JP2008166459A - Protective tape applying method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a protective film applying method and apparatus which can efficiently apply a protective tape onto a semiconductor wafer beautifully up to a peripheral edge without containing any air. <P>SOLUTION: The protective tape applying apparatus includes a protective tape 14 for protecting the surface of a semiconductor wafer 12, an application roller 26 for applying the protective tape 14 on the surface of the semiconductor wafer 12, a preheating roller 32, and an application drive device 30 for driving the application roller 26. The apparatus also includes a heater table 16 for carrying the semiconductor wafer 12 thereon, an outer peripheral table 20 located to be spaced from the peripheral edge of the heater table 16 by a predetermined distance, and a ring member 22 provided in a way that it bridges a gap between the outer periphery edge of the heater table 18 and the outer peripheral table 20 and moves vertically. When the protective tape 14 is pasted onto the semiconductor wafer 12, the ring member 22 is located to be flush with the outer peripheral table 20 and at a position slightly higher than the surface of the semiconductor wafer 12. The application roller 26 acts to paste the tape onto the semiconductor wafer 12 from its center to its peripheral edge. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a protective tape affixing device for affixing a surface of a semiconductor wafer on which a predetermined circuit pattern or the like has been formed in a semiconductor product manufacturing process.

  Conventionally, in a manufacturing process of a semiconductor product, a semiconductor wafer having a large number of circuit patterns and elements formed on the surface is subjected to a back grinding process in which the back surface is polished and thinned as necessary, and then cut into each functional element. Through a dicing process, it is divided into individual semiconductor chips. When the back surface of the semiconductor wafer is polished (back grind) or etched, an adhesive protective tape is attached to the semiconductor wafer surface to protect the semiconductor wafer surface. The semiconductor wafer protected by the protective tape is subjected to a treatment such as polishing on the back surface in a state where the front side is sucked and held by a suction cup.

As disclosed in Patent Documents 1 to 3, the protective tape is attached in such a manner that the surface provided with the adhesive of the protective tape wound in a roll shape is disposed toward the surface of the semiconductor wafer, and the semiconductor is applied by the application roller. Affixing from one peripheral edge of the wafer to the opposite side. Thereafter, the protective tape is cut out in a circular shape of the semiconductor wafer, and the peripheral edge is wound up. As disclosed in Patent Documents 1 and 2, in the process of drawing out into a circle, the protective tape is cut out along the outer periphery of the semiconductor wafer by a cutter.
JP 2002-134438 A JP 2003-209082 A JP 2005-136306 A

  In general, when a protective tape is applied to a semiconductor wafer, the semiconductor wafer is placed on a mounting table, an attaching roller is placed thereon, and the protective tape is attached while applying a predetermined force. However, in order to reliably apply the protective tape to the surface of the semiconductor wafer, the application roller has to be moved slowly to some extent, which is not efficient. Moreover, as disclosed in Patent Documents 1 to 3, the sticking roller moves from one peripheral edge portion of the protective tape toward the central portion of the semiconductor wafer. For this reason, the linear roller with respect to the peripheral edge of the arc-shaped semiconductor wafer surface moves so as to enter inward from the peripheral edge, and air is likely to be included between the semiconductor wafer and the protective tape. It was.

  The present invention has been made in view of the above-mentioned problems of the prior art, and is capable of efficiently applying a protective tape to a semiconductor wafer, and can be applied to a peripheral edge cleanly without including air. And to provide a device.

  The present invention is a protective tape attaching method in which a protective tape for protecting a semiconductor wafer surface and elements on the semiconductor wafer surface is disposed above the surface of the semiconductor wafer, and the protective tape is attached to the surface of the semiconductor wafer by an attaching roller. The semiconductor wafer is placed on a heater table kept at a predetermined temperature, the sticking roller is disposed so as to be positioned on the center of the surface of the semiconductor wafer, and the protective tape is interposed via the sticking roller. To the semiconductor wafer surface, the sticking roller is moved from the central portion of the semiconductor wafer toward one peripheral edge to stick the protective tape to about half of the semiconductor wafer surface. Affixing the adhering roller to the center of the semiconductor wafer and adhering the protective tape to the remaining surface of the semiconductor wafer It is the law.

  The present invention also relates to a method for applying a protective tape for protecting a semiconductor wafer surface and elements on the semiconductor wafer surface, wherein the semiconductor wafer is placed on a heater table kept at a predetermined temperature, and a lateral side of the semiconductor wafer surface is provided. The sticking roller is disposed on the surface of the sticking roller, and the surface of the sticking roller is subjected to a surface treatment for improving the peelability from the surface of the protective tape. Surface treatment is performed to suppress fluidity, and the protective tape is brought into contact with the surface of the semiconductor wafer via the sticking roller, and the sticking roller is moved from the end of the semiconductor wafer toward the peripheral edge on the opposite side. It is a protective tape sticking method of moving and sticking the protective tape on the surface of the semiconductor wafer.

  Furthermore, the adhesive on the back surface of the protective tape reaching the sticking roller is preheated and sent to the sticking roller.

  The present invention also provides a protective tape that is disposed immediately above a semiconductor wafer and protects the surface of the semiconductor wafer and the elements on the surface, a sticking roller that sticks the protective tape to the surface of the semiconductor wafer, and a sticking that drives the sticking roller. In a protective tape affixing device having a drive device, a circular heater table on which the semiconductor wafer is placed and kept at a predetermined temperature is formed, and a hole larger than the heater table is formed, and a predetermined interval is formed from a peripheral portion of the heater table. An outer peripheral table disposed around the heater table, and a ring member that fills a gap between the outer peripheral edge of the heater table and the outer peripheral table and is provided so as to move up and down with respect to the heater table. When the protective tape is affixed to the semiconductor wafer by the step, the ring member is The ring member is positioned so as to be flush with or slightly above and below the bull and is substantially flush with or slightly higher than the surface of the semiconductor wafer, and after attaching the protective tape to the semiconductor wafer, It is a protective tape applying device that lowers and forms a gap between the heater table and the outer peripheral table, and cuts out the protective tape at the periphery of the semiconductor wafer.

  The sticking roller surface is subjected to a surface treatment for improving the peelability from the surface of the protective tape, and at least the upper surface of the ring member and the outer peripheral table is a surface treatment for suppressing the adhesiveness of the back surface of the protective tape and increasing the fluidity. Is given.

  The sticking roller includes a heater and a preheating roller that warms the adhesive on the back surface of the protective tape in parallel with the sticking roller.

  The preheating roller is disposed on both sides of the sticking roller, and the protective tape is different from the central part of the semiconductor wafer toward the peripheral part on both sides corresponding to the sticking position on the semiconductor wafer. The preheating roller is sent to the sticking roller.

  The upper surface of the outer peripheral table is provided with a relief groove that receives excess adhesive protruding from the protective tape, and the escape groove is formed concentrically or radially with respect to the heater table on the upper surface of the outer peripheral table. .

  According to the method for applying the protective tape of the present invention, the protective tape is heated by the heater, the viscosity of the pressure-sensitive adhesive is decreased, the unevenness on the surface of the semiconductor wafer is easily adjusted, the application speed can be increased, and the working efficiency is improved. At the same time, the surface of the protective tape is not uneven, and the semiconductor wafer is reliably adsorbed in the subsequent process. Further, no bubbles remain on the attached protective tape, and the occurrence of defects in the subsequent process is suppressed.

  Further, according to the protective tape preparation device of the present invention, the tape application speed can be increased, the working efficiency can be increased, and the flatness of the surface of the protective tape can be increased. In addition, no bubbles remain on the protective tape, and the protective tape can be securely and reliably affixed to the periphery of the semiconductor wafer, improving the workability in the manufacturing process of the semiconductor element and improving the yield.

  Hereinafter, the protective tape sticking apparatus of this invention is demonstrated based on FIGS. 1-3. As shown in FIG. 1, the protective tape applying apparatus 10 of this embodiment is provided with a heater table 16 including a heater (not shown) and a metal disk having a smooth surface. The heater table 16 is on which the semiconductor wafer 12 is placed, is positioned so as to face the protective tape 14, and is fixed to the base 17 via a plurality of support members 15. As shown in FIG. 2, an outer peripheral table 20 is provided outside the outer periphery of the heater table 16 with a cutter groove 18 formed of a gap having a predetermined width. The upper surface of the outer peripheral table 20 is positioned between the upper surface of the convex portion 12 a formed on the surface of the semiconductor wafer 12 and the surface of the semiconductor wafer 12 when the semiconductor wafer 12 is placed on the heater table 16.

  As shown in FIG. 2, the protective tape 14 attached to the surface of the semiconductor wafer 12 is formed on a resin tape base material 14a made of polyethylene terephthalate (PET) or the like and has a thickness of about several hundreds of micrometers. An adhesive 14b is applied and formed. The thickness of the pressure-sensitive adhesive 14b is thicker than the convex portion 12a on the surface of the semiconductor wafer 12, and is softened and gelled at a predetermined temperature, for example, a temperature of about 60 ° C. As shown in FIG. 3, the width of the protective tape 14 is wider than the heater table 16, and is formed so that both end portions in the width direction are positioned on escape grooves 24 described later.

  In the cutter groove 18, a metal ring member 22 formed slightly thicker than the heater table 16 is positioned with a slight gap between the heater table 16 and the outer peripheral table 20 so as to move up and down. Yes. The lower end of the ring member 22 is formed in a shape that extends outwardly in a flange shape, and is formed so as to be movable up and down by a device (not shown). As shown in FIG. 2, the upper surface of the ring member 22 when the ring member 22 is positioned at the uppermost position is formed on the surface of the semiconductor wafer 12 when the semiconductor wafer 12 is placed on the heater table 16. It is located between the upper surface of the convex portion 12 a and the surface of the semiconductor wafer 12 and is flush with the surface of the outer peripheral table 20.

  As shown in FIG. 3, the outer peripheral table 20 is formed in a rectangular plate shape, is formed slightly thinner than the heater table 16, and is attached to the base 17 or the like via support members 21 near the four corners. It has been. The upper surface of the outer peripheral table 20 is formed flush with the upper surface of the ring member 22 in the raised position, and the surface is subjected to a non-adhesion process in which an adhesive does not adhere. Further, on the surface of the outer peripheral table 20, a plurality of arcuate grooves formed, for example, five times in a concentric manner with the heater table 16 at a predetermined interval are provided, and the relief grooves of the adhesive 14b of the protective tape 14 are provided. 24 is formed. The escape groove 24 is stopped in the vicinity of the center on both sides in the longitudinal direction of the outer peripheral table 20.

  The upper surface of the ring member 22 and the outer peripheral table 20 is subjected to a surface treatment in order to suppress the adhesiveness of the adhesive 14b of the protective tape 14 and increase the fluidity of the gel-like resin as will be described later. The surface treatment is a fluororesin coating or the like.

  Above the heater table 16, a sticking roller 26 having a length slightly longer than the diameter of the heater table 16 and about the width of the protective tape 14 is provided. The sticking roller 26 includes a heating device such as an electric heater inside and is formed of a hard material such as metal or hard resin. The sticking roller 26 is pivotally supported by a roller support portion 28 in parallel with the upper surfaces of the heater table 16 and the outer peripheral table 20. The roller support portion 28 is provided integrally with the sticking drive device 30 and is formed to be movable up and down and left and right by a motor (not shown).

  The surface of the sticking roller 26 is subjected to a surface treatment to suppress the adhesiveness of the adhesive 14b of the protective tape 14 and enhance the fluidity of the gel-like resin as will be described later. The surface treatment is a fluororesin coating or the like.

  As shown in FIG. 1, a first preheating part 34 a and a second preheating part 34 b provided with a preheating roller 32 for preheating the protective tape 14 are formed on both sides of the sticking roller 26, respectively. Are each provided with a turning roller 36. The protective tape 14 is fed from the right side to the left side in FIG. 1, and a tape roll is attached to a tape feeding device (not shown) around which the protective tape 14 is wound on the upstream side of the first preheating unit 34a. On the downstream side of 34b, the tape gripping portion 38 is located outside the outer peripheral table 20.

  The tape gripping portion 38 is provided with a gripping roller 40a formed to be rotatable, and a gripping portion 40 that is lowered from above the gripping roller 40a and includes a gripping piece 40b formed to be able to grip the protective tape 14. Yes. The contact surface of the gripping piece 40b with the gripping roller 40a is formed in a concave shape with the same curvature as the outer periphery of the gripping roller 40a. Adjacent to the tape gripping portion 38, there is provided a pinching roller 42 composed of a pair of large and small diameter rollers for pinching and feeding the protective tape 14 sent out from the tape gripping portion 38.

  Next, operation | movement of the tape sticking apparatus 10 of this embodiment is demonstrated. First, as shown in FIG. 1, the protective tape 14 fed from a tape roll of a tape feeder (not shown) is preheated from the lower side of the turning roller 36 of the first preheater 34a located on the right side of the sticking drive device 30. Is wound around in the S-shape and sent to the lower side of the sticking roller 26 of the sticking drive device 30. Further, from the sticking roller 26, it goes around the preheating roller 32 of the second preheating portion 34b, is wound around the lower turning roller 36 in an S shape, and is drawn out to the left outer side. The pulled-out protective tape 14 is affixed to the semiconductor wafer 12, and then pulled out by the cutter (not shown) at the outer peripheral portion of the semiconductor wafer 12, and the remaining peripheral portion passes through the grip portion 40 of the tape grip portion 38. Then, it is nipped by the nipping roller 42 and discarded by a discarding unit (not shown).

  Next, the tape sticking operation of the sticking drive device 30 will be described. First, the semiconductor wafer 12 on which the semiconductor element is formed is transferred to the heater table 16 by a transfer device (not shown), and is placed with the surface having the concavo-convex portion 12a facing upward. At this time, the ring member 22 is lifted and is positioned substantially in the same plane as the outer peripheral table 20 and in the vicinity of the middle between the upper end portion of the uneven portion 12a of the semiconductor wafer 12 and the surface of the semiconductor wafer 12, as shown in FIG. The semiconductor wafer 12 placed on the heater table 16 is heated to, for example, about 60 ° C. by a heater built in the heater table 16. At this time, as shown in FIG. 1, the sticking drive device 30 and the first preheating unit 34a are retracted to the right end of the drawing, and the second preheating unit 34b is retracted to the left side. Further, the protective tape 14 is gripped by the tape gripping portion 38.

  After the semiconductor wafer 12 is placed on the heater table 16, the pasting drive device 30 and the first preheating unit 34 a move from the right direction toward the center above the semiconductor wafer 12. At this time, the protective tape 14 is heated to about 60 ° C. by contacting the preheating roller 32 and the sticking roller 26 of the first preheating portion 34a. As shown by the arrow line in FIG. 1, the sticking drive device 30 starts to descend when it passes slightly near the center of the semiconductor wafer 12 and moves to the right in FIG. 1 at a predetermined speed. Thus, the protective tape 14 is pressed with a predetermined force from the central portion of the surface of the semiconductor wafer 12 by a predetermined force, and at the same time, the application driving device 30 moves while the application roller 26 rotates to the right side of FIG. Also at this time, since the affixing roller 26 is warmed by the heater built in the affixing roller 26, the adhesive 14b of the protective tape 14 is warmed and reliably pressed and adhered to the semiconductor wafer 12.

  When the protective tape 14 is attached to the right half of the semiconductor wafer 12 shown in FIG. 1 and the application driving device 30 moves to a predetermined position beyond the end of the outer peripheral table 20, the application driving device 30 is raised. Next, the sticking drive device 30 moves to the left in FIG. 1 in a state where the first preheating portion 34a is held at a predetermined retracted position. When it is located slightly near the right side of the center of the semiconductor wafer 12, it starts to descend simultaneously while moving to the left at a predetermined speed. Then, from the vicinity of the center of the semiconductor wafer 12, the protective tape 14 is pressed and pasted to the semiconductor wafer 12 by the pasting roller 26 partially overlapping the previous pasting position. Also at this time, the sticking driving device 30 moves to the left side shown in FIG. 1 while rotating the sticking roller 26. The protective tape 14 is heated to, for example, about 60 ° C. by the preheating roller 32 of the second preheating unit 34b. Further, the protective tape 14 is pressed against and adhered to the semiconductor wafer 12 while being heated by a heater built in the attaching roller 26. When the protective tape 14 is affixed to the left half of the semiconductor wafer 12 shown in FIG. 1 and the pasting drive device 30 moves to a predetermined position beyond the end of the outer peripheral table 20, the pasting drive device 30 rises.

  Subsequently, the ring member 22 fitted in the cutter groove 18 is lowered, and the protective tape 14 is cut out on the outer periphery of the semiconductor wafer 12 by a cutter (not shown) along the cutter groove 18. Thereafter, the sticking drive device 30 starts to move together with the second preheating portion 34b in the right direction in FIG. At this time, when the second preheating part 34b passes over the outer peripheral table 20, the protective tape 14 attached to the upper surface of the outer peripheral table 20, which is the remainder cut out in a circular shape, is peeled off. Furthermore, the sticking drive device 30 and the first preheating portion 34a are retracted in the right direction of the drawing, and the remaining portion of the protective tape 14 is completely peeled off from the outer peripheral table 20.

  Next, the gripping of the gripping portion 40 of the tape gripping portion 38 is released, and the protective tape 14 is wound up by the device (not shown) via the pinching roller 42, and the new protective tape 14 is positioned on the heater table 16. Thereafter, the above procedure is repeated.

  According to the tape applicator 10 of this embodiment, the protective tape 14 is warmed by the heater table 16, the applicator roller 26, and each preheating roller 32, the viscosity of the adhesive 14b is reduced, and unevenness on the surface of the semiconductor wafer 12 is easily achieved. Familiarize with, can increase the application speed, and work efficiency is improved. Furthermore, the surface of the protective tape 14 is accurately and flatly formed, so that unevenness does not appear, and the semiconductor wafer is reliably adsorbed in the subsequent process. Further, since the affixing roller 26 is affixed by moving from the central part of the semiconductor wafer 12 to the peripheral part, no bubbles remain between the affixed protective tape 14 and the semiconductor wafer 12, and a defect occurs in the subsequent process. Suppress.

  Even if the protective tape 14 is warmed to reduce the viscosity of the adhesive 14 b, the adhesive 14 b does not hang down into the cutter groove 18 due to the ring member 22 of the cutter groove 18, and the ring member 22 further includes the semiconductor wafer 12. Since the pressure-sensitive adhesive 14b does not sag outward from the outer peripheral cross section of the protective tape 14, the pressure-sensitive adhesive 14b maintains a predetermined thickness and adheres even near the outer periphery. An escape groove 24 is formed on the upper surface of the outer peripheral table 20, and the adhesive 14b sticking out by the sticking roller 26 enters and the extra adhesive 14b does not spread unintentionally.

  The method and apparatus for applying the protective tape of the present invention is not limited to the above embodiment, and the semiconductor wafer is placed on a heater table kept at a predetermined temperature, and the semiconductor wafer is placed on the side of the semiconductor wafer surface. An affixing roller is disposed, the protective tape is brought into contact with the surface of the semiconductor wafer via the affixing roller, and the affixing roller is moved from the end of the semiconductor wafer toward the peripheral edge on the opposite side, and the protective tape May be affixed to the surface of the semiconductor wafer. Also in this case, the surface of the sticking roller is subjected to a surface treatment for improving the peelability from the surface of the protective tape, and the adhesive surface of the back surface of the protective tape is applied to the outer peripheral table upper surface and the ring member upper surface outside the heater table. By applying a surface treatment that suppresses the fluidity and enhances the fluidity, it is possible to achieve a beautiful pasting.

  Further, the shape of the escape groove 24 may be formed radially with respect to the heater table 16 as shown in FIG. In addition, the size of the heater table, outer peripheral table, ring member, etc. can be appropriately set according to the semiconductor wafer to be protected. Furthermore, the number, thickness, and shape of the grooves constituting the escape groove can be changed in accordance with the width of the protective tape, and can be appropriately set according to the material of the adhesive or the protective tape. In addition, the shape and material of each member can be appropriately changed.

It is a schematic fragmentary sectional view which shows the protective tape sticking apparatus of one Embodiment of this invention. It is the elements on larger scale of the part shown to A of FIG. 1 of one implementation mobile phone of this invention. It is a schematic plan view which shows the outer periphery table and heater table of the protective tape sticking apparatus of one Embodiment of this invention. It is a schematic plan view which shows the outer periphery table and heater table of the protective tape sticking apparatus of other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Protective tape sticking device 12 Semiconductor wafer 12a Convex part 14 Protective tape 16 Heater table 18 Cutter groove 20 Outer table 22 Ring member 24 Relief groove 26 Sticking roller 30 Sticking drive device 32 Preheating roller 34a First preheating part 34b Second preheating part

Claims (9)

  In a protective tape attaching method in which a protective tape for protecting a semiconductor wafer surface and a device on the semiconductor wafer surface is disposed above the semiconductor wafer surface, and the protective tape is attached to the semiconductor wafer surface by an application roller. The semiconductor wafer is placed on a heated heater table, the sticking roller is disposed so as to be positioned on the center of the semiconductor wafer surface, and the protective tape is placed on the semiconductor wafer surface via the sticking roller. The affixing roller is abutted and moved from the central part of the semiconductor wafer toward one peripheral edge to affix the protective tape to about half of the surface of the semiconductor wafer, and thereafter the affixing roller is attached to the semiconductor wafer. The protective tape is returned to the center of the semiconductor wafer, and the protective tape is attached to the remaining surface of the semiconductor wafer. Method with.   In a protective tape attaching method in which a protective tape for protecting a semiconductor wafer surface and a device on the semiconductor wafer surface is disposed above the semiconductor wafer surface, and the protective tape is attached to the semiconductor wafer surface by an application roller. The semiconductor wafer is placed on a heat-retained heater table, the sticking roller is disposed on the side of the semiconductor wafer surface, and a surface treatment is performed on the sticking roller surface to improve the peelability from the surface of the protective tape. The outer peripheral table upper surface outside the heater table is subjected to a surface treatment that suppresses the adhesiveness of the back surface of the protective tape to increase the fluidity, and the protective tape is applied to the semiconductor wafer surface via the sticking roller. Abutting and moving the sticking roller from the edge of the semiconductor wafer toward the peripheral edge on the opposite side, Protective tape applying method characterized by attaching the serial semiconductor wafer surface.   The protective tape sticking method according to claim 1 or 2, wherein the adhesive on the back surface of the protective tape reaching the sticking roller is heated in advance and sent to the sticking roller.   A protective tape that is disposed immediately above the semiconductor wafer and protects the surface of the semiconductor wafer and elements on the surface, a sticking roller that sticks the protective tape to the surface of the semiconductor wafer, and a sticking drive device that drives the sticking roller. In the protective tape affixing device, a circular heater table on which the semiconductor wafer is placed and kept at a predetermined temperature is formed, and a hole larger than the heater table is formed, and the heater table is spaced apart from the peripheral edge of the heater table by a predetermined distance. An outer peripheral table disposed around, and a ring member provided to fill a gap between the outer peripheral edge of the heater table and the outer peripheral table so as to be movable up and down with respect to the heater table; When affixing to the semiconductor wafer, the ring member is flush with the outer peripheral table. Is located with a slight step up and down, and is substantially flush with or slightly higher than the surface of the semiconductor wafer, and after the protective tape is attached to the semiconductor wafer, the ring member is lowered, A protective tape attaching device, wherein a gap is formed between the heater table and the outer peripheral table, and the protective tape is cut out at the periphery of the semiconductor wafer.   The sticking roller surface is subjected to a surface treatment for improving the peelability from the surface of the protective tape, and at least the upper surface of the ring member and the outer peripheral table is a surface treatment for suppressing the adhesiveness of the back surface of the protective tape and increasing the fluidity. The protective tape sticking device according to claim 4, wherein:   5. The protective tape sticking apparatus according to claim 4, wherein the sticking roller includes a heater and a preheating roller that warms the adhesive on the back surface of the protective tape in parallel with the sticking roller.   The preheating roller is disposed on both sides of the sticking roller, and the protective tape is different from the central part of the semiconductor wafer toward the peripheral part on both sides corresponding to the sticking position on the semiconductor wafer. The protective tape sticking device according to claim 6, wherein the protective tape sticking device is sent to the sticking roller through the preheating roller.   The protective tape sticking device according to claim 4, wherein an escape groove for receiving an excess adhesive protruding from the protective tape is provided on an upper surface of the outer peripheral table. 9. The protective tape applying device according to claim 8, wherein the escape groove is formed concentrically or radially with respect to the heater table on the upper surface of the outer peripheral table.

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