JP5430087B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to a circuit surface side of a semiconductor wafer.

  Recently, in semiconductor wafers (hereinafter simply referred to as “wafers”), ultra-thin grinding is required, but the wafer diameter tends to increase. For this reason, in transporting a wafer that has been ground to an extremely thin thickness, the wafer is transported in a state of being warped by its own weight, so that there is a disadvantage that the wafer is broken. Here, in order to avoid such an inconvenience, a wafer having a form disclosed in Patent Document 1 is used. In this document, by grinding so that the thickness of the outer edge side of the wafer is relatively larger than the thickness of the other regions, a recess is formed, and this outer edge is made the remaining circumferential portion, which serves as a reinforcing material. Thus, the wafer can be prevented from being damaged.

  In forming the recess as described above, a protective adhesive sheet is applied to the circuit surface side of the wafer and backside grinding is performed. As an apparatus for attaching an adhesive sheet to a wafer, an apparatus that presses and attaches an adhesive sheet to a wafer placed on a table is known (see Patent Document 2).

JP 2007-19379 A JP 2001-148212 A

  However, the affixing device as in Patent Document 2 is not compatible with the case of adhering an adhesive sheet to a wafer in which a recess is formed after that as in Patent Document 1, and is located at an appropriate position inside the outer periphery of the wafer. If the adhesive sheet is affixed so as to fit in the wafer, as shown in FIG. 4, the wafer W is damaged when the adhesive sheet S is peeled after the back surface grinding. That is, when the peeling tape PT is pasted with the pasting roller R on the table on which the convex portion T1 that contacts the bottom of the concave portion W1 is formed, a gap CL is generated between the lower surface of the wafer W and the upper surface of the table T. As a result, the load is concentrated in the vicinity of the corner between the bottom of the recess W1 and the inner standing surface, and a crack C is caused.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to provide an adhesive sheet in advance so as not to cause damage such as cracks on the wafer from which a recess is formed. It is in providing the sheet sticking apparatus and sticking method which can stick.

To achieve the above object, the present invention is, before the step of forming a recess on one surface of the thickness of the outer edge side is made larger than the thickness of other regions of the semiconductor wafer, the other surface of the semiconductor wafer A sheet sticking device for sticking the adhesive sheet in advance as a position corresponding to the position where the concave portion is formed on the circuit surface side to be a sticking position of the adhesive sheet ,
The semiconductor wafer includes a flat surface portion on which a circuit surface is formed and a curved surface portion connected to an outer periphery of the flat surface portion, and the diameter of the adhesive sheet is set to be the same as the diameter of the bottom surface of the concave portion, It fits within the plane part and is set so as to be able to cover the entire circuit surface,
Holding means for mounting and holding the semiconductor wafer; support means for supporting the original fabric in which an adhesive sheet is temporarily attached to one surface of a strip-shaped release sheet; feeding means for feeding out the original fabric; A peeling means for peeling the adhesive sheet from the release sheet in the course of feeding out, a pressing means for pressing and sticking the adhesive sheet peeled by the peeling means to the semiconductor wafer, and a control means for controlling these means,
The control means includes storage means for storing the diameter of the semiconductor wafer and the diameter of the adhesive sheet via the input means, and controls the position where the adhesive sheet is attached based on the data stored in the storage means. The structure is adopted.

Further, the sheet sticking method of the present invention is the step before forming the concave portion on one surface by making the thickness of the outer edge side of the semiconductor wafer larger than the thickness of the other region, and the other surface of the semiconductor wafer. A sheet sticking method for sticking an adhesive sheet in advance as a sticking position of the adhesive sheet at a position corresponding to the position where the concave portion is formed on the circuit surface side,
The semiconductor wafer includes a flat surface portion on which a circuit surface is formed and a curved surface portion connected to an outer periphery of the flat surface portion, and the diameter of the adhesive sheet is set to be the same as the diameter of the bottom surface of the concave portion, It fits within the plane part and is set so as to be able to cover the entire circuit surface,
Storing the diameter of the semiconductor wafer and the diameter of the adhesive sheet in a storage means via a predetermined input means;
A step of feeding the raw one of the adhesive to the surface sheet of the band-shaped release sheet is temporarily adhered,
Peeling the adhesive sheet from the release sheet in the course of unwinding the original fabric,
A method is adopted in which a step of pressing and adhering the adhesive sheet to the adhesive sheet application position determined by the control means based on the data stored in the storage means is performed.

  According to the present invention, since the adhesive sheet is pasted before forming the recess in the semiconductor wafer, it is possible to prevent the wafer from cracking when the sheet is pasted due to the formation of the recess. In addition, by storing the respective diameters of the semiconductor wafer and the adhesive sheet in the storage means, the control means can control the position where the adhesive sheet is applied so as to be optimal according to the formation position of the recess and the circuit surface. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The schematic front view of the sheet sticking apparatus which concerns on FIG. 1 is shown by FIG. In this figure, a sheet sticking apparatus 10 is a belt-like member in which a circular adhesive sheet S is temporarily attached to a holding member 11 for placing and holding a substantially circular wafer W and a belt-like release sheet RL at a predetermined interval. The supporting means 12 for supporting the original fabric R, the feeding means 13 for applying the output to the original fabric R, and the original fabric R in the middle of being fed out through the feeding means 13 are folded back so that the adhesive sheet S is removed from the release sheet RL. A peeling plate 15 as a peeling means for peeling, a pressing means 16 for pressing and sticking the adhesive sheet S peeled from the peeling sheet RL to the wafer W, an input means 17 for inputting the diameter and the like of the wafer W, The holding means 11, the feeding means 13, the pressing means 16 and the control means 18 for controlling the input means 17 as a whole are configured. Note that the wafer W is expressed as a substantially circular shape because a V-notch indicating the crystal orientation, an orientation flat, and the like are formed. Also, the diameter of the wafer is the diameter of the circumferential portion excluding V notches and orientation flats.

  The wafer W is connected so as to connect the flat upper plane portion F1 and the lower plane portion F2 that are parallel to each other in the vertical direction in FIG. 2 and the outer peripheries of the upper plane portion F1 and the lower plane portion F2, and the outer edge of the wafer W. And a curved surface portion F3 (left and right surfaces in FIG. 2) having a semicircular arc shape when viewed from the front. A circuit surface F4 is formed on the upper flat surface portion F1. Further, the lower surface portion F2 side of the wafer W is ground after the adhesive sheet S is pasted, so that a concave portion W1 having a circular shape in plan view is formed at a position indicated by a two-dot chain line in FIG. When the concave portion W1 is formed, a remaining circumferential portion W2 that forms the outer edge of the wafer W is provided continuously to the outer periphery of the concave portion W1, and the thickness of the outer edge side of the wafer W is relative to the thickness of the other region. Become bigger. The recess W1 includes a bottom surface W1a and an inner standing surface W1b extending downward from the outer edge of the bottom surface W1a in FIG. Here, as shown in FIG. 2, when the width D1 of the area of the circuit surface F4, the diameter D2 of the bottom surface W1a, the diameter D3 of the upper flat surface portion F1 and the lower flat surface portion F2, and the diameter D4 of the wafer W, The magnitude has a correlation such that D1 <D2 <D3 <D4.

  As shown in FIG. 3, the diameter of the adhesive sheet S is set to be the same as the diameter D2 of the bottom surface W1a. Accordingly, the adhesive sheet S is formed in a plane size that can be accommodated in the plane of the upper plane portion F1 and that can cover the entire circuit plane F4.

  As shown in FIG. 1, the holding means 11 includes a table T having an upper surface formed as a suction surface of the wafer W and a linear motor 20, and the table T is illustrated via a slider 20A of the linear motor 20. 1 is provided so as to be movable in the left-right direction.

  The support means 12 includes a support shaft 22 that is rotatably supported with respect to the frame F, and is supported on the support shaft 22 so as to be able to supply an original fabric R wound in a roll shape.

  The feeding means 13 includes a driving roller 24 that is rotatably provided via a motor M1, and a pinch roller 25 that sandwiches the release sheet RL after the adhesive sheet S is peeled between the drive roller 24. I have. A take-up shaft 26 that winds the release sheet RL with a predetermined torque by a driving source (not shown) is provided on the right side in FIG.

  The pressing means 16 includes a linear motion motor 28 and a press roller 29 that is supported via the linear motion motor 28 and located on the front end side of the peel plate 15, and is peeled from the release sheet RL by the press roller 29. A pressing force is applied to the adhesive sheet S, and the adhesive sheet S is attached to the wafer W.

  The input means 17 includes an operation panel or the like electrically connected to the control means 18. In addition to the diameter D4 of the wafer W and the diameter of the adhesive sheet S, the input means 17 can output the operating conditions and data of each means controlled via the control means 18 to the control means 18.

  The control means 18 can be constituted by a sequencer, a personal computer or the like, and includes a storage means 31 for storing data such as the diameter D4 of the wafer W and the diameter of the adhesive sheet S input by the input means 17. Further, the control means 18 has a function of determining the application position and application timing of the adhesive sheet S based on the data stored in the storage means 31, and the holding means 11 so that application can be performed at the determined application position and application timing. And a function of controlling the pressing timing and pressing force of the pressing means 16 and the feeding timing and feeding speed of the feeding means 13.

  Next, a method for sticking the adhesive sheet S by the sheet sticking apparatus 10 will be described.

As an initial work, the original fabric R supported by the support shaft 22 is pulled out by a predetermined length, and the original fabric R is wound around so as to be folded back at the tip of the peel plate 15. The lead end of the original fabric R is fixed to the winding shaft 26 by passing the anti-R. Further, the diameter D 4 of the wafer W and the diameter of the adhesive sheet S are input via the input unit 17 and stored in the storage unit 31 in advance. In the control means 18, the sticking position of the adhesive sheet S is determined based on the data stored in the storage means 31. Specifically, the position at which the adhesive sheet S is applied is determined so as to coincide with the formation position of the bottom surface W1a formed later in plan view. That is, the adhesive sheet S is determined to be a pasting position where the adhesive sheet S is within the plane of the upper flat surface portion F1 of the wafer W and the circuit surface F4 is entirely covered by the adhesive sheet S.
The control means 18 determines the sticking position of the adhesive sheet S by subtracting the diameter of the adhesive sheet S (the diameter D2 of the bottom surface W1a) from the diameter D4 of the wafer W input via the input means 17.

  Next, when the operation is started via the input means 17, the motor M1 of the feeding means 13 is driven to feed the original fabric R, and the leading edge of the adhesive sheet S is detected by a sensor (not shown) and fed at a predetermined position. Stop and enter standby. In this state, the table T is conveyed from the position shown in FIG. When it is confirmed through the pulse of the linear motor 20 that the wafer W has reached the attachment position of the adhesive sheet S, the motor M1 rotates and synchronizes with the conveyance of the table T, and the adhesive sheet is formed at the tip of the peel plate 15. S is peeled from the release sheet RL. Then, the peeled adhesive sheet S is pressed by a press roller 29 via a linear motion motor 28, and is stuck on the upper flat surface portion F1 of the wafer W moving in the left direction in the figure. At this time, the control means 18 determines the rotation speed, rotation timing, movement speed, movement timing, and pressing timing of the linear motor 28 of the motor M1 so that the sticking position determined by the control means 18 as described above is obtained. Be controlled.

  The wafer W to which the adhesive sheet S is attached is transferred through a transfer device (not shown), and then the lower flat surface portion F2 is ground through a grinder or the like to form the concave portion W1.

  Therefore, according to such an embodiment, since the adhesive sheet S can be attached according to the concave portion W1 to be formed later, when the adhesive sheet S is peeled after the concave portion W1 is formed, the wafer W is conventionally used. Can be eliminated.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the press roller 29 can be variously changed, and may be replaced with a plate-like blade material, or an elastic member such as rubber, resin, or sponge.

The schematic front view of the sheet sticking apparatus which concerns on embodiment. The schematic front view in the process of sticking the adhesive sheet to a wafer. The schematic front view after sticking an adhesive sheet on a wafer. Explanatory drawing of the malfunction which concerns on a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Holding means 12 Support means 13 Feeding means 15 Peel plate (peeling means)
16 Pressing means 17 Input means 18 Control means 31 Storage means F1 Upper flat surface portion (flat surface portion)
F2 Lower plane part (plane part)
F3 Curved surface part F4 Circuit surface R Original fabric RL Release sheet S Adhesive sheet W Semiconductor wafer W1 Concave part

Claims (2)

The concave portion is formed on the circuit surface side which is the other surface of the semiconductor wafer in a stage before the concave portion is formed on one surface by making the thickness of the outer edge side of the semiconductor wafer larger than the thickness of the other region. A sheet sticking device for sticking an adhesive sheet in advance as a position corresponding to the position where the adhesive sheet is attached,
The semiconductor wafer includes a flat surface portion on which a circuit surface is formed and a curved surface portion connected to an outer periphery of the flat surface portion, and the diameter of the adhesive sheet is set to be the same as the diameter of the bottom surface of the concave portion, It fits within the plane part and is set so as to be able to cover the entire circuit surface,
Holding means for mounting and holding the semiconductor wafer; support means for supporting the original fabric in which an adhesive sheet is temporarily attached to one surface of a strip-shaped release sheet; feeding means for feeding out the original fabric; A peeling means for peeling the adhesive sheet from the release sheet in the course of feeding out, a pressing means for pressing and sticking the adhesive sheet peeled by the peeling means to the semiconductor wafer, and a control means for controlling these means,
The control means includes storage means for storing the diameter of the semiconductor wafer and the diameter of the adhesive sheet via the input means, and controls the sticking position of the adhesive sheet based on the data stored in the storage means. A sheet sticking device characterized by the above. The concave portion is formed on the circuit surface side which is the other surface of the semiconductor wafer in a stage before the concave portion is formed on one surface by making the thickness of the outer edge side of the semiconductor wafer larger than the thickness of the other region. A sheet sticking method for sticking an adhesive sheet in advance as a position corresponding to the position where the adhesive sheet is attached,
The semiconductor wafer includes a flat surface portion on which a circuit surface is formed and a curved surface portion connected to an outer periphery of the flat surface portion, and the diameter of the adhesive sheet is set to be the same as the diameter of the bottom surface of the concave portion, It fits within the plane part and is set so as to be able to cover the entire circuit surface,
Storing the diameter of the semiconductor wafer and the diameter of the adhesive sheet in a storage means via a predetermined input means;
A step of feeding the raw one of the adhesive to the surface sheet of the band-shaped release sheet is temporarily adhered,
Peeling the adhesive sheet from the release sheet in the course of unwinding the original fabric,
And a step of pressing and sticking the adhesive sheet to the adhesive sheet sticking position determined by the control means based on the data stored in the storage means.

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