TWI614826B - Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus - Google Patents

Abstract

A raw material tape having a long adhesive tape bonded to a long carrier tape is discharged from the raw material roll, and a ring-shaped cutting member having an arc shape on both sides in the width direction of the raw material tape and a linear shape in front and rear of the length direction will adhere The tape T is cut halfway on the carrier tape into adhesive tape pieces. The carrier tape is folded back and moved by the edge member, while the adhesive tape piece is peeled off from the carrier tape, and the tape is attached to the ring frame that moves relatively in synchronization with the peeling speed. With tablets.

Description

Adhesive tape, adhesive tape attaching method, and adhesive tape attaching device

The present invention relates to an adhesive tape attached to an annular frame for holding a semiconductor wafer, an adhesive tape attaching method for attaching the adhesive tape to an annular frame, and an adhesive tape attaching device.

In order to make the semiconductor wafer thinned by the back grinding process (hereinafter referred to as "wafer" as appropriate) rigid and easy to handle, and to perform the dicing process, it is looped through an adhesive tape (dicing tape) for support. The center of the frame then holds the wafer.

The process of attaching a dicing tape is as follows, for example. From the roll, a tape-shaped adhesive film provided on a tape-shaped substrate was added. The adhesive film is pre-cut into a circular shape on the substrate to form a dicing tape. The base tape on which the dicing tape is formed is guided to an attachment means composed of an edge member, the base tape is folded back, and the dicing tape is peeled off. The peeled dicing tape is attached to both the ring-shaped frame and the wafer disposed in the center of the ring-shaped frame (see Japanese Patent Application Laid-Open No. 2005-116928).

As shown in FIG. 4 (c), the dicing tape is formed by arranging circular dicing tapes at predetermined intervals on a substrate.

As for the cutting tape, as shown in Fig. 4 (a), The strip-shaped material is cut into a semi-circular shape on the substrate so as to have linear portions at four places in the front, back, left, and right, and a plurality of cutting tapes are connected in linear contact with each other in the front and rear straight portions (see Japanese Patent Application Laid-Open No. 2011). -192850).

The cutting tape shown in FIG. 4 (c) is formed by being cut at half intervals with a predetermined interval. If only one interval of the front and rear cutting tapes is viewed, it is a short distance. Therefore, it is generally considered that there is no obstacle when discarding the cut cutting tape. However, if the number of cutting bands cut into a circle is large in terms of the raw material roll unit, the amount of waste is cumulatively increased. For this reason, in the process of sticking an adhesive tape to a ring frame and a wafer, there arises a problem that the exchange frequency of the raw material roll wound with the dicing tape is increased and the working efficiency is reduced.

In addition, the dicing tape shown in FIG. 4 (a) is such that the linear portions of the adhesive tape pieces are in linear contact with each other, so that no discarded portion is generated in the longitudinal direction. However, when the adhesive tape sheet is peeled off from the substrate, although it has been partially cut off, the adhesive tape sheet of the peeling object and the adhesive layer of the subsequent adhesive tape sheet are frequently stuck to each other.

If the tape attaching process is continued in this state, wrinkles will be generated on the end side before the subsequent adhesive tape piece. Therefore, there arises a problem that the cutting tape cannot be closely adhered to the ring frame with high accuracy and the like.

The present invention has been made in view of such circumstances, and an object thereof is to provide an adhesive tape that can be effectively cut from a tape-shaped adhesive tape to be attached to a ring frame and can be attached to the ring frame with high accuracy. Adhesive tape, adhesive tape attaching method, and adhesive tape attaching device.

To achieve such an object, the present invention adopts the following configuration.

That is, an adhesive tape is attached to the ring frame and the semiconductor wafer. The adhesive tape includes a structure in which an arc-shaped end connecting a linear end with an opposite end and a linear end are connected. A plurality of edges are adhered to the strip, and the linear end edges of each other are arranged close to each other and are arranged on a long carrier tape.

With this adhesive tape, since a plurality of adhesive tape pieces having linear end edges in the front and back of the length direction of the carrier tape are configured so that the linear end edges are close to each other, the usage amount of each adhesive tape piece can be reduced.

In addition, since the distance between the cut portions between the front and rear adhesive tape pieces arranged on the carrier tape becomes shorter, it is possible to reduce the discarded portion of the adhesive tape after half cutting. Therefore, the number of the adhesive tape pieces provided on the carrier tape can be increased, and the exchange frequency of the adhesive tape roll can be reduced.

In addition, the adhesive tape sheet may have a pair of linear end edges parallel to the end edges of the carrier tape. That is, the adhesive tape may have a shape having four linear end edges in front, back, left, and right. With this adhesive tape, when a plurality of adhesive tape rolls are manufactured by cutting a wide raw material roll into an adhesive tape having a predetermined width, the bandwidth can be shortened compared with an adhesive tape having an arc-shaped end edge in the width direction. More rolls of a predetermined width are made from the raw roll. It is also possible to reduce the amount of discarded raw materials.

In addition, in order to achieve such an object, the present invention adopts the following configuration.

That is, an adhesive tape attaching method is to attach an adhesive tape On the ring frame, the foregoing method includes the following process: a discharging process, which releases a raw material tape with a long adhesive tape attached to a long carrier tape from a raw material roll; a cutting process, which uses a ring-shaped cutting member to The aforementioned adhesive tape is half-cut into an adhesive tape piece on the carrier tape, and the cutting member has an arc shape on both sides in the width direction of the raw material tape, and has a linear shape in front and back in the length direction; and the attaching process, which is When the carrier tape is folded back and moved by the edge member, the adhesive tape piece is peeled from the carrier tape, and the adhesive tape piece is attached to a ring frame that moves relatively in synchronization with the peeling speed.

By this method, an adhesive tape piece having linear end edges in the front-rear direction can be formed by half-cutting from the raw material tape, and the adhesive tape piece can be peeled off from the carrier tape and attached to the endless frame. Therefore, it is possible to reduce the usage amount of the adhesive tape in the longitudinal direction and the discarded portion between the adhesive tape pieces after being cut into the adhesive tape pieces. In other words, since the cut-out amount of the adhesive tape piece of each raw material roll is increased, the exchange frequency of the raw material roll can be reduced.

In addition, the adhesive tape piece of the peeling object and the subsequent adhesive tape piece will not be in line contact with each other as in the conventional type. Therefore, when the adhesive tape sheet to be treated is peeled off, the front end side of the subsequent adhesive tape sheet and the rear end of the adhesive tape to be peeled off do not continue through the adhesive layer, so the front end of the subsequent adhesive tape sheet is not generated. Wrinkles and more. Therefore, the adhesive tape piece can be brought into close contact with the ring frame.

As the cutting member, for example, a cutting roller having an annular cutting blade connecting an arc shape and a linear shape is used.

In this way, the release speed of the cutting roller and the adhesive tape is increased. It can be pressed and rotated on the adhesive tape at the same time, so that the adhesive tape can be cut into half by cutting. That is, there is no need to stop the conveyance of the raw material tape. Therefore, the half-cut of the adhesive tape sheet and the sticking of the adhesive tape sheet to the ring frame can be effectively performed.

In addition, in order to achieve such an object, the present invention adopts the following configuration.

That is, an adhesive tape attaching device is used for attaching an adhesive tape to a ring frame. The device includes the following structure: a tape supply section, which is formed by attaching a long adhesive tape to a long carrier tape fed from a raw material roll. Raw material tape; a tape movement guide mechanism that moves the raw material tape discharged from the aforementioned tape supply unit along a predetermined tape conveying path and guides it to an edge member; and a tape pre-cutting mechanism that uses a ring-shaped cutting member to The adhesive tape is cut into half on the carrier tape to form an adhesive tape piece. The cutting member has an arc shape on both sides in the width direction of the adhesive tape provided on the tape conveying path, and has a linear shape in the front and rear of the length direction. The edge member It is folded back to the aforementioned carrier tape to peel off the adhesive tape piece; the holding platform is to hold the aforementioned ring frame; the tape attachment mechanism is to move the aforementioned holding platform in synchronization with the moving speed of the applicator roller and the belt, and to move relatively The pressure-sensitive adhesive tape piece peeled from the carrier tape by the aforementioned edge member is attached to the ring-shaped frame on the holding platform by pressing the sticking roller; and the carrier tape recovery section recovers the peeled tape Said carrier tape adhesive strip.

With this structure, the adhesive tape piece is cut in half from the long raw material tape on the tape conveying path while being synchronized with the tape moving speed. The adhesive tape sheet can be attached to the ring frame while being peeled from the carrier tape. That is, the above method can be appropriately implemented by this structure.

The cutting member is preferably a cutting roller having an annular cutting blade connecting an arc shape and a linear shape.

With this structure, when the adhesive tape piece is cut from the long adhesive tape half, the semi-cutting of the adhesive tape and the sticking of the adhesive tape piece to the ring frame can be continuously performed without stopping the conveyance of the raw material tape.

1‧‧‧ belt supply department

2‧‧‧ with pre-cutting mechanism

3‧‧‧ tension roller

4‧‧‧ Adhesive Tape Recovery Department

5‧‧‧ with attachment

6‧‧‧ Carrier tape recovery department

7‧‧‧ cutting roller

8‧‧‧ backup roller

9‧‧‧ cutting blade

10‧‧‧ sheet

11‧‧‧Straight part

12‧‧‧ arc part

13‧‧‧Feeding roller

14‧‧‧ Recovery tube

15‧‧‧ 1st attaching unit

16‧‧‧ 2nd attaching unit

17‧‧‧ Attach Platform

18‧‧‧Edge members

20‧‧‧ Attachment roller

21‧‧‧Feed roller

22‧‧‧ Recovery tube

23‧‧‧Drive cylinder

24‧‧‧ Attachment roller

25‧‧‧ Mobile station

26‧‧‧Frame holding department

27‧‧‧ Wafer holding section

30‧‧‧ Wafer holding section

31‧‧‧Frame holding department

32‧‧‧ chamber

33‧‧‧ Upper case

34‧‧‧ Lower case

35‧‧‧ par

36‧‧‧ Motor

37‧‧‧ Lifting drive mechanism

38‧‧‧ vertical wall

39‧‧‧Guide

40‧‧‧ movable table

41‧‧‧movable frame

42‧‧‧ arm

43‧‧‧ fulcrum

ct‧‧‧bearing belt

e1‧‧‧Straight end

e1A‧‧‧Straight edge

e2‧‧‧ arc-shaped end

e2A‧‧‧Arc-shaped edge

f‧‧‧ ring frame

ta‧‧‧adhesive tape

tb‧‧‧adhesive layer

tc‧‧‧ substrate

MF‧‧‧ Wafer Mount

P‧‧‧protective tape

T‧‧‧adhesive tape

T’‧‧‧ useless adhesive tape

TR‧‧‧ Raw Roll

W‧‧‧ Wafer

Please understand that several forms which are currently considered suitable for explaining the invention are illustrated, but the invention is not limited to the structures and schemes shown in the figure.

Figure 1 is a plan view of the adhesive tape.

Fig. 2 is an enlarged plan view of a portion surrounded by the two-point chain line of Fig. 1.

Fig. 3 is a longitudinal sectional side view of the adhesive tape.

FIG. 4 is a comparison diagram of the adhesive tape of the present invention and the conventional adhesive tape.

Fig. 5 is a front view of the adhesive tape attachment device.

Fig. 6 is a plan view of the adhesive tape attachment device.

Fig. 7 is a perspective view of a cutting roller.

Fig. 8 is a longitudinal sectional view of the attachment platform.

FIG. 9 is a flowchart showing an adhesive tape attaching process.

Fig. 10 is a perspective view of the tape attachment portion.

Fig. 11 is a schematic side view showing an adhesive tape attaching operation of the first attaching unit.

Fig. 12 is a schematic diagram showing an adhesive tape attaching operation of the first attaching unit. Slightly side view.

Fig. 13 is a schematic side view showing an adhesive tape attaching operation of the second attaching unit.

Fig. 14 is a schematic side view showing an adhesive tape attaching operation of the second attaching unit.

FIG. 15 is a plan view of the back side of the wafer mount.

Fig. 16 is a front view of an adhesive tape attachment device according to a modification.

Fig. 17 is a longitudinal sectional side view of a second attachment unit according to a modification.

FIG. 18 is a flowchart showing an adhesive tape attaching process according to a modification.

FIG. 19 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

FIG. 20 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

FIG. 21 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

Fig. 22 is a front view of a modified example device.

Fig. 23 is a plan view of an adhesive tape of a modified example device.

FIG. 24 is a plan view of a back surface side of a wafer mount according to a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<Adhesive tape>

In this embodiment, a tape-shaped adhesive tape including an adhesive tape sheet is described in detail. The adhesive tape sheet holds a semiconductor wafer on a ring frame.

Figure 1 shows the plane of the adhesive tape of the present invention. Fig. 2 shows a partially enlarged plane of the adhesive tape, and Fig. 3 shows a longitudinal sectional side view of the adhesive tape.

The adhesive tape T is attached to the long carrier tape ct with a long adhesive tape T having the same width as the carrier tape ct. The adhesive tape itself has been half-cut into the adhesive tape piece ta on the carrier tape ct. The adhesive tape piece ta has a pair of linear end edges e1 orthogonal to the longitudinal direction and facing back and forth, and straight ends A pair of left and right arc-shaped end edges e2 connected to each end of the edge e1. The plurality of adhesive tape pieces ta are formed at the front and rear along the longitudinal direction of the adhesive tape T, and the linear end edges e1 are arranged close to each other and facing each other.

The distance between the linear end edges e1 of the front and rear adhesive tapes ta is set to the following distance: When the adhesive tape ta is peeled off in the forward direction, the adhesive layer at the rear end of the adhesive tape ta and the rear adhesive tape ta The distance at which the adhesive layer at the front no longer follows. That is, the distance is set as a distance in which, when it is attached to the ring frame, unnecessary peeling stress does not occur on the front end of the rear adhesive tape piece ta and wrinkles are generated. The generation of the wrinkles varies depending on the type of the adhesive tape T or environmental characteristics (for example, temperature, humidity, tension, etc.). Therefore, the distance between the adhesive tape pieces ta is determined in advance by experiments or simulations. However, compared with the case where, for example, as shown in FIG. 4, the linear ends of the conventional example are in contact with each other (FIG. 4 (a)), the adhesive tape piece ta of the conventional example is cut into a perfect circle In the case where the front and rear adhesive tape pieces ta are arranged at a predetermined pitch (FIG. 4 (c)), the distance L2 from the center P1 to P2 of the adhesive tape piece ta of this embodiment is set to the adhesive tape of the conventional example. The relationship between the distances L1 and L3 between the centers of the slices ta is L1 <L2 <L3.

Furthermore, as shown in FIG. 2, the adhesive tape T is laminated in the order of the carrier tape ct, the adhesive layer tb, and the substrate tc.

<Adhesive tape attachment device>

Figure 5 shows the front side of the adhesive tape attachment device of the present invention, and Figure 6 shows the side of the device.

This adhesive tape attaching device is composed of a tape supply section 1, a tape pre-cut mechanism 2, a tension roller 3, an adhesive tape recovery section 4, a tape attaching section 5, a carrier tape recovery section 6, and the like. Hereinafter, each structure will be described in detail.

The tape supply unit 1 includes a bobbin for mounting a material roll TR on which an adhesive tape T is wound. It is comprised so that the adhesive tape T discharged | emitted from the tape supply part 1 may be guided to the predetermined tape conveyance path via the tension roller 3, and is supplied to the tape application part 5 via the tape precut mechanism 2.

The pre-cutting mechanism 2 is provided with a cutting roller 7 and a back-up roller 8 which are driven synchronously and vertically. As shown in FIG. 7, the cutting roller 7 is configured by mounting a sheet 10 on which a cutting blade 9 is formed on a driving roller. The cutting blade 9 is formed in a ring shape formed by a straight portion 11 and an arc portion 12 which are horizontally opposed; the arc portion 12 connects one end of the two straight portions 11 to each other.

When the sheet 10 is mounted on a driving roller, the two straight portions 11 of the cutting blade 9 are parallel and close to each other along the longitudinal direction of the driving roller.

The backup roller 8 is a metal driving roller. In addition, at least one of the cutting roller 7 or the backup roller 8 is configured to be movable up and down by a driving cylinder. Therefore, the configuration is such that the gap between the two rollers 7 and 8 can be changed according to the thickness of the adhesive tape T.

The adhesive tape recovery unit 4 is configured to strip the useless adhesive tape T 'cut into the shape of an adhesive tape piece ta on the carrier tape ct, and then take off the tape feed roller 13 from the carrier tape ct and wind it up on the recovery bobbin 14. Therefore, the adhesive tape T in a state where the adhesive tape piece ta remains on the carrier tape ct is guided to the tape attaching portion 5.

As shown in FIGS. 5 and 6, the tape attaching section 5 includes a first attaching unit 15 that attaches the adhesive tape piece ta to the ring frame f, and attaches the adhesive tape piece ta to the semiconductor wafer W. (Hereinafter referred to simply as "wafer") second attachment unit 16 and attachment platform 17 and the like.

The first attachment unit 15 includes an edge member 18, an attachment roller 20, and the like. The first attaching unit 15 is provided so as to reciprocate above the attaching platform 17 along the conveying direction of the adhesive tape T.

The edge member 18 peels off the adhesive tape piece ta while returning the carrier tape ct of the semi-cut adhesive tape T sent from the tape pre-cutting mechanism 2 and peeling the adhesive tape piece ta, and guides the carrier tape ct to the carrier tape recovery unit 6.

The application roller 20 faces the front end portion disposed on the front edge member 18 from above. The application roller 20 is configured to be raised and lowered by a driving cylinder 23. Therefore, at the front end of the edge member 18, the pressure-sensitive adhesive tape piece ta that is peeled from the carrier tape ct and pushed forward is pushed from above, and is attached to the upper surface of the annular frame f held by the attachment platform 17. In addition, the tape attaching mechanism of the present invention is composed of an attaching roller 20 and a driving cylinder 23. The first attaching unit 15 corresponds to the tape attaching mechanism of the present invention.

The second application unit 16 includes an application roller 24 that can be raised and lowered by a driving cylinder. The second attaching unit 16 is provided so as to intersect with the conveying direction of the adhesive tape T and move back and forth so as not to hinder the advancement of the first attaching unit 15. The application roller 24 is covered with an elastomer.

As shown in FIGS. 6 and 8, the attaching platform 17 is composed of a pull-out type movable table 25, a frame holding portion 26, and a wafer holding portion 27.

The movable table 25 is configured to move horizontally forward and backward along the guide rails at the left and right ends.

The frame holding portion 26 is configured to position and fix the ring-shaped frame f placed on the ring-shaped holding surface by suction holding or supporting pins.

The wafer holding unit 27 has a holding surface that attracts the wafer W, and is configured to be lifted and lowered by an actuator such as an air cylinder.

The carrier tape recovery unit 6 is configured to drive the carrier tape ct folded back by the edge member 18 to be moved by the feed roller 21 and is wound around the recovery bobbin 22.

In addition, the tension roller 3, the guide roller without a symbol, and the like constitute the belt movement guide mechanism of the present invention.

The adhesive tape attachment device of the present invention is configured as described above. Referring to the flowchart shown in FIG. 9 and FIGS. 10 to 15, the following explains the use of the adhesive tape attachment device to attach the adhesive tape piece ta to the ring frame f, and then the adhesive tape piece ta A round of action attached to the wafer W.

The movable table 25 is pulled out from the apparatus main body on the attachment platform 17, and the ring frame f and the wafer W are placed and held on each of the holding portions of the frame holding portion 26 and the wafer holding portion 27. The movable table 25 is returned to the apparatus body. At this time, it is set such that the wafer holding portion 27 is slightly lowered and the surface height of the wafer W is lower than the surface height of the ring frame f (step S1). At this time, the wafer W is placed with its back face up. A protective tape P is attached to the surface of the wafer W.

The apparatus main body is operated to release and supply the adhesive tape T from the tape supply unit 1 (step S2). During passing between the cutting roller 7 and the support roller 8 of the tape pre-cutting mechanism 2, the adhesive tape T is continuously and semi-cut into the adhesive tape piece ta on the carrier tape ct by the cutting roller 7 driven by rotation (step S3).

The half-cut adhesive tape T is sent to the adhesive tape recovery unit 4 via the tension roller 3. The adhesive tape recovery unit 4 peels the useless adhesive tape T 'cut into the adhesive tape piece ta by the tape feed roller 13. Thereafter, the adhesive tape T 'is gradually taken up and collected in the bobbin 14 (step S4).

The adhesive tape T in which only the adhesive tape piece ta remains on the carrier tape ct is sent to the tape attaching section 5.

The first attaching unit 15 pulls out the adhesive tape T introduced and absorbed by the tension roller 3 while moving to the front tape attaching position. When the first attaching unit 15 reaches the tape attaching position, the carrier tape ct folded back by the edge member 18 is gradually wound up and recovered in the bobbin of the carrier tape recovery section 6. At this time, the adhesive tape piece ta is peeled off from the carrier tape ct which is gradually moved back, and gradually protrudes forward along the upper surface of the edge member 18.

As shown in FIG. 10, the front end of the adhesive tape piece ta passes the front end of the edge member 18 and reaches directly below the application roller 20 in the upper waiting position. As shown in FIG. 11, lowering the application roller 20, The front end portion of the double-sided adhesive tape piece ta protruding forward of the edge member 18 is pressed against the front end surface of the annular frame f held by the attachment platform 17. Thereafter, as shown in FIG. 12, the first adhering unit 15 and the adhesive tape piece ta that is gradually moved forward while one side is peeled from the carrier tape ct are synchronized with the moving speed of the carrier tape ct and the winding speed The rear waiting position moves. That is, the adhesive tape piece ta from which the carrier tape ct is peeled is gradually attached by the application roller 20. On the surface of the ring frame f (step S5).

At this time, the tension roller 3 is used to adjust the tape supply amount so as not to supply the excessive adhesive tape T to the first attaching unit 15.

After the application of the adhesive tape piece ta to the ring frame f is completed, the second application unit 16 is moved to the front application position. When the second attachment unit 16 reaches a predetermined position, as shown in FIG. 13, the attachment roller 24 is lowered and moved forward from one end of the ring-shaped frame f to the other end. At this time, as shown in FIG. 14, the adhesive roller 24 gradually attaches the adhesive tape piece ta to the back surface of the wafer W which is close to and opposed to the adhesive tape piece ta while being elastically deformed (step S6).

When the application roller 24 reaches the end position, the second application unit 16 raises the application roller 24. After that, the second attaching unit 16 moves backward and returns to the waiting position.

The movable table 25 is pulled out from the apparatus main body, and as shown in FIG. 15, the wafer mounting frame MF made through the adhesive tape piece ta is taken out and recovered (step S7). As described above, the one-round operation of attaching the adhesive tape piece ta to the ring frame f and the wafer W ends, and the same operation is repeated until the predetermined piece is reached (step S8).

According to the apparatus of the above-mentioned embodiment, since the adhesive tape T portion facing forward and backward in the adhesive tape T conveying direction is cut in half linearly, the distance in the longitudinal direction can be set to be shorter than the width of the adhesive tape piece ta by a predetermined interval. Pitches are continuously formed on the carrier tape ct. Therefore, more adhesive tape pieces ta can be obtained from the raw material roll TR than the adhesive tape pieces cut into a perfect circle. In other words, it is possible to reduce the exchange frequency of the raw material rolls TR and improve work efficiency. In addition, due to the adhesion cut between the front and rear adhesive tape pieces ta The distance of the tape T is short, so the amount of the discarded adhesive tape T can also be reduced.

Moreover, since the adhesive tape pieces ta before and after the conveyance direction are cut | disconnected by a predetermined space | interval, the adhesive layers of the adhesive tape pieces ta before and behind do not adhere to each other. Therefore, when the adhesive tape piece ta is peeled from the carrier tape ct, it is possible to avoid unnecessary peeling stress from being applied to the adhesive tape piece ta on the rear side, and wrinkles can be generated.

In addition, the present invention can also be implemented in the following forms:

(1) The sticking of the adhesive tape piece ta on the back surface of the wafer W is not limited to the above-mentioned embodiment, and it may also be configured such that, for example, only the wafer W is stored in the chamber, and the adhesive tape piece ta is attached by decompression. On the back of wafer W.

As shown in FIGS. 16 and 17, the attachment stage 17 includes a wafer holding portion 30 for wafer holding and a frame holding portion 31 for holding a ring frame, and the wafer holding portion 30 and the frame holding portion 31 A lower case 34 is integrally formed between the upper case 33 and the cavity 32.

The wafer holding portion 30 is connected to a rod 35 penetrating the lower case 34 constituting the chamber 32 via a sealing member for sealing. The other end of the lever 35 is drivingly connected to the motor 36. Therefore, the wafer holding unit 30 is configured to be raised and lowered in the lower case 34 by the forward and reverse driving of the motor 36.

In addition, the upper portion of the cylinder of the lower case 34 is slightly circular, and is subjected to a release treatment such as fluorine processing.

The upper case 33 is provided on the lift driving mechanism 37. This lifting driving mechanism 37 is provided with a movable table 40 that can be raised and lowered along a guide rail 39 disposed longitudinally on the back of the vertical wall 38; a movable frame 41 supported by the movable table 40 in an adjustable height manner; and an arm 42 that From this point forward the movable frame 41 Reach out. An upper case 33 is attached to the lower end of the support shaft 43 which projects downward from the front end of the arm 42.

The cavity 32 formed by the upper and lower cases 33 and 34 has a diameter smaller than the width of the adhesive tape piece ta. In other words, the two casings 33 and 34 can be sandwiched between the adhesive tape piece ta exposed from the outer periphery of the wafer W to the inner diameter of the ring frame f.

Next, a round operation of attaching the adhesive tape piece ta to the wafer W using the apparatus of this embodiment will be described according to the flowchart shown in FIG. 18.

In addition, until the adhesive tape piece ta is attached to the ring frame f, the processing from step S11 to step S15 is omitted because it is the same as the above embodiment, and the different steps from step S16 to step S18 will be adhered. The operation of attaching the tape ta to the wafer W will be described.

By the same operation as the above-mentioned embodiment, the first sticking unit 15 ends the sticking of the adhesive tape piece ta to the ring frame f, and as shown in FIG. 19, the upper case 33 is lowered. Following this descent, the upper case 33 and the lower case 34 sandwich the adhesive tape piece ta whose adhesive surface is exposed from the outer periphery of the wafer W to the inner diameter of the ring frame f to form the cavity 32 (step S16). At this time, the adhesive tape piece ta functions as a sealing material and divides the upper case 33 side and the lower case 34 side into two spaces.

There is a predetermined gap between the wafer W located in the lower case 34 and the adhesive tape piece ta, and the wafer W approaches the opposite side.

Regarding the flow path in which the upper case 33 and the lower case 34 communicate with the vacuum device via a solenoid valve, a control unit (not shown) is used to adjust the opening and closing of the solenoid valve to reduce the pressure in the two cases 33 and 34. That is, the opening degree of the solenoid valve is adjusted so that the pressure in the two cases 33 and 34 is gradually reduced at the same speed.

When the pressure in the two casings 33 and 34 is reduced to a predetermined pressure, the solenoid valve is closed and the operation of the vacuum device is stopped.

The control unit adjusts the opening degree of the solenoid valve to leak the gas while gradually increasing the inside of the upper case 33 to a predetermined air pressure. At this time, the air pressure in the lower case 34 becomes lower than the air pressure in the upper case 33, and using this differential pressure, as shown in FIG. 20, the adhesive tape piece ta is gradually pulled from the center into the lower case 34 From the center of the wafer W disposed close to the periphery, it is slowly attached to the periphery (step S17).

The air pressure in the upper case 33 reaches a preset pressure, and the control unit adjusts the opening degree of the solenoid valve so that the air pressure in the lower case 34 becomes the same as the air pressure in the upper case 33. In response to this adjustment of the air pressure, the wafer holding portion 30 is raised so that the surface of the ring frame f and the upper surface of the wafer W become the same height. Thereafter, as shown in FIG. 21, the control unit raises the upper case 33 to open the atmosphere in the upper case 33, and opens the solenoid valve fully, and also opens the atmosphere to the lower case 34 side (step S18).

When the upper case 33 is raised, the sticking of the adhesive tape piece ta on the back surface of the wafer W is completed.

The upper case 33 returns to the upper waiting position, and the wafer mounting frame MF is completed. The attaching platform 17 is pulled out to carry out the wafer mounting rack MF (step S19). As described above, one operation of attaching the adhesive tape piece ta to the ring frame f and the wafer W ends, and the same operation is repeated until the predetermined number of pieces is reached (step S20).

(2) In the above-mentioned embodiment, as shown in FIG. 22, both the first application unit 15 and the vacuum chamber type application unit in which the application roller 24 is provided may be provided, and may be arbitrarily selected and used.

(3) In the device according to the modification, a heater may be provided in the chamber, and the adhesive tape piece ta is heated while being attached to the back surface of the wafer W.

(4) In the device according to the modification, the chamber 32 may be configured as a ring frame f, or may be stored together.

(5) In the apparatus of each of the above embodiments, although the useless adhesive tape T 'is peeled off before being sent to the tape attaching section 5 after the half-cut process, the tape attaching section 5 and the carrier tape may be peeled off. ct is reeled together for recycling.

(6) The adhesive tape T of each of the above embodiments has a shape having a pair of linear end edges e1 orthogonal to the longitudinal direction and facing front to back, but is not limited to this shape. For example, as shown in Figs. 23 and 24, a pair of linear end edges e1A are formed parallel to the side end edges of the carrier tape. An adhesive tape T having a shape in which one end of the linear end edges e1, e1A of the front, back, left, and right sides of the carrier tape ct are connected by an arc-shaped end edge e2A may be arranged on the carrier tape ct.

Furthermore, in the apparatus of the above-mentioned embodiment, when the adhesive tape T is half-cut, a cutting blade 9 having the same shape as the adhesive tape T is formed on the sheet 10.

With this adhesive tape T, when a plurality of adhesive tape rolls are manufactured by cutting a wide raw material tape in accordance with the width of the adhesive tape T along the length direction, compared with the case where a plurality of adhesive tape T rolls are manufactured, Adhesive tape T with arc-shaped end edges in the width direction can make more rolls. In addition, the amount of waste in the width direction of the raw material roll can be adjusted to be small.

The present invention can be implemented in other specific forms without departing from the spirit or essence of the invention. Therefore, those who show the scope of the invention should refer to the attached Added patent application scope, not the above description.

ta‧‧‧adhesive tape

Claims (5)

An adhesive tape is attached to a ring frame and a semiconductor wafer. The aforementioned adhesive tape includes the following structure: an arc-shaped end edge connected with an opposite linear end edge and the linear end edge is connected. A plurality of adhesive tapes are arranged so that the linear end edges of each other are spaced apart from each other and approach each other, and are arranged on a long carrier tape. A method for attaching an adhesive tape is to attach an adhesive tape as described in the scope of patent application No. 1 to a ring frame. The foregoing method includes the following process: a release process, which is performed by releasing a long carrier tape from a roll of raw material. The raw material tape of the long adhesive tape; in the cutting process, the aforementioned adhesive tape is cut into half on the carrier tape by a ring-shaped cutting member, and the cutting member is provided on both sides in the width direction of the raw tape. The shape of the arc is linear and has a linear shape in the front and back of the length direction; and the attaching process is to fold and move the carrier tape by the edge member, while peeling the adhesive tape piece from the carrier tape, while synchronizing with the peeling speed Adhesive tape pieces are attached to the relatively moving ring frame. For example, the method for applying an adhesive tape according to item 2 of the patent application range, wherein the cutting member is a cutting roller having an annular cutting blade connecting an arc shape and a linear shape. An adhesive tape attaching device is used for attaching an adhesive tape as described in the scope of patent application No. 1 on a ring frame. The foregoing device includes the following structure: a tape supply unit that attaches a long carrier tape from a raw material roll A raw material tape with a long adhesive tape; a tape moving guide mechanism that moves the raw material tape released from the aforementioned tape supply section along a predetermined tape conveying path and guides it to an edge member; a tape pre-cutting mechanism that uses a loop The cutting member cuts the adhesive tape halfway on the carrier tape into an adhesive tape piece. The cutting member has an arc shape on both sides in the width direction of the adhesive tape provided on the tape conveying path, and has an Linear shape; edge member that is folded back to the aforementioned carrier tape to peel off the adhesive tape piece; holding platform that holds the aforementioned annular frame; tape attachment mechanism that synchronizes the moving speed of the holding platform with the application roller and the belt on one side For relative movement, the adhesive tape piece peeled from the carrier tape by the aforementioned edge member is attached to the ring frame on the holding platform by the application roller; and the carrier tape recovery part is for recovering the peeled adhesive. Carrier tape with tape. For example, in the adhesive tape application device of the fourth scope of the application, the cutting member is a cutting roller having an annular cutting blade connecting an arc shape and a linear shape.