JPS63155633A - Automatic sticking system for semiconductor wafer - Google Patents

Abstract

PURPOSE:To detect an error of the suction of a semiconductor wafer at a semiconductor-wafer transfer part by a method wherein a pressure switch detects a change in the pressure of a vacuum chuck built in the semiconductor-wafer transfer part. CONSTITUTION:If a solenoid valve VL2 installed in connection with a vacuum chuck of a reversing fork 40 (semiconductor-wafer transfer part) is actuated and the reversing fork 40 starts a sucking operation of a wafer, a timer installed in a control unit is cleared. A pressure switch PUSW 2 detects whether the reversing fork 40 has sucked the wafer 2. When this pressure switch PUSW 2 is not set to an OFF state, said timer confirms whether a time limit has been exceeded or not. If the time limit has been exceeded, it is judged that the semiconductor wafer 2 has not been sucked by the reversing fork 40 for one cause or another, and an error is displayed.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is attached to an adhesive tape and subjected to thalassoking. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next die bonding process.

Such a process of attaching a semiconductor wafer to an adhesive tape is performed as a pre-process of a semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafers to adhesive tape.

<Problems to be Solved by the Invention> The present invention has been developed in view of the above circumstances, and is directed to an apparatus for automatically attaching semiconductor wafers, in particular to alignment and
The object of the present invention is to provide an automatic semiconductor wafer pasting device that has a function of detecting whether a semiconductor wafer is being adsorbed by a semiconductor wafer transport unit that transports semiconductor wafers aligned by a table to a pasting table. It is said that

Such objects of the present invention will become clearer in the detailed description of the present invention that follows.

<Means for Solving the Problems> In order to achieve the above object, the present invention adopts the following configuration.

That is, the present invention provides an automatic semiconductor wafer attaching apparatus for aligning a semiconductor wafer on which an orientation flat is formed and attaching the semiconductor wafer to an adhesive tape, comprising: an alignment table for aligning the semiconductor wafer; and an alignment table for aligning the semiconductor wafer;・The semiconductor wafer aligned by the table is attached to the adhesive tape.The semiconductor wafer aligned by the alignment table is sucked and held by a vacuum chuck, and the semiconductor wafer aligned by the alignment table is attached to the adhesive tape from the alignment table to the adhesive tape. The semiconductor wafer transport unit includes a semiconductor wafer transport unit that transports the semiconductor wafer, and a suction detection unit that detects whether or not the semiconductor wafer transport unit is suctioning the semiconductor wafer, and the suction detection unit includes a vacuum chuck provided in the semiconductor wafer transport unit. pressure detection means for detecting a pressure change in the vacuum chuck; and error determination means for determining a semiconductor wafer suction error in the semiconductor wafer transfer section based on whether the pressure detection means detects a pressure change in the vacuum chuck. It is characterized by

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of the automatic semiconductor wafer attachment device according to the present embodiment, and FIGS. 2 to 9 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attachment device. It is.

FIG. 10 shows a semiconductor wafer 2 that is attached to an adhesive tape by an apparatus for automatic attachment of semiconductor wafers according to this embodiment.
, a frame 4 for holding the adhesive tape to which the semiconductor wafer 2 is attached, and a mount frame 6 which is the frame to which the semiconductor wafer 2 is attached.

An orientation flat OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2 . Based on this orientation flat OF, an element pattern is formed on the semiconductor wafer 2=4-.

The frame 4 is a ring-shaped metal plate or resin plate,
V-notches 4□, 4□ are formed on the outer periphery of the frame 4 to be used when aligning the frame 4, which will be described later.

For automatic attachment of semiconductor wafers according to this embodiment, the apparatus separately supplies the semiconductor wafer 2 and the frame 4 from the wafer loader section and the frame loader section, respectively, and attaches them to the adhesive tape, and finally mounts the semiconductor wafers. -The frame 6 is stored in the unloader section.

The configuration of each part of this device will be explained below.

Reference numeral 8 (8, to 84) shown in FIG. 1 is a wafer cassette set in the wafer loader section. Wafer
The cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically at regular intervals. In this embodiment, there are two wafer loader sections, wafer cassettes 88, 8□ can be loaded into the left wafer loader section, and wafer cassettes 83, 84 can be loaded into the right wafer loader section. Each wafer loader section is configured to be movable in the vertical direction, and the wafer cassette 8
The semiconductor wafer 2 is supplied by detecting the semiconductor wafer 2 inside and pushing it out.

The wafer push mechanism provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a morph is installed.
The right wafer loader section is provided with a wafer pushing mechanism 12 driven by an air cylinder.

The semiconductor wafers 2 supplied from each wafer loader section are
This semiconductor wafer 2 is transported to a semiconductor wafer alignment section 14 for alignment.

The semiconductor wafer 2 is transported to the semiconductor wafer alignment section 14 by a transport belt 16 shown in FIG. This conveyor belt 16 is driven by the morph 18 in forward and reverse directions.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives and receives the semiconductor wafer 2 that has been transferred and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center alignment plate 22. , 22°, etc.

The alignment table 2o is equipped with a vacuum chuck for holding the semiconductor wafer 2 by suction. VLI is
The solenoid valve PUSWI that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in pressure within the vacuum chuck.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable in the vertical direction by an air cylinder 26.

Center alignment plate 22. , 22□ are provided at positions facing each other with the alignment table 20 at the upper limit position interposed therebetween. Each center alignment plate 22, . An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposing surface side of the semiconductor wafer 2 . Center alignment plate 22□, 22
□ is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

On both sides of the alignment table 20, conveyor belts 1
There are wafer stoppers 301 and 30 for receiving and stopping the semiconductor wafers 2 conveyed on the wafer 6. Wafer stopper 30. ．． 30z is swung by an air cylinder (not shown). When the semiconductor wafer 2 is supplied from the left wafer loader section, the right wafer stopper 302 is used, and when the semiconductor wafer 2 is supplied from the right wafer loader section, the left wafer stopper 30 ．． , respectively, rise and stop receiving the semiconductor wafer 2 that has been transported.

Reference numeral 32 shown in FIG.
In order to detect the edge of the orientation flat OF of the semiconductor wafer 2 which is being held by suction and rotating,
This is an orientation flat end detection unit equipped with a transmission type photoelectric element PH3WI, 2.3. As shown in FIG.
The light receiving section 38 and the light receiving section 38 are configured to be openable and closable by the air cylinder 34. The reason why such three sets of transmission type photoelectric elements PH3WI, 2.3 are used is to select and use appropriate photoelectric elements according to the size of the semiconductor wafer 2. The orientation flat end detection section 32 is open in a normal state, and is closed when detecting the end of the orientation flat OF for positioning.

Reference numeral 40 shown in FIG. 1 and FIG.
A reversing fork is used to transfer the semiconductor wafer 2 whose OF has been aligned to the table 42. The reversing fork 40 is equipped with a vacuum chuck for suctioning and holding the semiconductor wafer 2 from the back side. VL2 is
The solenoid valve PUSW2 that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in pressure within the vacuum chuck.

The reversing fork 40 is driven by an air cylinder 44 to connect the alignment table 20 and the pasting table 4.
2, and is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. P
HSW 4 is a photoelectric element for detecting whether or not the reversing fork 40 has performed a reversing operation and is at a predetermined position.

As shown in FIG.
It includes a chuck table 48 and a frame chuck table 50 provided around the wafer chuck table 48. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 is laid on the wafer chuck table 48. Reversing fork 4
The semiconductor wafer 2 transported by the wafer 2 is placed on the wafer chuck table 48 via the protective film 52 with its back side facing upward. Protective film 52
is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of frames 4 in a stacked state, and a frame push-out mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. This frame extrusion mechanism, as shown in Figure 4,
an extrusion plate 58 for extruding the frame 4;
It is composed of an air cylinder 60 that drives this horizontally.

The frame 4 supplied from the frame loader section 54 is
The frame positioning section 62
It is sent out to The frame feeding section includes a frame pusher 64 that engages with the inner peripheral surface of the frame 4 pushed out from the frame stocker 56 and feeds out the frame 4, and an air cylinder 66 for raising and lowering the frame pusher 64. , an air cylinder 68 for horizontally driving the frame pusher 64, and the like. In the normal state, frame pusher 64 is lowered.

When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven to push up the frame pusher 64 and insert it into the frame 4, and then the air cylinder 68 is driven to push the frame pusher 64 up and into the frame 4. is sent out to the frame positioning section 62.

The frame positioning unit 62 has two positioning pins 70 (however,
Only one positioning pin 70 is visible in Fig. 4)
is provided. This positioning pin 70 and the notch 4 of the frame 4. ．． The frame 4 is positioned by engaging 4□. PHSW 5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is transported to the table 42 for pasting by the frame conveying section, and the pasting is carried out by the table 42.
It is placed on the frame chuck table 50 of No. 2. As shown in FIG. 5, the frame transport section includes a frame chuck arm 72 that holds the frame 4 by suction, an air cylinder 73 that raises this frame chuck arm 72, and a horizontal drive of the frame chuck arm 72. It is composed of an air cylinder 74, etc. for VL3 is a solenoid valve that turns on/off the frame chuck arm 72, and PUSW3 is a pressure switch that detects a drop in pressure within the frame chuck arm 72 and turns on.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport section. Fifth
V L 4 shown in the figure is a solenoid valve that turns on/off the frame/chuck table 50, and PUSW 4 is turned on by detecting a pressure drop inside the frame/chuck table 50.
It is a pressure swift that goes into the state. In addition, PH3W6 is
This is a photoelectric element that detects the frame 4 on the frame chuck table 50.

Next, a tape supply/winding mechanism and an adhesive tape cutting mechanism will be explained based on FIGS. 1 and 6.

The above-described protective film 52 is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and wound up by a protective film take-up reel 78 provided on the other side of the table 42. .

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is placed on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator 84 is wound up separately from the adhesive tape 82 by a separator take-up reel 86 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a pasting roller unit consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 6, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is pasted onto a roller unit 90 in a 'SJ' shape, and is further pasted on the roller unit 90 in parallel. The tape is then passed to a peeling roller unit 92 and wound onto a residue tape take-up reel 88 .

As shown in FIG. 7, the pasting roller unit 90 is connected to the tip of an air cylinder 94 that horizontally drives the pasting roller unit 90. Furthermore, the peeling roller unit 92 is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide on a rail 96 by means of cam followers provided above them. The rail 96 has air cylinders 98 provided at both ends thereof.
．． ．． It is configured to be movable up and down by 9B□. A rack and pinion mechanism 100 is provided at the bottom of the roller unit 90, and this rack and pinion mechanism 100 is driven by a motor 106 coupled via a brake 102 and a clutch 104. There is.

The operations of the pasting roller unit 90 and the ff1l separating roller unit 92 will be explained with reference to FIGS. 7 and 8.

In the normal state, each roller unit 90, 92 is attached at the origin position to the left of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When pasting is performed, use an air cylinder at 98° for 9 days.
is activated and the rail 96 is lowered. Then, a not-shown lever provided in connection with the peeling roller unit 92 operates to maintain the peeling roller unit 92 in a stopped state. In this state, when the air cylinder 94 is activated, only the roller unit 90 is driven in the horizontal direction, and the roller moves while pressing the adhesive tape 82 on the table 42 downward, thereby applying the adhesive tape. 8
2 and the semiconductor wafer 2 are attached.

At this time, clutch 104 is released.

When peeling the residual tape from the frame 4 or the like after cutting the adhesive tape 82, the cock of the peeling roller unit 92 is released and the brake 102 is activated. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one. The peeling roller unit 92 peels off the residual tape by rotating the peeling roller while moving horizontally. FIG. 8 shows the position of each roller unit 90, 92 at the time when such a peeling operation is completed.

The return of each roller unit (90, 92) to its origin after the completion of the peeling operation is performed as follows.

First, air cylinder 98. ．． 98□ operates to raise the rail 96. Raising the rail 96 in this way is done by each roller 90
．． When the attached tape 92 rolls on the table 42, the residual tape released by the above-mentioned peeling operation is left on the frame 4.
This is because it will be re-adhered to etc. As the rail 96 rises, the brake 102 is released and the clutch 104 is engaged. Then, the motor 106 operates to
By driving the pinion mechanism 100, the pasting roller unit 90 and the peeling roller unit 92 move horizontally to the left and return to the origin.

For pasting, an adhesive tape cutting mechanism 1 is provided above the table 42 for cutting the band-shaped adhesive tape 82 pasted by the above-described pasting operation into a circular shape along the frame 4.
08 is provided. This adhesive tape cutting mechanism 108
As shown in FIG.
10, a tape cutter 112 that is rotatably driven along the outer periphery of the presser plate 110, and the like.

The pressing plate 110 and tape cutter 112 are
It is configured to be movable in the vertical direction as a unit.

Reference numeral 114 shown in FIG. 6 is a mount/frame chuck arm for ejecting the mount frame 6 from the attachment table 42. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves toward the table 42 side with the peeling operation of the peeling roller unit 92, and removes the mount/frame.
The frame 6 is held by suction, and the mount frame 6 is discharged and conveyed by the return-to-origin operation of the peeling roller unit 92 or the like. In addition, VL5 shown in FIG. 6 is a solenoid valve that turns on/off this mount/frame chuck arm 114, and PUSW5 is a solenoid valve that turns on/off the mount/frame chuck arm 114.
This is a pressure switch that turns on when it detects a drop in pressure within the pressure switch 14.

The mount frame 6 suctioned and held by the mount frame chuck arm 114 is conveyed to the swing reversing unit 116 by the origin return operation of each of the rollers 90 and 92. As shown in FIGS. 6 and 9, the swing reversing unit 116 includes a clamp mechanism 11 that holds the transported mount frame 6.
In addition to 8, there is also a swing mechanism 120 that swings the held mount frame 6 approximately 180 degrees in the horizontal direction, an inversion mechanism 122 that inverts the swung mount frame 6 so that the surface of the semiconductor wafer 2 faces up, and The apparatus includes a vertical drive mechanism 124 for lowering the mount frame to the heat stage 126. Note that the PH3W7 provided in the clamp mechanism 118 is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

The heat stage 126 is provided for the purpose of increasing tape tension by heating when using an adhesive tape using a heat-shrinkable film as a support.

As shown in FIG. 9, the mount frame 6 on the heat stage 126 is adjacent to the heat stage 126.
Mount frame extrusion mechanism 12 for extruding
8 and a transport table 130 for transporting the extruded mount frame 6 to a frame cassette 132 (132, to 1324) shown in FIG. The conveyance table 130 is configured to be movable in the horizontal direction by an air cylinder 131 shown in FIG. 9, and includes a conveyor belt 134 for conveying to the unloader section on the left side and a conveyor belt 134 for conveying to the unloader section on the right side. The mount frame 6 can be distributed to the belt 136.

In addition, PH5W8 shown in FIG. 9 is heat stage 1.
A photoelectric element for detecting the mounting frame 6 on 26, P
H3W9 is a photoelectric element that detects the extrusion of the mount frame 6 on the heat stage 126, and PH3WIO is a photoelectric element that detects the reception of the mount frame 6 by the transport table 130.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equal intervals, and in this embodiment, four frame cassettes 132I to 1324 can be set. Frame cassettes 1321.132□ are placed in the left unloader section. ．． 1
324 are respectively sent to the right unloader section. Each unloader section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. This operation panel 1.38 is provided with a 3-digit 7-segment LED that displays a code corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a patrol light that displays automatic driving operations, occurrence of errors, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 11.

The control unit 142 includes a CPU 144. ROM146°RAM
14B, operation panel controller 150. Sensor controller 152. Actuator controller 154. It is composed of a pulse motor controller 156 and the like.

The CPU 144 controls the entire device according to a processing program stored in the ROM 146. Data such as the size of the semiconductor wafer to be attached and processing conditions are written in the RAM 148. The operation panel controller 150 controls the operation panel 138, the sensor controller 152 controls the various sensors 158 such as pressure switches and photoelectric elements provided in this device, and the actuator controller 154 controls the motors, air cylinders, etc. provided in this device. The pulse motor controller 156 controls the various actuator groups 160 and the pulse motor 24 that rotationally drives the alignment table 20.

Next, the operation of the automatic semiconductor wafer bonding apparatus having the above-described configuration will be explained according to the operation flowchart shown in FIG.

When the apparatus is started with each part of the apparatus having returned to its original position and with the wafer cassette 8 and frame cassette 132 installed in the wafer loader section and unloader section, respectively, the wafer - The wafer loader section on one side with the cassette 8 mounted is lowered (step S2).

It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in the wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the conveyor belt 16 is driven, and the detected semiconductor wafer 2 is pushed out from inside the wafer cassette 8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section (step S8 ). The extruded semiconductor wafer 2 is transferred to the conveyor belt 1
6 and is transported to the semiconductor wafer alignment section 14.

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is checked whether the receipt has been received (step 510).

Confirmation that the semiconductor wafer 2 has been received is detected by a photoelectric element PH3WI1 provided near the alignment table 20, as shown in FIG. If the alignment table 20 does not pick up the semiconductor wafer 2 after a certain period of time has elapsed, an error display ■ is performed (step 512), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 lights up.
will display the code corresponding to this error.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). Then, the center alignment plates 221 and 222 are driven to index the center of the semiconductor wafer 2 (step 516). Once the center of the semiconductor wafer 2 has been determined, the vacuum chuck of the alignment table 20 is operated to suck the semiconductor wafer 2 (step 818). and a pressure switch PUSWI provided in connection with the vacuum chuck.
Thus, it is confirmed whether the semiconductor wafer 2 is reliably attracted (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flat OF of the semiconductor wafer 2 is aligned (step 524).

Below, the procedure for aligning the orientation flat of the semiconductor wafer, which is performed in this step, will be explained as follows.
This will be explained based on FIG. 3 and FIG. 14.

FIG. 13 shows that the semiconductor wafer 2 whose center is indexed by the center alignment plates 22+ and 22□ is aligned and
A state in which the table 20 has been adsorbed is shown. The end of the orientation flat OF is provided with a photoelectric element PH3W that is appropriately selected according to the size of the semiconductor wafer 2.
1.2.3. In this figure, only the photoelectric element PH3WI is shown for convenience. The photoelectric element P HS W 1 is connected to the alignment table 20
It is located slightly inside the radius of the semiconductor wafer 2 from the center of the semiconductor wafer 2 . The output of the photoelectric element P HS W 1 is directly given to a pulse motor controller 156 that controls the pulse motor 24 . The pulse smoke controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element PH5WI. In addition, the pulse motor controller 156 is
Based on the command from U144, the amount of rotation is output to the pulse motor 24, and the amount of rotation until the pulse motor 24 comes to a stop state is given to the CPU 144.

FIG. 14 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 144 sets a rotation amount to rotate the pulse motor 24 by 360 degrees counterclockwise, for example, in step 5130>, and controls this via the pulse motor controller 156. It outputs to the pulse motor 24 (step 5132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation franc)O
When one end of F is detected by the photoelectric element PH3W1, the detection signal is given to the pulse smoke controller 156, and the pulse smoke 24 is stopped.

After step 5132 is completed, the CPU 144 monitors whether the pulse smoke 24 has stopped (step 5
134).

After confirming that Pulsmoke 24 has stopped, the CPU
The I 44 sets the amount of rotation for rotating the pulse smoke 24 360° clockwise (step 5136), and outputs this to the pulse motor 24 via the pulse motor controller 156 (step 3138). As a result, the semiconductor wafer 2 is rotated clockwise. And the other end of the orientation (orientation flange) OF is the photoelectric element PH3WI.
When detected, the detection signal is given to the pulse motor controller 156, and the pulse smoke 24 is stopped.

When the CPU 144 confirms that the pulse motor 24 has stopped (step 5140), the CPU 144 determines the clockwise rotation amount θ at that time.
(step 3142).

Then, a rotation amount for rotating the pulse motor 24 counterclockwise by θ/2 is set (Step 7 5144), and this is output to the pulse motor 24 via the pulse motor controller 156. As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat OF intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element P HS W 1.

The above is the basic procedure for aligning the orientation flat OF, but depending on the model of the semiconductor wafer 2,
Final positioning may be completed by further rotating the semiconductor wafer 2 by 90' or 180°.

Hereinafter, referring back to FIG. 12, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 826). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step S22 described above and an error display (2) is displayed.

By the way, after the above-described step S14 is completed, the process moves to step S16 and also moves to step 528. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530).At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction.

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). The presence or absence of suction is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If suction has not been performed, an error display ■ is performed (step 534), and the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. .

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 83).
6). Then, it is confirmed whether the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 4o is reversed is determined based on the detection signal of the photoelectric element PH3W4 provided in relation to the reversing fork 40. If the reversing fork 40 has not been reversed to the predetermined position, an error message ■ is displayed (step 540).
), the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the reversing fork 40 is correctly reversed, the suction of the semiconductor wafer 2 is confirmed again (step S4).
1. ), if it has not been adsorbed, the above-mentioned error display (2) is performed (step 534).

=31- When the suction of the semiconductor wafer 2 is confirmed, the reversing fork 4
0 is pasted and retreats to the table 42 side (step 542
). Then, the reversing fork 4° releases the suction of the semiconductor wafer 2 and transfers the transferred semiconductor wafer onto the wafer chuck table 48 covered with the protective film 52 (step 544). The semiconductor wafer 2 transferred to the wafer chuck table 48 has its back side facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. As a result, the frame 4 stored in the frame stocker 56 is pushed out by the frame push-out mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 34B), and moves forward while engaging inside the pushed-out frame 4 (step 550). . As a result, the frame 4 is sent out to the frame positioning section 62, and the V notches 47, 4□ of the frame 4 are moved to the frame positioning section 62.
The frame 4 is positioned by engaging with a positioning pin 70 provided in the frame 4 .

Then, it is confirmed whether the frame 4 has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element PH3W5 provided in the frame positioning section 62. If frame 4 is not aligned, an error message ■ is displayed (step 354),
The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the frame 4 has been positioned, the frame chuck arm 72 that conveys the frame 4 to the table 42 is lowered (step 556) and sucks the positioned frame 4 (step 858). Next, it is determined whether the frame chuck arm 72 has attracted the frame 4 (step 560). this is,
The determination is made based on the detection signal of the pressure switch PUSW3 provided in relation to the frame chuck arm 72. If frame 4 is not adsorbed, an error message appears■
is carried out (step 562), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When it is confirmed that the frame 4 is attracted, the frame chuck arm 72 is raised (step 564).
). Then, it is checked again that frame 4 has been attracted (step 565), and if it has not been attracted, the above-mentioned error display (2) is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the attachment table 42 (step 8).
66). Then, the frame chuck arm 72 descends to move the frame 4 onto the frame chuck table 50.
(step 567).

When the transfer of the frame 4 is confirmed, the frame chuck table 50 is operated to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably sucking the frame 4 (step 571). This is determined based on the detection signal of the pressure switch PUSW4 provided in relation to the frame chuck table 50.

If the frame 4 is not attracted, an error display (2) is performed (step 572), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

After confirming that the frame 4 is attracted to the frame/chuck table 50, the frame/chuck arm 7
In order to release the suction of the frame chuck arm 72 (step 573), the frame chuck arm 72 rises (step 574).

Through the above steps, the semiconductor wafer 2 and frame 4 are set on the attachment table 42.

When the frame chuck arm 72 is raised, the pasting roller unit 90 is lowered (step 575). As a result, the adhesive tape 82 placed on the roller unit 90 also descends, and this adhesive tape 82 is attached to the wafer.
It comes into contact with the back surface of the semiconductor wafer 2 on the chuck table 48. When the pasting roller unit 90 is lowered, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, pasting is performed by the roller unit 9.
0 is attached by a roller rolling on the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2 and pressing lightly to attach the semiconductor wafer 2, the adhesive tape 82, and the frame 4 (step 876).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, by rotating the tape cuffer 112 once around the presser plate 110, the adhesive tape 82 is cut so as to be slightly smaller than the outer shape of the frame 4 (step S
78).

When cutting of the adhesive tape 82 is completed, the wafer/chuck table 48 is lowered (step 580), the protective film take-up reel 78 is driven to take up the protective film 52, and a new protective film 52 is placed on the wafer/chuck table 48. (step 582).

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residue of the adhesive tape 82 stuck to the periphery of the frame 4 is peeled off from the frame 4 (step 584).

Once the adhesive tape has been peeled off, the mount/frame chuck arm 114 is lowered to eject the mount frame 6 on the table 42 (step 886).
. Attach the mount frame 6 (step 388)
. Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). This is determined based on the detection signal of the pressure switch PUSW5 provided in relation to the mount/frame control arm 114. If the mount frame 6 is not attracted, an error message X is displayed (step 592), and the patrol light 14
0 error display light lights up and the operation panel 13
8 7-segment LEDs display the code corresponding to this error.

When it is confirmed that the mount frame 6 is attracted, the mount frame chuck arm 114 is raised (step 594). After the mount/frame chuck arm 114 is raised, check again whether the mount/frame 6 is attracted (step 595), and if it is not attracted, an error message X is displayed (step 592). When the suction of the mount frame 6 is confirmed, the pasting roller unit 90 and the peeling roller unit 92, which have moved to the pasting table 42, return to their original positions (origins) (step 896). For pasting, the roller unit 90 and peeling roller unit 92 return to their origin, and
The mount/frame chuck arm 1/4 which has attracted the mount/frame 6 also moves toward the swing reversing unit 116 (step 398). Then, the mount/frame chuck arm 114 is attached to the swing reversing unit 1.
After moving to the position where one end of the mount frame 6 is inserted into the clamp mechanism 118 of 16, check again that the mount frame 6 is attracted (step 599).
If it is not attracted, an error message X is displayed (step 592).

When adhesion of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 3100).
. Then, it is confirmed whether the mount frame 6 is securely clamped (step 5102). This is due to the photoelectric element PH3 provided in the clamp mechanism 118.
The determination is made based on the detection signal of W7. If the mount frame 6 is not clamped, error display XI is performed (step 5104), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. do.

After confirming that the mount frame 6 is clamped, the swing reversing unit 116 swings approximately 180 degrees in the horizontal direction (step 3106), and confirms that the mount frame 6 is clamped again (step 31).
07). If it is not clamped, error display XI is performed (step 5104). When the clamping of the mount frame 6 is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 3108). And once again, mount frame 6
Confirm the clamping (Step 5IO9), and if it is not clamped, perform an error display XI (Step S
104).

When the clamping of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the heat stage 126 (step 5lIO). This is performed based on the detection signal of the photoelectric element PH3W8 provided on the heat stage 126. If there is another mount frame 6 on the heat stage 126, an error display X will be displayed (status 7" 5111), the Parallel I-140 (7) error display light will turn on, and 7 on the operation panel 138 will be displayed.
A segment LED will display the code corresponding to this error.

When it is confirmed that there is no other mount frame 6 on the heat stage 126, the swing reversing unit 116 descends (step 5112), and when the mount frame 6 reaches above the heat stage 126, the clamp mechanism 118 is released. (Step 5113). This moves the mount frame 6 to the heat stage 126.

Mount frame 6 transferred to heat stage 126
is now heated (step 3114). This causes the adhesive tape on the mount frame 6 to contract, increasing the tape tension.

However, if such slack removal is not required, this step 5114 is omitted.

After heating the mount frame 6, the mount frame 6 is heated.
Frame pushing mechanism 128 is activated to push out the mounting frame on heat stage 126 (step 5116). Then, it is determined by Vv whether or not the mount frame 6 has been pushed out from the heat stage 126 (
Step 5l18). This is determined based on the detection signal of the photoelectric element PH3W9 provided at the end of the heat stage 126. If the mount frame 6 has not been pushed out, an error message will be displayed (step 51).
20) The error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

The mount frame 6 pushed out from the heat stage 126 rides on a transport table 130 for transporting to the unloader section. Then, the photoelectric element PH3WIO provided on the transport table 130 detects whether the mount frame 6 is placed on the transport table 130 or not.
I'iIl is recognized (step 5122). If the mount frame 6 is not placed on the transport table 130, an error display XTV is displayed (step 5124);
The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the mount frame 6 is not supported on the transport table 130, the mount frame 6 is transported to the unloader section and stored in the frame cassette 132 set in the unrotor section (step 5126).
). When the photoelectric element provided in the unloader section detects that the mount frame 6 has been stored in the frame cassette 132, the unloader section moves up one pitch to accommodate the next mount frame 6. (step 5128).

As described above, after aligning the semiconductor wafer 2 supplied from the wafer loader section in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame cassette 132 and storing the mount frame 6 with the semiconductor wafer 2 attached thereto in the frame cassette 132, are automatically performed.

Next, the suction detection section of the semiconductor wafer transport section, which is included in the automatic semiconductor wafer attachment apparatus according to this embodiment, will be described in more detail.

If the semiconductor wafer is not attracted to the semiconductor wafer transfer section, there is a risk that the semiconductor wafer will fall and be damaged when the semiconductor wafer is transferred from the alignment table to the attachment table.

Therefore, in the above-described automatic attachment of semiconductor wafers, it is important to have a function of detecting whether or not the semiconductor wafer transport section is suctioning a semiconductor wafer.

By the way, as is clear from the explanation of the embodiments mentioned above,
A semiconductor wafer transport section that sucks and holds the aligned semiconductor wafer 2 with a vacuum chuck and transports it from the alignment table 20 to the pasting table 42 corresponds to the reversing fork 40 . Further, the pressure detection means included in a part of the suction detection 44 for detecting whether or not the semiconductor wafer transfer section is suctioning a semiconductor wafer corresponds to the pressure switch PUSW2 described in the embodiment, and is capable of determining a semiconductor wafer suction error. The error determination means is the control unit 14 described in the embodiment.
It corresponds to 2. Further, the operation of this adsorption detection section is as follows in step S in the operation flowchart shown in FIG.
32 and step S41.

Next, more specific operations of the adsorption detection unit performed in steps S32 and S41 will be described in the first step.
This will be explained based on FIG.

Assume that the electromagnetic valve VL2 provided in connection with the vacuum chuck of the reversing fork 40 is activated, and the reversing fork 40 starts suctioning the semiconductor wafer 2 (step 531 shown in FIG. 12). At the same time as the solenoid valve VL2 operates, the 11th
A timer included in the CPU 144 of the control unit 142 shown in the figure is cleared (step 5321). Then, it is determined whether or not the reversing fork 40 has picked up the aligned semiconductor wafer 2 based on the detection signal of the pressure swifter PUSW2 (step S32□). Reversing fork 4
0 is sucking the semiconductor wafer 2, the pressure inside the vacuum chuck decreases, so the pressure switch PUSW2 is set to 0.
It becomes N state.

If the pressure switch PUSW2 is not in the ON state, it is checked whether the timer has timed out (step s32: +). This is done in consideration of the waiting time since it takes a considerable amount of time after the electromagnetic valve VL2 is activated until the pressure inside the vacuum chuck of the reversing fork 40 becomes low. Therefore, if the time has not exceeded, the process returns to step S32□. On the other hand, if the time has elapsed, it is determined that the aligned semiconductor wafer 2 has not been attracted to the reversing fork 40 for some reason, and an error display (2) is performed (step 534).

In step S32□, when it is confirmed that the reversing fork 40 has attracted the semiconductor wafer 2, the process proceeds to step S36 explained in FIG.
Performs inversion of 0. Then, when it is confirmed that the reversing fork 40 is correctly reversed (step 838),
Once again, it is detected whether the reversing fork 40 is sucking the semiconductor wafer 2 (step 541). however,
In this step S41, the above-described waiting time is not taken into consideration, and the presence or absence of suction of the semiconductor wafer 2 is immediately confirmed from the detection signal of the pressure switch PUSW2.

This is because the reversing fork 40 attracts the semiconductor wafer 2 in step S31 and step S32, and
This is because the vacuum chuck of the reversing fork 40 should be under low pressure.

If a suction error of the semiconductor wafer 2 is detected in this step 341, an error display ■ is performed (step 534).

On the other hand, when it is confirmed that the semiconductor wafer 2 is attracted, the reversing fork 40 moves backward in an inverted state (step 542), and the semiconductor wafer 2 is transferred to the table 42 for pasting.

Note that the semiconductor wafer 2 in step S41 described above
Since the suction confirmation is carried out just to be sure, the automatic attachment of the semiconductor wafer according to this embodiment is not necessarily required in the apparatus.

Next, we will briefly explain the recovery process that is performed when an error occurs in the automatic attachment of semiconductor wafers according to the above-described embodiment.

When any of the various errors described above occur, the mechanical sections that follow the location where the error occurs continue their respective operations and stop after completing their respective operation cycles. On the other hand, the location where the error occurred and each mechanical section corresponding to the preceding process stop when the error occurs. Based on the above-mentioned error display, the operator takes appropriate measures such as removing the workpiece (for example, the semiconductor wafer 2 or the frame 4) where the error has occurred or setting the cassette correctly. Then, each mechanical section corresponding to the process preceding the error occurrence point is returned to its origin, and the apparatus is restarted.

Note that the display mode indicating the failure of the reversing fork 40 to pick up the semiconductor wafer is not limited to that described in the embodiment, and may be modified in various ways such as a buzzer display.

Furthermore, it goes without saying that the apparatus for automatically attaching semiconductor wafers according to the present invention is not limited to the apparatus described in the embodiments.

<Effects of the Invention> As is clear from the above description, the automatic semiconductor wafer attachment device according to the present invention transfers the semiconductor wafer aligned by the alignment table to the semiconductor wafer transport unit that conveys the semiconductor wafer to the attachment table. Relatedly, a suction detection section detects whether or not the semiconductor wafer 1 general transfer section is suctioning a semiconductor wafer, and a suction detection section detects a semiconductor wafer suction error of the semiconductor wafer transfer section based on a detection signal of the suction detection section. and an error determining means for determining.

Therefore, according to the present invention, if the semiconductor wafer is not attracted to the semiconductor wafer transport unit due to some abnormality, the operator can use this automatic semiconductor wafer attachment to know the occurrence of the abnormality in the apparatus and the location thereof. This makes it possible to take appropriate measures quickly, which prevents semiconductor wafers from falling from the semiconductor wafer transport section, and also improves the operating efficiency of the equipment by automatically attaching semiconductor wafers.
This is very convenient for making two things happen.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing the overall configuration of a semiconductor wafer automatic pasting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration of the semiconductor wafer alignment section and the surrounding area of the reversing fork in the embodiment. FIG. 3 is a configuration diagram of the orientation flat end detection section in the above embodiment, and FIG.
The figure is a block diagram of the frame loader section and the surroundings of the frame positioning section in the embodiment, FIG. 5 is a block diagram of the frame transport section and its periphery in the embodiment, and FIG. 6 is the adhesive tape supply system and the adhesive tape in the embodiment. FIGS. 7 and 8 are diagrams illustrating the configuration and operation of the pasting roller unit and peeling roller unit in the embodiment; FIG. 9 is a diagram illustrating the configuration around the heat stage in the embodiment; FIG. 10 is an explanatory diagram of the semiconductor wafer, frame, and mount frame used in the embodiment, FIG. 11 is a block diagram schematically showing the configuration of the control system in the embodiment, and FIG. 12 is a diagram showing the configuration of the control system in the embodiment. FIG. 13 is an explanatory diagram of the orientation flat alignment in the embodiment, FIG. 14 is an operation flowchart of the orientation flat alignment in the embodiment, and FIG. 15 is an illustration of the semiconductor wafer adsorption of the reversing fork in the embodiment. It is a specific operation flowchart of error detection. 2... Semiconductor wafer, ○F... Orientation flat, 4... Frame, 6... Mount frame, 8... Wafer cassette, 14... Semiconductor wafer positioning section, 20... - Alignment table, 24... Pulse motor, 32... Orientation flat end detection section, 40... Reversing fork, 4
2... Paste on table, 48... Wafer/chuck table, 50... Frame/chuck table, 5
4... Frame loader section, 62... Frame positioning section, 72... Frame chuck arm, 82...
...Adhesive tape, 90...Pasting is done using a roller unit, 9
2... Peeling roller unit, 108... Adhesive tape cutting mechanism, 114... Mount/frame chuck arm, 116... Swing reversing unit, 118...
・Clamp mechanism, 126... Heat stage, 128
...Mount frame extrusion mechanism, 130...
Transport table, 132...Frame cassette, 13
8... Control panel, 140... Patrol light, 142...
・Control unit, 144...CPU, PH3WI to PH3W
I1...Photoelectric element, PUSWI~PUSW5...
Pressure switch.

Claims (1)

[Claims] An automatic semiconductor wafer affixing device that aligns a semiconductor wafer on which an orientation flat is formed and affixes it to an adhesive tape, the apparatus comprising: an alignment table that aligns the semiconductor wafer; and a wafer that is aligned by the alignment table. a pasting table for pasting a semiconductor wafer onto an adhesive tape; a semiconductor wafer transport section for sucking and holding the semiconductor wafer aligned by the alignment table with a vacuum chuck and transporting the semiconductor wafer from the alignment table to the pasting table; a suction detection unit that detects whether the semiconductor wafer transfer unit is suctioning the semiconductor wafer;
The suction detection unit includes pressure detection means for detecting a pressure change of a vacuum chuck provided in the semiconductor wafer transfer unit;
An automatic semiconductor wafer pasting apparatus comprising: an error determination means for determining a semiconductor wafer suction error in the semiconductor wafer transfer section based on whether or not the pressure detection means detects a pressure change in the vacuum chuck. .