JPH02108805U - - Google Patents
Info
- Publication number
- JPH02108805U JPH02108805U JP1665989U JP1665989U JPH02108805U JP H02108805 U JPH02108805 U JP H02108805U JP 1665989 U JP1665989 U JP 1665989U JP 1665989 U JP1665989 U JP 1665989U JP H02108805 U JPH02108805 U JP H02108805U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- taping device
- adhesive
- treating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Description
第１図はこの考案の一実施例であるテーピング
装置の全体構成を示す説明図、第２図ａはＳＯＰ
ＩＣ１の平面図、第２図ｂは第２図ａのＡ―Ａ
線における断面図、第３図ａは粘着式テープ４を
示す平面図、第３図ｂは第３図ａのＢ―Ｂ線にお
ける接着されたＳＯＰ ＩＣを示す断面図、第４
図は従来のテーピング装置の全体構成を示す説明
図である。
図において、１はＳＯＰ ＩＣ、２ａはＳＯＰ
ＩＣの接着面、３は粘着式テープ、４は粘着テ
ープ、９は水素バーナ等加熱処理部、１０は水素
ボンベを示す。なお、図中、同一符号は同一、又
は相当部分を示す。
Figure 1 is an explanatory diagram showing the overall configuration of a taping device that is an embodiment of this invention, and Figure 2a is an SOP.
Plan view of IC1, Figure 2b is A-A in Figure 2a
3a is a plan view showing the adhesive tape 4; FIG. 3b is a sectional view taken along line BB in FIG. 3a; FIG.
The figure is an explanatory diagram showing the overall configuration of a conventional taping device. In the figure, 1 is SOP IC, 2a is SOP
The adhesive surface of the IC, 3 is an adhesive tape, 4 is an adhesive tape, 9 is a heat treatment section such as a hydrogen burner, and 10 is a hydrogen cylinder. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ーピング装置において電子部品の粘着式テープと
の接着面を熱処理する機能をそなえた事を特徴と
するテーピング装置。 A taping device for storing surface-mounted electronic components on an adhesive tape, characterized in that the taping device has a function of heat-treating the adhesive surface of the electronic component to the adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (en) | 1989-02-15 | 1989-02-15 | Taping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (en) | 1989-02-15 | 1989-02-15 | Taping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108805U true JPH02108805U (en) | 1990-08-29 |
| JPH0718566Y2 JPH0718566Y2 (en) | 1995-05-01 |
Family
ID=31229780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989016659U Expired - Lifetime JPH0718566Y2 (en) | 1989-02-15 | 1989-02-15 | Taping device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718566Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155642A (en) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | Automatic sticking system for semiconductor wafer |
| JPS63258717A (en) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | Taping device for fuse clip |
-
1989
- 1989-02-15 JP JP1989016659U patent/JPH0718566Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155642A (en) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | Automatic sticking system for semiconductor wafer |
| JPS63258717A (en) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | Taping device for fuse clip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0718566Y2 (en) | 1995-05-01 |
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