JP4612453B2 - Method and apparatus for applying tape to wafer - Google Patents

Description

  The present invention relates to a sticking method and a sticking apparatus for sticking various tapes to a wafer, and more specifically, reducing the running cost of the tape when sticking various tapes to the wafer, and reducing the tension when sticking the tape. In addition, the present invention relates to a method and an apparatus that can be attached without bubbles or the like under vacuum.

  In the manufacturing process of a semiconductor product, a semiconductor wafer having a large number of circuit patterns formed on its surface is used, and this wafer is cut into individual functional elements (dicing process) to form individual semiconductor chips (die). In general, after a chip is mounted on and fixed to a die pad (die bonding process), wire bonding or the like is performed to complete a product such as an IC or LSI.

  In the manufacturing process of the semiconductor product using the wafer, as shown in FIGS. 19A to 19D, various tape affixing operations are performed on the wafer as necessary.

1) Protective tape (Fig. 19 (a))
As protection during grinding (back grinding) of the back surface of the wafer 1, a protective tape 3 is attached to the front surface of the wafer 1 (surface on which the circuit pattern 2 is formed). In order to attach the protective tape 3 to the wafer 1, a roll-shaped wide protective tape 3 is supplied onto the wafer 1, and the protective tape 3 is applied to the surface of the wafer 1 by pressing and rolling the application roller, and then the wafer 1. The protective tape 3 is cut out along the outer periphery.

  However, with the recent miniaturization of semiconductor chips, the thickness of the wafer 1 has been reduced, and when the tension when the protective tape 3 is applied is too strong, the wafer is caused by the residual stress when the protective tape 3 is applied. 1 could be warped or damaged.

  In addition, with the recent increase in the density of semiconductors, wafers having bumps with large irregularities formed on the surface of wafers and wafers with large irregularities on the surface such as MEMS (microelectromechanical system) are increasing. When a protective tape is applied to the wafer in the air, there is a problem that air bubbles easily enter, and application under vacuum is required.

  For this reason, a protective tape is sandwiched between an upper chamber and a lower chamber, the inside of the vacuum chamber is evacuated, and affixed to the wafer surface using a differential pressure (for example, Patent Document 1).

2) Die attach film (Figure 19 (b))
A die attach film 4 (hereinafter referred to as DAF 4) for bonding a die is attached to the back surface (polished surface) of the wafer 1. In order to attach the DAF 4 without bubbles, as in the case of the protective tape 3 in 1) above, the DAF 4 is sandwiched between the chambers and attached using a differential pressure under vacuum (for example, Patent Documents). 2).

3) Dicing tape (Fig. 19 (c))
The back surface (polished surface) of the wafer 1 is affixed to a dicing frame 6 (hereinafter referred to as D / C frame 6) via a dicing tape 5 (hereinafter referred to as D / C tape 5). The following two methods are used.
(i) After the D / C frame 6 and the D / C tape 5 are bonded together, the back surface of the wafer 1 and the D / C tape 5 are bonded in a vacuum chamber and integrated with the D / C frame 6.
(ii) The D / C tape 5 is attached to the D / C frame 6 and the back surface of the wafer 1 at the same time, and the D / C tape 5 is cut along the D / C frame 6.

4) Double-sided tape (for support substrate) (FIG. 19 (d))
The support substrate 8 or the like may be attached via a removable double-sided tape 7 instead of the protective tape 3 in 1) above. In this case as well, the protective tape is applied when the removable double-sided tape 7 is applied. As in the case of attaching 3, a technique of attaching in a vacuum using a vacuum chamber is used so that bubbles do not enter.

JP 60-80249 A JP 2004-281534 A

  The above-described various tape application processes have the following problems.

1) Protective tape When the vacuum chamber method is applied to the conventional method, it is necessary to perform the pasting operation with the rear end of the tape sandwiched between the chambers, and it is not possible to adjust the tension by applying a back tension to the tape. Wafer warpage and breakage could not be prevented.

  Also, in order to perform automatic attachment under vacuum, it is necessary to pinch the tape in the chamber, and there is a lot of tape loss, and the adhesive sticks to the chamber at the tape pinching position. Since the affixing operation is performed in this state, there is a problem in that there is a lot of air leakage in this part and the vacuum level does not increase.

2) DAF
In the case of DAF, as in the case of protective tape, in order to perform automatic attachment under vacuum, it is necessary to sandwich the tape in the chamber, and there is a problem that there is a lot of tape loss, and the state where the tape is sandwiched in the vacuum chamber remains Because of the work, there was a problem that there were many leaks and the degree of vacuum did not increase.

  Furthermore, since pasting of the conventional method requires sandwiching the tape in the chamber, the thermoplastic DAF that requires heat pasting cannot absorb the expansion and contraction of the DAF due to heat storage in the chamber, and the DAF is wrinkled. There was a problem that it was impossible to paste with high accuracy.

3) D / C tape In the method (i) above, since the periphery of the D / C tape is fixed to the D / C frame, when a D / C tape requiring heating is applied, the heat is accumulated in the chamber. There was a problem that the D / C tape was wrinkled due to expansion / contraction of the D / C tape and could not be attached with high accuracy.

4) Double-sided tape (for support substrate)
In the case of double-sided tape as well, it is necessary to perform the affixing operation in a vacuum chamber in order to affix without air bubbles. At this time, since the rear end of the tape is sandwiched between the chambers, the tension cannot be adjusted as with the protective tape 3. In addition, there are problems that the tape is lost, the adhesive adheres to the chamber, and the degree of vacuum does not increase during the pasting operation.

The invention of claim 1 for solving the above-mentioned problems is applied by pressing a wide tape supplied immediately above the wafer positioned and supplied on the suction table onto the wafer by pressing and rolling the sticking roll, Thereafter, in the tape affixing method to the wafer, in which the tape is cut into the outer shape of the wafer, a plurality of the upper surface is provided at a position sandwiching the suction table and the upper surface is substantially the same height as the upper surface of the suction table and can be moved up and down. Using a tape support plate, the wide tape drawn directly above the suction table on which the wafer is placed is affixed to a plurality of tape support plates at the raised position, and then cut at a position outside the tape support plate. the tape support plate affixed to the suction table and the tape placing the wafer on the vacuum state in the vacuum chamber, with a joining roller under vacuum conditions During the biasing operation is obtained by adopting a configuration in which Ru is independently lowered moving with each tape supporting plate to the progress of the application roller.

Similarly, the invention of claim 2 is affixed by pressing a wafer, which is positioned and supplied on the suction table, and a wide dicing tape, which is supplied immediately above the dicing frame, onto the wafer and the dicing frame by pressing and rolling the sticking roll. In the method of attaching the dicing tape to the wafer, after which the dicing tape is cut along the dicing frame,
A suction table on which a wafer and a dicing frame are mounted, using a plurality of tape support plates that are provided at least at a position sandwiching the suction table and whose upper surface can move up and down between substantially the same height as the upper surface of the suction table. A wide-width dicing tape pulled out directly above and fixed to a plurality of tape support plates in the raised position, and then cut at a position outside the tape support plate, and a suction table on which the wafer and dicing frame are placed; The tape support plate with the dicing tape attached is evacuated in the vacuum chamber, and when applying the application using the application roller under vacuum conditions , each tape support plate is moved down independently as the application roller advances. The configuration is adopted.

Similarly, the invention of claim 3 is the tape application method to the wafer according to claim 1 or 2, wherein the application operation is performed while moving at least one tape support plate in a direction in which the tension applied to the tape is relaxed during the application operation. The structure which performs is adopted.

Similarly, the invention of claim 4 is a suction table for sucking and holding the wafer on the upper surface, a tape feeding mechanism for supplying a wide tape just above the wafer on the suction table, and pressing the tape against the wafer on the suction table. In a tape sticking device to a wafer consisting of a sticking roll that rolls and a tape cutter that cuts the tape attached to the wafer into the outer shape of the wafer, a plurality of devices are provided at least at positions where the suction table is sandwiched, and sucked separately. A tape support plate that can move up and down between approximately the same height as the upper surface of the table, a chuck unit that clamps the end of the wide tape and draws it onto the tape support plate, and is attached to the tape support plate A cutting mechanism that cuts the subsequent tape at a position outside the tape support plate, a suction table, a tape support plate, and a sticking roller. It is obtained by employing the configuration in which a vacuum chamber that allows a patch work under vacuum and.

Similarly, the invention of claim 5 is a suction table for sucking and holding the wafer and the dicing frame on the upper surface, a tape feeding mechanism for sequentially supplying a wide dicing tape to the wafer and the dicing frame on the suction table, and a suction table. 2. Description of the Related Art In a dicing tape affixing device for a wafer comprising an affixing roll for pressing a dicing tape against a wafer and a dicing frame and a tape cutter for cutting the dicing tape affixed to the dicing frame along the dicing frame, at least the suction table is sandwiched. A tape support plate, which is provided in multiple positions, and can be moved up and down between approximately the same height as the top surface of the suction table and a higher position, and the end of the wide dicing tape is clamped on the tape support plate. A chuck unit to be pulled out A cutting mechanism that cuts the wide dicing tape after being attached to the tape support plate at a position outside the tape support plate, a suction table, a tape support plate, and a sticking roller can be housed to perform sticking work in a vacuum state. A configuration provided with a vacuum chamber is adopted.

Similarly, the invention of claim 6 relates to the tape affixing device for a wafer according to claim 4 or 5, wherein the tension is made movable so as to relieve the tension applied to the tape when the tape is applied to at least one tape support plate. A configuration provided with a device is adopted.

According to the present invention, the chuck pull-out method is adopted, and the tape after being attached to the tape support plate is cut, so that only the minimum necessary tape can be supplied into the vacuum chamber. The part that cannot be used due to the sandwiching of the chamber is eliminated, and the tape application in the vacuum chamber can be automated while reducing the running cost of the tape.

Further, since it is not necessary to sandwich the tape in the upper and lower chambers of the vacuum chamber, it is not necessary to process the adhesive attached to the chamber, and it is possible to increase the vacuum degree of the vacuum chamber.

Furthermore, since the tape can be applied in the vacuum chamber, the tape can be applied with high accuracy by increasing the degree of vacuum even for wafers having large surface irregularities such as MEMS.

Conventionally, after the D / C tape and the D / C frame are bonded together, the D / C frame and the wafer are bonded together in the vacuum chamber. It is possible to apply at the same time, and simultaneous application in a vacuum chamber is also possible.

For the tape support plates that can move at least one of the tape support plates by the tension relaxation mechanism when the tape is applied to the wafer, the distance between each tape support plate can be changed. It is possible to attach the wafer to the wafer while reducing the residual stress at the time of attachment (rotation), thereby preventing the wafer from being warped or damaged.

In addition, even in the case of using a thermoplastic tape in DAF etc., the tape expansion and contraction associated with the heat storage of the device is absorbed by the tension relaxation mechanism of the tape support plate, and can be attached without wrinkles. Even in a vacuum chamber, it becomes possible to perform accurate pasting without wrinkles.

In addition, the tension applied to the D / C tape that is attached can be absorbed by the tension relaxation mechanism of the tape support plate, and the wafer can be made low tension, and even the thermoplastic D / C tape is wrinkled. It became possible to paste without letting.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the illustrated examples. The same parts as those described in the background art will be described with the same reference numerals.

  FIGS. 1 to 10 show a method and apparatus for attaching a protective tape 3 to a wafer 1 as an example of a method and apparatus for attaching a tape to a wafer according to the present invention. FIG. 1 is a plan view showing the overall structure of the apparatus. The wafer storage unit 11 before bonding that stores the wafers 1 before bonding on the machine base 10 in upper and lower stages, the alignment unit 12 that aligns the supplied wafer 1, and two support frames 13, a tape attaching mechanism for attaching the protective tape 3 to the wafer 1 after alignment, an attached wafer storage portion 14 for storing the attached wafer 1 ′, an alignment portion 12 and a tape from the pre-attachment wafer storage portion 11 A sticking mechanism and a transfer robot 15 that sucks and sequentially transfers the wafer 1 to the stuck wafer storage unit 14 are provided.

  The alignment unit 12 is not particularly shown in detail in its structure, but includes an adsorption rotary table 16 that can move up and down and rotate, and a sensor unit 17 disposed on the outer periphery of the adsorption rotary table 16. The suction rotation table 16 sucks and supports the wafer 1 taken out from the pre-bonding wafer storage unit 11 by the transfer robot 15 and then rotates to detect the notch 9 formed on the wafer 1 by the sensor unit 17. Then, the wafer 1 is positioned.

  Among the tape applying mechanisms, the tape feeding mechanism for supplying the tape to the wafer is located at the upper part between the support frames 13 and 13, as shown in FIG. 1 and FIG. A tape supply reel 18 around which the wide roll type protective tape 3 is wound, a pair of guide rollers 19 for guiding the protective tape 3 downward from the tape supply reel 18, and a peeling roller for peeling the release sheet 20 from the protective tape 3 21, a guide roller group 22 for guiding the peeled release sheet 20 downward, a release sheet take-up reel 23 for winding the release sheet 20, and the protective tape 3 from which the release sheet 20 has been peeled down The lower side guide roller 24 to be guided, and the upstream side tape chuck unit which is movable by appropriate means in parallel with the inclined traveling path of the tape moving between the peeling roller 21 and the lower level guide roller 24. A knit 25 and a downstream side tape chuck unit 26 that is positioned in front of the lower guide roller 24 and that can be moved back and forth back and forth in a horizontal direction on the tape applying portion by appropriate means.

Upstream tape chuck unit 25 is provided so as to be reciprocated by a suitable drive source along a rail 27 provided on the inclined slant to the inner surface of the opposite of the support frame 13, the upstream-side tape chuck unit 25 Is a roller 28 that has been subjected to a non-adhesive treatment to receive the lower surface that is the adhesive surface of the protective tape 3, and can be moved forward and backward by a cylinder 29 with respect to the roller 28 from above the protective tape 3. By forming the tape chuck 30 to be sandwiched and moving from the upper original position shown by the solid line in FIG. 2 to the lower forward position of the two-dot chain line in FIG. 2, the protective tape 3 is pulled out by the moving stroke.

  The downstream tape chuck unit 26 includes a lower tape chuck 32 that reciprocates a fixed stroke horizontally with an appropriate driving source between rails 31 provided on the inner surfaces of the support frames 13 and 13 in the horizontal direction. It is located in front of the lower tape chuck 32 and can move back and forth horizontally with a fixed stroke by a driving source, and can move back and forth by a vertical movement by a cylinder 34 or the like and a fixed stroke by a driving source. The upper tape chuck 35 that holds the protective tape 3 between the lower tape chuck 32 and the upper tape chuck 35 is disposed so as to move up and down integrally with the upper tape chuck 35. The cutter blade 36 is movable in the width direction of the tape orthogonal to the tape.

  Of the tape attaching mechanism, the protective tape 3 is attached to the wafer 1 in a vacuum chamber comprising a pair of lower chamber 37 and upper chamber 38 that can be opened and closed.

  A circular suction table 39 that holds the wafer 1 with the wafer 1 facing upward is provided on the upper surface in the lower chamber 37, and is moved up and down by the action of the cylinder 40 to a position immediately below the center of the suction table 39. Wafer lifting pins 41 that lift the wafer 1 when the wafer 1 is taken out from the suction table 39 by protruding from the upper surface of the suction table 39 are provided.

  In addition, tape support plates 42 and 43 for supporting the protective tape 3 immediately before being attached to the wafer 1 are provided at positions in the front and rear direction of the tape so as to sandwich the suction table 39, and these tape support plates 42 are provided. , 43 can be moved up and down independently by drive units 44, 45 at the lower part thereof to a position where the upper surface thereof is slightly raised from substantially the same height as the upper surface of the suction table 39, respectively.

  The lower chamber 37 is fixed to a guide member 47 that moves on a rail 46 provided in the tape running direction, and is a nut that is provided in parallel with the rail 46 and screwed into a ball screw 49 that is reversibly rotated by a motor 48. Since the member 50 is fixed to the guide member 47, the lower chamber 37 can be moved from the original position just below the upper chamber 38 to the advanced position along the tape running direction and the slightly retracted position as the motor 48 rotates. It has become.

  A sticking roller 51 having an axis parallel to the tape width direction and capable of moving up and down and retreating along the tape running direction in order to press and attach the protective tape 3 to the wafer 1 on the lower surface in the upper chamber 38. A vacuum adapter 52 is connected as a passage for air for evacuating the chamber and returning to atmospheric pressure.

  The upper chamber 38 moves up and down by the expansion and contraction operations of the lifting cylinder 53 and the opening / closing cylinder 54 provided on the support frame 13, overlaps with the lower chamber 37 at the original position in the lowest position, and is surrounded by the upper and lower chambers. The inside is sealed, and in this state, the air is drawn through the vacuum adapter 52 through an appropriate suction source (not shown) to be in a vacuum state.

  In front of the upper chamber 38 in the tape feeding direction, directly above the most advanced position of the lower chamber 37, the protective tape 3 attached to the wafer 1 attracted to the suction table 39 in the lower chamber 37 is attached to the outer shape of the wafer 1. A tape cutter mechanism 55 that cuts into a shape is provided.

  The tape cutter mechanism 55 includes an elevating cylinder 56 fixed to the support frame 13, a rail 57 provided on the support frame 13 so as to extend in the vertical direction, and a cylinder shaft of the elevating cylinder 56 that is movable up and down along the rail 57. And a tape cutter 60 that rotates along the outer shape of the wafer 1 by a drive motor 59 attached to the guide member 58.

  The tape cutter mechanism 55 moves along the rail 46 and is driven by the action of the lifting cylinder 56 after being lowered with respect to the protective tape 3 attached to the wafer 1 in the lower chamber 37 that has reached the most advanced position. The tape cutter 60 rotates along the outer shape of the wafer 1 by driving the motor 59, and the wide protective tape 3 is cut out in the shape of the wafer 1.

The affixed wafer 1 'to which the protective tape 3 cut out in the shape of the wafer 1 is attached is in the state shown in FIG. 19A, and is then accommodated in the affixed wafer storage unit 14 by the transfer robot 15, and is then attached to the tape support plate. 42 and 43 to the sticky remainder of the protective tape 3 was cut out into a wafer shape (waste Tepukasu 3 ') has a vertical movement and forward and backward movement and the rotary shaft 61 can rotate around an axis, the effect of sandwiching the tape It is housed in a tape disposal box 63 by a disposal tape chuck 62 having a chuck portion and a non-adhesive treatment.

  Details of the suction table 39 and the tape support plates 42 and 43 in the lower chamber 37 are added with the plan view of FIG. 3, the partially cut left side view of FIG. 4, and the partially cut right side view of FIG. explain.

  The suction table 39 provided in the lower chamber 37 is a porous suction member in which a portion supporting the wafer 1 is connected to a suction table suction hose 64 serving as a suction source. The vacuum adapter 52 connected to the upper chamber 38 is connected to another suction source, and a stronger negative pressure than the vacuum adapter 52 is applied to hold the wafer 1 by suction even when the chamber is evacuated. Yes.

  The tape support plate 42 is attached via a tension relaxation mechanism 68 to a lift plate 69 attached to the upper end of the shaft 65 of the drive unit 44 that moves up and down by appropriate means such as a cylinder or a pulse motor. The tape support plate 43 is directly attached to the upper end portion of the shaft 66 of the drive unit 45 that moves up and down by appropriate means such as a cylinder or a pulse motor.

  In addition, air leakage is prevented around the shafts 65 and 66, the wafer lifting pins 41, and the like by appropriate sealing members.

  The lift plate 69 and the tape support plate 43 to which the tape support plate 42 is attached are supported at both ends by a guide 67 that guides the lift motion, and ensures a smooth lift motion. And 43 can be moved up and down independently by drive units 44 and 45.

  These drive units 44 and 45 may be those that give up and down movement controlled by a pulse motor or the like, or cylinders that give down movement at an adjusted predetermined speed.

  The tension relief mechanism 68 provided on the tape support plate 42 on the front side in the tape traveling direction is opposite to the pressing and rolling direction of the application roller 51 (in the drawing, the tape feed direction in order to reduce the tension applied to the tape during tape application). In the opposite direction, the tape support plate 42 can be moved horizontally by a small distance with respect to the lift plate 69, and the tape support plate 42 can be moved in the horizontal direction using an appropriate cushioning material such as a spring, or The tape support plate 42 is moved while controlling the tension or forcibly using a simple drive unit.

  On the other hand, the tape support plate 43 on the rear side is provided with a notch 70 in the vicinity of the center for the above-mentioned waste tape chuck 62 to sandwich the waste tape residue 3 '.

  Note that a seal member 71 for preventing air leakage is provided at a portion of the upper surface portion of the lower chamber 37 that is joined with the lower surface portion of the upper chamber 38.

  As described above, the tape support plates 42 and 43 in the lower chamber 37 have been described. However, the tape support plate in the present invention is not limited to this embodiment, and three or more tape support plates may be used. Various shapes and arrangements may be employed for the tape support plate.

  When the apparatus of this embodiment is used and a thermoplastic tape is used, not only the application operation of the application roller 51 but also the entire tape expands and contracts with heating, but the expansion and contraction in the feed direction of the tape is illustrated. The tension relaxation mechanism 68 absorbs the tape, and the expansion and contraction in the width direction of the tape is free without sticking the side edges at both ends of the tape width to the tape support plate. Since the portions attached to the support plates 42 and 43 are located away from the circular wafer 1, no problem occurs.

  However, in order to ensure complete absorption of tape expansion and contraction, for example, a tension relaxation mechanism that divides the tape support plates 42 and 43 with an interval near the central portion in the tape width direction and changes the interval between the divided one and the other. May be incorporated.

  Next, a mechanism for moving the upper chamber 38 up and down will be described with reference to FIG. 6 in the direction of arrows VI-VI in FIG. 1. The lift cylinder 53 fixed to the support frame 13 and the support frame 13 extend in the vertical direction. Rail 72, a guide member 74 that is attached to a slider 73 that is movable up and down along the rail 72, and that moves up and down as the cylinder shaft of the elevating cylinder 53 expands and contracts, and is attached to the guide member 74. The upper chamber 38 is attached to the lower end of the cylinder shaft 75 of the open / close cylinder 54, and the upper chamber 38 is smoothly raised and lowered with respect to the guide member 74 by a plurality of guides 76 provided between the guide member 74 and the upper chamber 38. I try to get a move.

  The upper chamber 38 moves downward to the lowermost end and is combined with the lower chamber 37 directly below to form a vacuum chamber.

  Further, rails 92, 92 extending horizontally in the support frames 13, 13 are provided in front of the upper chamber 38 in the tape feeding direction, and sliders 93, 93 are fitted to the rails 92, 92, respectively. Rails 94 extending in the vertical direction are connected to the sliders 93, sliders 95, 95 are fitted to the rails 94, 94, and both ends of the guide member 96 are connected to the sliders 95, 95. A waste tape chuck 62 is attached to the center of the guide member 96 via a rotating shaft 61.

  The horizontal movement of the slider 93 along the rail 92, the vertical movement of the slider 95 along the rail 94, the rotation operation of the disposal tape chuck 62 around the rotation shaft 61, and the chucking operation of the disposal tape chuck 62 are as follows. The waste tape chuck 62 can be moved forward and backward, moved up and down, rotated, and chucked by the tape. Yes.

  Next, the downstream side tape chuck unit 26 will be described with reference to the plan view of FIG. 7 and the left side view of FIG. 8 (viewed along arrows VIII-VIII). 35 and the cutter blade 36 are provided on a moving body 78 connected to sliders 77 and 77 fitted to rails 31 and 31 provided on both support frames 13, and the moving body 78 is appropriately driven. Thus, it can move along the rail 31.

  The upper tape chuck 35 is integrated with sliders 80, 80 fitted to the rails 79, 79 that are provided on both sides of the moving body 78 toward the inner surface and extend in the vertical direction. The cutter blade 36 is provided integrally with a cutter unit 82 that is appropriately moved by a driving means along a rail 81 extending in the tape width direction on the upper surface of the upper tape chuck 35. The affixing roller 33, the upper tape chuck 35, and the cutter blade 36 are moved together by the movement of the moving body 78 in the tape feeding direction, and the upper tape chuck 35 and the cutter blade 36 are moved up and down by the action of the cylinder 34. In addition, the cutter blade 36 moves in the tape width direction according to the movement of the cutter unit 82.

  The lower surface of the upper tape chuck 35 is provided with a plurality of suction pads 83 for sucking and holding the protective tape 3 as required.

  On the other hand, the lower tape chuck 32 is subjected to non-adhesive treatment on the upper surface, and a slider 85 fitted to a rail 84 provided in parallel to the lower side of the rail 31 to which the slider 77 of the moving body 78 of both support frames 13 is fitted. And can be moved by appropriate means in the tape feeding direction independently of the moving body 78.

  Further, a cutter groove 86 is provided on the upper surface of the tip of the lower tape chuck 32 so as to release the cutting edge of the cutter blade 36 when it is lowered and traversed in the tape width direction.

  Next, the details of the upper chamber 38 and the lower chamber 37 and the operation during the pasting process will be described with reference to FIGS. 9A and 10B as viewed from the arrows of FIGS. 3IX-IX. A rail 87 extending along the tape running direction is attached to the upper surface, a slider 88 is fitted to the rail 87, a sticking roller drive motor 89 is provided on the upper chamber 38, and the rotation of the sticking roller drive motor 89 is rotated in the upper chamber. 38, the slider 88 is attached to the drive belt 90, and the slider 88 is reciprocated along the rail 87. The sticking roller 51 is attached to the lower surface of the slider 88 via the elevating unit 91. It is attached.

  9A, in the lower chamber 37, the protective tape 3 attached to the upper surfaces of the two tape support plates 42 and 43 and having the rear end portions cut off is driven by the tape support plate 43 on the rear end side. The unit 45 moves downward as shown by the two-dot chain line diagram in FIG. 9A, and the rear end portion of the protective tape 3 comes close to the wafer 1.

  Next, as shown in FIG. 10B, after the upper chamber 38 moves downward and overlaps with the lower chamber 37 and the both chambers are in a sealed state, the air inside the chamber is evacuated through the vacuum adapter 52. The application roller 51 is moved down by the operation of the elevating unit 91 and then moved horizontally along with the slider 88 by the drive of the application roller drive motor 89, and moved as indicated by a two-dot chain line diagram and an arrow in the drawing. The wafer 1 and the protective tape 3 placed on the substrate 39 roll while being pressed from above, and the protective tape 3 is attached to the wafer 1.

  At that time, as the sticking roller 51 moves in the tape feeding direction, tension is applied to the protective tape 3 in the direction opposite to the tape feeding direction along the inclination of the tape. Since the tape support plate 42 is moved backward in the direction of the arrow by the tension relief mechanism 68 and the tension applied to the protective tape 3 is relaxed, the protective tape 3 is placed on the wafer 1 with the tension in the planar direction being relaxed. Attaching and preventing the thin film wafer 1 from being warped or damaged.

  The tension relaxation mechanism 68 is provided to be inclined in order to smoothly move in the tension direction.

  Moreover, in this embodiment, although it is made to track the tape tension accompanying the movement of the sticking roller 51, a tension | tensile_strength can be eased beforehand and a tape can also be stuck before tape sticking.

  Next, the entire process of the method for applying the protective tape 3 to the wafer 1 will be described with reference to process diagrams shown in FIGS. 11 to 17 (a) to (j).

  The solid line in FIG. 11A shows the initial state, and the lower tape chuck 32, the application roller 33, the upper tape chuck 35, and the cutter blade 36 of the downstream tape chuck unit 26 approach the lower guide roller 24. One end of the protective tape 3 is sandwiched between the lower tape chuck 32 and the lowered upper tape chuck 35 at the original position, and the lower chamber 37 stands by at the original position directly below the upper chamber 38, and the suction table in the lower chamber 37. A single wafer 1 supplied from the pre-bonding wafer supply unit 11 is positioned and placed on the upper surface of 39, and the tape support plates 42 and 43 at the front and rear positions of the wafer 1 are raised by the action of the drive units 44 and 45. It is in. In the upstream side tape chuck unit 25, the tape chuck 30 is separated from the roller 28 to release the protective tape 3, and the upstream side tape chuck unit 25 stands by at the upper original position.

  Next, the upstream tape chuck 25 chucks the protective tape 3 while the chuck 30 moves close to the roller 28, and the upstream tape chuck unit 25 and the downstream tape chuck unit 26 move synchronously. While maintaining a constant tension, as shown by a two-dot chain line in FIG. 11A, the upstream tape chuck unit 25 and the downstream tape chuck unit 26 each move to the forward position, and the protective tape 3 is moved to the lower guide roller. The lower chamber 37 is slightly retracted in the direction opposite to the tape advance direction indicated by the two-dot chain line in FIG.

  As shown in FIG. 11B, the downstream tape chuck unit 26 is stopped at the forward position, the lower chamber 37 is stopped at the backward position, and the protective tape 3 faces directly above the suction table 39 in the lower chamber 37. Then, as shown by a two-dot chain line in the figure, the downstream tape chuck unit 26 is lifted with the upper tape chuck 35 adsorbing the tip of the protective tape 3 by the action of the suction pad 83, and the protective tape 3 is pulled away. The lower tape chuck 32 moves back to the original position and stops at a position outside the tape support plate 43 in the lower chamber 37.

  Next, as shown in FIG. 12 (c), the upper tape chuck 35 of the downstream tape chuck unit 26 moves downward, and the tip of the protective tape 3 is pressed onto the tape support plate 42 at the raised position to be stuck. After this sticking, the upper tape chuck 35 is lifted by stopping the suction action of the protective tape 3 of the suction pad 83, moves backward at the raised position as shown by the two-dot chain line in the figure, returns to the original position, and returns to the previous position. Stops at an interval immediately above the lower tape chuck 32.

Along with the movement of the upper tape chuck 35, the sticking roller 33 is also moved backward as shown by a two-dot chain line in the figure, and rolls from the tape support plate 42 to just above the tape support plate 43. Is stuck on the tape support plate 42 and the tape support plate 43.
At this time, the protective tape 3 between the two tape support plates 42 and 43 is maintained at a predetermined tension by the tension relaxation mechanism 68.

As shown in FIG. 12D, when the upper tape chuck 35 and the sticking roller 33 return to the original position located above the lower tape chuck 32, the upper tape chuck 35 moves down and is protected by the lower tape chuck 32. Chuck in the middle of tape 3. In this state, the cutter blade 36 reciprocates in a direction crossing the protective tape 3, and the protective tape 3 is cut linearly along the front surface of the upper tape chuck 35.
7 and 8, since the upper tape chuck 35 and the application roller 33 are provided on the same moving body 78, the backward movement is performed simultaneously, but the movement of the upper tape chuck 35 and the application roller 33 is performed. May be a separate mechanism.

  When the cutter blade 36 cuts the protective tape 3, the lower chamber 37 moves forward as shown by a two-dot chain line in FIG. 12 (d). As a result, the protective tape 3 adhered to both the tape support plates 42 and 43 is Then, it moves with the lower chamber 37 leaving the rear side from the portion cut by the cutter blade 36.

  As shown in FIG. 13 (e), the lower chamber 37 stops after moving forward to the original position just below the upper chamber 38, and then, as shown by the two-dot chain line in the figure, the tape support plate on the rear side in the tape feeding direction. 43 is lowered by the drive of the drive unit 45 so that the rear end portion of the protective tape 3 approaches the upper surface of the wafer 1, and the upper chamber 38 is moved downward so that both chambers are joined together so that the inside of the chamber is sealed. And

  Next, as shown in FIG. 13 (f), after the air in the sealed chamber is evacuated through the vacuum adapter 52, the chamber is evacuated, and then the adhesive provided in the upper chamber 38 is applied. The roller 51 descends and presses the vicinity of the front end portion of the wafer 1 from above the protective tape 3. In this state, the sticking roller 51 moves forward and rolls while pressing the protective tape 3 on the wafer 1. A tape 3 is attached over the entire surface of the wafer 1.

  At this time, as the sticking roller 51 moves forward, the tape support plate 42 on the front side is also sequentially lowered by the controlled drive of the drive unit 44, so that the portion pressed by the sticking roll 51 of the protective tape 3 is smooth. The wafer 1 is lowered to the upper surface.

  At the same time, as described above, the tension relief mechanism 68 provided on the front tape support plate 42 applies the tension applied to the rear side of the protective tape 3 as the sticking roller 51 moves, and the tape support plate 42 moves rearward. Is relieved by being permitted (see FIG. 10).

  As shown in FIG. 14G, when the sticking roller 51 finishes sticking by pressing the protective tape 3 on the entire surface of the wafer 1 and reaches the rear end of the wafer 1, the sticking roller 51 moves upward. Air is introduced into the chamber through the vacuum adapter 52 to apply atmospheric pressure. After returning to atmospheric pressure, the upper chamber 38 moves up.

  Next, the lower chamber 37 moves forward and moves to a position below the tape cutter 60 indicated by a two-dot chain line in the drawing. The tape cutter 60 is moved to the peripheral portion of the wafer 1 by the action of the elevating cylinder 56 (see FIG. 2). It moves down until it reaches.

  Further, as shown in FIG. 15 (h), the tape cutter 60 cuts the protective tape 3 along the outer shape of the wafer 1 by driving of the drive motor 59, and the tape cutter 60 is moved by the action of the lifting cylinder 56 after the rotation is completed. Move up to the initial position. During this operation, the adhering roller 51 returns to the initial position in the adjacent upper chamber 38.

  Next, the waste tape chuck 62 moves downward and forwards, and the waste tape chuck 62 is attached to the tape support plate 43 and the protective tape 3 in the cutout portion 70 of the rear end portion of the protective tape 3 is attached. Insert the upper and lower surfaces.

  Next, as shown in FIG. 16 (i), the waste tape chuck 62 moves upward, and the protective tape 3 leaves the portion attached to the wafer 1 on the wafer 1 and is cut out by the tape cutter 60. (The waste tape residue 3 ′) is pulled up along the waste tape chuck 62. However, as indicated by a two-dot chain line in the figure, the opposite front end pulled up by the waste tape chuck 62 remains attached to the front tape support plate 42.

  In this state, when the lower chamber 37 moves backward and returns to the original position just below the upper chamber 38 indicated by a two-dot chain line in FIG. 16 (i), the distance between the waste tape chuck 62 and the front tape support plate 42. Is separated from the distance between the front and rear ends of the waste tape residue 3 ', and the waste tape residue 3' is naturally detached from the tape support plate 42 as shown in FIG.

  As shown by the two-dot chain line in the figure, the waste tape chuck 62 rotates around the rotation shaft 61 and releases chucking, and the waste tape residue 3 'falls into the tape waste box 63. In the lower chamber 37, the cylinder 40 The wafer holding pins 41 are raised, the tape-applied wafer 1 ′ is lifted, and the tape-applied wafer 1 ′ that has been lifted is transferred to the attached wafer storage unit 14 by the transfer robot 15.

  As described above, the method and apparatus for attaching a substrate to a wafer according to the present invention have been described by taking as an example the attachment of the protective tape 3 to the wafer 1. However, the tape that is the subject of the present invention is limited to the protective tape 3. Without limitation, the present invention can be applied to the DAF 4, the D / C tape 5 or the removable double-sided tape 7 shown in FIG. 19, and tapes having various properties such as a thermoplastic tape can be used. Note that when the type and properties of the tape are changed, the structure of the above-described embodiment is appropriately changed accordingly. For example, when a thermoplastic tape is used, a heater may be added to the suction table 39 or the like.

  FIG. 18 shows an embodiment of a tape attaching device for attaching the D / C tape 5 to the wafer 1 and the D / C frame 6, and is a plan view of the lower chamber 37 in this embodiment. The table 101 includes a wafer suction table 102 that sucks and fixes the central wafer 1 and a D / C frame suction pad 103 that is provided at four locations around the wafer suction table 102 and sucks and fixes the D / C frame. .

  In the case of this embodiment, the wafer 1 on which the protective tape 3 or the like is attached on the circuit forming surface side on the front side is placed on the suction table 101 with the back side facing up and the D / C frame 6 is placed. The D / C tape 5 is affixed, and the tape support plates 42 and 43 are provided outside the D / C frame suction pad. This is the same as the lower chamber 37 of the embodiment in which the protective tape 3 is attached only to the wafer 1.

  In the case of this embodiment, although not shown in the figure, means for transferring the D / C frame 6 onto the D / C frame suction pad 103 on the suction table 101, or D / C tape 5 after the D / C tape 5 is attached. A tape cutter that cuts the D / C tape 5 along the C frame 6, a means for transferring the D / C frame 6 to which the wafer 1 is attached via the D / C tape 5 to the next process, and as required Add other means.

The top view which shows the whole apparatus of this invention II-II arrow view of FIG. Bottom chamber plan view Partial cutaway left side view of lower chamber Partial cutaway right side view of lower chamber VI-VI arrow view of Fig. 1 Top view of the tape chuck unit Left side view of the tape chuck unit (Figure VIII-VIII arrow view) (A) is an enlarged view of the vacuum chamber shown in FIG. 3IX-IX. (B) is an enlarged view of the vacuum chamber shown in FIG. 3IX-IX. (A) (b) is explanatory drawing which shows the sticking method of this invention (C) (d) is an explanatory view of the same as above (E) and (f) are the same as above. (G) is the same as above (H) is the same as above (I) is the same as above (J) is the same as above The top view of the lower chamber in 2nd Embodiment of this invention (A) (b) (c) (d) is a tape application state diagram of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wafer 1 'Affixed wafer 2 Circuit pattern 3 Protection tape 3' Waste tape waste 4 DAF
5 D / C tape 6 D / C frame 7 Removable double-sided tape 8 Support substrate 9 Notch 10 Machine base 11 Wafer storage part 12 before bonding 12 Alignment part 13 Support frame 14 Attached wafer storage part 15 Transfer robot 16 Adsorption rotary table 17 Sensor unit 18 Tape supply reel 19 Guide roller 20 Release sheet 21 Release roller 22 Guide roller group 23 Release sheet take-up reel 24 Lower guide roller 25 Upstream tape chuck unit 26 Downstream tape chuck unit 27 Rail 28 Roller 29 Cylinder 30 Tape chuck 31 Rail 32 Lower tape chuck 33 Sticking roller 34 Cylinder 35 Upper tape chuck 36 Cutter blade 37 Lower chamber 38 Upper chamber 39 Suction table 40 Cylinder 41 Wafer lifting pin 4 , 43 Tape support plate 44, 45 Drive unit 46 Rail 47 Guide member 48 Motor 49 Ball screw 50 Nut member 51 Sticking roller 52 Vacuum adapter 53 Lifting cylinder 54 Opening / closing cylinder 55 Tape cutter mechanism 56 Lifting cylinder 57 Rail 58 Guide member 59 Drive motor 60 Tape cutter 61 Rotating shaft 62 Waste tape chuck 63 Tape waste box 64 Suction table suction hose 65, 66 Shaft 67 Guide 68 Tension relief mechanism 69 Lift plate 70 Notch 71 Seal member 72 Rail 73 Slider 74 Guide member 75 Cylinder shaft 76 Guide 77 Slider 78 Moving body 79 Rail 80 Slider 81 Rail 82 Cutter unit 83 Suction pad 84 Rail 85 Slider 86 Cutter groove 87 Rail 88 Slider 89 Adhesive roller drive motor 90 Drive belt 91 Lifting unit 92 Rail 93 Slider 94 Rail 95 Slider 96 Guide member 101 Adsorption table 102 Wafer adsorption table 103 D / C frame adsorption pad

Claims (6)

A method for attaching a tape to a wafer, in which a wide tape supplied just above the wafer positioned and supplied on the suction table is attached to the wafer by pressing it onto the wafer by a pressing roll of an attaching roll, and then the tape is cut into an outer shape of the wafer. In
Using a plurality of tape support plates that are provided at least at a position sandwiching the suction table and whose upper surface is substantially the same height as the upper surface of the suction table and can be moved up and down,
Affixed to a plurality of tape support plates in a raised position with a wide tape drawn directly above the suction table on which the wafer is placed, and then cut at a position outside the tape support plate,
The vacuum table is placed in the vacuum chamber of the suction table on which the wafer is placed and the tape support plate to which the tape is attached.
During application work using the joining roller under vacuum conditions, tape application method to the wafer, wherein the benzalkonium is independently lowered moving with each tape supporting plate to the progress of the application roller. A wafer and a wide dicing tape, which are positioned and supplied on the suction table, are pasted onto the wafer and the dicing frame by pressing and rolling the pasting roll, and then the dicing tape is attached to the dicing frame. In the method of applying a dicing tape to a wafer that is cut along
Using a plurality of tape support plates that are provided at least at a position sandwiching the suction table and whose upper surface is substantially the same height as the upper surface of the suction table and can be moved up and down,
A wide dicing tape pulled out directly above the suction table on which the wafer and dicing frame are placed is fixed to a plurality of tape support plates at the raised position, and then cut at a position outside the tape support plate,
The vacuum table is placed in a vacuum chamber on the suction table on which the wafer and the dicing frame are placed and the tape support plate on which the dicing tape is attached.
During application work using the joining roller under vacuum conditions, tape application method to the wafer, wherein the benzalkonium is independently lowered moving with each tape supporting plate to the progress of the application roller. 3. The method for sticking a tape to a wafer according to claim 1, wherein the sticking operation is performed while moving at least one tape support plate in a direction in which the tension applied to the tape is relaxed during the sticking operation. Tape application method to wafer. An adsorption table for adsorbing and holding the wafer on the upper surface; a tape feeding mechanism for supplying a wide tape directly above the wafer on the adsorption table; an affixing roll that rolls while pressing the tape against the wafer on the adsorption table; In a tape affixing device to a wafer comprising a tape cutter for cutting a tape affixed to a wafer into a wafer outer shape,
A plurality of tape support plates that are provided at least across the suction table , and are individually movable up and down between approximately the same height and higher position as the upper surface of the suction table ; and
A chuck unit that clamps the end of the wide tape and pulls it out onto the tape support plate;
A cutting mechanism for cutting the tape after being attached to the tape support plate at a position outside the tape support plate;
A tape sticking apparatus for a wafer, comprising: a vacuum table in which a suction table, a tape support plate, and a sticking roller are housed to perform a sticking operation in a vacuum state . An adsorption table for adsorbing and holding the wafer and the dicing frame on the upper surface, a tape feeding mechanism for sequentially supplying a wide dicing tape to the wafer and the dicing frame on the adsorption table, and a dicing tape for the wafer and the dicing frame on the adsorption table In a dicing tape affixing device to a wafer consisting of an affixing roll that presses and a tape cutter that cuts the dicing tape affixed to the dicing frame along the dicing frame,
Provided with a plurality of at least suction table to do it position clamping a tape support plate respectively between the upper surface higher than a substantially same height as the separate suction table and movable up and down movement,
A chuck unit that clamps the end of the wide dicing tape and pulls it out onto the tape support plate;
A cutting mechanism for cutting the wide dicing tape after being attached to the tape support plate at a position outside the tape support plate;
A tape sticking apparatus for a wafer, comprising: a vacuum table in which a suction table, a tape support plate, and a sticking roller are housed to perform a sticking operation in a vacuum state . 6. The apparatus for applying a tape to a wafer according to claim 4 or 5, wherein a tension relief device is provided that is movable to at least one tape support plate so as to relieve the tension applied to the tape when the tape is applied. Tape sticking device for wafers.

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