CN112490107A - Plasma etching machine and etching method thereof - Google Patents
Plasma etching machine and etching method thereof Download PDFInfo
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- CN112490107A CN112490107A CN202110051091.1A CN202110051091A CN112490107A CN 112490107 A CN112490107 A CN 112490107A CN 202110051091 A CN202110051091 A CN 202110051091A CN 112490107 A CN112490107 A CN 112490107A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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Abstract
The invention discloses a plasma etcher and an etching method thereof in the technical field of plasma etchers, wherein the plasma etcher comprises a machine shell, wherein the top of the machine shell is fixedly connected with an ionization box; according to the invention, the intermittent gear is meshed with the T-shaped toothed plate, so that the wafer rack is driven by the overturning shaft to overturn by 180 degrees, at the moment, the surface changing operation of the wafer is realized, the double-sided etching of the wafer is further realized, the wafer is taken out without opening the device in the whole process, the problem that when the wafer is taken out by the opening device, external fine impurities enter the equipment to influence the internal vacuum environment is avoided, the process operation is simple and rapid, the problem that manual operation damages the etched wafer surface is avoided, meanwhile, when the electric push rod moves upwards, the limitation on the wafer rack is automatically released, and when the electric push rod moves downwards, the limiting plate slowly limits the wafer rack.
Description
Technical Field
The invention relates to the technical field of plasma etchers, in particular to a plasma etcher and an etching method thereof.
Background
In the semiconductor integrated circuit manufacturing process, etching is one of the most important processes, and plasma etching is one of the commonly used etching methods. Generally, etching occurs in a vacuum reaction chamber, a wafer is placed on a susceptor in the vacuum reaction chamber, radio frequency is applied to an electrode on the top of the susceptor, and plasma is formed in the vacuum reaction chamber by introducing reaction gas to process the wafer.
In the case of the invention of a plasma etching machine and an etching method thereof disclosed in the prior art, a Chinese patent with the patent application number of 201910800375.9 is invented, and the plasma processing system comprises a reaction chamber, a Faraday shielding device and an air inlet nozzle, wherein the Faraday shielding device and the air inlet nozzle are positioned on the reaction chamber; the gas inlet nozzle penetrates through the Faraday shielding device and introduces process gas into the reaction chamber; the air inlet nozzle is made of conductive materials and is in conductive connection with the Faraday shielding device.
In the prior art, when wafers are etched, only one side of the wafers can be etched, when the wafers are etched on two sides, the wafers etched on one side need to be manually taken out and turned to the other side and then put into etching equipment, the process is complex in operation, the etched wafer surfaces are easy to damage, and when a device is opened to take out the wafers, external fine impurities enter the equipment to influence the internal vacuum environment.
Based on the above, the invention designs a plasma etcher and an etching method thereof, so as to solve the problems.
Disclosure of Invention
The invention aims to provide a plasma etching machine and an etching method thereof, and aims to solve the problems that in the prior art provided by the background technology, when a wafer is etched, only one side can be etched, when the wafer needs to be etched on two sides, the wafer with one etched side needs to be manually taken out, turned to the other side and then put into etching equipment, the operation of the process is complicated, the etched wafer surface is easily damaged, and when a device is opened to take out the wafer, external fine impurities enter the inside of the equipment to influence the vacuum environment inside the equipment.
In order to achieve the purpose, the invention provides the following technical scheme: a plasma etching machine comprises a machine shell, wherein an ionization box is fixedly connected to the top of the machine shell, a first air inlet pipe is fixedly communicated with the side surface of the ionization box, a second air inlet pipe is fixedly communicated with the top of the machine shell, which is positioned in the ionization box, a feeding door is hinged to the side surface of the machine shell, a fixed table is fixedly connected to the inner wall of the machine shell, a wafer rack is arranged at the top of the fixed table, wafers are fixedly connected to the inner wall of the wafer rack, turnover mechanisms for driving the wafer rack to turn over are connected to the inner walls of two sides of the machine shell, and limiting mechanisms for limiting the wafer rack are connected to two sides;
the turnover mechanism comprises two electric push rods, the electric push rods are fixedly connected to the inner wall of the shell, the inner walls of two sides of the shell are both penetrated through and are connected with pull plates in a sliding mode, the end part of each pull plate is connected with a reset mechanism, the other end of each pull plate is provided with a circular groove, the inner wall of each circular groove is connected with a disc in a sliding mode, the side surface of each disc is fixedly connected with a turnover shaft, the surface of each turnover shaft is fixedly connected with a discontinuous gear, the side surface of each discontinuous gear is fixedly connected with a first plate, the surface of each turnover shaft is rotatably connected with a first supporting plate, the side surface of each first supporting plate is fixedly connected with a second plate, the two sides of each first supporting plate are respectively and fixedly connected with a first L-shaped plate and a third plate, the surface of each turnover shaft is respectively and fixedly connected with a deflection, the surface of the circular sleeve is fixedly connected with an L-shaped rod, the inner walls of two sides of the shell are respectively provided with a first notch, the end part of the L-shaped rod is connected onto the inner wall of the first notch in a sliding manner, the inner wall of the circular sleeve is matched with the telescopic end of the electric push rod, the two sides of the wafer frame are respectively provided with a clamping groove, the end part of the turnover shaft is inserted onto the inner wall of the clamping groove, the two sides of the inner wall of the shell are respectively and fixedly connected with two L-shaped supporting plates, the tops of the two L-shaped supporting plates are jointly and fixedly connected with a supporting frame, the side surface of the supporting frame is provided with a through elongated slot, the turnover shaft is connected onto the inner wall of the elongated slot in a sliding manner, the side surface of the supporting frame is provided with two T-shaped slots, the inner wall of the T-shaped slot is connected with a rectangular shell, the side surface of the L-shaped pressing plate is fixedly connected with an L-shaped top plate, the end part of the L-shaped top plate is an inclined surface, the side surface of the L-shaped supporting plate is fixedly connected with a T-shaped toothed plate, and the T-shaped toothed plate is matched with the intermittent gear;
the limiting mechanism comprises a transverse pressing plate which is fixedly connected with the side surface of the telescopic end of the electric push rod, both sides of the fixed table are fixedly connected with L-shaped extension plates, two first sliding chutes are arranged at the tops of the L-shaped extension plates, the inner wall of the first sliding chute is connected with an extrusion block in a sliding way, the side surface of the extrusion block and the L-shaped extension plate are fixedly connected with a second spring together, the side surface of the extrusion block is fixedly connected with a special-shaped rod, the end part of the special-shaped rod is fixedly connected with a limit plate, both sides of the wafer rack are provided with limiting grooves, the limiting plates are connected on the inner walls of the limiting grooves in a sliding manner, the top of the L-shaped extension plate is rotationally connected with two rollers, the side surface of the extrusion block is fixedly connected with a first rope, the first rope bypasses the surface of the roller and penetrates through the L-shaped extension plate, the end part of the first rope is fixedly connected with a connecting plate, and the top of the connecting plate is contacted with the bottom of the transverse pressing plate;
when the device works, only one side can be etched when a wafer is etched in the prior art, when the wafer needs to be etched on two sides, the wafer etched on one side needs to be manually taken out, the wafer is turned to the other side and then put into etching equipment, the operation of the process is complex, and when the etched wafer surface is easily damaged and the device is opened to take out the wafer, external fine sundries enter the equipment to influence the vacuum environment inside the equipment, the technical scheme is characterized in that a turning mechanism, a limiting mechanism and the like are arranged, firstly, etching gas is introduced into an ionization box through a first gas inlet pipe, the etching gas enters the inside of a shell through a second gas inlet pipe after plasma is formed in the ionization box, the surface of the wafer is etched, after the etching on one side of the wafer is finished, the introduction of the gas is stopped, and at the moment, an electric push rod is started to move upwards, the telescopic end of the electric push rod enters the inner wall of the circular sleeve and drives the circular sleeve and the L-shaped rod to move upwards, the circular sleeve drives the first supporting plate to move upwards through the third plate, the first supporting plate drives the wafer frame to move upwards through the turnover shaft, the turnover shaft drives the L-shaped pressing plate to move upwards through the first supporting plate, the L-shaped pressing plate drives the L-shaped top plate to move upwards, when the L-shaped top plate moves to be contacted with the end part of the L-shaped supporting plate, the inclined plane at the end part of the L-shaped top plate is extruded and moves towards the rear side, meanwhile, the L-shaped pressing plate is driven to move towards the rear side, so that the L-shaped pressing plate does not limit the first supporting plate any more, because the side surface of the turnover shaft is fixedly connected with a deflection plate, the gravity center of the turnover shaft and the connected structure of the turnover shaft are positioned at one side of the deflection plate and tend to rotate towards the, the intermittent gear is meshed with the T-shaped rack and drives the intermittent gear to rotate, the intermittent gear drives the turnover shaft to rotate 180 degrees, the turnover shaft synchronously drives the wafer rack to turn 180 degrees, the surface changing operation of the wafer is realized at the moment, the intermittent gear drives the deflection plate to turn to one side through the turnover shaft, the first plate on the side surface of the intermittent gear rotates 180 degrees and then is contacted with the bottom of the second plate, the gravity center is still on one side of the deflection plate at the moment, the turnover shaft has a rotating trend, the second plate blocks the rotating trend through the first plate, the electric push rod moves downwards, the toothless part of the intermittent gear is contacted with the T-shaped rack at the moment, the intermittent gear does not rotate any more, when the intermittent gear moves to the end part of the L-shaped support plate and does not extrude the L-shaped top plate any more, the L-shaped pressure plate limits the first support plate again under the action of the first spring, when the wafer rack moves to the, the electric push rod stops moving, the surface changing operation of the wafer is realized at the moment, the double-sided etching of the wafer is further realized, the wafer is not required to be taken out by an opening device in the whole process, the problem that when the wafer is taken out by the opening device, external fine sundries enter the equipment to influence the internal vacuum environment is avoided, the process operation is simple and rapid, and the problem that manual operation damages the etched wafer surface is avoided, when the electric push rod moves upwards, the transverse press plate is synchronously driven to move upwards, the transverse press plate does not extrude the connecting plate any more, under the action of the second spring, the extrusion block drives the limiting plate to move backwards through the special-shaped rod, so that the limiting plate is separated from the limiting groove and does not limit the wafer frame any more, when the electric push rod moves downwards to reset, the limiting plate is enabled to enter the limiting groove again to limit the wafer frame, realized relieving its earlier spacing when wafer frame upward movement through above-mentioned process, guarantee its motion, when reseing, the limiting plate will slow carry on spacingly to wafer frame, realize that the wafer is stable on the fixed station, safe spacing, it can not receive the damage because of the extrusion to have guaranteed that the wafer on the wafer frame inner wall, when the wafer is taken out to needs, it makes no longer to add to hold wafer frame to the rear side removal through canceling release mechanical system pulling trip shaft, electric putter upward movement certain distance makes the limiting plate no longer spacing to wafer frame, alright take out wafer frame this moment.
As a further scheme of the invention, a damping spring is fixedly connected to the side surface of the limiting plate, a damping pad is fixedly connected to the other end of the damping spring, and the damping pad is connected to the inner wall of the limiting groove in a sliding manner; during operation, when guaranteeing limiting plate contact wafer frame, avoid rigid contact, through setting up damping spring and shock pad for get into the spacing groove, make the contact become soft contact through damping spring, and guarantee that the wafer on the wafer frame inner wall can not receive the damage because of the extrusion.
As a further scheme of the invention, the inner walls of two sides of the casing are fixedly connected with a second support plate, the top of the second support plate is provided with a through second chute, the inner wall of the second chute is connected with a wedge block in a sliding manner, the top of the second support plate is fixedly connected with a frame, the inner wall of the frame is fixedly connected with an air bag, two sides of the frame are provided with third chutes, the inner wall of each third chute is connected with a squeezing plate in a sliding manner, the wedge block and the squeezing plate are fixedly connected, the squeezing plate and the frame are fixedly connected with a third spring together, the side surface of the squeezing plate is contacted with the air bag, the top of the air bag is fixedly communicated with a third air inlet pipe penetrating through the frame, the surface of the third air inlet pipe is fixedly connected with a one-way valve, the side surface of the air bag is fixedly communicated with an air outlet pipe penetrating through the frame, the end part of the air outlet pipe is fixedly communicated with a transverse pipe, the surface of the transverse pipe is provided with an air outlet hole, and the side surface of the circular sleeve is fixedly connected with a special-shaped ejector rod; the during operation, when putting into the fixed station with the wafer frame on, can bring partial tiny debris into the fixed station on, through setting up the gasbag, dysmorphism ejector pin and wedge isotructure, will extrude the wedge through dysmorphism ejector pin tip when circular cover upward movement, the wedge will remove to the rear side and extrude the gasbag through the stripper plate, the gasbag blows gas to the fixed station with inside inert gas through going out the venthole on pipe and the horizontal pipe, the realization blows away the fixed station to tiny debris on the fixed station surface, guarantee the cleanness on its surface, avoid it to pollute the wafer surface.
As a further scheme of the invention, both sides of the fixed station are fixedly connected with third support plates, the tops of the third support plates are fixedly connected with two limiting shafts, and the limiting shafts penetrate through the connecting plate; during operation, when the connecting plate upward movement, the connecting plate can probably produce and rock, through setting up third extension board and spacing axle, realizes spacing to the connecting plate, makes it can only move along spacing axial direction.
As a further scheme of the invention, the bottom of the rectangular shell is fixedly connected with a second rope, the second rope penetrates through the L-shaped extension plate, and the end part of the second rope is fixedly connected with a heavy object block; during operation, because the rectangular shell is the side of sliding connection at the support frame, and L type clamp plate receives the upset power that first backup pad gave, and the upset power has vertical ascending component, can upwards slide in order to prevent the rectangular shell, through setting up heavy object piece and second rope, utilizes heavy object piece and second rope to exert certain pulling force to the rectangular shell for it can not produce the slip because of the vertical ascending component of upset power.
As a further scheme of the invention, the reset mechanism comprises two second L-shaped plates, the second L-shaped plates are fixedly connected to the side surface of the housing, the end of the pull plate is fixedly connected with a reset shaft penetrating through the second L-shaped plates, the second L-shaped plates and the pull plate are jointly and fixedly connected with a reset spring sleeved on the surface of the reset shaft, the end of the reset shaft is fixedly connected with a rectangular block, the top of the rectangular block is provided with a threaded hole penetrating through, the side surface of the second L-shaped plate is fixedly connected with a fourth support plate, and the top of the fourth support plate is in threaded connection with a bolt; during operation, the reset mechanism is arranged, so that the turnover shaft does not clamp the wafer rack, and the wafer rack can be conveniently taken out of the equipment.
An etching method of a plasma etcher comprises the following steps:
the method comprises the following steps: and introducing etching gas into the ionization box, wherein the etching gas is introduced into the shell after plasma is formed in the ionization box, and etching the surface of the wafer.
Step two: after the etching of one side of the wafer is finished, the introduction of gas is stopped, the electric push rod is started to move at the moment, the wafer frame is turned to the other side through the turning mechanism, the etching of the other side of the wafer is realized, meanwhile, when the electric push rod moves upwards, the wafer frame is automatically released to be limited, and when the electric push rod moves downwards, the limiting plate slowly limits the wafer frame.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention adopts the structure of the turnover mechanism, the limit mechanism and the like, and utilizes the meshing of the discontinuous gear and the T-shaped gear plate to drive the wafer rack to turn over by 180 degrees through the turnover shaft, thereby realizing the surface changing operation of the wafer, thereby realizing the double-sided etching of the wafer, and the whole process does not need to open the device to take out the wafer, avoiding the problem that when the device is opened to take out the wafer, the external fine impurities enter the equipment to influence the internal vacuum environment, the process operation is simple and rapid, and avoids the problem that the etched wafer surface is damaged by manual operation, and simultaneously, when the electric push rod moves upwards, the wafer frame is automatically released from being limited, when electric putter downstream, the limiting plate will slow carry on spacingly to the wafer frame, realizes that the wafer is stable, safe spacing on the fixed station, has guaranteed that the wafer on the wafer frame inner wall can not receive the damage because of the extrusion.
2. According to the invention, by arranging the structure of the air bag, the special-shaped ejector rod, the wedge block and the like, when the circular sleeve moves upwards, the wedge block is extruded through the end part of the special-shaped ejector rod, the wedge block moves towards the rear side and extrudes the air bag through the extrusion plate, the air bag blows inert gas inside to the fixed table through the air outlet holes in the air outlet pipe and the transverse pipe, so that fine sundries on the surface of the fixed table are blown away from the fixed table, the cleanness of the surface of the fixed table is ensured, and the surface of a wafer is prevented from being polluted by the air bag.
3. According to the invention, the weight block and the second rope are arranged, and a certain pulling force is applied to the rectangular shell by the weight block and the second rope, so that the rectangular shell cannot slide due to the vertically upward component force of the overturning force.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of an etching method of the present invention;
FIG. 2 is a first perspective view of the overall structure of the plasma etcher, partially cut away;
FIG. 3 is a second perspective view of the overall structure of the plasma etcher, partially cut away;
FIG. 4 is a cross-sectional perspective view of the overall structure of the plasma etcher;
FIG. 5 is a perspective view of the plasma etcher after the structure of the shell and the turnover mechanism on one side of the shell is removed;
FIG. 6 is an enlarged view of a portion of FIG. 5 at A;
FIG. 7 is a first perspective view of the plasma etcher after the housing, the turning mechanism and the reset mechanism on one side of the housing are removed;
FIG. 8 is a second perspective view of the plasma etcher after the housing and the structures such as the turning mechanism and the reset mechanism on one side of the housing are removed;
FIG. 9 is an enlarged view of a portion of FIG. 8 at B;
FIG. 10 is an enlarged view of a portion of FIG. 8 at C;
fig. 11 is a perspective view of a wafer carrier.
In the drawings, the components represented by the respective reference numerals are listed below:
the device comprises a machine shell 1, an ionization box 2, a first air inlet pipe 3, a second air inlet pipe 4, a feeding door 5, a fixed table 6, a wafer frame 7, an electric push rod 8, a pulling plate 9, a disc 10, a turnover shaft 11, an intermittent gear 12, a first plate 13, a first supporting plate 14, a second plate 15, a first L-shaped plate 16, a third plate 17, a deflection plate 18, a first supporting plate 19, a circular sleeve 20, an L-shaped rod 21, a clamping groove 22, an L-shaped supporting plate 23, a supporting frame 24, a rectangular shell 25, an L-shaped pressing plate 26, a first spring 27, an L-shaped toothed plate 28, a T-shaped 29, a transverse pressing plate 30, an L-shaped extension plate 31, an extrusion block 32, a second spring 33, a special-shaped rod 34, a limiting plate 35, a roller 36, a first rope 37, a connecting plate 38, a damping spring 39, a damping pad 40, a second supporting plate 41, a wedge-shaped block 42, a frame 43, an air bag 44, an extrusion plate 45, a, The device comprises a check valve 48, an air outlet pipe 49, a transverse pipe 50, an air outlet hole 51, a special-shaped ejector rod 52, a third support plate 53, a limiting shaft 54, a second rope 55, a heavy block 56, a second L-shaped plate 57, a reset shaft 58, a reset spring 59, a threaded hole 60 and a bolt 61.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-11, the present invention provides a technical solution: a plasma etching machine comprises a machine shell 1, wherein an ionization box 2 is fixedly connected to the top of the machine shell 1, a first air inlet pipe 3 is fixedly communicated with the side surface of the ionization box 2, a second air inlet pipe 4 is fixedly communicated with the top of the machine shell 1 and positioned inside the ionization box 2, a feeding door 5 is hinged to the side surface of the machine shell 1, a fixed table 6 is fixedly connected to the inner wall of the machine shell 1, a wafer frame 7 is arranged at the top of the fixed table 6, a wafer is fixedly connected to the inner wall of the wafer frame 7, turnover mechanisms for driving the wafer frame 7 to turn over are connected to the inner walls of two sides of the machine shell 1, and limiting mechanisms for limiting;
the turnover mechanism comprises two electric push rods 8, the electric push rods 8 are fixedly connected on the inner wall of the machine shell 1, the inner walls of two sides of the machine shell 1 are both penetrated through and are connected with a pulling plate 9 in a sliding way, the end part of the pulling plate 9 is connected with a reset mechanism, the other end of the pulling plate 9 is provided with a circular groove, the inner wall of the circular groove is connected with a disc 10 in a sliding way, the side surface of the disc 10 is fixedly connected with a turnover shaft 11, the surface of the turnover shaft 11 is fixedly connected with a discontinuous gear 12, the side surface of the discontinuous gear 12 is fixedly connected with a first plate 13, the surface of the turnover shaft 11 is rotatably connected with a first supporting plate 14, the side surface of the first supporting plate 14 is fixedly connected with a second plate 15, two sides of the first supporting plate 14 are respectively and fixedly connected with a first L-shaped plate 16 and a third plate 17, the surface of the, the surface of the circular sleeve 20 is fixedly connected with an L-shaped rod 21, the inner walls of two sides of the machine shell 1 are respectively provided with a first notch, the end part of the L-shaped rod 21 is connected on the inner wall of the first notch in a sliding way, the inner wall of the circular sleeve 20 is matched with the telescopic end of the electric push rod 8, two sides of the wafer frame 7 are respectively provided with a clamping groove 22, the end part of the turnover shaft 11 is inserted on the inner wall of the clamping groove 22, two sides of the inner wall of the machine shell 1 are respectively and fixedly connected with two L-shaped supporting plates 23, the top parts of the two opposite L-shaped supporting plates 23 are respectively and fixedly connected with a supporting frame 24, the side surface of the supporting frame 24 is provided with a through long groove, the turnover shaft 11 is connected on the inner wall of the long groove in a sliding way, the side surface of the supporting frame 24 is provided with two T-shaped grooves, the inner wall of the T-, the side surface of the L-shaped pressing plate 26 is fixedly connected with an L-shaped top plate 28, the end part of the L-shaped top plate 28 is an inclined surface, the side surface of the L-shaped supporting plate 23 is fixedly connected with a T-shaped toothed plate 29, and the T-shaped toothed plate 29 is matched with the intermittent gear 12;
the limiting mechanism comprises a transverse pressing plate 30, the transverse pressing plate 30 is fixedly connected to the side face of the telescopic end of the electric push rod 8, two sides of the fixing table 6 are fixedly connected with L-shaped extending plates 31, two first sliding grooves are formed in the tops of the L-shaped extending plates 31, the inner walls of the first sliding grooves are connected with extrusion blocks 32 in a sliding mode, the sides of the extrusion blocks 32 and the L-shaped extending plates 31 are fixedly connected with second springs 33 together, the sides of the extrusion blocks 32 are fixedly connected with special-shaped rods 34, limiting plates 35 are fixedly connected to the end portions of the special-shaped rods 34, limiting grooves are formed in two sides of the wafer frame 7, the limiting plates 35 are connected to the inner walls of the limiting grooves in a sliding mode, two idler wheels 36 are rotatably connected to the tops of the L-shaped extending plates 31, first ropes 37 are fixedly connected to the sides of the extrusion blocks 32, the first ropes 37 bypass the surfaces of the idler;
when the device works, only one side of the wafer can be etched when the wafer is etched in the prior art, when the wafer needs to be etched on two sides, the wafer with one side etched needs to be manually taken out, the wafer is turned to the other side and then put into etching equipment, the operation of the process is complex, the etched wafer surface is easy to damage, and when the device is opened to take out the wafer, external fine impurities enter the equipment to influence the vacuum environment inside the equipment, the technical scheme is that through the structures of a turning mechanism, a limiting mechanism and the like, firstly, etched gas is introduced into an ionization box 2 through a first gas inlet pipe 3, the etched gas forms plasma in the ionization box 2 and then enters the inside of a shell 1 through a second gas inlet pipe 4, the surface of the wafer starts to be etched, after one side of the wafer is etched, the introduction of the gas is stopped, and at the moment, an electric push rod 8 is started to move upwards, the telescopic end of the electric push rod 8 enters the inner wall of the circular sleeve 20 and drives the circular sleeve 20 and the L-shaped rod 21 to move upwards, the circular sleeve 20 drives the first supporting plate 14 to move upwards through the third plate 17, the first supporting plate 14 drives the wafer rack 7 to move upwards through the turnover shaft 11, the turnover shaft 11 drives the L-shaped pressing plate 26 to move upwards through the first supporting plate 19, the L-shaped pressing plate 26 drives the L-shaped top plate 28 to move upwards, when the L-shaped top plate 28 moves to be in contact with the end part of the L-shaped supporting plate 23, the inclined plane at the end part of the L-shaped top plate 28 is extruded and moves towards the rear side, and simultaneously drives the L-shaped pressing plate 26 to move towards the rear side, so that the L-shaped pressing plate 26 does not limit the first supporting plate 19 any more, because the side surface of the turnover shaft 11 is fixedly connected with the deflection plate 18, the gravity center of the turnover shaft 11 and the connected structure thereof is on one side of, because the first L-shaped plate 16 is arranged, the turnover shaft 11 cannot rotate and continues to move upwards, the intermittent gear 12 is meshed with the T-shaped toothed plate 29 and drives the intermittent gear 12 to rotate, the intermittent gear 12 drives the turnover shaft 11 to rotate 180 degrees, the turnover shaft 11 synchronously drives the wafer rack 7 to turn 180 degrees, at the moment, the surface changing operation of the wafer is realized, the intermittent gear 12 drives the deflection plate 18 to turn to one side through the turnover shaft 11, the first plate 13 on the side surface of the intermittent gear 12 rotates 180 degrees and then contacts with the bottom of the second plate 15, the gravity center is still on one side of the deflection plate 18 at the moment, so that the turnover shaft 11 has a rotating trend, the second plate 15 blocks the rotating trend through the first plate 13, the electric push rod 8 moves downwards, at the moment, the toothless part of the intermittent gear 12 contacts with the T-shaped toothed plate 29, the intermittent gear 12 does not rotate any more, when the end of the L-shaped support plate 23 moves to not extrude the L-shaped top, under the action of the first spring 27, the L-shaped pressing plate 26 will limit the first supporting plate 19 again, when the wafer rack 7 moves to the fixing table 6, the electric pushing rod 8 stops moving, at this time, the surface changing operation of the wafer is realized, and then the double-sided etching of the wafer is realized, and the whole process does not need to open the device to take out the wafer, thereby avoiding the problem that when the opening device takes out the wafer, external fine impurities enter the device to affect the internal vacuum environment, the process operation is simple and quick, and avoiding the problem that manual operation damages the etched wafer surface, when the electric pushing rod 8 moves upwards, the transverse pressing plate 30 will be synchronously driven to move upwards, the transverse pressing plate 30 will not extrude the connecting plate 38 any more, under the action of the second spring 33, the extruding block 32 will drive the limiting plate 35 to move backwards through the special-shaped rod, so that the limiting plate 35 breaks away from the limiting groove, no longer spacing wafer frame 7, when electric putter 8 downstream resets, will make limiting plate 35 get into the spacing groove again and carry on spacingly to wafer frame 7, realized removing its spacing earlier when wafer frame 7 upward movement through above-mentioned process, guarantee its motion, when resetting, limiting plate 35 will slow carry on spacingly to wafer frame 7, realize that the wafer is stable on fixed station 6, safe spacing, it can not receive the damage because of the extrusion to have guaranteed the wafer on the wafer frame 7 inner wall, when needing to take out the wafer, it makes no longer to add to wafer frame 7 to move to the rear side through canceling release mechanical system pulling trip shaft 11, electric putter 8 upward movement certain distance makes limiting plate 35 no longer spacing wafer frame 7, alright take out wafer frame 7 this moment.
As a further scheme of the invention, the side surface of the limit plate 35 is fixedly connected with a damping spring 39, the other end of the damping spring 39 is fixedly connected with a damping pad 40, and the damping pad 40 is connected to the inner wall of the limit groove in a sliding manner; during operation, in order to guarantee that limiting plate 35 contacts wafer frame 7, avoid the rigid contact, through setting up damping spring 39 and shock pad 40 for getting into the spacing groove, make the contact become soft contact through damping spring 39, and guarantee that the wafer on the wafer frame 7 inner wall can not receive the damage because of the extrusion.
As a further scheme of the invention, the inner walls of two sides of the machine shell 1 are fixedly connected with a second support plate 41, the top of the second support plate 41 is provided with a through second chute, the inner wall of the second chute is connected with a wedge block 42 in a sliding way, the top of the second support plate 41 is fixedly connected with a frame 43, the inner wall of the frame 43 is fixedly connected with an air bag 44, two sides of the frame 43 are provided with third chutes, the inner wall of the third chute is connected with a squeezing plate 45 in a sliding way, the wedge block 42 is fixedly connected with the squeezing plate 45, the squeezing plate 45 and the frame 43 are fixedly connected with a third spring 46 together, the side surface of the squeezing plate 45 is contacted with the air bag 44, the top of the air bag 44 is fixedly communicated with a third air inlet pipe 47 which penetrates through the frame 43, the surface of the third air inlet pipe 47 is fixedly connected with a one-way valve 48, the side surface of the air bag, the end part of the air outlet pipe 49 is fixedly communicated with a transverse pipe 50, the surface of the transverse pipe 50 is provided with an air outlet hole 51, and the side surface of the circular sleeve 20 is fixedly connected with a special-shaped ejector rod 52; during operation, when the wafer rack 7 is placed on the fixed table 6, part of fine impurities can be brought into the fixed table 6, the wedge block 42 is extruded through the end part of the special-shaped ejector rod 52 when the circular sleeve 20 moves upwards by arranging the air bag 44, the special-shaped ejector rod 52, the wedge block 42 and the extrusion plate 45, the air bag 44 is extruded by the inner inert gas of the air bag 44 through the outlet holes 51 on the outlet pipe and the transverse pipe 50, the fine impurities on the surface of the fixed table 6 are blown away from the fixed table 6, the surface cleanness of the fixed table is ensured, and the wafer surface is prevented from being polluted by the fine impurities.
As a further scheme of the invention, both sides of the fixed table 6 are fixedly connected with third support plates 53, the tops of the third support plates 53 are fixedly connected with two limiting shafts 54, and the limiting shafts 54 penetrate through the connecting plate 38; in operation, when the connecting plate 38 moves upwards, the connecting plate 38 may shake, and the third support plate 53 and the limiting shaft 54 are arranged to limit the connecting plate 38, so that the connecting plate can only move upwards along the limiting shaft 54.
As a further aspect of the present invention, a second rope 55 is fixedly connected to the bottom of the rectangular shell 25, the second rope 55 penetrates through the L-shaped extension plate 31, and a weight block 56 is fixedly connected to the end of the second rope 55; in operation, since the rectangular shell 25 is slidably connected to the side of the supporting frame 24, and the L-shaped pressing plate 26 receives the turning force given by the first supporting plate 19, and the turning force has a vertically upward component, in order to prevent the rectangular shell 25 from sliding upward, by providing the weight block 56 and the second rope 55, the weight block 56 and the second rope 55 are used to apply a certain pulling force to the rectangular shell 25, so that the rectangular shell 25 does not slide due to the vertically upward component of the turning force.
As a further scheme of the present invention, the reset mechanism includes two second L-shaped plates 57, the second L-shaped plates 57 are fixedly connected to the side of the casing 1, the end of the pull plate 9 is fixedly connected with a reset shaft 58 penetrating through the second L-shaped plates 57, the second L-shaped plates 57 and the pull plate 9 are jointly and fixedly connected with a reset spring 59 sleeved on the surface of the reset shaft 58, the end of the reset shaft 58 is fixedly connected with a rectangular block, the top of the rectangular block starts to have a penetrating threaded hole 60, the side of the second L-shaped plates 57 is fixedly connected with a fourth support plate, and the top of the fourth support plate is in threaded connection with a bolt 61; during operation, the reset mechanism is arranged, so that the overturning shaft 11 does not clamp the wafer rack 7, and the wafer rack 7 can be conveniently taken out of the equipment.
An etching method of a plasma etcher comprises the following steps:
the method comprises the following steps: and introducing etching gas into the ionization box 2, wherein the etching gas is introduced into the shell 1 after plasma is formed in the ionization box 2, and etching the surface of the wafer.
Step two: after the one side etching of wafer is accomplished, stop gaseous letting in, start electric putter 8 motion this moment, make the another side of wafer frame 7 upset through tilting mechanism, realize the etching to the other one side of wafer, simultaneously when electric putter 8 upwards moves, will remove automatically and carry out spacingly to wafer frame 7, when electric putter 8 downstream, limiting plate 35 will slow carry on spacingly to wafer frame 7.
The working principle is as follows: after one side of the wafer is etched, stopping introducing gas, starting the electric push rod 8 to move upwards, enabling the telescopic end of the electric push rod 8 to enter the inner wall of the circular sleeve 20 and drive the circular sleeve 20 and the L-shaped rod 21 to move upwards, enabling the circular sleeve 20 to drive the first supporting plate 14 to move upwards through the third plate 17, enabling the first supporting plate 14 to drive the wafer rack 7 to move upwards through the turnover shaft 11, enabling the turnover shaft 11 to drive the L-shaped pressing plate 26 to move upwards through the first supporting plate 19, enabling the L-shaped pressing plate 26 to drive the L-shaped top plate 28 to move upwards, enabling the inclined plane at the end of the L-shaped top plate 28 to be extruded and move towards the rear side when the L-shaped top plate 28 moves to be in contact with the end of the L-shaped supporting plate 23, simultaneously driving the L-shaped pressing plate 26 to move towards the rear side, enabling the L-shaped pressing plate 26 not to limit the first supporting plate 19 any more, and fixedly, the overturning shaft 11 and the gravity center of the structure connected with the overturning shaft are positioned on one side of the deflection plate 18 and tend to rotate on the side, because the first L-shaped plate 16 enables the overturning shaft 11 not to rotate and continue to move upwards, the intermittent gear 12 is meshed with the T-shaped toothed plate 29 and drives the intermittent gear 12 to rotate, the intermittent gear 12 drives the overturning shaft 11 to rotate 180 degrees, the overturning shaft 11 synchronously drives the wafer rack 7 to overturn 180 degrees, at the moment, the surface changing operation of the wafer is realized, the intermittent gear 12 drives the deflection plate 18 to rotate to one side through the overturning shaft 11, the first plate 13 on the side surface of the intermittent gear 12 rotates 180 degrees and then contacts with the bottom of the second plate 15, at the moment, the gravity center is still positioned on one side of the deflection plate 18, further, the overturning shaft 11 tends to rotate, the second plate 15 blocks the tendency of rotation through the first plate 13, the electric push rod 8 moves downwards, at the moment, the toothless part of the intermittent gear 12 contacts with the T, the intermittent gear 12 does not rotate any more, when the intermittent gear moves to the end part of the L-shaped supporting plate 23 and does not extrude the L-shaped top plate 28 any more, under the action of the first spring 27, the L-shaped pressing plate 26 limits the first supporting plate 19 again, when the wafer frame 7 moves to the fixed table 6, the electric push rod 8 stops moving, the surface changing operation of the wafer is realized at the moment, the double-sided etching of the wafer is realized, the wafer is taken out without an opening device in the whole process, the problem that when the wafer is taken out by the opening device, external fine impurities enter the equipment to influence the internal vacuum environment is avoided, the process operation is simple and rapid, the problem that the etched wafer surface is damaged by manual operation is avoided, when the electric push rod 8 moves upwards, the transverse pressing plate 30 is synchronously driven to move upwards, the transverse pressing plate 30 does not extrude the connecting plate 38 any more, under the action of the second spring 33, the extrusion block 32 drives the limit plate 35 to move towards the rear side through the special-shaped rod, so that the limit plate 35 is separated from the limit groove and no longer limits the wafer frame 7, when the electric push rod 8 moves downwards and resets, the limit plate 35 is enabled to enter the limit groove again to limit the wafer frame 7, the limit of the wafer frame 7 is firstly released when the wafer frame 7 moves upwards through the processes, the movement of the wafer frame is ensured, when the electric push rod 8 moves downwards and resets, the limit plate 35 slowly limits the wafer frame 7, the stable and safe limit of the wafer on the fixed table 6 is realized, the wafer on the inner wall of the wafer frame 7 is ensured not to be damaged due to extrusion, when the wafer needs to be taken out, the turnover shaft 11 is pulled to move towards the rear side through the reset mechanism so that the wafer frame 7 is not held any more, the electric push rod 8 moves upwards for a certain distance so that the limit plate 35 no, at this time, the wafer rack 7 can be taken out.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A plasma etcher comprising a housing (1), characterized in that: casing (1) top fixedly connected with ionization chamber (2), the fixed intercommunication in ionization chamber (2) side has first intake pipe (3), casing (1) top is located ionization chamber (2) inside fixed intercommunication has second intake pipe (4), casing (1) side articulates there is feeding door (5), casing (1) inner wall fixedly connected with fixed station (6), fixed station (6) top is provided with wafer frame (7), wafer frame (7) inner wall fixedly connected with wafer, casing (1) both sides inner wall all is connected with the drive the tilting mechanism of wafer frame (7) upset, fixed station (6) both sides all are connected with right spacing stop gear of wafer frame (7).
2. A plasma etcher as defined in claim 1, wherein: the turnover mechanism comprises two electric push rods (8), the electric push rods (8) are fixedly connected to the inner wall of the casing (1), the inner walls of the two sides of the casing (1) are both penetrated through and are slidably connected with a pulling plate (9), the end part of the pulling plate (9) is connected with a reset mechanism, the other end of the pulling plate (9) is provided with a circular groove, the inner wall of the circular groove is slidably connected with a disc (10), the side surface of the disc (10) is fixedly connected with a turnover shaft (11), the surface of the turnover shaft (11) is fixedly connected with a discontinuous gear (12), the side surface of the discontinuous gear (12) is fixedly connected with a first plate (13), the surface of the turnover shaft (11) is rotatably connected with a first supporting plate (14), the side surface of the first supporting plate (14) is fixedly connected with a second plate (15), the two sides of the first supporting plate (14) are respectively fixedly, the surface of the turnover shaft (11) is fixedly connected with a deflection plate (18) and two first support plates (19) respectively, the top of the first L-shaped plate (16) is contacted with the bottom of the deflection plate (18), the end part of the third plate (17) is fixedly connected with a circular sleeve (20), the surface of the circular sleeve (20) is fixedly connected with an L-shaped rod (21), the inner walls of the two sides of the shell (1) are respectively provided with a first notch, the end part of the L-shaped rod (21) is connected onto the inner wall of the first notch in a sliding manner, the inner wall of the circular sleeve (20) is matched with the telescopic end of the electric push rod (8), the two sides of the wafer frame (7) are respectively provided with a clamping groove (22), the end part of the turnover shaft (11) is inserted into the inner wall of the clamping groove (22), the two sides of the inner wall of the shell (1) are respectively and fixedly connected with two L-shaped support plates (23, the utility model discloses a gear rack, including support frame (24), trip shaft (11), trip shaft (24), support frame (24), both sides T type groove has been seted up to the side, T type inslot wall sliding connection has rectangular shell (25), rectangular shell (25) inner wall sliding connection has L type clamp plate (26), the first spring (27) of the common fixedly connected with of L type clamp plate (26) and rectangular shell (25) inner wall, the top of L type clamp plate (26) bottom and first extension board (19) contacts, L type clamp plate (26) side fixedly connected with L type roof (28), L type roof (28) tip is the inclined plane, L type backup pad (23) side fixedly connected with T type pinion rack (29), T type pinion rack (29) and interrupted gear (12) cooperate.
3. A plasma etcher as defined in claim 2, wherein: the limiting mechanism comprises a transverse pressing plate (30), the transverse pressing plate (30) is fixedly connected to the side face of the telescopic end of the electric push rod (8), L-shaped extension plates (31) are fixedly connected to two sides of the fixed table (6), two first sliding grooves are formed in the tops of the L-shaped extension plates (31), an extrusion block (32) is slidably connected to the inner wall of each first sliding groove, a second spring (33) is fixedly connected to the side face of the extrusion block (32) and the L-shaped extension plates (31) jointly, a special-shaped rod (34) is fixedly connected to the side face of the extrusion block (32), limiting plates (35) are fixedly connected to the end portions of the special-shaped rods (34), limiting grooves are formed in two sides of the wafer frame (7), the limiting plates (35) are slidably connected to the inner walls of the limiting grooves, two idler wheels (36) are rotatably connected to the tops of the L-shaped extension plates (31), first ropes (37) are fixedly, the first rope (37) bypasses the surface of the roller (36) and penetrates through the L-shaped extension plate (31), the end part of the first rope (37) is fixedly connected with a connecting plate (38), and the top of the connecting plate (38) is contacted with the bottom of the transverse pressing plate (30).
4. A plasma etcher as defined in claim 3, wherein: limiting plate (35) side fixedly connected with damping spring (39), damping spring (39) other end fixedly connected with shock pad (40), shock pad (40) sliding connection is on the inner wall of spacing groove.
5. A plasma etcher as defined in claim 2, wherein: the inner walls of two sides of the machine shell (1) are fixedly connected with a second support plate (41), the top of the second support plate (41) is provided with a through second chute, the inner wall of the second chute is connected with a wedge block (42) in a sliding manner, the top of the second support plate (41) is fixedly connected with a frame (43), the inner wall of the frame (43) is fixedly connected with an air bag (44), the two sides of the frame (43) are provided with third chutes, the inner wall of the third chute is connected with an extrusion plate (45) in a sliding manner, the wedge block (42) is fixedly connected with the extrusion plate (45), the extrusion plate (45) and the frame (43) are fixedly connected with a third spring (46) together, the side surface of the extrusion plate (45) is in contact with the air bag (44), the top of the air bag (44) is fixedly communicated with a third air inlet pipe (47) penetrating through the frame (43), and the surface of the third air inlet pipe (47) is fixedly connected, the side face of the air bag (44) is fixedly communicated with an air outlet pipe (49) penetrating through the frame (43), the surface of the air outlet pipe (49) is fixedly connected with a one-way valve (48), the end part of the air outlet pipe (49) is fixedly communicated with a transverse pipe (50), the surface of the transverse pipe (50) is provided with an air outlet hole (51), and the side face of the circular sleeve (20) is fixedly connected with a special-shaped ejector rod (52).
6. A plasma etcher as defined in claim 3, wherein: both sides of the fixed table (6) are fixedly connected with third support plates (53), the tops of the third support plates (53) are fixedly connected with two limiting shafts (54), and the limiting shafts (54) penetrate through the connecting plate (38).
7. A plasma etcher as defined in claim 2, wherein: the bottom of the rectangular shell (25) is fixedly connected with a second rope (55), the second rope (55) penetrates through the L-shaped extension plate (31), and the end part of the second rope is fixedly connected with a heavy object block (56).
8. A plasma etcher as defined in claim 2, wherein: reset mechanism includes two second L templates (57), second L template (57) fixed connection is in the side of casing (1), pull board (9) end fixedly connected with runs through reset axle (58) of second L template (57), second L template (57) and the common fixedly connected with of pull board (9) cup joint reset spring (59) on reset axle (58) surface, reset axle (58) end fixedly connected with rectangular block, the rectangular block top begins to have screw hole (60) that run through, second L template (57) side fixedly connected with fourth extension board, fourth extension board top threaded connection has bolt (61).
9. An etching method of a plasma etcher, which is applied to a plasma etcher as claimed in any one of claims 1 to 8, characterized in that: the method comprises the following steps:
the method comprises the following steps: introducing etching gas into the ionization box (2), introducing the etching gas into the interior of the machine shell (1) after the plasma is formed in the ionization box (2), and beginning to etch the surface of the wafer;
step two: after the one side etching of wafer was accomplished, stop gaseous letting in, start electric putter (8) motion this moment, make wafer frame (7) upset another side through tilting mechanism, realize the etching to the other one side of wafer, simultaneously when electric putter (8) upward movement, will remove automatically and carry out spacingly to wafer frame (7), when electric putter (8) downstream, limiting plate (35) will slow carry on spacingly to wafer frame (7).
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114388659A (en) * | 2022-01-11 | 2022-04-22 | 安徽英发睿能科技股份有限公司 | PERC double-sided battery etching equipment with fixing structure |
| CN116779411A (en) * | 2023-08-17 | 2023-09-19 | 成都超迈光电科技有限公司 | Multifunctional plasma etching machine with composite physical and chemical effects |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155633A (en) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | Automatic sticking system for semiconductor wafer |
| US5636724A (en) * | 1994-08-31 | 1997-06-10 | Jenoptik Technologie Gmbh | Device for transferring a transport object between two end positions |
| US20130276983A1 (en) * | 2011-01-13 | 2013-10-24 | Hitachi Kokusai Electric Inc. | Injection member for manufacturing semiconductor device and plasma processing apparatus having the same |
| CN105529283A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Two-sided vapor etching device for wafer |
| CN106409720A (en) * | 2015-07-27 | 2017-02-15 | 三星显示有限公司 | Plasma treatment apparatus |
| CN111243932A (en) * | 2020-01-18 | 2020-06-05 | 苏州市奥普斯等离子体科技有限公司 | Multi-material-box semi-automatic plasma processing device and using method thereof |
-
2021
- 2021-01-14 CN CN202110051091.1A patent/CN112490107B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155633A (en) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | Automatic sticking system for semiconductor wafer |
| US5636724A (en) * | 1994-08-31 | 1997-06-10 | Jenoptik Technologie Gmbh | Device for transferring a transport object between two end positions |
| US20130276983A1 (en) * | 2011-01-13 | 2013-10-24 | Hitachi Kokusai Electric Inc. | Injection member for manufacturing semiconductor device and plasma processing apparatus having the same |
| CN105529283A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Two-sided vapor etching device for wafer |
| CN106409720A (en) * | 2015-07-27 | 2017-02-15 | 三星显示有限公司 | Plasma treatment apparatus |
| CN111243932A (en) * | 2020-01-18 | 2020-06-05 | 苏州市奥普斯等离子体科技有限公司 | Multi-material-box semi-automatic plasma processing device and using method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114038939B (en) * | 2021-10-13 | 2022-11-25 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114388659A (en) * | 2022-01-11 | 2022-04-22 | 安徽英发睿能科技股份有限公司 | PERC double-sided battery etching equipment with fixing structure |
| CN114388659B (en) * | 2022-01-11 | 2023-09-15 | 安徽英发睿能科技股份有限公司 | Etching equipment with fixed structure for PERC double-sided battery |
| CN116779411A (en) * | 2023-08-17 | 2023-09-19 | 成都超迈光电科技有限公司 | Multifunctional plasma etching machine with composite physical and chemical effects |
| CN116779411B (en) * | 2023-08-17 | 2023-11-03 | 成都超迈光电科技有限公司 | Multifunctional plasma etching machine with composite physical and chemical effects |
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