CN115332123A - Wafer glue laminating machine - Google Patents

Abstract

The invention discloses a wafer water glue laminating machine, comprising a base frame and a wafer feeding unit, a wafer conveying unit, a film feeding unit, a glue dispensing unit, a film cutting unit and a finished product unloading unit mounted on the base frame , the wafer feeding unit is used to carry a plurality of stacked wafers to be filmed, the film feeding unit is used to carry and cut the film, the dispensing unit is used to paste the film on the wafer, and the film cutting unit is used to cut the periphery of the wafer Film, the finished product unloading unit is used to collect the wafers and cutting waste after filming The unit is transported to the film cutting unit. The wafer is automatically filmed, and the excess film on the periphery of the wafer is automatically cut, which effectively avoids the phenomenon of damage to the wafer during manual filming and film cutting, improves product quality, and can greatly improve production efficiency and reduce labor costs. Use cost and improve equipment stability.

Description

A wafer water glue laminating machine

technical field

The invention relates to the field of wafer processing, in particular to a wafer water glue bonding machine.

Background technique

In the semiconductor industry, integrated circuit packaging requires the use of wafers. Before the wafers pick up the chips on the chips, the wafers need to be pretreated with a film. This film has a protective effect on the wafers.

In the prior art, most of the wafers are attached to the film manually. After the film is completed, the excess film around the wafer needs to be cut. The efficiency of manual film attachment is relatively slow, and it is easy to damage the wafer, especially when Wafers are more likely to be scratched when the wafers are subjected to thin-film dicing.

Therefore, how to provide an automatic, stable and efficient wafer water-glue bonding machine is a technical problem currently to be solved by those skilled in the art.

Contents of the invention

The purpose of the present invention is to provide a wafer water glue laminating machine, which can realize automatic operation, effectively avoid damage to the wafer during manual film sticking and film cutting, improve product quality, and can greatly improve production efficiency and reduce Reduce labor costs and improve equipment stability.

In order to solve the above-mentioned technical problems, the present invention provides a wafer water-glue laminating machine, including a chassis and a wafer feeding unit, a wafer transport unit, a film feeding unit, a glue dispensing unit, A film cutting unit and a finished product unloading unit, the wafer loading unit is used to carry a plurality of stacked wafers to be laminated, the film loading unit is used to carry and cut the film, and the dispensing unit is used to place the film Pasted on the wafer, the film cutting unit is used to cut the film around the wafer, the finished product unloading unit is used to collect the wafer and cutting waste after the film is pasted, and the wafer transfer unit is used to transfer the wafer from the The wafer feeding unit is transported to the glue dispensing unit, and the wafer is transported from the glue dispensing unit to the film cutting unit after the glue dispensing is completed.

Preferably, the wafer loading unit includes a loading magazine, a wafer transfer module, a wafer lifting module, a suction platform, a calibration platform and a calibration lifting motor assembly, the loading magazine and the calibration platform respectively installed at both ends of the horizontally arranged wafer transfer module, the wafer lifting module is installed on the wafer transfer module, the suction platform is installed on the wafer lifting module, the The correction lifting motor assembly is installed below the correction platform, the feeding box is used to store a plurality of vertically stacked wafers to be laminated, the suction platform is used to absorb a single wafer to be laminated, and the correction platform is used for For carrying a single wafer to be laminated, the correction lift motor assembly is used to drive the correction platform to move up and down in the vertical direction, and the wafer transfer module is used to drive the wafer lift module to move horizontally. The wafer lifting module is used to drive the suction platform to move vertically, so that the suction platform reciprocates between the loading box and the calibration platform.

Preferably, the wafer transport unit includes a horizontally extending fixed frame, the two ends of the fixed frame are respectively installed with a film feeding and transporting assembly and a film feeding and transporting assembly, and the middle part of the fixed frame is installed with a wafer feeding The moving assembly, the first synchronous wheel assembly, the wafer feeding drive assembly and the second synchronous wheel assembly are also installed on the fixed frame, and the wafer feeding drive assembly is used to drive the wafer feeding and moving The component reciprocates horizontally to transport the wafer to be filmed to the dispensing unit, and the second synchronous wheel combination is used to drive the film feeding and conveying component to reciprocate horizontally to transport the film to the dispensing unit , the first synchronous wheel combination is used to drive the film cutting, feeding and conveying assembly to reciprocate horizontally, so as to transport the film-attached wafer to the film cutting unit.

Preferably, the film feeding unit includes a coil assembly, a film cutting assembly, an adsorption platform, and a film pulling assembly arranged in sequence, and also includes a film pulling drive motor assembly that drives the film pulling assembly away from the coil assembly, so that The film pulling component pulls out the film in the roll material component, the suction platform is used to suck the pulled out film, and the film cutting component is used to cut the pulled out film.

Preferably, the dispensing unit includes a vertically extending dispensing frame, the upper end of the dispensing frame is equipped with a dispensing lifting motor assembly, and the dispensing lifting motor assembly is connected with a dispensing head and an attached assembly, with When driving the dispensing head and the attached assembly to move up and down, a dispensing platform is installed at the lower end of the dispensing frame, and the attached assembly is used to compress the wafer carried on the dispensing platform, The side of the glue dispensing platform is provided with a cleanliness detection component for detecting the film, and a UV curing light source for glue curing is arranged under the glue dispensing platform.

Preferably, the film cutting unit includes a lower mounting frame and an upper mounting frame, a laser cutting head is installed on the lower mounting frame, a laser is installed on the upper mounting frame, and the laser emitted by the laser is transmitted to the The laser cutting head, the film cutting unit includes a cutting motor assembly and a cutting platform installed on the cutting motor assembly, the cutting platform is used to carry wafers, the cutting motor assembly can drive the cutting platform in the Pass below the laser cutting head horizontally.

Preferably, a strip light source is provided on the side of the cutting platform.

Preferably, the finished product unloading unit includes an unloading material box, a reclaiming platform, an unloading lifting module, an unloading conveying assembly, an unloading transfer platform, a waste film box, and a retrieving and conveying module, and the horizontally arranged The blanking conveying component is connected to the blanking transfer platform, and drives the blanking transfer platform to reciprocate and move horizontally between the film cutting unit and the waste film box, and the horizontally arranged blanking conveying component is installed with the The blanking lifting module, the vertically arranged blanking lifting module is connected to the reclaiming platform, and is used to drive the reclaiming platform to reciprocate between the blanking transfer platform and the blanking box moving, the processed wafers are transported to the unloading magazine.

Preferably, the wafer loading unit and the film loading unit are arranged side by side at one end of the chassis, and the film cutting unit and the finished product unloading unit are arranged side by side at the other end of the chassis, The glue dispensing unit is arranged in the middle of the bottom frame, and the wafer transfer unit straddles the bottom frame and approaches each unit sequentially.

Preferably, the chassis is specifically a box structure.

The invention provides a wafer water-glue laminating machine, comprising a base frame and a wafer loading unit installed on the base frame, a wafer conveying unit, a film feeding unit, a glue dispensing unit, a film cutting unit and a finished product unloading unit , the wafer feeding unit is used to carry multiple stacked wafers to be laminated, the film feeding unit is used to carry and cut the film, the glue dispensing unit is used to paste the film on the wafer, and the film cutting unit is used to cut the periphery of the wafer The film and finished product unloading unit is used to collect the wafers and cutting waste after the film has been pasted. The wafer transfer unit is used to transport the wafers from the wafer loading unit to the dispensing unit. The unit is transported to the film cutting unit.

Realize automatic operation, fully automatic film attachment process on the wafer, and can automatically cut the excess film around the wafer, effectively avoid the phenomenon of damage to the wafer during manual film attachment and cutting, improve product quality, and can greatly improve Production efficiency, reduced labor costs, and improved equipment stability.

Description of drawings

Fig. 1 is a schematic structural view of a specific embodiment of the wafer water glue laminating machine provided by the present invention;

Fig. 2 is the structural representation of the wafer loading unit in a kind of embodiment of the wafer hydroglue laminating machine provided by the present invention;

Fig. 3 is a schematic structural view of the wafer transfer unit in a specific embodiment of the wafer water glue laminating machine provided by the present invention;

Fig. 4 is a schematic structural view of the film feeding unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention;

FIG. 5 is a schematic structural view of the dispensing unit in a specific embodiment of the wafer water glue laminating machine provided by the present invention;

6 is a schematic cross-sectional view of the dispensing unit in a specific embodiment of the wafer water glue laminating machine provided by the present invention;

7 is a schematic structural view of the film cutting unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention;

FIG. 8 is a schematic structural view of the finished product unloading unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention.

Detailed ways

The core of the present invention is to provide a wafer water-glue bonding machine, which can realize automatic operation, effectively avoid damage to the wafer during manual film bonding and film cutting, improve product quality, and can greatly improve production efficiency and reduce Reduce labor costs and improve equipment stability.

In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Please refer to the drawings, and Fig. 1 is a structural schematic diagram of a specific embodiment of the wafer hydroglue bonding machine provided by the present invention.

The specific embodiment of the present invention provides a wafer water glue bonding machine, including a chassis 1 and a wafer loading unit 2 installed on the chassis 1, a wafer transfer unit 3, a film loading unit 4, and a glue dispensing unit 5 , a film cutting unit 6 and a finished product unloading unit 7, the wafer loading unit 2 is used to carry a plurality of stacked wafers to be laminated, the film loading unit 4 is used to carry and cut the film, and the dispensing unit 5 is used to apply the film Pasted on the wafer, the film cutting unit 6 is used to cut the film around the wafer, the finished product unloading unit is used to collect the wafer and cutting waste after the film has been pasted, and the wafer transfer unit 3 is used to transfer the wafer from the wafer feeding unit 2 Transported to the glue dispensing unit 5, after the glue dispensing and pasting is completed, the wafer is transported from the glue dispensing unit 5 to the film cutting unit 6.

During the working process, a plurality of wafers to be filmed are stacked into the wafer loading unit 2, and the wafers in the wafer loading unit 2 are transported to the dispensing unit 5 through the wafer transfer unit 3, and sent to the wafer Glue is applied, and then the film cut in the film feeding unit 4 is transported to the dispensing unit 5 through the wafer feeding unit 2, and covered on the previously delivered wafer, and the dispensing unit 5 completes the curing and pasting. The wafer transfer unit 3 transports the wafer pasted with the film to the film cutting unit 6 , cuts off the excess film on the periphery of the wafer, and transports the finished wafer to the finished product unloading unit 7 after cutting.

Realize automatic operation, fully automatic film attachment process on the wafer, and can automatically cut the excess film around the wafer, effectively avoid the phenomenon of damage to the wafer during manual film attachment and cutting, improve product quality, and can greatly improve Production efficiency, reduced labor costs, and improved equipment stability.

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of the wafer loading unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention.

In the wafer water glue laminating machine provided in the specific embodiment of the present invention, the wafer loading unit 2 includes a loading box 21, a wafer transfer module 22, a wafer lifting module 23, a suction platform 24, and a correction platform 25 and a correction lifting motor assembly 26, wherein the material loading box 21 is a vertically arranged box structure, and the staff puts a plurality of stacked wafers into the material loading box 21. The conveying part of the wafer transfer module 22 is arranged horizontally, the feeding box 21 and the calibration platform 25 are respectively installed at the two ends of the wafer transfer module 22, and the wafer lifting module 23 is installed on the wafer transfer module 22. The conveying part of the circular lifting module 23 is vertically arranged, and the suction platform 24 is installed on the wafer lifting module 23, and the suction platform 24 is used for suctioning a single wafer to be coated. The calibration lifting motor assembly 26 is installed under the calibration platform 25. The calibration platform 25 is used to carry a single wafer to be laminated. The calibration lifting motor assembly 26 is used to drive the calibration platform 25 to move up and down in the vertical direction to control the height of the entire calibration platform 25. The position is convenient for the wafer transfer unit 3 to take out the wafers on the calibration platform 25 . When working, the wafer transfer module 22 drives the wafer lifting module 23 and the suction platform 24 to move close to the loading box 21, and the suction platform 24 sucks and loads the inner wafer, and then the wafer transfer module 22 drives the wafer The circular lifting module 23 and the suction platform 24 move close to the calibration platform 25 , and the suction platform 24 places the wafer on the calibration platform 25 . Automatic refilling is realized by the suction platform 24 reciprocating between the feeding box 21 and the correction platform 25 .

Please refer to FIG. 3 . FIG. 3 is a schematic structural diagram of the wafer transfer unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention.

Further, the wafer transport unit 3 includes a horizontally extending fixed frame 31, the two ends of the fixed frame 31 are respectively equipped with a cutting film feeding and conveying assembly 33 and a film feeding and conveying assembly 36, and the middle part of the fixed frame 31 is equipped with a wafer loading device. The moving assembly 35, the first synchronous wheel assembly 32, the wafer feeding drive assembly 34 and the second synchronous wheel assembly 37 are also installed on the fixed frame 31, the wafer feeding driving assembly 34 is used to drive the wafer feeding and moving Component 35 reciprocates horizontally to transport the wafer to be filmed to the dispensing unit 5, and the second synchronous wheel assembly 37 is used to drive the film feeding and conveying component 36 to reciprocate horizontally to transport the film to the dispensing unit 5. The synchronous wheel assembly 32 is used to drive the film cutting, feeding and conveying assembly 33 to reciprocate horizontally, so as to transport the film-attached wafer to the film cutting unit 6 . Among them, the wafer feeding and moving assembly 35, the slit film feeding and transferring assembly 33, and the film feeding and transferring assembly 36 all include a bracket structure and a suction cup structure installed on the upper end of the bracket structure, and the lower end of the bracket structure is connected to the corresponding driver. Horizontal movement to move the required parts to the corresponding working position. That is, the wafer feeding and moving assembly 35 reciprocates between the wafer feeding unit 2 and the dispensing unit 5, and the film feeding and transferring assembly 36 reciprocates between the film feeding unit 4 and the dispensing unit 5, and the film is cut The feeding and conveying assembly 33 reciprocates between the glue dispensing unit 5 and the film cutting unit 6 .

Please refer to FIG. 4 . FIG. 4 is a schematic structural diagram of the film feeding unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention.

In the wafer hydroglue bonding machine provided in the specific embodiment of the present invention, the film feeding unit 4 includes a coil material assembly 41, a film cutting assembly 42, an adsorption platform 43, and a film pulling assembly 44 arranged in sequence, and also includes a driving film pulling assembly. The assembly 44 is far away from the film-drawing driving motor assembly 45 of the coil material assembly 41, and the film-drawing assembly 44 is driven by the film-drawing drive motor assembly 45 to pull out the film inside the coil material assembly 41 to a certain length, and then the film is pulled out by the adsorption platform 43 The film is adsorbed, and finally the film of the roll material is cut into sections by the film cutting assembly 42, and now there will be a rectangular film on the adsorption platform 43.

Please refer to Fig. 5 and Fig. 6, Fig. 5 is a schematic structural view of the dispensing unit in a specific embodiment of the wafer hydroglue laminating machine provided by the present invention; Fig. 6 is the wafer hydroglue provided by the present invention A schematic cross-sectional view of the dispensing unit in a specific embodiment of the machine.

The dispensing unit 5 includes a vertically extending dispensing frame 51, the upper end of the dispensing frame 51 is equipped with a dispensing lifting motor assembly 52, and the dispensing lifting motor assembly 52 is connected with a dispensing head 53 and an attachment assembly 54 for driving The dispensing head 53 and the attachment assembly 54 move up and down, the dispensing platform 55 is installed at the lower end of the dispensing frame 51, the attachment assembly 54 is used to compress the wafer carried on the dispensing platform 55, and the side of the dispensing platform 55 is set There is a cleanliness detection component 56 for detecting the film, and a UV curing light source 57 for glue curing is arranged under the glue dispensing platform 55 . During work, the wafer loading and moving component 35 takes the uncoated wafer from the correction platform 25 and puts it into the dispensing platform 55, and then the dispensing head 53 descends for dispensing, and then the film feeding and moving component 36 Put the film on the wafer, and use the cleanliness detection component 56 to test the film. Only after passing the test can the film sticking process be carried out. The sticking component 54 presses down to attach the film to the wafer completely, and finally the UV curing light source 57 is turned on, and the UV glue is cured by ultraviolet rays. At this time, the wafer attachment has been completed.

Please refer to Fig. 7 and Fig. 8, Fig. 7 is a schematic structural view of the film cutting unit in a specific embodiment of the wafer hydroglue bonding machine provided by the present invention; Fig. 8 is the wafer hydroglue pasting provided by the present invention A schematic structural view of the finished product unloading unit in a specific embodiment of the combined machine.

The film cutting unit 6 comprises a lower mounting frame 64 and an upper mounting frame 67, a laser cutting head 63 is installed on the lower mounting frame 64, a laser device 66 is installed on the upper mounting frame 67, and the laser light emitted by the laser device 66 is transmitted to the laser cutting head through a reflector 68 63 , the lower mounting frame 64 is a gantry structure, and the laser cutting head 63 can move horizontally and laterally on the lower mounting frame 64 . The film cutting unit 6 also includes a cutting motor assembly 61 and a cutting platform 65 installed on the cutting motor assembly 61. The cutting motor assembly 61 passes through the gantry structure of the lower mounting frame 64. The cutting platform 65 is used to carry wafers, and the cutting motor assembly 61 can drive the cutting platform 65 to pass horizontally and longitudinally under the laser cutting head 63 . The horizontal movement and the vertical movement of the laser cutting head 63 and the cutting platform 65 realize the horizontal movement of the wafer relative to the laser cutting head 63 in two directions, and can clean the excess film around the wafer.

Further, a strip light source 62 is provided on the side of the cutting platform 65 . The film feeding and conveying component 36 puts the film-attached wafer onto the cutting platform 65. At this time, the wafer needs to be visually photographed and positioned for subsequent laser cutting processing. The strip light source 62 can provide light for visual positioning.

The finished product unloading unit includes unloading material box 71, reclaiming platform 72, unloading lifting module 73, unloading and conveying assembly 74, unloading transfer platform 75, waste film box 76 and unloading and conveying module 77, horizontally arranged The blanking transfer component 74 is connected to the blanking transfer platform 75, and drives the blanking transfer platform 75 to reciprocate and move horizontally between the film cutting unit 6 and the waste film box 76, and the blanking transfer component 74 arranged horizontally is equipped with a blanking lifting module 73, the vertically arranged unloading lifting module 73 is connected to the reclaiming platform 72, and is used to drive the unloading platform 72 to reciprocate between the unloading transfer platform 75 and the unloading box 71, and the processed wafers are transported to Blanking material box 71. When working, after the wafer cutting is completed, the unloading transfer platform 75 is driven by the unloading and conveying component 74, absorbs the wafer and moves to the top of the waste box 76, and breaks the vacuum treatment of the discarded film, allowing the film to fall freely to the waste film Inside the box 76, the unloading platform 72 is driven by the unloading lifting module 73, and then lowered to a suitable height to take out the wafers on the unloading transfer platform 75. Then the wafer on the retrieving platform 72 is sent to the inside of the unloading material box 71 by the retrieving and transporting module 77, and the unloading and lifting module 73 can control the height of the retrieving platform 72, so as to adapt to the situation where the wafer is placed on different heights. 71 li of feeding box.

In the wafer water-glue laminating machine provided in each of the above specific embodiments, the wafer loading unit 2 and the film loading unit 4 are arranged side by side at one end of the chassis 1, and the film cutting unit 6 and the finished product unloading unit are arranged side by side at At the other end of the chassis 1, the dispensing unit 5 is arranged in the middle of the chassis 1, and the wafer transfer unit 3 straddles the chassis 1 and approaches each unit in turn. The chassis 1 is specifically a box structure, capable of placing electrical components, power facilities and the like. Wherein, each operation drive part also can adopt other types, select pulley drive, cylinder drive and motor drive etc. according to the situation, also can carry out adaptive adjustment to each support structure and structure layout, all within the scope of protection of the present invention.

The wafer hydroglue laminating machine provided by the present invention has been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present invention, and the descriptions of the above embodiments are only used to help understand the method and core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims (10)

1. The utility model provides a wafer glue rigging machine, characterized in that, including chassis (1) and install in wafer material loading unit (2), wafer carrying unit (3), film material loading unit (4), some glue unit (5), film cutting unit (6) and finished product unloading unit (7) of chassis (1), wafer material loading unit (2) are used for bearing a plurality of waiting to paste the membrane wafer that pile up, film material loading unit (4) are used for bearing and cutting the film, some glue unit (5) are used for pasting the film in the wafer, film cutting unit (6) are used for cutting the peripheral film of wafer, finished product unloading unit (7) are used for collecting the wafer and the cutting waste material of accomplishing the pad pasting, wafer carrying unit (3) are used for transporting the wafer by wafer material loading unit (2) to some glue unit (5), accomplish paste the back with the wafer by some glue unit (5) transport to some glue unit (6).

2. The wafer glue laminating machine according to claim 1, wherein the wafer loading unit (2) comprises a loading magazine (21), a wafer carrying module (22), a wafer lifting module (23), a suction platform (24), a calibration platform (25) and a calibration lifting motor assembly (26), the material loading box (21) and the correcting platform (25) are respectively arranged at two ends of the wafer conveying module (22) which is horizontally arranged, the wafer lifting module (23) is arranged on the wafer conveying module (22), the suction platform (24) is arranged on the wafer lifting module (23), the correcting lifting motor component (26) is arranged below the correcting platform (25), the feeding material box (21) is used for storing a plurality of vertically stacked wafers to be filmed, the suction platform (24) is used for sucking a single wafer to be filmed, the correction platform (25) is used for bearing a single wafer to be filmed, the correcting lifting motor component (26) is used for driving the correcting platform (25) to move up and down along the vertical direction, the wafer carrying module (22) is used for driving the wafer lifting module (23) to move horizontally, the wafer lifting module (23) is used for driving the suction platform (24) to vertically move, so that the suction platform (24) reciprocates between the feed magazine (21) and the calibration platform (25).

3. The wafer glue laminating machine according to claim 2, wherein the wafer conveying unit (3) comprises a horizontally extending fixed frame (31), a film cutting and feeding conveying assembly (33) and a film feeding conveying assembly (36) are respectively mounted at two ends of the fixed frame (31), a wafer feeding conveying assembly (35) is mounted in the middle of the fixed frame (31), a first synchronous wheel assembly (32), a wafer feeding driving assembly (34) and a second synchronous wheel assembly (37) are further mounted on the fixed frame (31), the wafer feeding driving assembly (34) is used for driving the wafer feeding conveying assembly (35) to horizontally reciprocate so as to convey a wafer to be laminated to the dispensing unit (5), the second synchronous wheel assembly (37) is used for driving the film feeding conveying assembly (36) to horizontally reciprocate so as to convey a film to the dispensing unit (5), and the first synchronous wheel assembly (32) is used for driving the film cutting and feeding conveying assembly (33) to horizontally reciprocate so as to convey a wafer to be laminated to the film cutting and cutting unit (6).

4. The wafer glue laminating machine according to claim 3, wherein the film feeding unit (4) comprises a roll material assembly (41), a film cutting assembly (42), an adsorption platform (43) and a film pulling assembly (44) which are sequentially arranged, and further comprises a film pulling driving motor assembly (45) for driving the film pulling assembly (44) to be away from the roll material assembly (41), so that the film pulling assembly (44) pulls out the film in the roll material assembly (41), the adsorption platform (43) is used for sucking the pulled film, and the film cutting assembly (42) is used for cutting off the pulled film.

5. The wafer glue laminating machine according to claim 4, wherein the glue dispensing unit (5) comprises a vertically extending glue dispensing frame (51), a glue dispensing lifting motor assembly (52) is installed at the upper end of the glue dispensing frame (51), the glue dispensing lifting motor assembly (52) is connected with a glue dispensing head (53) and an attaching assembly (54) and used for driving the glue dispensing head (53) and the attaching assembly (54) to move up and down, a glue dispensing platform (55) is installed at the lower end of the glue dispensing frame (51), the attaching assembly (54) is used for pressing a wafer borne on the glue dispensing platform (55), a cleanliness detection assembly (56) for detecting a film is arranged on the side of the glue dispensing platform (55), and a UV curing light source (57) for curing glue is arranged below the glue dispensing platform (55).

6. The wafer glue laminating machine according to claim 5, wherein the film cutting unit (6) comprises a lower mounting frame (64) and an upper mounting frame (67), the lower mounting frame (64) is provided with a laser cutting head (63), the upper mounting frame (67) is provided with a laser (66), laser emitted by the laser (66) is transmitted to the laser cutting head (63) through a reflector (68), the film cutting unit (6) comprises a cutting motor assembly (61) and a cutting platform (65) mounted on the cutting motor assembly (61), the cutting platform (65) is used for bearing a wafer, and the cutting motor assembly (61) can drive the cutting platform (65) to horizontally pass below the laser cutting head (63).

7. The wafer glue laminating machine according to claim 6, characterized in that a strip-shaped light source (62) is arranged on the side of the cutting platform (65).

8. The wafer hydrogel laminating machine according to claim 7, wherein the finished product blanking unit (7) comprises a blanking magazine (71), a material taking platform (72), a blanking lifting module (73), a blanking carrying assembly (74), a blanking transfer platform (75), a waste film box (76) and a material taking carrying module (77), the blanking carrying assembly (74) arranged horizontally is connected with the blanking transfer platform (75) and drives the blanking transfer platform (75) to move horizontally and reciprocally between the film cutting unit (6) and the waste film box (76), the blanking lifting module (73) is installed on the blanking carrying assembly (74) arranged horizontally, the blanking lifting module (73) arranged vertically is connected with the material taking platform (72) and is used for driving the material taking platform (72) to move reciprocally between the blanking transfer platform (75) and the blanking magazine (71), and a processed wafer is conveyed to the blanking magazine (71).

9. The wafer glue laminating machine according to any one of claims 1 to 8, characterized in that the wafer feeding unit (2) and the film feeding unit (4) are arranged in parallel at one end of the bottom frame (1), the film cutting unit (6) and the finished product feeding unit (7) are arranged in parallel at the other end of the bottom frame (1), the glue dispensing unit (5) is arranged at the middle of the bottom frame (1), and the wafer carrying unit (3) spans the bottom frame (1) and is sequentially close to each unit.

10. The wafer glue laminating machine according to claim 9, characterized in that the chassis (1) is embodied as a box structure.

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