JPH03112969U - - Google Patents
Info
- Publication number
- JPH03112969U JPH03112969U JP2044790U JP2044790U JPH03112969U JP H03112969 U JPH03112969 U JP H03112969U JP 2044790 U JP2044790 U JP 2044790U JP 2044790 U JP2044790 U JP 2044790U JP H03112969 U JPH03112969 U JP H03112969U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- inner layer
- layer pattern
- electronic component
- packaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の説明図、第２図は
第１図の部分の詳細説明図、第３図は従来の装
置の説明図である。
１……内層パターン、２……電子回路配線板、
３……ワイヤ、４……電子部品、５……パツケー
ジ、６……外部部品、７……リード線。
FIG. 1 is an explanatory diagram of an embodiment of the present invention, FIG. 2 is a detailed explanatory diagram of the portion shown in FIG. 1, and FIG. 3 is an explanatory diagram of a conventional device. 1...Inner layer pattern, 2...Electronic circuit wiring board,
3...Wire, 4...Electronic component, 5...Package, 6...External component, 7...Lead wire.
Claims (1)
同配線板上に設けられ上記内層パターンに接続さ
れパツケージングされた電子部品を備えたことを
特徴とする電子部品装置。 An electronic component device comprising: an electronic circuit wiring board having an inner layer pattern; and an electronic component provided on the wiring board, connected to the inner layer pattern, and packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2044790U JPH03112969U (en) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2044790U JPH03112969U (en) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112969U true JPH03112969U (en) | 1991-11-19 |
Family
ID=31523538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2044790U Pending JPH03112969U (en) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112969U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5839071B2 (en) * | 1978-08-25 | 1983-08-27 | 日本電産コパル株式会社 | wire dot print head |
| JPS5999752A (en) * | 1982-11-29 | 1984-06-08 | Toshiba Corp | Hybrid integrated circuit device |
| JPS6042765B2 (en) * | 1977-06-27 | 1985-09-25 | ドラゴコ・ゲルベルデインク・アンド・コムパニ−・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | Bacterial growth inhibition methods and bacteriostatic agents |
| JPS61268049A (en) * | 1985-05-23 | 1986-11-27 | Nec Corp | Mounting structure of package for lsi |
-
1990
- 1990-03-02 JP JP2044790U patent/JPH03112969U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042765B2 (en) * | 1977-06-27 | 1985-09-25 | ドラゴコ・ゲルベルデインク・アンド・コムパニ−・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | Bacterial growth inhibition methods and bacteriostatic agents |
| JPS5839071B2 (en) * | 1978-08-25 | 1983-08-27 | 日本電産コパル株式会社 | wire dot print head |
| JPS5999752A (en) * | 1982-11-29 | 1984-06-08 | Toshiba Corp | Hybrid integrated circuit device |
| JPS61268049A (en) * | 1985-05-23 | 1986-11-27 | Nec Corp | Mounting structure of package for lsi |