JP2016111055A - Sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sticking device capable of sticking even a thick tape like a high-bump tape to a wafer after releasing the tape from a base sheet.SOLUTION: A sticking device 1 comprises: a band-like material transfer mechanism for transferring a band-like material TA to which a film F for protective tape formation is stuck, to a base sheet BS; a precut mechanism for adding a cut of a closed loop to the film F and forming a protective tape; a releasing and fitting mechanism for turning over the band-like material TA at a release edge 41 and fitting the protective tape to a peripheral surface of a sticking roller 70 which has viscosity on the peripheral surface and is rotated while pressing the protective tape, while releasing the protective tape from the base sheet BS by the sticking roller 70; and a sticking mechanism for sticking the protective tape to a wafer W by rotating the sticking roller 70 with relative movements of the sticking roller 70 and a sticking stage 90 while pressing the wafer W mounted on the sticking stage 90 with the sticking roller 70.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an attaching device for attaching a protective tape to a wafer.

  In the process of manufacturing a semiconductor device, there is a process in which a protective tape is applied to protect a circuit formed on a semiconductor wafer. For example, in the back grinding process, a back grinding tape (hereinafter referred to as BG tape) is affixed to the surface on which the circuit of the wafer is formed, and the opposite surface (back surface) is ground.

  As an apparatus for attaching such a protective tape to a wafer, for example, there is Patent Document 1. In Patent Document 1, for a strip-shaped material in which a film for forming a protective tape is pasted on a mount, a protective tape is formed by cutting the film into a closed loop, and the protective tape is removed from the mount by folding the strip-shaped material at the peeling edge. Affixed to the wafer while peeling.

  In recent years, some wafers have a circuit (bump) having irregularities. If the bumps have large irregularities, the BG tape having a normal thickness is too thin, and irregularities are formed on the surface on which the BG tape is applied. When the back surface of the wafer is pressed against the grindstone for grinding, the back surface of the wafer cannot be uniformly pressed against the grindstone, so that uniform grinding becomes difficult. For this reason, a thick BG tape (hereinafter referred to as a high bump tape) is used.

JP 2014-136598 A

  For a strip-shaped material with a film for forming a high bump tape on the mount, when the film is cut in a closed loop, the strip material is folded and the high bump tape is peeled off from the mount, the thickness of the adhesive layer of the film Due to the large size, there is a problem that when the belt-shaped material is folded back, the high bump tape follows the mount and it is difficult to peel off the high bump tape from the mount.

  The present invention has been made in view of the above matters, and an object of the present invention is to provide a sticking device that can be peeled off from a mount and attached to a wafer even if it is a thick tape such as a high bump tape. It is to provide.

The sticking device according to the present invention comprises:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
An affixing mechanism for affixing the protective tape to the wafer by rotating the affixing roller by relative movement between the affixing roller and the affixing stage while the affixing roller presses the wafer placed on the affixing stage; ,
It is characterized by that.

  Further, it is preferable that the strip-shaped material is folded back at the peeling edge to peel off the front end portion of the protective tape, and then the strip-shaped material is retracted to attach the protective tape to the sticking roller.

Further, the peeling edge is configured to be capable of reciprocating in the feeding direction of the strip material,
After peeling off the tip of the protective tape, the peeling edge moves in the opposite direction of the feeding direction of the strip material to peel off the tip of the protective tape,
After the peeling edge moves in the feeding direction of the strip-shaped material and the tip of the protective tape returns to the original position on the peeling edge, the protective tape may be attached to the sticking roller.

  Moreover, it is preferable to peel the front-end | tip part of the said protective tape, pressing the site | part behind the said peeling edge of the said strip | belt-shaped material, and applying tension | tensile_strength to the said strip | belt-shaped material.

  The application roller gradually increases the pressing force from one end portion to the central portion of the protective tape, and gradually decreases the pressing force from the central portion to the other end portion of the protective tape. It is preferable to affix to.

  In the sticking apparatus according to the present invention, even a thick tape such as a high bump tape can be peeled off from the mount and stuck on the wafer.

It is a front view of a sticking device. It is a top view of a sticking device. FIG. 3A is a plan view of the sheet-like cutter, and FIG. 3B is a cross-sectional view taken along the line A-A ′ of FIG. It is a top view of the strip | belt-shaped raw material in which the protective tape was formed. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows sticking operation | movement. It is a figure which shows the sticking operation | movement by the sticking apparatus of another form. It is a figure which shows the sticking operation | movement by the sticking apparatus of another form.

  The sticking apparatus according to the present embodiment will be described with reference to the drawings. As shown in FIGS. 1 and 2, the sticking device 1 includes a belt-shaped material support roller 10, a cutting roller 30, a peeling table 40, a folding angle adjusting roller 42, a pressing device 50, a take-up roller 60, a sticking roller 70, and a Y-axis position. A detection sensor 80, an X-axis position detection sensor 81, a pasting stage 90, and a control device 100 are provided.

  In the following description, the + Y direction in FIG.

  The belt-shaped material support roller 10 supports the wound belt-shaped material TA. The band-shaped material TA is wound with a film F attached to a mount BS. The film F is a film for forming the protective tape PT, and is attached to the mount BS with an adhesive layer (not shown). The belt-shaped material support roller 10 can be rotated counterclockwise so as not to bend the belt-shaped material TA that is pulled out, and can be applied with back tension.

  The cutting roller 30 cuts the film F and forms the protective tape PT. The cutting roller 30 is configured by, for example, a detachable sheet-like blade 31 having a closed-loop blade 31b standing around a sheet 31a shown in FIGS. 3A and 3B and wound around the roller. It can be applied to various wafers W having different diameters by replacing the blade 31b with a closed loop blade 31b having a different diameter.

  When the band-shaped material TA advances while being sandwiched between the cutting roller 30 and the pressing roller 32, a closed loop protective tape PT is formed on the film F as the cutting roller 30 rotates as shown in FIG. The height of the blade is set to such an extent that the mount BS is not cut.

  The peeling table 40 is disposed in front of the cutting roller 30, and includes a peeling edge 41 at the front end portion of the peeling table 40. When the strip-shaped material TA on which the protective tape PT is formed passes over the peeling table 40 and is folded at the peeling edge 41, the protective tape PT is peeled from the mount BS.

  A folding angle adjusting roller 42 is disposed below the peeling table 40, and the folding angle adjusting roller 42 is configured to be movable in the Y-axis direction. When the folding angle adjusting roller 42 is positioned forward, the folding angle of the band-shaped material TA becomes an obtuse angle, and when it is positioned rearward, the folding angle of the band-shaped material TA becomes an acute angle. The folding angle adjusting roller 42 is used by appropriately moving in accordance with the band-shaped material TA used. Further, the folding angle adjusting roller 42 may be configured to be movable in the Z-axis direction, and may be configured to adjust the folding angle of the strip material TA. By changing the position of the folding angle adjusting roller 42, it is possible to adjust the folding angle according to the strip-shaped material TA to be easily peeled.

  The pressing member 50 is movable in the Z-axis direction, presses the strip material TA against the peeling table 40, and suppresses the movement of the strip material TA.

  The winding roller 60 winds the strip-shaped material TA. The belt-shaped material TA advances from the belt-shaped material support roller 10 to the winding roller 60 by the rotational drive of the winding roller 60. Instead of rotating the take-up roller 60, a drive roller may be installed between the take-up roller 60 and the folding angle adjusting roller 42, and the belt-shaped material TA may be advanced by the drive roller.

  The sticking roller 70 is supported by the sticking roller support member 71, and is configured to be rotatable by a servo motor or the like. The sticking roller support member 71 is configured to be movable in the X axis direction, the Y axis direction, and the Z axis direction. The outer peripheral surface of the sticking roller 70 has adhesiveness, and the protective tape PT can be attached and held by the adhesive force. The adhesive force of the outer peripheral surface of the sticking roller 70 is set to be weaker than the adhesive force of the adhesive material layer of the protective tape PT. As the sticking roller 70, for example, a configuration in which an adhesive sheet or the like is detachably wound around the roller can be used.

  The Y-axis position detection sensor 80 detects the tip position of the protective tape PT held by the sticking roller 70 in the Y-axis direction. The Y-axis position detection sensor 80 is not limited as long as it can detect the tip position of the protective tape PT in the Y-axis direction. As the Y-axis position detection sensor 80, for example, an image sensor or the like is cited, and the sticking roller 70 is photographed, and the tip position of the protective tape PT held by the sticking roller 70 is detected from the image.

  The X-axis position detection sensor 81 detects the tip position of the protective tape PT held by the sticking roller 70 in the X-axis direction. The X-axis position detection sensor 81 is not limited as long as it can detect the tip position of the protective tape PT in the X-axis direction. As the X-axis position detection sensor 81, for example, a photosensor can be cited, and the X-axis direction of the protective tape PT held by the sticking roller 70 based on the difference in the amount of reflected light between the protective tape PT and the sticking roller 70. The position of the tip of the is detected.

  The sticking stage 90 is a table on which the wafer W is placed and the protective tape PT is stuck on the wafer W. The sticking stage 90 includes a positioning mechanism (not shown) that defines the mounting position of the wafer W.

  The control device 100 controls each device described above.

  Next, the pasting operation will be described. The following operations are performed under the control of the control device 100.

  The wafer W is placed on the sticking stage 90. The wafer W is placed by a transfer device (not shown).

  The belt-shaped material TA is pulled out by the rotation of the take-up roller 60, passes between the guide rollers 20 and 21, and proceeds to the cutting roller 30. Then, a closed loop cut is made in the film F of the strip-shaped material TA to form the protective tape PT.

  After the front end of the protective tape PT reaches the vicinity of the peeling edge 41, the pressing device 50 descends and presses the strip-shaped material TA against the peeling table 40 as shown in FIG.

  Then, as shown in FIG. 6, the winding roller 60 rotates clockwise, winds up the strip-shaped material TA, and preliminarily peels off the protective tape PT. As a result, the protective tape PT is peeled from the mount BS and protrudes from the peeling edge 41.

  Thereafter, as shown in FIG. 7, the take-up roller 60 rotates and the front end of the protective tape PT is returned to the peeling edge 41.

  Then, as shown in FIG. 8, the sticking roller 70 descends and presses the protective tape PT. And the winding roller 60 winds up the strip | belt-shaped raw material TA, and the sticking roller 70 rotates synchronously. Since the outer peripheral surface of the sticking roller 70 has adhesiveness and the protective tape PT is preliminarily peeled off, the front end of the protective tape PT easily adheres to the peripheral surface of the sticking roller 70. Then, the belt-shaped material TA is folded back at the peeling edge 41, and the protective tape PT is adhered to the outer peripheral surface of the sticking roller 70 while being peeled from the mount BS.

  After adhering to the sticking roller 70 up to the rear end of the protective tape PT, the winding roller 60 stops rotating and the sticking roller 70 ascends as shown in FIG.

  Thereafter, as shown in FIG. 10, the sticking roller 70 moves forward and moves onto the Y-axis position detection sensor 80 and the X-axis position detection sensor 81. Here, the sticking roller 70 rotates, and the Y-axis position detection sensor 80 detects the front end position of the protective tape PT attached to the sticking roller 70. The Y-axis position detection sensor 80 may be configured to detect the rear end position of the protective tape PT. Further, the X-axis position detection sensor 81 detects the tip position of the protective tape PT in the X-axis direction. The X-axis position detection sensor 81 may detect either the tip position in the + X direction or the tip position in the −X direction of the protective tape PT.

  After the X-axis position and the Y-axis position of the protective tape PT attached to the sticking roller 70 are detected, the sticking roller 70 moves onto the sticking stage 90 as shown in FIG. Here, the control device 100 determines the Y-axis direction and the X-axis direction of the sticking roller 70 that moves onto the wafer W placed on the sticking stage 90 based on the detected position information of the protective tape PT. The movement amount and the rotation angle are calculated, and the sticking roller 70 is moved.

  Then, as shown in FIG. 12, the sticking roller 70 descends and presses the front end of the protective tape PT against the wafer W. Subsequently, the sticking roller 70 is moved backward as shown in FIG. 13 while the protective tape PT is pressed. Since the adhesive force of the sticking roller 70 is set to be weaker than the adhesive force of the protective tape PT, the protective tape PT is attached to the wafer W when the sticking roller 70 rotates.

  Then, as shown in FIG. 14, after pasting to the rear end of the protective tape PT, the pasting roller 70 rises, and the pasting roller 70 moves backward to the original position, that is, above the peeling edge 41. To do.

  In the above description, the sticking roller 70 moves backward and sticks to the wafer W from the front end to the rear end of the protective tape PT. However, the sticking roller 70 moves forward and sticks from the rear end to the front end of the protective tape PT. May be attached.

  Then, the wafer W to which the protective tape PT is attached is transported, and another wafer W is placed on the attaching stage 90, and the protective tape PT is attached to the wafer W sequentially. As described above, the protective tape PT can be attached to the wafer W.

  As described above, in the sticking device 1, the belt-like material TA is folded and pulled at the peeling edge 41 while pressing the belt-like material TA located behind the peeling edge 41 with the pressing device 50, and the front end portion of the protective tape PT is peeled off. doing. Since sufficient tension can be applied to the strip-shaped material TA folded back at the peeling edge 41, the protective tape PT having a large thickness such as a high bump tape can be peeled off.

  Moreover, about the peeling of the front-end part of protective tape PT, the form which the peeling edge 41 moves and peels with respect to the peeling stand 40 may be sufficient as shown in FIG. 15, FIG. As shown in FIG. 15, the strip material TA is sent on the peeling table 40, the leading end of the protective tape PT reaches the leading edge of the peeling edge 41, and the strip material TA is pressed against the peeling table 40 by the pressing device 50. The peeling edge 41 is in the advanced state.

  Then, as shown in FIG. 16, the peeling edge 41 moves backward and the belt-shaped material TA is wound up, whereby the belt-shaped material TA is folded back at the peeling edge 41 and the tip of the protective tape PT is peeled off from the mount BS. .

  Thereafter, the peeling edge 41 retreats and returns to the original position (position shown in FIG. 15), and the belt-shaped material TA is rewound, and the tip of the protective tape PT returns to above the peeling edge 41. Then, the protective tape PT is attached to the sticking roller 70.

  The pressing force with which the sticking roller 70 presses the protective tape PT against the wafer W is controlled so as to gradually increase from the front end portion to the center portion of the wafer W and gradually decrease from the center portion to the rear end portion of the wafer W. It is preferable. When the application roller 70 applies the force with the same force to attach the wafer W, the pressure applied to the front end portion and the rear end portion of the wafer W is large because the wafer W is circular, and the pressure decreases between them. In the case of a protective tape PT having a large thickness, such as a high bump tape, the protective tape PT is crushed at the portion attached to the front end portion and the rear end portion of the wafer W, and the thickness with the central portion of the wafer W is increased. Will be different, which will hinder the back grinding in the backgrinding process, and the force applied to the front and rear ends of the wafer W will become too large, which may cause defects in the formed circuit. is there. By controlling so as to gradually decrease from the center to the rear end of the wafer W, the stress applied to the wafer W becomes uniform over the entire surface, the thickness is not uneven, and the circuit formed on the wafer W is not defective. Occurrence is also suppressed.

  Further, in the sticking apparatus 1, since the protective tape PT is adsorbed to the cylindrical sticking roller 70 and then attached to the wafer W, when the protective tape PT is attached to the wafer W, the protective tape PT has a surface direction. No tension is applied to the. Therefore, no load in the surface direction is applied to the wafer W to which the protective tape PT is attached, and the wafer W can be attached with low tension.

  For example, as in Patent Document 1, when the protective tape PT is applied to the wafer W while applying a tension, the attached protective tape PT is contracted, and a contraction stress is applied to the wafer W. When the back surface of the wafer W is ground in the back grinding process and the wafer W is thinned, the wafer W is warped by the applied contraction stress when the wafer W is removed from the grinding stage. If the wafer W is warped, there is a problem that the wafer W cannot be transferred from the stage for grinding and cannot proceed to the next process. In the sticking device 1, the protective tape PT is stuck to the wafer W so that no tension is applied to the protective tape PT.

  Note that, in the above, the operation of performing the preliminary peeling of the protective tape PT has been described. However, whether or not to perform the preliminary peeling may be appropriately controlled according to the band-shaped material TA to be used. In the case of the strip-shaped material TA that can be easily peeled off, preliminary peeling may not be performed.

DESCRIPTION OF SYMBOLS 1 Sticking apparatus 10 Band-shaped material support roller 20 Guide roller 21 Guide roller 30 Cutting roller 31 Sheet-like blade 31a Sheet 31b Blade 32 Pressing roller 40 Peeling table 41 Peeling edge 42 Folding angle adjustment roller 43 Guide roller 50 Pressing device 60 Winding roller 70 Application roller 71 Application roller support member 80 Y-axis position detection sensor 81 X-axis position detection sensor 90 Application stage 100 Control device TA Strip material F Film BS Mount PT Protection tape W Wafer

The sticking device according to the first aspect of the present invention is:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
A sticking mechanism for sticking the protective tape to the wafer by rotating the sticking roller by relative movement of the sticking roller and the sticking stage while the sticking roller presses the wafer placed on the sticking stage; Huh,
The affixing roller affixes to the wafer while gradually increasing the pressing force from one end to the center of the protective tape and gradually decreasing the pressing force from the center to the other end of the protective tape. To
It is characterized by that.

The sticking device according to the second aspect of the present invention is:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
A sticking mechanism for sticking the protective tape to the wafer by rotating the sticking roller by relative movement between the sticking roller and the sticking stage while the sticking roller presses the wafer placed on the sticking stage; ,
After the pre-SL strip material separating the leading end portion of the protective tape is folded back by the peeling edge, said strip-shaped material is retracted, characterized in that depositing said protection tape to the application roller.

The sticking device according to the third aspect of the present invention is:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
A sticking mechanism for sticking the protective tape to the wafer by rotating the sticking roller by relative movement between the sticking roller and the sticking stage while the sticking roller presses the wafer placed on the sticking stage; ,
Is pre Symbol peeling edge configured for reciprocal movement in the feeding direction of the strip material,
After peeling off the tip of the protective tape, the peeling edge moves in the opposite direction of the feeding direction of the strip material to peel off the tip of the protective tape,
The peeling edge is moved in the feeding direction of the strip material, after the leading end of the protective tape is returned to the original position by the said peeling edge, and wherein the Rukoto by attaching the protective tape to the joining roller .

The sticking device according to the first aspect of the present invention is:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
A sticking mechanism for sticking the protective tape to the wafer by rotating the sticking roller by relative movement between the sticking roller and the sticking stage while the sticking roller presses the wafer placed on the sticking stage; ,
The strip-shaped material is folded back at the peeling edge to peel off the front end portion of the protective tape, and then the strip-shaped material is retracted to attach the protective tape to the sticking roller.

The sticking device according to the second aspect of the present invention is:
In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
A sticking mechanism for sticking the protective tape to the wafer by rotating the sticking roller by relative movement between the sticking roller and the sticking stage while the sticking roller presses the wafer placed on the sticking stage; ,
The peeling edge is configured to be capable of reciprocating in the feeding direction of the strip-shaped material,
After peeling off the tip of the protective tape, the peeling edge moves in the opposite direction of the feeding direction of the strip material to peel off the tip of the protective tape,
After the peeling edge moves in the feeding direction of the belt-shaped material and the tip of the protective tape returns to the original position on the peeling edge, the protective tape is attached to the sticking roller.

Claims (5)

In a sticking device that sticks a protective tape on a wafer,
A belt-shaped material transport mechanism for transporting a belt-shaped material having a protective tape-forming film attached to the mount;
A pre-cut mechanism for forming the protective tape by making a closed-loop cut into the film;
The belt-like material is folded back at the peeling edge, and the protective surface is provided on the peripheral surface of the sticking roller while peeling off the protective tape from the mount by a sticking roller that rotates while pressing the protective tape with adhesiveness on the peripheral surface. A peel adhesion mechanism for attaching the tape;
An affixing mechanism for affixing the protective tape to the wafer by rotating the affixing roller by relative movement between the affixing roller and the affixing stage while the affixing roller presses the wafer placed on the affixing stage; ,
A sticking device characterized by that. Folding the strip-shaped material at the peeling edge and peeling the tip of the protective tape, then retracting the strip-shaped material and attaching the protective tape to the sticking roller,
The sticking device according to claim 1. The peeling edge is configured to be capable of reciprocating in the feeding direction of the strip-shaped material,
After peeling off the tip of the protective tape, the peeling edge moves in the opposite direction of the feeding direction of the strip material to peel off the tip of the protective tape,
The peeling edge moves in the feeding direction of the strip-shaped material, and after the tip of the protective tape returns to the original position on the peeling edge, the protective tape is attached to the sticking roller.
The sticking device according to claim 1. Pressing the site behind the peeling edge of the strip material, peeling the tip of the protective tape while applying tension to the strip material,
The sticking device according to claim 2 or 3, characterized in that. The affixing roller affixes to the wafer while gradually increasing the pressing force from one end to the center of the protective tape and gradually decreasing the pressing force from the center to the other end of the protective tape. To
The sticking device according to any one of claims 1 to 4, wherein the sticking device is provided.

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