JP5006176B2 - Sheet cutting method - Google Patents

Description

  The present invention relates to a sheet cutting method, and more specifically, a sheet in which an adhesive sheet having a size protruding from the outer periphery of the adherend is attached to the adherend, and then the adhesive sheet is cut according to the size of the adherend. It relates to a cutting method.

Conventionally, a semiconductor wafer (hereinafter simply referred to as “wafer”) has an adhesive sheet as a protective sheet attached to the circuit surface forming side, and various processing such as backside grinding with the adhesive sheet attached. It is to give.
When affixing an adhesive sheet to a wafer, a method of cutting out and adhering a belt-like adhesive sheet having a size protruding from the outer periphery of the wafer onto the wafer, and then cutting the adhesive sheet according to the size of the wafer Is known (see, for example, Patent Document 1). Here, in the cutting method of the adhesive sheet (die bonding tape) described in Patent Document 1, suction grooves are formed on the outer table (tape support table), and the adhesive sheet is cut according to the size of the wafer. When this is done, a technique is adopted in which the suction groove is decompressed and an unnecessary adhesive sheet portion that protrudes outside the adhesive sheet affixed on the wafer is raised to prevent re-adhesion of the cut site.

JP 2002-134438 A

However, recent wafers are required to be ground back so as to have a very thin thickness (several tens of μm), and have rigidity so that the wafer after grinding is not broken by an impact in a transfer process or the like. It is necessary to use an adhesive sheet or a thick adhesive sheet.
Therefore, in the method described in Patent Document 1, it is difficult for the adhesive sheet to rise along the suction concave groove, which causes inconvenience that re-adhesion occurs at the cut site.
In addition, since the suction groove must be formed in the outer table, not only the structure of the outer table itself is complicated, but also the manufacturing cost is increased.

FIG. 4 shows a state where the adhesive sheet S is cut by a conventional cutting method and the wafer W is lifted by the transfer arm H.
However, in such a sheet cutting method, the adhesive sheet S attached to the wafer W after cutting and the unnecessary adhesive sheet S1 located outside the wafer W may re-adhere over time, and in such a state When the wafer W is lifted by the transfer arm H, a phenomenon in which the adhesive A extends between the cut end surfaces and pulls the yarn (hereinafter referred to as “thread drawing phenomenon”) occurs. When the back surface grinding of the wafer W is performed in such a state, the thread-like adhesive A is caught in the grindstone, causing the wafer W to be damaged or clinging to the grindstone, thereby reducing the grinding accuracy.
Furthermore, when an adhesive sheet with rigidity as described above or a thick adhesive sheet is used, it is difficult to cut with a normal cutter, so when cutting while melting the adhesive sheet by heating the cutter blade etc. There is. In such a case, a stringing phenomenon may occur due to re-adhesion of the base sheet in addition to the adhesive.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is that even if an adhesive sheet affixed to an adherend such as a wafer and an unnecessary adhesive sheet outside are re-adhered. An object of the present invention is to provide a sheet cutting method that does not cause a stringing phenomenon.
Another object of the present invention is to provide a sheet cutting method that does not require special processing on the upper surface of the table that supports the adherend.

  In order to achieve the above object, the present invention attaches an adhesive sheet of a size that protrudes from the outer periphery of the adherend while supporting the adherend on the inner table provided on the inner peripheral side of the outer table, In the sheet cutting method of cutting the adhesive sheet according to the size of the adherend, after the adhesive sheet is cut, the outer table and the inner table are rotated relative to each other about an axis that is orthogonal to the bonding surface of the adhesive sheet. Then, the technique of separating the adhesive sheet affixed to the adherend and the unnecessary adhesive sheet on the outside is employed.

  In this invention, you may make it isolate | separate the adhesive sheet affixed to the to-be-adhered body by making the said outer table and an inner table relatively displace in the said rotation center axis direction, and an outer unnecessary adhesive sheet.

Furthermore, it is preferable that the adhesive sheet is pressed against the outer table when the outer table and the inner table are relatively rotated or relatively displaced.

  Moreover, the method of performing the said cutting | disconnection in the state which heated at least 1 of the said cutting | disconnection means, an outer side table, and an inner side table can be taken.

According to the present invention, after the adhesive sheet is cut, the outer table and the inner table rotate relative to each other about an axis orthogonal to the adhesive sheet's application surface, so that even if re-adhesion occurs after cutting, the re-adhesion The portion extends in the lateral direction and is cut, and the edge of the adhesive sheet affixed to the adherend and the unnecessary adhesive sheet on the outside is completely cut. In such a state, the adhesive sheet affixed to the adherend and the outer unnecessary adhesive sheet are separated, so that the stringing phenomenon can be prevented from occurring. Therefore, for example, it is possible to eliminate the inconvenience that the adhesive sheet that protects the circuit surface of the wafer using the adherend as a wafer causes a stringing phenomenon and is caught in the grindstone.
In addition, if the method of pressing the adhesive sheet against the outer table is employed, twisting and twisting of the adhesive sheet can be reliably eliminated when the outer table and the inner table are relatively rotated or relatively displaced.
Further, when the cutting means is configured to be able to cut in a heated state, even if a rigid adhesive sheet or a thick adhesive sheet is applied, the adhesive sheet can be melted and cut. it can. In this case, after cutting while melting the adhesive sheet, even if there is a possibility that the base sheet re-adheres to cause a stringing phenomenon, it can be effectively prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view of a sheet sticking apparatus to which the sheet sticking method according to the present embodiment is applied. In this figure, the sheet sticking device 10 supports the raw fabric R in which the belt-like adhesive sheet S composed of the adhesive A and the base sheet B is temporarily attached to one surface of the belt-like release sheet RL so as to be able to be fed out. Roller 11, collection means 12 for collecting release sheet RL, peel plate 13 for peeling release sheet RL from original fabric R, table 15 for supporting wafer W as an adherend, and adhesive sheet S for wafer W And a winding means 17 that doubles the adhesive sheet S and winds up the unnecessary adhesive sheet S1 generated outside the wafer W by the cutting. .

  The collecting means 12 includes a drive roller 20, a pinch roller 21 that sandwiches the release sheet RL between the drive roller 20, and a recovery roller 14 that winds up the release sheet RL, and is connected to an output shaft of a motor (not shown). Thus, the drive roller 20 and the collection roller 14 are rotated synchronously.

The table 15 includes an outer table T1 and an inner table T2. As shown in FIGS. 1 and 2, the outer table T <b> 1 includes a bottom portion 23 having a substantially square planar shape, and four side portions 24 connected to the outer periphery of the bottom portion 23. It is provided in the shape of a bottomed container having a circular recess 25. On the other hand, the inner table T2 has a circular shape with a size for forming a gap C between the inner peripheral surface of the side portion 24, and the upper surface thereof is formed as a suction surface for sucking and holding the wafer W. .
The inner table T <b> 2 is disposed in the recess 25 through a motor 27 and a linear motion motor 28 disposed on the bottom 23. The motor 27 enables the outer table T1 and the inner table T2 to rotate relative to each other in a plane around the axis orthogonal to the application surface of the adhesive sheet S, while the linear motor 28 has the outer table T1 and the inner table T2. Are relatively displaced in a direction perpendicular to the plane, that is, in the axial direction of the rotation center. In the present embodiment, a heater (not shown) can be incorporated in the outer table T1 and / or the inner table T2, thereby making the adhesive sheet S soft and easy to cut.

  The cutting means 16 includes a cutter blade 30 that is heated by a heater (not shown), an arm 31 that holds the cutter blade 30, a rotary shaft 32 that rotates the arm 31 in a plane, the rotary shaft 32, and the arm 31. And a motor (not shown) that rotates the cutter blade 30 along the outer periphery of the wafer W. Thereby, even if the adhesive sheet S which has the base material sheet B provided with rigidity and the thick base material sheet B is employ | adopted, it can cut | disconnect, melt | dissolving the base material sheet B.

  The winding means 17 sandwiches the adhesive sheet S between the frame F provided so as to be movable in the left-right direction in FIG. 1, the driving roller 35 supported by the frame F, and the driving roller 35. The pinch roller 36 and a take-up roller 37 that takes up the unnecessary adhesive sheet S1 are connected to an output shaft of a motor (not shown) so that the drive roller 35 and the take-up roller 37 rotate synchronously. Further, a press roller 40 is disposed in the vicinity of the drive roller 35. The press roller 40 is provided so as to be movable in the vertical direction, and along the upper surfaces of the outer table T1 and the inner table T2. It is provided to be movable.

  Next, a sheet cutting method in the present embodiment will be described with reference to FIG.

  As an initial operation, the original fabric R is pulled out from the support roller 11, the release sheet RL is peeled off at the tip position of the peel plate 13, and the lead end of the release sheet RL is fixed to the collection roller 14. On the other hand, the lead end of the adhesive sheet S from which the release sheet RL has been peeled is fixed to the winding roller 37. Further, as shown in FIG. 1, the inner table T2 is driven and controlled by a sensor (not shown) and a linear motion motor 28 so that the upper surface of the wafer W to be placed is at the same level as the upper surface of the outer table T1. .

  When the wafer W is transferred to the inner table T2 via a transfer arm (not shown), the frame F and the press roller 40 are lowered from the solid line position in FIG. 1 to the two-dot chain line position. Then, the press roller 40 rotates and moves to the left while applying a pressing force to the adhesive sheet S, and moves to the top of the left side 24 in the figure, while the drive roller 35 rolls the adhesive sheet S to the right Move to the top of the side 24 (see FIG. 2). As a result, the adhesive sheet S is adhered to the outer table T1 and the upper surface of the wafer W, and the adhesive sheet S is kept pressed against the outer table T1 by the press roller 40 and the driving roller 35.

  Next, after the cutting means 16 is lowered and lowered to a position where the cutter blade 30 pierces the adhesive sheet S, the adhesive sheet S is cut according to the size of the wafer W by rotating along the outer periphery of the wafer W. .

  After the adhesive sheet S is cut, the cutting means 16 is retracted upward, and the inner table T2 is rotated in a plane via the motor 27. Even if the adhesive A and the melted base sheet B are re-adhered by this rotation, as shown in FIG. 3, some of the re-adhered adhesive A and the base sheet B extend in the lateral direction. (See A1 and B1 in the figure) The edge is completely cut off from the unnecessary sheet S1. When the inner table T2 is rotated, the press roller 40 and the driving roller 35 keep the adhesive sheet S pressed against the upper surface of the outer table T1, and the adhesive sheet S is not twisted or rolled up. . After the inner table T2 is rotated in the plane, the inner table T2 is raised via the linear motor 28, and stringing is performed between the adhesive sheet S on the wafer W and the unnecessary adhesive sheet S1 on the outer table T1. Separation without occurrence of phenomenon.

  Next, the wafer W is removed from the inner table T2 via a transfer arm (not shown) and transferred to a predetermined position, and the inner table T2 returns to the initial planar height position.

Thereafter, with the support roller 11 locked in rotation, the frame F moves in the left direction, and the drive roller 35 and the take-up roller 37 rotate in the direction to wind up the unnecessary adhesive sheet S1 to cause unnecessary adhesive sheet S1. It rises after winding up. Then, while the rotation of the driving roller 35 is locked, the rotation lock of the feeding roller 11 is released and the frame F moves to the right, and returns to the solid line position in FIG. 1 to prepare for the next sheet sticking. S is pulled out.
Thereafter, the adhesive sheet S can be pasted and cut by the same operation.

  Therefore, according to such an embodiment, after cutting the adhesive sheet S, the threading phenomenon can be prevented by rotating the inner table T2 in the plane, and the subsequent back surface grinding of the wafer W can be prevented. Inconvenience that the thread drawing portion is caught in the grindstone can be solved.

The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, those skilled in the art can make various modifications in shape, material, quantity, and other detailed configurations.
Accordingly, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which excluded the limitation of all or part is included in this invention.

For example, in the above-described embodiment, the configuration in which the outer table T1 is fixed and the inner table T2 is rotated has been illustrated and described. However, when the configuration is such that a single wafer adhesive sheet is attached to the wafer W and cut, T1 may be fixed and the outer table T1 may be rotated in a plane.
Further, the outer table T2 may be displaced, and the inner table T2 may be relatively raised or lowered. However, in this case, it becomes necessary to support the inner table T2 independently of the outer table T1.

  Further, as the cutting means 16, an articulated robot whose movement trajectory is numerically controlled may be used, and a cutter blade may be configured to be detachable at the end of the robot arm. When this configuration is adopted, a configuration in which the transfer arm is changed to a cutter blade can be adopted, and the wafer W can be transferred.

  Further, the adherend is not limited to the wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer is a silicon wafer or a compound wafer. There may be.

  Further, when the outer table T1 and the inner table T2 are relatively rotated or displaced, the pressing member 40 that presses the adhesive sheet S against the outer table uses another pressing member in addition to the press roller 40 and the driving roller 35. May be.

  The inner table T2 may be relatively displaced while rotating relative to the outer table T1, and the angle of relative rotation can be arbitrarily set.

  Further, the unnecessary adhesive sheet S1 may be wound up by the winding means 17 after the relative rotation of the inner table T2.

The schematic front view of the sheet sticking apparatus with which the sheet cutting method in this embodiment was applied. The partial schematic perspective view of FIG. The principal part enlarged view which shows the state which rotated the inner side table in the plane and raised it. The figure for demonstrating the conventional inconvenience.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 16 Cutting means 27 Motor 28 Linear motion motor 30 Cutter blade T1 Outer table T2 Inner table A Adhesive S Adhesive sheet S1 Unnecessary adhesive sheet RL Release sheet W Semiconductor wafer (Substrate)

Claims (4)

In a state where the adherend is supported on the inner table provided on the inner peripheral side of the outer table, an adhesive sheet that protrudes from the outer periphery of the adherend is pasted, and the adhesive sheet is adjusted to the size of the adherend. In the sheet cutting method of cutting
After cutting the adhesive sheet, the outer table and the inner table are rotated relative to each other about an axis orthogonal to the adhesive sheet application surface, and then the adhesive sheet attached to the adherend and the unnecessary adhesive on the outer side. A sheet cutting method comprising separating a sheet. The sheet cutting according to claim 1, wherein the outer sheet and the inner table are relatively displaced in the direction of the rotation center axis to separate the adhesive sheet adhered to the adherend and the outer unnecessary adhesive sheet. Method.   The sheet cutting method according to claim 1 or 2, wherein the adhesive sheet is pressed against the outer table when the outer table and the inner table are relatively rotated or relatively displaced.   4. The sheet cutting method according to claim 1, wherein the cutting is performed while at least one of the cutting means, the outer table, and the inner table is heated.

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