JP4637057B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and in particular, when sticking a heat-sensitive adhesive sheet to a plate-like member such as a semiconductor wafer, the sheet sticking apparatus capable of sticking according to the shape of the plate-like member. And an affixing method.

  A semiconductor wafer (hereinafter simply referred to as a “wafer”) on which a circuit surface is formed is divided into chips, and each chip is picked up and bonded to a lead frame (die bonding). A heat-sensitive adhesive sheet for die bonding is applied in advance to the wafer back surface.

  As an apparatus for attaching the above-mentioned adhesive sheet to a wafer, for example, as disclosed in Patent Document 1, a raw material in which a belt-like adhesive sheet is temporarily attached to a belt-like release sheet is used to peel the adhesive sheet from the release sheet. A configuration is known in which an adhesive sheet is attached to a wafer and then cut along the outer periphery of the wafer. Further, as disclosed in Patent Document 2, there is also known a configuration in which a sheet-like adhesive sheet previously provided in a planar shape corresponding to the wafer outer shape is peeled off from the release sheet and attached to the wafer.

JP 2003-257898 A JP-A-7-195527

  However, in the configuration of Patent Document 1, since the outer peripheral cut after the adhesive sheet is attached is a configuration in which the cutter blade is moved along the outer periphery of the wafer, the movement of the cutter blade must be managed with high accuracy. In addition, there is a disadvantage that the outer periphery of the wafer is easily damaged in order to make the cutting position coincide with the outer periphery of the wafer.

  On the other hand, when a sheet-like adhesive sheet formed in advance corresponding to the wafer shape is affixed to the wafer, particularly when the adhesive sheet is heat-sensitive adhesive, the affixing roller rotates on the wafer. When the relative movement is performed, the adhesive sheet is extended along the moving direction, and the diameter of the adhesive sheet along the moving direction is enlarged to cause partial protrusion of the sheet from the outer periphery of the wafer. This is due to the fact that the adhesive sheet is heated, pressed by the application roller, and further applied with tension to apply it to each other to apply stretching force to the adhesive sheet.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to form a sticking sheet in the course of feeding out the adhesive sheet, and a stretching force is applied to the sticking sheet at the time of sticking. However, an object of the present invention is to provide a sheet sticking device and a sticking method capable of sticking a sticking sheet so as not to cause partial protrusion.

In order to achieve the above object, the present invention provides a sheet sticking apparatus for peeling a sticking sheet from a peeling sheet and sticking it to a plate member.
Wherein the release sheet to the adhesive sheet feed the raw band-shaped, which is temporarily stuck and feeding device, a cutting device for forming a sticking sheet wherein the adhesive sheet provided with a notch in a closed loop in the middle of feeding the raw, A sticking unit that peels the sticking sheet from the release sheet and sticks it to the plate member;
The cutting device includes a closed-loop cutting blade that forms the incision, and the size of the closed loop of the cutting blade is determined in consideration of sheet extension when applying an external force to the application sheet and applying the external force to the application sheet. Provided smaller than the member ,
The plate-like member has a substantially circular semiconductor wafer, the cutting blade, the take a configuration that is Ru, is set smaller than the diameter of the diameter along the feeding direction of the raw is along the feeding direction of the semiconductor wafer Yes.

Further, the present invention provides a sheet sticking apparatus for peeling a sticking sheet from a release sheet and sticking it to a plate member.
A feeding device for feeding out a strip-shaped original fabric in which an adhesive sheet is temporarily attached to the release sheet; a cutting device for forming an adhesive sheet by providing a closed-loop cut in the adhesive sheet in the course of feeding the original fabric; A sticking unit that peels the sticking sheet from the release sheet and sticks it to the plate member;
The cutting device includes a roller shaft and a die cut roller including a closed-loop cutting blade that is provided on an outer periphery of the roller shaft and forms the incision, and a platen roller attached to the die-cutting roller, and the closed loop of the cutting blade The size of is provided smaller than the plate-like member in anticipation of sheet extension when applying and applying an external force to the sticking sheet,
The cutting blade is configured to be replaceable according to the size of the plate-like member, and adopts a configuration in which the raw fabric feeding speed of the feeding device and the rotational speed of the die cut roller are controlled independently.

Furthermore, before Symbol sticking unit may be configured to include an application roller for applying a pressing force while applying heat to the sticking sheet.

Furthermore, the present invention is, after forming the sticking sheet provided cuts closed loop to the adhesive sheet in the course of feeding the raw strip-shaped adhesive sheet to release sheet is temporarily stuck, said the sticking sheet In the sheet sticking method of peeling from the release sheet and sticking to the plate member,
The incision is formed so that the sticking sheet is smaller than the size of the plate member,
By using the extension of the adhesive sheet when affixed to the plate member while the external force to the sticking sheet, the sticking sheet is stuck to match the size of the plate-like member, the method of Adopted.

Further, the present invention provides a method for forming an adhesive sheet by providing a closed loop cut in the adhesive sheet in the course of feeding a belt-like raw material having an adhesive sheet temporarily attached to the release sheet, and then removing the adhesive sheet from the release sheet. in the sheet sticking method for sticking a substantially circular semiconductor wafer der Ru plate member was peeled off from the sheet,
The sticking sheet is smaller than the size of the plate-like member, and the diameter along the feeding direction of the original fabric is formed along a substantially elliptical locus smaller than the diameter along the feeding direction of the semiconductor wafer. the incision was formed keep as that,
A method in which the sticking sheet is attached in accordance with the size of the plate-like member by utilizing the extension of the sticking sheet when sticking to the plate-like member while applying an external force to the sticking sheet. Adopted.
Further, in the middle of feeding the strip-shaped raw material with the adhesive sheet temporarily attached to the release sheet, the adhesive sheet is provided with a closed loop cut by a cutting device including a die cut roller, and then the adhesive sheet is formed. In the sheet sticking method of peeling the sheet from the release sheet and sticking it to the plate member,
By independently controlling the rotational speed of the die cut roller and the feed speed of the original fabric, the size of the sticking sheet in the original fabric feeding direction is adjusted, and the sticking sheet is larger than the size of the plate-like member. The notch is formed so that the
A method in which the sticking sheet is attached in accordance with the size of the plate-like member by utilizing the extension of the sticking sheet when sticking to the plate-like member while applying an external force to the sticking sheet. Adopted.

  Moreover, it is good to take the method that the size of the sheet | seat for sticking formed by the said notch is provided so that change is possible according to the magnitude | size of a plate-shaped member.

  According to the present invention, since the notch is formed so as to have a small size with an expectation of an extension when pressing and sticking the sticking sheet to the plate-like member in advance, external forces such as heat, pressing force, and tension are used. Even if elongation occurs due to the application of, it is possible to prevent the possibility of protruding to the outside of the plate-like member. In particular, the effect of applying a pressing force using a heated sticking roller such as a heat-sensitive adhesive sheet is even higher.

  In addition, the cutting blade having a closed loop shape is provided on the outer periphery of the roller shaft. However, in the state where the cutting blade is developed on a plane, the diameter of the cutting blade along the feeding direction is the diameter along the feeding direction of the semiconductor wafer. Therefore, if the diameter of the cutting blade can be adjusted along the feeding direction, even if the expected extension varies depending on the sheet characteristics, it matches the size of the plate-like member. In this state, the sticking sheet can be stuck.

  Furthermore, since the cutting blade can be exchanged according to the size of the plate-like member, it can be applied to plate-like members having different sizes, and a versatile sheet pasting device can be provided. .

  Moreover, since the original fabric feeding speed of the feeding device and the rotational speed of the die cut roller can be controlled independently, it is possible to adjust the size of the sticking sheet by changing the feeding speed of the original fabric. That is, when the cutting blade is set so that the diameter along the feeding direction is smaller than the diameter along the feeding direction of the semiconductor wafer, the degree of making the feeding speed of the original fabric faster than the rotational speed of the die cut roller is increased. In addition, while the length, that is, the diameter of the sticking sheet along the feeding direction can be increased, when the degree is reduced, the diameter of the sticking sheet along the feeding direction can be reduced. Therefore, by allowing these speed adjustments and the shape of the cutting blade to interact, the length of the sticking sheet along the feeding direction can be finely adjusted. Adhesive sheets with different elongation rates and adhesive sheets with different sticking temperatures can be used. Even if it is adopted, it can be handled.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment, and FIG. 2 shows a schematic perspective view thereof. In these drawings, the sheet sticking apparatus 10 is formed by cutting a heat-sensitive adhesive sheet LS temporarily attached to the release sheet PS, with a substantially circular wafer W as a plate-like member being attached. The apparatus is configured as an apparatus for attaching the sticking sheet S to the back side (upper side in FIG. 1) of the wafer W. The sheet sticking apparatus 10 includes a table 12 that supports the wafer W substantially horizontally and a sticking unit 13 that sticks the sticking sheet S on the upper surface side of the wafer W.

  The table 12 is provided so as to be movable up and down via a lifting device 14. The table 12 has an upper surface as an adsorption surface, and is provided so as to adsorb the circuit surface side (lower surface side) of the wafer W and support the wafer W. Although not shown here, the wafer W is supported with a protective tape applied to the circuit surface side to prevent damage to the circuit surface. The table 12 includes a heater for heating the wafer W to a constant temperature, and is provided so as to be movable in the Y-axis direction shown in FIG. 2 via a driving device (not shown). Thus, the position of the wafer W in the Y-axis direction can be adjusted.

  The table 12 is provided so as to reciprocate in the X-axis direction in FIG. The moving device 15 is screwed into a slide plate 16 that supports the table 12, a pair of rails 17 that guide the slide plate 16 to be movable in the X-axis direction, and a nut 19 that is fixed to the slide plate 16. And a motor M1 that rotationally drives the ball screw shaft 20. In the ball screw shaft 20, the opposite end portion of the motor M 1 is rotatably supported by the bearing 22, whereby the table 12 reciprocates along the rail 17 in the X-axis direction when the motor M 1 is driven to rotate forward and backward. Will move. When the table 12 is located on the left side in FIG. 1, the table 12 receives the wafer W via a transfer arm or the like (not shown), and moves to the right side in FIG. An affixing sheet S is affixed.

  The pasting unit 13 is composed of a sheet feeding portion 25 supported in a plate-like frame F and a pasting head 26 provided therewith. The sheet feeding portion 25 has an outer shape that approximates the outer shape of the wafer W, and a support roller 27 that supports the roll-shaped original fabric L in which the belt-like adhesive sheet LS is temporarily attached to the belt-like release sheet PS. A cutting device 28 for forming the adhesive sheet LS by forming a closed loop cut C (see FIG. 2) in the adhesive sheet LS, and an outer peripheral side of the adhesive sheet LS after the adhesive sheet S is formed is unnecessary adhesive sheet A collecting roller 30 that winds and collects as S1, a dancer roller 32 that is provided alongside the collecting roller 30 to secure a buffer area, and is disposed on the feed path of the original fabric L after passing through the position of the dancer roller 32 for pasting. A winding means for winding the release sheet PS after affixing the adhesive sheet S on the wafer W with a predetermined tension via the adhering head 26 and a detecting means 35 for detecting the position of the sheet S It is constituted by a chromatography La 36.

  The cutting device 28 includes a die cut roller 39 including a roller shaft 37 and a closed-loop cutting blade 38 provided on the outer periphery of the roller shaft 37, and a platen roller that acts as a drive roller attached to the die cut roller 39. 40. The die-cut roller 39 has a cutting blade 38 formed by etching the surface of a metal plate that can be wound around the outer peripheral surface of the roller shaft 37, and the cutting blade 38 is removed by removing the metal plate from the roller shaft 37. 38 can be exchanged. Therefore, when the size of the wafer W is changed, the wafer W is replaced with one having a cutting blade capable of forming a cut corresponding thereto. In this cutting blade 38, as shown in FIG. 4 developed in a plane, the diameter D1 along the feeding direction of the original fabric L is smaller than the diameter D2 along the direction orthogonal to the direction (vertical direction in the figure). It is provided in a closed loop shape along a substantially elliptical locus. Here, the diameter D1 is smaller than the diameter of the wafer W, the diameter D2 is set to a dimension that substantially matches the diameter of the wafer W, and the difference between D2 and D1 is that the sticking sheet S is attached to the wafer W. Accordingly, when the sticking sheet S is stuck on the wafer W, the sticking sheet S is stuck to the size of the wafer W without protruding from the wafer W. It will be. Incidentally, as shown in FIG. 5, the state in which the cutting blade 38 forms the cut C in the adhesive sheet LS appears in an elliptical shape with respect to a virtual circle indicated by a two-dot chain line.

  Between the support roller 27 and the platen roller 40, a first drive roller 42, a pinch roller 43 in contact therewith, and a guide roller 44 are provided. The first drive roller 42 and the platen roller 40 are supported by output shafts of motors M2 and M3 disposed on the back side of the frame F. Further, between the platen roller 40 and the collection roller 30, a guide roller 45, a second drive roller 46 supported by the output shaft of the motor M4, a pinch roller 47 in contact therewith, and an output shaft of the motor M5. A third driving roller 50 supported by the second driving roller 50 and a pinch roller 52 interposed between the third driving roller 50 and the collecting roller 30 are disposed.

  Further, on the downstream side of the dancer roller 32, a fourth drive roller 53 and a pinch roller 55 supported by the output shaft of the motor M6, and a guide roller 56 are disposed, and an upstream side of the winding roller 36. A fifth driving roller 58 driven by a motor M7 and a pinch roller 59 in contact therewith are arranged. The winding roller 36 is rotationally driven by a motor M8. Here, the first driving roller 42, the platen roller 40 acting as the driving roller, the second driving roller 46, and the motors M2, M3, and M4 that rotationally drive these components constitute the feeding device 60 for the original fabric L. Further, the first driving roller 42, the platen roller 40, and the second driving roller 46 are provided such that the rotation speed is controlled independently. Therefore, by appropriately adjusting the rotation speed of each roller, it is possible to perform fine adjustment by forming a cut C in the direction of expanding or reducing the diameter D1 of the cutting blade 38.

  The sticking head 26 is supported by a single-axis robot 70 extending in the X-axis direction and extends in the X-axis direction so as to support a moving arm 71 extending in the Y-axis direction and an end side of the moving arm 71 opposite to the single-axis robot 70. An extending rail 73, a pair of vertical cylinders 75 provided at two positions on the upper surface of the moving arm 71, and a piston rod 76 (see FIG. 3) of the vertical cylinder 75 disposed on the lower surface side of the moving arm 71 are moved forward and backward. And a pasting roller 80 rotatably supported by the portal frame 78, and the single-axis robot 70 is operated to move the moving arm 71 in the X-axis direction. As a result, the application sheet S that rotates around the outer periphery of the application roller 80 is pressed against the wafer W and applied. Here, the application roller 80 is configured as a built-in heater type, and the application sheet S is applied to the wafer W while being heated by the application roller 80.

  On both sides of the portal frame 78, a plate-like bracket 82 directed in a substantially vertical plane is fixed, and guide rollers 83 and 84 are supported on the upper and lower sides of the bracket 82 on the right side in FIG. Yes. A substantially L-shaped link 85 is swingably mounted around the rotation center axis of the guide roller 83, and a tension roller 87 is supported on one end side, while the other end side A piston rod 89 of an air cylinder 88 fixed to the upper surface of the moving arm 71 is connected. Accordingly, when the piston rod 89 advances and retreats, the tension roller 87 is rotatably provided with the rotation center axis of the guide roller 83 as the rotation center, whereby a predetermined length L is provided between the guide roller 83 and the application roller 61. The tension is applied.

  The detection means 35 includes a rod-like support member 90 protruding from the surface of the frame F, and a pair of sensors 91 and 92 attached to two places in the longitudinal direction of the support member 90. These sensors 91 and 92 are arranged at equal left and right positions with respect to the reference center line along the feeding direction of the original fabric L, and the chord length of the sticking sheet S along the reference center line is detected to detect the sticking sheet. It is detected whether or not S is shifted to the left or right, and when the shift is detected, the table 12 is moved in the Y-axis direction, and the relative position shift between the wafer W and the adhesive sheet in the Y-axis direction is detected. Is configured to prevent. This configuration is disclosed in Japanese Patent Application No. 2005-218543 already proposed by the present applicant, and therefore detailed description thereof is omitted here.

  Next, the sticking operation of the sticking sheet S in the present embodiment will be described.

  The wafer W is transferred to the heated table 12, and the sticking sheet S is stuck to the wafer W while the table 12 is moved below the sticking head 26.

  In the pasting unit 13, the raw fabric L is fed out. At the time of the feeding, the feeding speed of the original fabric L by the first driving roller 42 and the second driving roller 46 is set faster than the rotational speed of the die cut roller 39 that is driven to rotate by the platen roller 40. As a result, a region surrounded by the cuts C in the adhesive sheet LS is formed as the sticking sheet S (see FIG. 5).

  The unnecessary adhesive sheet S1 generated by the cut C is sequentially wound and collected by the collection roller 30, and the original fabric in a state where the adhesive sheet S is temporarily attached to the release sheet PS on the downstream side in the feeding direction from the third drive roller 50. Are fed out sequentially. Here, the detection means 35 detects the positional deviation of the sticking sheet S in the lateral direction, and the table 12 moves in the Y-axis direction shown in FIG. 2 according to the deviation amount.

  The application sheet S is applied to the wafer W with a predetermined tension applied by the tension roller 87 while being heated and pressed by the application roller 80. That is, as shown in FIGS. 6A to 6D, the lead end SE of the sticking sheet S is fed out to a position that coincides with the right end of the wafer W in the drawing (see FIG. 6A). In this state, the sticking roller 80 is lowered via the vertical movement cylinder 75 to bring the lead end SE into contact with the right end of the wafer W (see FIG. 6B). Next, the sticking roller 80 presses and sticks the sticking sheet S to the wafer W while the sticking sheet S is fed out by moving the moving arm 71 toward the opposite side in the radial direction of the wafer W (see FIG. 6 (D)). At this time, as described above, since the diameter D1 along the feeding direction of the sticking sheet S is smaller than the wafer diameter, the length when there is no stretching along the feeding direction of the sticking sheet S is shortened. Although an unapplied area is generated at the wafer edge, the application sheet S is given a predetermined tension while being heated and pressed by the application roller 80 and slightly stretched in the feeding direction. Accordingly, since the cut C is formed so as to have the diameter D1 in consideration of the stretched portion, the sticking sheet S is stuck in a state matching the size of the wafer W in the sticking completion state. . Here, when the sticking sheet S is not sufficiently stretched, it is only necessary to increase the degree at which the feed speed of the first and second drive rollers 42 and 46 is faster than the rotational speed of the die cut roller 39. If the stretching is too large, the degree may be reduced.

  Therefore, according to such an embodiment, even if the sticking sheet S is stretched in the feeding direction by an external force such as heating, pressing force, or tension, the sticking sheet S does not protrude from the outer periphery of the wafer W, and the size of the wafer W is not large. In this case, when the sheet S for bonding is a heat-sensitive adhesive sheet for die bonding, it is possible to prevent the possibility of bonding failure or the like.

  Moreover, since the sticking sheet S is stuck by receiving a pressing force through the release sheet PS, it is possible to prevent damage due to direct contact of the sticking roller 80.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the die bonding bonding sheet S having heat-sensitive adhesiveness is illustrated and described as an apparatus for applying to the wafer W. However, other sheets, for example, pressure-sensitive adhesive bonding sheets, may be used. May be. Further, the present invention can also be applied when a dry resist film, a protective film forming sheet, or the like is attached to the wafer W. In short, the present invention can be used as a response device in the case where the sticking sheet is extended by applying external force such as heat, pressing force, and tension.

  Moreover, although the said embodiment demonstrated the structure which affixes the sheet | seat S for affixing on the wafer W, it is applicable also to the structure which affixes a sheet | seat and a film on plate-like members other than the wafer W. FIG.

  Furthermore, the sticking sheet S may be configured to be pressed by a sticking roller that can move relative to the wafer W while being peeled off via a peel plate.

The schematic front view which shows the whole structure of the sheet sticking apparatus which concerns on this embodiment. The schematic perspective view of the sheet sticking apparatus which shows the state before sticking the sheet | seat for sticking on a wafer. The schematic perspective view of the sheet sticking apparatus which shows the state which has stuck the sheet | seat for sticking on the wafer. The expansion | deployment top view of a die-cut roller. The top view which shows the state which formed the cut | notch C in the adhesive sheet. Explanatory drawing which shows the sticking operation | movement of the sheet | seat for sticking.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking device 13 Sticking unit 28 Cutting device 37 Roller shaft 38 Cutting blade 60 Feeding device L Raw material S Adhesive sheet PS Release sheet LS Adhesive sheet W Semiconductor wafer (plate-like member)

Claims (7)

In the sheet sticking device for peeling the sticking sheet from the peeling sheet and sticking it to the plate member,
Wherein the release sheet to the adhesive sheet feed the raw band-shaped, which is temporarily stuck and feeding device, a cutting device for forming a sticking sheet wherein the adhesive sheet provided with a notch in a closed loop in the middle of feeding the raw, A sticking unit that peels the sticking sheet from the release sheet and sticks it to the plate member;
The cutting device includes a closed-loop cutting blade that forms the incision, and the size of the closed loop of the cutting blade is determined in consideration of sheet extension when applying an external force to the application sheet and applying the external force to the application sheet. Provided smaller than the member ,
The plate-like member is a substantially circular semiconductor wafer, and the cutting blade is set such that a diameter along the feeding direction of the original fabric is set smaller than a diameter along the feeding direction of the semiconductor wafer. Sheet pasting device. In the sheet sticking device for peeling the sticking sheet from the peeling sheet and sticking it to the plate member,
A feeding device for feeding out a strip-shaped original fabric in which an adhesive sheet is temporarily attached to the release sheet; a cutting device for forming a sticking sheet by providing a closed-loop cut in the adhesive sheet in the course of feeding the original fabric; and A sticking unit that peels the sticking sheet from the release sheet and sticks it to the plate member;
The cutting device includes a roller shaft and a die cut roller including a closed loop-shaped cutting blade that is provided on an outer periphery of the roller shaft and forms the incision, and a platen roller attached to the die cutting roller, and the closed loop of the cutting blade The size of is provided smaller than the plate-like member in anticipation of sheet extension when applying and applying an external force to the sticking sheet,
The cutting blade is provided so as to be replaceable according to the size of the plate-like member, and the sheet feeding device and the rotation speed of the die cut roller of the feeding device are independently controlled. . Before SL sticking unit, the sheet sticking apparatus according to claim 1 or 2, characterized in that it is configured to include a joining roller for applying a pressing force while applying heat to the sticking sheet. After adhered to the release sheet sheet to form a sticking sheet provided cuts closed loop to the adhesive sheet in the course of feeding the raw band-shaped, which is temporarily stuck and peeled off the sticking sheet from the release sheet In the sheet affixing method to affix to the plate member,
The incision is formed so that the sticking sheet is smaller than the size of the plate member,
By using the extension of the adhesive sheet when affixed to the plate member while the external force to the sticking sheet, and characterized in that the sticking sheet is stuck to match the size of the plate-like member Sheet sticking method to do. In the middle of feeding the strip-shaped raw material on which the adhesive sheet is temporarily attached to the release sheet, the adhesive sheet is provided with a closed loop-shaped cut to form an adhesive sheet, and then the adhesive sheet is peeled off from the release sheet. In the sheet sticking method for sticking to a plate-like member that is a circular semiconductor wafer,
The sticking sheet is smaller than the size of the plate-like member, and the diameter along the feeding direction of the original fabric is formed along a substantially elliptical locus smaller than the diameter along the feeding direction of the semiconductor wafer. So that the notches are formed,
By using the extension of the sticking sheet when sticking to the plate-like member while applying external force to the sticking sheet, the sticking sheet is stuck in accordance with the size of the plate-like member, Sheet sticking method to do. In the middle of feeding the strip-shaped raw material on which the adhesive sheet is temporarily attached to the release sheet, the adhesive sheet is provided with a closed-loop cut by a cutting device including a die cut roller, and then the adhesive sheet is formed. In the sheet sticking method of peeling from the release sheet and sticking to the plate member,
By independently controlling the rotational speed of the die cut roller and the feed speed of the original fabric, the size of the sticking sheet in the original fabric feeding direction is adjusted, and the sticking sheet is larger than the size of the plate-like member. The notch is formed so that the
By using the extension of the sticking sheet when sticking to the plate-like member while applying external force to the sticking sheet, the sticking sheet is stuck in accordance with the size of the plate-like member, Sheet sticking method to do. The sheet sticking method according to claim 4, 5 or 6, wherein the size of the sticking sheet formed by the cutting is provided so as to be changeable according to the size of the plate-like member.

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