CN110364473B - Bearing device and packaging method - Google Patents
Bearing device and packaging method Download PDFInfo
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- CN110364473B CN110364473B CN201810322009.2A CN201810322009A CN110364473B CN 110364473 B CN110364473 B CN 110364473B CN 201810322009 A CN201810322009 A CN 201810322009A CN 110364473 B CN110364473 B CN 110364473B
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 263
- 238000003825 pressing Methods 0.000 claims abstract description 151
- 239000003292 glue Substances 0.000 claims abstract description 45
- 230000001681 protective effect Effects 0.000 claims abstract description 36
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 239000010410 layer Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000012466 permeate Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000010073 coating (rubber) Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000012858 packaging process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OEBRKCOSUFCWJD-UHFFFAOYSA-N dichlorvos Chemical compound COP(=O)(OC)OC=C(Cl)Cl OEBRKCOSUFCWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a bearing device and a packaging method. By providing a plurality of openings in the press member of the carrier, the pressed portion of the substrate can be exposed through the openings of the press member even if a partial area of the substrate is pressed by the press member when the substrate is pressed by the press member. Therefore, when the bearing device provided by the invention is used for bearing and fixing the substrate to carry out a gluing process, not only can a glue layer be formed in the part, which is not pressed by the pressing piece, of the substrate, but also a glue column can be formed in the pressed area of the substrate, and under the common support of the glue layer and the glue column, a subsequently formed protective film has better flatness, so that the problem of chip loss in a subsequent cutting process is further avoided.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a carrier device and a packaging method.
Background
In the subsequent packaging process of the integrated circuit, processes such as substrate back thinning, slicing, mounting, wire bonding and the like need to be performed, and before slicing the substrate, relevant information needs to be marked on the back of the substrate. For example, by forming a back adhesive on the back side of the substrate, the relevant information can then be marked on the back adhesive with a laser, and the dicing process can be performed after the formation of the back adhesive.
The slicing process is to cut the substrate by a blade to divide a plurality of chips. Before the substrate is cut, a protective film is usually required to be formed on the back adhesive of the substrate, so that the substrate is cut under the maintenance of the protective film, and the integrity of the substrate after cutting can be kept the same as that of the substrate before cutting.
However, in the actual slicing process, a chip missing (fly die) problem corresponding to the edge region of the substrate often occurs, which not only results in the loss of the product, but also further damages the blade due to the chip missing generated in the cutting process, thereby affecting the product yield in the slicing process.
Disclosure of Invention
The invention aims to provide a bearing device to solve the problem that chips corresponding to the edge area of a substrate are frequently lost in the slicing process.
In order to solve the above technical problem, the present invention provides a bearing device, including:
a support table for supporting the substrate from a first surface thereof; and the number of the first and second groups,
the pressing piece is used for pressing the substrate on the supporting table from the upper part of the supporting table, and is provided with a pressing part which is used for pressing the substrate from the second surface of the substrate and is also provided with a plurality of openings; when the pressing member presses the substrate, the pressed portion of the substrate is exposed through the opening in the pressing portion.
Optionally, the pressing part of the pressed piece is of an annular structure, and a plurality of openings are distributed in the annular structure; when the pressing member presses the substrate, the annular structure of the pressing portion presses the substrate, and a part of the substrate is exposed in an inner ring of the annular structure of the pressing portion.
Optionally, the inner ring size of the annular structure of the pressing part is smaller than the size of the substrate, and the outer ring size of the annular structure of the pressing part is larger than the size of the substrate; when the pressing member presses the substrate, the pressing portion of the pressing member presses an area of the second surface of the substrate near an edge, and a portion of the substrate in the edge area is exposed through the opening in the pressing portion.
Optionally, the difference between the size of the inner ring of the annular structure of the pressing part and the size of the substrate is less than or equal to 1.5 mm.
Optionally, the pressing piece further comprises an extension part, the extension part is located at the periphery of the pressing part and integrally connected with the boundary of the pressing part, and the opening is not formed in the extension part; when the pressing member presses the substrate, the pressing portion presses on an edge region of the substrate, and the extension portion extends from the edge region of the substrate to cover a peripheral region of the substrate.
Optionally, when the pressing member presses the substrate on the supporting table from above the susceptor, the pressing portion covers an edge region of the supporting table, and the extending portion extends from the edge region of the supporting table to a peripheral region of the supporting table to prevent the supporting table from being exposed.
Optionally, the substrate is a wafer, and the pressing portion is of a circular ring structure.
Optionally, a chamfer is arranged on the wafer; when the support table supports the wafer, a portion of the support table corresponding to the chamfer of the wafer is exposed from the surface of the wafer, and when the pressing member is pressed on the substrate, the pressing portion of the pressing member presses the portion of the chamfer of the wafer without starting to have a hole.
Optionally, the carrying device further includes: the stop piece is used for stopping the substrate from the side wall of the substrate, when the bearing device bears the substrate, the stop piece stops at the position of the side wall of the substrate, and the pressing piece presses on the area, close to the edge, of the second surface of the substrate and extends to press on the stop piece.
It is still another object of the present invention to provide a packaging method, comprising:
carrying a substrate by using the carrying device as described above, wherein the substrate is placed on the supporting table with the first surface facing the supporting table in the carrying device, a pressing member in the carrying device presses the substrate from the second surface of the substrate, and the pressed portion of the substrate is exposed through an opening of the pressing member; and the number of the first and second groups,
and coating a back adhesive material on the second surface of the substrate, wherein the part of the substrate which is not pressed by the pressing member is coated with the back adhesive material to form an adhesive layer, and the back adhesive material permeates into the edge area of the substrate through the opening of the pressing member to form a plurality of adhesive columns.
Optionally, the openings in the compact have an opening size equal to or greater than the largest size of the backsize particles in the backsize material.
Optionally, the height of the glue layer and the glue column in a direction perpendicular to the surface of the substrate is less than or equal to the height of the pressing member.
Optionally, after the adhesive-backed material is coated, the method further comprises: and taking the substrate out of the bearing device so as to attach a protective film on the second surface of the substrate, wherein the protective film is attached on the glue layer and the glue columns.
Optionally, after attaching the protective film, the method further includes: a dicing process is performed on the substrate from the first surface of the substrate.
In the bearing device provided by the invention, the pressing piece is provided with a plurality of openings, so that when the pressing piece is used for pressing the substrate, even if partial area of the substrate is pressed by the pressing piece, the pressed part of the substrate (for example, the edge area of the substrate) can be exposed through the openings of the pressing piece. Therefore, when the bearing device is used for bearing and fixing the substrate for gluing, not only the part of the substrate which is not pressed by the pressing piece is coated with the gum material, but also the area pressed by the pressing piece in the substrate can be formed with the glue column through the opening of the pressing piece. That is, even under the pressing of the pressed member, the back adhesive material can be coated in most of the area of the substrate. Furthermore, under the common support of the glue layer and the glue column, the subsequent protective film attached to the second surface of the substrate has better flatness, and has better fixing and maintaining effects on the whole substrate, thereby avoiding the problem of chip loss in the subsequent cutting process.
Drawings
FIG. 1a is a top view of a carrier device carrying a substrate;
fig. 1b is a cross-sectional view of the carrier device shown in fig. 1a, wherein the carrier device carries a substrate, taken along the direction aa';
fig. 2a is a schematic structural diagram of a glue layer obtained when the substrate is carried by the carrying device shown in fig. 1a and 1b to glue the substrate;
FIG. 2b is a schematic structural view of a protective film attached to the substrate coated with the adhesive-backed material shown in FIG. 2 a;
fig. 3a is a schematic structural diagram of a carrying device according to a first embodiment of the invention;
FIG. 3b is a cross-sectional view of the load bearing device shown in FIG. 3a taken along the direction aa';
FIG. 4 is a flowchart illustrating a packaging method according to a second embodiment of the present invention;
fig. 5a to 5c are schematic structural diagrams of a packaging method in a second embodiment of the invention in a packaging process thereof.
Detailed Description
As described in the background art, when a blade is used to perform a dicing process, a chip missing problem often occurs at the edge of a substrate, so that the blade is damaged, and the yield of a product is affected.
In view of the above problem, the inventors of the present invention have conducted extensive studies to find that the reason for the chip missing is that a certain gap exists between the protective film at the edge of the substrate and the substrate, so that the portion of the substrate corresponding to the gap cannot be well fixed and maintained by the protective film, and further, the portion of the substrate is easily separated from the substrate by the cutting action of the blade, thereby causing the chip missing.
The inventors have further studied and found that the above-mentioned gap occurs at the edge of the substrate because the back adhesive cannot cover the edge region of the substrate, so that the portion of the substrate located at the edge region is exposed from the back adhesive to form a large step with the back adhesive. Therefore, when the protective film is attached to the back glue in the subsequent process, the protective film cannot be filled to cover the side wall and the bottom of the step, and the gap is formed. The fundamental reason why the back adhesive cannot completely cover the back surface of the entire substrate is that, when the back surface of the substrate is coated with the back adhesive material, the pressing member pressed on the back surface of the substrate covers a part of the substrate, and the covered part of the substrate cannot naturally form the back adhesive.
Fig. 1a is a top view of a carrier device carrying a substrate, and fig. 1b is a cross-sectional view of the carrier device carrying the substrate shown in fig. 1a along the direction aa'. Referring to fig. 1a and 1b, a carrier apparatus includes:
a support table 10 for supporting the substrate W from a first surface thereof;
a pressing member 20 for pressing the substrate W from the second surface of the substrate W, and the pressing member 20 presses an edge area W1 of the second surface of the substrate W.
That is, when the substrate W is carried by the carrier apparatus shown in fig. 1a, the edge area W1 of the substrate W is completely blocked by the pressing member 20 of the carrier apparatus.
Fig. 2a is a schematic structural diagram of a glue layer obtained when the substrate is carried by the carrying device shown in fig. 1a and 1b to glue the substrate. As shown in fig. 2a, the part of the substrate W not pressed by the pressing member 20 is exposed, and the adhesive material is coated on the exposed part of the substrate W to form an adhesive layer 40; however, the edge area W1 of the substrate W, which is hidden by the pressing member 20 without being exposed, is not coated with the adhesive material accordingly.
Fig. 2b is a schematic structural diagram of attaching a protective film to the substrate coated with the adhesive-backed material shown in fig. 2 a. As shown in fig. 2b, when attaching a protective film 50 on the substrate W, since the edge region of the substrate W is not formed with the glue layer, a step is formed between the edge of the glue layer 40 and the substrate W, and due to the step, the protective film 50 forms a space gap G at the step, that is, the protective film 50 cannot completely fill the region of the step. Due to the existence of the space gap G, when the substrate W corresponding to the space gap G is cut, the chip at the corresponding position is likely to be lost.
To this end, the invention provides a carrying device comprising:
a support table for supporting the substrate from a first surface thereof; and the number of the first and second groups,
the pressing piece is used for pressing the substrate on the supporting table from the upper part of the supporting table, and is provided with a pressing part which is used for pressing the substrate from the second surface of the substrate, and a plurality of openings are formed in the pressing part.
In the bearing device provided by the invention, on the basis of utilizing the pressing piece to press the substrate to bear and fix the substrate, as the pressing part of the pressing piece pressed on the substrate is provided with the plurality of openings, the substrate can be exposed through the openings, therefore, when the bearing device provided by the invention is subsequently utilized to bear and fix the substrate to perform a gluing process on the substrate, the gum material can be coated on the part which is not pressed by the pressing piece in the substrate to form a gum layer, and meanwhile, the gum material can also permeate into the pressed part in the substrate through the openings, so that a glue column can be formed on the pressed part in the substrate. Due to the existence of the glue column, when a protective film needs to be formed on the glue layer of the substrate in the subsequent process, the glue column can support and adhere the protective film, so that a complete protective film can be formed on the whole second surface of the substrate, a larger gap is prevented from being formed by the substrate, the glue layer and the protective film, and the problem of flying chips generated in the subsequent cutting process can be solved.
The carrier and the packaging method according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
Fig. 3a is a schematic structural diagram of a carrying device according to a first embodiment of the invention, and fig. 3b is a cross-sectional view of the carrying device shown in fig. 3a along the direction aa'.
As shown in fig. 3a and 3b, the carrying device includes:
a support table 100 for supporting the substrate W from a first surface thereof; further, a plurality of vacuum suction ports may be provided in the support table 100 to vacuum-suck the substrate W; and the number of the first and second groups,
a pressing member 200 for pressing the substrate on the support table 100 from above the support table 100, the pressing member 200 having a pressing portion 210, the pressing portion 210 for pressing the substrate W from the second surface thereof, and a plurality of openings 210a formed in the pressing portion 210; when the pressing member 200 presses the substrate W, the pressed portion of the substrate W is exposed through the opening 210a in the pressing part 210.
That is, when a substrate is loaded on the carrier, the support table 100 supports the substrate W from below the substrate, and the pressing member 200 presses the substrate W from above the substrate W. Since the pressing part 210 of the pressing member 200 is provided with a plurality of openings 210a, the substrate W can be pressed by the pressing member 200 to be supported and fixed; and, in the subsequent glue spreading process, the back glue material can penetrate into the pressed portion of the substrate W through the opening 210a, so that a plurality of glue pillars can be formed on the pressed portion of the substrate.
With continued reference to fig. 3a and 3b, the pressing portion 210 of the pressing member 200 has a ring-shaped structure, and a plurality of openings 210a are distributed in the ring-shaped structure. When the pressing member 200 presses the substrate W, the ring-shaped structure of the pressing part 210 presses the substrate W, and a portion of the substrate W is exposed in an inner ring of the ring-shaped structure of the pressing part 210. In this embodiment, the substrate is, for example, a wafer, and the pressing portion 210 may have a corresponding annular structure.
In a preferred embodiment, an inner ring size of the ring-shaped structure of the pressing portion 210 is smaller than a size of the substrate W, and an outer ring size of the ring-shaped structure of the pressing portion 210 is larger than the size of the substrate W. As such, when the pressing member 200 presses the substrate W, the pressing portion 210 of the pressing member presses an area of the second surface of the substrate W near the edge, and a portion of the substrate located at the edge area is exposed through the opening 210a in the pressing portion 210. In this embodiment, the annular structure is an annular structure, and therefore the inner ring size can be understood as an inner diameter size of the annular structure, and the outer ring size can be understood as an outer diameter size of the annular structure.
The inner ring size and the outer ring size of the pressing part 210 can be adjusted according to specific conditions, for example, the difference between the inner ring size of the ring-shaped structure of the pressing part 210 and the size of the substrate can be less than or equal to 1.5 mm. As such, when the pressing member presses the substrate, the pressing part 210 may press an area of the substrate W near the edge of 1.5mm or less.
As shown in fig. 3a and 3b, the pressing member 200 further includes an extension portion 220, the extension portion 220 is located at the periphery of the pressing portion 210 and integrally connected to the boundary of the pressing portion 210, and the opening is not opened in the extension portion 220. When the pressing member 200 presses the substrate W, the pressing part 210 presses on the edge area of the substrate W, and the extension part 220 extends from the edge area of the substrate W to cover the peripheral area of the substrate. Since the opening is not formed in the extension part 220 of the pressing member 200, the peripheral region of the substrate is prevented from being exposed, and therefore, other components or devices are not polluted in the subsequent gluing process.
Optionally, the extension 220 may further extend from an edge region of the support stage 100 to cover a peripheral region of the support stage 100. That is, when the pressing member 200 presses the substrate on the support stage 100 from above the susceptor 100, the pressing portion 210 covers the edge region of the support stage 100, and the extension portion 220 may extend from the edge region of the support stage 100 to the peripheral region of the support stage 100, thereby preventing the support stage 100 from being exposed under the common covering of the pressing member 200 and the substrate W.
In this way, when the size of the supporting surface of the supporting table 100 is larger than the size of the first surface of the substrate, a portion of the supporting surface of the supporting table 100 is not covered by the substrate W, and at this time, the pressing member 200a covers the peripheral area of the substrate W in an extending manner, and further covers the peripheral area of the supporting table 100 in an extending manner, so that the supporting table 100 is prevented from being exposed under the common covering of the substrate W and the pressing member 200, and further, when the glue coating process is performed, the gum material can be coated on the substrate W only and cannot overflow onto the supporting table 100, thereby ensuring that the supporting table 100 is not contaminated by the gum material.
In this embodiment, the substrate is a wafer, and the pressing portion has an annular structure. The shape of the support table 100 may be circular, and the diameter of the support table 100 may be set according to the diameter of the wafer, for example, the diameter of the support table 100 may be set to be equal to or larger than the diameter of the wafer. In this embodiment, the diameter of the support table 100 is the same as the diameter of the wafer.
In addition, the shape of the wafer is not absolutely circular, but a chamfer W2 is provided at the edge region of the wafer to assist in confirming the orientation of the wafer. Since the chamfer is provided, when the support table 100 supports the wafer, the portion of the support table 100 corresponding to the chamfer W2 of the wafer is exposed from the surface of the wafer, i.e., the position of the support table 100 corresponding to the chamfer is not covered by the wafer. Therefore, in a preferable aspect, when the pressed member 200 is pressed on the wafer, the pressing portion 210 of the pressed member 200 does not start to have an opening in a portion where the chamfer W2 of the wafer is pressed. Therefore, the back glue material is prevented from permeating into the supporting platform from the chamfer area of the wafer in the subsequent gluing process.
With continued reference to fig. 3a and 3b, the carrier further includes a stopper 300, wherein the stopper 300 is used for stopping the substrate W from the sidewall thereof, so that the substrate W is limited at a predetermined position and prevented from sliding. When the substrate W is carried by the carrier, the stopper 300 is stopped at a sidewall position of the substrate, and the pressing member 200 is pressed on an area of the second surface of the substrate near the edge and extended to press on the stopper 300.
Specifically, the process of the carrying device carrying the substrate includes:
first, a substrate W is placed on the support table 100 with its first surface facing the support table 100, and is restrained from sliding on the support table 100 from the side wall thereof by the stopper 300;
next, the edge position of the second surface of the substrate W is pressed by the pressing member 200 while being pressed above the stopper 300 to fix the substrate W, thereby ensuring that the substrate W is not turned out of the support table 100 when the substrate W is coated with glue.
The pressing member 200 may be a plate-like structure, for example. And, the edge of the pressed piece 200 may further be provided with a fixing frame 230, the fixing frame 230 is used to maintain the shape of the whole pressed piece 200 and prevent the pressed piece 200 from deforming, and the fixing frame 230 may also be used as a force application part for realizing the movement of the pressed piece 200, that is, by applying a force to the fixing frame 230, the whole pressed piece 200 is driven to be pressed on the substrate, or the whole pressed piece is driven to leave the substrate, etc.
Further, a positioning pin 310 is provided on the stopper 300, and the positioning pin 310 is used to confirm the positional relationship between the stopper 200 and the pressing member 300, so that the pressing member 200 can be pressed over the substrate W and the stopper 300 in alignment.
Example two
Based on the above bearing device, the invention further provides a packaging method, that is, the bearing device is utilized to bear and fix the substrate, so as to perform a gluing process on the substrate in the packaging process, so that when the substrate is coated with the gum material, the gum material can be coated in the edge area of the substrate at the same time.
Fig. 4 is a schematic flow chart of a packaging method in the second embodiment of the present invention, and fig. 5a to 5c are schematic structural diagrams of the packaging method in the second embodiment of the present invention in a packaging process thereof. The packaging method in the present embodiment is described in detail below with reference to the drawings.
In step S110, as shown in fig. 5a, a substrate W is supported by the support apparatus as described above, wherein the substrate W is placed on the support table 100 with a first surface facing the support table 100, the pressing member 200 presses the substrate W from a second surface of the substrate W, and the pressed portion of the substrate is exposed through the opening 210a of the pressing member 200.
Further, the pressing member 200 presses an edge region of the second surface of the substrate. And, the pressing member 200 may also preferably extend from the edge of the substrate W to the peripheral region of the substrate, thereby preventing the supporting table 100 from being exposed under the cover of the pressing member 200 and the substrate W, and thus ensuring that the gum material does not overflow onto the supporting table 100.
Further, the carrier device further includes a stopper 300, and the stopper 300 stops the substrate W from a sidewall of the substrate W to limit the substrate W at a predetermined position.
In step S120, as shown in fig. 5a and 5b, a back adhesive material is coated on the second surface of the substrate W, wherein the back adhesive material is coated on a portion of the substrate W that is not pressed by the pressing member 200 to form an adhesive layer 400, and the back adhesive material penetrates into the edge region of the substrate W through the opening 210a of the pressing member 200 to form a plurality of adhesive columns 410.
With continued reference to fig. 5b, when the substrate W is carried by the carrying apparatus to perform the glue coating process, since the pressing member 200 has the opening 210a formed in the portion pressed on the substrate, the edge portion of the substrate W can also be coated with the back glue material to form a plurality of glue pillars 410, thereby preventing the edge area of the substrate from being largely exposed.
Specifically, the manner of applying the adhesive-backed material can refer to the following steps, for example:
firstly, under the pressing of the pressing piece 200, a backing adhesive material is coated on the second surface of the substrate by using a tool such as a scraper to form a backing adhesive material film, and the thickness of the formed backing adhesive material film is less than or equal to the thickness of the pressing piece 200 correspondingly, for example, the thickness of the backing adhesive material film is between 30 μm and 40 μm;
and then, curing the back adhesive material film, for example, curing by baking, and forming an adhesive layer with higher hardness, namely the back adhesive, by using the cured back adhesive material film. In the subsequent packaging process, laser marking and other operations can be carried out on the solidified back adhesive.
Further, the opening size of the opening 210a may be set according to actual conditions, and specifically, the opening size of the opening 210a may be set according to the size of the adhesive-backed particles in the adhesive-backed material, the viscosity of the adhesive-backed material, and the like. For example, the opening size of the opening 210a may be made larger than the maximum size of the adhesive-backed particles in the adhesive-backed material, so that the adhesive-backed material can be ensured to smoothly penetrate into the opening 210a to form the adhesive column 410.
In this embodiment, the packaging method further includes:
in step S130, referring to fig. 5c, the substrate W is taken out of the carrier, and a protective film 500 is attached on the second surface of the substrate W, wherein the protective film 500 is attached on the glue layer 400 and the glue pillars 410. That is, the protective film 500 may be attached to the middle area and the edge area of the substrate W. The protective film 500 may be a blue film, for example.
Due to the existence of the glue column 410, a large gap is not formed between the glue layer 400 attached with the protective film 500 and the substrate W; and the glue column 410 formed at the edge of the substrate can support the protective film 500, which is beneficial to improving the flatness of the protective film 500 on the second surface of the substrate W, so that the protective film 500 can better fix and maintain the whole substrate, especially can strengthen the fixing and maintaining force on the edge area of the substrate, and avoid the problem of chip loss in the subsequent cutting process.
After the protective film is attached, the method further comprises the following steps:
step S140, a cutting process is performed on the substrate from the first surface of the substrate to realize a slicing process.
As described above, the glue column is formed on the edge area of the base, so that the protective film can be attached to the second surface of the whole substrate under the supporting and adhering effects of the glue column, the problem that a large gap exists between the glue layer attached with the protective film and the base is avoided, and the protective film can have good fixing and maintaining effects on the whole substrate.
In summary, in the carrying apparatus provided by the present invention, the pressing member is provided with a plurality of openings, so that the pressed portion of the substrate can be exposed through the openings while the substrate is pressed by the pressing member to achieve the carrying fixation of the substrate. Therefore, when the carrying device provided by the invention is subsequently used for carrying and fixing the substrate so as to perform a gluing process on the substrate, the gum material can be coated on the part of the substrate which is not pressed by the pressing member, and simultaneously, the gum material can also permeate into the pressed area (such as the edge area of the substrate) of the substrate through the opening, so that the edge area of the substrate can also be coated with the gum material. Namely, most of the area of the second surface of the substrate can be coated with the gum material, so that the subsequent protective film attached to the second surface of the substrate has better flatness, the larger gap generated in the edge area of the substrate is avoided, and the problem of chip loss generated in the subsequent cutting process is further improved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (14)
1. The utility model provides a be applied to rubber coating technology's load-bearing device which characterized in that includes:
a support table for supporting the substrate from a first surface thereof; and the number of the first and second groups,
the pressing piece is used for pressing the substrate on the supporting table from the upper part of the supporting table, and is provided with a pressing part which is used for pressing the substrate from the second surface of the substrate and is also provided with a plurality of openings; when the pressing piece presses the substrate, the pressed part of the substrate is exposed through the opening in the pressing part, and the gum material in the gluing process permeates through the opening to form a glue column on the pressed part of the substrate.
2. The carrier of claim 1 wherein the pressed portion of the pressed article is an annular structure with a plurality of openings distributed therein; when the pressing member presses the substrate, the annular structure of the pressing portion presses the substrate, and a part of the substrate is exposed in an inner ring of the annular structure of the pressing portion.
3. The carrier of claim 2 wherein the annular structure of the press section has an inner ring dimension that is smaller than a dimension of the substrate and an outer ring dimension that is larger than the dimension of the substrate; when the pressing member presses the substrate, the pressing portion of the pressing member presses an area of the second surface of the substrate near an edge, and a portion of the substrate in the edge area is exposed through the opening in the pressing portion.
4. The carrier of claim 3 wherein the difference between the inner ring dimension of the ring-like structure of the press section and the dimension of the substrate is less than or equal to 1.5 mm.
5. The carrying device as claimed in claim 3, wherein the pressing member further comprises an extension portion, the extension portion is located at the periphery of the pressing portion and integrally connected with the boundary of the pressing portion, and the opening is not opened in the extension portion; when the pressing member presses the substrate, the pressing portion presses on an edge region of the substrate, and the extension portion extends from the edge region of the substrate to cover a peripheral region of the substrate.
6. The carrier device as claimed in claim 5, wherein the pressing portion covers an edge region of the support table when the pressing member presses the substrate on the support table from above the support table, and the extension portion extends from the edge region of the support table to cover a peripheral region of the support table to prevent the support table from being exposed.
7. The carrier device according to claim 2, wherein the substrate is a wafer and the pressing portion has a ring-shaped structure.
8. The carrier as claimed in claim 7 wherein the wafer has a chamfer thereon; when the support table supports the wafer, a portion of the support table corresponding to the chamfer of the wafer is exposed from the surface of the wafer, and when the pressing member is pressed on the substrate, the pressing portion of the pressing member presses the portion of the chamfer of the wafer without starting to have a hole.
9. The carrier of claim 1, further comprising:
the stop piece is used for stopping the substrate from the side wall of the substrate, when the bearing device bears the substrate, the stop piece stops at the position of the side wall of the substrate, and the pressing piece presses on the area, close to the edge, of the second surface of the substrate and extends to press on the stop piece.
10. A method of packaging, comprising:
carrying a substrate by using the carrier according to any one of claims 1 to 9, wherein the substrate is placed on the support stage with a first surface thereof facing the support stage in the carrier, a pressing member in the carrier presses the substrate from a second surface of the substrate, and a pressed portion of the substrate is exposed through an opening of the pressing member; and the number of the first and second groups,
and coating a back adhesive material on the second surface of the substrate, wherein the part of the substrate which is not pressed by the pressing member is coated with the back adhesive material to form an adhesive layer, and the back adhesive material permeates into the edge area of the substrate through the opening of the pressing member to form a plurality of adhesive columns.
11. The method of claim 10 wherein the openings in the compact have an opening size equal to or greater than the largest dimension of the adhesive-backed particles in the adhesive-backed material.
12. The packaging method of claim 10, wherein the height of the glue layer and the glue pillars in a direction perpendicular to the substrate surface is less than or equal to the height of the pressing member.
13. The method of claim 10, further comprising, after applying the adhesive-backed material:
and taking the substrate out of the bearing device, and attaching a protective film on the second surface of the substrate, wherein the protective film is attached on the glue layer and the glue column.
14. The packaging method according to claim 13, further comprising, after attaching the protective film:
a dicing process is performed on the substrate from the first surface of the substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810322009.2A CN110364473B (en) | 2018-04-11 | 2018-04-11 | Bearing device and packaging method |
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| CN201810322009.2A CN110364473B (en) | 2018-04-11 | 2018-04-11 | Bearing device and packaging method |
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| CN110364473B true CN110364473B (en) | 2021-09-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862660A (en) * | 2014-02-24 | 2015-08-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying device, and plasma processing device |
| CN105586574A (en) * | 2014-10-20 | 2016-05-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing apparatus and physical vapor deposition equipment |
| US20160240352A1 (en) * | 2015-02-17 | 2016-08-18 | Panasonic Intellectual Property Management Co., Ltd. | Plasma processing apparatus and method for manufacturing electronic component |
| CN106653663A (en) * | 2015-11-03 | 2017-05-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and semiconductor processing equipment |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862660A (en) * | 2014-02-24 | 2015-08-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying device, and plasma processing device |
| CN105586574A (en) * | 2014-10-20 | 2016-05-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing apparatus and physical vapor deposition equipment |
| US20160240352A1 (en) * | 2015-02-17 | 2016-08-18 | Panasonic Intellectual Property Management Co., Ltd. | Plasma processing apparatus and method for manufacturing electronic component |
| CN106653663A (en) * | 2015-11-03 | 2017-05-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and semiconductor processing equipment |
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