CN114582769A - Blowing type wafer conveying system and operation method - Google Patents
Blowing type wafer conveying system and operation method Download PDFInfo
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- CN114582769A CN114582769A CN202210079640.0A CN202210079640A CN114582769A CN 114582769 A CN114582769 A CN 114582769A CN 202210079640 A CN202210079640 A CN 202210079640A CN 114582769 A CN114582769 A CN 114582769A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
The invention discloses a blowing type wafer conveying system and an operation method thereof, and the blowing type wafer conveying system comprises a supporting table, wherein the bottom of the supporting table is fixedly connected with a base, the top of the supporting table is fixedly connected with a conveying box, the front side of the supporting table is fixedly connected with a first conveying plate and a second conveying plate, and an ejection mechanism is arranged in the first conveying plate. The blowing type wafer conveying system and the operation method have the advantages that the turning transmission mechanism is arranged, the driving motor is used for driving the driving rotating shaft to rotate, the driving rotating shaft drives the connecting rod and the clamping column to move in the clamping groove of the cross wheel, the rotating plate and the extracting box are rotated, the wafer is clamped through the extracting plate, the wafer is clamped, accordingly, the wafer is clamped, the problem that the wafer drops due to adsorption is solved, intermittent turning is achieved, the purpose of accurate positioning and transmission is achieved, and the wafer conveying efficiency is improved.
Description
Technical Field
The invention relates to the technical field of wafer transmission, in particular to a blowing type wafer transmission system and an operation method.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are mainly 8 inches and 12 inches, and the main processing modes of the wafers are sheet processing and batch processing, namely 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.
The existing wafer has the following problems in the process of transmission:
1. the problem that accurate positioning cannot be carried out and the transmission process is slow often exists when manual transmission is carried out in the transmission process;
2. the wafer falls off due to insufficient adsorption force in the process of adsorption through the sucker;
3. in the process of transmission, the wafer is not jacked up, so that the problem of inconvenient transmission and lifting is caused.
Therefore, the invention provides a blowing type wafer conveying system and an operation method.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a blowing type wafer conveying system and an operation method thereof, which solve the problems that the prior conveying process often cannot be accurately positioned, the wafer falls off due to insufficient adsorption force in the process of adsorption of a sucker, and the conveying process often causes inconvenience in lifting due to the fact that the wafer is not jacked up.
In order to achieve the purpose, the invention is realized by the following technical scheme: a blowing type wafer conveying system comprises a supporting table, wherein the bottom of the supporting table is fixedly connected with a base, the top of the supporting table is fixedly connected with a conveying box, the front side of the supporting table is fixedly connected with a first conveying plate and a second conveying plate, an ejection mechanism is arranged inside the first conveying plate, a steering conveying mechanism is arranged inside the conveying box, the steering conveying mechanism comprises a driving motor and a first air cylinder, the bottom of the first air cylinder is connected with a first piston rod in a sliding mode, one end of the first piston rod is fixedly connected with a rotating plate, one end of the rotating plate is provided with a wafer extracting mechanism, one end of an output shaft of the driving motor is fixedly connected with a driving rotating shaft through a coupler, the surface of the driving rotating shaft is provided with a wafer ejection mechanism, the bottom of the driving rotating shaft is fixedly connected with a connecting rod, and the surface of the connecting rod is fixedly connected with a clamping column, the inner part of the transmission box is rotatably connected with a supporting rotating shaft, the surface of the supporting rotating shaft is fixedly connected with a cross wheel, the surface of the cross wheel is provided with a clamping groove, the clamping column is connected with the surface of the clamping groove in a sliding manner, the bottom end of the supporting rotating shaft is fixedly connected with the top part of the first air cylinder, the wafer extracting mechanism comprises a rotating disc and an extracting box fixedly arranged at the bottom part of the rotating plate, the extracting box is internally provided with a placing groove, the inner surface of the placing groove is fixedly connected with a spring, one end of the spring is fixedly connected with a moving plate, the moving plate is connected with the inner surface of the placing groove in a sliding manner, the bottom part of the moving plate is fixedly connected with an arc plate, the bottom part of the arc plate is fixedly connected with an extracting plate through a support rod, the bottom part of the extracting box is provided with a moving groove, the arc plate moves in the moving groove, and the bottom part of the rotating disc is fixedly connected with a rotating rod, the bottom fixedly connected with elliptical plate of dwang, the surface contact of surface and circular arc board of elliptical plate.
Preferably, the wafer pushing mechanism comprises a transmission rotating shaft driven by a transmission assembly, the top end of the transmission rotating shaft is rotatably connected with the inner wall of the transmission box, and a transmission gear is fixedly connected to the bottom of the transmission rotating shaft.
Preferably, the inner wall of the transmission box is connected with a transmission rack in a sliding mode, the transmission gear is meshed with the surface of the transmission rack, and one end of the transmission rack is fixedly connected with a push-out frame.
Preferably, the transmission assembly comprises a driving wheel and a transmission wheel, the driving wheel is fixedly arranged on the surface of the driving rotating shaft, the transmission wheel is fixedly arranged on the surface of the transmission rotating shaft, and the driving wheel and the surface of the transmission wheel are in transmission connection through a transmission belt.
Preferably, the ejection mechanism comprises a second cylinder and a fixed block, the bottom of the fixed block is fixedly connected with the inside of the first transmission plate, and one side of the second cylinder is slidably connected with a second piston rod.
Preferably, the ends of the second cylinder and the second piston rod, which are far away from each other, are fixedly connected with supporting rods, one ends of the supporting rods are fixedly connected with supporting blocks, and the surfaces of the supporting blocks are rotatably connected with a first rotating rod and a second rotating rod through supporting rods.
Preferably, the surface of the first rotating rod is rotatably connected with a jacking block, and the top of the jacking block is fixedly connected with an arc plate.
Preferably, one end of the second rotating rod is rotatably connected with the surface of the fixed block, an extending groove is formed in the top of the first transmission plate, and the supporting block penetrates through the extending groove and extends to the outside of the extending groove.
The invention also discloses an operation method of the blowing type wafer conveying system, which comprises the following steps:
s1, wafer extraction: firstly, the rotating disc is rotated to drive the rotating rod and the elliptical plate to rotate, so that the arc plate and the movable plate are driven to move, the spring is driven to extend, the extraction plate is driven to move, the first air cylinder is started to drive the first piston rod to move at the moment, the first piston rod drives the rotating plate and the extraction box to move downwards, the wafer is placed between the extraction plates, and the extraction plates are clamped on the wafer through the restoring force of the spring;
s2, moving the circular plate downwards: at the moment, a second air cylinder is started, the second air cylinder drives a second piston rod to move, and a first rotating rod and a second rotating rod are driven to move through a supporting rod and a supporting block, so that a jacking block moves downwards until the arc plate is flush with the extending groove;
s3, wafer transmission: the driving motor is started, the driving motor is utilized to drive the driving rotating shaft to rotate, and the driving rotating shaft drives the connecting rod and the clamping column to move in the clamping groove of the cross wheel, so that the supporting rotating shaft is driven to rotate, and the rotating plate and the extracting box are rotated.
Preferably, in S3, the driving motor drives the rotation of the transmission shaft synchronously through the driving wheel, the transmission wheel and the transmission belt, and drives the transmission rack to move through the transmission gear, so that the transmission rack drives the pushing frame to move, and the wafer is moved.
Advantageous effects
The invention provides a blowing type wafer conveying system and an operation method. Compared with the prior art, the method has the following beneficial effects:
(1) this type of blowing wafer passes piece system and operation method, through being provided with and turn to transmission device, utilize driving motor to drive the rotation of drive pivot, the drive pivot has driven connecting rod and card post and has removed in the draw-in groove of cross wheel, thereby realized the rotation of rotor plate with draw the case, and press from both sides tightly the wafer through drawing the board, thereby realized pressing from both sides tightly the wafer, thereby avoided adsorbing the problem that produces and drop, and realized intermittent type and turned to, reach the purpose of accurate positioning and transmission, thereby the efficiency that the wafer passed the piece has been improved.
(2) According to the blowing type wafer conveying system and the operation method, the wafer pushing-out mechanism is arranged, the driving wheel and the driving belt are used for synchronously driving the driving rotating shaft to rotate, the driving gear drives the driving rack to move, the driving rack drives the pushing-out frame to move, and the wafer is moved, so that the next wafer transmission is realized in the synchronous steering process, the energy consumption is reduced, and the transmission efficiency is improved.
(3) The blowing type wafer conveying system and the operation method thereof drive the second piston rod to move by the second cylinder through the ejection mechanism, and drive the first rotating rod and the second rotating rod to move through the support rod and the support block, so that the ejection block moves downwards until the arc plate is flush with the extension groove, thereby facilitating the stretching operation of the wafer and facilitating the subsequent wafer extraction operation.
Drawings
FIG. 1 is an external perspective view of the present invention;
FIG. 2 is a perspective view of the interior of the present invention;
FIG. 3 is an enlarged view of a portion of the structure of FIG. 2;
FIG. 4 is a perspective view of the wafer picking mechanism according to the present invention;
FIG. 5 is an enlarged view of a portion of the structure of FIG. 4B in accordance with the present invention;
FIG. 6 is a perspective view of the wafer pushing mechanism according to the present invention;
FIG. 7 is a perspective view of the ejector mechanism of the present invention;
fig. 8 is an exploded perspective view of the ejection mechanism of the present invention;
FIG. 9 is an enlarged view of a portion of the structure of FIG. 8 at C in accordance with the present invention;
FIG. 10 is a process flow diagram of the method of operation of the present invention.
In the figure: 1-supporting table, 2-base, 3-transmission box, 4-first transmission plate, 5-second transmission plate, 6-ejection mechanism, 61-second cylinder, 62-fixed block, 63-second piston rod, 64-supporting rod, 65-supporting block, 66-first rotating rod, 67-second rotating rod, 68-ejection block, 69-arc plate, 610-extension groove, 7-steering transmission mechanism, 71-driving motor, 72-first cylinder, 73-first piston rod, 74-rotating plate, 75-wafer extraction mechanism, 75-1-rotating disc, 75-2-extraction box, 75-3-placing groove, 75-4-spring, 75-5-moving plate, 75-6-arc plate, 75-7-extraction plate, 75-8-moving groove, 75-9-rotating rod, 75-10-elliptical plate, 76-driving rotating shaft, 77-wafer push-out mechanism, 77-1-transmission component, 77-11-driving wheel, 77-12-transmission wheel, 77-13-transmission belt, 77-2-transmission rotating shaft, 77-3-transmission gear, 77-4-transmission rack, 77-5-push-out frame, 78-connecting rod, 79-clamping column, 710-supporting rotating shaft, 711-cross wheel and 712-clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a blowing type wafer conveying system comprises a supporting table 1, wherein the bottom of the supporting table 1 is fixedly connected with a base 2, the top of the supporting table 1 is fixedly connected with a conveying box 3, the front side of the supporting table 1 is fixedly connected with a first conveying plate 4 and a second conveying plate 5, the first conveying plate 4 and the second conveying plate 5 are convenient for placing wafers, an ejection mechanism 6 is arranged inside the first conveying plate 4, a steering conveying mechanism 7 is arranged inside the conveying box 3, the steering conveying mechanism 7 comprises a driving motor 71 and a first air cylinder 72, the driving motor 71 is a three-phase asynchronous motor, the driving motor 71 is electrically connected with an external power supply, the first air cylinder 72 is electrically connected with the external power supply, the bottom of the first air cylinder 72 is slidably connected with a first piston rod 73, one end of the first piston rod 73 is fixedly connected with a rotating plate 74, one end of the rotating plate 74 is provided with a wafer extracting mechanism 75, one end of an output shaft of the driving motor 71 is fixedly connected with a driving rotating shaft 76 through a coupler, the surface of the driving rotating shaft 76 is provided with a wafer pushing-out mechanism 77, the bottom of the driving rotating shaft 76 is fixedly connected with a connecting rod 78, the surface of the connecting rod 78 is fixedly connected with a clamping column 79, the clamping column 79 and a clamping groove 712 move to drive a cross wheel 711 to rotate, the interior of the transmission box 3 is rotatably connected with a supporting rotating shaft 710, the surface of the supporting rotating shaft 710 is fixedly connected with the cross wheel 711, the surface of the cross wheel 711 is provided with a clamping groove 712, the clamping column 79 is slidably connected with the surface of the clamping groove 712, the bottom end of the supporting rotating shaft 710 is fixedly connected with the top of the first air cylinder 72, the wafer extracting mechanism 75 comprises a rotating disc 75-1 and an extracting box 75-2 fixedly installed at the bottom of the rotating plate 74, the interior of the extracting box 75-2 is provided with a placing groove 75-3, and the inner surface of the placing groove 75-3 is fixedly connected with a spring 75-4, one end of the spring 75-4 is fixedly connected with a movable plate 75-5, the movable plate 75-5 is connected with the inner surface of the placing groove 75-3 in a sliding manner, the bottom of the movable plate 75-5 is fixedly connected with an arc plate 75-6, the bottom of the arc plate 75-6 is fixedly connected with an extraction plate 75-7 through a support rod, the surface of the extraction plate 75-7 is provided with a protective pad for avoiding damage to the wafer, the bottom of the extraction box 75-2 is provided with a movable groove 75-8, the arc plate 75-6 moves in the movable groove 75-8, the bottom of the rotating disc 75-1 is fixedly connected with a rotating rod 75-9, the bottom of the rotating rod 75-9 is fixedly connected with an oval plate 75-10, the surface of the oval plate 75-10 is in contact with the surface of the arc plate 75-6, by arranging the steering transmission mechanism 7, the driving motor 71 is used for driving the driving rotating shaft 76 to rotate, the driving rotating shaft 76 drives the connecting rod 78 and the clamping column 79 to move in the clamping groove 712 of the cross wheel 711, so that the rotating plate 74 and the extraction box 75-2 are rotated, and the wafer is clamped through the extraction plate 75-7, so that the wafer is clamped, the problem that the wafer falls due to adsorption is solved, intermittent steering is realized, the purposes of accurate positioning and transmission are achieved, and the wafer conveying efficiency is improved.
Referring to FIG. 6, the wafer pushing mechanism 77 includes a transmission shaft 77-2 driven by a transmission assembly 77-1, the top end of the transmission shaft 77-2 is rotatably connected to the inner wall of the transmission box 3, the bottom of the transmission shaft 77-2 is fixedly connected to a transmission gear 77-3, the inner wall of the transmission box 3 is slidably connected to a transmission rack 77-4, the transmission gear 77-3 is engaged with the surface of the transmission rack 77-4, one end of the transmission rack 77-4 is fixedly connected to a pushing frame 77-5, the transmission assembly 77-1 includes a driving wheel 77-11 and a transmission wheel 77-12, the driving wheel 77-11 is fixedly mounted on the surface of the driving shaft 76, the transmission wheel 77-12 is fixedly mounted on the surface of the transmission shaft 77-2, the driving wheel 77-11 and the surface of the transmission wheel 77-12 are in transmission connection through a transmission belt 77-13, by arranging the wafer pushing mechanism 77, the driving wheel 77-11, the driving wheel 77-12 and the driving belt 77-13 are used for synchronously driving the transmission rotating shaft 77-2 to rotate, and the transmission gear 77-3 is used for driving the transmission rack 77-4 to move, so that the transmission rack 77-4 is used for driving the pushing frame 77-5 to move, and wafers are moved, therefore, the next wafer transmission is realized in the synchronous steering process, the energy loss is reduced, and the transmission efficiency is improved.
Referring to fig. 7-9, the ejecting mechanism 6 includes a second cylinder 61 and a fixed block 62, the second cylinder 61 is electrically connected to an external power source, the bottom of the fixed block 62 is fixedly connected to the inside of the first transmission plate 4, one side of the second cylinder 61 is slidably connected to a second piston rod 63, the ends of the second cylinder 61 and the second piston rod 63 that are far away from each other are fixedly connected to a support rod 64, one end of the support rod 64 is fixedly connected to a support block 65, the surface of the support block 65 is rotatably connected to a first rotating rod 66 and a second rotating rod 67 through the support rod, the surface of the first rotating rod 66 is rotatably connected to a jacking block 68, the top of the jacking block 68 is fixedly connected to an arc plate 69, one end of the second rotating rod 67 is rotatably connected to the surface of the fixed block 62, the top of the first transmission plate 4 is provided with an extension groove 610, the support block 65 extends to the outside of the extension groove 610 through the ejecting mechanism 6, the second cylinder 81 is utilized to drive the second piston rod 83 to move, and the support rod 84 and the support block 85 are utilized to drive the first rotating rod 86 and the second rotating rod 87 to move, so that the jacking block 88 moves downwards until the arc plate 89 is flush with the extension groove 810, the stretching operation of the wafer is facilitated, and the subsequent wafer extraction operation is facilitated.
Referring to fig. 10, the present invention further discloses an operating method of the blowing type wafer transferring system, which specifically includes the following steps:
s1, wafer extraction: firstly, the rotating disc 75-1 is rotated to drive the rotating rod 75-9 and the elliptical plate 75-10 to rotate, so that the circular arc plate 75-6 and the moving plate 75-5 are driven to move, the spring 75-4 is driven to extend, the extracting plate 75-7 is driven to move, at the moment, the first air cylinder 72 is started to drive the first piston rod 73 to move, the first piston rod 73 drives the rotating plate 74 and the extracting box 75-2 to move downwards, a wafer is placed between the extracting plates 75-7, and the extracting plate 75-7 is clamped on the wafer through the restoring force of the spring 75-4;
s2, moving the circular plate downwards: at this time, the second air cylinder 61 is started, the second air cylinder 61 drives the second piston rod 63 to move, and the support rod 64 and the support block 65 drive the first rotating rod 66 and the second rotating rod 67 to move, so that the jacking block 68 moves downwards until the arc plate 69 is flush with the extension groove 610;
s3, wafer transmission: the driving motor 71 is started, the driving motor 71 drives the driving rotating shaft 76 to rotate, the driving rotating shaft 76 drives the connecting rod 78 and the clamping column 79 to move in the clamping groove 712 of the cross wheel 711, and therefore the supporting rotating shaft 710 is driven to rotate, and therefore the rotating plate 74 and the extraction box 75-2 are rotated.
In the embodiment of the invention, the driving motor 71 in S3 synchronously drives the transmission rotating shaft 77-2 to rotate through the driving wheel 77-11, the transmission wheel 77-12 and the transmission belt 77-13, and drives the transmission rack 77-4 to move through the transmission gear 77-3, so that the transmission rack 77-4 drives the push-out frame 77-5 to move, and the wafer is moved.
And those not described in detail in this specification are well within the skill of those in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a type of blowing wafer passes piece system, includes brace table (1), the bottom fixedly connected with base (2) of brace table (1), the top fixedly connected with transmission case (3) of brace table (1), its characterized in that: a first transmission plate (4) and a second transmission plate (5) are fixedly connected to the front side of the supporting table (1), an ejection mechanism (6) is arranged inside the first transmission plate (4), and a steering transmission mechanism (7) is arranged inside the transmission box (3);
the turning transmission mechanism (7) comprises a driving motor (71) and a first air cylinder (72), the bottom of the first air cylinder (72) is connected with a first piston rod (73) in a sliding mode, one end of the first piston rod (73) is fixedly connected with a rotating plate (74), one end of the rotating plate (74) is provided with a wafer extracting mechanism (75), one end of an output shaft of the driving motor (71) is fixedly connected with a driving rotating shaft (76) through a coupler, a wafer pushing-out mechanism (77) is arranged on the surface of the driving rotating shaft (76), the bottom of the driving rotating shaft (76) is fixedly connected with a connecting rod (78), the surface of the connecting rod (78) is fixedly connected with a clamping column (79), the inner portion of the transmission box (3) is rotatably connected with a supporting rotating shaft (710), and the surface of the supporting rotating shaft (710) is fixedly connected with a cross wheel (711), a clamping groove (712) is formed in the surface of the cross wheel (711), the clamping column (79) is connected with the surface of the clamping groove (712) in a sliding mode, and the bottom end of the supporting rotating shaft (710) is fixedly connected with the top of the first air cylinder (72);
the wafer extracting mechanism (75) comprises a rotating disc (75-1) and an extracting box (75-2) fixedly mounted at the bottom of a rotating plate (74), a placing groove (75-3) is formed in the extracting box (75-2), a spring (75-4) is fixedly connected to the inner surface of the placing groove (75-3), a moving plate (75-5) is fixedly connected to one end of the spring (75-4), the moving plate (75-5) is connected with the inner surface of the placing groove (75-3) in a sliding mode, an arc plate (75-6) is fixedly connected to the bottom of the moving plate (75-5), an extracting plate (75-7) is fixedly connected to the bottom of the arc plate (75-6) through a supporting rod, a moving groove (75-8) is formed in the bottom of the extracting box (75-2), the arc plate (75-6) moves in the moving groove (75-8), the bottom of the rotating disc (75-1) is fixedly connected with a rotating rod (75-9), the bottom of the rotating rod (75-9) is fixedly connected with an elliptical plate (75-10), and the surface of the elliptical plate (75-10) is in contact with the surface of the arc plate (75-6).
2. The blow type wafer transfer system of claim 1, wherein: the wafer push-out mechanism (77) comprises a transmission rotating shaft (77-2) driven by a transmission assembly (77-1), the top end of the transmission rotating shaft (77-2) is rotatably connected with the inner wall of the transmission box (3), and the bottom of the transmission rotating shaft (77-2) is fixedly connected with a transmission gear (77-3).
3. A blow type wafer transfer system as claimed in claim 2, wherein: the inner wall of the transmission box (3) is connected with a transmission rack (77-4) in a sliding mode, the transmission gear (77-3) is meshed with the surface of the transmission rack (77-4), and one end of the transmission rack (77-4) is fixedly connected with a push-out frame (77-5).
4. A blow type wafer transfer system as claimed in claim 2, wherein: the transmission assembly (77-1) comprises a driving wheel (77-11) and a transmission wheel (77-12), the driving wheel (77-11) is fixedly arranged on the surface of the driving rotating shaft (76), the transmission wheel (77-12) is fixedly arranged on the surface of the transmission rotating shaft (77-2), and the driving wheel (77-11) and the surface of the transmission wheel (77-12) are in transmission connection through a transmission belt (77-13).
5. A blow type wafer transfer system as claimed in claim 1, wherein: the ejection mechanism (6) comprises a second air cylinder (61) and a fixed block (62), the bottom of the fixed block (62) is fixedly connected with the inside of the first transmission plate (4), and one side of the second air cylinder (61) is connected with a second piston rod (63) in a sliding mode.
6. A blowing type wafer conveying system as claimed in claim 5, wherein: the end of the second cylinder (61) and the end of the second piston rod (63) which are far away from each other are fixedly connected with a supporting rod (64), one end of the supporting rod (64) is fixedly connected with a supporting block (65), and the surface of the supporting block (65) is rotatably connected with a first rotating rod (66) and a second rotating rod (67) through the supporting rod.
7. The system of claim 6, wherein: the surface of the first rotating rod (66) is rotatably connected with a jacking block (68), and the top of the jacking block (68) is fixedly connected with an arc plate (69).
8. The system of claim 6, wherein: one end of the second rotating rod (67) is rotatably connected with the surface of the fixed block (62), an extending groove (610) is formed in the top of the first transmission plate (4), and the supporting block (65) penetrates through the extending groove (610).
9. An operation method of a blowing type wafer conveying system is characterized in that: the method specifically comprises the following steps:
s1, wafer extraction: firstly, a rotating rod (75-9) and an elliptical plate (75-10) are driven to rotate by rotating a rotating disc (75-1), so that an arc plate (75-6) and a moving plate (75-5) are driven to move, a spring (75-4) is driven to extend, an extraction plate (75-7) is driven to move, a first air cylinder (72) is started to drive a first piston rod (73) to move, the first piston rod (73) drives the rotating plate (74) and an extraction box (75-2) to move downwards, a wafer is placed between the extraction plates (75-7), and the extraction plate (75-7) is clamped on the wafer through restoring force of the spring (75-4);
s2, moving the circular plate downwards: at the moment, a second air cylinder (61) is started, the second air cylinder (61) is utilized to drive a second piston rod (63) to move, and a first rotating rod (66) and a second rotating rod (67) are driven to move through a supporting rod (64) and a supporting block (65), so that a jacking block (68) moves downwards until an arc plate (69) is flush with an extension groove (610);
s3, wafer transmission: the driving motor (71) is started, the driving motor (71) is used for driving the driving rotating shaft (76) to rotate, the driving rotating shaft (76) drives the connecting rod (78) and the clamping column (79) to move in the clamping groove (712) of the cross wheel (711), and therefore the supporting rotating shaft (710) is driven to rotate, and the rotating plate (74) and the extracting box (75-2) are rotated.
10. The method of claim 9, wherein the wafer transfer system further comprises: in the S3, the driving motor (71) synchronously drives the transmission rotating shaft (77-2) to rotate through the driving wheel (77-11), the transmission wheel (77-12) and the transmission belt (77-13), and drives the transmission rack (77-4) to move through the transmission gear (77-3), so that the transmission rack (77-4) drives the push-out frame (77-5) to move, and the wafer is moved.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115592550A (en) * | 2022-12-14 | 2023-01-13 | 杭州中欣晶圆半导体股份有限公司（Cn） | Pumping device for wafer polishing and pumping method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115592550A (en) * | 2022-12-14 | 2023-01-13 | 杭州中欣晶圆半导体股份有限公司（Cn） | Pumping device for wafer polishing and pumping method thereof |
| CN115592550B (en) * | 2022-12-14 | 2023-04-28 | 杭州中欣晶圆半导体股份有限公司 | Pumping device for wafer polishing and pumping method thereof |
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