JP5750632B2 - Sheet sticking device to substrate - Google Patents

Description

  The present invention relates to a sheet sticking apparatus for sticking a sheet to a substrate. More specifically, the present invention relates to a sheet sticking apparatus for sticking an adhesive sheet such as a dry film resist or a die attach film on a substrate such as a semiconductor wafer.

  Conventionally, a circuit of a semiconductor wafer or the like (hereinafter simply referred to as a wafer) is formed by attaching a dry film resist (hereinafter referred to as DFR) on the wafer, exposing it, and then removing unnecessary portions of the resist or substrate. Has been done.

  In general, the DFR is attached to the wafer by holding the wafer on a heating table having a built-in heater so that the adhesive surface of the DFR formed in a wide roll shape on the wafer faces the wafer. Then, the DFR is pressed against the wafer with a sticking roller.

  Recently, even when a wafer having a three-dimensional structure in MEMS (Micro Electro Mechanical Systems) is formed, the above-described DFR (equivalent to a photoresist film) is repeatedly applied and laminated to form a three-dimensional structure. (For example, Patent Document 1). In this case, unlike the formation of the circuit described above, unnecessary resist is removed and the remaining resist is left as a permanent film.

  FIG. 12 shows a conventional method of attaching DFR to a three-dimensional structure. As shown in FIG. 12, the DFR 87 normally has a base material sheet 88 on one side of the DFR 87 and a separator 86 on the other side. Is supplied as a three-layer original sheet 91 provided with The DFR 87 is attached to the wafer 80 by separating the separator 86 provided on the adhesion surface side from the original sheet 91 supplied from a supply reel (not shown) by the separation roller 89, and the adhesion surface of the DFR 87 is the three-dimensional surface of the wafer 80. It is supplied so as to face the structure 81. The adhesive surface of the DFR 87 is softened by heating and exhibits adhesiveness.

  In the lamination of the three-dimensional structure 81, the wafer 80 on which the three-dimensional structure 81 has already been formed is sucked and held on the inner peripheral table 82 so that the surface on which the three-dimensional structure 81 is formed is up. While heating 80 with a heater 83 built in the inner peripheral table 82, a wide roll DFR 87 is fed onto the wafer 80, and a sticking roller 85 heated with a heater (not shown) is moved from a two-dot chain line position to a solid line position. This is done by pressing and rolling. At this time, the surface of the outer peripheral table 84 is in contact with the adhesive surface of the DFR 87. In the wafer 80 on which the DFR 87 has been pasted, a surplus portion of the sheet is cut by a cutter along the outer shape of the wafer 80.

  In forming a semiconductor, a die attach film (hereinafter referred to as DAF) is attached to the back surface of the wafer, the wafer is mounted on a dicing tape, and then diced to form a chip, and the chip is attached to the die with the DAF. Things have been done.

  In the DAF attachment, the surface of the wafer attached to the DFR is opposite to that of the DFR, but the attachment method is performed in the same manner as the DFR (for example, Patent Document 2).

JP 2008-4708 A Japanese Patent No. 3956084

  By the way, when a circuit is formed on a wafer, since the DFR is attached to a wafer having a flat surface, the surface of the wafer can be obtained by heating only the wafer holding portion of the attaching table. Heat was transmitted evenly throughout, and it was possible to evenly attach the DFR to the wafer.

  However, when the DFR 87 is attached to the wafer 80 having the three-dimensional structure 81 as shown in FIG. 12, the top of the three-dimensional structure 81 is only heated by heating the wafer holding portion (inner peripheral table 82) of the attaching table. There is a problem that heating of the pasted portion becomes insufficient because heat is not easily transmitted uniformly. This is the same in Patent Document 1, and in the case of Patent Document 1 as well, there is a problem that heat is not easily transmitted to the top of the three-dimensional structure by heating only the pasting table (corresponding to a table).

  Therefore, heating the sticking roller 85 as shown in FIG. 12 is also performed. However, since the DFR 87 exhibits adhesiveness by heating as described above and the surface becomes sticky, the DFR 87 in contact with the upper surface of the outer peripheral table 84 adheres to the outer peripheral table 84, and the excess portion of the subsequent DFR 87 There is a problem that peeling becomes difficult or the outer peripheral table 84 is contaminated and the operation is interrupted. When the application roller is heated in Patent Document 1, there is a problem that DFR adheres to a bumper member (corresponding to the outer peripheral table) provided on the outer periphery of the table. This has a problem that occurs even when the outer periphery of the table is subjected to non-adhesive treatment with a fluororesin or the like.

  Further, even when DAF is attached as in Patent Document 2, since DAF has adhesiveness by heating, there is a problem that it adheres to the outer peripheral portion of the wafer of the attaching table as in DFR.

  Thus, when an adhesive sheet such as DFR or DAF adheres to the outer peripheral portion of the sticking table, it becomes difficult to peel off the surplus portion of the adhesive sheet from the sticking table, which causes a problem of sheet feeding failure.

  In addition to adhesives that show adhesiveness when heated, adhesive sheets (protective tape, etc.) and pressure-sensitive adhesive sheets that have adhesiveness at room temperature can be attached to the application table surface only by pressing force without heating the application roller. Since it adheres, there exists a problem from which the peeling of the excess part of an adhesive sheet becomes difficult.

  In addition, when the adhesive sheet such as DFR or DAF is attached, the adhesive sheet is stretched while being heated while the adhesive table or the application roller is heated. Sticks to the outer periphery of the sticking table, and there is a problem that wrinkles occur in the sticking end portion because the stretched adhesive sheet has no place to go.

  Therefore, the purpose of the present invention is to attach various types of adhesive sheets to a substrate such as a wafer, and attach an unnecessary part of the adhesive sheet to the application table, or an adhesive or the like adheres to the application table and is contaminated. It is to prevent wrinkles from being generated on the adhesive sheet attached to the substrate and to improve the attaching efficiency.

In view of this, the invention of claim 1 is characterized in that a base sheet is provided on one surface of an adhesive sheet and a raw sheet supply means for feeding out an original sheet provided with a separator on the other surface of the adhesive sheet onto the substrate; A sticking table having an inner peripheral table that holds the inner peripheral table and an outer peripheral table provided outside the inner peripheral table so as to surround the inner peripheral table, and pressing the original sheet against the substrate to attach the adhesive sheet to the substrate. In a sheet affixing device comprising affixing means for attaching, and a cutting means for cutting the original sheet affixed to the substrate along the outer shape of the substrate,
The original sheet supply means is arranged in the course of feeding the original sheet onto the substrate, and a blade that forms a substrate-shaped closed loop cut in the separator, and a separator portion cut by the blade is peeled from the original sheet, Peeling means for exposing the adhesive surface of the inner part of the closed-loop cut,
The inner peripheral table has a heating means for heating the substrate,
When the original sheet is supplied onto the substrate by the original sheet supply means, the sticking means makes the adhesive surface face the substrate, and the separator surface outside the adhesive surface faces the outer peripheral table surface. Having a sticking roller for pressing and pressing the adhesive sheet on the substrate;
The sheet sticking device adopts a configuration in which when the adhesive sheet is pressed onto the substrate by the sticking roller, the separator surface outside the adhesive surface covers the portion other than the portion to be pasted.

  According to a second aspect of the present invention, the original sheet supply means further comprises sheet piece forming means for cutting the original sheet into a strip shape at an outer portion of the cut after forming a cut in the separator with the cutter, and on the substrate. The sheet sticking apparatus according to claim 1, wherein the original sheet is supplied as a sheet piece.

According to a third aspect of the present invention, the peeling means includes a holding means for holding the original sheet so that the separator surface faces down, a peeling tape supply means, and a peeling start end portion of the cut separator from below. It comprises a sticking means for attaching the release tape, and a winding means for winding the peeled separator together with the release tape,
After pasting the separator cut the peeling tape by the sticking means, the Rukoto pulling the separator, a separator was peeled by causing peeling to wrap in a direction pulling the separator, downward by its own weight a sheet sticking apparatus according to claim 1 or 2, wherein the exfoliated Ru configuration adopted as hanging.

  According to the present invention, since the surplus portion other than the portion where the adhesive sheet is attached to the substrate is covered with a non-adhesive sheet such as a separator, the adhesive sheet is adhered to the outer periphery of the adhesive table other than the substrate holding portion of the adhesive table. The excess adhesive sheet can be easily peeled off from the affixing table. That is, only the separator is peeled off to the shape of the substrate, and the other part of the separator acts as a protective film. Further, since the sticking table is not contaminated with the adhesive sheet, the apparatus does not stop for cleaning the sticking table, and the working efficiency is improved.

  In addition, even if the adhesive sheet is stretched due to heating during heat pasting, the adhesive sheet will not stick to the outer periphery of the sticking table, and the extended adhesive sheet will not run out, so it can There is no occurrence of my self.

  In addition, since the adhesive surface of the adhesive sheet is protected by the separator until just before sticking, foreign matter does not adhere to the adhesive surface and adhesion failure does not occur.

  Furthermore, even in the case of a strongly adhesive adhesive sheet, the adhesive surface is protected by the separator until immediately before being attached, so that the adhesive surface does not come into contact with a guide roller, a chuck or the like in the path of the adhesive sheet. Accordingly, the sheet can be fed smoothly, and no running failure occurs even if the adhesive surface is in contact with other parts during sheet feeding.

  In addition, even if the adhesive sheet is affixed onto a three-dimensional structure where heat is not easily transmitted to the wafer surface, the adhesive sheet can be affixed using a heating roller, and a highly reliable three-dimensional structure. The body can be formed.

These are top views of the sheet sticking apparatus which concerns on the 1st Embodiment of this invention. These are the arrow front views of the sheet sticking apparatus seen from the II direction of FIG. (A) thru | or (d) are explanatory drawings of the cut | notch formation operation | movement of the sheet | seat which concerns on the 1st Embodiment of this invention. (A) thru | or (c) are explanatory drawings of the separator peeling operation | movement of the sheet | seat which concerns on the 1st Embodiment of this invention. (A) And (b) is explanatory drawing of the sticking operation | movement of the adhesive sheet which concerns on the 1st Embodiment of this invention. (C) And (d) is explanatory drawing of the sticking operation | movement of the adhesive sheet which concerns on the 1st Embodiment of this invention. These are the front views of the sheet sticking apparatus which concerns on the 2nd Embodiment of this invention. (A) And (b) is explanatory drawing of the sticking operation | movement of the adhesive sheet which concerns on the 2nd Embodiment of this invention. These are explanatory drawings of the peeling state of a separator. These are the schematic explanatory perspective views of the peeling state of a separator. These are explanatory drawings explaining the pasting operation of the present invention. These are explanatory drawings explaining the conventional pasting operation.

  A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a partially cutaway plan view of a sheet sticking apparatus according to the present invention, and FIG. 2 is a front view as seen from the direction of the arrows II in FIG.

  As shown in FIG. 1, the sheet sticking apparatus 1 is divided into two parts: a wafer supply unit for supplying the upper half wafer 3 in the figure on the machine base 2 and an adhesive sheet sticking part for sticking the lower half adhesive sheet S in the figure. Yes. The wafer supply unit is provided with a wafer storage unit 4, a transfer robot 5, and an alignment unit 7.

  Further, as shown in FIGS. 1 and 2, the adhesive sheet attaching portion is provided between the machine frames 9A and 9B erected on the machine base 2, and the supply reel 10 for supplying the original sheet A is bonded. A notch forming means 15 for forming the separator D by forming a notch in the separator B provided on the adhesive surface side of the sheet S, a sheet piece forming means 20 for cutting the original sheet A into strips to form a sheet piece, A sheet conveying means 30 for conveying the sheet A to the sheet affixing part 50, a peeling means 40 for peeling the separator D cut into the substrate shape by the notch forming means 15, and a sheet affixing part 50 for adhering the adhesive sheet S to the wafer 3. A cutter mechanism 65 as a cutting means for cutting the adhered adhesive sheet S along the outer shape of the wafer 3, and a sheet discard mechanism 70 for peeling off and discarding the surplus sheet 73. It is.

  As the original sheet A, in this embodiment, a case where DFR is used will be described as an example. The structure of the original sheet A will be described with reference to FIG. 2. As shown in the partially enlarged view in the upper left part of FIG. Is composed of an adhesive sheet S corresponding to a DFR, a separator B provided on the adhesive surface side of the adhesive sheet S, and a base sheet C provided on the surface opposite to the adhesive surface.

  In the wafer storage unit 4, a cassette storing a plurality of wafers 3 is placed, and the cassette moves up and down by an appropriate lifting mechanism.

  The transfer robot 5 is formed into a multi-joint so as to be rotatable, and a suction hand 6 is provided at the tip thereof, and the wafers 3 are sequentially taken out from the wafer storage unit 4 one by one by the suction hand 6. It has become. The suction hand 6 is configured to supply the wafer 3 to the sheet pasting unit 50 through an opening (not shown) provided in the wafer storage unit 4, the alignment unit 7, and the machine frame 9 </ b> A by the transfer robot 5.

  The alignment unit 7 is provided with an alignment table 8 that sucks and holds the wafer 3 on its upper surface and rotates it, and performs positioning by detecting notches and orientation flats of the wafer 3 with an appropriate sensor (not shown).

  The supply reel 10 supports a wide roll-shaped original sheet A, and is supported by a rotating shaft that is rotated by an appropriate motor (not shown) so that the adhesive surface of the adhesive sheet S to the wafer 3 is upward. The supplied original sheet A is supplied to the notch forming means 15 through a guide roller 11, a vertically movable dancer roller 12 that adjusts the tension, and a nip roller 13 that sandwiches and feeds the original sheet A. The leading end of the original sheet A is sandwiched between the upper chuck 22 and the lower chuck 24.

  The notch forming means 15 is provided with a die cut roll 17 provided with a closed loop-shaped blade 16 having a wafer shape in a planar state on the surface thereof, and the original sheet A is attached to a die cut roller on the lower surface side of the original sheet A. A support roller 18 is provided to be sandwiched between the two. The original sheet A is sandwiched between the die cut roller 17 and the support roller 18, so that a wafer-shaped cut 47 is formed in the separator B on the upper surface side.

  The die cut roller 17 and the support roller 18 are kept at an appropriate distance, and the depth of the cut 47 by the die cut roller 17 is adjusted by the height of the blade 16 provided. . Further, the blade 16 of the die cut roller 17 is formed on a magnet-type thin metal plate, and a magnet is formed on the surface thereof in accordance with the reference position of the die cut roller 17 so that it can be easily replaced according to the shape and size of the wafer 3. It comes to fix with. In addition, since the original sheet A and the die cut roller 17 are not in contact with each other at the portion where the blade 16 is not formed, the original sheet A passes between the die cut roller 17 and the support roller 18 and passes through the original sheet. A notch 47 is not formed in A. Therefore, the formation interval of the notches 47 can be adjusted by adjusting the feed amount.

  The sheet piece forming means 20 has an upper chuck 22 that holds the original sheet A by suction on the lower surface thereof and holds the original sheet A with the lower chuck 24, and a cutter blade 23 that cuts the original sheet A in the width direction. And a lower chuck 24 provided to face the upper chuck 22 through the original sheet A. The upper chuck 22 is provided with sliders 26 on both sides in the width direction, and is moved by an appropriate mechanism (not shown) along rails 25A and 25B provided on the machine casings 9A and 9B. Further, the upper chuck 22 is configured to be movable up and down by the cylinder 21, and a suction hole is provided on the lower surface of the upper chuck 22 so that the original sheet A is sucked and held by an appropriate suction means.

  The cutter blade 23 is provided in front of the upper chuck 22, and the cutter blade 23 is moved in the width direction along the cutter groove provided in the lower chuck 24 by an appropriate mechanism (not shown) and vertically. The upper sheet 22 and the upper sheet 22 can be moved in the feeding direction. Further, the lower chuck 24 has a cutter groove for receiving the cutter blade 23 formed in front of the lower chuck 24 along the width direction of the original sheet A, and an appropriate mechanism (not shown) in the feeding direction of the original sheet A independent of the upper chuck 22. Is provided so as to be movable. With the above configuration, the sheet piece forming means 20 pulls out the original sheet A, cuts it to an appropriate length, and cuts out the strip-shaped original sheet A as a sheet piece.

  The sheet conveying means 30 is disposed below the sheet piece forming means 20, and includes a suction table 31 as a holding means for sucking and holding the original sheet A from the base sheet C side on the lower surface thereof, and the suction table 31. A cylinder 32 that moves up and down and a motor 33 that rotates the suction table 31 up and down are provided.

  The suction table 31 is provided with a plurality of suction holes 34 on the surface, and sucks the original sheet A drawn on the surface from below. The suction table 31 is supported on a table support plate 35 provided in parallel below the suction table 31 by a cylinder 32 and a guide so as to be movable up and down. In addition, one end of a rotary shaft 37 supported by the machine frame 9A is fixed to a support plate 36 provided perpendicular to the table support plate 35. By rotating the rotary shaft 37 by the motor 33 connected via the machine casing 9 </ b> A, the suction table 31 rotates so as to be turned upside down around the rotary shaft 37.

  The peeling means 40 is disposed below the suction table 31, and includes a supply reel 41 that supplies the peeling tape R, a plurality of guide rollers 42 and 43 that guide the peeling tape R, a sticking roller 44, and a collection reel 45. It consists of.

  An adhesive release tape R is supplied from the supply reel 41, and the release tape R is guided through the guide rollers 42 and 43, guided to the application roller 44, and then collected through the plurality of guide rollers 42. The reel 45 is wound up.

  The peeling means 40 is configured to be capable of horizontal movement integrally by an appropriate driving source (not shown). Further, the sticking roller 44 can swing up and down with the guide roller 43 as a base point, and is peeled off from the original sheet A on which the separator D conveyed by the rotation of the suction table 31 is formed above the sticking roller 44. The tape R is pressed and pasted.

  Further, a sheet presser 46 is provided on the right side of the peeling means 40, and when the separator D cut into the original sheet A is peeled off, the suction table 31 is prevented so that the separator B in the outer peripheral portion is not peeled off. The separator B can be pressed by pressing toward the side. The sheet presser 46 is formed in a plate shape along the width direction of the original sheet A, and the lower surface of the tip is provided with an inclined surface, and the peeling tape R is applied to the peeling start end of the separator D by the sticking roller 44. It is designed not to be an obstacle when attaching. Further, sliders 48 are provided at both ends of the sheet presser 46, and these sliders 48 are slidably fitted to rails 49 provided along the machine casings 9A and 9B, so that an appropriate driving source is provided. It is designed to move horizontally. Further, the sheet presser 46 is moved up and down by an appropriate mechanism (not shown). In addition, the shape of the sheet presser 46 may be appropriately provided in accordance with the shape of the wafer, or a release treatment may be performed so that the peeling tape R does not adhere.

  The original sheet supply means for supplying the original sheet A to the wafer 3 includes a supply reel 10 for supplying the original sheet A and a notch for forming a substrate-shaped cut 47 in the separator B in the course of supplying the original sheet A. Forming means 15, sheet piece forming means 20 that cuts the original sheet A into strips to create a sheet piece, sheet conveying means 30 that supplies the sheet piece to the sheet sticking unit 50, an area formed inside the cut 47 It is comprised by the peeling means 40 which peels the separator D inside.

  The sheet affixing unit 50 is provided with an upper chamber 51 provided with an elevating cylinder 53 and capable of moving up and down, and a lower chamber 52 capable of horizontal movement along a rail 53 laid on the machine base 2. The chamber 51 and the lower chamber 52 are combined to form a vacuum chamber.

  The upper chamber 51 is provided with a vacuum adapter 55 connected to an appropriate vacuum source in the upper part, and can form a vacuum chamber together with the lower chamber 52 to keep the inside of the chamber in a reduced pressure state. . Note that the inside of the vacuum chamber can be replaced with an inert gas such as nitrogen or argon depending on the state of attachment. In the upper chamber 51, a sticking roller 56 is provided as a sticking means capable of moving up and down and horizontally by an appropriate mechanism (not shown). In the present embodiment, the sticking roller 56 includes an appropriate heater (not shown) and can be heated, and the adhesive sheet S is pressed and stuck to the wafer 3 in a vacuum chamber.

  The lower chamber 52 is provided with a slider 54 on the lower surface thereof, and the slider 54 is slidably fitted to the rail 53 so that the original sheet A can be moved at the vacuum chamber forming position and below the sheet conveying means 30. The sheet is moved horizontally by an appropriate driving source (not shown) between the receiving position and the receiving position. Further, the lower chamber 52 is provided with an inner peripheral table 57 at the center thereof for attracting and holding the wafer 3 on its upper surface.

  The inner peripheral table 57 is configured to suck and hold the wafer 3 with a vacuum source different from the suction source or the vacuum chamber different from the vacuum source of the vacuum chamber. A sheet-like heater 60 (see FIG. 11) is provided inside the inner peripheral table 57 so as to heat the wafer 3. The inner peripheral table 57 can be moved up and down by a cylinder 59 so that the upper surface of the wafer 3 can be aligned with the upper surface of the outer peripheral table 58.

  Around the inner peripheral table 57, a rectangular outer peripheral table 58 in which a central portion is cut out in a donut shape is provided. A sheet piece is formed before and after the outer peripheral table 58 in the attaching direction. Further, sheet holding mechanisms 61 and 62 for holding the original sheet A are provided. Each of these sheet holding mechanisms 61 and 62 is provided with a clamping mechanism (not shown) that holds the original sheet A while holding it on the upper surface thereof, and at least one of them is along the direction in which the original sheet A is attached. A mechanism for adjusting the tension is provided. Further, the sheet holding mechanisms 61 and 62 can be moved up and down by cylinders 63 and 64, respectively, and the original sheet A can be held in an inclined state by lowering one of the sheet holding mechanisms 61 and 62. It is possible.

  The cutter mechanism 65 is disposed between the sheet conveying means 30 and the upper chamber 51, and cuts an excess portion of the adhesive sheet S attached to the wafer 3 along the outer periphery of the wafer 3 in the vacuum chamber. In this way, it is moved up and down between the upper standby position and the lower cutting position by an appropriate drive source (not shown). Further, the cutter blade 67 is rotated at the cutting position by the motor 66.

  The sheet discarding mechanism 70 is disposed between the cutter mechanism 65 and the upper chamber 51, and adsorbs an excess sheet 73 of the original sheet A cut by the cutter mechanism 65 with an adsorbent 71, and in this state, By moving the chamber 52 horizontally, the excess sheet A on the outer peripheral table 58 is peeled off and discarded in a disposal box 72 provided on the lower machine base 2. The sheet discarding mechanism 70 is moved up and down by an appropriate driving source (not shown) between the upper standby position and the suction position of the surplus sheet 73.

  The above is the configuration of the sheet sticking apparatus according to the first embodiment of the present invention. Next, the sticking operation of the adhesive sheet S will be described based on FIGS. 3 to 6. In addition, the thickness of the original sheet A and the thickness of the wafer are exaggerated for easy understanding.

  3A to 3D are operation diagrams of the notch forming means 15 provided in the original sheet supply means of the sheet sticking apparatus 1, and the upper chuck of the sheet piece forming means 20 as shown in FIG. The sheet piece forming means 20 is advanced while holding the vicinity of the leading end of the original sheet A between the lower chuck 24 and the lower chuck 24, and the original sheet A is pulled out onto the suction table 31. At this time, a wafer-shaped cut 47 is formed in the separator B on the upper surface of the original sheet A by pulling out the original sheet A while sandwiching the die cut roller 17 and the support roller 18 of the cut forming means 15. Note that the cuts 47 need only be such that the separator B is completely cut, and there is no problem even if the adhesive sheet S is completely cut within a range in which the base sheet C is not cut completely.

  Next, as shown in FIG. 3B, the lower chuck 24 moves backward to the initial position while the original sheet A is sucked and held on the lower surface of the upper chuck 22.

  As shown in FIG. 3C, the suction table 31 is raised by the action of the cylinder 32 to suck and hold the original sheet A, and then the suction of the upper chuck 22 is released and the upper chuck 22 is retracted to the initial position ( At this time, the upper chuck 22 may be moved back in the raised state by the cylinder 21). Subsequently, the cutter 23 is lowered and driven in the width direction of the original sheet A, and the original sheet A is cut into strips to form sheet pieces.

  As shown in FIG. 3D, the cutter 23 is moved away, and the motor 33 (see FIG. 1) is driven to rotate the suction table 31 from the two-dot chain line position to the solid line position around the rotation shaft 37. As a result, the original sheet A cut into a strip shape into a sheet piece is in a state of being sucked and held by the suction table 31 with the separator B having the cuts 47 formed as the lower surface.

  Next, the peeling operation of the separator D (within the wafer-shaped closed loop) will be described with reference to FIGS.

  As shown in FIG. 4A, the peeling means 40 is positioned below the peeling start end portion while holding the outer periphery of the separation start side of the separator D on the lower surface of the original sheet A held by the suction table 31 by the sheet presser 46. . Subsequently, the peeling roller R is swung around the guide roller 43 as a base point, and the peeling tape R is stuck near the peeling start end of the separator D. Thereafter, the application roller 44 is pressed and rolled while supplying the release tape R toward the peeling start end at the position of the two-dot chain line in FIG. 4B, and the release tape R is attached to the release start end.

  As shown in FIG. 4B, the peeling roller 40 is swung downward to cause the separator D, and the peeling means 40 is moved backward with the supply of the peeling tape R of the peeling means 40 stopped (at the suction table 31 side). May be moved). Thus, the separator D is peeled off so as to be folded back. FIG. 10 shows an outline of the peeled state, and the separator D in the region where the notch 47 is formed as shown in FIG. 10 is peeled by the separator D being pulled by the peeling tape R (not shown), The adhesive surface of the adhesive sheet S is exposed. When the adhesive sheet S is attached along the outer shape of the wafer 3, the exposed surface is formed larger than the outer shape of the wafer 3.

  As shown in FIG. 4C, when the peeling means 40 continues to move backward, the separator D is peeled off and hangs down so as to be folded downward under its own weight as shown. Thereafter, the sheet presser 46 is retracted to return to the initial state, and the peeling tape R is sequentially wound around the collection reel 45 as shown in FIG. A cover or the like may be provided so that the separator D is not caught in the guide roller 42 or the like.

  By peeling from the lower side in this way, an unnecessary sheet to be peeled can be peeled by bonding only the peeling start end portion, and the usage amount of the peeling tape R can be greatly reduced. This is because the unnecessary peeled sheet is folded back in the direction away from the adhesive surface of the peeling tape by its own weight, so that it can be peeled off by bonding only the peeling start edge of the unnecessary sheet to the peeling tape. When peeling from the sheet, the peeled unnecessary sheet hangs down on the peeled surface, so the peeled unnecessary sheet must be rolled up while adhering to the entire surface of the peeling tape so as not to be dragged to the peeled surface. Depending on.)

  Next, an operation of attaching the adhesive sheet S portion of the original sheet A to the wafer 3 will be described with reference to FIGS.

  As shown in FIG. 5A, the lower chamber 52 moves to the sheet receiving position at the two-dot chain line position, and the separator D peeled original sheet A sucked by the suction table 31 is transferred to the sheet holding mechanisms 61 and 62. It is done. The original sheet A is held by clamps on the sheet holding mechanisms 61 and 62 (note that an appropriate suction mechanism or the like may be used instead of the clamps). The held original sheet A is held in an inclined state by the lowering of the sheet holding mechanism 61. The lower chamber 52 that has received the original sheet A moves to a vacuum chamber forming position (solid line position) below the upper chamber 51, the upper chamber 51 is lowered by the action of the cylinder 53, and is combined with the lower chamber 52. It is formed.

  Next, as shown in FIG. 5B, the vacuum chamber 55 is depressurized through the vacuum adapter 55, and when the predetermined depressurized state is reached, the sticking roller 56 acts and the original sheet A is removed from the sheet holding mechanisms 61 and 62. The exposed adhesive sheet S is attached to the wafer 3 while being swung by vertical movement. At this time, the inner peripheral table 57 and the sticking roller 56 are allowed to act in a heated state, but the upper surface of the outer peripheral table 58 and the adhesive sheet S are in contact with each other via the separator B. The adhesive sheet S does not adhere. When pasting along the outer periphery of the wafer 3 as in the present embodiment, the exposed surface of the adhesive sheet S is formed larger than the wafer 3 (that is, the separator D is formed larger than the wafer 3). Keep it).

  When the adhesive sheet S is to be attached only to the inner periphery of the wafer 3 (when it is desired to attach the adhesive sheet S to a diameter smaller than the outer diameter of the wafer), the notch forming means 15 makes it smaller than the outer diameter of the wafer 3. After the notch 47 is formed and the separator D is peeled off, the adhesive sheet S is attached to the wafer.

  As shown in FIG. 6C, the upper chamber 51 is opened with the decompression of the vacuum chamber opened and restored to atmospheric pressure, and the lower chamber 52 is moved to be positioned below the cutter mechanism 65. Subsequently, the cutter mechanism 65 is lowered, and the excess portion of the original sheet A is pierced by the cutter blade 67 along the outer shape of the wafer 3. At this time, the cutter blade 67 acts on a gap portion between the inner peripheral table 57 and the outer peripheral table 58.

  Subsequently, as shown in FIG. 6D, the cutter mechanism 65 retreats upward and the adsorbent 71 descends to adsorb and hold the excess sheet 73 near the outer peripheral table 58, and clamp the sheet holding mechanisms 61 and 62. It cancels and the adsorbent 71 rises. In this state, the lower sheet 52 moves downward in the upper chamber 51, so that the surplus sheet 73 is held by the adsorbent 71, and then the adsorption of the adsorbent 71 is released to allow the surplus sheet 73 to enter the disposal box 72. Discarded. The wafer 3 with the adhesive sheet S attached is in a state where the base sheet C is attached to the surface, but the base sheet C may be peeled off in the next step or the like.

  Even when the notch 47 is formed smaller than the outer diameter of the wafer 3 and the adhesive sheet S is attached only to the inner peripheral portion of the wafer 3, the original sheet is formed along the outer shape of the wafer 3 by the cutter mechanism 65 as described above. By cutting A, discarding the surplus sheet 73, and removing the doughnut-shaped surplus portion remaining on the wafer 3, the adhesive sheet S that fits inside the wafer 3 can be formed.

  FIG. 11 shows a state in which the adhesive sheet S is attached to the wafer 3 on which the three-dimensional structure 74 is formed. Note that the thickness of the original sheet A and the three-dimensional structure 74 are exaggerated for easy understanding.

  As shown in FIG. 11, the portion where the original sheet A is in contact with the outer peripheral table 58 is covered with the separator B, and only the adhesive sheet S of the pasting portion is exposed. Even if the adhesive sheet S such as DFR is used, the adhesive sheet S does not stick to the outer peripheral table 58 or the like.

  Next, a second embodiment will be described with reference to FIG. In addition, about the components similar to 1st Embodiment, the same code | symbol is used and the part from which a structure and operation | movement differs is demonstrated.

  In the second embodiment, the original sheet A is supplied upside down, the suction table 31 of the sheet conveying means 30 is provided above the original sheet A, and the original sheet A is not conveyed. Is different from the first embodiment in that the sheet is supplied in a roll shape without being cut into strips, and that the pasting is performed in the atmosphere.

  The original sheet A is supplied from the supply reel 10 so that the adhesive surface of the adhesive sheet S faces downward, and the notch forming means 15 forms a notch 47 in the separator B from below the original sheet A. The original sheet A is chucked by the chucking / peeling roller 75 and supplied onto the sticking table 76, and the sticking roller 56 presses the adhesive sheet S against the wafer 3 to stick the adhesive sheet S to the wafer 3. The excess original sheet A of the adhesive sheet S after being attached is wound around the collection reel 77.

  The suction table 31 is provided on the right side of the notch forming means 15 so as to suck and hold the surface on the base sheet C side of the original sheet A from above, and can be moved up and down by a cylinder 32. Further, the suction table 31 sucks the original sheet A, and supports the original sheet A from the base sheet C side when the peeling means 40 acts.

  Since the peeling means 40 is the same except that the moving direction is opposite to that of the first embodiment, the description thereof is omitted.

  In the present embodiment, the original sheet supply unit includes the supply reel 10, the cut forming unit 15, and the peeling unit 40.

  The sticking table 76 is provided on a support stand 78 erected on the machine base 2 via a cylinder 59 and a guide, and moves up and down in the whole sticking table 76. Note that the inner peripheral table 57 may be configured to be movable up and down with respect to the outer peripheral table 58 as appropriate. In addition, the inner peripheral table 57 is provided with a heater 60, and the wafer 3 is sucked and held on the upper surface thereof, so that the attaching surface of the wafer 3 coincides with the upper surface of the outer peripheral table 58.

  The sticking roller 56 has a built-in heater and can be moved up and down by a cylinder or the like. In addition, the adhesive sheet S is pressed and rolled onto the wafer 3 held by suction on the sticking table 76.

  The above is the configuration of the sheet sticking device 69 of the second embodiment. Next, the sticking operation of the adhesive sheet S will be described with reference to FIGS.

  First, the suction of the suction table 31 is released, and the original sheet A is sandwiched and pulled out by the chuck and peeling roller 75, so that the notch forming means 15 forms a wafer-shaped cut 47 in the separator B on the lower surface side of the original sheet A. Is done. The original sheet A is sucked and supported by the suction table 31 from the upper surface side of the original sheet A in which the cuts 47 are formed, and in this state, the peeling means 40 is acted from below, so that the inside of the cuts 47 is the same as in the first embodiment. The separator D formed in the above is peeled off.

  FIG. 8A shows a state where the separator D has been peeled off. Next, the original sheet A from which the separator D has been peeled off as shown in FIG. The exposed surface (adhesive surface) of the adhesive sheet S is pulled out so as to face the wafer 3 held on the inner peripheral table 57. Thereafter, the adhesive table 76 is raised and the adhesive roller 56 is lowered to remove the exposed portion of the adhesive sheet S. Affix to the wafer 3 by pressing.

  Thereafter, the cutter mechanism 65 is operated to cut the original sheet A along the outer periphery of the wafer 3, and the original sheet A in the excess portion on the outer periphery is wound around the recovery reel 77. The wafer 3 with the adhesive sheet S attached is in a state where the base sheet C is attached to the surface, but the base sheet C may be peeled off in the next step or the like.

  Although the above is embodiment of this invention, it is not limited to the above, For example, it can replace with DFR and can use various adhesive sheets which exhibit adhesiveness by heating, such as DAF, as adhesive sheet S. Also, a strong adhesive protective film or the like can be used at room temperature, and in this case, the film can be attached without using a heater of a table or a sticking roller. Moreover, even if it is DAF etc. of 2 layer structure without the base material sheet C, it can be used.

  In the present invention, a die-cut roller is used as the notch forming means, but various means can be applied as long as the means can form a notch in the sheet. For example, the cutter mechanism 65 used in the present invention may be used. Various means can be applied to the means for peeling the separator D and the cutter mechanism for cutting the sheet to the outer shape of the wafer. The shape is not only circular, but also has orientation flats, notches, rectangles, triangles, hexagons, octagons, etc. Applicable to various shapes.

A Original sheet B Separator C Substrate sheet D Separator R Release tape S Adhesive sheet 1 Sheet sticking device 2 Machine stand 3 Wafer 4 Wafer supply part 5 Transfer robot 6 Suction hand 7 Alignment part 8 Alignment table 9 Machine frame 10 Supply reel 11 Guide Roller 12 Dancer roller 13 Nip roller 15 Incision forming means 16 Cutting tool 17 Die cut roller 18 Support roller 20 Sheet piece forming means 21 Cylinder 22 Upper chuck 23 Cutter blade 24 Lower chuck 25A Rail 25B Rail 26 Slider 30 Sheet conveying means 31 Adsorption table 32 Cylinder 33 Motor 35 Table support plate 36 Support plate 37 Rotating shaft 40 Peeling means 41 Supply reel 42 Guide roller 43 Guide roller 44 Adhesive roller 45 Collection reel 46 Sheet presser 47 Notch 48 Slider 49 Rail 50 Sheet pasting portion 51 Upper chamber 52 Lower chamber 53 Lifting cylinder 54 Slider 55 Vacuum adapter 56 Sticking roller 57 Inner peripheral table 58 Outer peripheral table 60 Heater 61 Sheet holding mechanism 62 Sheet holding mechanism 63 Cylinder 64 Cylinder 65 Cutter mechanism 66 Motor 67 Cutter blade 69 Sheet sticking device 70 Sheet discarding mechanism 71 Adsorbent 72 Discarding box 73 Surplus sheet 74 Three-dimensional structure 75 Chuck and peeling roller 76 Sticking table 77 Recovery reel 78 Support base 80 Wafer 81 Three-dimensional structure 82 Inner peripheral table 83 Heater 84 Peripheral table 85 Sticking roller 86 Separator 87 DFR (Dry film resist)
88 Separator 89 Peeling roller 90 Guide roller 91 Original sheet

Claims (3)

A base sheet provided on one side of the adhesive sheet and a raw sheet supply means for feeding the original sheet provided with a separator on the other side of the adhesive sheet onto the substrate; and an inner periphery for holding the substrate on the top surface A sticking table comprising a table and an outer peripheral table provided on the outer side so as to surround the inner peripheral table; a sticking means for pressing the original sheet against the substrate and sticking the adhesive sheet to the substrate; and In a sheet sticking device comprising cutting means for cutting the attached original sheet along the outer shape of the substrate,
The original sheet supply means is arranged in the course of feeding the original sheet onto the substrate, and a blade that forms a substrate-shaped closed loop cut in the separator, and a separator portion cut by the blade is peeled from the original sheet , e Bei a release means to expose the adhesive surface of the inner part of the closed loop-shaped incision,
The inner peripheral table has a heating means for heating the substrate,
When the original sheet is supplied onto the substrate by the original sheet supply means, the sticking means makes the adhesive surface face the substrate, and the separator surface outside the adhesive surface faces the outer peripheral table surface. Having a sticking roller for pressing and pressing the adhesive sheet on the substrate;
The sheet sticking apparatus , wherein when the adhesive sheet is pressed onto the substrate by the sticking roller, a separator surface outside the adhesive surface covers a portion other than a portion to be pasted.
The original sheet supply means further comprises sheet piece forming means for cutting the original sheet into strips at the outer portion of the cut after forming a cut in the separator with the blade,
2. The sheet sticking apparatus according to claim 1, wherein the original sheet is supplied as a sheet piece on a substrate. The peeling means includes a holding means for holding the original sheet so that the separator surface faces downward, a peeling tape supply means, and an adhesive for attaching the peeling tape to the peeling start end of the cut separator from below. Means and winding means for winding the peeled separator together with the peeling tape,
After pasting the separator cut the peeling tape by the sticking means, the Rukoto pulling the separator, a separator was peeled by causing peeling to wrap in a direction pulling the separator, downward by its own weight The sheet sticking device according to claim 1 or 2, wherein the sheet sticking device is peeled off so as to hang down.

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