JPH01207943A - Automatic apparatus for sticking semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent breakage of a wafer and improve the utilization factor by a method wherein an auxiliary removing roller provided in a removing roller unit is displaced by a large tension applied to a remaining tape and the displacement is detected to judge the existence of removing failure. CONSTITUTION:The apparatus is used for sticking a semiconductor wafer 2 to an adhesive tape 82 in the process before the scribing process of the semiconductor wafer 2. An auxiliary removing roller which can be displaced by the application of the tension of a remaining tape 82' remaining after the adhesive tape 82 is cut into a circle along a frame and a tension detecting mechanism which detects the occasion that a tension higher than a predetermined tension is applied to the auxiliary removing roller are provided in a removing roller unit 92 and a means which judges the existence of removing failure in accordance with the detected results of the tension detecting mechanism is also provided. Therefore, the roll-in of the wafer in the process of removing the remaining tape 82' caused by the cutting failure of the tape can be detected beforehand. With this constitution, a proper disposition can be carried out before a large trouble such as breakage of the wafer 2 which requires much labor for restoration takes so that the performance of the automatic apparatus can be fully exhibited.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is cranked while attached to the adhesive tape. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next process, the bonding process.

Such a process of attaching a semiconductor wafer to an adhesive tape is performed as a pre-process of a semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafers to adhesive tape.

Therefore, the present applicant positioned and held a ring-shaped frame on a frame chuck table using automatic feeding means, and also positioned and held a semiconductor wafer, which was also automatically fed, on the wafer chuck table at the center of the ring. In the above, a continuous adhesive tape is pasted over the frame and wafer using a roller unit, and then the pasted adhesive tape is cut out in a circular shape along the frame, and the residual tape after cutting is removed using a peeling roller unit. We have previously proposed an automatic pasting device that is designed to be peeled off from the frame and then rolled up and collected.

<Problems to be Solved by the Invention> The proposed automatic affixing described above uses an extremely highly efficient device to affix and support wafers via adhesive tape to a frame (
However, when cutting out a circular shape from the adhesive tape attached to the frame, the cutting performance of the canter deteriorated due to long-term use, and the blade was damaged. If a cutting defect occurs in a part of the circular cutting line, in the next residue tape peeling and recovery process, not only the residue tape but also the tape attached to the wafer will be peeled off from the frame and placed inside the peeling roller unit. If the wafer gets caught, the wafer may be damaged, and when such a trouble occurs, the apparatus has to be stopped for a long time to repair it.

The present invention has been developed in view of the above circumstances, and by making it possible to detect in advance wafer entrapment during the residual tape peeling process due to poor tape cutting, it is possible to prevent wafer damage and repair. The purpose of the present invention is to enable appropriate measures to be taken before major troubles occur that require time and effort, and to enable the performance of an automated device to be fully demonstrated.

Means for Solving the Problems> In order to achieve the above object, the present invention has the following configuration.

That is, the characteristic configuration of the present invention includes: a frame chuck table for positioning and holding a ring-shaped frame; a wafer chuck table for positioning and holding a semiconductor wafer at the center of the frame; A semiconductor device equipped with a roller unit for pasting adhesive tape, an adhesive tape cutting mechanism for cutting out the pasted adhesive tape in a circular shape along the frame, and a peeling roller unit for peeling off the residual tape from the frame after cutting. For automatic wafer attachment, the apparatus includes a peeling auxiliary roller that can be displaced by the tension of the residual tape in the peeling roller unit, and a tension detection mechanism that detects when a tension higher than a set value is applied to the peeling auxiliary roller. and a means for determining a peeling error based on the detection result of the tension detection mechanism.

<Effect> The effects of the configuration of the present invention are as follows.

If a part of the adhesive tape attached to the semiconductor wafer is not cut due to an abnormality in the adhesive tape cutting mechanism, a large tension will be applied to the residual tape when it is peeled off from the frame. The peeling auxiliary roller provided in the peeling roller unit is displaced by the large tension acting on the residual tape, and a peeling error is determined based on this displacement being detected by the tension detection mechanism.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of an automatic semiconductor wafer attaching apparatus according to the present embodiment, and FIGS. 2 to 15 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attaching apparatus. It is.

FIG. 16 shows a semiconductor wafer 2 that is attached to an adhesive tape by an apparatus for automatic attachment of semiconductor wafers according to this embodiment.
, a ring-shaped frame 4 for holding the adhesive tape to which the semiconductor wafer 2 is attached, and the semiconductor wafer 2
The mount frame 6 is shown with the mount frame 6 attached.

An orientation flat OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2 . An element pattern is formed on the semiconductor wafer 2 using this orientation flat OF as a reference.

The frame 4 is a ring-shaped metal plate or resin plate, and has a V-notch 4 on its outer periphery, which is used when aligning the frame 4, which will be described later. ．． 4□ is formed.

For automatic attachment of semiconductor wafers according to this embodiment, the apparatus separately supplies the semiconductor wafer 2 and the frame 4 from the wafer loader section and the frame loader section, respectively, and attaches them to the adhesive tape, and finally mounts the semiconductor wafers. -The frame 6 is stored in the unloader section.

The configuration of each part of this device will be explained below.

Reference numerals 8 (81 to 84) shown in FIG. 1 are wafer cassettes set in the wafer loader section. The wafer cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically in equally spaced corners. In this embodiment, there are two wafer loader sections, and the left wafer loader section has wafer cassettes 8. ．． 82 is a wafer cassette 83, 8 . can be set respectively. Each wafer loader section is configured to be movable in the vertical direction, and the wafer cassette 8
The semiconductor wafer 2 is supplied by detecting the semiconductor wafer 2 inside and pushing it out.

The wafer pushing means provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a motor is installed.
A wafer push-out mechanism 12 driven by an air cylinder is provided in the right wafer loader section.

Semiconductor wafers 2B supplied from each wafer loader section,
This semiconductor wafer 2 is transported to a semiconductor wafer alignment section 14 for alignment.

The semiconductor wafer 2 is transported to the semiconductor wafer alignment section 14 by a transport belt 16 shown in FIG. This transport heald 16 is driven in forward and reverse directions by a motor 8.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives and receives the semiconductor wafer 2 that has been transferred and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center of the semiconductor wafer 2. ．． Including 22□ etc.

The alignment table 20 is equipped with a vacuum chuck that holds the semiconductor wafer 2 by suction. VLI is
The solenoid valve PUSWI that turns on/off the vacuum chuck is a pressure switch that detects a pressure drop within the vacuum chuck and turns on.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable in the vertical direction by an air cylinder 26.

Center alignment plate 22. , 22□ are provided at positions facing each other with the alignment table 20 in the upper limit state interposed therebetween. Each center alignment plate 22, . An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposite surface side of the 22□. Center alignment plate 22. ,22
□ is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

As shown in FIG. 3, two reflective photoelectric elements PH3WI 1+ and PH3Wll are installed on both sides of the alignment table 20 in order to detect the edge of the semiconductor wafer 2 transferred on the transfer heald 16. . is provided. When the semiconductor wafer 2 is supplied from the wafer loader section on the left, the reflective photoelectric element PH3W1 on the right]
+ detects the edge of the semiconductor wafer 2, and the transport heald 16 is stopped after a certain period of time has elapsed depending on the size of the semiconductor wafer 2. When the semiconductor device H2 is supplied from the right wafer loader section, the left reflective photoelectric element PH3
The end of the semiconductor wafer 2 is detected at WI 1□, and the conveyor belt 16 is stopped after a certain period of time has elapsed depending on the size of the semiconductor wafer 2.

Reference numeral 32 shown in FIG.
In order to detect the edge of the orientation flat OF of the semiconductor wafer 2 which is being held by suction and rotating,
This is an orientation flat end detection unit equipped with a set of transmission type photoelectric elements PH3WI, 2.3. As shown in FIG.
The light receiving section 38 and the light receiving section 38 are configured to be openable and closable by the air cylinder 34. The reason why such three sets of transmission type photoelectric elements PH3WI, 2.3 are used is to select and use an appropriate photoelectric element according to the size of the semiconductor wafer 2. The orientation flat end detection section 32 is open in a normal state, and is closed when detecting the end of the orientation flat OF for positioning.

Reference numeral 40 shown in FIG. 1 and FIG.
A reversing fork is used to convey the semiconductor wafer 2, which has been subjected to OF alignment, to the table 42. The reversing fork 40 is equipped with a vacuum chuck for suctioning and holding the semiconductor wafer 2 from the back side. ■I, 2 is a solenoid valve that turns on/off this vacuum chuck, PUSW2
is a pressure switch that detects a pressure drop within the vacuum chuck and turns on.

The reversing fork 40 is driven by an air cylinder 44 and is connected to the alignment table 20 and the pasting table 42.
The semiconductor wafer 2 is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. PH3W
Reference numeral 4 denotes a photoelectric element for detecting whether the reversing fork 40 is in a predetermined position after performing a reversing operation.

As shown in FIG. 7, the pasting table 42 is
It includes a chuck table 48 and a frame chuck table 5o provided around the wafer chuck table 48. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 in which a large number of small holes are formed is laid on the wafer chuck table 48. The semiconductor wafer 2 conveyed by the reversing fork 40 is placed on the wafer chuck table 48 with the back surface facing up via the protective film 52. The protective film 52 is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of 7 frames 4 in a stacked state, and a frame extrusion mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. . This frame extrusion mechanism consists of 1
, an extrusion plate 58 for extruding the frame 4, an air cylinder 60 for horizontally driving the extrusion plate 58, and the like. The frame 4 supplied from the frame loader section 54 is sent out to the frame positioning section 62 by the frame sending means. The frame sending means includes a frame pusher 64 that engages with the inner circumferential surface of the frame 4 pushed out from the frame stocker 56 and sends out the frame 4, and an air cylinder 6 for raising and lowering the frame pusher 64.
6, and an air cylinder 68 for horizontally driving the frame pusher 64. In the normal state, frame pusher 64 is lowered. When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven and the frame stocker 56 is pushed out.
Push up the pusher 64 and then push the air cylinder 6
8 is driven, and with the frame pusher 64 engaging the frame 4, the frame 4 is moved to the frame positioning section 62.
Send it out to.

The frame positioning section 62 is provided with two left and right positioning bins 70 (however, only one positioning bin 70 is shown in FIG. 5) for positioning the sent-out frame 4. The frame 4 is positioned by engaging the positioning pin 70 with the V-notch 41.4□ of the frame 4. PH3W5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is conveyed to the attachment table 42 by the frame conveyance means, and the attachment frame 4 is placed on the frame chuck table 50 of the table 42.

As shown in FIG.
It is composed of a frame/chuck arm 72 for sucking and holding the frame/chuck arm 72, an air cylinder 73 for raising the frame/chuck arm 72, and an air cylinder 74 for driving the frame/chuck arm 72 in the horizontal direction. VL3 is this frame chuck arm 72
The solenoid valve PUSW3-15= which turns on/off is a pressure switch that detects a drop in pressure within the frame chuck arm 72 and turns on.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport means. VL4 shown in FIG. 6 is a solenoid valve that turns on/off the frame/chuck table 50, and PUSW4 is a pressure switch that turns on when detecting a pressure drop within the frame/chuck table 50. . In addition, PH3W6 is
This is a photoelectric element that detects the frame 4 on the frame chuck table 50.

Next, a tape supply/winding mechanism and an adhesive tape cutting mechanism will be explained based on FIGS. 1 and 7.

The above-described protective film 52 is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and wound up by a protective film take-up reel 78 provided on the other side of the table 42. .

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is set on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator 84 is wound up separately from the adhesive tape 82 by a separator take-up reel 86 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a pasting roller unit consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 7, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is pasted onto a roller unit 90 in an r3J shape, and is further placed in parallel on the roller unit 90. The frame is passed to the peeling roller unit 92 and wound onto the residue tape take-up reel 88.

As shown enlarged in FIG. 10, the peeling roller unit 92 includes a peeling roller 92. and two upper and lower peeling auxiliary rollers 9.
It is equipped with 22,923. Peeling roller 92. A peeling torque motor 924 is connected to the peeling torque motor 924, and when the adhesive tape '82 is peeled off, the peeling torque motor 924 moves the peeling roller 92. By forcibly driving the residual tape 82', the residual tape 82' is smoothly sent out to the residual tape take-up reel 88. Note that this peeling torque motor 924 is
A tape whose peeling torque can be adjusted depending on the type of residual tape 82 is used.

The re-peeling auxiliary rollers 92□, 923 are provided at the upper and lower ends of a swinging arm 93 that can swing left and right about an intermediate fulcrum P, respectively, and the swinging arm 93 is pulled counterclockwise by a spring 95. The peeling roller 92. The adhesive tape 82 is pressed with a constant pressure to the peeling roller 92. I try not to slip on top. Further, a limit switch LSWI is provided to detect whether or not the swing arm 93 is swung against the tension spring 95, and this limit switch LSWI causes the lower peeling auxiliary opening 92□ to properly peel. Roller 92. A mechanism is configured to detect whether or not the object is being pressed.

As shown in FIG. 8, the pasting roller unit 90 is connected to the tip of an air cylinder 94 that horizontally drives it. Furthermore, the peeling roller unit 92 is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide horizontally on the rail 9G by means of a cam follower provided on their upper portions. The rail 96 is configured to be movable up and down by air cylinders 9B, 98□ provided at both ends thereof. A rack and pinion mechanism 100 is provided at the bottom of the roller unit 90, and this rack and pinion mechanism 100 is used for pasting.
The pinion mechanism 100 includes a brake 102 and a clutch 10
The motor 106 is connected to the motor 106 via the motor 4.

The operations of the pasting roller unit 90 and peeling roller unit 92 described above will be explained with reference to FIGS. 8 and 9.

In the normal state, each roller unit 90, 92 is attached at the origin position to the left of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When performing pasting operation, use air cylinder 98°, 98□
is activated and the rail 96 is lowered. As shown in FIG.
The air cylinder 99 engages in a recess 925 provided in the peeling roller unit 92 due to the protruding operation of the air cylinder 99, thereby maintaining the peeling roller unit 92 in a stopped state. In this state, when the air cylinder 94 is activated, the pasting is done by the roller unit 90.
The adhesive tape 82 and the semiconductor wafer 2 are driven horizontally, and the roller rolls while pressing the adhesive tape 82 on the table 42 downward.
Pasting is done. At this time, clutch 104 is released.

When the residual tape 82'' is to be peeled off from the frame 4 etc. after cutting the adhesive tape 82, the pressure on the air cylinder 99 is released via the solenoid valve VL10, and the cutter 97 is moved back, thereby fixing the peeling roller unit 92. is released, and the brake 102 is activated.In this state, when the air cylinder 94 is activated, the peeling roller unit 92 and the air cylinder 94 are integrated, since the pasting roller unit 90 remains stopped. The peeling roller unit 92 moves horizontally to the right and peels off the residual tape 82' by rotationally driving the peeling roller 92. FIG. 9 shows the point at which such a peeling operation is completed. each roller unit) 90.
92 position is shown.

The return of each roller unit 90, 92 to its origin after the peeling operation is completed is performed as follows.

First, air cylinder 98. ．． 9B□ operates to raise the rail 96. The reason for raising the rail 96 in this way is that each roller unit 90.
This is because when the adhesive tape 92 rolls on the table 42, the residual tape 82' peeled off by the peeling operation described above will adhere to the frame 4 etc. again. As the rail 96 rises, the brake 102 is released and the clutch 104
are combined. Then, each time the motor 106 is activated and the rack and pinion mechanism 100 is driven, the pasting roller unit 1-90 and the peeling roller unit 92 move horizontally to the left and return to the origin.

By the way, the above-mentioned pasting is performed using a band-shaped adhesive tape 82 that is pasted on the upper side of the table 42.
An adhesive tape cutting mechanism 108 is provided for cutting the tape along the frame 4 in a circular shape. This adhesive tape cutting mechanism 108, as shown in FIG.
2, a disc-shaped tape cutter 112 that is rotatably driven along the outer periphery of the press plate 110, and the like. The holding plate 110 and the tape counter 112 are configured to be movable in the vertical direction as a unit.

The reference numeral 114 shown in FIG.
It is a frame chuck arm. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves to the side of the pasting table 42 along with the peeling operation of the peeling roller unit 92 and holds the mount/frame 6 by suction, and the mount/frame 6 is removed by the return-to-origin operation of the peeling roller unit 92 or the like. is discharged and conveyed. In addition, VL5 shown in FIG. 7 is a solenoid valve that turns on/off this mount/frame chuck arm 114, and PUSW5 is a pressure switch that turns on when detecting a pressure drop inside the mount/frame chuck arm 114. It is.

The mount frame 6 suctioned and held by the mount frame chuck arm 114 is conveyed to the swing reversing unit 116 by the return-to-origin operation of each of the roller units 90 and 92. As shown in FIGS. 7 and 15, the swing reversing unit 116 includes a clamp mechanism 1 that holds the transported mount frame 6.
In addition to 18, there is also a swing mechanism 120 that swings the held mount frame 6 approximately 180 degrees in the horizontal direction, an inversion mechanism 122 that inverts the swung mount frame 6 so that the surface of the semiconductor wafer 2 faces up, and an inversion mechanism The mount frame 6 is provided with a vertical drive mechanism 124 for lowering the mounted mount frame 6 to a mount frame dispensing table 126.

Note that the PH3W7 provided in the clamp mechanism 118 is
This is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

The mount frame delivery table 126 is provided with a transport heald 127 for delivering the mount frame 6 to the transport table 130.

The transport table 130 transports the mount frame 6 discharged from the mount frame discharge table 126 into frame cassettes 132 (132, . . .
1324). Transfer table 130
is connected to a heald 133 driven by a motor 131 as shown in FIG. The mount frame 6 is distributed and supplied to a transport heald 136 for transport. Note that PH3W8 shown in FIG. 15 is a photoelectric element that detects the mount frame 6 on the mount frame dispensing table 126, and PH3WIO is a photoelectric element that detects the reception and removal of the mount frame 6 by the transport table 130. It is.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equal intervals, and in this embodiment, four frame cassettes 132I to 1324 can be set. Frame cassette 132. ．． 132□ is
Frame cassette 1323,
132. are respectively sent to the right unloader section. Each unloader section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. This control panel 1
38 is provided with an LCD display unit that displays a message corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a patrol light that displays automatic driving operations, error occurrences, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 17.

The control unit 142 includes a CPU 144, a ROM 146, and a RAM.
148, an operation panel controller 150, a sensor controller 152, an actuator controller 154, a pulse motor controller 156, and the like. C
The PU 144 controls the entire device according to a processing program stored in the ROM 146. RAM 14B
Data such as the size of the semiconductor wafer to be pasted and processing conditions are written in. Operation panel controller 150
represents the operation panel 138, the sensor controller 152 represents various sensor groups 158 such as pressure switches and photoelectric elements provided in this device, and the actuator controller 154 represents various actuator groups such as motors and air cylinders provided in this device. 160 and a pulse motor controller 156 respectively control the pulse motor 24 that rotationally drives the alignment table 20.

Next, the operation of the automatic semiconductor wafer bonding apparatus having the above-described configuration will be explained according to the flowchart shown in FIG.

When this apparatus is started with each part of the apparatus having returned to its original position and with the wafer cassette 8 and frame cassette 132 installed in the wafer loader section and unloader section, respectively, the wafer - The wafer loader section on one side with the cassette 8 mounted is lowered (step S2).

It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in the wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the transport heald 16 is driven, and the detected semiconductor wafer 2 is pushed out from the wafer cassette 8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section (step 3B). ). The extruded semiconductor wafer 2 is transferred to the transport heddle 1
6 and is transported to the semiconductor wafer alignment section 14.

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is checked whether the receipt has been received (step 510).

Confirmation that the semiconductor wafer 2 has been received is detected by photoelectric elements PH3WI1° and PH3WII□ provided near the alignment table 20, as shown in FIG. Alignment table 20 after a certain period of time
does not pick up the semiconductor wafer 2, an error display ■ is performed (step 312), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error. Display.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). And center alignment plate 22. , 22° are driven to index the center of the semiconductor wafer 2 (step 316). Once the center of the semiconductor wafer 2 has been determined, the vacuum chuck of the alignment table 20 is operated to suck the semiconductor wafer 2 (step 518). and a pressure switch PUSWI provided in connection with the vacuum chuck.
Thus, it is confirmed whether the semiconductor wafer 2 is reliably attracted (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flat OF of the semiconductor wafer 2 is aligned (step 524).

Hereinafter, the procedure for aligning the orientation flat of the semiconductor wafer in this step will be explained based on FIGS. 3 and 19. FIG. 3 shows the center alignment plate 22. ．． The semiconductor wafer 2 centered by 22□ is shown being attracted by the alignment table 20. The edge of the orientation flat OF is detected by one of the photoelectric elements PH3WI, 2.3, which are appropriately selected depending on the size of the semiconductor wafer 2. In FIG. 3, for convenience, the photoelectric element PH
Only 3WI is shown. The photoelectric element PH3WI is located slightly inside the radius of the semiconductor wafer 2 from the center of the alignment table 20. The output of the photoelectric element P HS W 1 is directly given to a pulse motor controller 156 that controls the pulse motor 24 . The pulse motor controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element PH3WI. Further, the pulse motor controller 156 outputs a rotation amount to the pulse motor 24 based on a command from the CPU 14'4, and
CP is the rotation amount until the pulse motor 24 comes to a stop state.
Give to U144.

FIG. 19 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 144 rotates the pulse motor 24 counterclockwise by 360° and sets the rotation amount (step 3130), and controls the pulse motor controller 156 to the pulse motor 24 (
Step 5132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation franc)O
When one end of F is detected by photoelectric element PH3WI,
The detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

After step 5132 is completed, the CPU 144 monitors whether the pulse motor 24 has stopped (step 31
．． 34).

After confirming that the pulse motor 24 has stopped, the CPU
144 sets the amount of rotation for rotating the pulse motor 24 by 360° clockwise (STELLA 7''5L36), and outputs this to the pulse motor 24 via the pulse motor controller 156 (step 5L3B).

As a result, the semiconductor wafer 2 is rotated in the opening direction.

When the other end of the orientation flat OF is detected by the photoelectric element PH3VI/1, the detection signal is given to the pulse motor controller 156 to stop the pulse motor 24.

When the CPU 144 confirms that the pulse motor 24 has stopped (step 5140), the CPU 144 determines the clockwise rotation amount θ at that time.
is read (step 5142).

Then, a rotation amount for rotating the pulse motor 24 counterclockwise by θ/2 is set (step 5144), and this is output to the pulse motor 24 via the pulse motor controller 156 (step 5146). As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat OF intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element PH3WI.

The above is the basic procedure for aligning the orientation flat OF, but depending on the type of semiconductor wafer 2,
Final positioning may be completed by further rotating the semiconductor wafer 2 by 90° or 180°.

Hereinafter, referring back to FIG. 18, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 526). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step 32.2 described above and an error display (2) is performed.

By the way, after the above-mentioned step S14 is completed, the process moves to step S16 and also moves to step 328. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530). At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction (step 531).

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). Whether or not suction is performed is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If suction has not been performed, an error display (2) is performed (step 534), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error.

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 53).
6). Then, it is confirmed whether the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 40 is reversed is determined based on the detection signal of the photoelectric element PH3W4 provided in relation to the reversing fork 40. If the reversing fork 40 has not been reversed to the predetermined position, an error display V is displayed (step 540).
, the error indicator light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error.

If the inversion frame 40 is correctly inverted, the suction of the semiconductor wafer 2 is confirmed again (step 54).
1) If it is not picked up, the error message I mentioned above will be displayed.
V (step 534).

When adsorption of the reversing fork 40 is confirmed, the reversing fork 40 retreats toward the table 42 (step 54).
2). Then, the reversing fork 40 releases the suction of the semiconductor wafer 2 and transfers the retreated semiconductor wafer 2 onto the wafer chuck table 48 covered with the protective film 52 (step 544). Wafer chuck table 48
The semiconductor wafer 2 transferred has its back side facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. Due to the dirt, the frame 4 stored in the frame stocker 56 is pushed out by the frame pushing mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 548), and moves forward while being held inside the pushed-out frame 4 (step 550). . As a result, the frame 4 is sent out to the frame positioning section 62, and the notch 4. , 4□ engage with the positioning pin 70 provided on the frame positioning part 62,
The frame 4 is positioned. And frame 4
It is checked whether the position has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element PH3W5 provided in the frame positioning section 62. If the frame 4 is not aligned, an error display ■ is performed (step 554), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error. do.

If the frame 4 has been positioned, the frame chuck arm 72 that transports the frame 4 to the table 42 is lowered (step 556) and sucks the positioned frame 4 (step 358). Next, it is confirmed whether or not the frame chuck arm 72 has attracted the frame 4 (step 560). This is determined based on the detection signal from the pressure switch PUSW3 provided in relation to the frame chuck arm 72. If the frame 4 is not attracted, an error display ■ is displayed (step 562), the error display light of the patrol light 140 lights up, and the LC of the operation panel 138 turns on.
The D display unit displays a message corresponding to this error.

When it is confirmed that the frenim 4 is attracted, the frame chuck arm 72 is raised (step 564).
). Then, check again that frame 4 is adsorbed (step 565); if it is not adsorbed,
The error display (2) described above is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the pasting table 42 (step 566). Then, the frame chuck arm 72 descends to transfer the frame 4 to the frame chuck table 50 (step 567).

When it is confirmed that the frames 1 and 4 have been transferred, the frame chuck table 50 operates to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably adsorbing the frame 4 (step 571). This is determined based on the detection signal of the pressure inch PUSW4 provided in relation to the frame/chuck table 50. If the frame 4 is not attracted, an error display (2) is performed (step 572), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error.

When it is confirmed that the frame 4 is attracted to the frame chuck full 50, the adsorption of the frame chuck arm 72 is released (step 573), and the frame chuck arm 72 is raised (step 574).

Through the above steps, the semiconductor wafer 2 and the frame 4 are set on the table 42, and when the frame chuck arm 72 is raised, the pasting is performed by the roller unit 9.
0 falls (step 575). This allows pasting (q
The adhesive tape 82 carried over the roller unit 90 also descends, and this adhesive tape 82 comes into contact with the back surface of the semiconductor wafer 2 on the wafer lock table 48. Paste (=
When the roller unit 90 descends, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, the roller of the roller unit 90 presses lightly while rolling on the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2, and the adhesive tape 82 and frame 4 are attached to the semiconductor wafer 2. (step 576).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 1-110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, the tape cutter 112 cuts the circumference of the presser plate 110 one by one.
By rotating the adhesive tape 82, the adhesive tape 82 is cut to be slightly smaller than the outer shape of the frame 4 (step 3).
78).

When cutting of the adhesive tape 82 is completed, the wafer chuck table 48 is lowered (step 580), the protective film take-up reel 78 is driven to wind up the protective film 52, and the new protective film 52 is transferred to the wafer chuck table (step 580). 48" (Step 5)
82).

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residual tape 82' stuck to the peripheral portion of the frame 4 is peeled off from the frame 4 (step 584).

During the peeling operation of the residual tape 82'', a tape peeling error is detected in step S85. If a peeling error is detected, an error display ■ is displayed (step 387), and the error display light of the patrol light 140 lights up. At the same time, a message corresponding to this error is displayed on the LCDCD display of the operation panel 138.

Once the residue tape 82'' has been removed, the tape is attached to table 4.
In step 5, the mount frame chunk arm 114 for ejecting the mount frame 6 on the 2 is lowered.
86), adsorb the mount frame 6 (step 3
88). Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). this is,
The determination is made based on the detection signal of the pressure switch PUSW5 provided in relation to the mount/frame chuck arm 114. If the mount frame 6 is not suctioned, error display X is displayed (step 592), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error. indicate.

When it is confirmed that the mount frame 6 is attracted, the mount frame chuck arm 114 is raised (step 594). After the mount frame chunk arm 114 has been raised, check again whether the mount frame 6 is attracted (step 595), and if it is not attracted, the above-mentioned error message X is displayed (step 59).
2).

When the adhesion of the mount frame 6 is confirmed, the adhesion has moved to the table 42, and the adhesion has moved to the roller unit 90.
Then, the peeling roller unit 92 returns to its original position (origin) (step 896).

Pasting is done by roller unit 90 and peeling roller unit 9
2 returns to the origin, the mount/frame chuck arm 114 that has attracted the mount/frame 6 also moves in the direction of the swing reversing unit 116 (step 89
8). And mount frame chuck arm 11
4 is a clamp mechanism 118 of the swing reversing unit 116
When the mount frame 6 is moved to the position where one end of the mount frame 6 is inserted, check again whether the mount frame 6 is attracted (Step 599), and if it is not attracted, the above-mentioned error message X is displayed (Step 592). .

When suction of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 3100).
). Then, it is confirmed whether the mount frame 6 is securely clamped (step 5102). This is due to the photoelectric element P provided in the clamp mechanism 118.
The judgment is made based on the detection signal of HSW 7. If the mount frame 6 is not clamped, an error display XI is displayed (step 5104), and the patrol light 140
The error display light on the control panel 138 lights up.
The LCD display unit will display a message corresponding to this error.

After confirming that the mount frame 6 is clamped, the swing reversing unit 116 swings approximately 180 degrees in the horizontal direction (step 5106), and confirms that the mount frame 6 is clamped again (step 51).
07). If it is not clamped, the above-mentioned error display XI is performed (step 5104). When the clamping of the mount frame 6 is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 310B). And once again, Mt.
Check the clamp of frame 6 (step 5109),
If it is not clamped, the error display XI mentioned above will appear.
(Step 5IO4).

When the clamp of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the mount frame dispensing table 126 (step 5il).
o). This is the mount frame payout table 1
This is performed based on the detection signal of the photoelectric element PH3W8 provided at 26.

If there is another mount frame 6 in the mount frame payout table 126, error display XII is displayed (
In step 5111), the error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error.

When it is confirmed that there is no other mount frame 6 on the mount frame dispensing table 126, the swing reversing unit 116 descends (step 3112), and when the mount frame 6 reaches the top of the mount frame dispensing table 126. , clamp mechanism 118
(step 5113). As a result, the mount frame 6 is moved to the mount frame payout table 126.

When the mount frame 6 is transferred to the mount frame dispensing table 126, the conveyor belt 127 is operated to dispense the mount frame 6 on the mount frame dispensing table 126 (step 5116).

Then, it is confirmed whether the mount frame 6 has been paid out from the mount frame payout table 126 (step S'11B). This is the photoelectric element F provided on the mount frame dispensing table 126.
) Judgment is made based on the detection signal of H3W8.

If the mount frame 6 has not been paid out, an error display X is displayed (step 5120), and the error display light of the patrol light 140 lights up.
The LCD display unit of the operation panel 138 displays a message corresponding to this error.

The mount frame 6 discharged from the mount frame dispensing table 126 rides on a transport table 130 for transporting to the unloader section. Then, it is checked by the photoelectric element PH3WIO provided on the transport table 130 whether or not the mount frame 6 has been received by the transport table 130 (step 5122). If the mount frame 6 is not placed on the transport table 130, an error display XIV is displayed (step 31).
24) The error display light of the patrol light 140 lights up, and the LCD display unit of the operation panel 138 displays a message corresponding to this error.

If the mount frame 6 is not supported on the transport table 130, the mount frame 6 is transported to the unloader section and stored in the frame cassette 132 set in the unloader section (step 3126).
). When the photoelectric element provided in the unloader section detects that the mount frame 6 has been stored in the frame cassette 132, the unloader section moves up one pitch to accommodate the next mount frame 6. (Step 5L2B).

As described above, after aligning the semiconductor wafer 2 supplied from the wafer loader section in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame cassette 132 and storing the mount frame 6 to which the semiconductor wafer X2 has been attached, into the frame cassette 132 are automatically performed.

Next, the tape peeling error detecting section of the tape peeling section provided in the automatic semiconductor wafer attaching apparatus according to this embodiment will be described in more detail.

After cutting the adhesive tape 82, when the residual tape 82'' is peeled off from the frame 4 by the peeling roller, if the adhesive tape is not cut sufficiently by the cutter blade of the adhesive tape cutting mechanism, the semiconductor wafer attached to the adhesive tape may be left as a residue. If the tape is wound up by the peeling roller together with the tape, the semiconductor wafer will be damaged and the series of pasting operations of this device will be hindered. Automatic pasting is important in the device.

By the way, as is clear from the explanation of the embodiments mentioned above,
In the present invention, the auxiliary peeling roller for smoothly peeling off the adhesive tape after cutting the adhesive tape corresponds to the auxiliary peeling roller 92□ in the embodiment. Also, by detecting changes in tape tension acting on the peeling auxiliary roller 92□, the peeling roller 92. The means for detecting whether or not the adhesive tape is normally peeled off corresponds to the limit switch LSWI in the embodiment, and determines whether there is a tape peeling error in the tape peeling section based on the detection signal of the tension detecting means (LSWI). The error determining means corresponds to the control unit 142 in the embodiment. The process of determining a tape peeling error by detecting a change in tape tension acting on the peeling auxiliary roller 92□ corresponds to step S85 in the operation flowchart described in FIG. 18.

The specific operations for detecting peeling errors are shown in Figures 10 to 1 below.
This will be explained based on FIG. 3 and FIG. 20.

In step 37B, when the residual tape 82' is to be peeled off from the frame 4 etc. after the adhesive tape 82 has been cut, the solenoid valve VLIO provided in connection with the peeling roller unit 92 is released, so that the residual tape 82' can be peeled off. 97 is opened (step 3841).

A limit switch LS detects whether or not the cock 97 is opened as a displacement of the air cylinder 99.
Judgment is made based on the detection signal of W3 (step 384□
).

The brake 102 is activated at the same time as the cock 97 is opened. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one, and begin the peeling operation. (
Step S843).

By the time the peeling operation is completed, it is determined whether or not the frame chuck table 50 has attracted the positioned frame 4 based on the detection signal of the pressure switch PUSW4 (step 3851).

When the frame/chuck table 50 is suctioning the frame 4, the pressure inside the vacuum chuck decreases, so the pressure switch PUSW4 is turned on. If this pressure switch PUSW4 is not in the ON state, it is determined that the positioned frame 4 is not attracted to the frame/chuck table 50 for some reason, and an error message is displayed (step S87+). .

Step S85. When it is confirmed that the frame/chuck table 50 is suctioning the frame 4, the process proceeds to step S85□ shown in FIG. 20, where the wafer/chuck table 48 suctions the positioned semiconductor wafer 2. It is determined based on the detection signal of the pressure switch PUSW6.

When the wafer chuck table 48 is sucking the semiconductor wafer 2, the pressure inside the vacuum chuck decreases.
Pressure switch PUSW6 is turned on. If this pressure switch PUSW6 is not in the ON state, it is determined that the positioned semiconductor wafer 2 is not attracted to the wafer chuck table 48 for some reason, and an error display (2) is performed (step 5872).

If it is confirmed in step S85□ that the wafer chuck table 4B is adsorbing the semiconductor wafer 2, the process proceeds to step 5853 shown in FIG. Based on the detection signal of the limit switch LSWI provided in relation to the peeling auxiliary roller 92□, it is determined whether the residual tape 82° has been peeled off from the frame 4 or the like (step SSS: +).

When the adhesive tape 82 is completely cut out in a circular shape by the adhesive tape cutting mechanism 108, the residual tape 82'
is smoothly wound around the peeling roller unit 92, and the peeling auxiliary roller 92□ is pressed against the peeling roller 921 by the coil spring 95, so the limit switch LSWI is turned on.

Furthermore, due to the blade of the cutter 112 of the adhesive tape cutting mechanism 108 falling off, etc., the adhesive tape 82 may not be cut into a complete circle, and, for example, as shown in FIG. When M occurs, the peeling resistance of the residual tape 82' increases and the tension of the residual tape 82' increases. When the tension of the residue tape 82' increases beyond the set value,
The leftward force acting on the peeling auxiliary roller 92□ increases,
As shown in FIG.
5, the limit switch LSW1 turns OFF.
From this, it is determined that the adhesive tape 82 has been peeled off incorrectly, and an error display (3) is performed (step S87).

If it is confirmed in step 5853 that the tape is peeled off normally, the process proceeds to step 5854, where it is determined whether or not the peeling roller unit 92 has moved to the peeling roller moving end, as shown in FIG. limit switch L
Judgment is made based on the detection signal of SW2 (step 385
4).

When the peeling roller unit 92 moves to the peeling roller moving end, the limit switch LSW2 is turned on.

If the limit switch LSW2 is not in the ON state, it is determined that the peeling roller unit 92 has not yet moved to the peeling roller moving end, and the process returns to step S85□ described in FIG. 20.

When it is confirmed in step 5854 that the peeling roller unit 92 has moved to the peeling roller moving end, the process proceeds to the next step S86, where the mount/frame chunk arm 114 is lowered.

Next, a brief explanation will be given of the recovery process performed when an error occurs in the automatic semiconductor wafer bonding apparatus according to the above-described embodiment.

When any of the above-mentioned errors occur, each mechanical section corresponding to the next process of the location where the error occurs continues its respective operations and stops after completing each operation cycle. On the other hand, the location where the error occurred and each mechanical section corresponding to the preceding process stop when the error occurs. Based on the above-mentioned error display, the operator takes appropriate measures such as removing the workpiece (for example, the semiconductor wafer 2 or the frame 4) where the error has occurred or setting the cassette correctly. Then, each mechanical section corresponding to the process preceding the error occurrence point is returned to its origin, and the apparatus is restarted. .

Note that the display mode for informing that the various errors mentioned above have occurred is not limited to the one explained in the embodiment.
Various modifications such as buzzer display can be implemented.

Further, as a tension detection mechanism for detecting an increase in tension of the residual liquid tape 82' in order to determine a peeling error, for example, the first
As shown in FIG. 4, a peeling auxiliary roller 92□ that is pressed against the peeling roller 92+ is attached to a movable arm 93I that can slide left and right in a straight line, and this movable arm 931 is attached to the peeling roller 92. with a coil spring 95□. side, and this movable arm 93. It is also possible to implement a structure in which the displacement resisting the coil spring 951 is detected by the limit switch LSW4.

Furthermore, by detecting the external force acting on the swing arm 93 or the movable arm 93 of the above-described embodiment using a piezoelectric element, it is also possible to detect an increase in the tension of the residual tape 82'' that exceeds the setting. It is also possible to directly detect the external force acting on the support shaft of the peeling auxiliary roller 92□ using a sensor such as a piezoelectric element.

Furthermore, the automatic attachment device for semiconductor wafers according to the present invention includes:
Of course, the present invention is not limited to the devices described in the embodiments.

<Effects of the Invention> As explained above, according to the present invention, if the adhesive tape is not peeled off from the frame due to abnormality such as poor cutting or the occurrence of irregularities, major troubles such as wafer entrapment can occur. This automatic semiconductor wafer attachment system allows operators to know when an abnormality has occurred in the equipment and where it has occurred, allowing them to quickly take appropriate measures to prevent wafer damage. In addition, automatic semiconductor wafer attachment can improve the operating efficiency of the equipment without having to stop the equipment for a long time to recover from a problem.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing the overall outline of an automatic attachment device for semiconductor wafers according to an embodiment of the present invention, and FIG. 2 is a configuration of the semiconductor wafer alignment section and the surrounding area of the reversing fork in the embodiment. 3 is an explanatory diagram of the orientation flat positioning in the embodiment, FIG. 4 is an explanatory diagram of the orientation flat end detecting section, and FIG. 5 is an explanatory diagram of the frame loader section and frame positioning section surroundings in the embodiment. FIG. 6 is a block diagram of the area around the frame conveyance unit in the embodiment, FIG. 7 is a block diagram of the adhesive tape supply system and the area around the adhesive tape cutting mechanism in the embodiment, and FIGS. 8 and 9 are The pasting in the above embodiment is an explanatory diagram of the structure and operation of the roller unit and the peeling roller unit, FIG. 10 is a configuration diagram of the peeling roller unit in the above embodiment, and FIG. FIG. 12 is an explanatory diagram showing the operation state of the peeling auxiliary roller in the above embodiment for detecting a peeling error. FIG. 13 is an explanatory diagram showing a state in which a poorly cut adhesive tape is peeled off. FIG. 15 is a block diagram showing another embodiment of the detection means; FIG. 15 is a block diagram of the mount frame dispensing table and its surroundings in the embodiment; FIG. 16 is an explanation of the semiconductor wafer, frame, and mount frame used in the embodiment. 17 is a block diagram showing an outline of the configuration of the control system in the embodiment, FIG. 18 is an operation flowchart of the embodiment, and FIG. 19 is an operation flowchart of orientation flat alignment in the embodiment. 20
The figure is a concrete operational flowchart 1 for detecting a tape peeling error of the peeling auxiliary roller in the embodiment. 2... Semiconductor wafer 4... Frame 6... Mount frame 14... Semiconductor wafer alignment section 18... Wafer cassette 20... Alignment table 24... Pulse motor 32...・Orientation flat end detection section 40
... Reversing fork 42 ... Pasting is done on table 48 ... Wafer chuck table 50 ... Frame chuck table 54 ... Frame loader section 62 ... Frame positioning section 72 ... Frame chuck Arm 82... Adhesive tape 82°... Residue tape 90... Pasting roller unit 92... Peeling Mtl-ra unit 93... Peeling roller 94... Peeling auxiliary roller 95... Coil spring 96. ...Torque motor for peeling 108...Adhesive tape cutting mechanism 114...Mount frame chuck arm 116
...Swing reversing unit 118...Clamp mechanism 126...Mount frame dispensing table 12
7... Conveyance belt 130... Conveyance table 131... Conveyance table horizontal movement motor 132...
Frame cassette 13'8...Operation panel 140...Patrol light 142...Control section 144...CPU PH3WI to PH3WI 1. , PH3WI 1□...
・Photoelectric element PUSWI~PUSW6...Pressure switch LSWI~
L'S W 4...Limit switch Fig. 15 Fig. 16r! J (HQ diagram of the semiconductor wafer, frame, and mount frame in the example) (a) Figure 18 (Operation flowchart of the example) Figure 18 (Part 4 E F Mount Frame 5122510
6 Musisinkpa 5107 Mount NO Frame Clamp 5126) 6? ES mount frame 5128S
1 Invert the image

Claims (1)

[Claims] (1) A frame chuck table that positions and holds a ring-shaped frame, a wafer chuck table that positions and holds a semiconductor wafer at the center of the frame, and a continuous adhesive tape that is pasted over the positioned and held ring and wafer. An automatic semiconductor wafer pasting device comprising: a pasting roller unit; an adhesive tape cutting mechanism that cuts out the pasted adhesive tape in a circular shape along a frame; and a peeling roller unit that peels off residual tape from the frame after cutting. The peeling roller unit is provided with a peeling auxiliary roller that can be displaced in response to the tension of the residual tape, and a tension detection mechanism that detects when a tension exceeding a setting is applied to the peeling auxiliary roller, and the tension detection mechanism detects An automatic semiconductor wafer pasting device that is equipped with a means for determining peeling errors based on the results.