JP2010232417A - Sheet-peeling device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-peeling device and method that peels off an adhesive sheet smoothly from an adherend, without giving stress to the adherend. <P>SOLUTION: An adhesive sheet S is peeled off from a wafer W by making an edge part 46E roll in a direction where the wafer W is peeled off while allowing a pressing surface 461 to press tape T to an adhesive sheet S by rotating a pressing head 46. Therefore, a peeling device, featuring both smooth peeling that does not give stress to the wafer W like roller peeling and positive peeling like edge peeling, is realized. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet affixed to an adherend.

  Conventionally, in a semiconductor manufacturing process, in a process of grinding a back surface of a semiconductor wafer (hereinafter simply referred to as a wafer), an adhesive sheet is applied to the front surface (surface on which a circuit is formed) to protect the front surface of the wafer. Grinding is performed, and such an adhesive sheet is peeled off from the wafer after a grinding process or the like. As a peeling method of the adhesive sheet, a method of peeling the adhesive sheet by rolling the peeling roller and pulling the peeling tape while pressing the peeling tape against the surface of the adhesive sheet with a peeling roller (see, for example, Patent Document 1) ) Or a method of peeling the adhesive sheet by pulling the peeling tape while moving the peeling tape along the surface of the adhesive sheet with an edge member (peel plate) (for example, see Patent Document 2). Yes.

JP 2004-273527 A JP 2002-124494 A

By the way, the roller peeling as described in Patent Document 1 pulls the peeling tape or the adhesive sheet while pressing the adherend downward, and peels off the adhesive sheet, so that the adherend is not stressed smoothly. There is an advantage that peeling can be performed. However, as shown in FIG. 5 (A), the peeling force PH in the roller peeling acts on the surface circumferential direction (tangential direction) of the peeling tape T, so the adhesive sheet S attached to the adherend W is In the case of peeling, the adhesive sheet S is peeled from the adherend W when the upward component force PH1 of the peel force PH exceeds the adhesive force PR of the adhesive sheet S to the adherend W. Therefore, almost no component force PH1 of the peeling force PH is generated in the vicinity immediately below the peeling roller R. Therefore, as shown in FIG. 5B, the adhesive sheet S is attached to the adherend W until the peeling roller R rotates to some extent. Since there is no peeling from the film, a peeling delay Z occurs. For this reason, there is a disadvantage that the adhesive sheet S cannot be peeled while the adherend W is pressed by the peeling roller R, and the adherend W is lifted together with the peeling tape T and cracked. Such a tendency is conspicuous when the adhesive sheet is peeled off from a semiconductor wafer that has been ground very thinly. The peeling force PH1 is maximized at the position where the peeling roller R is rotated 90 degrees.
On the other hand, edge peeling as described in Patent Document 2 has an advantage that reliable peeling can be performed because the maximum peeling force can be obtained immediately after passing through the edge member. However, since the peeling is performed while the edge member rubs on the peeling tape or the adhesive sheet, the force for pulling the peeling tape is increased, and the peeling tape is peeled off or cut off from the adhesive sheet. There is a disadvantage that it occurs.

  The present invention has been devised by paying attention to the above inconveniences, and its purpose is to prevent the application of stress to the adherend and poor peeling of the adhesive sheet, and to remove the adhesive sheet from the adherend. An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of smoothly and reliably peeling.

  In order to achieve the above object, the sheet peeling apparatus of the present invention is a sheet peeling apparatus that peels off the adhesive sheet from an adherend having an adhesive sheet attached to the surface using a peeling tape, the peeling tape A tape placing means for placing the adhesive tape opposite the adhesive sheet, an attaching means for pressing and attaching the peeling tape to the adhesive sheet, and a relative movement of the adherend and the peeling tape to move the covering. Moving means for peeling the adhesive sheet from the body, and the sticking means is a pressing means for pressing the peeling tape against the adhesive sheet, and a rotating means for rotating the pressing means. The pressing means includes a pressing surface capable of rolling on the surface of the adhesive sheet via the peeling tape as the rotating means rotates, and an edge portion adjacent to the pressing surface. And having Have been made, it has adopted the configuration that.

At this time, in the sheet peeling apparatus of the present invention, the sticking means has a peeling angle regulating means for regulating an angle formed by the peeling tape and the adhesive sheet outside the outer edge of the adhesive sheet to a predetermined angle. It is preferable to be configured.
In the sheet peeling apparatus of the present invention, the peeling angle regulating means is provided to be movable in a direction along the surface of the adhesive sheet, and is configured to be able to adjust an angle formed by the peeling tape and the adhesive sheet. It is preferable.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which the adhesive sheet is peeled off from an adherend having an adhesive sheet affixed to the surface using a peeling tape, and the sticking method is performed on the adherend. The peeling tape is arranged to face the adhesive sheet, and has a pressing surface capable of rolling the surface of the adhesive sheet via the peeling tape with rotation, and an edge portion adjacent to the pressing surface. The peeling tape is pressed and stuck to the adhesive sheet by a pressing means, and the pressing means is rotated to peel the adhesive sheet from the adherend.

  According to the present invention as described above, the adhesive sheet is peeled off by rotating a pressing means having a pressing surface capable of rolling the surface of the adhesive sheet and an edge portion adjacent to the pressing surface. Eliminates the disadvantages of applying stress to the adherend caused by a delay in peeling such as peeling, and peeling failure from the adhesive sheet of the peeling tape such as edge peeling and peeling due to cutting, such as roller peeling It is possible to perform peeling that combines the advantages of smooth smooth peeling and reliable peeling such as edge peeling.

Further, by regulating the angle formed by the peeling tape and the adhesive sheet to a predetermined angle by the peeling angle regulating means, the direction of the peeling force acting on the adhesive sheet can be set appropriately, and the end of the adhesive sheet is Easy to peel.
Furthermore, by moving the peeling angle regulating means and adjusting the angle formed by the peeling tape and the adhesive sheet, the peeling force can be applied in an appropriate direction, and the adhesive sheet can be applied more smoothly and reliably. It can be peeled from the body.

The side view which shows the sheet peeling apparatus which concerns on embodiment of this invention. Operation | movement explanatory drawing of the sheet peeling apparatus of FIG. Operation | movement explanatory drawing of the sheet peeling apparatus following FIG. Operation | movement explanatory drawing of the sheet peeling apparatus following FIG. Operation | movement explanatory drawing of the sheet peeling apparatus which concerns on a prior art example.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In FIG. 1, a sheet peeling apparatus 1 is an apparatus that peels an adhesive sheet S affixed to the surface of a wafer W as an adherend using a tape (peeling tape) T, and holds the wafer W. Table 2 as means, tape placement means 3 for placing the tape T opposite to the adhesive sheet S, pasting means 4 for pressing and feeding the fed tape T against the adhesive sheet S, wafer W and tape T And a moving means 5 for relatively moving them. Here, the tape T is an adhesive tape in which a pressure-sensitive adhesive layer is laminated on one surface of the base sheet, and the adhesive layer is arranged to face the adhesive sheet S. Yes.

  The table 2 includes a flat table main body 21 that holds the wafer W by suction through a plurality of suction ports (not shown). The moving means 5 has a single-axis robot 51 provided on the lower side of the table main body 21 and its slider 52, and the table main body 21 is fixed to these sliders 52. It is configured to be movable in the left-right direction in FIG.

  The tape placement means 3 is supported by a frame (not shown). The frame includes a support roller 31 that supports the tape T by winding it in a roll shape, and a collection roller that collects the tape T together with the adhesive sheet S peeled from the wafer W. 32, a pair of drive rollers 34 and a pinch roller 35 for feeding the tape T, and a plurality of guide rollers 36 for guiding the tape T are provided. Further, the tape placement means 3 is supported by the rotating member 44 of the sticking means 4 and holds the tape T facing the adhesive sheet S, and the tape T between the holding rollers 37. And a pinch roller 38 for sandwiching. The support roller 31, the collection roller 32, the drive roller 34, and the holding roller 37 are driven by motors 31A, 32A, 34A, and 37A, respectively, so that the tape T is fed from the support roller 31 toward the collection roller 32. By being held between the holding rollers 37, the tape T is arranged to face the surface S 1 of the adhesive sheet S.

  The sticking means 4 includes a single-axis robot 41 provided between the support roller 31 and the collection roller 32, a single-axis robot 42 supported by the slider 41A of the single-axis robot 41, and a slider 42A of the single-axis robot 42. A rotary motor 43 fixed to the rotary motor 43, a plate-like rotary member 44 fixed to the output shaft of the rotary motor 43, a pressing motor 45 supported by the rotary member 44, and the pressing motor 45 A pressing head 46 serving as pressing means provided at the lower end of the output shaft 45A is provided. Further, the rotating member 44 is provided with a roller 47 as a peeling angle restricting means located below the tape T held between the holding rollers 37, and is bonded by the relative positional relationship between the roller 47 and the pressing head 46. The angle of the tape T with respect to the sheet S is regulated. Further, the pressing head 46 incorporates a heater 48 as a heating means.

  The pressing head 46 has a pressing surface 461 that presses the tape T against the adhesive sheet S with a 1/4 arc-shaped curved surface on the lower right side in the drawing centering on the axis O extending in the depth direction of the paper surface of FIG. And an edge forming portion 462 that forms an edge portion 46E adjacent to the pressing surface 461. The pressing head 46 is pushed downward by the driving of the pressing motor 45, and the pressed tape T portion is bent by an edge portion 46 E and is rolled by a roller 47 as shown in FIG. By being guided, the angle formed by the tape T and the adhesive sheet S is regulated to approximately 90 °.

  Further, as shown in FIG. 3, the rotation member 44 rotates the axis O that is the center of the arc of the pressing surface 461 by the synchronous drive of the single-axis robots 41 and 42 that constitute the rotation means and the rotation motor 43. It is designed to rotate around the center. By the rotation of the pressing head 46, the pressing surface 461 presses the tape T against the surface S1 of the adhesive sheet S, while the edge portion 46E rolls away from the wafer W, and the adhesive sheet S is peeled from the wafer W. It is configured as follows. In addition, since the holding roller 37, the pinch roller 38, and the roller 47 are also rotated by this rotation, the angle formed by the tape T and the adhesive sheet S is regulated to approximately 90 degrees.

Next, the operation of the sheet peeling apparatus 1 will be described as a method for peeling the adhesive sheet S in the present embodiment.
As a procedure for peeling the adhesive sheet S from the wafer W, first, as shown in FIG. 1, the wafer W is held at a predetermined position of the table 2 and the pressing head 46 of the sticking means 4 is retracted upward. Then, the motors 31A, 32A, 34A, 37A of the tape placement means 3 are driven to feed the tape T from the support roller 31 toward the collection roller 32. As a result, the tape T is held in a state of being stretched between the holding rollers 37, and the tape T is disposed so as to face the upper side of the adhesive sheet S.

  Next, as shown in FIG. 2, the sticking means 4 operates the pressing motor 45 to press down the pressing head 46, and lowers the tape T between the holding rollers 37 by the pressing surface 461. At this time, the motor 37A on the left side in FIG. 2 is locked, and the tape T is fed out by appropriate driving of the motor 37A on the right side in FIG. 2 and the motors 34A and 31A on the right side in FIG. Along the pressing surface 461 of the pressing head 46, the angle is regulated by the roller 47 and the edge portion 46E. Then, the pressing head 46 is lowered so that the edge portion 46E and the outer surface S1 of the adhesive sheet S coincide with each other, and presses the tape T against the adhesive sheet S. Thereafter, the rotation of the motors 37A, 34A, 31A is stopped to restrain the movement of the tape T between the holding rollers 37.

Next, as shown in FIG. 3, the sticking means 4 is configured so that the slider 41A moves rightward, the slider 42A moves downward, and the rotary motor is driven by the synchronous drive of the single-axis robots 41 and 42 and the rotary motor 43. When the output shaft 43 rotates to the right, the rotation member 44 and the pressing head 46 are rotated about the axis O. As a result, the pressing surface 461 presses the tape T against the surface S1 of the adhesive sheet S, while the edge portion 46E rolls away from the wafer W, and the adhesive sheet S attached to the tape T is peeled off from the wafer W. The As the pressing surface 461 rolls, the single-axis robot 51 moves the table 2 to the left side in FIG. 3 and controls the driving so that the rolling pressing surface 461 presses the tape T directly below the axis O. Has been.
As a result, the pressing surface 461 presses the wafer W downward while pulling the tape T or the adhesive sheet S to peel off the adhesive sheet S, and due to the presence of the edge portion 46E, as shown in the component diagram of FIG. If the pressing head 46 rotates even a little, the maximum peeling force (component force PH1 above the peeling force PH) can be obtained immediately. Therefore, the disadvantages such as applying stress to the wafer W due to the delay in peeling such as conventional roller peeling and peeling failure due to peeling or cutting from the adhesive sheet S of the tape T like edge peeling are eliminated, Peeling that combines the advantages of smooth peeling such as roller peeling and reliable peeling such as edge peeling can be performed.

  When the end portion of the adhesive sheet S is peeled off from the wafer W as described above, as shown in FIG. 4, the sticking means 4 returns the pressing head 46 with the pressing motor 45, and the tape placement means 3 includes the motor 31A, 32A, 34A, and 37A are driven, and the single-axis robot 51 moves the table 2 toward the left side in the figure. As a result, the tape T attached to the end of the adhesive sheet S and the wafer W move relative to each other, and the adhesive sheet S is peeled off from the wafer W. Thereafter, when the entire adhesive sheet S is peeled from the wafer W, the tape placement means 3 winds and collects the tape T by the collection roller 32. When the adhesive sheet S is peeled from the wafer W as described above, the wafer W is unloaded from the table 2 by an appropriate transfer device, and each part of the sheet peeling device 1 is returned to the initial position to complete the peeling procedure of the adhesive sheet S. To do.

According to this embodiment as described above, the following effects are obtained.
That is, since the adhesive sheet S is peeled by rotating the pressing head 46, the disadvantages of roller peeling and edge peeling are eliminated, and a peeling device that combines these advantages can be realized.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above embodiment, the case where the adherend is a semiconductor wafer is shown, but the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate are used. Adhesives can also be targeted, and examples of semiconductor wafers include silicon wafers and compound wafers. A peeling device or a peeling device for peeling an adhesive sheet (sheet, film, tape, etc.) affixed to the adherend. The present invention can also be applied to a method.
Further, as the peeling tape T, a heat-sensitive adhesive tape may be employed, and the tape T may be heated by the heater 48, or the pressure-sensitive adhesive tape may be bonded to the tape T. You may comprise so that it may heat to the temperature suitable for. Further, the adhesive sheet to be peeled is not limited to the adhesive sheet S, and may be an appropriate sheet, film, tape, or the like.

Also, the tape placement means has been illustrated and described as supplying a strip-shaped tape T. However, the tape T is not limited to a strip-shaped tape, and for example, a single-sheet tape obtained by cutting the tape T to an appropriate length is used. May be.
Further, the configuration for rotating the pressing head 46 is not limited to the configuration as in the above embodiment. That is, the pressing head 46 may be configured to rotate alone, or the pressing head 46 including the pressing motor 45 may be configured to rotate. Further, the single axis robot 41 may be omitted, and the movement in the left-right direction accompanying the rotation may be followed by the single axis robot 51 as a moving means. Alternatively, the single-axis robot 42 may be omitted, and a vertical movement mechanism may be provided in the moving means 5 or the table 2 and the vertical movement mechanism accompanying the rotation may be followed by the vertical movement mechanism.
Further, the roller 47 constituting the peeling angle regulating means may be provided so as to be movable in the left-right direction in FIG. 1 via a driving means (not shown). By forming in this way, for example, the peeling angle can be arbitrarily set according to the material and properties of the adhesive sheet S.
Further, each of the rollers 35, 36, 38, 47 in contact with the adhesive layer of the tape T may be subjected to non-adhesion processing.

1 Sheet peeling device 2 Table (holding means)
3 Tape placement means 4 Sticking means 5 Moving means 41 Single-axis robot (turning means)
42 Single-axis robot (turning means)
43 Rotating motor (turning means)
46 Pressing head (pressing means)
46E edge portion 47 roller (peeling angle regulating means)
461 Press surface S Adhesive sheet S1 Surface T Tape (peeling tape)
W Wafer (Substrate)

Claims (4)

A sheet peeling apparatus for peeling the adhesive sheet from the adherend having an adhesive sheet attached to the surface using a peeling tape,
A tape placement means for placing the peeling tape against the adhesive sheet;
Affixing means for pressing and adhering the peeling tape to the adhesive sheet;
Moving means for separating the adhesive sheet from the adherend by relatively moving the adherend and the peeling tape;
The sticking means includes a pressing means for pressing the peeling tape against the adhesive sheet, and a rotating means for rotating the pressing means.
The pressing means includes a pressing surface that can roll on the surface of the adhesive sheet via the peeling tape as the rotating means rotates, and an edge portion adjacent to the pressing surface. The sheet peeling apparatus characterized by the above-mentioned.   The sticking means includes a peeling angle restricting means for restricting an angle formed by the peeling tape outside the outer edge of the adhesive sheet and the adhesive sheet to a predetermined angle. The sheet peeling apparatus according to 1.   The said peeling angle control means is provided so that it can move in the direction along the surface of the said adhesive sheet, and it is comprised so that adjustment of the angle which the said tape for peeling and an adhesive sheet comprise is possible. The sheet peeling apparatus as described in. A sheet peeling method for peeling the adhesive sheet from the adherend having an adhesive sheet attached to the surface using a peeling tape,
Placing the peeling tape facing the adhesive sheet affixed to the adherend,
The peeling tape is pressed against the adhesive sheet by a pressing means having a pressing surface capable of rolling on the surface of the adhesive sheet via the peeling tape with rotation and an edge portion adjacent to the pressing surface. Pasted,
A sheet peeling method, wherein the pressing means is rotated to peel the adhesive sheet from the adherend.

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