JPS63155640A - Automatic sucking system for semiconductor wafer - Google Patents

Abstract

PURPOSE:To detect an error of the suction of a frame by a frame-chuck table by judging whether a pressure-detecting means has detected a change in the pressure of the table during a prescribed time after the table has started to such the frame. CONSTITUTION:If a solenoid valve VL4 which is installed in connection with a vacuum chuck of a frame-chuck table 50 is actuated and the table 50 starts to such a semiconductor wafer frame 4, a timer inside a control unit is cleared. It is judged by a detection signal of a pressure switch PUSW 4 whether the table 50 has sucked the positioned frame 4. If the table 50 has sucked the frame 4, the pressure inside the vacuum chuck is lowered and the PUSW 4 is set to an ON state. If this PUSW 4 is turned off, said timer confirms whether a time limit has been exceeded or not. If the time limit has been exceeded, it is judged that the frame 4 has not been sucked by the table 50 for one cause or another, and an error is displayed.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is cracked while attached to the adhesive tape. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next die bonding process.

This process of attaching the semiconductor wafer to the adhesive tape is performed as a pre-process of the semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafers to adhesive tape.

<Problems to be Solved by the Invention> The present invention has been developed in view of the above circumstances, and is an apparatus for automatically attaching semiconductor wafers. An object of the present invention is to provide an apparatus for automatically attaching a semiconductor wafer, which has a function of detecting whether or not a frame chuck table is adsorbing the frame.

Such objects of the present invention will become clearer in the detailed description of the present invention that follows.

Means for Solving the Problems> In order to achieve the above object, the present invention adopts the following configuration.

That is, the present invention provides an automatic semiconductor wafer attachment device for aligning a semiconductor wafer on which an orientation flat is formed and attaching it to an adhesive tape, the invention comprising: a wafer chuck on which the pre-aligned semiconductor wafer is placed; a table; a frame chuck table provided around the wafer chuck table and sucking and holding a pre-positioned ring-shaped frame for holding the adhesive tape to which the semiconductor wafer is attached; a suction detection section that detects whether or not the frame/chuck table is suctioning the frame; the suction detection section includes: pressure detection means that detects a pressure change in the frame/chuck table; and the frame/chuck table. A frame suction error of the frame/chuck table is determined based on whether or not the pressure detection means detects a change in the pressure of the frame/chuck table within a certain period of time after the table starts suctioning the frame. The present invention is characterized by comprising an error determination means.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of the automatic semiconductor wafer attachment device according to the present embodiment, and FIGS. 2 to 9 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attachment device. It is.

The tenth threshold is the semiconductor wafer 2 that is attached to the adhesive tape by the automatic attachment of the semiconductor wafer according to this embodiment.
, a frame 4 for holding the adhesive tape to which the semiconductor wafer 2 is attached, and a mount frame 6 which is the frame to which the semiconductor wafer 2 is attached.

An orientation flat OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2 . An element pattern is formed on the semiconductor wafer 2 with this orientation flat O-4=F as a reference.

The frame 4 is a ring-shaped metal plate or resin plate,
On its outer periphery, there is a V-notch 4, which is used when aligning the frame 4, which will be described later. ．． 42 is formed.

For automatic attachment of semiconductor wafers according to this embodiment, the apparatus separately supplies the semiconductor wafer 2 described above from the wafer loader section and the frame 4 from the frame loader section, and attaches them to the adhesive tape (=j, final Specifically, the frame 6 is stored in the unloader section.

The +14 configuration of each part of this device will be explained below.

Reference numeral 8 (8, to 84) shown in FIG. 1 is a wafer cassette set in the wafer loader section. Wafer
The cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically at regular intervals. In this embodiment, there are two wafer loader sections: the left wafer rotor section has wafer cassettes 84, 8□, and the right wafer rotor section has wafer cassettes 83, 8. can each be a cent. Each wafer loader section is configured to be movable in the vertical direction, and the wafer cassette 8
The semiconductor wafer 2 is supplied by detecting the semiconductor wafer 2 inside and pushing it out.

The wafer push mechanism provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a motor is installed.
The right wafer loader section is provided with a wafer pushing mechanism 12 driven by an air cylinder.

The semiconductor wafers 2 supplied from each wafer loader section are
The semiconductor wafer 2 is transported to the semiconductor wafer alignment section 14 for aligning the semiconductor wafer 2.
The semiconductor wafer is transported to the semiconductor wafer alignment section 14 by the transport heald 16 shown in FIG. This transport heald 16 is driven by a motor 18 in forward and reverse directions.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives and receives the semiconductor wafer 2 that has been transferred and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center alignment plate 22. ．． Including 22° etc.

The alignment table 20 is equipped with a vacuum chuck for holding the semiconductor wafer 2 by suction. VLL is
The solenoid valve PUSWI that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in pressure within the vacuum chuck.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable northward by an air cylinder 26.

Center alignment plate 22. ．． 22□ is provided at a position facing the alignment table 20 at the upper limit position. An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposing surface side of each center alignment plate 221.22°. Center alignment plate 22. ．． 22
□ is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

On both sides of the alignment table 20, there are transport healds 1.
a wafer stopper 30 for receiving and stopping the semiconductor wafer 2 conveyed on the wafer 6; .

There are 30□. Wafer stopper 30. ．． 30□ is swung by an air cylinder (not shown). When the semiconductor wafer 2 is supplied from the left wafer loader section, the right wafer stopper 30 □ is pressed, and when the semiconductor wafer 2 is supplied from the right wafer loader section,
The left wafer stoppers 301 each rise to receive and stop the semiconductor wafer 2 that has been transported.

Reference numeral 32 shown in FIG.
In order to detect the edge of the orientation flat OF of the semiconductor wafer 2 which is being held by suction and rotating,
This is an orientation flat edge detection unit equipped with a set of transmission type photoelectric elements PH3W1.2.3. As shown in FIG.
The light receiving section 38 and the light receiving section 38 are configured to be openable and closable by the air cylinder 34. The reason why such three sets of transmission type photoelectric elements PH3W1.2.3 are used is to select and use appropriate photoelectric elements according to the size of the semiconductor wafer 2. The orientation flat end detection section 32 is open in a normal state, and is closed when detecting the end of the orientation flat OF for positioning.

The reference numeral 40 shown in FIGS. 1 and 2 is a reversing fork for transporting the semiconductor wafer 2 whose orientation flat OF has been aligned by the semiconductor wafer alignment section 14 to the attachment table 42. The reversing fork 40 is equipped with a vacuum chuck that attracts and holds the semiconductor wafer 2 from the back side. V L 2
For example, a solenoid valve, PUSW, turns on/off this vacuum chuck.
Reference numeral 2 denotes a pressure switch that detects a decrease in pressure within the vacuum chuck and turns on.

The reversing fork 40 is driven by an air cylinder 44 to connect the alignment table 20 and the pasting table 4.
2, and is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. P.H.
3W4 is a photoelectric element for detecting whether the reversing fork 40 is in a predetermined position after performing a reversing operation.

As shown in FIG.
It includes a chuck table 48 and a frame chuck table 50 provided around the wafer chuck table 4. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 is laid on the wafer chuck table 48. Reversing fork 4
The semiconductor wafer 2 transported by the wafer 2 is placed on the wafer chuck table 48 via the protective film 52 with its back side facing upward. Protective film 52
is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of frames 4 in a stacked state, and a frame push-out mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. This frame extrusion mechanism, as shown in Figure 4,
an extrusion plate 58 for extruding the frame 4;
It is composed of an air cylinder 60 that drives this horizontally.

The frame 4 supplied from the frame loader section 54 is
The frame positioning section 62
It is sent out to The frame feeding section includes a frame button 64 that engages with the inner peripheral surface of the frame 4 pushed out from the frame stocker 56 and feeds out the frame 4, and an air cylinder for raising and lowering the frame button 64. 66, and an air cylinder 68 for horizontally driving the frame pusher 64. In the normal state, frame pusher 64 is lowered.

When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven to push up the frame pusher 64 and insert it into the frame 4, and then the air cylinder 68 is driven to push the frame pusher 64 up and into the frame 4. is sent out to the frame positioning section 62.

The frame positioning section 62 is provided with two positioning pins 70 (however, only one positioning pin 70 is shown in FIG. 4) for positioning the sent-out frame 4. This positioning pin 70 and the frame 4
The frame 4 is positioned by engaging the V-notches 41, 4□. PH3W5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is transported to the table 42 for pasting by the frame conveying section, and the pasting is carried out by the table 42.
It is placed on the frame chuck table 50 of No. 2. As shown in FIG. 5, the frame transport section includes a frame chuck arm 72 that holds the frame 4 by suction, an air cylinder 73 that raises this frame chuck arm 72, and a horizontal drive of the frame chuck arm 72. It is composed of an air cylinder 74, etc. for VL3 is a solenoid valve that turns on/off the frame chuck arm 72, and PUSW3 is a pressure switch that detects a drop in pressure within the frame chuck arm 72 and turns on.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport section. Fifth
VL4 shown in the figure is a solenoid valve that turns on/off the frame chuck table 50, and PUSW4 is a solenoid valve that turns on/off the frame chuck table 50.
This is a pressure switch that detects a pressure drop within the chuck table 50 and turns on. Further, PH3W6 is an optical element that detects the frame 4 on the frame/chuck table 50.

Next, a tape supply/winding mechanism and an adhesive tape cutting mechanism will be explained based on FIGS. 1 and 6.

The above-mentioned protective film 52 is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and wound up by a protective film take-up reel 78 provided on the other side of the table 42. .

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is set on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator 84 is wound up separately from the adhesive tape 82 by a separator take-up reel 86 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a pasting roller unit consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 6, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is applied to a roller unit 90 in an "S" shape, and is applied in parallel to the roller unit 90. The frame is then passed to the peeling roller unit 92 and wound onto the residue tape take-up reel 88.

As shown in FIG. 7, the pasting roller unit 90 is connected to the tip of an air cylinder 94 that horizontally drives the pasting roller unit 90. Furthermore, the peeling roller unit 92 is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide on a rail 96 by means of cam followers provided above them. The rail 96 has air cylinders 98 provided at both ends thereof.
．． ．． It is configured to be movable up and down by 98□. A rack and pinion mechanism 100 is provided at the bottom of the roller unit 90, -15= This rank and pinion mechanism 100 has a brake 102,
It is designed to be driven by a motor 106 coupled via a clutch 104.

The operations of the above-mentioned pasting roller unit 9o and peeling roller unit 92 will be explained with reference to FIGS. 7 and 8.

In the normal state, each roller unit 7) 90.92 is attached at the origin position on the left side of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When pasting is performed, use an air cylinder 98°, 98□
is activated and the rail 96 is lowered. Then, a cock (not shown) provided in connection with the peeling roller unit 92 is operated to maintain the peeling roller unit 92 in a stopped state. In this state, when the air cylinder 94 is activated, only the roller unit 90 is driven in the horizontal direction, and the roller rolls while pressing the adhesive tape 82 on the table 42 downward, thereby creating an adhesive. table 8
2 and the semiconductor wafer 2 are attached.

At this time, clutch 104 is released.

When peeling the residual tape from the frame 4 or the like after cutting the adhesive tape 82, the cock of the peeling roller unit 92 is released and the brake 102 is activated. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one. The peeling roller unit 92 peels off the residual tape by rotating the peeling roller while moving horizontally. Figure 8 shows such a t
11 Each roller unit 90.9 at the end of the separation operation
2 position is shown.

After the peeling operation is completed, each roller 90, 92 returns to its origin in the following manner.

First, air cylinder 98. ．． 98□ operates to raise the rail 96. Raising the rail 96 in this way is done by each roller unit 90 during the return-to-origin operation.
When the tape 92 rolls on the tape 42, the residual tape peeled off by the above-mentioned peeling operation will fall onto the frame 4.
This is because it will be re-adhered to etc. As the rail 96 rises, the brake 102 is released and the clutch 104 is engaged. Then, the motor 106 operates to
By driving the pinion mechanism 100, the sticking roller unit 90 and the peeling roller unit 92 move horizontally to the left and return to the origin.

For pasting, an adhesive tape cutting mechanism 108 is provided above the table 42 for cutting the band-shaped adhesive tape 82 pasted by the above-described pasting operation into a circular shape along the frame 4. This adhesive tape cutting mechanism 10
8, as shown in FIG. 6, is a presser plate 1 that presses and holds the adhesive tape 82 on the table 42 for pasting.
10, a tape cutter 112 that is rotatably driven along the outer periphery of the presser plate 110, and the like.

The pressing plate 110 and tape cutter 112 are
It is configured to be movable in the vertical direction as a unit.

Reference numeral 114 shown in FIG. 6 is a mount/frame chuck arm for ejecting the mount frame 6 from the attachment table 42. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves to the side of the pasting table 42 along with the peeling operation of the ff111 release roller unit 92, holds the mount frame 6 by suction, and then removes the mount/frame by the return-to-origin operation of the peeling roller unit 92, etc. 6
is discharged and conveyed. In addition, L5 shown in FIG. 6 is a solenoid valve that turns on/off the mount/frame chuck arm 114, and PUSW5 is turned on by detecting a pressure drop inside the mount/frame chuck arm 114. This is a pressure saw switch.

The mount/frame chuck arm 114 suction-holds the mount/frame chuck arm 114 and is conveyed to the swing reversing unit 116 by the return operation of each of the rollers 1-90, 92 to its origin. The swing inversion Uniso l-116, as shown in Figures 6 and 9,
In addition to the clamp mechanism 118 that holds the transported mount frame 6, there is also a swing a mechanism 120 that swings the held mount frame approximately 180 degrees horizontally, and a swing a mechanism 120 that swings the swung mount frame 6 around the semiconductor wafer. The mount frame includes an inversion mechanism 122 for inverting the mount frame 2 so that the surface thereof faces upward, a vertical drive mechanism 124 for lowering the inverted mount frame to a heat stage 126, and the like. Note that the PH3W7 provided in the clamp mechanism 118 is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

The heat stage 126 is provided for the purpose of increasing the tape tension by heating when using an adhesive tape using a heat-shrinkable film as a support.

As shown in FIG. 9, the mount frame 6 on the heat stage 126 is adjacent to the heat stage 126.
Mount frame extrusion mechanism 12 for extruding
8 and the extruded mount frame 6 shown in FIG.
A transport table 130 is provided for transporting. The conveyance table 130 includes an air cylinder 131 shown in FIG.
A conveyor belt 134 is configured to be movable in the horizontal direction, and is for conveying to the left unloader section;
Transport bell I-13 for transporting to the right unloader section
The mount frame 6 can be assigned to the mount frame 6.

In addition, as shown in FIG. 9, PHSW 8 is a photoelectric element that detects the mount frame 6 on the heat stage 126, and PHSW 9 is a photoelectric element that detects the extrusion of the mount frame 6 on the heat stage 126. , P.H.
3W1.0 is a photoelectric element that detects whether or not the mount frame 6 is received by the transport table 130.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equally spaced corners, and in this embodiment, four frame cassettes h 1321 to 1324 can be set therein. Frame casenode 132. ．． 132□ has a frame cassette 132:1 in the left unloader section.
．． 1324 are respectively set in the right unloader section. Each unloader section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. The operation panel 138 is provided with a three-digit, seven-segment LED that displays a code corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a light that displays automatic driving operation, occurrence of an error, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 11.

The control unit 142 includes a CPU 144. ROM146°RAM
I 48. Operation panel controller 150. Sensor controller 152. Actuation Controller] 54. It is composed of a pulse motor controller 156 and the like. CPU 14.4 controls the entire device according to a processing program stored in ROM 146. RAM14
8, data such as the size of the semiconductor wafer to be pasted and processing conditions are written. Operation panel controller 15
0 refers to the operation panel 138, the sensor controller 152 refers to a group of various sensors 158 such as a pressure switch and a photoelectric element provided in this device, and the actuator controller 15
Reference numeral 4 controls various actuator groups 160 such as morphs and air cylinders provided in this apparatus, and a pulse motor controller 156 controls the pulse motor 24 that rotationally drives the alignment table 20.

Next, the automatic bonding of semiconductor wafers with the above-described configuration will be described in the operation flowchart 1 shown in FIG. 12.
Explain according to the following.

Each part of this equipment has returned to its original position, and the wafer cassettes are installed in the wafer loader and unloader parts.
When the apparatus is started with the wafer cassette 8 and the frame cassette 132 installed, first the wafer cassette 8 and frame cassette 132 are installed.
The wafer loader section on one side with the wafer loaded thereon is lowered (step S2).

-23= It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in this wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the transport heald 16 is driven, and the detected semiconductor wafer 2 is pushed out from inside the wafer cassette 8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section (step S8 ). The extruded semiconductor wafer 2 is transferred to the conveyor belt 1
6 and is transported to the semiconductor wafer alignment section 14.

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is checked whether the receipt has been received (step 510).

Confirmation that the semiconductor wafer 2 has been received is detected by a photoelectric element PH5WI1 provided near the alignment table 20, as shown in FIG. If the alignment table 20 does not receive the semiconductor wafer 2 after a certain period of time has elapsed, an error display ■ is performed (step S] 2), the error display lights from PA1 to light 140 light up, and the operation panel 138 7 segment LE
D displays the code corresponding to this error.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). And center alignment plate 22. ．． 22□ is driven to index the center of this semiconductor wafer 2 (step 316). Hanyu 1
Once the center of the semiconductor wafer 2 has been determined, the vacuum chuck of the alignment table 20 is operated to suck the semiconductor wafer 2 (step 318). and a pressure swifter PUSW provided in connection with the vacuum chuck.
I confirms whether the semiconductor wafer 2 is reliably attracted (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flask l-OF of the semiconductor wafer 2 is aligned (step 524).

Below, the procedure for aligning the orientation flat of the semiconductor wafer, which is performed in this step, will be explained as follows.
This will be explained based on FIG. 3 and FIG. 14.

FIG. 13 shows the center alignment plate 22. , 22□, the semiconductor wafer 2 is aligned and centered.
A state in which the table 20 has been adsorbed is shown. The end of the orientation flat OF is provided with a photoelectric element PH5W that is appropriately selected according to the size of the semiconductor wafer 2.
I, 2.3. In this figure, only the photoelectric element PH3WI is shown for convenience. The photoelectric element P HS W 1 is connected to the alignment table 20
It is located slightly inside the radius of the semiconductor wafer 2 from the center of the semiconductor wafer 2 . The output of the photoelectric element PH3WI is directly given to a pulse motor controller 156 that controls the pulse motor 24. The pulse motor controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element PH3WI. In addition, the pulse motor controller 156 is
Based on the command from 44, the amount of rotation is output to the pulse motor 24, and the amount of rotation until the pulse motor 24 comes to a halt is given to the CPU 144.

FIG. 14 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 144 sets a rotation amount for rotating the pulse motor 24 by 360 degrees counterclockwise (step 5130), and controls this via the pulse motor controller 156. It outputs to the pulse motor 24 (step S132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation flat O
When one end of F is detected by the photoelectric element P HS W 1, the detection signal is sent to the pulse motor controller 15.
6, the pulse motor 24 is stopped.

After step 5132 ends, the CPU 144 monitors whether the pulse motor 24 has stopped (step 5
134).

After confirming that the pulse motor 24 has stopped, the CPU
144 sets the amount of rotation for rotating the pulse motor 24 clockwise 360 degrees (step 5136), and sets the rotation amount to rotate the pulse motor 24 through the pulse motor controller 156.
4 (step 3138). As a result, the semiconductor wafer 2 is rotated clockwise. When the other end of the orientation plane OF is detected by the photoelectric element PH3WI, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

When the CPU 144 confirms that the pulse motor 24 has stopped (step 5140), the CPU 144 determines the clockwise rotation amount θ at that time.
(Step 5L42).

Then, a rotation amount for rotating the pulse motor 24 counterclockwise by θ/2 is set (step 3144), and this is output to the pulse motor 24 via the pulse smoke controller 156. As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat ○F intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element PH3WI.

The above is the basic procedure for aligning the orientation flat OF, but depending on the model of the semiconductor wafer 2,
The final positioning may be completed by further rotating the semiconductor wafer 2 by 90″ or 180°.

Hereinafter, referring back to FIG. 12, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 826). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step 322 described above, where an error display (2) is displayed.

By the way, after the above-described step 314 is completed, the process moves to step S16, and at the same time, moves to step S28. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530). At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction.

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). The presence or absence of suction is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If suction has not been performed, an error display (2) is performed (step 534), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 53).
6). Then, it is confirmed whether the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 40 is reversed is determined based on the detection signal of the photoelectric element PH3W4 provided in relation to the reversing fork 40. If the reversing fork 40 has not been reversed to the predetermined position, an error message ■ is displayed (step 540).
), the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the display panel 138 displays a code corresponding to this error.

If the reversing fork 40 is correctly reversed, the suction of the semiconductor wafer 2 is confirmed again (step 54).
1) If it is not absorbed, the above error message will be displayed.
(step 534).

When the semiconductor wafer 2 is confirmed to be attracted, the reversing fork 4
0 is pasted and retreats to the table 42 side (step 542
). Then, the reversing fork 40 releases the suction of the semiconductor wafer 2 and transfers the transferred semiconductor wafer onto the wafer chuck table 48 covered with the protective film 52 (step 544). Wafer chuck table 48
The semiconductor wafer 2 transferred has its back side facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. As a result, the frame 4 stored in the frame stocker 56 is pushed out by the frame push-out mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 548), and moves forward while engaging the inside of the pushed-out frame 4 (step 550). . As a result, the frame 4 is sent out to the frame positioning section 62, and the V-notches 40, 4□ of the frame 4 are moved to the frame positioning section 62.
The frame 4 is positioned by engaging with a positioning pin 70 provided in the frame 4.

Then, it is confirmed whether or not the frame 4 has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element PH3W5 provided in the frame positioning section 62. If frame 4 is not aligned, an error message ■ is displayed (step 554);
The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the frame 4 has been positioned, the frame chuck arm 72 that conveys the frame 4 to the table 42 is lowered (step 556) and sucks the positioned frame 4 (step 858). Next, it is determined whether the frame chuck arm 72 has attracted the frame 4 (step 560). this is,
The determination is made based on the detection signal of the pressure switch PUSW3 provided in association with the frame chuck arm 72. If frame 4 is not adsorbed, an error message appears■
is carried out (step 562), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When it is confirmed that the frame 4 is attracted, the frame chuck arm 72 is raised (step 564).
) 6 Then, it is checked again that frame 4 has been attracted (step 565), and if it has not been attracted, the above-mentioned error display (2) is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the pasting table 42 (steer knob 566). Then, the frame chuck arm 72 descends to attach the frame 4 to the frame chuck arm 72.

Transfer to tip 50 (step knob 567).

When the transfer of the frame 4 is confirmed, the frame chuck table 50 is operated to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably sucking the frame 4 (step 571). This is determined based on the detection signal of the pressure switch PUSW4 provided in association with the frame check table 50.

If the frame 4 is not attracted, an error display ■ is displayed (step 572), and the error display light on the Patry 1-140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error. do.

When it is confirmed that the frame 4 is suctioned to the frame chuck full 50, the suction of the frame chuck arm 72 is released (step 573), and the frame chuck arm 72 is raised (step 574).

Through the above steps, the semiconductor wafer 2 and frame 4 are attached to the table 42.

When the frame chuck arm 72 is raised, the pasting roller unit 90 is lowered (step 575). As a result, the adhesive tape 82 placed on the roller unit 90 also descends, and this adhesive tape 82 is attached to the wafer.
It comes into contact with the back surface of the semiconductor wafer 2 on the chuck table 48. When the pasting roller unit 90 is lowered, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, pasting is performed by the roller unit 9.
0 is attached by a roller rolling on the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2 and pressing lightly to attach the semiconductor wafer 2, the adhesive tape 82, and the frame 4 (step 876).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, the tape cutter 112 rotates once around the presser plate 110, thereby cutting the adhesive tape 82 so that it is slightly smaller than the outer shape of the frame 4 (Step 7 S78).

When cutting of the adhesive tape 82 is completed, the wafer chuck table 48 is lowered (step 580), the protective film take-up reel is driven to wind up the protective film 52, and the new protective film 52 is transferred to the wafer.
Pull it out onto the chuck table 48 (step 582)
.

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residue of the adhesive tape 82 stuck to the periphery of the frame 4 is peeled off from the frame 4 (step 584).

Once the adhesive tape has been peeled off, the mount 1 on the table 42 and the mount/frame chuck arm 114 for ejecting the frame 6 are lowered in step 586.
). Adsorb Mount Frey J16 (Step 88
8). Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). This is determined based on the detection signal of the pressure switch PUSW5 provided in connection with the mount/frame chuck arm 114. If the mount frame 6 is not suctioned, an error display X is displayed (step 592), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. .

611 that the mount frame 6 is adsorbed
When it is LE, the mount/frame chuck arm 11
4 rises (step 594). After the mount/flare chuck arm 114 is raised, the mount/flare chuck arm 114 is raised again.
Check whether frame 6 has been attracted (Step 595), and if it has not been attracted, an error message will be displayed (Step 59).
2). When the suction of the mount frame 6 is confirmed, the pasting roller unit 90 and the peeling roller unit 92, which have moved to the pasting table 42, return to their original positions (origins) (step 896). For pasting, the roller unit 90 and the peeling roller unit 92 return to their origin, and the mount/frame chuck arm 114 that has sucked the mount frame 6 also moves back to the swing reversing unit 1.
It moves in 16 directions (step 898). Then, when the mount/frame chuck arm 114 has moved to the position where one end of the mount frame 6 is inserted into the clamp mechanism 118 of the swing reversing unit 116, step 5 is performed again to confirm that the mount frame 6 is attracted.
99), and if it is not picked up, an error message X is displayed (step 592).

When the suction of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 5100).
. Then, it is confirmed whether the mount frame 6 is securely clamped (step 5I02). In this case, the photoelectric element P H provided in the clamp mechanism 118
The determination is made based on the detection signal of SW7. Maun I
・If frame 6 is not clamped, error display XI is displayed (step 5LO4) and the patrol light 140
The error display light on the control panel 138 lights up.
The 7 segment LED will display the code corresponding to this error.

After confirming that the mount frame 6 is clamped, the swing reversing unit 116 swings approximately 180 degrees in the horizontal direction (step 5106), and confirms that the mount frame 6 is clamped again (step 51).
07). If it is not clamped, error display XI is performed (step 5104). When the clamping of the mount frame 6 is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 3108). And once again, mount frame 6
Confirm the clamping (Step 5IO9), and if it is not clamped, display an error message (Step 3).
104. ).

When the clamping of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the heat stage 12G (step S i 10). this is,
Photoelectric element PH5W8 provided on heat stage 12G
This is done based on the detection signal. heat stage 126
If there is another mount frame 6, an error message will be displayed.
(Step 5ill), the error display light of the patrol light 140 lights up, and the 7-segment LBD of the operation panel 138 displays a code corresponding to this error.

When it is confirmed that there is no other mount frame 6 on the heat stage 126, the swing reversing unit 116 descends (step 5112), and when the mount frame 6 reaches the heat stage 126-hi, the clamping machine ff&11 B releases (step 5113)
. As a result, the mount frame 6 is moved to the HEI stage 126.

The mount I...frame 6 transferred to the heat stage 126 is heated here (step S], 14).

This causes the adhesive tape on the mount frame 6 to contract, increasing the tape tension.

However, if such loosening removal is not required, step 2 (if not, this step knob S) and step I4 are omitted.

After heating the mount frame 6, the mount frame 6 is heated.
Frame pushing mechanism 128 is activated to push out the mounting frame on heat stage 126 (step 5116). Then, it is confirmed whether the mount frame 6 has been pushed out from the heat stage 126 (step 5l18). This is determined based on the detection signal of the photoelectric element PH3W9 provided at the end of the heat stage 126. If the mount frame 6 has not been pushed out, an error message X is displayed (step 512).
0), the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

The mount frame 6 pushed out from the heat stage 126 rides on a transport table 130 for transporting to the unloader section. Then, the photoelectric element PH3WIO provided on the transport table 130 confirms whether or not the mount frame 6 has been placed on the transport table 130 (step S122). If the mount frame 6 is not placed on the transport table 130, an error display XrV is performed (step 5124), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 indicates this error. Display the corresponding code.

If the mount frame 6 is not supported on the transport table 130, the mount frame 6 is transported to the unloader section and stored in the frame cassette 132 placed in the unloader section (step 5126).
). When the photoelectric element provided in the unloader section detects that the mount frame 6 is stored in the frame cassette 132, the unloader section moves up one pitch and the next mount frame 6 is stored. (step 5128).

As described above, after aligning the semiconductor wafer 2 supplied from the wafer loader section in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame car 43 and storing the mount frame 6 with the semiconductor wafer 2 attached to the frame car 43=set 132, are automatically performed.

Next, the adsorption detection unit of the frame/chuck table, which is included in the automatic semiconductor wafer attachment apparatus according to this embodiment, will be explained in more detail.

If the frame 4 carried by the frame chuck arm 72 is not correctly placed on the frame chuck table 50, the frame chuck table 50 will not attract the frame 4. When the semiconductor wafer 2 is attached in such a state, the positional relationship between the semiconductor wafer 2 and the frame 4 becomes misaligned, and as a result, the semiconductor wafer 2 is attached to the frame 4 in a correctly aligned state. Therefore, in the above-mentioned automatic attachment of semiconductor wafers, the function of detecting whether or not the frame chuck table 50 is adsorbing the frame 4 is important.

By the way, as is clear from the explanation of the embodiments mentioned above,
The pressure detection means of the suction detection unit that detects whether or not the frame/chuck table is suctioned corresponds to the pressure switch PUSW4 in the embodiment, and determines whether the frame/chuck table has been suctioned incorrectly based on the detection signal of the pressure detection means. The error determining means is the control unit 142 in the embodiment.
It corresponds to Further, the operation of the suction section corresponds to step S71 in the operation flowchart explained in FIG. 12.

Next, a more specific operation of the adsorption detection section performed in step 71 will be explained based on FIG. 15.

Assume that the solenoid valve VL4 provided in connection with the vacuum chuck of the frame chuck table 50 is activated, and the frame chuck table 50 starts suctioning the frame 4 (step 570 shown in FIG. 12). At the same time when the solenoid valve VL4 is activated, the control unit 142 shown in FIG.
A timer included in PUI 44 is cleared (step 5711).

Then, the pressure switch PU determines whether or not the frame chuck table 50 has attracted the positioned frame 4.
Judgment is made based on the detection signal of SW4 (step S71)
□). When the frame/chuck table 50 is sucking the frame 4, the pressure inside the vacuum chuck decreases, so the pressure switch PUSW4 is turned on.

If the pressure switch PUSW4 is not in the ON state, it is checked whether the timer has timed out (step 571ff). This is done in consideration of the waiting time since it takes a considerable amount of time for the pressure inside the vacuum chuck of the frame/chuck table 50 to become low after the electromagnetic valve VL4 is activated. Therefore, if the time has not exceeded, the process returns to step S71□.

On the other hand, if the time has elapsed, the positioned frame 4 may be damaged by frame/chuck table 5 for some reason.
It is determined that it was not absorbed to 0, and an error message appears.■(
Step 572) is performed.

In step S71□, when it is confirmed that the frame chuck table 50 has attracted the frame 4, the process proceeds to step S74 explained in FIG. will be held.

Next, we will briefly explain the recovery process that is performed when an error occurs in the automatic attachment of semiconductor wafers according to the above-described embodiment.

When any of the above-mentioned errors occurs, each mechanical section that is a process subsequent to the location where the error occurs continues its operations and stops after completing its respective operation cycle. On the other hand, the location where the error occurred and each mechanical section corresponding to the preceding process stop when the error occurs. Based on the above-mentioned error display, the operator takes appropriate measures such as removing the workpiece (for example, the semiconductor wafer 2 or the frame 4) where the error has occurred or setting the cassette correctly. Then, each mechanical section corresponding to the process preceding the error occurrence point is returned to its origin, and the apparatus is restarted.

Note that the display mode indicating a frame suction error on the frame/chuck table 50 is not limited to that described in the embodiment, and may be modified in various ways such as a buzzer display.

Furthermore, the semiconductor wafer automatic pasting device according to the present invention includes:
Of course, the present invention is not limited to the devices described in the embodiments.

<Effects of the Invention> As is clear from the above description, the automatic semiconductor wafer attachment device according to the present invention is related to a frame/chuck table that sucks and holds a frame positioned in advance for attachment of semiconductor wafers. and a pressure detection means for detecting a pressure change in the frame/chuck table; and a pressure detection means for detecting a pressure change in the frame/chuck table;
and an error determining means for determining a frame suction error of the chuck table.

Therefore, according to the present invention, it is possible to prevent a frame chuck table from picking up a frame incorrectly, thereby preventing a positional shift between a semiconductor wafer and a frame due to a mistake in picking up a frame.

Furthermore, according to the present invention, if the frame is not attracted to the frame/chuck table due to some abnormality, the operator can use this automatic semiconductor wafer attachment to know the occurrence of abnormality in the equipment and the location thereof. Since this allows appropriate measures to be taken quickly, automatic semiconductor wafer attachment is very convenient for improving the operating efficiency of the apparatus.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing the overall configuration of a semiconductor wafer automatic pasting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration of the semiconductor wafer alignment section and the surrounding area of the reversing fork in the embodiment. FIG. 3 is a configuration diagram of the orientation flat end detection section in the above embodiment, and FIG.
The figure is a block diagram of the frame loader section and the surroundings of the frame positioning section in the embodiment, FIG. 5 is a block diagram of the frame transport section and its periphery in the embodiment, and FIG. 6 is the adhesive tape supply system and the adhesive tape in the embodiment. FIGS. 7 and 8 are diagrams illustrating the configuration and operation of the pasting roller unit and peeling roller unit in the embodiment; FIG. 9 is a diagram illustrating the configuration around the heat stage in the embodiment; FIG. 10 is an explanatory diagram of the semiconductor wafer, frame, and mount frame used in the embodiment, FIG. 11 is a block diagram schematically showing the configuration of the control system in the embodiment, and FIG. 12 is a diagram showing the configuration of the control system in the embodiment. FIG. 13 is an explanatory diagram of orientation flat alignment in the embodiment, FIG. 14 is an operation flowchart of orientation flat alignment in the embodiment, and FIG. 15 is an illustration of the frame/chuck table frame in the embodiment. It is a specific operation flowchart of suction error detection. 2... Semiconductor wafer, OF... Orientation flat, 4... Frame, 6... Mount frame, 8... Wafer cassette, 14... 111 Wafer positioning section, 20... Alignment table, 24... Pulse motor, 32... Orientation flat end detection section, 40... Reversing fork, 4
2... Paste on table, 48... Wafer/chuck table, 50... Frame/chuck table, 5
4... Frame loader section, 62... Frame positioning section, 72... Frame chuck arm, 82...
...Adhesive tape, 90...Pasting is done using a roller unit, 9
2... Peeling roller unit, 108... Adhesive tape cutting mechanism, 114... Mount/frame chuck arm, 116... Swing reversing unit, 118...
・Clamp mechanism, 126... Heat stage, 128
...Mount frame extrusion mechanism, 130...
Transport table, 132...Frame cassette, 13
8...Mission 1.140...PaI Wright, 142...
・Control unit, 144...CPU, PH3WI~PH3
WII...Photoelectric element, PUSWI~PUSW
5...Pressure switch 2 switches.

Claims (1)

[Claims] An automatic semiconductor wafer attachment device that aligns a semiconductor wafer on which an orientation flat is formed and attaches it to an adhesive tape, the device comprising: a wafer chuck table on which a pre-aligned semiconductor wafer is placed; and the wafer chuck. A frame/chuck table is provided around the table and holds a pre-positioned ring-shaped frame by suction for holding the adhesive tape to which the semiconductor wafer is attached, and the frame/chuck table holds the frame by suction. a suction detection section that detects whether or not the frame is being suctioned; the suction detection section includes a pressure detection means that detects a pressure change in the frame/chuck table; and error determining means for determining whether a frame suction error of the frame/chuck table has occurred based on whether or not the pressure detecting means detects a change in the pressure of the frame/chuck table for a certain period of time. Automatic bonding equipment for semiconductor wafers.