JP2010219265A - Sheet peeling apparatus and sheet peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To press and paste a peeling tape to a adhesive sheet by a simple configuration, to fold and peel the adhesive sheet together with the peeling tape, and to prevent an adherend from being cracked or fractured due to the peel-off of the adhesive sheet even if the adherend has projections such as bumps. <P>SOLUTION: A sheet peeling device 10 includes: a delivery means 11 for delivering a peeling tape PT; a pressing means 12 for pressing and pasting the peeling tape PT to an adhesive sheet S pasted to a wafer W; a single-axis robot 16 for peeling the adhesive sheet S by relatively moving the peeling tape PT and the wafer W; and a collection means 13 for collecting the adhesive sheet S together with the peeling tape PT. The pressing means 12 includes a plate member 22 capable of being folded while pressing the adhesive sheet S to the wafer W at a tip side. The plate member 22 is provided so as to be deformable when pressed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, a sheet capable of adhering a peeling tape to an adhesive sheet affixed to an adherend and peeling the adhesive sheet through the peeling tape. The present invention relates to a peeling apparatus and a peeling method.

  In the processing process of a semiconductor wafer (hereinafter simply referred to as “wafer”), the wafer is subjected to various processes such as backside grinding after a protective adhesive sheet is attached to its circuit surface, and this bonding is performed before dicing. The sheet is peeled off. Such an adhesive sheet peeling apparatus is disclosed in, for example, Patent Documents 1 and 2. In these documents, the adhesive tape is adhered to the wafer by pressing the adhesive tape against the adhesive sheet with the tip of the edge member and relatively moving the edge member and the wafer while folding the adhesive sheet together with the adhesive tape. The sheet is peeled off.

JP 2002-124494 A Utility Model Registration No. 2552501

However, in Patent Document 1, when bumps are provided on the bonding surface of the adhesive sheet on the wafer, there is a disadvantage that the bumps are peeled off or damaged by the edge member.
Moreover, in patent document 2, since it is comprised so that an edge member may be moved up and down via a spring, the number of parts increases and it will be inconvenient that it will become a complicated structure. Furthermore, since the edge member as a whole is lifted when the tip of the edge member passes through the bump, the pressing force by the edge member is insufficient or not applied in the region where the bump does not exist, and the adhesive sheet This causes a disadvantage that the wafer is lifted and cracked together with the adhesive sheet without being peeled off.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to press and affix the peeling tape to the adhesive sheet with a simple configuration and fold the adhesive sheet together with the peeling tape. An object of the present invention is to provide a sheet peeling apparatus and a peeling method that can be peeled off.
Another object of the present invention is to provide a sheet peeling apparatus and a peeling device capable of preventing the adherend from being cracked or broken due to peeling of the adhesive sheet even if the adherend has protrusions such as bumps. It is to provide a method.

In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape.
A feeding means for feeding out the peeling tape, a pressing means for pressing and attaching the peeling tape to the adhesive sheet, a moving means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend, and peeling A recovery means for recovering the adhesive sheet together with the tape for use,
The pressing means includes a plate member that is capable of folding the adhesive sheet while pressing the adhesive sheet against the adherend on the tip side, and the plate member is provided so as to be able to bend and deform when pressed. ing.

  In this invention, it is preferable that the said pressing means is equipped with the rotation means which supports the base end side of a plate member, and supports the said plate member so that rotation is possible.

  Further, the rotation means preferably includes a detection means for detecting a pressing force to the adhesive sheet by the plate member, and a configuration in which the pressing force of the plate member is controlled based on the detection result of the detection means is preferably employed. Is done.

  Furthermore, the plate member may include a heating means.

In addition, a plurality of protrusions are provided on the bonding surface of the adhesive sheet in the adherend,
The plate member is oriented in an inclined direction with respect to the affixing surface, provided so as to be deformable in a direction bulging toward the affixing surface, and provided so as to be partially deformable along the shape of the protrusion. Can be adopted.

Furthermore, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape.
A step of pressing and adhering the peeling tape to an adhesive sheet;
The peeling tape is fed out while relatively moving the peeling tape and the adherend, and the adhesive sheet is peeled off from the adherend by pressing the adhesive sheet against the adherend at the front end side of the plate member that is bent and deformed. Process,
And a step of recovering the adhesive sheet together with the peeling tape.

According to the present invention, since the plate member that presses and peels off the adhesive sheet is provided so as to be able to bend and deform, the configuration in which the edge member is moved up and down via a spring as in the conventional example is eliminated, which is very simple. With the configuration, the peeling tape can be pressed and pasted onto the adhesive sheet via the plate member, and the adhesive sheet can be peeled off while being folded back by the plate member together with the peeling tape.
Also, even if the adherend has a plurality of bumps or other protrusions on the adhesive sheet application surface, when the tip of the plate member passes over the protrusion, the adhesive sheet is attached while flexing and deforming the plate member. Can be pressed against the body. Specifically, the deformation of the plate member itself allows the tip to move along the shape of the protrusion, and the plate member can be deformed so as to be partially recessed along the shape of the protrusion. This not only prevents the protrusions from being damaged by the plate member, but also uniformly presses all areas of the adhesive sheet to prevent the adherend from cracking or breaking when the adhesive sheet is peeled off. Can do.

  Further, when the plate member can be turned by the turning means, the direction of the plate member can be easily changed. As a result, it is possible to cope with various conditions such as shifting the tip position of the plate member to advance the peeling of the adhesive sheet and adjusting the pressing force of the plate member to the adhesive sheet.

  Further, since the rotating means is provided with a detecting means for detecting the pressing force to the adhesive sheet, the pressing force of the plate member can be kept at a predetermined value based on the detection result of the detecting means, and the adherend is excessively attached. It is possible to prevent a pressing force from being applied and to prevent the adherend from cracking.

  In addition, when the plate member is provided with heating means, the hardness of the plate member can be reduced by heating, and the plate member can be further easily deformed and deformed, and the adhesive sheet can be made easier. It is also possible to soften the adhesive so that the adhesive sheet is easily peeled off from the adherend.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. Explanatory drawing of the peeling initial stage of an adhesive sheet. The principal part enlarged front view during adhesive sheet peeling. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 4, the sheet peeling apparatus 10 includes a feeding means 11 that feeds a strip-shaped peeling tape PT, and affixing the peeling tape PT to an adhesive sheet S that is stuck to a wafer W as an adherend. Pressing means 12, collecting means 13 capable of winding the peeling tape PT, table 15 for holding the wafer W by suction, and uniaxial as moving means for moving the table 15 in the left-right direction in FIG. And a robot 16. The feeding means 11, the pressing means 12, and the collecting means 13 are supported above the table 15 via a frame F that can move in the vertical direction in FIG.

  The feeding means 11 supports the peeling tape PT wound in a roll shape, and supports a support roller 18 that can be rotated by a motor M 1, a drive roller 19 that is rotated by a motor M 2, and the drive roller 19. And a pinch roller 20 that sandwiches the peeling tape PT. The surface of the pinch roller 20 is subjected to a non-adhesion treatment with a fluororesin or the like so that the peeling tape PT does not adhere.

  The pressing means 12 includes a plate member 22 capable of pressing the peeling tape PT against the adhesive sheet S while folding the peeling tape PT fed from the feeding means 11 on the tip (left end in FIG. 1) side, and the plate. Rotating means 23 that supports the base end (right end in FIG. 1) side of the member 22 and rotatably supports the plate member 22 is configured.

The plate member 22 is provided in a shape that is inclined toward the lower left in FIG. 1 with respect to the upper surface of the wafer W and that becomes thinner toward the tip. The plate member 22 is made of an elastically deformable material such as resin, metal, or rubber. Thereby, as shown in FIG. 2, the plate member 22 is curved and bulges toward the upper surface side of the wafer W when the peeling tape PT and the adhesive sheet S are pressed downward in the figure. The peeling tape PT is provided so as to be able to be pressed against the adhesive sheet S. In addition, as shown in FIG. 4, the plate member 22 is, for example, a case where bumps B as a plurality of protrusions are provided on the bonding surface of the adhesive sheet S on the wafer W, that is, the upper surface in FIG. 1. When the surface of the bump B is pressed, it is provided so as to be elastically deformed so as to be partially recessed along the shape of the bump B.
As shown in FIG. 3, a heating unit 25 including a heater is built in the tip side of the plate member 22. By this heating means 25, the plate member 22 is heated, its hardness is lowered, the plate member 22 can be more easily deformed flexibly and partially recessed, and the followability to the bump B is improved. In addition, the adhesive of the adhesive sheet S can be softened so that the adhesive sheet S can be easily peeled off from the wafer W. Further, when a heat-sensitive adhesive tape is used as the peeling tape PT, the adhesive sheet S can be peeled while the peeling tape PT is heated and applied to the adhesive sheet S.

  The rotating means 23 includes a motor M3 and a connecting member 26 that connects the output shaft of the motor M3 and the base end side of the plate member 22. The motor M3 is composed of a torque-sensitive servomotor or the like that can rotate forward and reverse, and can function as a detection unit that detects a pressing force applied to the adhesive sheet S by the plate member 22. Further, the motor M3 is controlled so that the rotation direction, the rotation speed, the torque, and the like become predetermined values based on the detection result of the pressing force by the plate member 22, so that the pressing force of the plate member 22 can be controlled. Is provided. Thereby, it is possible to prevent an excessive pressing force from being applied to the wafer W and to prevent the wafer W from cracking.

  The collecting means 13 includes a driving roller 28 that is rotated by a motor M4, a pinch roller 29 that sandwiches the peeling tape PT between the driving roller 28, and a winding roller that is rotated by the motor M5 and winds up the peeling tape PT. And a roller 30. The drive roller 28 is also subjected to the same non-adhesion treatment as the pinch roller 20.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  As shown in FIG. 1, the wafer W to which the adhesive sheet S is stuck at a predetermined position on the table 15 is sucked and held by a conveying means (not shown). When the suction holding of the wafer W is confirmed, the table 15 is moved via the single-axis robot 16, and it is detected by the output pulse of the single-axis robot 16 that the wafer W has reached a predetermined position below the plate member 22. The driving of the single axis robot 16 is stopped. Thereafter, the frame F is lowered by a driving means (not shown), and stops in a state where the front end of the plate member 22 is in contact with the left end of the adhesive sheet S as shown in FIG.

  Thereafter, the motor M3 is driven to rotate so that the plate member 22 bends, and the peeling tape PT is pressed and stuck to the adhesive sheet S at the tip of the plate member 22, and the pressing force is predetermined by the detection means of the motor M3. It is detected that the value has been reached, and the driving of the motor M3 stops. At this time, the position of the tip of the plate member 22 is moved to the right side in FIG. 1 due to the bending of the plate member 22, but the single axis robot 16 in FIG. 1 causes the table 15 to follow the movement of the position of the tip of the plate member 22. Since it is controlled to move to the right side, the front end position of the plate member 22 is controlled so as not to deviate from the left end position of the adhesive sheet S. Further, the loosening of the peeling tape PT due to the bending of the plate member 22 is taken up by the rotation of the motors M4 and M5.

  Then, as shown in FIG. 2, the table 15 is moved to the left via the single-axis robot 16 so that the peeling tape PT and the wafer W are relatively moved in the left-right direction in the drawing. As a result, the adhesive sheet S is folded back while being pressed onto the wafer W by the plate member 22, and the peeling of the adhesive sheet S proceeds toward the right side in FIG. At this time, the support roller 18, the drive rollers 19 and 28, and the take-up roller 30 are driven by motors that drive the table 15 in synchronization with the movement of the table 15, and the peeling tape PT is unwound from the support roller 18 and wound. The take-up roller 30 winds the adhesive sheet S together with the peeling tape PT.

  Here, during the peeling of the adhesive sheet S, when the tip of the plate member 22 passes over the bump B, the tip of the plate member 22 bends and deforms along the shape of the bump B as shown in FIG. . In addition, as shown in FIG. 4, the plate member 22 is elastically deformed so as to be partially recessed along the shape of the bump B. Further, in the motor M3, the pressing force applied to the adhesive sheet S by the plate member 22 is controlled to be a predetermined value by the detecting means, so that no excessive pressing force is applied to the wafer W.

  Therefore, according to such an embodiment, since the plate member 22 is bent and deformed, the peeling tape PT is pressed and pasted to the adhesive sheet S via the plate member 22 with a simple configuration, and the peeling tape PT At the same time, the adhesive sheet S can be peeled off while being folded back by the plate member 22. Further, even if a large number of bumps B are arranged on the wafer W in an intricate manner, the adhesive sheet S in the peripheral area of the bumps B can be pressed firmly at the tip of the plate member 22 and the wafer W is lifted together with the adhesive sheet S. It is possible to avoid cracking.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the single-axis robot 16 may be replaced with driving means such as a direct acting motor, an air cylinder, or a hydraulic cylinder.

  Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer. Furthermore, the protrusion of the adherend is not limited to the bump B, and various modifications can be made. Further, the sheet peeling apparatus and the peeling method of the present invention can be applied to an adherend having no protrusion on the adherend.

  Further, a single-axis robot 16 serving as a moving means may be provided on the frame F side, the table 15 may be stopped, the peeling tape PT and the wafer W may be moved relative to each other, and the adhesive sheet S may be peeled off. A single-axis robot 16 serving as a moving means may be provided on both the means 12 and the table 15, and the peeling tape PT and the wafer W may be moved to peel off the adhesive sheet S.

  The peeling tape PT may be a heat-sensitive adhesive tape or a pressure-sensitive adhesive tape. Further, as the peeling tape PT, a single-wafer type peeling tape PT having a predetermined length can be used in addition to the belt-like one as in the above embodiment.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Feeding means 12 Pressing means 13 Collecting means 16 Single axis robot (moving means)
22 Plate member 23 Rotating means 25 Heating means B Bump (projection)
M3 motor (detection means)
PT Stripping tape S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (6)

In the sheet peeling apparatus for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A feeding means for feeding out the peeling tape, a pressing means for pressing and attaching the peeling tape to the adhesive sheet, a moving means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend, and peeling A recovery means for recovering the adhesive sheet together with the tape for use,
The pressing means includes a plate member capable of folding the adhesive sheet while pressing the adhesive sheet against the adherend on the tip side, and the plate member is provided so as to be able to bend and deform when pressed. Sheet peeling device.   2. The sheet peeling apparatus according to claim 1, wherein the pressing unit includes a rotating unit that supports the base end side of the plate member and rotatably supports the plate member.   3. The rotating means includes a detecting means for detecting a pressing force applied to the adhesive sheet by the plate member, and the pressing force of the plate member is controlled based on a detection result of the detecting means. Sheet peeling device.   The sheet peeling apparatus according to claim 1, 2 or 3, wherein the plate member includes a heating means. A plurality of protrusions are provided on the bonding surface of the adhesive sheet in the adherend,
The plate member is oriented in an inclined direction with respect to the affixing surface, provided so as to be deformable in a direction bulging toward the affixing surface, and provided so as to be partially deformable along the shape of the protrusion. The sheet peeling apparatus according to claim 1, wherein the sheet peeling apparatus is provided. In the sheet peeling method for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A step of pressing and adhering the peeling tape to an adhesive sheet;
The peeling tape is fed out while relatively moving the peeling tape and the adherend, and the adhesive sheet is peeled off from the adherend by pressing the adhesive sheet against the adherend at the front end side of the plate member that is bent and deformed. Process,
And a step of recovering the adhesive sheet together with the peeling tape.

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