JP2006073920A - Tape pasting equipment, mounting equipment, and mounting method - Google Patents

Tape pasting equipment, mounting equipment, and mounting method Download PDF

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Publication number
JP2006073920A
JP2006073920A JP2004258078A JP2004258078A JP2006073920A JP 2006073920 A JP2006073920 A JP 2006073920A JP 2004258078 A JP2004258078 A JP 2004258078A JP 2004258078 A JP2004258078 A JP 2004258078A JP 2006073920 A JP2006073920 A JP 2006073920A
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Prior art keywords
tape
device
dicing tape
ring frame
base material
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JP2004258078A
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Japanese (ja)
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JP4723216B2 (en
Inventor
Kenji Kobayashi
Masaki Tsujimoto
Takahisa Yoshioka
孝久 吉岡
賢治 小林
正樹 辻本
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Lintec Corp
リンテック株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/6839Separation by peeling using peeling wedge or knife or bar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

An apparatus and method for mounting a semiconductor wafer, in which a dicing tape is formed by detecting abnormalities such as scratches on a tape base material and cutting out the abnormal parts.
An inspection device such as a CCD camera provided on the upstream side of a die cutting device is provided immediately before a guide roll, and the area of the dicing tape DT can be covered with a single image of the inspection. preferable. The inspection data from the inspection device 14 is output to the control device, and when an abnormality is detected, the region where the abnormality exists is not included in the region of the cut C based on the position data. When an abnormality is detected in a region where a single dicing tape DT is formed, the driving of the die cutting device 13 is stopped while maintaining the above-described clearance CL until the abnormal portion passes through.
[Selection] Figure 1

Description

  The present invention relates to a tape applying device, a mounting device, and a mounting method, and in particular, when a semiconductor wafer is fixed to a ring frame, a raw material in which a tape base material for forming a dicing tape is temporarily attached to one surface of a base sheet. The present invention relates to a tape applicator, a mounting apparatus, and a mounting method suitable for forming a dicing tape using a tape, peeling the dicing tape, and fixing a semiconductor wafer to a ring frame.

Conventionally, when a semiconductor wafer having a circuit surface formed is diced, the semiconductor wafer is placed on the inner side of the ring frame and a dicing tape is attached to the surface to fix the semiconductor wafer to the ring frame. It has been broken. The dicing tape is affixed by applying a continuous dicing tape in a band shape to the ring frame and the semiconductor wafer, and then cutting off the outer peripheral side of the dicing tape according to the shape of the ring frame using a cutter.
As another pasting method, for example, as shown in Patent Document 1, a strip-shaped original fabric in which a tape base material is temporarily attached to one surface of a base sheet is used, and the tape base material corresponds to the shape of a ring frame. There is also adopted a method in which a closed-loop cut is formed, a dicing tape is formed on the inside, and then the dicing tape is peeled off one by one and attached to the ring frame.

JP-A-6-216242

  However, in the method of cutting the outer peripheral side of the dicing tape with a cutter according to the shape of the ring frame after applying a continuous dicing tape in a band shape, the ring frame is cut by the blade of the cutter in order to cut the dicing tape within the surface of the ring frame. Has the disadvantage of being significantly damaged. In particular, when a resin ring frame is used in order to reduce the weight and achieve weight reduction, the degree of damage becomes even more remarkable.

  On the other hand, as shown in Patent Document 1, in the method of applying a dicing tape that has been cut into a ring frame shape in advance, a step of previously forming a dicing tape in a label shape on the surface of the tape base material Is required. Further, when the tape base material is hard and thick, there is a disadvantage that it is peeled off from the base sheet during feeding. Furthermore, since the dicing tape in which the cut is formed in the label shape is wound in a roll shape in a state of being attached to the base sheet via an adhesive, dicing is performed for each layer along the radial direction of the roll. The tape is not always wound so that it is exactly overlapped. Therefore, due to the elastic deformation of the adhesive and the edges of the dicing tape that overlap each other, a pressing mark (step) or a scratch caused by the winding pressure is formed on the surface of the dicing tape, and the plane accuracy is greatly reduced. . When a dicing tape having such a stamp mark or scratch is pasted on a ring frame, air mixing due to a decrease in planar accuracy is caused, which causes a bad effect such as sticking failure.

  By the way, the dicing tape described above may have scratches in its surface or may have impurities such as dust attached thereto. In such a case, the presence of such scratches and dusts causes air to be mixed into the bonding surface between the semiconductor wafer and the dicing tape, resulting in partial bonding failure. In this regard, conventionally, only a dicing tape is formed in a predetermined shape at a predetermined interval in advance, and no special countermeasures are taken. There was a problem that it was impossible to avoid defective pasting.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to form a tape for application by forming a cut in a base substrate temporarily attached to a base sheet. Inspect whether there is an abnormality in the tape substrate, and if an abnormality is detected, form a notch in the area excluding the abnormal part to form an adhesive tape, and then apply the adhesive tape. It is providing the tape sticking apparatus which can be stuck on a kimono.

  Another object of the present invention is to inspect whether or not there is an abnormality in the tape base material, and when an abnormality is detected, form a notch in the area excluding the abnormal part to form a dicing tape, An object of the present invention is to provide a mounting apparatus and a mounting method for attaching a dicing tape to a ring frame and a semiconductor wafer and mounting the semiconductor wafer on the ring frame.

In order to achieve the above object, the present invention provides a feeding device for feeding a belt-shaped original fabric in which a tape base material is temporarily attached to one surface of a base sheet, and a closed loop on the tape base material on the original material supply route. Cutting device for forming an adhesive tape by forming an incision, a peeling device for peeling the adhesive tape from the base sheet, a support for supporting a predetermined adherend, and the peeling device A sticking device for sticking the sticking tape to an adherend, and a winding device for winding up the original fabric after peeling the sticking tape with the peeling device,
A tape base material inspection device is disposed upstream of the cutting device in the feed direction of the original, and when this inspection device detects an abnormality of the tape base material, the abnormal portion is passed through the cutting device and pasted. The structure of forming a tape for use is adopted.

Further, the present invention provides a mounting apparatus in which a ring frame is arranged on a table and a semiconductor wafer is arranged inside the ring frame, and a dicing tape is attached to the ring frame to fix the semiconductor wafer to the ring frame.
Forming a dicing tape by forming a strip-shaped raw material with a tape base material temporarily attached to one surface of a base sheet, and forming a closed-loop cut in the tape base material on the raw material supply route A cutting device that peels off the dicing tape from the base sheet, a sticking device that sticks the dicing tape to a ring frame and a semiconductor wafer by relatively moving the table and the peeling device, and the peeling device And a winding device that winds up the original fabric after peeling the dicing tape with,
A tape substrate inspection device is arranged upstream of the cutting device in the feed direction of the original, and when this inspection device detects an abnormality of the tape substrate, the abnormal portion is passed through the cutting device and dicing is performed. The configuration is to form a tape.

Further, the present invention provides a mounting method in which a ring frame is arranged on a table, a semiconductor wafer is arranged inside the ring frame, and a dicing tape is attached to the ring frame to fix the semiconductor wafer to the ring frame.
A step of inspecting whether there is an abnormality in the tape base material in the middle of feeding the strip-shaped raw material in which the tape base material is temporarily attached to one surface of the base sheet;
A cutting process for forming a dicing tape by forming a closed-loop cut on the tape base material that has undergone the inspection process;
Peeling the dicing tape from the base sheet and attaching the dicing tape to a ring frame and a semiconductor wafer;
Winding the original fabric after peeling the dicing tape with the peeling device,
When an abnormality of the tape base material is detected in the inspection step, a method is employed in which the notch is formed by excluding the abnormality portion.

According to the present invention, a strip-shaped original fabric is formed in a state where the tape base material is adhered to the base sheet, and the original fabric is fed out from a state wound in a roll shape. A dicing tape is formed by forming a closed loop-shaped cut by a cutting device on the unrolled raw material so as to have a planar shape corresponding to an adherend such as a ring frame and a semiconductor wafer. The dicing tape is peeled off via a peeling device made of a peel plate or the like, and then attached to an adherend such as a ring frame or a semiconductor wafer. Therefore, the step of cutting the film on the ring frame after application is not necessary, and damage to the ring frame can be avoided. In addition, since the dicing tape is formed on the path through which the raw material is fed, the above-described pressing marks and scratches due to the winding pressure are not formed in the dicing tape, thereby improving the planar accuracy. It is possible to affix to the semiconductor wafer and the ring frame in a state kept in the above.
Also, in the stage before forming the cut by the cutting device, the tape base material is detected for abnormalities such as dust adhesion or the presence or absence of scratches. Since it is formed, air can be mixed between the dicing tape and the semiconductor wafer after sticking, and the cause of sticking failure can be avoided.
In the present specification, the “closed loop” is sufficient if it is endless, and includes an ellipse, a polygon, and the like in addition to the case where it is closed in a circle.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic front view of the mounting device according to the present embodiment. In this figure, the mounting apparatus 10 is composed of a lower unit 10A and an upper unit 10B. The lower unit 10A includes a lower frame LF composed of a pair of frame plates F1 that are relatively arranged in a direction perpendicular to the paper surface in FIG. 1 (up and down direction in FIG. 2), and a base sheet. A feeding device 11 that feeds a strip-shaped original fabric L temporarily attached to one surface of S with a tape base material TB, and a closed-loop cut C (see FIG. 3) in the tape base material TB on the feed path of the original fabric L. A die cutting device 13 as a cutting device for forming a dicing tape DT as a sticking tape and a tape base material TB arranged on the upstream side in the feeding direction of the original fabric L with respect to the die cutting device 13 And an inspection device 14.

  The upper unit 10B is arranged in an area of the upper frame UF composed of the frame plate F2, the upper frame UF, the peeling device 15 for peeling the dicing tape DT from the base sheet S, and the dicing tape DT. It is configured to include a sticking device 16 for sticking to a ring frame RF and a semiconductor wafer W as a body, and a winding device 17 for winding up the original fabric after the dicing tape DT is peeled off by the peeling device 15. A table 19 as a support body movable in the left-right direction in FIG. 1 is disposed on the lower side of the peeling device 15, and the ring frame RF and the semiconductor wafer W are sucked and supported on the upper surface side of the table 19. It has become. In addition, each part of the apparatus in the lower unit 10A and the upper unit 10B is entirely controlled via a control device (not shown).

  The feeding device 11 includes a motor M1 and a support shaft 21 that is rotationally driven by the motor M1, and a raw fabric L wound around the support shaft 21 in a roll shape is supported. The raw fabric L fed from the feeding device 11 passes through a guide roll 22, a first dancer roll 23, and guide rolls 25 and 26 which are sequentially arranged toward the downstream side in the feeding direction, that is, the upper unit 10 </ b> B side. A notch C is formed at, and is further fed to the upper unit 10B side through the guide rolls 28 and 29. Here, the first dancer roll 23 is provided so as to be vertically movable along a vertically extending slot 30 formed in the frame plate F1, and an upper sensor 32 and a lower sensor 33 are provided at respective positions above and below the slot 30. Is arranged. When the first dancer roll 23 rises as the raw fabric L is fed to the die cutting device 13, the upper sensor 32 detects the raised position and outputs a signal to the control device. A drive signal is output to the motor M1 to feed out the raw fabric L from the feeding device 11, while the first dancer roll 23 is lowered by its own weight along with this feeding, and the lowered position of the first dancer roll 23 is set. When the lower sensor 33 detects, the operation of stopping the driving of the motor M1 is alternately performed via the control device.

  As shown in FIG. 2, the die-cutting device 13 is disposed between the frame plates F1 and F1, and has a die-cut roll 36 provided with a cutting blade 36A on the outer peripheral surface, and a die-receiving roll 37 disposed relative thereto. A motor M2 for rotating the die receiving roll 37, a main driving gear 39 fixed to the rotating shaft 38 of the die receiving roll 37, and a driven gear fixed to the rotating shaft 40 of the die cut roll 36 and meshing with the main driving gear 39. The gear 42 is provided. Bearers 43 and 44 are disposed on both sides of the die cut roll 36 and the die receiving roll 37, respectively, whereby the distance between the center axes of the die cut roll 36 and the die receiving roll 37 is maintained constant, and as a result, the tape by the cutting blade 36A. The base material TB can be cut with high accuracy. The cutting blade 36A extends along a locus that draws a closed loop circle having a diameter slightly smaller than the diameter of the ring frame RF when the die cut roll 36 rotates, and forms a cut in the tape base material TB. It is formed at the height to be. Further, as shown in FIG. 5, the cutting blade 36 </ b> A includes a region N where no blade exists in the circumferential direction of the die cut roll 36, and as shown in FIG. 6, a region N where the cutting blade 36 </ b> A does not exist. Is located on the die receiving roll 37 side, the clearance CL that allows the original fabric L to pass through without forming a notch in the original fabric L is maintained by the bearers 43 and 44.

  As shown in FIG. 3, slide blocks 47 and 47 having a bearing function are provided on both sides of the rotary shaft 40 of the die cut roll 36, and these slide blocks 47 and 47 are provided on the frame plates F1 and F1, respectively. It is disposed in substantially U-shaped cutout portions 49, 49 formed in the plane. More specifically, the slide block 47 has a substantially H-shaped side end surface, and the upper and lower formation end portions 49A of the cutout portions 49 enter the upper and lower grooves 47A, so that the slide block 47 is moved to the frame plate. It is provided so that it cannot fall off in the direction perpendicular to the surface of F1. A spring member 51 is interposed between the slide block 47 and the U-shaped bottom portion 49B of the notch 49. In the presence of the spring member 51, the die cut roll 36 is separated from the die receiving roll 37. It is energized.

  The rollers 43 and 43 are respectively provided with rollers 53 and 53 that are in contact with the outer peripheral surface portion on the opposite side to the corresponding bearers 44 and 44 at two locations on the upper and lower sides. The rollers 53 are rotatably provided via bearings 55 and 55, and the bearings 55 and 55 are connected to each other via a connecting plate 56. The connecting plate 56 extends between the notches 49 formed on the respective surfaces of the frame plates F1 and F1, and is provided in the notch 49 so as to be movable in the left-right direction in FIG. The U-shaped open end side of the notch 49 is closed by a plate-like member 59 extending between the frame plates F1 and F1, and the surface of the connecting plate 56 is disposed at two longitudinal positions of the plate-like member 59. An adjustment handle 61 for moving the position in the left-right direction is provided. In the present embodiment, by rotating the adjustment handle 61 in the clockwise direction, the connecting plate 56 can be moved in the right direction in FIG. 1, and the rollers 53 and 53 of the bearings 55 and 55 fixed to the connecting plate 56 are moved. The die cut roll 36 can be moved to the die receiving roll 37 side against the urging force of the spring member 51 via the bearers 43, 43. The bearer 43 on the die cut roll 36 side and the bearer on the die receiving roll 37 side can be moved. 44 can be adjusted so as to be in contact with 44. On the other hand, the die cut roll 36 can be separated from the die receiving roll 37 by the urging force of the spring member 51 by rotating the adjustment handle 61 counterclockwise.

  In the present embodiment, the inspection device 14 provided on the upstream side in the feed direction of the original fabric L with respect to the position of the die cutting device 13 is provided at a position immediately before the guide roll 25. For example, an optical system sensor such as a CCD camera can be used as the inspection device 14, and it is preferable to employ a wide-angle sensor that can cover the area of the dicing tape DT with a single imaging. Moreover, even if it is a sensor of the type which cannot cover the area of the dicing tape DT, it does not matter even if it detects abnormality of the tape base material TB by imaging several times. Inspection data from the inspection device 14 is output to the control device. When there is no abnormality such as a scratch on the dicing tape DT, a cut C is formed by driving the die cutting device 13, while when an abnormality is detected, Based on the position data, the raw fabric L passes through the die-cutting device 13 so that the region where the abnormality exists is not included in the region of the cut C. Here, for example, when an abnormality is detected in a region where a single dicing tape DT is formed, the drive of the die cutting device 13 is stopped while maintaining the above-described clearance CL until the abnormal portion passes through. It will be.

  The original fabric L in which the cut C is formed in the lower unit 10A is supplied to the upper unit 10B via a pair of nip rolls 65 and 65 and a guide roll 66 supported by a support device (not shown).

  In the upper unit 10B, in the plane of the frame plate F2, a guide roll 70, a second dancer roll 71, a tension roll 72 and a pinch roll 73 that apply a predetermined tension to the original fabric L by a motor M3 capable of torque adjustment, a guide The peeling device 15 is disposed via the roll 74, and the dicing tape DT is sequentially peeled by the peeling device 15. Then, the original fabric L after the dicing tape DT is peeled off by the peeling device 15 is wound by the winding device 17 via the drive roll 76 and the nip roll 77, the third dancer roll 79, and the guide roll 80 driven by the motor M4. It has come to be taken.

  The second dancer roll 71 is provided so as to be movable along a vertically extending slot 82 provided in the plane of the frame plate F2. An upper sensor 84 and a lower sensor 85 for detecting the raised position and the lowered position of the second dancer roll 71 are provided at the upper and lower parts of the slot 82, respectively, and the raw roll L is fed out by driving the drive roll 76. When the upper sensor 84 detects the rising position of the second dancer roll 71, the web L is fed from the upstream side, and the second dancer roll 71 is lowered by its own weight. Then, when the lower sensor 85 detects the lowered position of the second dancer roll 71, the feeding of the original fabric L from the upstream side stops. The motor M3 urges the tension roll 72 in the anti-feeding direction so that the original fabric L between the tension roll 72 and the drive roll 76 has a predetermined tension.

  In the present embodiment, the peeling device 15 is constituted by a peel plate 87, and the dicing tape DT can be peeled from the original fabric L by rapidly reversing the feeding direction of the original fabric L at the tip position of the peel plate 87. Then, the dicing tape DT is affixed to the ring frame RF on the table 19 and the upper surface of the semiconductor wafer W that move in accordance with the peeling timing. At this time, a pressing roll 90 constituting a sticking device is disposed on the front end side of the peel plate 87, and the dicing tape DT peeled off by the pressing roll 90 is provided on the ring frame RF and the surface of the semiconductor wafer W with a predetermined amount. Affixing pressure is applied. Note that a sensor 91 is disposed on the front side of the pressing roll 90 (upstream side in the feeding direction of the original fabric L). The sensor 91 detects the leading position of the dicing tape DT in the feeding direction, and adjusts the movement timing of the table 19. Can be done.

  The third dancer roll 79 is provided so as to be movable along a vertically extending slot 92 provided in the plane of the frame plate F2. An upper sensor 94 and a lower sensor 95 for detecting the raised position and the lowered position of the third dancer roll 79 are provided at the upper part and the lower part of the slot 92, respectively, and the upper sensor 94 indicates the raised position of the third dancer roll 79. When detected, similarly to the first and second dancer rolls 23, 71, the third dancer roll 79 is controlled to descend by its own weight, while the lower sensor 95 is controlled by the third dancer roll 79. When the lowered position is detected, the take-up device 17 takes up the original fabric L. The winding device 17 includes a motor M5 and a winding shaft 97 connected to the motor M5.

  Next, the overall operation of the mounting apparatus 10 in this embodiment will be described.

  As an initial operation, the original fabric L is pulled out from the feeding device 11, and the lead end of the original fabric L is fixed to the winding shaft 97 of the winding device 17 as shown in FIG. On the other hand, the ring frame RF and the semiconductor wafer W are adsorbed on the upper surface of the table 19 and kept at a position indicated by a solid line in FIG. At the time of this initial work, the die cutting device 13 sets the outer peripheral area where the cutting blade 36A of the die cutting roll 36 does not exist to the die receiving roll 37 side to the initial position where the clearance CL is formed, and the raw fabric L passes through. Is maintained in an acceptable state.

  When the power is turned on, the control device controls the respective units of the upper and lower units 10A and 10B as a whole. That is, when the motors M1, M2, M3, M4 and M5 are driven to feed out the original fabric L, the first to third dancer rolls 23, 71 and 79 are reciprocated up and down to move the original fabric L. The original fabric L feeding operation is performed while keeping the tension of the sheet constant. In the feeding process, the inspection device 14 inspects the tape base material TB to inspect for the presence of scratches and dust. By this inspection, on condition that no abnormality is detected, the die cut roll 36 and the die receiving roll 37 rotate to cut the tape base material TB, and circular cuts C are sequentially formed in the tape base material TB. .

  Thus, the dicing tape DT is formed on the raw fabric L with the inner region of the cut C formed in the tape base material TB as the dicing tape DT. When the dicing tape DT is detected by the sensor 90 provided in the vicinity of the peel plate 87, the table 19 starts moving to the right in FIG. 1 at a preset timing, and is sequentially peeled off at the tip end position of the peel plate 87. The dicing tape DT is fed onto the ring frame RF and the semiconductor wafer and stuck by the pressing roll 90.

  Here, when the inspection device 14 detects an abnormality in the tape base material TB, it is determined by the control device based on the inspection data whether or not the abnormality portion belongs to the formation area of the dicing tape. That is, even if there is an abnormality in the position deviated from the formation area of the dicing tape DT, there is no problem in forming the cut C thereafter. On the other hand, if it is determined that the abnormality belongs to the formation area of the dicing tape DT, the die-cutting device 14 remains in a stopped state while allowing the original fabric L to pass through until the abnormal portion passes. After the passage of the abnormal portion, the dicing tape DT is formed at regular intervals by performing a rotation operation until the next abnormal portion is detected. In addition, when a plurality of abnormal portions are detected along the feed direction of the original fabric L and they belong to the formation area of one dicing tape DT, the die cutting device 13 until the last abnormal portion passes through the die cutting device 13. Will be stopped.

  Therefore, according to such an embodiment, the dicing tape DT is formed in the process of feeding the belt-shaped raw fabric L temporarily attached to the base sheet S with the tape base material TB, and then is attached to the ring frame RF and the semiconductor wafer W. Since it is set as the structure which carries out, the inconvenience at the time of using the original fabric which temporarily attached the dicing tape previously formed in the label form to the base sheet can be eliminated. In addition, when an abnormality such as a scratch is detected on the tape substrate TB, the dicing tape DT is formed by removing the abnormal portion to obtain the dicing tape DT having excellent surface accuracy. An effect is obtained that the dicing tape DT can be attached to the semiconductor wafer W with high accuracy.

Although the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but the embodiments described above are within the scope of the technical idea and scope of the invention. On the other hand, those skilled in the art can make various modifications in shape, material, quantity, and other detailed configurations.
Accordingly, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which excluded the limitation of all or part is included in this invention.

  For example, in the above-described embodiment, the case where the present invention is applied to a mounting apparatus that forms the dicing tape DT from the raw fabric L and attaches it to the ring frame RF and the semiconductor wafer W has been illustrated and described. However, the present invention is not limited to this, and may be applied to other adherends, for example, a tape applicator in which a compact disc (CD), a digital other-use disc (DVD), a display panel, glass or the like is used as an adherend. it can.

  In the above embodiment, the mount device 10 is configured as a two-stage configuration of the lower unit 10A and the upper unit 10B. However, the units 10A and 10B can be provided side by side or configured as a single unit. It is. However, when it is configured as separate units as in the above-described embodiment, versatility that allows these units to be separated and used as independent units is provided.

  Furthermore, in the said embodiment, although the die-cutting apparatus 13 was employ | adopted as a cutting apparatus which forms the cut C in the tape base material TB, it is another apparatus which forms the cut C using the rotary blade along the surface of the tape base material TB. There may be.

The schematic front view of the mounting apparatus in this embodiment. The principal part schematic plan view of a die-cut apparatus. The schematic perspective view of a die-cutting apparatus. The schematic perspective view of the die-cutting apparatus which shows the state which abbreviate | omitted the frame board. The schematic perspective view of a die-cut roll. The front view of a die cut roll and a die receiving roll.

Explanation of symbols

10 Mounting device (tape application device)
11 Feeding device 13 Die cutting device (cutting device)
DESCRIPTION OF SYMBOLS 14 Inspection apparatus 15 Peeling apparatus 16 Sticking apparatus 17 Winding apparatus C Cutting L Original fabric RF Ring frame (adhered body)
S Base sheet TB Tape base W Semiconductor wafer (Substrate)

Claims (3)

  1. A feeding device that feeds a strip-shaped raw material with a tape base material temporarily attached to one surface of a base sheet, and a tape for pasting by forming a closed-loop cut in the tape base material on the feeding route of the raw material A cutting device to be formed, a peeling device for peeling the sticking tape from the base sheet, a support for supporting a predetermined adherend and the peeling device are moved relative to each other to attach the sticking tape to the adherend. A sticking device for sticking, and a winding device for winding up the original fabric after peeling the sticking tape with the peeling device;
    A tape base material inspection device is disposed upstream of the cutting device in the feed direction of the original, and when this inspection device detects an abnormality of the tape base material, the abnormal portion is passed through the cutting device and pasted. A tape applicator characterized in that a tape is formed.
  2. In a mounting device that places a ring frame on a table and places a semiconductor wafer inside the ring frame, affixes a dicing tape to the ring frame and fixes the semiconductor wafer to the ring frame,
    Forming a dicing tape by forming a strip-shaped raw material with a tape base material temporarily attached to one surface of a base sheet, and forming a closed-loop cut in the tape base material on the raw material supply route A cutting device that peels off the dicing tape from the base sheet, a sticking device that sticks the dicing tape to a ring frame and a semiconductor wafer by relatively moving the table and the peeling device, and the peeling device And a winding device that winds up the original fabric after peeling the dicing tape with,
    A tape substrate inspection device is arranged upstream of the cutting device in the feed direction of the original, and when this inspection device detects an abnormality of the tape substrate, the abnormal portion is passed through the cutting device and dicing is performed. A mounting device for forming a tape.
  3. In the mounting method of placing a ring frame on a table, placing a semiconductor wafer inside the ring frame, and attaching a dicing tape to the ring frame to fix the semiconductor wafer to the ring frame,
    A step of inspecting whether there is an abnormality in the tape base material in the middle of feeding out the belt-like original fabric in which the tape base material is temporarily attached to one surface of the base sheet;
    A cutting process for forming a dicing tape by forming a closed-loop cut on the tape base material that has undergone the inspection process;
    Peeling the dicing tape from the base sheet and attaching the dicing tape to a ring frame and a semiconductor wafer;
    Winding the original fabric after peeling the dicing tape with the peeling device,
    A mounting method characterized in that, when an abnormality of a tape base material is detected in the inspection step, the cut is formed by excluding the abnormal portion.
JP2004258078A 2004-09-06 2004-09-06 Tape sticking device, mounting device, and mounting method Active JP4723216B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004258078A JP4723216B2 (en) 2004-09-06 2004-09-06 Tape sticking device, mounting device, and mounting method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004258078A JP4723216B2 (en) 2004-09-06 2004-09-06 Tape sticking device, mounting device, and mounting method
PCT/JP2005/015317 WO2006027953A1 (en) 2004-09-06 2005-08-24 Tape applicator, tape mounter, and tape mounting method
TW094129102A TW200618087A (en) 2004-09-06 2005-08-25 Tape pasting equipment, mounting equipment, and mounting method

Publications (2)

Publication Number Publication Date
JP2006073920A true JP2006073920A (en) 2006-03-16
JP4723216B2 JP4723216B2 (en) 2011-07-13

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TW (1) TW200618087A (en)
WO (1) WO2006027953A1 (en)

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JP2007307866A (en) * 2006-05-22 2007-11-29 Tokyo Seimitsu Co Ltd Tape sticking method and tape sticking apparatus
JP2007313765A (en) * 2006-05-26 2007-12-06 Lintec Corp Laminated sheet manufacturing device/method
JP2007317886A (en) * 2006-05-25 2007-12-06 Lintec Corp Sheet pasting device and sheet pasting method
JP2008098278A (en) * 2006-10-10 2008-04-24 Lintec Corp Sheet pasting device and pasting method
JP2008112789A (en) * 2006-10-30 2008-05-15 Lintec Corp Sheet pasting device, and sheet pasting method
JP2008117988A (en) * 2006-11-07 2008-05-22 Lintec Corp Method and device for pasting sheet
JP2008300760A (en) * 2007-06-04 2008-12-11 Lintec Corp Sheet pasting device
KR100874367B1 (en) 2007-01-15 2008-12-18 가부시키가이샤 신가와 A computer-readable recording medium recording the die bonder and the method of cutting and pasting the thermocompression tape pieces of the die bonder.
JP2009045698A (en) * 2007-08-21 2009-03-05 Lintec Corp Sheet cutter
JP2009132529A (en) * 2007-12-03 2009-06-18 Lintec Corp Sheet pasting device and its method
JP2011124369A (en) * 2009-12-10 2011-06-23 Nitto Denko Corp Adhesive tape joining method, and apparatus using the same
CN103545168A (en) * 2012-07-09 2014-01-29 日东电工株式会社 Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus
JP2014072229A (en) * 2012-09-27 2014-04-21 Lintec Corp Sheet sticking device and sheet sticking method
JP2015149510A (en) * 2015-05-15 2015-08-20 リンテック株式会社 sheet manufacturing apparatus and sheet sticking apparatus
EP2577720A4 (en) * 2010-05-27 2017-04-12 Suss MicroTec Lithography GmbH Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers

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JP4801018B2 (en) * 2007-07-31 2011-10-26 リンテック株式会社 Sheet pasting device

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JP2002151528A (en) * 2000-11-14 2002-05-24 Lintec Corp Die bonding sheet sticking device and method of sticking die bonding sheet
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JP2002151528A (en) * 2000-11-14 2002-05-24 Lintec Corp Die bonding sheet sticking device and method of sticking die bonding sheet
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JP2007307866A (en) * 2006-05-22 2007-11-29 Tokyo Seimitsu Co Ltd Tape sticking method and tape sticking apparatus
US8440040B2 (en) 2006-05-22 2013-05-14 Tokyo Seimitsu Co., Ltd. Tape adhering method and tape adhering device
JP2007317886A (en) * 2006-05-25 2007-12-06 Lintec Corp Sheet pasting device and sheet pasting method
JP4637057B2 (en) * 2006-05-25 2011-02-23 リンテック株式会社 Sheet sticking device and sticking method
JP2007313765A (en) * 2006-05-26 2007-12-06 Lintec Corp Laminated sheet manufacturing device/method
JP2008098278A (en) * 2006-10-10 2008-04-24 Lintec Corp Sheet pasting device and pasting method
JP2008112789A (en) * 2006-10-30 2008-05-15 Lintec Corp Sheet pasting device, and sheet pasting method
JP4616231B2 (en) * 2006-10-30 2011-01-19 リンテック株式会社 Sheet sticking device and sticking method
JP2008117988A (en) * 2006-11-07 2008-05-22 Lintec Corp Method and device for pasting sheet
KR100874367B1 (en) 2007-01-15 2008-12-18 가부시키가이샤 신가와 A computer-readable recording medium recording the die bonder and the method of cutting and pasting the thermocompression tape pieces of the die bonder.
JP2008300760A (en) * 2007-06-04 2008-12-11 Lintec Corp Sheet pasting device
JP4713541B2 (en) * 2007-06-04 2011-06-29 リンテック株式会社 Sheet pasting device
JP2009045698A (en) * 2007-08-21 2009-03-05 Lintec Corp Sheet cutter
JP2009132529A (en) * 2007-12-03 2009-06-18 Lintec Corp Sheet pasting device and its method
JP2011124369A (en) * 2009-12-10 2011-06-23 Nitto Denko Corp Adhesive tape joining method, and apparatus using the same
EP2577720A4 (en) * 2010-05-27 2017-04-12 Suss MicroTec Lithography GmbH Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
CN103545168A (en) * 2012-07-09 2014-01-29 日东电工株式会社 Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus
TWI614826B (en) * 2012-07-09 2018-02-11 日東電工股份有限公司 Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus
JP2014072229A (en) * 2012-09-27 2014-04-21 Lintec Corp Sheet sticking device and sheet sticking method
JP2015149510A (en) * 2015-05-15 2015-08-20 リンテック株式会社 sheet manufacturing apparatus and sheet sticking apparatus

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WO2006027953A1 (en) 2006-03-16
JP4723216B2 (en) 2011-07-13

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