp mechanism 118 of 16, check again that the mount frame 6 is attracted (step 599).
If it is not absorbed, an error message X is displayed (step 592).

When adsorption of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 5100).
. Then, it is confirmed whether the mount frame 6 is securely clamped (step 5102). This is due to the photoelectric element P H provided in the clamp mechanism 118.
The determination is made based on the detection signal of SW7. mount·
If frame 6 is not clamped, error display XI is performed (step 5104), and the patrol light 1-4
= 40 error display light lights up and operation panel 1
38 7-segment LEDs display the code corresponding to this error.

After confirming that the mount frame 6 is clamped, the swing reversing unit 116 swings approximately 180 degrees in the horizontal direction (step 5106), and confirms that the mount frame 6 is clamped again (step 51).
07). If it is not clamped, error display XI is performed (step 5104). When the clamping of the mount frame 6 is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 3108). And once again, mount frame 6
Confirm the clamping (Step 5IO9), and if it is not clamped, an error display XI is displayed (Step 3104).

When the clamping of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the heat stage 126 (step 5llO). This is performed based on the detection signal of the photoelectric element PH3W8 provided on the heat stage 126. If there is another mount frame 6 on the heat stage 126, an error display x is displayed (step 5ill), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 responds to this error. Show code.

When it is confirmed that there is no other mount frame 6 on the heat stage 126, the swing reversing unit 116 descends (step 5112), and when the mount frame 6 reaches above the heat stage 126, the clamp mechanism 118 is released. (Step 5113). This moves the mount frame 6 to the heat stage 126.

Mount frame 6 transferred to heat stage 126
is heated here (step 5l14). This causes the adhesive tape on the mount frame 6 to contract, increasing the tape tension.

However, if such slack removal is not required, this step 5114 is omitted.

After heating the mount frame 6, the mount frame 6 is heated.
Frame pushing mechanism 128 is activated to push out the mounting frame on heat stage 126 (step 5116). Then, it is confirmed whether the mount frame 6 has been pushed out from the heat stage 126 (step S], 18). This is heat stage 12
The judgment is made based on the detection signal of the photoelectric element PH3W9 provided at the end of the photoelectric element PH3W9. If the mount frame 6 is not pushed out, an error display X is displayed (step 5120), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. Display.

The mount frame 6 pushed out from the heat stage 126 rides on a transport table 30 for transporting it to the unrotor section. Then, the photoelectric element PH3WIO provided on the transport table 130 confirms whether the mount frame 6 has been received by the transport table 130 (stay 43=knob 5122). If the mount frame 6 is not received on the transport table 130, error display XIV
(step 5124), the error display light on the patrol l-140 lights up, and the
A segment LED will display the code corresponding to this error.

If the mount frame 6 is received on the transport table 130, the mount frame 6 is transported to the unrotor section and stored in the frame cassette 132 set in the unrotor section (step 5126).
). When the photoelectric element provided in the unrotor section detects that the mount frame 6 has been stored in the frame cassette 132, the unrotor section moves up one pitch to accommodate the next mount frame 6. (Step 5L28).

As described above, after aligning the semiconductor wafer 2 supplied from the wafer loader section in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame cassette 132 and storing the mount frame 6 with the semiconductor wafer 2 attached thereto in the frame cassette 132, are automatically performed.

Next, the automatic attachment of semiconductor wafers according to this embodiment requires a function that is installed in the apparatus to detect errors in remaining heat stage mounting frames,
Let us specifically explain the function of detecting a frame extrusion error and the function of detecting a mount/frame receiving error of the mount/frame transport unit.

When the mount frame 6 is transferred to the heat stage 126 by the swing inversion unit 116, if another mount frame remains on the heat stage 126, the two mount frames 6 will overlap and the subsequent mount frame will be The frame 6 cannot be ejected. Also,
Even if there is a mistake in pushing out the mount frame 6 from the heat stage 126 or a mistake in receiving the mount frame by the transport table 130 as the mount frame transport section, the mount frame 6 cannot be stored in the unrotor section, which is inconvenient. It is.

Therefore, each of the above-mentioned functions is important for the automatic attachment of semiconductor wafers.

By the way, in the embodiment described above, heat stage 1
The function of detecting the mounting frame 6 on the first
This is obtained by the photoelectric element PH3W8 as a detection means and the control section 142 as a first error determination means. That is, if the mount frame 6 remains on the heat stage 126, the photoelectric element PH3W8 is turned on. Before transferring the mount frame 6 from the swing inversion unit 116 to the heat stage 126, the control unit 142 determines whether the mount frame remains incorrect by checking whether this photoelectric element PH3W8 is in the ON state (
(Step 5ILO shown in FIGS. 12 and 15) On the other hand, the function of detecting an extrusion error of the mount frame 6 from the heat stage 126 is performed using the photoelectric element PH3W9 as a second detection means and the control as a second error determination means. 142.

That is, from the heat stage 126 to the mount frame 6
When pushed out, the photoelectric element PH3W9 is turned on. The control unit 142 determines whether the mount frame has been pushed out incorrectly depending on whether the photoelectric element PH3W9 is in the ON state (step 3118 shown in FIGS. 12 and 15).

In addition, the mount/frame receiving error detection function of the transport table 130 as the mount/frame transport unit is as follows:
This is obtained by the photoelectric element PH3WIO as the third detection means and the control section 142 as the third discrimination means. That is, when the mount frame 6 is received by the transport table 130, the photoelectric element PH5WIO is turned on. The control unit 142 determines whether the mount frame has been pushed out incorrectly depending on whether or not the photoelectric element PH3WIO is in the ON state (step 5122 shown in FIGS. 12 and 15). However, after the mount frame 6 is pushed out, this mount frame 6 is attached to the photoelectric element PH3.
Since it takes a considerable amount of time to reach the WIO position, this step 5122 takes into consideration the following waiting time.

That is, as shown in FIG. 15, at the same time as the extrusion of the mount frame 6 is confirmed in step 5l18,
A timer included in the CPU 144 of the control unit 142 shown in FIG. 11 is cleared (step 5122). Then, it is determined whether the transport table 130 has received the mount frame 6 based on the detection signal of the photoelectric element PH3WIO (step 5122□). Photoelectric element PH
If 3W10 is not in the ON state, check whether the timer has timed out (step 51).
223). If the time has not exceeded, it means that the time required for the mount frame 6 to be transported has not elapsed, and the process returns to step 31222. On the other hand, even if the time is over, the photoelectric element PH3WIO remains ON.
If the mount frame 6 is not in the
It is determined that the item was not received by the transport table 130 for some reason, and an error display XIV (step 512) is displayed.
Do 4).

When the receipt of the mount frame 6 is confirmed in step 5122, the process proceeds to step 8126 described in FIG. 12, and the mount frame 6 is stored in the unrotor section.

Next, we will briefly explain the recovery process that is performed when an error occurs in the automatic attachment of semiconductor wafers according to the above-described embodiment.

When any of the above-mentioned errors occurs, each mechanical section that is a process subsequent to the location where the error occurs continues each operation for m times and stops when each operation cycle is completed. On the other hand, the location where the error occurred and each mechanical section corresponding to the preceding process stop when the error occurs. Based on the double error display, the operator takes appropriate measures such as removing the workpiece (for example, semiconductor wafer 2 or frame 4) where the error has occurred or correctly inserting the cassette. Then, each mechanical section corresponding to the process preceding the error occurrence point is returned to its origin, and the apparatus is restarted.

In addition, in the above-mentioned embodiment, the first to third detection means are composed of photoelectric elements PH3W8 to PH3WIO, but
The present invention is not limited to this, and for example, an appropriate detection means such as a proximity switch can be used.

Furthermore, the display mode indicating the mount frame remaining error, mount frame extrusion error, and mount frame receiving error is not limited to that described in the embodiment,
Various modifications such as buzzer display etc. can be implemented.

Furthermore, the semiconductor wafer automatic pasting device according to the present invention includes:
Of course, the present invention is not limited to the devices described in the embodiments.

<Effects of the Invention> As is clear from the explanation in Section 2 below, the apparatus for automatically attaching semiconductor wafers according to the present invention includes a first detection means for detecting a mount I frame on a heat stage; a first determining means for determining whether the heat stage mount frame remains incorrectly based on a detection signal of the detecting means; a second detecting means for detecting the mount frame pushed out from the heat stage; a second determination means for determining whether the mount frame has been pushed out from the heat stage based on the detection means of the means; a third determination means for detecting the mount frame in the mount frame transport section;
Based on the detection means and the detection signal of this third detection means,
and a third determining means for determining whether the mount frame transport unit has received the mount frame incorrectly.

Therefore, according to the present invention, if the mount frame remains on the heat stage due to some abnormality, or if there is a mistake in pushing out the mount frame or in receiving the mount frame, the operator can Automatic semiconductor wafer attachment is very convenient for improving the operating efficiency of the equipment because it allows you to know when an abnormality has occurred in the equipment and where it is occurring, allowing you to quickly take appropriate measures. It is.

[Brief explanation of the drawing]

Figure 1 is an explanation showing the outline of the overall configuration of an apparatus for automatically attaching semiconductor wafers according to an embodiment of the present invention = 51- figure, and Figure 2 is a diagram showing the vicinity of the semiconductor wafer alignment section and reversing fork in the embodiment described above. FIG. 3 is a configuration diagram of the orientation flat end detection unit in the embodiment, FIG. 4 is a configuration diagram of the frame loader unit and frame positioning unit periphery in the embodiment, and FIG. 5 is a configuration diagram of the orientation flat end detection unit in the embodiment described above. FIG. 6 is a configuration diagram of the area around the frame conveyance unit in the example, FIG. 6 is a configuration diagram of the adhesive tape supply system and the area around the adhesive tape cutting mechanism in the example, and FIGS. 9 is a diagram illustrating the configuration and operation of the roller unit; FIG. 9 is a diagram illustrating the configuration around the heat stage in the embodiment; FIG. 10 is an explanatory diagram of the semiconductor wafer, frame, and mount frame used in the embodiment; 12 is a block diagram showing an outline of the configuration of the control system in the embodiment, FIG. 12 is an operation flowchart of the embodiment, FIG. 13 is an explanatory diagram of orientation flat alignment in the embodiment, and FIG. 14 is an illustration of the orientation flat alignment in the embodiment. FIG. 15 is an operational flowchart for orientation flat/7 position alignment in the embodiment. FIG. 15 is a specific operational flowchart for detecting a mount frame remaining error, mount frame extrusion error detection, and mount frame receiving error detection in the embodiment. . 2... Semiconductor wafer, OF... Orientation flat, 4... Frame, 6... Mount frame, 8... Wafer cassette, 14... Semiconductor wafer positioning unit, 20... Alignment table, 24... Pulse motor, 32... Orientation flat end detection section, 40... Reversing fork, 4
2... Paste on table, 48... Wafer/chuck table, 50... Frame/chuck table, 5
4...Frame loader section, 62...Frame position f
f determining part, 72...frame chuck arm, 82
... Adhesive tape, 90... Roller unit for pasting,
92... Peeling roller unit, 108... Adhesive tape cutting mechanism, 114... Mount/frame chuck arm, 116... Swing reversing unit, 118...
... Clamp mechanism, 126 ... Heat stage, 12
8...Mount frame extrusion mechanism, 130...
・Transport table, 132...Frame cassette, 1
38... Operation panel, 140... Patrol light, 142...
...Control unit, 144...CPU, PH3WI~PH3
WII...Photoelectric element, PUSWI~PUSW5...
Pressure switch.

Claims (1)

[Claims] An automatic semiconductor wafer pasting device that aligns a semiconductor wafer on which an orientation flat is formed and pastes it onto an adhesive tape, comprising: a frame holding the adhesive tape to which the semiconductor wafer is pasted; a heat stage on which a mount frame (mount frame) is placed and capable of heat-treating the mount frame; a first detection means for detecting the mount frame on the heat stage; based on a detection signal of the first detection means, a first error determining means for determining whether a remaining mount frame of the heat stage is incorrect; a mount frame pushing mechanism unit that pushes out the mount frame placed on the heat stage; and a mount frame pushed out from the heat stage. a second detection means for detecting a detection signal of the second detection means; a second error determination means for determining a mistake in pushing out the mount frame from the heat stage; - a mount frame transport section that receives a frame and transports it toward an unrotor section; a third detection means that detects the mount frame in the mount frame transport section; a detection signal of the third detection means; an automatic semiconductor wafer pasting apparatus, comprising third error determining means for determining whether the mount frame transfer unit receives a mount frame incorrectly based on the above.