CN115332123B - Wafer water glue laminating machine - Google Patents
Wafer water glue laminating machine Download PDFInfo
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- CN115332123B CN115332123B CN202211013554.6A CN202211013554A CN115332123B CN 115332123 B CN115332123 B CN 115332123B CN 202211013554 A CN202211013554 A CN 202211013554A CN 115332123 B CN115332123 B CN 115332123B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention discloses a wafer water glue laminating machine which comprises a chassis, a wafer loading unit, a wafer conveying unit, a film loading unit, a glue dispensing unit, a film cutting unit and a finished product blanking unit, wherein the wafer loading unit is arranged on the chassis, the wafer loading unit is used for loading a plurality of stacked wafers to be glued, the film loading unit is used for loading and cutting films, the glue dispensing unit is used for adhering the films to the wafers, the film cutting unit is used for cutting the films on the periphery of the wafers, the finished product blanking unit is used for collecting wafers and cutting waste materials which are subjected to film pasting, the wafer conveying unit is used for conveying the wafers from the wafer loading unit to the glue dispensing unit, and the wafers are conveyed from the glue dispensing unit to the film cutting unit after glue dispensing and pasting are finished. The wafer is fully automatically subjected to film pasting treatment, redundant films on the periphery of the wafer are automatically cut, the phenomenon of damage to the wafer during manual film pasting and film cutting is effectively avoided, the product quality is improved, the production efficiency is greatly improved, the manual use cost is reduced, and the equipment stability is improved.
Description
Technical Field
The invention relates to the field of wafer processing, in particular to a wafer water glue laminating machine.
Background
In the semiconductor industry, the integrated circuit package needs to use a wafer, and before the wafer picks up the chip on the chip, the wafer needs to be subjected to pretreatment of film sticking, and the film has a protection effect on the wafer.
In the prior art, most of wafer film sticking is carried out by adopting a manual film sticking mode, redundant films around the wafer circumference are required to be cut after film sticking is finished, the manual film sticking efficiency is low, the wafer is easy to damage, and particularly when the wafer is subjected to film cutting treatment, the wafer is more easily scratched.
Therefore, how to provide an automatic running, stable and efficient wafer glue laminating machine is a technical problem that needs to be solved currently by those skilled in the art.
Disclosure of Invention
The invention aims to provide a wafer water glue laminating machine, which realizes automatic operation, effectively avoids the phenomenon of wafer damage during manual film pasting and film cutting, improves the product quality, greatly improves the production efficiency, reduces the manual use cost and improves the equipment stability.
In order to solve the technical problems, the invention provides a wafer water glue laminating machine which comprises a chassis, a wafer loading unit, a wafer conveying unit, a film loading unit, a glue dispensing unit, a film cutting unit and a finished product blanking unit, wherein the wafer loading unit is used for loading a plurality of stacked wafers to be glued, the film loading unit is used for loading and cutting films, the glue dispensing unit is used for pasting the films on the wafers, the film cutting unit is used for cutting the films on the periphery of the wafers, the finished product blanking unit is used for collecting the wafers and cutting waste materials which are subjected to film pasting, and the wafer conveying unit is used for conveying the wafers from the wafer loading unit to the glue dispensing unit, and conveying the wafers from the glue dispensing unit to the film cutting unit after glue dispensing pasting is finished.
Preferably, the wafer loading unit comprises a loading box, a wafer conveying module, a wafer lifting module, a sucking platform, a correction platform and a correction lifting motor assembly, wherein the loading box and the correction platform are respectively installed at two ends of the wafer conveying module which are horizontally arranged, the wafer lifting module is installed on the wafer conveying module, the sucking platform is installed on the wafer lifting module, the correction lifting motor assembly is installed below the correction platform, the loading box is used for storing a plurality of vertically stacked wafers to be laminated, the sucking platform is used for sucking a single wafer to be laminated, the correction platform is used for bearing a single wafer to be laminated, the correction lifting motor assembly is used for driving the correction platform to vertically move up and down, the wafer conveying module is used for driving the wafer lifting module to horizontally move, and the wafer lifting module is used for driving the sucking platform to vertically move so that the sucking platform reciprocates between the loading box and the correction platform.
Preferably, the wafer carrying unit comprises a horizontally extending fixing frame, a film cutting and feeding carrying assembly and a film feeding and carrying assembly are respectively arranged at two ends of the fixing frame, the wafer feeding and carrying assembly is arranged in the middle of the fixing frame, a first synchronous wheel combination, a wafer feeding driving assembly and a second synchronous wheel combination are further arranged on the fixing frame, the wafer feeding driving assembly is used for driving the wafer feeding and carrying assembly to reciprocate horizontally so as to convey a wafer to be pasted with films to the dispensing unit, the second synchronous wheel combination is used for driving the film feeding and carrying assembly to reciprocate horizontally so as to convey films to the dispensing unit, and the first synchronous wheel combination is used for driving the film cutting and feeding carrying assembly to reciprocate horizontally so as to convey the wafer to be pasted with films to the film cutting unit.
Preferably, the film feeding unit comprises a coil stock assembly, a film cutting assembly, an adsorption platform and a film pulling assembly which are sequentially arranged, and further comprises a film pulling driving motor assembly for driving the film pulling assembly to be away from the coil stock assembly, so that the film pulling assembly pulls out the film in the coil stock assembly, the adsorption platform is used for sucking the pulled film, and the film cutting assembly is used for cutting off the pulled film.
Preferably, the dispensing unit comprises a vertically extending dispensing frame, a dispensing lifting motor assembly is mounted at the upper end of the dispensing frame, the dispensing lifting motor assembly is connected with a dispensing head and an attaching assembly, the dispensing lifting motor assembly is used for driving the dispensing head to move up and down, a dispensing platform is mounted at the lower end of the dispensing frame, the attaching assembly is used for pressing a wafer borne on the dispensing platform, a cleanliness detection assembly for detecting a film is arranged on the side face of the dispensing platform, and a UV curing light source for curing glue is arranged below the dispensing platform.
Preferably, the film cutting unit comprises a lower mounting frame and an upper mounting frame, a laser cutting head is mounted on the lower mounting frame, a laser is mounted on the upper mounting frame, laser emitted by the laser is transmitted to the laser cutting head through a reflecting mirror, the film cutting unit comprises a cutting motor assembly and a cutting platform mounted on the cutting motor assembly, the cutting platform is used for bearing a wafer, and the cutting motor assembly can drive the cutting platform to horizontally pass through below the laser cutting head.
Preferably, the side surface of the cutting platform is provided with a strip-shaped light source.
Preferably, the finished product unloading unit includes unloading magazine, get material platform, unloading lifting module, unloading transport assembly, unloading transfer platform, useless capsule and get material transport module, and the level is arranged unloading transport assembly connects unloading transfer platform, and drive unloading transfer platform is in reciprocal horizontal migration between film cutting unit and the useless capsule install on the unloading transport assembly of level unloading lifting module, vertical arrangement unloading lifting module connects get material platform, be used for the drive get material platform unloading transfer platform with unloading magazine between reciprocating motion, the wafer that has finished will be processed is transported to unloading magazine.
Preferably, the wafer loading unit and the film loading unit are arranged at one end of the underframe in parallel, the film cutting unit and the finished product unloading unit are arranged at the other end of the underframe in parallel, the dispensing unit is arranged at the middle part of the underframe, and the wafer conveying unit spans the underframe and sequentially approaches each unit.
Preferably, the chassis is specifically a box structure.
The invention provides a wafer water glue laminating machine which comprises a chassis, a wafer loading unit, a wafer conveying unit, a film loading unit, a glue dispensing unit, a film cutting unit and a finished product blanking unit, wherein the wafer loading unit is arranged on the chassis, the wafer loading unit is used for loading a plurality of stacked wafers to be glued, the film loading unit is used for loading and cutting films, the glue dispensing unit is used for adhering the films to the wafers, the film cutting unit is used for cutting the films on the periphery of the wafers, the finished product blanking unit is used for collecting wafers and cutting waste materials which are subjected to film pasting, the wafer conveying unit is used for conveying the wafers from the wafer loading unit to the glue dispensing unit, and the wafers are conveyed from the glue dispensing unit to the film cutting unit after glue dispensing and pasting are finished.
Realize automatic operation, carry out the pad pasting processing to the wafer fully automatically to can the unnecessary film of automatic cutout wafer periphery, avoid artifical pad pasting and cut the phenomenon of damage to the wafer when the membrane effectively, promote product quality, and can improve production efficiency by a wide margin, reduce artifical use cost, promote equipment stability.
Drawings
FIG. 1 is a schematic diagram of a wafer glue laminating machine according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a wafer loading unit in an embodiment of the wafer glue laminating machine provided by the invention;
FIG. 3 is a schematic diagram of a wafer handling unit in an embodiment of a wafer glue machine according to the present invention;
FIG. 4 is a schematic structural diagram of a film feeding unit in an embodiment of the wafer glue laminating machine according to the present invention;
fig. 5 is a schematic structural diagram of a dispensing unit in an embodiment of the wafer glue laminating machine provided by the invention;
FIG. 6 is a schematic cross-sectional view of a dispensing unit in an embodiment of a wafer glue laminating machine according to the present invention;
FIG. 7 is a schematic diagram of a film cutting unit in an embodiment of a wafer glue machine according to the present invention;
fig. 8 is a schematic structural diagram of a finished product blanking unit in an embodiment of the wafer glue laminating machine provided by the invention.
Detailed Description
The core of the invention is to provide a wafer water glue laminating machine, which realizes automatic operation, effectively avoids the phenomenon of wafer damage during manual film pasting and film cutting, improves the product quality, greatly improves the production efficiency, reduces the manual use cost and improves the equipment stability.
In order to better understand the aspects of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Referring to the drawings, fig. 1 is a schematic structural diagram of an embodiment of a wafer glue laminating machine provided by the present invention.
The invention provides a wafer water glue laminating machine, which comprises a chassis 1, a wafer loading unit 2, a wafer conveying unit 3, a film loading unit 4, a glue dispensing unit 5, a film cutting unit 6 and a finished product blanking unit 7, wherein the wafer loading unit 2 is used for loading a plurality of stacked wafers to be laminated, the film loading unit 4 is used for loading and cutting films, the glue dispensing unit 5 is used for adhering the films to the wafers, the film cutting unit 6 is used for cutting the films on the periphery of the wafers, the finished product blanking unit is used for collecting the wafers and cutting waste materials which are subjected to film adhering, the wafer conveying unit 3 is used for conveying the wafers from the wafer loading unit 2 to the glue dispensing unit 5, and the wafers are conveyed from the glue dispensing unit 5 to the film cutting unit 6 after glue dispensing and adhering are finished.
In the working process, a plurality of wafers to be pasted are stacked and placed in the wafer loading unit 2, the wafers in the wafer loading unit 2 are conveyed to the dispensing unit 5 through the wafer conveying unit 3, dispensing is conducted on the wafers, the films cut in the film loading unit 4 are conveyed to the dispensing unit 5 through the wafer loading unit 2, the wafers conveyed to the wafer in advance are covered, and curing and pasting are completed through the dispensing unit 5. The wafer carrying unit 3 carries the wafer with the attached film to the film cutting unit 6, cuts off the redundant film on the periphery of the well wafer, and carries the finished wafer to the finished product blanking unit 7 after cutting off.
Realize automatic operation, carry out the pad pasting processing to the wafer fully automatically to can the unnecessary film of automatic cutout wafer periphery, avoid artifical pad pasting and cut the phenomenon of damage to the wafer when the membrane effectively, promote product quality, and can improve production efficiency by a wide margin, reduce artifical use cost, promote equipment stability.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a wafer loading unit in an embodiment of a wafer glue laminating machine according to the present invention.
In the wafer glue laminating machine provided by the embodiment of the invention, the wafer loading unit 2 comprises a loading material box 21, a wafer conveying module 22, a wafer lifting module 23, a suction platform 24, a correction platform 25 and a correction lifting motor assembly 26, wherein the loading material box 21 is of a box structure which is vertically arranged, and a worker puts a plurality of stacked wafers into the loading material box 21. The conveying part of the wafer conveying module 22 is horizontally arranged, the loading material box 21 and the correction platform 25 are respectively installed at two ends of the wafer conveying module 22, the wafer lifting module 23 is installed on the wafer conveying module 22, the conveying part of the wafer lifting module 23 is vertically arranged, the sucking platform 24 is installed on the wafer lifting module 23, and the sucking platform 24 is used for sucking single wafers to be laminated. The correction lift motor assembly 26 is installed below the correction platform 25, the correction platform 25 is used for bearing a single wafer to be film-pasted, the correction lift motor assembly 26 is used for driving the correction platform 25 to move up and down along the vertical direction, the height position of the whole correction platform 25 is controlled, and the wafer conveying unit 3 is convenient to take the wafer on the correction platform 25. During operation, the wafer conveying module 22 drives the wafer lifting module 23 and the sucking platform 24 to move close to the feeding box 21, the sucking platform 24 sucks and feeds the wafer inside, the wafer conveying module 22 drives the wafer lifting module 23 and the sucking platform 24 to move close to the correction platform 25, and the sucking platform 24 places the wafer on the correction platform 25. The automatic feeding is realized by the reciprocating motion of the sucking platform 24 between the feeding box 21 and the correcting platform 25.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a wafer conveying unit in an embodiment of the wafer glue laminating machine provided by the present invention.
Further, the wafer conveying unit 3 includes a horizontally extending fixing frame 31, a film cutting and feeding conveying component 33 and a film feeding and conveying component 36 are respectively installed at two ends of the fixing frame 31, a wafer feeding and conveying component 35 is installed in the middle of the fixing frame 31, a first synchronous wheel assembly 32, a wafer feeding and driving component 34 and a second synchronous wheel assembly 37 are also installed on the fixing frame 31, the wafer feeding and driving component 34 is used for driving the wafer feeding and conveying component 35 to horizontally reciprocate so as to convey a wafer to be pasted to the dispensing unit 5, the second synchronous wheel assembly 37 is used for driving the film feeding and conveying component 36 to horizontally reciprocate so as to convey a film to the dispensing unit 5, and the first synchronous wheel assembly 32 is used for driving the film cutting and feeding conveying component 33 to horizontally reciprocate so as to convey a wafer to be pasted to the film cutting unit 6. The wafer loading and transporting assembly 35, the film cutting and transporting assembly 33 and the film loading and transporting assembly 36 all comprise a bracket structure and a sucker structure arranged at the upper end of the bracket structure, the lower end of the bracket structure is connected with a corresponding driver, so that horizontal movement of each assembly is realized, and required components are moved to corresponding working positions. That is, the wafer loading and transporting assembly 35 reciprocates between the wafer loading unit 2 and the dispensing unit 5, the film loading and transporting assembly 36 reciprocates between the film loading unit 4 and the dispensing unit 5, and the film cutting and loading and transporting assembly 33 reciprocates between the dispensing unit 5 and the film cutting unit 6.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a film feeding unit in an embodiment of the wafer glue laminating machine provided by the present invention.
In the wafer glue laminating machine provided by the embodiment of the invention, the film feeding unit 4 comprises a coil stock assembly 41, a film cutting assembly 42, an adsorption platform 43 and a film pulling assembly 44 which are sequentially arranged, and further comprises a film pulling driving motor assembly 45 for driving the film pulling assembly 44 to be far away from the coil stock assembly 41, wherein the film pulling assembly 44 pulls out the film in the coil stock assembly 41 to a certain length under the driving of the film pulling driving motor assembly 45, the adsorption platform 43 adsorbs the film, and finally the film cutting assembly 42 cuts the film of the coil stock, so that a rectangular film exists on the adsorption platform 43.
Referring to fig. 5 and fig. 6, fig. 5 is a schematic structural diagram of a dispensing unit in an embodiment of a wafer glue laminating machine according to the present invention; fig. 6 is a schematic cross-sectional view of a dispensing unit in an embodiment of a wafer glue laminating machine according to the present invention.
The dispensing unit 5 comprises a vertically extending dispensing frame 51, a dispensing lifting motor assembly 52 is mounted at the upper end of the dispensing frame 51, the dispensing lifting motor assembly 52 is connected with a dispensing head 53 and an attaching assembly 54, the dispensing head 53 and the attaching assembly 54 are used for being driven to move up and down, a dispensing platform 55 is mounted at the lower end of the dispensing frame 51, the attaching assembly 54 is used for pressing wafers borne on the dispensing platform 55, a cleanliness detection assembly 56 for detecting films is arranged on the side face of the dispensing platform 55, and a UV curing light source 57 for curing glue is arranged below the dispensing platform 55. In operation, the wafer loading and moving assembly 35 takes the wafer without the film from the correction platform 25 and puts the wafer into the dispensing platform 55, the dispensing head 53 descends to perform dispensing treatment, then the film is put on the wafer by the film loading and moving assembly 36, the film is detected by the cleanliness detecting assembly 56, the film can be pasted, the attaching assembly 54 presses down to completely attach the film on the wafer, finally, the UV curing light source 57 is used for lighting, and the UV curing is used for curing the UV adhesive, so that the wafer film pasting is completed completely.
Referring to fig. 7 and 8, fig. 7 is a schematic structural diagram of a film cutting unit in an embodiment of a wafer glue laminating machine according to the present invention; fig. 8 is a schematic structural diagram of a finished product blanking unit in an embodiment of the wafer glue laminating machine provided by the invention.
The film cutting unit 6 includes a lower mounting frame 64 and an upper mounting frame 67, a laser cutting head 63 is mounted on the lower mounting frame 64, a laser 66 is mounted on the upper mounting frame 67, laser light emitted by the laser 66 is transmitted to the laser cutting head 63 through a reflecting mirror 68, the lower mounting frame 64 is of a portal structure, and the laser cutting head 63 can horizontally and transversely move on the lower mounting frame 64. The film cutting unit 6 further includes a cutting motor assembly 61 and a cutting platform 65 mounted on the cutting motor assembly 61, the cutting motor assembly 61 penetrating through the portal structure of the lower mounting frame 64, the cutting platform 65 being for carrying a wafer, the cutting motor assembly 61 being capable of driving the cutting platform 65 horizontally and longitudinally through below the laser cutting head 63. The laser cutting head 63 and the cutting platform 65 move horizontally and longitudinally, so that the wafer moves horizontally relative to the laser cutting head 63 in two directions, and redundant films around the wafer can be cut.
Further, a strip-shaped light source 62 is provided at the side of the cutting stage 65. The film loading and transporting assembly 36 places the wafer with the film attached onto the dicing table 65, and at this time, the wafer needs to be visually photographed and positioned for subsequent laser dicing, and the bar-shaped light source 62 can provide illumination for visual positioning.
The finished product blanking unit comprises a blanking box 71, a material taking platform 72, a blanking lifting module 73, a blanking conveying assembly 74, a blanking transfer platform 75, a waste film box 76 and a material taking conveying module 77, wherein the blanking conveying assembly 74 which is horizontally arranged is connected with the blanking transfer platform 75 and drives the blanking transfer platform 75 to reciprocate horizontally between the film cutting unit 6 and the waste film box 76, the blanking lifting module 73 is arranged on the blanking conveying assembly 74 which is horizontally arranged, the vertically arranged blanking lifting module 73 is connected with the material taking platform 72 and is used for driving the material taking platform 72 to reciprocate between the blanking transfer platform 75 and the blanking box 71, and processed wafers are conveyed to the blanking box 71. When the film cutting process is finished, the blanking transfer platform 75 is driven by the blanking conveying assembly 74 to suck the wafer to move above the waste box 76, the waste film is subjected to vacuum breaking treatment, the film falls into the waste film box 76 freely, and the material taking platform 72 is driven by the blanking lifting module 73 to descend to a proper height to take out the wafer of the blanking transfer platform 75. Then, the wafer on the material taking platform 72 is sent to the blanking box 71 by the material taking and conveying module 77, and the blanking lifting module 73 can control the height of the material taking platform 72 so as to adapt to the placement of the wafer in the blanking boxes 71 with different heights.
In the wafer glue laminating machine provided in the above embodiments, the wafer loading unit 2 and the film loading unit 4 are arranged in parallel at one end of the chassis 1, the film cutting unit 6 and the finished product unloading unit are arranged in parallel at the other end of the chassis 1, the dispensing unit 5 is arranged in the middle of the chassis 1, and the wafer conveying unit 3 spans across the chassis 1 and sequentially approaches each unit. The chassis 1 has a box structure, and can house electrical components, power facilities, and the like. Other types of operation driving components can be adopted, belt wheel driving, cylinder driving, motor driving and the like are selected according to the situation, and the supporting structures and the structural layout can be adaptively adjusted, so that the operation driving components are all within the protection scope of the invention.
The wafer water glue laminating machine provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (8)
1. The wafer water glue laminating machine is characterized by comprising a bottom frame (1), a wafer feeding unit (2), a wafer conveying unit (3), a film feeding unit (4), a glue dispensing unit (5), a film cutting unit (6) and a finished product blanking unit (7), wherein the wafer feeding unit (2) is used for bearing a plurality of stacked wafers to be laminated, the film feeding unit (4) is used for bearing and cutting films, the glue dispensing unit (5) is used for pasting the films on the wafers, the film cutting unit (6) is used for cutting the films on the periphery of the wafers, the finished product blanking unit (7) is used for collecting wafers and cutting waste materials which finish film pasting, and the wafer conveying unit (3) is used for conveying the wafers from the wafer feeding unit (2) to the glue dispensing unit (5) and conveying the wafers from the glue dispensing unit (5) to the film cutting unit (6) after glue dispensing pasting;
the wafer feeding unit (2) comprises a feeding box (21), a wafer conveying module (22), a wafer lifting module (23), a sucking platform (24), a correction platform (25) and a correction lifting motor assembly (26), wherein the feeding box (21) and the correction platform (25) are respectively arranged at two ends of the wafer conveying module (22) which are horizontally arranged, the wafer lifting module (23) is arranged on the wafer conveying module (22), the sucking platform (24) is arranged on the wafer lifting module (23), the correction lifting motor assembly (26) is arranged below the correction platform (25), the feeding box (21) is used for storing a plurality of wafers to be film-adhered which are vertically stacked, the sucking platform (24) is used for sucking a single wafer to be film-adhered, the correction platform (25) is used for bearing a single wafer to be film-adhered, the correction lifting motor assembly (26) is used for driving the correction platform (25) to move up and down along the vertical direction, the wafer lifting module (22) is used for driving the wafer lifting module (23) to reciprocate between the wafer lifting module (24) and the correction platform (24) to make the wafer lifting module (23) move up and down;
the wafer carrying unit (3) comprises a horizontally extending fixing frame (31), a film cutting and feeding carrying assembly (33) and a film feeding carrying assembly (36) are respectively arranged at two ends of the fixing frame (31), a wafer feeding carrying assembly (35) is arranged in the middle of the fixing frame (31), a first synchronous wheel assembly (32), a wafer feeding driving assembly (34) and a second synchronous wheel assembly (37) are further arranged on the fixing frame (31), the wafer feeding driving assembly (34) is used for driving the wafer feeding carrying assembly (35) to horizontally reciprocate so as to carry a wafer to be pasted to the dispensing unit (5), the second synchronous wheel assembly (37) is used for driving the film feeding carrying assembly (36) to horizontally reciprocate so as to carry a film to the dispensing unit (5), and the first synchronous wheel assembly (32) is used for driving the film cutting and feeding carrying assembly (33) to horizontally reciprocate so as to carry a wafer to be pasted to the film cutting unit (6).
2. Wafer glue laminating machine according to claim 1, characterized in that the film feeding unit (4) comprises a coil stock assembly (41), a film cutting assembly (42), an adsorption platform (43) and a film pulling assembly (44) which are sequentially arranged, and further comprises a film pulling driving motor assembly (45) for driving the film pulling assembly (44) to be far away from the coil stock assembly (41), so that the film pulling assembly (44) pulls out the film in the coil stock assembly (41), the adsorption platform (43) is used for sucking the pulled film, and the film cutting assembly (42) is used for cutting the pulled film.
3. Wafer glue laminating machine according to claim 2, characterized in that the glue dispensing unit (5) comprises a vertically extending glue dispensing frame (51), a glue dispensing lifting motor assembly (52) is mounted at the upper end of the glue dispensing frame (51), the glue dispensing lifting motor assembly (52) is connected with a glue dispensing head (53) and an attaching assembly (54) and used for driving the glue dispensing head (53) and the attaching assembly (54) to move up and down, a glue dispensing platform (55) is mounted at the lower end of the glue dispensing frame (51), the attaching assembly (54) is used for pressing a wafer borne on the glue dispensing platform (55), a cleanliness detection assembly (56) used for detecting films is arranged on the side face of the glue dispensing platform (55), and a UV curing light source (57) used for curing glue is arranged below the glue dispensing platform (55).
4. A wafer glue laminating machine according to claim 3, characterized in that the film cutting unit (6) comprises a lower mounting frame (64) and an upper mounting frame (67), a laser cutting head (63) is mounted on the lower mounting frame (64), a laser (66) is mounted on the upper mounting frame (67), laser emitted by the laser (66) is transmitted to the laser cutting head (63) through a reflecting mirror (68), the film cutting unit (6) comprises a cutting motor assembly (61) and a cutting platform (65) mounted on the cutting motor assembly (61), the cutting platform (65) is used for bearing a wafer, and the cutting motor assembly (61) can drive the cutting platform (65) to horizontally pass below the laser cutting head (63).
5. Wafer glue laminating machine according to claim 4, characterized in that the cutting platform (65) is provided laterally with a strip-shaped light source (62).
6. Wafer glue laminating machine according to claim 5, characterized in that the finished product blanking unit (7) comprises a blanking box (71), a material taking platform (72), a blanking lifting module (73), a blanking conveying assembly (74), a blanking transfer platform (75), a waste film box (76) and a material taking conveying module (77), the blanking conveying assembly (74) which is horizontally arranged is connected with the blanking transfer platform (75), the blanking transfer platform (75) is driven to reciprocate horizontally between the film cutting unit (6) and the waste film box (76), the blanking lifting module (73) is mounted on the blanking conveying assembly (74) which is horizontally arranged, the material taking platform (72) is connected with the blanking lifting module (73) which is vertically arranged, and the material taking platform (72) is driven to reciprocate between the blanking transfer platform (75) and the blanking box (71), and processed wafers are conveyed to the blanking box (71).
7. Wafer glue laminating machine according to any of claims 1 to 6, characterized in that the wafer loading unit (2) and the film loading unit (4) are arranged in parallel at one end of the chassis (1), the film cutting unit (6) and the finished product blanking unit (7) are arranged in parallel at the other end of the chassis (1), the glue dispensing unit (5) is arranged in the middle of the chassis (1), and the wafer conveying unit (3) spans across the chassis (1) and is sequentially close to each unit.
8. Wafer glue applicator according to claim 7, characterized in that the chassis (1) is in particular a box structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211013554.6A CN115332123B (en) | 2022-08-23 | 2022-08-23 | Wafer water glue laminating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211013554.6A CN115332123B (en) | 2022-08-23 | 2022-08-23 | Wafer water glue laminating machine |
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| CN115332123A CN115332123A (en) | 2022-11-11 |
| CN115332123B true CN115332123B (en) | 2023-04-28 |
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| JP4361309B2 (en) * | 2003-04-17 | 2009-11-11 | 株式会社ディスコ | Manufacturing method of semiconductor chip |
| JP4612453B2 (en) * | 2005-03-30 | 2011-01-12 | 株式会社タカトリ | Method and apparatus for applying tape to wafer |
| CN107170874B (en) * | 2017-06-08 | 2019-01-04 | 李文联 | A kind of LED display surface protection film packaging method |
| CN110364473B (en) * | 2018-04-11 | 2021-09-10 | 中芯国际集成电路制造(上海)有限公司 | Bearing device and packaging method |
| CN111446346A (en) * | 2019-12-29 | 2020-07-24 | 深圳市科昭科技有限公司 | Full-automatic adhesive dispensing and film pasting machine for L ED lamp |
| CN216800415U (en) * | 2021-12-29 | 2022-06-24 | 南京双星塑料模具有限公司 | Automatic film sticking machine is glued to point |
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