JPS63155639A - Automatic sticking system for semiconductor wafer - Google Patents

Abstract

PURPOSE:To detect an error of the suction of a wafer at a frame-transfer part by installing a pressure switch which detects a change in the pressure of a vacuum chuck incorporated in the frame transfer part. CONSTITUTION:A solenoid valve VL3 which is installed in connection with a vacuum chuck of a frame chuck arm 72 is actuated, and the arn 72 starts to such a semiconductor wafer frame 4. Simultaneously with the actuation of the solenoid valve VL3, a timer inside a control unit is cleared. It is judged by a detection signal of a pressure switch PUSW 3 whether the arm 72 has sucked the positioned frame 4. When the arm 72 has sucked the frame 4, the pressure inside the vacuum chuck is lowered and the PUSW 3 is set to an ON state. If the PUSW 3 is in an OFF state, said timer confirms whether a time limit has been exceeded or not. If the time limit has been exceeded, it is judged that the frame 4 has not been sucked by the arm 72 for one cause or another, and an error is displayed.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is attached to an adhesive tape and subjected to thalassoking. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next process, the bonding process.

Such a process of attaching a semiconductor wafer to an adhesive tape is performed as a pre-process of a semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafers to adhesive tape.

<Problems to be Solved by the Invention> The present invention has been developed in view of the above-mentioned circumstances. Paste it on the table! The purpose is to provide an automatic semiconductor wafer attachment device that has a function of detecting whether or not the frame transport unit is picking up frames.

Such objects of the present invention will become clearer in the detailed description of the present invention that follows.

<Means for Solving the Problems> In order to achieve the above object, the present invention adopts the following configuration.

That is, the present invention provides an automatic semiconductor wafer affixing device that aligns a semiconductor wafer on which an orientation flat is formed and affixes it to an adhesive tape, the invention comprising a frame for holding the adhesive tape to which the semiconductor wafer is affixed. , a frame positioning unit that positions the semiconductor wafer in advance; a table that attaches the semiconductor wafer to the adhesive tape; a vacuum chuck that holds the frame positioned by the frame positioning unit; a frame conveyance unit that conveys the frame to a frame, and a suction detection unit that detects whether or not the frame conveyance unit is suctioning the frame, and the suction detection unit detects the pressure of a vacuum chuck provided in the frame conveyance unit. The apparatus is characterized in that it includes a pressure detection means for detecting a change, and an error determination means for determining a frame suction error in the frame conveying section based on a detection signal of the pressure detection means.

<Example> =3- Hereinafter, one example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of the automatic semiconductor wafer attachment device according to the present embodiment, and FIGS. 2 to 9 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attachment device. It is.

FIG. 10 shows a semiconductor wafer 2 that is attached to an adhesive tape by an apparatus for automatic attachment of semiconductor wafers according to this embodiment.
, a frame 4 for holding the adhesive tape to which the semiconductor wafer 2 is attached, and a mount frame 6 which is the frame to which the semiconductor wafer 2 is attached.

An orientation flat OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2 . An element pattern is formed on the semiconductor wafer 2 using this orientation flask 1-OF as a reference.

The frame 4 is a ring-shaped metal plate or resin plate,
On its outer periphery, V holes 41, 4□ are formed to be used when aligning the frame 4, which will be described later.

For automatic attachment of semiconductor wafers according to this embodiment, the apparatus separately supplies the semiconductor wafer 2 and the frame 4 from the wafer loader section and the frame loader section, respectively, and attaches them to the adhesive tape, and finally mounts the semiconductor wafers. -The frame 6 is stored in the unloader section.

The configuration of each part of this device will be explained below.

Reference numerals 8 (8□ to 84) shown in FIG. 1 are wafer cassettes set in the wafer loader section. The wafer cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically at equal intervals. In this embodiment, there are two wafer loader sections, wafer cassettes 81 and 8□ can be set in the left wafer loader section, and wafer cassettes 83 and 84 can be set in the right wafer loader section. Each wafer loader section is configured to be movable in the vertical direction, and supplies the semiconductor wafers 2 by detecting the semiconductor wafers 2 in the wafer cassette 8 and pushing them out.

The wafer push mechanism provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a motor is installed.
The right wafer loader section is provided with a wafer pushing mechanism 12 driven by an air cylinder.

The semiconductor wafers 2 supplied from each wafer loader section are
This semiconductor wafer 2 is transported to a semiconductor wafer alignment section 14 for alignment.

The semiconductor wafer 2 is generally transported to the semiconductor wafer alignment section 14 by a transport heald 16 shown in FIG. This transport heald 16 is driven by a motor 18 in forward and reverse directions.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives and receives the semiconductor wafer 2 that has been transferred and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center alignment plate 22. , 22□, etc.

The alignment table 20 is equipped with a vacuum chuck for holding the semiconductor wafer 2 by suction. VLI is
The solenoid valve PUSWI that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in pressure within the vacuum chuck.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable in the vertical direction by an air cylinder 26.

Center alignment plate 22. ．． 22 degrees are provided at positions facing each other with the alignment table 20 at the upper limit position interposed therebetween. Each center alignment provisional 22, . An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposite surface side of the semiconductor wafer 2 . Center alignment plate 22□, 22
□ is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

On both sides of the alignment table 20, conveyor belts 1
A wafer stopper 30 for receiving and stopping the semiconductor wafer 2 that has been generally transported on the wafer 6. .

There are 30□. Wafer stopper 30. ．． 302 is swung by an air cylinder (not shown). When the semiconductor wafer 2 is supplied from the left wafer loader section, the right wafer stopper 30 □ is pressed, and when the semiconductor wafer 2 is supplied from the right wafer loader section,
The left wafer stoppers 30+ each rise to stop receiving the semiconductor wafer 2 that has been transported.

Reference numeral 32 shown in FIG.
In order to detect the edge of the orientation flat OF of the semiconductor wafer 2 which is being held by suction and rotating,
This is an orientation flat end detection unit equipped with a pair of transmissive photoelectric elements P H3WI, 2.3. As shown in FIG.
6 and the light receiving section 38 are configured to be openable and closable by an air cylinder 34. The reason why such three sets of transmission type photoelectric elements PH3W1.2.3 are used is to select and use appropriate photoelectric elements according to the size of the semiconductor wafer 2. The orientation flat end detection section 32 is open in a normal state, and is closed when detecting the end of the orientation flat OF for positioning.

Reference numeral 40 shown in FIGS. 1 and 2 is a reversing fork for conveying the semiconductor wafer 2 whose orientation flat OF has been aligned by the semiconductor wafer alignment unit 14 to the attachment table 42. The reversing fork 40 is equipped with a vacuum chuck for suctioning and holding the semiconductor wafer 2 from the back side. V L 2
is a solenoid valve that turns on/off this vacuum chuck, PUSW
Reference numeral 2 denotes a pressure switch that detects a pressure drop within the vacuum chuck and turns on.

The reversing fork 40 is driven by an air cylinder 44 to connect the alignment table 20 and the pasting table 4.
2, and is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. P.H.
3W4 is a photoelectric element for detecting whether the reversing fork 40 is in a predetermined position after performing a reversing operation.

As shown in FIG.
It includes a chuck table 48 and a frame chuck table 50 provided around the wafer chuck table 48. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 is laid on the wafer chuck table 48. Reversing fork 4
The semiconductor wafer 2 transported by the wafer 2 is placed on the wafer chuck table 48 via the protective film 52 with its back side facing upward. Protective film 52
is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of frames 4 in a stacked state, and a frame push-out mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. This frame extrusion mechanism, as shown in Figure 4,
an extrusion plate 58 for extruding the frame 4;
It is composed of an air cylinder 60 that drives this horizontally.

The frame 4 supplied from the frame loader section 54 is
The frame positioning section 62
It is sent out to The frame feeding section includes a frame pusher 64 that engages with the inner peripheral surface of the frame 4 pushed out from the frame stocker 56 and feeds out the frame 4, and an air cylinder 66 that raises and lowers the frame pusher 64. , an air cylinder 68 for horizontally driving the frame pusher 64, and the like. In the normal state, frame pusher 64 is lowered.

When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven to push up the frame pusher 64 and insert it into the frame 4, and then the air cylinder 68 is driven to push the frame pusher 64 up and into the frame 4. is sent out to the frame positioning section 62.

The frame positioning unit 62 has two positioning pins 70 (however,
Only one positioning pin 70 is visible in Fig. 4)
is provided. This positioning pin 70 and the V notch 4 of the frame 4. ．． By engaging 42, the frame 4 is positioned. PH3W5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is transported to the table 42 for pasting by the frame conveying section, and the pasting is carried out by the table 42.
It is placed on the frame chuck table 50 of No. 2. As shown in FIG. 5, the frame transport section includes a frame chuck arm 72 that holds the frame 4 by suction, an air cylinder 73 that raises the frame chuck arm 72, and a horizontal drive of the frame chuck arm 72. It is composed of an air cylinder 74, etc. for VL3 is a solenoid valve that turns on/off the frame/chuck arm 72, and PUSW3 is a pressure switch that detects a decrease in pressure within the frame/chuck arm 72 and enters the N state.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport section. Fifth
VL4 shown in the figure is a solenoid valve that turns on/off the frame chuck table 50, and PUSW4 is a solenoid valve that turns on/off the frame chuck table 50.
This is a pressure switch that detects a pressure drop within the chuck table 50 and turns on. Further, PH3W6 is a photoelectric element that detects the frame 4 on the frame chuck table 50.

Next, a tape supply/winding mechanism and an adhesive tape cutting mechanism will be explained based on FIGS. 1 and 6.

The protective film 52 described above is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and taken up by a protective film take-up reel 78 provided on the other side of the table 42.

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is set on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator 84 is wound up separately from the adhesive tape 82 by a separator take-up reel 86 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a roller uni-nod attachment consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 6, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is pasted onto a roller unit 90 in a 'SJ' shape, and is further pasted on the roller unit 90 in parallel. The tape is then passed to a peeling roller unit 92 and wound onto a residue tape take-up reel 88 .

As shown in FIG. 7, the application roller uni-nod 90 is
It is connected to the tip of an air cylinder 94 that drives this horizontally. Further, the peeling roller unit 92 is
It is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide on a rail 96 by means of cam followers provided above them. The rail 96 has air cylinders 9 provided at both ends thereof.
8. ．． It is configured to be movable up and down by 98□. A rank and pinion mechanism 100 is provided at the bottom of the roller unit 90, and this rack and pinion mechanism 100 is driven by a motor 106 coupled via a brake 102 and a clutch 104. There is.

The above-mentioned pasting operations of the roller unit gutter 90 and the peeling roller unit 92 will be explained with reference to FIGS. 7 and 8.

In the normal state, each roller unit 90, 92 is attached at the origin position to the left of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When pasting is performed, use an air cylinder 98°, 98□
is activated and the rail 96 is lowered. Then, a cock (not shown) provided in connection with the peeling roller unit 92 is operated to maintain the peeling roller unit 92 in a stopped state. In this state, when the air cylinder 94 is activated, only the roller unit 90 is driven in the horizontal direction, and the roller rolls while pressing the adhesive tape 82 on the table 42 downward, thereby creating an adhesive. tape 8
2 and the semiconductor wafer 2 are attached.

At this time, clutch 104 is released.

When the residual tape is to be peeled off from the frame 4 or the like after cutting the adhesive tape 82, the cock of the peeling roller unit 92 is released and the brake 102 is activated. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one. The peeling roller unit 92 peels off the residual tape by rotating the peeling roller while moving horizontally. FIG. 8 shows the position of each roller unit 90, 92 at the time when such a peeling operation is completed.

After the peeling operation is completed, each roller 90, 92 returns to its origin in the following manner.

First, the air cylinders 9B, 9B□ are operated to raise the rail 96. Raising the rail 96 in this way is done by each roller unit 90 during the return-to-origin operation.
This is because when the adhesive tape 92 rolls on the table 42, the residual tape peeled off by the above-described peeling operation will adhere to the frame 4 etc. again. As the rail 96 rises, the brake 102 is released and the clutch 104 is engaged. Then, when the motor 06 is operated and the Ranok-Binion mechanism 100 is driven, the pasting roller unit 90 and the peeling roller unit 92 are integrally moved horizontally to the left and returned to the origin.

For pasting, an adhesive tape cutting mechanism 108 is provided above the table 42 for cutting the band-shaped adhesive tape 82 pasted by the above-described pasting operation into a circular shape along the frame 4. This adhesive tape cutting mechanism 10
8, as shown in FIG. 6, a presser plate 110 that presses and holds the adhesive tape 82 on the pasting table 42, a tape cutter 112 that is rotationally driven along the outer periphery of the presser plate 110, etc. It is configured. The pressing plate 110 and the tape cutter 112 are configured to be movable in the vertical direction as a unit.

Reference numeral 114 shown in FIG. 6 is a mount/frame chuck arm for ejecting the mount frame 6 from the attachment table 42. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves toward the table 42 side with the peeling operation of the peeling roller unit 92, and removes the mount/frame.
The frame 6 is held by suction, and the mount frame 6 is discharged and conveyed by the return-to-origin operation of the peeling roller unit 92 or the like. In addition, VL5 shown in FIG. 6 is a solenoid valve that turns on/off this mount/frame chuck arm 114, and PUSW5 is a solenoid valve that turns on/off the mount/frame chuck arm 114.
This is a pressure switch that turns on when it detects a drop in pressure within the pressure switch 14.

The mount frame 6 suctioned and held by the mount frame chuck arm 114 is conveyed to the swing reversing unit 116 by the origin return operation of each of the rollers 90 and 92. As shown in FIGS. 6 and 9, the swing reversing unit 116 includes a clamp mechanism 11 that holds the transported mount frame 6.
In addition to 8, there is also a swing mechanism 120 that swings the held mount frame 6 approximately 180 degrees in the horizontal direction, an inversion mechanism 122 that inverts the swung mount frame 6 so that the surface of the semiconductor wafer 2 faces up, and The apparatus includes a vertical drive mechanism 124 for lowering the mount frame to the heat stage 126. Note that the PHS W 7 provided in the clamp mechanism 118 is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

When using an adhesive tape using a heat-shrinkable film as a support, the heat stage 126 is provided for the purpose of increasing the tape tension by heating. As shown in FIG. 9, adjacent to this heat stage 126, there is a mount frame push-out mechanism 28 for pushing out the mount frame 6 on the P1-stage 126, and a Frame cassette l-132 (132, ~132
4) is provided with a transport table 130 for transporting.

The conveyance table 130 includes the air cylinder 1 shown in FIG.
31, it is configured to be movable in the horizontal direction,
Transport bell I-13 for transporting to the left unloader section
4, and a conveyor bell l for conveying to the unloader section on the right side.
-136, the mount frame 6 can be assigned.

In addition, PH3W8 shown in FIG. 9 is heat stage 1.
A photoelectric element for detecting the mounting frame 6 on 26, P
H3W9 is a photoelectric element that detects the extrusion of the mount frame 6 from the heat stage 126, and PH3WIO is a photoelectric element that detects the reception of the mount frame 6 by the transport table 130.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equal intervals, and in this embodiment, four frame cassettes 132I to 1324 can be stored. Frame cassette 132. ．． 1322 is a frame cassette 132. in the left unloader section. ．． 1
32. are set in the right unloader section. Each unloader section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. The operation panel 138 is provided with a three-digit, seven-segment LED that displays a code corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a patrol light that displays automatic driving operations, error occurrences, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 11.

The control unit 142 includes a CPU 144. ROM14.6゜RA
MI 48. Operation panel controller 150. Sensor controller 1-roller 152. Actuator controller 154
．． It is composed of a pulse motor controller 156 and the like. The CPU 144 controls the entire apparatus according to a processing program stored in the ROM 146. RAM1
48, data such as the size of the semiconductor wafer to be attached and processing conditions are written. The operation panel controller 1-roller 150 connects the operation panel 138 to the sensor controller 152.
represents a group 158 of various sensors such as pressure switches and photoelectric elements provided in this device, an actuator controller 154 represents a group 160 of various actuators such as motors and air cylinders provided in this device, and a pulse motor controller 156 controls alignment. - Control the pulse motors 24 that rotate the table 20.

Next, the operation of the automatic semiconductor wafer bonding apparatus having the above-described configuration will be explained according to the operation flowchart shown in FIG.

When the apparatus is started with each part of the apparatus having returned to its original position and with the wafer cassette 8 and frame cassette 132 installed in the wafer loader section and unloader section, respectively, the wafer - The wafer loader section on one side with the cassette 8 mounted is lowered (step 32).

It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in the wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the primary general transport heald 16 is driven, and the detected semiconductor wafer 2 is pushed out from inside the wafer cassette t8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section. (Step S8). The extruded semiconductor wafer 2 is conveyed to the semiconductor wafer alignment section 14 on the conveyor belt 16 .

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is checked whether the receipt has been received (step 510).

Confirmation that the semiconductor wafer 2 has been received is detected by a photoelectric element PH3WII provided near the alignment table 20, as shown in FIG. If the alignment table 20 does not pick up the semiconductor wafer 2 after a certain period of time has elapsed, an error display ■ is performed (step 512), and the error display line I of the patrol l-140 is displayed.
・ lights up, and the 7 segment 1- on the operation panel 138
The LED will display the code corresponding to this error.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). And center alignment plate 22. , 22□ are driven to index the center of this semiconductor wafer 2 (step 5).
16). Once the center of the semiconductor wafer 2 is determined, the vacuum holder of the alignment table 20 is operated to attract the semiconductor wafer 2 (step 818). Then, a pressure switch PUSWI provided in connection with the vacuum chuck checks whether or not the semiconductor wafer 2 is reliably chucked (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flat OF of the semiconductor wafer 2 is aligned (step 524).

Hereinafter, the procedure for positioning the semiconductor wafer orientation flask 1 performed in this step will be explained as follows.
This will be explained based on FIG. 3 and FIG. 14.

FIG. 13 shows the center alignment plate 22. , 22□, the semiconductor wafer 2 is aligned and centered.
A state in which the table 20 has been adsorbed is shown. The end of the orientation flat OF is provided with a photoelectric element PH3W that is appropriately selected according to the size of the semiconductor wafer 2.
I, 2.3. In this figure, only the photoelectric element PH3W1 is shown for convenience. The photoelectric element PH3WI is located slightly inside the radius of the semiconductor wafer 2 from the center of the alignment table 20. The output of the photoelectric element PH3WI is directly given to a pulse motor controller 156 that controls the pulse smoke 24. The pulse motor controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element P HS W 1. Further, the pulse motor controller 156 is controlled by the CPU 14.
Based on the command from 4, the rotation amount is output to the pulse motor 24, and the rotation amount until the pulse motor 24 comes to a stop state is given to the CPU 144.

FIG. 14 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 144 sets a rotation amount for rotating the pulse motor 24 by 360 degrees counterclockwise (step 5130), and controls this via the pulse motor controller 156. It outputs to the pulse motor 24 (step S132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation franc)O
When one end of F is detected by the photoelectric element P HS W 1, the detection signal is sent to the pulse motor controller 15.
6, the pulse motor 24 is stopped.

After the winter is finished in step 5132, the CPU 14.4 monitors whether the pulse motor 24 has stopped (step 3134).

After confirming that the pulse motor 24 has stopped, the CPU
144 sets the amount of rotation for rotating the pulse motor 24 clockwise 360 degrees (step 5136), and controls this via the pulse smoke controller 156 to
4 (step 5138). As a result, the semiconductor wafer 2 is rotated clockwise. Then, when the other end of the orientation flat OF is detected by the photoelectric element PH3WI, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

When the CPU 1-44 confirms that the pulse motor 24 has stopped (step 5140), it reads the clockwise rotation amount θ at that time (step 5142).

Then, a rotation amount for rotating the pulse motor 24 counterclockwise by θ/2 is set (step 5144), and this is output to the pulse motor 24 via the pulse motor controller 156. As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat OF intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element PH3WI.

The above is the basic procedure for aligning the orientation flat OF, but depending on the model of the semiconductor wafer 2,
Final positioning may be completed by further rotating the semiconductor wafer 2 by 906 rotations or 180 degrees.

Hereinafter, referring back to FIG. 12, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 826). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step S22 described above and an error display (2) is displayed.

By the way, after the above-mentioned step S14 is completed, the process moves to step 316 and also moves to step 328. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530). At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction.

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). The presence or absence of suction is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If suction has not been performed, an error display (2) is performed (step 534), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 53).
6). Then, it is confirmed whether the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 40 is reversed is determined based on the detection signal of the photoelectric element PH3W4 provided in relation to the reversing fork 40. If the reversing fork 40 has not been reversed to the predetermined position, an error message ■ is displayed (step 540).
), the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the reversing fork 40 is correctly reversed, the suction of the semiconductor wafer 2 is confirmed again (step 54).
1) If it is not absorbed, the above error message will be displayed.
(step 534).

When the semiconductor wafer 2 is confirmed to be attracted, the reversing fork 4
0 is pasted and retreats to the table 42 side (step 542
). Then, the reversing fork 40 releases the suction of the semiconductor wafer 2 and transfers the transferred semiconductor wafer onto the wafer chuck table 48 covered with the protective film 52 (step 544). The semiconductor wafer 2 transferred to the wafer chuck table 48 has its back side facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. As a result, the frame 4 stored in the frame stocker 56 is pushed out by the frame push-out mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 348), and moves forward while engaging the inside of the pushed-out frame 4 (step 550). . As a result, the frame 4 is sent out to the frame positioning section 62, and the notches 41 and 4□ of the frame 4 are moved to the frame positioning section 62.
The frame 4 is positioned by engaging with a positioning pin 70 provided in the frame 4 .

Then, it is confirmed whether or not the frame 4 has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element PH5W5 provided in the frame positioning section 62. If frame 4 is not aligned, an error message ■ is displayed (step 354),
The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the frame 4 has been positioned, the frame chunk arm 72 that conveys the frame 4 to the table 42 descends (step 556) and adsorbs the positioned frame 4 (step 858). Next, it is confirmed whether the frame chuck arm 72 has attracted the frame 4 (step 560). this is,
The determination is made based on the detection signal of the pressure switch PUSW3 provided in relation to the frame chuck arm 72. If frame 4 is not adsorbed, an error message appears■
is carried out (step 562), and the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When it is confirmed that the frame 4 is attracted, the frame chuck arm 72 is raised (step 564).
). Then, it is checked again that frame 4 has been attracted (step 565), and if it has not been attracted, the above-mentioned error display (2) is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the attachment table 42 (step 8).
66). Then, the frame chuck arm 72 descends and transfers the frame 4 to the frame chuck table 50 (step 567).

When the transfer of the frame 4 is confirmed, the frame chuck table 50 is operated to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably sucking the frame 4 (step 571). This is determined based on the detection signal of the pressure switch PUSW4 provided in relation to the frame chuck table 50.

If the frame 4 is not attracted, an error display ■ is displayed (step 572), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. do.

After confirming that the frame 4 is attracted to the frame/chuck table 50, the frame/chuck arm 7
In order to release the suction of the frame chuck arm 72 (step 573), the frame chuck arm 72 rises (step 574).

Through the above steps, the semiconductor wafer 2 and frame 4 are set on the attachment table 42.

When the frame chuck arm 72 is raised, the pasting roller unit 90 is lowered (step 575). As a result, the adhesive tape 82 placed on the roller unit 90 also descends, and this adhesive tape 82 is attached to the wafer.
The chuck table 4 comes into contact with the back surface of the semiconductor wafer 2 on the 35-8. When the pasting roller unit 90 is lowered, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, the roller of the roller unit 90 presses lightly while rolling on the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2, and the semiconductor wafer 2, the adhesive tape 82, and the frame 4 are attached. Do (Step 8
76).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, the tape cutter 112 cuts around the holding play 1-110.
By rotating the adhesive tape 82, the adhesive tape 82 is cut to be slightly smaller than the outer shape of the frame 4 (step 378).

When the cutting of the adhesive tape 82 is completed, the wafer chuck table 48 is lowered (step 580), the protective film take-up reel 78 is driven to wind up the protective film 52, and the new protective film 52 is placed on the wafer chuck. It is pulled out onto the table 48 (step 582).

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residue of the adhesive tape 82 stuck to the periphery of the frame 4 is peeled off from the frame 4 (step 584).

Once the adhesive tape has been peeled off, the mount/frame chuck arm 114 is lowered to eject the mount frame 6 on the table 42 (step 586).
. Attach the mount frame 6 (step 588)
. Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). This is determined based on the detection signal of the pressure switch PUSW5 provided in connection with the mount/frame chuck arm 114. If the mount frame 6 is not attracted, an error message X is displayed (step S92), and the patrol light 14
0 error display light lights up and the operation panel 13
The 7 segment l7ED of 8 displays the code corresponding to this error.

When it is confirmed that the mount frame 6 is attracted, the mount frame chuck arm 114 is raised (step 594). After the mount/frame chuck arm 114 is raised, check again whether the mount/frame 6 is attracted (step 595), and if it is not attracted, an error message X is displayed (step 592). When the suction of the mount frame 6 is confirmed, the pasting roller unit 90 and the peeling roller unit 92, which have moved to the pasting table 42, return to their original positions (origins) (step 896). For pasting, the roller unit 90 and peeling roller unit 92 return to their origin, and
The mount/frame chuck arm 114 that has attracted the mount frame 6 also moves toward the swing reversing unit 116 (step 898). Then, the mount flamecha, farm 114 is the swing reversal unit 1
After moving to the position where one end of the mount frame 6 is inserted into the clamp mechanism 118 of 16, check again that the mount frame 6 is attracted (step 599).
If it is not absorbed, an error message X is displayed (step 592).

When adsorption of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 5100).
. Then, it is confirmed whether the mount frame 6 is securely clamped (step 5102). This is due to the photoelectric element PH3 provided in the clamp mechanism 118.
The determination is made based on the detection signal of W7. If the mount frame 6 is not clamped, an error display XT is performed (step 5104), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error. do.

After confirming that the mount frame 6 is clamped, the swing reversing unit 116 swings approximately 180 degrees in the horizontal direction (Step 5106), and confirms that the mount frame 6 is clamped again (Step S).
107). If not clamped, error display XI
(Step S104). Mount frame 6
When the clamping is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 5108). Then, check once again whether the mount frame 6 is clamped (Step 5IO9), and if it is not clamped, an error message xr is displayed (Step 5104).

When the clamping of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the heat stage 126 (step 5llO). This is performed based on the detection signal of the photoelectric element PH3W8 provided on the heat stage 126. If there is another mount frame 6 on the heat stage 126, an error display X is displayed (step 5ill), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 indicates this error. Display the corresponding code.

When it is confirmed that there is no other mount frame 6 on the heat stage 126, the swing reversing unit 116 is lowered (step 5112), and when the mount frame 6 reaches the second part of the heat stage 126, the clamp mechanism 118 is lowered. Release (step 5113). With this, the mount frame 6 is attached to the heat stage 126.
will be moved to

Mount frame 6 transferred to heat stage 126
is heated here (step 5l14). This causes the adhesive tape on the mount frame 6 to contract, increasing the tape tension.

However, if such slack removal is not required, this step 5114 is omitted.

(Hereinafter, blank space) After heating the mount frame 6, the mount
Frame pushing mechanism 128 is activated to push out the mounting frame on heat stage 126 (step 5116). Then, it is confirmed whether the mount frame 6 has been pushed out from the heat stage 126 (step 5l18). This is determined based on the detection signal of the photoelectric element PH3W9 provided at the end of the heat stage 126. If the mount frame 6 has not been pushed out, an error message X is displayed (step 512).
0), the error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

The mount frame 6 pushed out from the heat stage 126 rides on a transport table 130 for transporting to the unloader section. Then, the photoelectric element PH3W10 provided on the transport table 130 confirms whether or not the mount frame 6 has been placed on the transport table 130 (step 5122). If the mount frame 6 is not placed on the transport table 130, an error message is displayed (step 3124) and the patrol light 1
Error indicator light 40 lights up and operation panel 1
38 7-segment LEDs display the code corresponding to this error.

If the mount frame 6 is not supported on the transport table 130, the mount frame 6 is transported to the unloader section and stored in the frame cassette 132 set in the unloader section (step 5126).
). When the photoelectric element provided in the unloader section detects that the mount frame 6 has been stored in the frame cassette 132, the unloader section moves up one pitch to accommodate the next mount frame 6. (step 3128).

As described above, after aligning the semiconductor wafer 2 supplied from the wafer loader section in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame car 43 and storing the mount frame 6 with the semiconductor wafer 2 attached to the frame car 43=set 132, are automatically performed.

Next, the suction detection section of the frame transport section, which is included in the automatic semiconductor wafer attachment apparatus according to this embodiment, will be explained in more detail.

If the frame transport unit does not adsorb the frame enough,
During pasting, the frame is no longer conveyed to the table, and the series of pasting operations of this device are hindered.

Therefore, the adhesion detection function of the frame transport section is important in an apparatus for automatically attaching two consecutive semiconductor wafers.

By the way, as is clear from the explanation of the embodiments mentioned above,
A frame conveyance section that suction-holds the aligned frame 4 with a vacuum chuck and conveys it from the frame positioning section 62 to the pasting table 42 corresponds to the frame chuck arm 72 in the embodiment. Further, the pressure detection means of the adsorption detection section that detects whether or not the frame transport section is adsorbing the frame 4 corresponds to the pressure switch PUSW3 in the embodiment, and is based on the detection signal of the pressure detection means 44. The error determining means for determining a frame suction error in the frame transport section corresponds to the control section 142 in the embodiment. The operation of the adsorption detection section corresponds to step 560 and step 365 in the operation flowchart explained in FIG. 12.

Next, the more specific operations of the adsorption detection unit performed in step 60 and step S65 will be described in the fifteenth section.
This will be explained based on the diagram.

Assume that the solenoid valve VL3 provided in connection with the vacuum chuck of the frame chuck arm 72 is activated, and the frame chuck arm 72 starts suctioning the frame 4 (
Step 858 shown in FIG. 12). At the same time as the solenoid valve VL3 operates, the CPU of the control section 142 shown in FIG.
144 is cleared (step S6
0. ).

Then, the pressure switch PUS is used to check whether or not the frame chuck arm 72 has attracted the positioned frame 4.
Judgment is made based on the detection signal of W3 (step S60□
). When the frame chuck arm 72 is suctioning the frame 4, the pressure inside the vacuum chuck decreases.
Pressure switch PUSW3 is turned on.

If the pressure switch PUSW3 is not in the ON state, it is checked whether the timer has completed the quim over (step 5603). This is done in consideration of the waiting time since it takes a considerable amount of time for the pressure inside the vacuum chuck of the frame chuck arm 72 to become low after the electromagnetic valve VL3 is activated. Therefore, if the time has not exceeded, the process returns to step S60°. On the other hand, if the time has elapsed, the positioned frame 4
However, it is determined that the frame/chuck arm 72 has not been attracted to the frame/chuck arm 72 for some reason, and an error display (2) is performed (step 562).

In step S60□, when it is confirmed that the frame chuck arm 72 has attracted the frame 4, the first
Proceeding to step S64 described in FIG. 2, the frame chuck arm 72 is raised. Then, it is detected once again whether or not the frame chuck arm 72 is sucking the frame 4 (step 565). however,
In this step S65, the above-described waiting time is not taken into account, and the presence or absence of adsorption of the frame 4 is immediately checked from the detection signal of the pressure switch PUSW3. This is because the frame chuck arm 72 adsorbs the frame 4 in step S58 and step S60.
This is because the vacuum chuck of the chuck arm 72 is supposed to be under low pressure.

If an error in adsorption of frame 4 is detected in this step S65, an error display ■ is performed (step 562). On the other hand, when it is confirmed that the frame 4 is suctioned, the frame chuck arm 72 moves toward the attachment table 42 (step 866).

Note that since the adsorption confirmation of the frame 4 in step 365 described above is performed just to be sure, automatic attachment of the semiconductor wafer according to this embodiment is not necessarily required in the apparatus.

Next, we will briefly explain the recovery process that is performed when an error occurs in the automatic attachment of semiconductor wafers according to the above-described embodiment.

When any of the above-mentioned errors occurs, each mechanical section that is a process subsequent to the location where the error occurs continues its operations and stops after completing its respective operation cycle. On the other hand, the location where the error occurred and each mechanical section corresponding to the preceding process stop when the error occurs. Based on the above-mentioned error display, the operator takes appropriate measures such as removing the workpiece (for example, the semiconductor wafer 2 or the frame 4) where the error has occurred or correctly inserting the cassette. Then, each mechanical section corresponding to the process preceding the error occurrence point is returned to its origin, and the apparatus is restarted.

Note that the display mode indicating a frame suction error in the frame transport section is not limited to that described in the embodiment, and may be modified in various ways such as a buzzer display.

Furthermore, it goes without saying that the apparatus for automatically attaching semiconductor wafers according to the present invention is not limited to the apparatus described in the embodiments.

<Effects of the Invention> As is clear from the above description, the apparatus for automatically attaching semiconductor wafers according to the present invention suction-holds the frame positioned by the frame positioning section with a vacuum chuck and conveys it to the table for attaching. In relation to the frame conveyance section, it includes a pressure detection means for detecting a pressure change in the vacuum chuck, and an error determination means for determining a frame suction error in the frame conveyance section based on a detection signal of the pressure detection means. ing.

Therefore, according to the present invention, if the frame is not attracted to the frame conveyance unit due to some abnormality, the operator can know the occurrence of the abnormality in the semiconductor wafer automatic attaching apparatus and the location thereof. Since this allows appropriate measures to be taken quickly, automatic semiconductor wafer attachment is very convenient for improving the operating efficiency of the apparatus.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing the overall configuration of a semiconductor wafer automatic pasting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration of the semiconductor wafer alignment section and the surrounding area of the reversing fork in the embodiment. FIG. 3 is a configuration diagram of the orientation flat end detection section in the above embodiment, and FIG.
The figure is a block diagram of the frame loader section and the surroundings of the frame positioning section in the embodiment, FIG. 5 is a block diagram of the frame transport section and its periphery in the embodiment, and FIG. 6 is the adhesive tape supply system and the adhesive tape in the embodiment. FIGS. 7 and 8 are diagrams illustrating the configuration and operation of the pasting roller unit 1- and the peeling roller unit in the above embodiment. FIG. 9 is a diagram showing the configuration around the heat stage in the embodiment. , FIG. 10 is an explanatory diagram of the semiconductor wafer, frame, and mount frame used in the embodiment, FIG. 11 is a block diagram schematically showing the configuration of the control system in the embodiment, and FIG. 12 is a diagram illustrating the configuration of the control system in the embodiment. FIG. 13 is an explanatory diagram of the orientation flat alignment in the above embodiment; FIG. 14 is an operational flowchart of the example;
15 is a flowchart of the operation for orientation flat positioning in the embodiment, and FIG. 15 is a flowchart of a specific operation for detecting a frame adsorption error of the frame chuck arm in the embodiment. 2... Semiconductor wafer, OF... Orientation flat, 4... Frame, 6... Mount frame, 8... Wafer cassette, 14... Half 1 wafer positioning section, 20...・To alignment 1・Table, 24...Pulse motor, 32...Orientation flat end detection section, 40...Reversing fork, 4
2... Paste on table, 48... Wafer/chuck table, 50... Frame/chuck table, 5
4... Frame loader section, 62... Frame positioning section, 72... Frame chuck arm, 82...
...Adhesive tape, 90...Pasting is done using a roller unit, 9
2... Peeling roller unit, 108... Adhesive tape cutting machine! , 114... Mount frame chuck arm, 116... Swing reversing unit, 118...
・Clamp mechanism, 126... Heat stage, 128
...Mount = 51-Mount/frame extrusion mechanism, 130...Transportation table, 132...Frame cassette I, 138...
Operation panel, 140... Patrol light, 142... Control unit, 144-CPU, PH3WI ~ PH3WI 1-.
- Photoelectric element, PUSW1 to PUSW5...pressure switch.

Claims (1)

[Scope of Claims] An automatic semiconductor wafer affixing device for aligning and affixing a semiconductor wafer with an orientation flat to an adhesive tape, comprising: a frame for holding the adhesive tape to which the semiconductor wafer is affixed; a frame positioning section for pre-positioning; a pasting table for pasting the semiconductor wafer onto an adhesive tape; a vacuum chuck holding the frame positioned by the frame positioning section, and transporting the frame from the frame positioning section to the pasting table. The frame transport unit includes a suction detection unit that detects whether or not the frame transport unit is suctioning the frame, and the suction detection unit detects a pressure change in a vacuum chuck provided in the frame transport unit. 1. An automatic semiconductor wafer pasting apparatus, comprising: a pressure detection means for detecting the pressure; and an error discrimination means for discriminating a frame suction error of the frame transport section based on a detection signal of the pressure detection means.