JPH0878366A - Tape applicator for semiconductor wafer - Google Patents

Abstract

PURPOSE: To provide a tape applicator so structured as greatly reduce the load exerted on a semiconductor wafer at applying an adhesive tape to the wafer, thereby avoiding damaging the wafer, crumpling the tape or causing voids. CONSTITUTION: A fixed table 12 to mount a semiconductor wafer 13 in place and a tray table 14 to mount a tray 16 with an adhesive tape 15 pasted thereto in place are provided, one end of the table 14 is fixed to a base shaft 20 and the other end is oscillatorily supported so that the table 14 can be oscillatory with center at the shaft 20 when the tape is applied to the wafer by a rubber roll 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape sticking device for a semiconductor wafer, and more particularly to an improved device for sticking a semiconductor wafer to an adhesive tape that has been previously stuck to a ring-shaped tray. Is.

[0002]

2. Description of the Related Art Generally, when manufacturing a semiconductor device such as an IC, an LSI, a VLSI or the like, a large number of electric patterns are formed on the surface of a semiconductor wafer and then cut into individual semiconductor chip elements.

The dicing process for cutting a semiconductor wafer is usually carried out by a diamond blade. At this time, a method of attaching an adhesive tape to the entire back surface of the semiconductor wafer in advance so as not to separate and scatter each element by cutting is a method. Well known than before.

FIG. 2 shows a conventionally known apparatus for sticking an adhesive tape to a semiconductor wafer, in which a semiconductor wafer 3 is placed at a predetermined position on a fixed base 2 provided on a support 1, while a table 4 is provided. A tray 6 to which an adhesive tape 5 is attached is placed at a predetermined position above.

The semiconductor wafer 3 placed as described above and the adhesive tape 5 attached to the tray 6 are arranged vertically with a certain clearance therebetween.
In this arrangement, the semiconductor wafer 3 is attached to the adhesive tape 5 by the rotational movement of the rubber roll 7 from the solid line shown in the figure to the position of the chain line and the pressing action on the tape surface.

[0006]

As described above, in the conventional apparatus, a fixed amount of a fixed gap is provided between the semiconductor wafer and the adhesive tape, and the downward pressing force of the rubber roll and the elongation of the adhesive tape are used. Since the adhesive tape is attached to the semiconductor wafer, the downward load of the rubber roll on the semiconductor wafer and the upward load due to the restoring force against the elongation of the adhesive tape act on the semiconductor wafer, which damages the semiconductor wafer. Which results in damage or damage. In particular, recent semiconductor wafers have a larger diameter (diameter 8
Inch) and ultra thin (150 microns or less) are being advanced, and conventional devices are not suitable for these semiconductor wafers.

Therefore, conventionally, the gap between the semiconductor wafer and the adhesive tape is made as small as possible to reduce the downward load due to the pressing force of the rubber roll and the upward load due to the restoring force of the adhesive tape. In this case, if the adhesive tape sags due to heat or other external factors, the adhesive tape will be grounded to the semiconductor wafer before sticking with the rubber roll, and as a result wrinkles or bubbles will occur in the tape after sticking Is a cause of hindrance to the dicing process.

The present invention has been made in order to solve the problems of the conventional device as described above, and has a structure capable of remarkably reducing the load applied to the semiconductor wafer at the time of attaching the tape to prevent damage to the semiconductor wafer. An object of the present invention is to provide an improved tape application device that eliminates wrinkles and air bubbles on the tape after application.

[0009]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention mounts a fixing base for mounting a semiconductor wafer at a predetermined position and a tray having an adhesive tape attached thereon on the upper side of the semiconductor wafer. A tray table to be placed, one end of the tray table is pivotally attached to the base shaft and the other end is swingably supported, and the tray table is centered on the base shaft when the adhesive tape is attached to the semiconductor wafer by the rubber roll. It is configured so that it can swing.

[0010]

The gap between the upper and lower sides of the semiconductor wafer mounted on the fixed table and the adhesive tape attached to the tray mounted on the tray table is made smaller on the base axis side of the tray table and larger on the other end side. When the rubber roll is attached in an inclined shape, while the rubber roll is moved horizontally, the other end of the tray table is swung downward around the base axis to make the gap between the semiconductor wafer and the adhesive tape gradually smaller. Then, an adhesive tape is attached to the semiconductor wafer.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, a cylindrical fixed base 12 is arranged in the center of a support 11, and a semiconductor wafer 13 is horizontally placed at a predetermined position on the fixed base 12.

On the other hand, a cylindrical tray table 14 is arranged outside the upper end of the fixed base 12,
An adhesive tape 15 is provided at a predetermined position on the tray table 14.
The tray 16 to which is attached is placed.

Although not shown in the drawing, the tray 16 has a ring shape whose inner circumference is circular, and the outer peripheral edge of the adhesive tape 15 cut out in a circle is attached to the tray 16 and stretched to adhere the inside of the tray 16. The semiconductor wafer 13 is attached to the tape surface.

One end of the tray table 14 is pivotally attached to the base shaft 20 and the other end is swingably supported, and a pin 22 having a push spring 21 is inserted into a recess 14a formed at the other end. Then, the other end of the tray table 14 is supported so as to be lifted upward by the urging force of the pushing spring 21.

As a result, as shown in FIG. 1, the tray table 14 is arranged so that the other end of the tray table 14 rises by the urging force of the push spring 21 with the fulcrum 20 as the fulcrum, and is inclined. It can be arbitrarily set by adjusting the position of the stopper 23 fixed to the pin 22.

That is, the push spring 21 mounted on the pin 22
Are disposed between the stopper 23 and the lower surface of the tray table 14, and the stopper 23 contacts the lower surface of the protrusion 12a provided on the fixed base 12, whereby the ascent of the tray table 14 is stopped.

A rubber roll 17 for sticking the adhesive tape 15 to the semiconductor wafer 13 is connected to an appropriate supporting means and a driving means (not shown), and is usually waiting at a rising position apart from the tray table 14 for tape sticking. At times, it is configured to descend from the standby position, to come into contact with the ground on the tray 16 (solid line position in FIG. 1), and then to horizontally move to the chain line position while rolling.

The tape applying device of the present invention has the above-mentioned structure, and when the rubber roll 17 is in the ascending standby position, the semiconductor wafer 13 is first placed on the fixed base 12 at a predetermined position, and then the adhesive tape 15 is attached in advance. Attached tray 1
6 will be mounted in the predetermined position on the tray table 14 via each appropriate handling device.

The mounting state of the semiconductor wafer 13 and the tray 16 is such that the tray table 14 is inclined as shown in FIG.
On the side, the adhesive tape 15 attached to the tray 16
The gap between the lower surface (adhesive surface) of the above and the upper surface of the semiconductor wafer 13 is small, and the gap between the two becomes larger toward the other end of the tray 16 in proportion to the inclination angle of the tray table 14.

Thus, the semiconductor wafer 13 and the tray 1 are
When 6 is placed at each predetermined position, the rubber roll 17 then descends first from the ascending standby position to contact the ground on the tray 16 (solid line position in FIG. 1), and then rolls horizontally to the chain line position. By moving, the adhesive tape 15 is pressed onto the semiconductor wafer 13 with a slight pressing force which is approximately equal to the weight of the rubber roll, and the adhesive tape 15 is attached to the semiconductor wafer 13.

At the time of this attachment, as the rubber roll 17 moves horizontally, the tray table 14 swings downward (swings) against the urging force of the push spring 21.
As a result, since the gap between the adhesive tape 15 and the semiconductor wafer 13 is gradually changed to be small, the bonding work is surely performed from one end.

When the work of sticking the adhesive tape 15 and the semiconductor wafer 13 by the rubber roll 17 is completed, the rubber roll rises from the position shown by the chain line in FIG. 1 and then moves backward to return to the original standby position. On the other hand, the semiconductor wafer 13 attached to the adhesive tape 15 is
It is discharged together with the tray 16 to the outside of the apparatus.

[0024]

As described above, according to the present invention, since the tray table, that is, the tray to which the adhesive tape is adhered has a structure capable of swinging about the fulcrum as a fulcrum, the gap between the adhesive tape and the semiconductor wafer ( clearance)
Can be set to be small in an inclined shape at the beginning, and can be set to a large value at the rear, and at the time of attaching the adhesive tape and the semiconductor wafer by the rubber roll, the adhesive tape swings as the rubber roll moves and the gap between the semiconductor wafer and the semiconductor wafer gradually changes. As a result, the rubber roll can be attached with the minimum necessary pressing force, and the upward load due to the restoring force of the adhesive tape during the attachment can be eliminated.

As a result, the load on the semiconductor wafer at the time of applying the adhesive tape can be remarkably reduced, and therefore, the large-diameter or ultra-thin semiconductor wafer is not damaged or damaged due to damage, and is reasonably possible. It can be pasted.

Furthermore, since the adhesive tape at the time of attaching is surely attached from one end of the semiconductor wafer,
Wrinkles and bubbles generated by the adhesive tape during the application will be eliminated.

[Brief description of drawings]

FIG. 1 is a cross-sectional front view showing the entire tape adhering device according to the present invention.

FIG. 2 is a sectional front view showing the entire tape sticking device of the conventional device.

[Explanation of symbols]

 12 Fixing Base 13 Semiconductor Wafer 14 Tray Table 15 Adhesive Tape 16 Tray 17 Rubber Roll

Claims (1)

[Claims] 1. A fixing base on which a semiconductor wafer is placed at a predetermined position, a tray table on which a tray having an adhesive tape is placed on top of the semiconductor wafer, and an adhesive tape which is pressed onto the semiconductor wafer. A tape sticking device for a semiconductor wafer, which comprises a rubber roll for sticking the tray table to the tray table, wherein one end of the tray table is pivotally attached to a base shaft and the other end is swingably supported, and an adhesive tape is stuck to the semiconductor wafer by the rubber roll. A tape sticking device for a semiconductor wafer, wherein the tape sticking device is configured so that it can be swung about the tray table base axis during the operation.