WO2005104221A1 - Apparatus and method for sticking sheet - Google Patents

Apparatus and method for sticking sheet Download PDF

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Publication number
WO2005104221A1
WO2005104221A1 PCT/JP2005/007122 JP2005007122W WO2005104221A1 WO 2005104221 A1 WO2005104221 A1 WO 2005104221A1 JP 2005007122 W JP2005007122 W JP 2005007122W WO 2005104221 A1 WO2005104221 A1 WO 2005104221A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
peeling
cutting
area
sticking
Prior art date
Application number
PCT/JP2005/007122
Other languages
French (fr)
Japanese (ja)
Inventor
Hideaki Nonaka
Kenji Kobayashi
Takahiro Yamamoto
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004122624A external-priority patent/JP4430973B2/en
Priority claimed from JP2004122625A external-priority patent/JP4509635B2/en
Priority claimed from JP2004122623A external-priority patent/JP2005305567A/en
Priority claimed from JP2004122622A external-priority patent/JP4528553B2/en
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2005104221A1 publication Critical patent/WO2005104221A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Definitions

  • the present invention relates to a sheet sticking apparatus and a sheet sticking method, and more particularly, to a sheet-like laminated sheet provided on one surface of a strip-shaped base sheet, in which a cut is provided, and a sticking area obtained by the cut is provided.
  • the present invention relates to a sheet sticking apparatus and a sheet sticking method capable of sticking a sheet to an adherend such as a semiconductor wafer with high accuracy.
  • wafer After a semiconductor wafer on which a circuit surface is formed (hereinafter, simply referred to as a "wafer") is divided into chips, each chip is picked up and bonded (die-bonded) to a lead frame. Has been done. This die bonding is performed in a wafer processing step by cutting a heat-sensitive adhesive die bonding sheet laminated on one surface of a base sheet and attaching it to a semiconductor wafer.
  • Such a sheet sticking apparatus is disclosed, for example, in Patent Document 1 already proposed by the present applicant.
  • the sheet sticking apparatus disclosed in the document includes a sticking table that supports a wafer, a die bonding sheet that is cut in accordance with the planar shape of the wafer, and a sticking area that is stuck to the wafer.
  • Cutting means for cutting the die bonding sheet in the width direction at a predetermined distance away from the upstream side; first peeling means for peeling off the remaining area of the die bonding sheet forming an outer peripheral area surrounding the attaching area; And a second peeling means for peeling off the base sheet.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-367931
  • Patent Document 1 the configuration disclosed in Patent Document 1 is configured such that the die bonding sheet on the outer peripheral side excluding the sticking area is peeled off by the first peeling means.
  • the movement area of the device required for separation becomes large and the positional relationship with other devices becomes complicated. Such disadvantages become more apparent as the size of the wafer increases.
  • the cutting blade forming the cutting means is constituted by a Thomson blade formed by attaching a single blade to a base plate in a closed loop shape, so that the cutting blade extends in the direction in which the blade extends.
  • An inevitable seam is formed at the joint between the ends along the edge, and the blade in the seam area is liable to be damaged, such as a crack, and cutting at the seam area cannot be completely performed by repeated continuous use. There is also a disadvantage.
  • a semiconductor device has been manufactured using a mounting method called V, so-called face-down.
  • a protrusion called a bump is formed on the circuit surface side of the chip to secure electrical continuity.
  • Patent Document 1 has a disadvantage that the wafer having bumps cannot be used as an adherend because it has a structure in which a region along the outer peripheral edge of the wafer is sucked. .
  • the present invention has been devised in view of such inconvenience, and an object thereof is to enable cutting, pasting, peeling, and the like to be performed at a work center which is a common processing position, and a means for realizing these is provided. It is an object of the present invention to provide a sheet sticking means and a sheet sticking method which enable a center work system capable of alternately separating and approaching the processing position.
  • an object of the present invention is to minimize the peeling area when peeling the laminated sheet surrounding the outside of the sticking area after forming the sticking area according to the planar shape of the adherend. It is an object of the present invention to provide a sheet sticking apparatus and a sheet sticking method capable of achieving a simplified peeling device and reducing a moving area of each part of the device required for peeling.
  • Another object of the present invention is to enable cutting without forming a seam, to reliably cut a laminated sheet to be stuck, and to stick the stuck area to an adherend when the stuck area is outside. It is an object of the present invention to provide a sheet sticking apparatus and a sticking method which do not lead to a laminated sheet region surrounding the sheet. [0011] Further, still another object of the present invention is to provide a method for manufacturing an adhesive sheet that includes a projection or the like near the outer edge of an adherend on the surface of the adherend opposite to the surface to which the adhesive sheet is attached. An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method capable of supporting an attached body and expanding an applicable range. Means for solving the problem
  • the present invention provides a sheet base including a band-shaped continuous base sheet and a lamination sheet for attachment provided on one surface of the base sheet.
  • the laminated sheet is cut into the planar shape of the adherend to form a sticking area, and the sheet sticking apparatus sticks the sticking area to the adherend! ⁇
  • the means for storing the adherends The conveying means for taking out and transporting the adherends one by one, and cutting the laminated sheet according to the planar shape of the adherend to form the attaching area, and A cutting means for forming a peeled area by cutting the front and rear of the laminated sheet in the width direction at a position adjacent to the area, a first peeling means for peeling the peeled area, and supporting the adherend. And an attaching means including an attaching table for attaching the attaching area to the adherend, and a second removing means for removing the base sheet from the attaching area.
  • the transporting means, the cutting means, the attaching means, the first and second peeling means can be moved without interfering with each other as a work center at a common processing position set in advance with respect to the sequentially fed sheet base material. It is provided with a structure of t.
  • the cutting means may include a first cutting blade provided in an endless shape along an outer edge of the adherend, and a feeding direction of the sheet substrate more than the first cutting blade.
  • a second cutting blade that cuts the laminated sheet in the width direction at a position distant to the upstream side, and the second cutting blade that is continuous with the first cutting blade and downstream of the second cutting blade in the feeding direction.
  • a third cutting blade arranged substantially in parallel with the cutting blade,
  • the pasting area is formed by the first cutting blade, and the peeling area is formed by a part of the first cutting blade and the second and third cutting blades. After peeling by the peeling means, it is possible to adopt a configuration in which the sticking area is stuck to the adherend.
  • first cutting blade and the third cutting blade are provided so as to be continuous with each other without a seam. Have been killed.
  • the cutting means may further include a table, and the first, second, and third cutting blades may be integrally formed on the upper surface of the table.
  • first, second and third cutting blades may be formed by etching the upper surface of the table.
  • the first peeling means includes a peeling head that supports the peeling tape so as to be rotatable in a width direction crossing the feeding direction of the sheet base material, and places the peeling tape in the peeling area.
  • a configuration is adopted in which the separation area is separated from the base sheet by bonding and rotating the separation tape.
  • the first peeling head is formed of a heat block, and the heat block is provided so as to thermally bond the peeling tape to a peeling region.
  • the heat blocks are arranged at a plurality of locations along the width direction of the peeling region.
  • the adherend is a semiconductor wafer having a surface provided with bumps
  • the bonding table does not interfere with the bumps, and includes a closed loop-shaped convex ring portion along the outer edge of the wafer.
  • the configuration is adopted.
  • the height of the convex portion of the convex ring portion may be set to a height substantially corresponding to the height of the bump.
  • the inside of the convex ring portion is configured as a suction space for a semiconductor wafer, and the elastic member is formed as a molding material.
  • the adherend may be a semiconductor wafer
  • the laminated sheet may be a heat-sensitive adhesive bonding sheet.
  • the present invention uses a sheet base including a base sheet continuous in a strip shape and a laminated sheet for attachment provided on one surface of the base sheet, and feeds out the sheet base.
  • a sheet sticking method in which a laminated sheet is cut into a planar shape of an adherend in a process to form an adhered region, and the adhered region is adhered to the adherend,
  • the cutting step includes a first cutting in which the laminated sheet is cut along the outer edge of the adherend without a seam to form an attachment area, and an upstream side in the feeding direction of the sheet substrate from the first cutting position.
  • the first and third cuts are provided so as to be continuous without a seam.
  • the cutting, the pasting of the pasting area, and the first and second peeling are performed by setting a common processing position set in advance in a state where the feeding of the base sheet is stopped. It is performed in a sequential manner.
  • each means constituting the sheet sticking apparatus has a center work system in which a predetermined operation is performed at a preset position in a state where the feeding of the sheet substrate is stopped.
  • the feeding means for holding the material can be kept at a fixed position. Therefore, in each of the cutting step, the peeling step, and the sticking step, highly accurate sheet sticking becomes possible while effectively avoiding a tension change that may occur on the sheet substrate side.
  • the peeling region is only a portion formed on the upstream side along the feeding direction in the entire outer periphery of the sticking region, the peeling structure can be made simpler than the conventional peeling structure.
  • the peeling region has a flaky shape along the width direction of the laminated sheet. Therefore, peeling can be realized by using a peeling head that can be separated and approached along the width direction. In this case, a structure that does not easily cause positional interference with peripheral means can be adopted.
  • the cutting blade forming the attachment region has a seamless structure, the cutting can be performed seamlessly.
  • partial damage to the cutting blade due to the presence of the seam is unlikely to occur, so that the cutting accuracy can be maintained accurately for a long period of time.
  • the cutting blade can be formed by etching the upper surface of the table, it is possible to maintain stable accuracy by keeping the masking accuracy constant. In other words, it is also possible to avoid the knock of the precision that is seen in the work of attaching to the table in an endless shape in accordance with the outer edge of the adherend using a single blade.
  • FIG. 1 is a schematic plan view showing the overall configuration of a sheet sticking apparatus according to the present embodiment.
  • FIG. 2 is a cross-sectional view of a sheet base material.
  • FIG. 3 is a schematic perspective view of a change in a processing state of a sheet base material as viewed from a lower surface side force.
  • FIG. 4 is a schematic perspective view showing the overall configuration of the device.
  • FIG. 5 is a schematic front view along the line A—A in FIG. 1.
  • FIG. 6 is a schematic left side view of FIG. 1.
  • FIG. 7 (A) is a schematic perspective view showing a table of the cutting means, (B) is an enlarged sectional view taken along line BB of FIG. 7 (C), and (C) is a part of FIG. 7 (A). Part enlarged plan view.
  • FIG. 8 is a schematic side view of a first peeling means.
  • FIG. 9 is a schematic plan view of a main part of a first peeling means.
  • FIG. 10 is a schematic perspective view of an attaching table that constitutes attaching means.
  • FIG. 11 is an operation explanatory view showing a state in which a die bonding sheet is attached to a wafer.
  • FIG. 12 is an operation explanatory view showing a state where a base sheet is peeled off.
  • 13 (A) to 13 (C) are operation explanatory views showing a state of cutting a die bonding sheet.
  • FIG. 14 Operation explanatory views showing an initial stage of peeling a peeling region.
  • ⁇ Circle around (17) ⁇ A plan view of the sheet base material after the peeling area is peeled off, as viewed from the lower surface side.
  • FIG. 1 is a schematic plan view of the sheet sticking apparatus according to the present embodiment.
  • a sheet sticking apparatus 10 has a semiconductor wafer W as an adherend, and is configured as an apparatus for a sheet base material S shown in FIG.
  • the base sheet BS is continuous with a strip and the upper surface side (the lower surface side in FIG. 3) is peeled off.
  • a heat-sensitive adhesive die-bonding sheet DS that constitutes a laminated sheet for attachment provided on one surface of the base sheet BS, and a die-bonding sheet DS that interacts with the base sheet BS to form a sandwich.
  • the die bonding sheet DS has a closed-loop bonding area A1 formed by cutting the die bonding sheet DS corresponding to the outer size of the wafer W and is bonded to the wafer W, and is adjacent to the bonding area A1.
  • the strip-shaped peeling area A2 formed by cutting the upstream area in the feeding direction is peeled off.
  • the sheet sticking device 10 includes a storage unit 11 for storing the wafer W, a transfer unit 12 for taking out and transferring the wafers W one by one, Alignment means 13 for positioning, cutting means 15 for cutting the die bonding sheet DS, first peeling means 17 for peeling a peeled area A2 formed by this cutting, and an alignment-processed wafer W And a second peeling means 20 for peeling the base sheet BS from the sticking area A1 after sticking the sticking area A1 to the stencil W, and then sticking the sticking area A1 to the weno and W.
  • the storage means 11 includes an upper and lower carrier 22, a drive motor 23 for vertically moving the carriers 22, and a ball screw shaft 24.
  • the carriers 22 are accommodated in multiple stages along the vertical direction with a predetermined space formed between the wafers.
  • the vertical position of the carrier 22 is provided so as to be detectable by a sensor (not shown), so that the position of each stage of the wafer W, the number of wafers W, and the like can be detected.
  • the transfer means 12 is constituted by a robot having an articulated arm 25.
  • the robot body 26 is provided so as to be able to move up and down, and the arm 25 is provided so as to be rotatable in the horizontal direction, so that the position for taking out the wafers W one by one from the carrier 22 and the alignment means 13 It moves between a position where UNO and W are transferred and a common processing position described later.
  • a suction hole 25A is provided on the distal end side of the arm 25, and the wafer W is suction-supported at the center position by the suction hole 25A.
  • the arm 25 is configured to have a function of reversing the surface of the attracted ueno and W.
  • the alignment means 13 is configured to include an alignment table 27 and a sensor 28.
  • the alignment table 27 has a rotating part 27A that can rotate in a substantially horizontal plane, and the sensor 28 detects the position of the orientation flat W1 formed on the wafer W to position the wafer W. ! /
  • the cutting means 15 is positioned above the sheet base material S that is fed out to a substantially horizontal position, and the axial direction is the feeding direction of the sheet base material S (Fig. 4).
  • a cutting force applying roller 29 arranged in substantially the same direction as the direction of the middle arrow D
  • a cutting table 30 arranged below the sheet substrate S
  • a cutting blade provided on the upper surface side of the cutting table 30 31 and a driving device 32 (see FIG. 5) for moving the cutting table 30 in the vertical direction.
  • the cutting force applying roller 29 is supported by a cooling plate 105 described later.
  • a virtual vertical line C see FIG.
  • the cutting means 15 is provided so as to be able to ascend along the straight line C to a position immediately below the sheet base material S, with the position shown in FIG.
  • the cutting blade 31 is provided with a first cutting blade 31A provided in an endless shape (closed loop) corresponding to the outer shape of the wafer W, and the first cutting blade 31A of the sheet base material S more than the first cutting blade 31A.
  • the second cutting blade 31B which cuts the die bonding sheet DS in the width direction at a position away from the upstream side in the feeding direction D, and the second cutting blade 31A, which are continuous with the first cutting blade 31A, are further fed out from the second cutting blade 31B.
  • a pair of left and right third cutting blades 31C, 31C arranged substantially parallel to the second cutting blade 31B on the downstream side in the direction.
  • the first cutting blade 31A has a linear portion corresponding to the orientation flat W1 of the wafer W positioned on the upstream side in the feeding direction D, and The arrangement extends in the width direction across the base material S.
  • the application region A1 is formed by the first cutting blade 31A, and a part (a part on the upstream side in the feeding direction) of the first cutting blade 31A including the linear portion and the second and third cuts are formed.
  • the peeled area A2 is formed by the blades 31B and 31C.
  • the cutting blade 31 has a cross-sectional shape whose upper end is formed to have a vertex of a substantially isosceles triangle and an upper surface of the cutting table 30. It is formed integrally with the cutting table 30 by etching the side. Therefore, as shown in FIG. 7 (C), the first cutting blade 31A does not have a seam which is seen when the single cutting blade is formed by bending a single blade into an endless shape, even if it has an endless shape. It will be. Further, the third cutting blades 31C, 31C are continuous with the first cutting blade 31A in a seamless state. In the present invention, by providing the third cutting blade 31C, the peeling area A2 formed only by peeling a part of the peeling area A2 that does not peel the entire outer peripheral area except the sticking area A1 can be used. It can be attached to.
  • the first peeling means 17 is a device for peeling the peeled area A2. As shown in FIGS. 1, 8 and 9, the first peeling means 17 is a peeling head that supports the peeling tape T so as to be able to circulate in the width direction crossing the feeding direction of the sheet base material S. 33, a peeling tape supply section 34, a peeling tape winding section 35, and a peeling head base 36.
  • the peeling head 33 is provided in a case 37 whose upper part is open, and is provided rotatably in the case 37, and has a pair of front and rear in FIG. 9 so that the axial direction is along the feeding direction D of the sheet base material S.
  • the upper guide rollers 38, 38 arranged, the bracket 39 located between the upper guide rollers 38, 38, the cylinder 40 for supporting the bracket 39 so as to be able to move up and down, and the inner side of the upper guide rollers 38, 38 And a pair of front and rear heat blocks 42, 42 which are provided so as to be able to move up and down together with the bracket 39.
  • the heat blocks 42, 42 rise, they are wound around the upper guide rollers 38, 38.
  • the surface position of the peeling tape T is raised, and the peeling tape T is brought into contact with the peeling area A2 so that the heat bonding portion 41 (see FIG. 15) is formed in two regions in the width direction of the sheet base material S.
  • Can be formed It is as follows.
  • the peeling tape supply unit 34 includes a tape holding roller 44 and the tape holding roller A drive roller 45 provided between the roller 44 and the peeling head 33, a pinch roller 46 for sandwiching the peeling tape T between the drive roller 45, and a motor M for applying a rotational driving force to the drive roller 45; It consists of.
  • the tape winding unit 35 includes a plurality of rollers 49 to 49 provided between a winding roller 48 driven to rotate in a winding direction by a motor (not shown) and an upper guide roller 38 of the peeling head 33. 53.
  • the peeling head base 36 includes a guide rail 55 for vertically guiding a frame F supporting the tape holding roller 44 and the peeling head 33 and a cylinder 56 for vertically moving the frame F up and down. And a single-axis robot mechanism 58 that moves the frame F in the front-rear direction (the left-right direction in FIG. 8) to move the peeling head 33 forward and backward with respect to the work center C.
  • the peeling head 33 When the peeling head 33 is in the non-operation position, the peeling head 33 takes a position below the surface of the die bonding sheet DS on the sheet substrate S and waits rearward, and when peeling the peeling area A2, The heat block 42 is advanced to the lower surface side of the die bonding sheet DS to raise the heat block 42 to the surface of the peeling area A2.
  • the sticking means 19 includes a feeding device 60 for feeding the sheet base material S, a winding device 61 for winding the cover sheet PS of the sheet base material S, and a wafer W. It comprises a supporting table 62 to be supported and a pressing device 63 for pressing the bonding area A1 of the die bonding sheet DS against the back surface of the wafer W.
  • the feeding device 60 includes a support roller 65 for supporting the sheet base material S wound in a roll shape, an upstream drive roller 66 for applying a feeding output to the sheet base material S, and the drive roller.
  • a pinch roller 67 for sandwiching the sheet base material S between the pinch roller 66, two guide rollers 68, 69 disposed between the drive roller 66 and the support roller 65, and a position lower than the axial position of the pinch roller 67.
  • the position adjusting roller 70 is arranged and holds the sheet base material S at a preset height position.
  • the winding device 61 of the cover sheet PS includes a winding roller 72, a winding driving roller 73, and two guide rollers 74 and 75.
  • the sheet substrate S is peeled off at the position of the pinch roller 67 and wound up by the winding roller 72 in a state where the cover sheet PS is peeled off. Therefore, the sheet base material S that has passed through the 67 position of the pinch opening is one of the base sheet BS and the die bonding sheet D. s will be fed out in the direction of passing through the work center c in a state of two layers
  • the sticking table 62 includes a table body 77, a cylinder 78 that moves the table body 77 up and down, and an intermediate table 79 that supports the cylinder 78.
  • a base table 80 for supporting the intermediate table 79; guide rails 81 and 82 for moving the intermediate table 79 and the base table 80 along the feeding direction D of the sheet base material S;
  • a cylinder device (not shown) for applying a driving force to the intermediate table 79 and the base table 80.
  • a heating device 84 is provided on the lower surface side of the table body 77, as shown in FIG.
  • the heating device 84 is a device that controls the table main body 77 to a predetermined temperature in order to attach the attachment region A1 to the wafer W.
  • the temperature can be arbitrarily set variably according to the characteristics of the die bonding sheet DS. It has become.
  • the table body 77 when the wafer W is supported such that the surface (circuit forming surface) of the wafer W is on the lower surface side, the table body 77 has a closed-loop convex shape along the outer edge thereof.
  • a concave space inside the convex ring portion 86 forms a suction space 87 for the wafer W.
  • a suction hole 87A is formed, and the suction hole 87A is connected to a pressure reducing pump (not shown).
  • the table main body 77 in this embodiment is formed of an elastic member, for example, rubber as a molding material, and the convex portion width W2 (see FIG. 11) of the convex ring portion 86 is set to about 2 mm.
  • the wafer W can be suction-supported in a state where the outer peripheral edge of the convex portion substantially coincides with the outer peripheral edge of the wafer W. Therefore, even if the bumps are formed on the surface of the wafer W up to the region near the outer peripheral edge of the wafer, the wafers and W can be supported without interfering with the bumps.
  • the height H of the convex ring portion 86 is set to a height substantially corresponding to the height of the bump, and is set to approximately 0.45 mm in the present embodiment.
  • the convex portion width W2 and height H can be set according to the corresponding Ueno and W.
  • the pressing device 63 that interacts with the attaching table 62 includes a fixing roller 89 and a press roller 90.
  • the fixing roller 89 and the press roller 90 are provided on the upper surface side of the base sheet BS so as to be able to move up and down, and the press roller 90 is configured as a built-in heater type and has a length equal to the length of the base sheet BS. So that the sticking area A1 can be stuck to the surface of the weno and W by applying a sticking pressure while keeping the sticking area A1 at a predetermined temperature by the movement. Become.
  • the second peeling means 20 includes a cooling device 93 that supports the above-described cutting force applying roller 29, and a peeling surface positioned below the cooling device 93 and on the lower surface side of the sheet substrate S. And a pair of peeling rollers 96, 97 for peeling the base sheet BS of the sheet base material S from the attaching area A1, a guide roller 98 for guiding the base sheet BS peeled by the peeling rollers 96, 97, It is provided with a driving roller 99 rotated by the motor Ml, a pinch roller 100 for sandwiching the sheet substrate S, a guide roller 101, and a winding roller 102 for winding the base sheet BS.
  • the upstream drive roller 66 and the downstream drive roller 99 are controlled to maintain the sheet base material S at a predetermined tension.
  • the cooling device 93 functions as a temperature adjusting device that lowers the temperature relatively to the temperature at which the attachment region A1 is attached to the wafer W.
  • the cooling device 93 includes a cooling plate 105 having a lower surface serving as an adsorption surface, and a temperature adjusting unit 106 provided on the cooling plate 105, and a rail disposed rearward in the width direction of the sheet base material S. It is supported so as to be able to move up and down along a 107 through an elevating cylinder 108, and is provided so as to be movable in the width direction of the sheet base material S via a cylinder 109 arranged behind the rail 107.
  • the cooling device 93 is provided so as to move up and down with the substantially center of the cooling plate 105 set on the work center C.
  • the peeling table 94 keeps its position retracted to the downstream side in the feeding direction of the sheet base material S when it is not operated, while its center is located at the work center C when it is operated. It is provided to move up to.
  • the peeling table 94 is provided such that the upper surface thereof has substantially the same structure as the table body 77 of the sticking table 62.
  • the wafer W positioned on the peeling table 94 is suction-supported.
  • the peeling table 94 is provided so as to be able to move up and down via an elevating mechanism 110, as shown in FIG.
  • the peeling rollers 96 and 97 are provided so as to be able to move to the upstream side in the feeding direction of the base sheet BS in a state where the base sheet BS passes between them, whereby the Ueno, W
  • the release rollers 96 and 97 are moved to the right in FIG. 12 while the base sheet BS is attracted by the release table 94, the base sheet BS is separated from the bonding area A1 while leaving the bonding area A1 on the surface of the wafer W.
  • the winding roller 99 is configured to wind sequentially. At this time, a part of the die bonding sheet DS excluding the peeling area A2 and the sticking area A1 described above is wound together with the base sheet BS.
  • the sheet base material S is pulled out, the cover sheet PS is peeled off from the die bonding sheet DS, and the lead end of the cover sheet PS is fixed to the winding roller 72. Then, the lead end of the sheet base material S from which the cover sheet PS has been peeled off is fixed to the winding roller 102 constituting the second peeling means 20.
  • the attaching table 62 and the peeling table 94 are at the standby positions indicated by solid lines in FIG. 4, and the cooling device 93 is at the standby position above the sheet base S in the work center C.
  • the table 30 of the cutting means 15 is at a standby position below the sheet substrate S in the work center C.
  • the transporting means 12 When the power supply (not shown) is turned on, the transporting means 12 is operated, and a piece of Ueno and W is sucked and taken out from the carrier 22 of the storage means 11 and transferred onto the alignment table 27.
  • the alignment table 27 rotates the wafer W in a plane, detects the orientation flat W1 with the sensor 28, and determines the position or orientation of the wafer W.
  • the aligned wafer W is transferred via the transfer means 12, and thereafter, the table main body 77 moves to the standby position. Then, the wafer W is heated at the standby position for a predetermined time. As shown in FIG. 13, while the wafer W is being heated at the standby position, the table 30 of the cutting means 15 rises, and the cutting blade 31 moves the sheet base material S (die bonding sheet DS). ) Ascends to a position almost in contact with the lower surface of.
  • the cooling device 93 moves forward via the cylinder 109 and descends via the elevating cylinder 108, and the cutting force applying roller 29 supported on the lower rear surface side of the cooling device 93 is moved to the upper surface of the sheet substrate S. To the position where it touches the front edge of the side.
  • the entire cooling device 93 is moved rearward in the substantially horizontal direction by the cylinder 109, that is, when the entire cooling device 93 is moved in the width direction crossing the feeding direction of the sheet base material S, the cutting blade 31 and the cutting force applying roller are moved. 29 is cut (half-cut) in the area sandwiched by 29 and the cutting lines corresponding to the first to third cutting blades 31A, 31B and 31C constituting the cutting blade 31 are die-bonded.
  • the cutting force applying roller 29 returns to the initial standby position together with the cooling device 93, and the table 30 of the cutting means 15 also returns to the standby position.
  • the first peeling means 17 is actuated, and the peeling head 33 is moved to a position just below the peeling area A2, and the cooling device 93 is cooled.
  • the plate 105 sucks the upper surface of the base sheet BS.
  • the heat block 42 is raised, and the peeling tape T is partially heated and adhered to the peeling area A2 of the die bonding sheet DS.
  • the peeling head 33 descends and winds up the peeling tape T, thereby forming the die bonding sheet DS as shown in FIG.
  • the rear area in the feeding direction adjacent to the attaching area A1 is peeled by a certain amount, and after the peeling is completed, the peeling head 33 returns to the rear standby position.
  • the wafer W heated at the standby position is transported to the work center C position while being placed on the sticking table 62, as shown in FIG. You.
  • the table body 77 is raised (see FIG. 18A)
  • the fixing roller 89 and the press roller 90 constituting the pressing device 63 are lowered to the upper surface position of the base sheet BS.
  • the fixing roller 89 is fixed in a state in which a downward pressing force is applied to the base sheet BS, while the press roller 90 rotates to the downstream side in the feeding direction while rotating. After moving (see FIG.
  • the cooling device 93 descends and sucks the wafer W across the sheet base material S, the table body 77 releases the sucking, and descends to the standby position. At this time, the wafer W is attached to the attaching area A1 of the die bonding sheet DS, so that the wafer W is left on the lower surface side of the die bonding sheet DS. Then, the Ueno, W and the base sheet S are cooled to the set temperature.
  • a peeling table 94 that constitutes second peeling means 20 is provided at the standby position and the work center C position. Go to and rise.
  • the peeling rollers 96 and 97 move toward the flow side of the base sheet BS in the direction in which the base sheet BS is fed, and the base sheet BS is moved toward the adhering area A1.
  • And are sequentially wound up by the winding roller 102.
  • the remaining area where the sticking area A1 and the peeling area A2 are removed is wound together with the base sheet BS.
  • the transfer means 12 sucks the upper surface side of the wafer W, stores the wafer W in the carrier 22 of the storage means 11 while inverting the upper surface side, and ends a series of steps of attaching the sheet.
  • the first peeling means 17 is not limited to the illustrated configuration example. It is enough if the area A2 can be peeled off. Specifically, the peeling area A2 can be peeled at an acute angle via a peel plate. Further, the length of the peeling area A2 along the feeding direction is a length from the middle of the sticking area A1 along the feeding direction to a position away from the rear end of the sticking area A1 by a predetermined distance upstream in the feeding direction. I just need.
  • the wafer W has a shape provided with the orientation flat W1, but a wafer having a V-notch on the outer peripheral edge can also be used. In this case, it suffices to form a blade area corresponding to the V notch on the first cutting blade 31A.
  • the present invention is not limited to the case where the adherend is the wafer W, and a plate-like body other than the wafer may be used as the adherend.
  • the sheet base material S is not limited to the one provided with the die bonding sheet DS, but may be a heat-sensitive adhesive sheet.
  • a heat-sensitive adhesive sheet for protecting the surface of an adherend may be used. It may be a protection sheet.
  • a sheet for forming a protective film disclosed in JP-A-2002-280329 or a dry resist film may be used.
  • the sheet sticking device including the heating device and the cooling device has been described.
  • other sheets having no heat-sensitive adhesiveness are described. In this case, a heating device and a cooling device are not required.
  • the peeling area A2 is formed on the upstream side in the feeding direction of the sticking area A1, but the press roller 90 moves from the downstream side in the feeding direction to the upstream side to move the sticking area A1 to the wafer W.
  • the peeling area A2 is formed on the downstream side in the feeding direction. This is because, if the die bonding sheet DS is present in the area surrounding the bonding start side of the bonding area A1, even if the cutting is performed with the cutting blade 31, there is a strong tendency for re-adhesion to occur.
  • the sticking table 62 has a force including an intermediate table 79, a base table 80, guide rails 81 and 82, a heating device 84, and the like.
  • the present invention is not limited to this. Various changes can be made as long as 79 can move from the standby position to work center C.

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Abstract

An apparatus and a method for sticking a sheet. The apparatus (10) cuts a sheet base material (S) formed by stacking a die bonding sheet (DS) on one face of a base sheet (BS) in the plane surface shape of a semi-conductor wafer to form a sticking area (A1) and sticks the sticking area on the semi-conductor wafer. The apparatus comprises a cutting means (15) forming the sticking area (A1) and a peeled area (A2), a first peeling means (17) peeling off the peeled area (A2), a sticking table (62) sticking the sticking area (A1) on the wafer, and a second peeling means (20) peeling off the base sheet from the sticking area (A1). The cutting means (15) further comprises first to third cutting blades (31A), (31B), and (31C), and forms the sticking area (A1) by the first cutting blade (31A). Also, the cutting means forms the peeled area (A2) by a part of the first cutting blade (31A) and the second and third cutting blades (31B) and (31C), and sticks the sticking area (A1) on the wafer after the peeled area (A2) is peeled off.

Description

明 細 書  Specification
シート貼付装置及び貼付方法  Sheet sticking device and sticking method
技術分野  Technical field
[0001] 本発明はシート貼付装置及び貼付方法に係り、更に詳しくは、帯状のベースシート の一方の面に設けられた貼付用の積層シートに切り込みを設け、これによつて得られ た貼付領域を半導体ウェハ等の被着体に精度よく貼付することのできるシート貼付 装置及び貼付方法に関する。  The present invention relates to a sheet sticking apparatus and a sheet sticking method, and more particularly, to a sheet-like laminated sheet provided on one surface of a strip-shaped base sheet, in which a cut is provided, and a sticking area obtained by the cut is provided. The present invention relates to a sheet sticking apparatus and a sheet sticking method capable of sticking a sheet to an adherend such as a semiconductor wafer with high accuracy.
背景技術  Background art
[0002] 回路面が形成された半導体ウェハ（以下、単に、「ウェハ」と称する）をチップに個片 化した後、各チップをピックアップしてリードフレームに接着 (ダイボンディング)するこ とが行われている。このダイボンディングは、ウェハ処理工程において、ベースシート の一方の面に積層された感熱接着性のダイボンディングシートをカットして半導体ゥ ェハに貼付しておくことにより行われる。  [0002] After a semiconductor wafer on which a circuit surface is formed (hereinafter, simply referred to as a "wafer") is divided into chips, each chip is picked up and bonded (die-bonded) to a lead frame. Has been done. This die bonding is performed in a wafer processing step by cutting a heat-sensitive adhesive die bonding sheet laminated on one surface of a base sheet and attaching it to a semiconductor wafer.
[0003] このようなシートの貼付装置としては、例えば、本出願人により既に提案された特許 文献 1に開示されている。同文献に開示されたシート貼付装置は、ウェハを支持する 貼付テーブルと、当該ウェハの平面形状に応じてダイボンディングシートをカットして ウェハに貼り付けられる貼付領域を形成するとともに、シート繰出方向の上流側に所 定距離離れてダイボンディングシートを幅方向に切断する切断手段と、前記貼付領 域を囲む外周領域をなすダイボンディングシートの残り領域を剥離する第 1の剥離手 段と、貼付領域をウェハに押圧して貼付するプレスロールと、前記ベースシートを剥 離する第 2の剥離手段とを含んで構成されて 、る。  [0003] Such a sheet sticking apparatus is disclosed, for example, in Patent Document 1 already proposed by the present applicant. The sheet sticking apparatus disclosed in the document includes a sticking table that supports a wafer, a die bonding sheet that is cut in accordance with the planar shape of the wafer, and a sticking area that is stuck to the wafer. Cutting means for cutting the die bonding sheet in the width direction at a predetermined distance away from the upstream side; first peeling means for peeling off the remaining area of the die bonding sheet forming an outer peripheral area surrounding the attaching area; And a second peeling means for peeling off the base sheet.
[0004] 特許文献 1 :特開 2002— 367931号公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2002-367931
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0005] しかしながら、特許文献 1に開示された構成にあっては、貼付領域を除く外周側の ダイボンディングシートを第 1の剥離手段により剥離する構成であるため、剥離される ダイボンディングシート領域の外形サイズが大きくなり、剥離構造が複雑になる他、剥 離に必要な装置の移動領域が大きくなつて他の装置との位置的な取り合い関係を複 雑にする、という不都合がある。かかる不都合は、ウェハのサイズが大きくなるに従つ て一層顕在化する。 [0005] However, the configuration disclosed in Patent Document 1 is configured such that the die bonding sheet on the outer peripheral side excluding the sticking area is peeled off by the first peeling means. In addition to the increase in external size and complexity of the peeling structure, There is an inconvenience that the movement area of the device required for separation becomes large and the positional relationship with other devices becomes complicated. Such disadvantages become more apparent as the size of the wafer increases.
[0006] また、切断手段を形成する切断刃は、一枚刃を閉ループ形状となるようにしてベー ス板に取り付けて構成されたトムソン刃により構成されて 、るため、刃の延出方向に 沿う端部間の接合部に必然的な継ぎ目が生じ、当該継ぎ目領域の刃に割れ等の損 傷が生じ易くなり、反復継続的な使用によって継ぎ目領域における切断が完全に行 えなくなつてしまう、という不都合もある。  [0006] Further, the cutting blade forming the cutting means is constituted by a Thomson blade formed by attaching a single blade to a base plate in a closed loop shape, so that the cutting blade extends in the direction in which the blade extends. An inevitable seam is formed at the joint between the ends along the edge, and the blade in the seam area is liable to be damaged, such as a crack, and cutting at the seam area cannot be completely performed by repeated continuous use. There is also a disadvantage.
[0007] ところで、最近では、 V、わゆるフェースダウンと称される実装法を用いた半導体装置 の製造が行われている。このフェースダウン方式では、チップの回路面側に電気的な 導通を確保するためのバンプと呼ばれる凸部が回路面側に形成されている。  [0007] By the way, recently, a semiconductor device has been manufactured using a mounting method called V, so-called face-down. In the face-down method, a protrusion called a bump is formed on the circuit surface side of the chip to secure electrical continuity.
このような凸部は、ウェハの外周縁に非常に接近した位置まで形成されている。従 つて、特許文献 1に開示された貼付テーブルは、ウェハ外周縁に沿う領域を吸着す る構造であるため、バンプを備えたウェハを被着体として対応することができない、と いう不都合がある。  Such a convex portion is formed up to a position very close to the outer peripheral edge of the wafer. Therefore, the sticking table disclosed in Patent Document 1 has a disadvantage that the wafer having bumps cannot be used as an adherend because it has a structure in which a region along the outer peripheral edge of the wafer is sucked. .
[0008] [発明の目的]  [0008] [Object of the invention]
本発明は、このような不都合に着目して案出されたものであり、その目的は、切断、 貼付、剥離等を共通の処理位置となるワークセンターで行えるようにし、これらを実現 する手段が前記処理位置に対して交互に離間接近可能としたセンターワークシステ ムを可能としたシート貼付手段及び貼付方法を提供することにある。  The present invention has been devised in view of such inconvenience, and an object thereof is to enable cutting, pasting, peeling, and the like to be performed at a work center which is a common processing position, and a means for realizing these is provided. It is an object of the present invention to provide a sheet sticking means and a sheet sticking method which enable a center work system capable of alternately separating and approaching the processing position.
[0009] また、本発明の目的は、被着体の平面形状に応じた貼付領域の形成後において、 当該貼付領域の外側を囲む積層シートの剥離を行うにあたり、剥離領域を最小限に して剥離装置の簡略ィ匕を達成するとともに、剥離に必要な装置各部の移動領域を小 さくすることのできるシート貼付装置及び貼付方法を提供することにある。  [0009] Further, an object of the present invention is to minimize the peeling area when peeling the laminated sheet surrounding the outside of the sticking area after forming the sticking area according to the planar shape of the adherend. It is an object of the present invention to provide a sheet sticking apparatus and a sheet sticking method capable of achieving a simplified peeling device and reducing a moving area of each part of the device required for peeling.
[0010] 本発明の他の目的は、継ぎ目を生ずることのない切断を可能とし、貼付される積層 シートを確実に切断でき、貼付領域を被着体に貼付する際に、当該貼付領域が外側 を囲む積層シート領域に繋がってしまうようなことがないシート貼付装置及び貼付方 法を提供することにある。 [0011] また、本発明の更に他の目的は、貼付シートの貼付面とは反対側となる被着体の 面に凸部等が被着体の外縁近傍に存在していても、当該被着体を支持可能として 適用範囲を拡大することできるシート貼付装置及び貼付方法を提供することにある。 課題を解決するための手段 [0010] Another object of the present invention is to enable cutting without forming a seam, to reliably cut a laminated sheet to be stuck, and to stick the stuck area to an adherend when the stuck area is outside. It is an object of the present invention to provide a sheet sticking apparatus and a sticking method which do not lead to a laminated sheet region surrounding the sheet. [0011] Further, still another object of the present invention is to provide a method for manufacturing an adhesive sheet that includes a projection or the like near the outer edge of an adherend on the surface of the adherend opposite to the surface to which the adhesive sheet is attached. An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method capable of supporting an attached body and expanding an applicable range. Means for solving the problem
[0012] 前記目的を達成するため、本発明は、帯状に連続するベースシートと、このベース シートの一方の面に設けられた貼付用の積層シートとを含むシート基材を用い、当該 シート基材を繰り出す過程で積層シートを被着体の平面形状にカットして貼付領域を 形成し、当該貼付領域を前記被着体に貼付するシート貼付装置にお！ヽて、  [0012] In order to achieve the above object, the present invention provides a sheet base including a band-shaped continuous base sheet and a lamination sheet for attachment provided on one surface of the base sheet. In the process of feeding out the material, the laminated sheet is cut into the planar shape of the adherend to form a sticking area, and the sheet sticking apparatus sticks the sticking area to the adherend!ヽ
前記被着体の収納手段力 当該被着体を一つずつ取り出して搬送する搬送手段 と、前記積層シートを被着体の平面形状に合わせて切断して前記貼付領域を形成 するとともに、当該貼付領域に隣接する位置で前記積層シートの繰出方向に沿う前 後を幅方向に切断して剥離領域を形成する切断手段と、前記剥離領域を剥離する 第 1の剥離手段と、被着体を支持して当該被着体に前記貼付領域を貼付する貼付 テーブルを含む貼付手段と、前記ベースシートを貼付領域から剥離する第 2の剥離 手段とを含み、  The means for storing the adherends The conveying means for taking out and transporting the adherends one by one, and cutting the laminated sheet according to the planar shape of the adherend to form the attaching area, and A cutting means for forming a peeled area by cutting the front and rear of the laminated sheet in the width direction at a position adjacent to the area, a first peeling means for peeling the peeled area, and supporting the adherend. And an attaching means including an attaching table for attaching the attaching area to the adherend, and a second removing means for removing the base sheet from the attaching area.
前記搬送手段、切断手段、貼付手段、第 1及び第 2の剥離手段は、順次繰り出され るシート基材に対して予め設定された共通の処理位置をワークセンターとして相互に 干渉することなく移動可能に設けられる、 t 、う構成を採って 、る。  The transporting means, the cutting means, the attaching means, the first and second peeling means can be moved without interfering with each other as a work center at a common processing position set in advance with respect to the sequentially fed sheet base material. It is provided with a structure of t.
[0013] 本発明にお 、て、前記切断手段は、被着体の外縁に沿ってエンドレス形状に設け られた第 1の切断刃と、当該第 1の切断刃よりもシート基材の繰出方向上流側に離れ た位置で前記積層シートを幅方向に切断する第 2の切断刃と、前記第 1の切断刃に 連続するとともに、前記第 2の切断刃よりも繰出方向下流側で当該第 2の切断刃と略 平行に配置された第 3の切断刃とを備え、 [0013] In the present invention, the cutting means may include a first cutting blade provided in an endless shape along an outer edge of the adherend, and a feeding direction of the sheet substrate more than the first cutting blade. A second cutting blade that cuts the laminated sheet in the width direction at a position distant to the upstream side, and the second cutting blade that is continuous with the first cutting blade and downstream of the second cutting blade in the feeding direction. And a third cutting blade arranged substantially in parallel with the cutting blade,
前記第 1の切断刃により前記貼付領域を形成する一方、第 1の切断刃の一部と前 記第 2及び第 3の切断刃とにより前記剥離領域を形成し、当該剥離領域を第 1の剥 離手段で剥離した後に、前記貼付領域を被着体に貼付する、という構成を採ることが できる。  The pasting area is formed by the first cutting blade, and the peeling area is formed by a part of the first cutting blade and the second and third cutting blades. After peeling by the peeling means, it is possible to adopt a configuration in which the sticking area is stuck to the adherend.
[0014] また、前記第 1の切断刃と前記第 3の切断刃は継ぎ目なく相互に連続するように設 けられている。 [0014] Further, the first cutting blade and the third cutting blade are provided so as to be continuous with each other without a seam. Have been killed.
[0015] また、前記切断手段はテーブルを更に含み、前記第 1、第 2及び第 3の切断刃は前 記テーブルの上面側に一体成形される、という構成が採用されている。  [0015] The cutting means may further include a table, and the first, second, and third cutting blades may be integrally formed on the upper surface of the table.
[0016] 更に、前記第 1,第 2及び第 3の切断刃は、前記テーブルの上面側をエッチング処 理することにより形成するとよい。 [0016] Further, the first, second and third cutting blades may be formed by etching the upper surface of the table.
[0017] また、前記第 1の剥離手段は、シート基材の繰出方向を横切る幅方向に剥離用テ 一プを回行可能に支持する剥離ヘッドを含み、前記剥離用テープを前記剥離領域 に接着して前記剥離用テープを回行させることで、前記剥離領域を前記ベースシー トから剥離する、という構成を採っている。 [0017] Further, the first peeling means includes a peeling head that supports the peeling tape so as to be rotatable in a width direction crossing the feeding direction of the sheet base material, and places the peeling tape in the peeling area. A configuration is adopted in which the separation area is separated from the base sheet by bonding and rotating the separation tape.
[0018] 更に、前記第 1の剥離ヘッドはヒートブロックにより構成され、当該ヒートブロックによ り前記剥離用テープを剥離領域に熱接着するように設けられて 、る。 Further, the first peeling head is formed of a heat block, and the heat block is provided so as to thermally bond the peeling tape to a peeling region.
[0019] 前記ヒートブロックは、前記剥離領域の幅方向に沿う複数箇所に配置されている。 [0019] The heat blocks are arranged at a plurality of locations along the width direction of the peeling region.
[0020] また、前記被着体は表面にバンプが設けられた半導体ウェハであり、 [0020] Further, the adherend is a semiconductor wafer having a surface provided with bumps,
前記貼付テーブルは、半導体ウェハのバンプ形成面が下面側となるように当該半 導体ウェハを支持したときに、前記バンプに干渉しな 、ウェハの外縁に沿う閉ループ 状の凸状リング部を備える、という構成を採っている。  When the semiconductor wafer is supported such that the bump forming surface of the semiconductor wafer is on the lower surface side, the bonding table does not interfere with the bumps, and includes a closed loop-shaped convex ring portion along the outer edge of the wafer. The configuration is adopted.
[0021] 前記凸状リング部の凸部高さは、バンプの高さに略対応する高さに設けられている とよい。 [0021] The height of the convex portion of the convex ring portion may be set to a height substantially corresponding to the height of the bump.
[0022] 更に、前記貼付テーブルは、前記凸状リング部の内側が半導体ウェハの吸着空間 として構成されているとともに、弾性部材を成形素材として形成されている。  [0022] Further, in the sticking table, the inside of the convex ring portion is configured as a suction space for a semiconductor wafer, and the elastic member is formed as a molding material.
[0023] また、前記被着体は半導体ウェハであり、前記積層シートは、感熱接着性のダイボ ンデイングシートとすることができる。  [0023] Further, the adherend may be a semiconductor wafer, and the laminated sheet may be a heat-sensitive adhesive bonding sheet.
[0024] 更に、本発明は、帯状に連続するベースシートと、このベースシートの一方の面に 設けられた貼付用の積層シートとを含むシート基材を用い、当該シート基材を繰り出 す過程で積層シートを被着体の平面形状にカットして貼付領域を形成し、当該貼付 領域を前記被着体に貼付するシート貼付方法において、  [0024] Further, the present invention uses a sheet base including a base sheet continuous in a strip shape and a laminated sheet for attachment provided on one surface of the base sheet, and feeds out the sheet base. In a sheet sticking method in which a laminated sheet is cut into a planar shape of an adherend in a process to form an adhered region, and the adhered region is adhered to the adherend,
前記被着体を搬送手段で一つずつ取り出す工程と、前記積層シートに貼付領域と 剥離領域とを形成する切断工程と、前記剥離領域を剥離する第 1の剥離工程と、貼 付領域を被着体に貼付する貼付工程と、前記ベースシートを貼付領域から剥離する 第 2の剥離工程とを含み、 A step of taking out the adherends one by one by a conveying means, a cutting step of forming a sticking area and a peeling area on the laminated sheet, a first peeling step of peeling the peeling area, An attaching step of attaching the attachment area to the adherend, and a second peeling step of removing the base sheet from the attachment area,
前記切断工程は、被着体の外縁に沿って継ぎ目なく積層シートを切断して貼付領 域を形成する第 1の切断と、当該第 1の切断位置よりもシート基材の繰出方向上流側 に離れた位置で前記積層シートを幅方向に切断する第 2の切断と、前記第 1の切断 線に連続するとともに、前記第 2の切断位置よりも繰出方向下流側で当該第 2の切断 と略平行な方向に積層シートを切断する第 3の切断とを同時に行うことにより達成され 前記第 1の切断によって貼付領域を形成する一方、第 1の切断の一部と前記第 2及 び第 3の切断によって剥離領域を形成し、  The cutting step includes a first cutting in which the laminated sheet is cut along the outer edge of the adherend without a seam to form an attachment area, and an upstream side in the feeding direction of the sheet substrate from the first cutting position. A second cutting in which the laminated sheet is cut in the width direction at a distant position; and a second cutting that is continuous with the first cutting line and substantially downstream of the second cutting position in the feeding direction. This is achieved by simultaneously performing a third cutting for cutting the laminated sheet in a parallel direction, and while forming the attachment region by the first cutting, a part of the first cutting and the second and third cutting are performed. Forming a peeled area by cutting,
前記剥離領域を第 1の剥離手段で剥離した後に前記貼付領域を被着体に貼付し、 前記貼付領域を被着体に残すように前記シート基材を貼付領域から剥離する、と いう方法を採っている。  After peeling off the peeling area by a first peeling means, attaching the sticking area to an adherend, and peeling the sheet substrate from the sticking area so that the sticking area remains on the adherend. I am taking it.
[0025] 前記方法において、前記第 1及び第 3の切断は継ぎ目なく連続するように設けられ ている。  [0025] In the above method, the first and third cuts are provided so as to be continuous without a seam.
[0026] また、前記方法において、前記切断、貼付領域の貼付、第 1及び第 2の剥離は、前 記ベースシートの繰り出しを停止した状態で、予め設定された共通の処理位置をヮ ークセンターとして順次行われる、 t 、う方法を採って 、る。  [0026] In the above method, the cutting, the pasting of the pasting area, and the first and second peeling are performed by setting a common processing position set in advance in a state where the feeding of the base sheet is stopped. It is performed in a sequential manner.
発明の効果  The invention's effect
[0027] 本発明によれば、シート貼付装置を構成する各手段は、シート基材の繰り出しを停 止した状態において、予め設定した位置で所定動作するというセンターワーク方式と なり、従って、シート基材を保持する繰出手段等を固定位置に保つことができる。そ のため、切断工程、剥離工程、貼付工程の各工程において、シート基材側に生じ得 る張力変化を効果的に回避しつつ高精度なシート貼付が可能となる。  According to the present invention, each means constituting the sheet sticking apparatus has a center work system in which a predetermined operation is performed at a preset position in a state where the feeding of the sheet substrate is stopped. The feeding means for holding the material can be kept at a fixed position. Therefore, in each of the cutting step, the peeling step, and the sticking step, highly accurate sheet sticking becomes possible while effectively avoiding a tension change that may occur on the sheet substrate side.
[0028] また、剥離領域が貼付領域の外周全域ではなぐ繰出方向に沿う上流側に形成さ れる部分のみとなるため、従来の剥離構造に比べて剥離構造を簡単に構成とするこ とができる。この際、剥離領域は、前記積層シートの幅方向に沿う片状をなすものとな り、従って、幅方向に沿って離間接近可能な剥離ヘッドを用いることで剥離が実現で き、周辺手段との位置的干渉を生じ難い構造を採用することができる。 [0028] Also, since the peeling region is only a portion formed on the upstream side along the feeding direction in the entire outer periphery of the sticking region, the peeling structure can be made simpler than the conventional peeling structure. . At this time, the peeling region has a flaky shape along the width direction of the laminated sheet. Therefore, peeling can be realized by using a peeling head that can be separated and approached along the width direction. In this case, a structure that does not easily cause positional interference with peripheral means can be adopted.
[0029] また、貼付領域を形成する切断刃が継ぎ目のない構造とされていることで、切断も 継ぎ目なく行われるようになる。しかも、継ぎ目が存在することに起因した切断刃の部 分的な損傷も生じ難いため、切断精度を長期に亘つて精度良く保つことができる。  [0029] In addition, since the cutting blade forming the attachment region has a seamless structure, the cutting can be performed seamlessly. In addition, partial damage to the cutting blade due to the presence of the seam is unlikely to occur, so that the cutting accuracy can be maintained accurately for a long period of time.
[0030] 更に、切断刃は、テーブルの上面をエッチング処理することで形成できるため、マス キングの精度を一定とすることで、安定した精度維持を図ることができる。すなわち、 一枚刃を用いて被着体の外縁に合わせてエンドレス形状にテーブルに取り付ける作 業に見られる精度のノ ツキも回避可能となる。  Further, since the cutting blade can be formed by etching the upper surface of the table, it is possible to maintain stable accuracy by keeping the masking accuracy constant. In other words, it is also possible to avoid the knock of the precision that is seen in the work of attaching to the table in an endless shape in accordance with the outer edge of the adherend using a single blade.
[0031] 更に、貼付テーブルがバンプを有するウエノ、にも適用できる構造とすることで、汎 用性を備えたシート貼付装置を提供することができる他、被着体及びシートの種別も 各種採用することが可能となる。  [0031] Furthermore, by adopting a structure in which the attaching table can be applied to an eno with bumps, a versatile sheet attaching apparatus can be provided, and various types of adherends and sheets can be employed. It is possible to do.
図面の簡単な説明  Brief Description of Drawings
[0032] [図 1]本実施形態に係るシート貼付装置の全体構成を示す概略平面図。 FIG. 1 is a schematic plan view showing the overall configuration of a sheet sticking apparatus according to the present embodiment.
[図 2]シート基材の断面図。  FIG. 2 is a cross-sectional view of a sheet base material.
[図 3]シート基材に対する処理状態の変化を下面側力 見た概略斜視図。  FIG. 3 is a schematic perspective view of a change in a processing state of a sheet base material as viewed from a lower surface side force.
[図 4]前記装置の全体構成を示す概略斜視図。  FIG. 4 is a schematic perspective view showing the overall configuration of the device.
[図 5]図 1の A— A線に沿う概略正面図。  FIG. 5 is a schematic front view along the line A—A in FIG. 1.
[図 6]図 1の概略左側面図。  FIG. 6 is a schematic left side view of FIG. 1.
[図 7] (A)は切断手段のテーブルを示す概略斜視図、（B)は図 7 (C)の B— B線に沿 う拡大断面図、（C)は図 7 (A)の一部拡大平面図。  [FIG. 7] (A) is a schematic perspective view showing a table of the cutting means, (B) is an enlarged sectional view taken along line BB of FIG. 7 (C), and (C) is a part of FIG. 7 (A). Part enlarged plan view.
[図 8]第 1の剥離手段の概略側面図。  FIG. 8 is a schematic side view of a first peeling means.
[図 9]第 1の剥離手段の要部概略平面図。  FIG. 9 is a schematic plan view of a main part of a first peeling means.
[図 10]貼付手段を構成する貼付テーブルの概略斜視図。  FIG. 10 is a schematic perspective view of an attaching table that constitutes attaching means.
[図 11]ダイボンディングシートをウェハに貼付する状態を示す動作説明図。  FIG. 11 is an operation explanatory view showing a state in which a die bonding sheet is attached to a wafer.
[図 12]ベースシートを剥離する状態を示す動作説明図。  FIG. 12 is an operation explanatory view showing a state where a base sheet is peeled off.
[図 13] (A)ないし (C)は、ダイボンディングシートを切断する状態を示す動作説明図 [図 14]剥離領域を剥離する初期段階を示す動作説明図。 圆 15]前記剥離領域に剥離用テープを熱接着する状態を示す動作説明図。 圆 16]前記剥離領域を剥離する状態を示す動作説明図。 13 (A) to 13 (C) are operation explanatory views showing a state of cutting a die bonding sheet. [FIG. 14] Operation explanatory views showing an initial stage of peeling a peeling region. [15] Operation explanatory view showing a state in which a peeling tape is thermally bonded to the peeling region. [16] Operation explanatory view showing a state in which the peeling region is peeled.
圆 17]前記剥離領域を剥離した後のシート基材を下面側から見た平面図。 {Circle around (17)} A plan view of the sheet base material after the peeling area is peeled off, as viewed from the lower surface side.
圆 18]ダイボンディングシートをウェハに貼付する状態を詳細に示す動作説明図。 符号の説明 [18] Operation | movement explanatory drawing which shows the state which sticks a die bonding sheet to a wafer in detail. Explanation of symbols
10 シート貼付装置  10 Sheet sticking device
11 収納手段  11 Storage means
12 搬送手段  12 Transport means
13 ァライメント手段  13 Alignment means
15 切断手段  15 Cutting means
17 第 1の剥離手段  17 First peeling means
19 貼付手段  19 Pasting means
20 第 2の剥離手段  20 Second peeling means
27 ァライメントテーブル  27 Alignment Table
30 テーブル  30 tables
31 切断刃  31 Cutting blade
31A 第 1の切断刃  31A 1st cutting blade
31B 第 2の切断刃  31B 2nd cutting blade
31C 第 3の切断刃  31C 3rd cutting blade
33 剥離ヘッド  33 Peeling head
A1 貼付領域  A1 Pasting area
A2 剥離領域  A2 Peeling area
C ワークセンター  C Work Center
W 半導体ウェハ (被着体）  W Semiconductor wafer (substrate)
S シート基材  S sheet base material
τ 剥離用テープ  τ Peeling tape
BS ベースシート  BS base sheet
DS ダイボンディングシート PS カバーシート DS die bonding sheet PS cover sheet
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0034] 以下、本発明の実施の形態について図面を参照しながら説明する。  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0035] 図 1には、本実施形態に係るシート貼付装置の概略平面図が示されている。この図 において、シート貼付装置 10は、半導体ウェハ Wを被着体としたものであり、図 2に 示されるシート基材 Sを対象とする装置として構成されている。ここで、シート基材 Sは 、上下 (表裏）を反転して表した図 3に示されるように、帯状に連続するとともに上面側 (図 3中下面側）が剥離処理されたベースシート BSと、当該ベースシート BSの一方の 面に設けられた貼付用の積層シートを構成する感熱接着性ダイボンディングシート D Sと、ベースシート BSと相互に作用してダイボンディングシート DSをサンドイッチする とともに、前記ベースシート BSと実質的に同一のシートからなるカバーシート PSとに より構成されている。ここで、ダイボンディングシート DSは、ウェハ Wの外形サイズに 対応して当該ダイボンディングシート DSを切断して形成される閉ループ状の貼付領 域 A1がウェハ Wに貼付され、この貼付領域 A1に隣接する繰出方向上流側領域を 切断して形成される帯状の剥離領域 A2が剥離される構成となっている。  FIG. 1 is a schematic plan view of the sheet sticking apparatus according to the present embodiment. In this figure, a sheet sticking apparatus 10 has a semiconductor wafer W as an adherend, and is configured as an apparatus for a sheet base material S shown in FIG. Here, as shown in FIG. 3 in which the sheet base material S is turned upside down (front and back), the base sheet BS is continuous with a strip and the upper surface side (the lower surface side in FIG. 3) is peeled off. A heat-sensitive adhesive die-bonding sheet DS that constitutes a laminated sheet for attachment provided on one surface of the base sheet BS, and a die-bonding sheet DS that interacts with the base sheet BS to form a sandwich. It is composed of a sheet BS and a cover sheet PS made of substantially the same sheet. Here, the die bonding sheet DS has a closed-loop bonding area A1 formed by cutting the die bonding sheet DS corresponding to the outer size of the wafer W and is bonded to the wafer W, and is adjacent to the bonding area A1. The strip-shaped peeling area A2 formed by cutting the upstream area in the feeding direction is peeled off.
[0036] 前記シート貼付装置 10は、図 1,図 4ないし図 6に示されるように、ウェハ Wの収納 手段 11と、ウェハ Wを一枚ずつ取り出して搬送する搬送手段 12と、ウェハ Wの位置 決めを行うァライメント手段 13と、前記ダイボンディングシート DSを切断する切断手 段 15と、この切断により形成される剥離領域 A2を剥離する第 1の剥離手段 17と、ァ ライメント処理済みのウェハ Wに貼付領域 A1を貼付する貼付手段 19と、前記貼付領 域 A1をウエノ、 Wに貼付した後に、ベースシート BSを貼付領域 A1から剥離する第 2 の剥離手段 20とを備えて構成されて 、る。  As shown in FIG. 1, FIG. 4 to FIG. 6, the sheet sticking device 10 includes a storage unit 11 for storing the wafer W, a transfer unit 12 for taking out and transferring the wafers W one by one, Alignment means 13 for positioning, cutting means 15 for cutting the die bonding sheet DS, first peeling means 17 for peeling a peeled area A2 formed by this cutting, and an alignment-processed wafer W And a second peeling means 20 for peeling the base sheet BS from the sticking area A1 after sticking the sticking area A1 to the stencil W, and then sticking the sticking area A1 to the weno and W. You.
[0037] 前記収納手段 11は、図 6に示されるように、上下二段のキャリア 22と、これらキヤリ ァ 22を上下に昇降させる駆動モータ 23と、ボールねじ軸 24とを含む。キャリア 22は 、各ウェハ間に所定の間隔を形成する状態で上下方向に沿って多段状に収容され ている。このキャリア 22の上下方向位置は、図示しないセンサにより検出可能に設け られており、ウェハ Wの各段位置、枚数などが検出可能となっている。  As shown in FIG. 6, the storage means 11 includes an upper and lower carrier 22, a drive motor 23 for vertically moving the carriers 22, and a ball screw shaft 24. The carriers 22 are accommodated in multiple stages along the vertical direction with a predetermined space formed between the wafers. The vertical position of the carrier 22 is provided so as to be detectable by a sensor (not shown), so that the position of each stage of the wafer W, the number of wafers W, and the like can be detected.
[0038] 前記搬送手段 12は、多関節型のアーム 25を備えたロボットにより構成されている。 ロボット本体 26は上下に昇降可能に設けられているとともに、アーム 25は水平方向 に回転可能に設けられ、これにより、前記キャリア 22からウェハ Wを一枚ずつ取り出 す位置と、ァライメント手段 13にウエノ、 Wを移載する位置と、後述する共通の処理位 置との間を移動するようになっている。また、アーム 25の先端側には吸着孔 25Aが 設けられており、当該吸着孔 25Aによって、ウェハ Wが中央部位置にて吸着支持さ れる。なお、アーム 25は、吸着したウエノ、 Wの面を反転させる機能を備えて構成され ている。 [0038] The transfer means 12 is constituted by a robot having an articulated arm 25. The robot body 26 is provided so as to be able to move up and down, and the arm 25 is provided so as to be rotatable in the horizontal direction, so that the position for taking out the wafers W one by one from the carrier 22 and the alignment means 13 It moves between a position where UNO and W are transferred and a common processing position described later. Further, a suction hole 25A is provided on the distal end side of the arm 25, and the wafer W is suction-supported at the center position by the suction hole 25A. Note that the arm 25 is configured to have a function of reversing the surface of the attracted ueno and W.
[0039] 前記ァライメント手段 13は、ァライメントテーブル 27と、センサ 28とを含んで構成さ れている。ァライメントテーブル 27は、略水平面内で回転可能となる回転部 27Aを備 えており、センサ 28は、ウェハ Wに形成されたオリエンテーションフラット W1位置を 検出してウェハ Wの位置決めを行うようになって!/、る。  The alignment means 13 is configured to include an alignment table 27 and a sensor 28. The alignment table 27 has a rotating part 27A that can rotate in a substantially horizontal plane, and the sensor 28 detects the position of the orientation flat W1 formed on the wafer W to position the wafer W. ! /
[0040] 前記切断手段 15は、図 4及び図 7に示されるように、略水平位置に繰り出されるシ 一ト基材 Sの上方位置で、軸線向きがシート基材 Sの繰出方向（図 4中矢印 D方向）と 略同一の向きに配置された切断力付与ローラー 29と、シート基材 Sよりも下方に配置 された切断テーブル 30と、この切断テーブル 30の上面側に設けられた切断刃 31と、 切断テーブル 30を上下方向に移動させる駆動装置 32 (図 5参照）とを備えて構成さ れている。切断力付与ローラー 29は、後述する冷却プレート 105に支持されている。 なお、本実施形態では、切断テーブル 30の略中心を通る仮想鉛直線 C (図 4参照） が共通する処理位置の略中心となるワークセンターとして設定されている。また、この 切断手段 15は、図 4に示される位置を待機位置とし、前記直線 Cに沿って上昇して シート基材 Sの直下位置まで上昇可能に設けられている。  [0040] As shown in Figs. 4 and 7, the cutting means 15 is positioned above the sheet base material S that is fed out to a substantially horizontal position, and the axial direction is the feeding direction of the sheet base material S (Fig. 4). A cutting force applying roller 29 arranged in substantially the same direction as the direction of the middle arrow D), a cutting table 30 arranged below the sheet substrate S, and a cutting blade provided on the upper surface side of the cutting table 30 31 and a driving device 32 (see FIG. 5) for moving the cutting table 30 in the vertical direction. The cutting force applying roller 29 is supported by a cooling plate 105 described later. In the present embodiment, a virtual vertical line C (see FIG. 4) passing substantially the center of the cutting table 30 is set as a work center that is substantially the center of the common processing position. The cutting means 15 is provided so as to be able to ascend along the straight line C to a position immediately below the sheet base material S, with the position shown in FIG.
[0041] 前記切断刃 31は、ウェハ Wの外形に対応してエンドレス形状（閉ループ）に設けら れた第 1の切断刃 31Aと、当該第 1の切断刃 31Aよりもシート基材 Sの前記繰出方向 Dにおける上流側に離れた位置でダイボンディングシート DSを幅方向に切断する第 2の切断刃 31Bと、第 1の切断刃 31Aに連続するとともに、第 2の切断刃 31Bよりも繰 出方向下流側で当該第 2の切断刃 31Bと略平行に配置された左右一対をなす第 3 の切断刃 31C, 31Cとからなる。第 1の切断刃 31Aは、ウェハ Wのオリエンテーション フラット W1に対応した直線部が、前記繰出方向 Dにおける上流側に位置してシート 基材 Sを横切る幅方向に延びる配置とされている。ここで、第 1の切断刃 31Aにより貼 付領域 A1が形成され、第 1の切断刃 31Aの前記直線部を含む一部 (繰出方向上流 側の一部）と前記第 2及び第 3の切断刃 31B, 31Cとにより剥離領域 A2が形成される [0041] The cutting blade 31 is provided with a first cutting blade 31A provided in an endless shape (closed loop) corresponding to the outer shape of the wafer W, and the first cutting blade 31A of the sheet base material S more than the first cutting blade 31A. The second cutting blade 31B, which cuts the die bonding sheet DS in the width direction at a position away from the upstream side in the feeding direction D, and the second cutting blade 31A, which are continuous with the first cutting blade 31A, are further fed out from the second cutting blade 31B. A pair of left and right third cutting blades 31C, 31C arranged substantially parallel to the second cutting blade 31B on the downstream side in the direction. The first cutting blade 31A has a linear portion corresponding to the orientation flat W1 of the wafer W positioned on the upstream side in the feeding direction D, and The arrangement extends in the width direction across the base material S. Here, the application region A1 is formed by the first cutting blade 31A, and a part (a part on the upstream side in the feeding direction) of the first cutting blade 31A including the linear portion and the second and third cuts are formed. The peeled area A2 is formed by the blades 31B and 31C.
[0042] 前記切断刃 31は、図 7 (B)に示されるように、その断面形状において、上端部が略 二等辺三角形の頂点となる形状に設けられているとともに、前記切断テーブル 30の 上面側をエッチング処理することにより切断テーブル 30と一体に形成されている。従 つて、図 7 (C)に示されるように、第 1の切断刃 31Aは、エンドレス形状であっても、一 枚刃をエンドレス形状に曲げ加工して形成した場合に見られる継ぎ目は存在しない ものとなる。また、第 3の切断刃 31C, 31Cは第 1の切断刃 31Aに対して継ぎ目のな い状態で連続することとなる。本発明では、第 3の切断刃 31Cを設けることにより、貼 付領域 A1を除く外周領域全体を剥離することなぐ部分的に形成される剥離領域 A 2を剥離するだけで貼付領域 A1がウェハ Wに貼付可能とされている。 [0042] As shown in FIG. 7 (B), the cutting blade 31 has a cross-sectional shape whose upper end is formed to have a vertex of a substantially isosceles triangle and an upper surface of the cutting table 30. It is formed integrally with the cutting table 30 by etching the side. Therefore, as shown in FIG. 7 (C), the first cutting blade 31A does not have a seam which is seen when the single cutting blade is formed by bending a single blade into an endless shape, even if it has an endless shape. It will be. Further, the third cutting blades 31C, 31C are continuous with the first cutting blade 31A in a seamless state. In the present invention, by providing the third cutting blade 31C, the peeling area A2 formed only by peeling a part of the peeling area A2 that does not peel the entire outer peripheral area except the sticking area A1 can be used. It can be attached to.
[0043] 前記第 1の剥離手段 17は、剥離領域 A2を剥離するための装置である。この第 1の 剥離手段 17は、図 1、図 8及び図 9に示されるように、シート基材 Sの繰出方向を横切 る幅方向に剥離用テープ Tを回行可能に支持する剥離ヘッド 33と、剥離用テープ供 給部 34と、剥離用テープ卷取部 35と、剥離ヘッドベース 36とにより構成されている。 剥離ヘッド 33は、上部が開放するケース 37と、当該ケース 37内で回転可能に設けら れるとともに、軸線向きがシート基材 Sの繰出方向 Dに沿うように図 9中前後一対の関 係に配置された上部ガイドローラー 38, 38と、これら上部ガイドローラー 38, 38間に 位置するブラケット 39と、当該ブラケット 39を昇降可能に支持するシリンダ 40と、上 部ガイドローラー 38, 38の直近内側に設けられるとともに、前記ブラケット 39と共に 上下に昇降可能に設けられた前後一対のヒートブロック 42, 42とを含み、このヒート ブロック 42, 42が上昇したときに、上部ガイドローラー 38, 38間に掛け回されている 剥離用テープ Tの面位置を上昇させて前記剥離領域 A2に剥離用テープ Tを当接さ せて熱接着部 41 (図 15参照）をシート基材 Sの幅方向二箇所領域に形成できるよう になっている。 [0043] The first peeling means 17 is a device for peeling the peeled area A2. As shown in FIGS. 1, 8 and 9, the first peeling means 17 is a peeling head that supports the peeling tape T so as to be able to circulate in the width direction crossing the feeding direction of the sheet base material S. 33, a peeling tape supply section 34, a peeling tape winding section 35, and a peeling head base 36. The peeling head 33 is provided in a case 37 whose upper part is open, and is provided rotatably in the case 37, and has a pair of front and rear in FIG. 9 so that the axial direction is along the feeding direction D of the sheet base material S. The upper guide rollers 38, 38 arranged, the bracket 39 located between the upper guide rollers 38, 38, the cylinder 40 for supporting the bracket 39 so as to be able to move up and down, and the inner side of the upper guide rollers 38, 38 And a pair of front and rear heat blocks 42, 42 which are provided so as to be able to move up and down together with the bracket 39. When the heat blocks 42, 42 rise, they are wound around the upper guide rollers 38, 38. Then, the surface position of the peeling tape T is raised, and the peeling tape T is brought into contact with the peeling area A2 so that the heat bonding portion 41 (see FIG. 15) is formed in two regions in the width direction of the sheet base material S. Can be formed It is as follows.
[0044] 前記剥離用テープ供給部 34は、テープ保持ローラー 44と、当該テープ保持ローラ 一 44と剥離ヘッド 33との間に設けられた駆動ローラー 45と、この駆動ローラー 45と の間に剥離用テープ Tを挟み込むピンチローラー 46と、駆動ローラー 45に回転駆動 力を付与するモーター Mとにより構成されている。一方、テープ卷取部 35は、図示し ないモーターにより卷取方向に回転駆動される卷取ローラー 48と、前記剥離ヘッド 3 3の上部ガイドローラー 38との間に設けられた複数のローラー 49〜53とにより構成さ れている。また、剥離ヘッドベース 36は、前記テープ保持ローラー 44及び剥離ヘッド 33を支持するフレーム Fを上下方向にガイドするガイドレール 55と、フレーム Fを上 下に昇降させるシリンダ 56とからなる上下昇降機構 57と、前記フレーム Fを前後方向 (図 8中左右方向）に移動させて剥離ヘッド 33を前記ワークセンター Cに対して進退 させる一軸ロボット機構 58とにより構成されている。 The peeling tape supply unit 34 includes a tape holding roller 44 and the tape holding roller A drive roller 45 provided between the roller 44 and the peeling head 33, a pinch roller 46 for sandwiching the peeling tape T between the drive roller 45, and a motor M for applying a rotational driving force to the drive roller 45; It consists of. On the other hand, the tape winding unit 35 includes a plurality of rollers 49 to 49 provided between a winding roller 48 driven to rotate in a winding direction by a motor (not shown) and an upper guide roller 38 of the peeling head 33. 53. The peeling head base 36 includes a guide rail 55 for vertically guiding a frame F supporting the tape holding roller 44 and the peeling head 33 and a cylinder 56 for vertically moving the frame F up and down. And a single-axis robot mechanism 58 that moves the frame F in the front-rear direction (the left-right direction in FIG. 8) to move the peeling head 33 forward and backward with respect to the work center C.
[0045] 前記剥離ヘッド 33は、非作動位置にあるきは、シート基材 Sにおけるダイボンディン グシート DSの面よりも下方位置で、後方に待機した位置をとり、剥離領域 A2を剥離 するときに、ダイボンディングシート DSの下面側に前進して剥離領域 A2の面にヒート ブロック 42を上昇させることとなる。  When the peeling head 33 is in the non-operation position, the peeling head 33 takes a position below the surface of the die bonding sheet DS on the sheet substrate S and waits rearward, and when peeling the peeling area A2, The heat block 42 is advanced to the lower surface side of the die bonding sheet DS to raise the heat block 42 to the surface of the peeling area A2.
[0046] 前記貼付手段 19は、図 4及び図 5に示されるように、シート基材 Sの繰出装置 60と 、シート基材 Sのカバーシート PSを巻き取る卷取装置 61と、ウェハ Wを支持する貼付 テーブル 62と、ダイボンディングシート DSの貼付領域 A1をウェハ Wの裏面に押圧 する押圧装置 63とにより構成されている。  As shown in FIGS. 4 and 5, the sticking means 19 includes a feeding device 60 for feeding the sheet base material S, a winding device 61 for winding the cover sheet PS of the sheet base material S, and a wafer W. It comprises a supporting table 62 to be supported and a pressing device 63 for pressing the bonding area A1 of the die bonding sheet DS against the back surface of the wafer W.
[0047] 前記繰出装置 60は、ロール状に卷回されたシート基材 Sを支持する支持ローラー 6 5と、シート基材 Sに繰出力を付与する上流側の駆動ローラー 66と、当該駆動ローラ 一 66との間にシート基材 Sを挟み込むピンチローラー 67と、駆動ローラー 66と支持 ローラー 65との間に配置された二つのガイドローラー 68, 69と、ピンチローラー 67の 軸線位置よりも下方に配置されてシート基材 Sを予め設定された高さ位置に保持する 位置調整ローラー 70とにより構成されている。また、カバーシート PSの卷取装置 61 は、卷取ローラー 72と、卷取駆動ローラー 73及び二つのガイドローラー 74, 75と力 らなる。シート基材 Sは、カバーシート PSを剥離した状態で、前記ピンチローラー 67 位置で剥離されて卷取ローラー 72に巻き取られるようになつている。従って、ピンチ口 一ラー 67位置を通過したシート基材 Sは、ベースシート BSとダイボンディングシート D sの二層となる状態で前記ワークセンター cを通過する方向に繰り出されることとなる [0047] The feeding device 60 includes a support roller 65 for supporting the sheet base material S wound in a roll shape, an upstream drive roller 66 for applying a feeding output to the sheet base material S, and the drive roller. A pinch roller 67 for sandwiching the sheet base material S between the pinch roller 66, two guide rollers 68, 69 disposed between the drive roller 66 and the support roller 65, and a position lower than the axial position of the pinch roller 67. The position adjusting roller 70 is arranged and holds the sheet base material S at a preset height position. The winding device 61 of the cover sheet PS includes a winding roller 72, a winding driving roller 73, and two guide rollers 74 and 75. The sheet substrate S is peeled off at the position of the pinch roller 67 and wound up by the winding roller 72 in a state where the cover sheet PS is peeled off. Therefore, the sheet base material S that has passed through the 67 position of the pinch opening is one of the base sheet BS and the die bonding sheet D. s will be fed out in the direction of passing through the work center c in a state of two layers
[0048] 前記貼付テーブル 62は、図 10及び図 11にも示されるように、テーブル本体 77と、 当該テーブル本体 77を上下方向に昇降させるシリンダ 78と、このシリンダ 78を支持 する中間テーブル 79と、当該中間テーブル 79を支持するベーステーブル 80と、これ ら中間テーブル 79及びベーステーブル 80をシート基材 Sの繰出方向 Dに沿って進 退させるガイドレール 81, 82と、これらガイドレール 81, 82に沿って中間テーブル 79 及びベーステーブル 80に駆動力を付与する図示しないシリンダ装置を含んで構成さ れている。ここで、テーブル本体 77の下面側には、図 11に示されるように、加熱装置 84が設けられている。この加熱装置 84は、ウェハ Wに前記貼付領域 A1を貼付する ためにテーブル本体 77を所定温度に制御する装置であり、当該温度は、ダイボンデ イングシート DSの特性に応じて任意に可変設定できるようになつている。 As shown in FIGS. 10 and 11, the sticking table 62 includes a table body 77, a cylinder 78 that moves the table body 77 up and down, and an intermediate table 79 that supports the cylinder 78. A base table 80 for supporting the intermediate table 79; guide rails 81 and 82 for moving the intermediate table 79 and the base table 80 along the feeding direction D of the sheet base material S; Along with a cylinder device (not shown) for applying a driving force to the intermediate table 79 and the base table 80. Here, a heating device 84 is provided on the lower surface side of the table body 77, as shown in FIG. The heating device 84 is a device that controls the table main body 77 to a predetermined temperature in order to attach the attachment region A1 to the wafer W. The temperature can be arbitrarily set variably according to the characteristics of the die bonding sheet DS. It has become.
[0049] 前記テーブル本体 77は、図 11に示されるように、ウェハ Wの表面（回路形成面）が 下面側となるように当該ウェハ Wを支持したときに、その外縁に沿う閉ループ状の凸 状リング部 86を備えて構成され、この凸状リング部 86の内側となる凹状の空間がゥェ ハ Wの吸着空間 87を形成するようになっている。吸着空間 87の底部には、吸着孔 8 7Aが形成されており、当該吸着孔 87Aは、図示しない減圧ポンプに接続されるよう になっている。本実施形態におけるテーブル本体 77は、弾性部材、例えばゴムを成 形素材として形成されているとともに、凸状リング部 86の凸部幅 W2 (図 11参照）は、 約 2mm程度に設定され、当該凸部の外周縁がウェハ Wの外周縁に略一致する状 態で当該ウェハ Wを吸着支持することができる。従って、ウェハ Wの表面にバンプが ウエノ、 Wの外周縁直近領域まで形成されて 、ても、当該バンプに干渉することなくゥ エノ、 Wを支持することが可能となる。なお、凸状リング部 86の凸部高さ Hは、バンプ の高さに略対応する高さに設定されるものであり、本実施形態では、約 0. 45mmに 設定されている。従って、ウェハ Wを吸着支持したときに、バンプの下端が吸着空間 87の底部に略接触する程度となり、吸着力が作用しても、テーブル本体 77の弾力が これを吸収することで、バンプに損傷を与えることはない。なお、前記凸部幅 W2及び 高さ Hは、対応するウエノ、 Wに応じて設定することができる。 [0050] 前記貼付テーブル 62と相互に作用する押圧装置 63は、図 4及び図 5に示されるよ うに、固定用ローラー 89及びプレスローラー 90により構成されている。これら固定用 ローラー 89及びプレスローラー 90は、ベースシート BSの上面側に位置して上下に 昇降可能に設けられ、プレスローラー 90は、ヒーター内蔵タイプとして構成されてい るとともに、ベースシート BSの長さ方向（繰出方向 D)に沿って移動可能に設けられ、 当該移動によって前記貼付領域 A1を所定温度に保ちつつ貼付圧力を付与して当 該貼付領域 A1をウエノ、 Wの面に貼付できるようになって ヽる。 As shown in FIG. 11, when the wafer W is supported such that the surface (circuit forming surface) of the wafer W is on the lower surface side, the table body 77 has a closed-loop convex shape along the outer edge thereof. A concave space inside the convex ring portion 86 forms a suction space 87 for the wafer W. At the bottom of the suction space 87, a suction hole 87A is formed, and the suction hole 87A is connected to a pressure reducing pump (not shown). The table main body 77 in this embodiment is formed of an elastic member, for example, rubber as a molding material, and the convex portion width W2 (see FIG. 11) of the convex ring portion 86 is set to about 2 mm. The wafer W can be suction-supported in a state where the outer peripheral edge of the convex portion substantially coincides with the outer peripheral edge of the wafer W. Therefore, even if the bumps are formed on the surface of the wafer W up to the region near the outer peripheral edge of the wafer, the wafers and W can be supported without interfering with the bumps. The height H of the convex ring portion 86 is set to a height substantially corresponding to the height of the bump, and is set to approximately 0.45 mm in the present embodiment. Accordingly, when the wafer W is suction-supported, the lower end of the bump is almost in contact with the bottom of the suction space 87, and even if suction force acts, the elasticity of the table body 77 absorbs this, so that the bump is applied to the bump. No damage. Note that the convex portion width W2 and height H can be set according to the corresponding Ueno and W. As shown in FIGS. 4 and 5, the pressing device 63 that interacts with the attaching table 62 includes a fixing roller 89 and a press roller 90. The fixing roller 89 and the press roller 90 are provided on the upper surface side of the base sheet BS so as to be able to move up and down, and the press roller 90 is configured as a built-in heater type and has a length equal to the length of the base sheet BS. So that the sticking area A1 can be stuck to the surface of the weno and W by applying a sticking pressure while keeping the sticking area A1 at a predetermined temperature by the movement. Become.
[0051] 前記第 2の剥離手段 20は、前述した切断力付与ローラー 29を支持する冷却装置 9 3と、この冷却装置 93の下方において、シート基材 Sよりも下面側に位置する剥離テ 一ブル 94と、シート基材 Sのベースシート BSを貼付領域 A1から剥離する一対の剥 離ローラー 96, 97と、これら剥離ローラー 96, 97によって剥離されたベースシート B Sをガイドするガイドローラー 98と、モーター Mlによって回転する駆動ローラー 99と 、シート基材 Sを挟み込むピンチローラー 100と、ガイドローラー 101と、ベースシート BSを巻き取る卷取ローラー 102とを備えて構成されている。ここで、前述した上流側 の駆動ローラー 66と下流側となる前記駆動ローラー 99とによりシート基材 Sを所定の テンションに保つように制御されている。  [0051] The second peeling means 20 includes a cooling device 93 that supports the above-described cutting force applying roller 29, and a peeling surface positioned below the cooling device 93 and on the lower surface side of the sheet substrate S. And a pair of peeling rollers 96, 97 for peeling the base sheet BS of the sheet base material S from the attaching area A1, a guide roller 98 for guiding the base sheet BS peeled by the peeling rollers 96, 97, It is provided with a driving roller 99 rotated by the motor Ml, a pinch roller 100 for sandwiching the sheet substrate S, a guide roller 101, and a winding roller 102 for winding the base sheet BS. Here, the upstream drive roller 66 and the downstream drive roller 99 are controlled to maintain the sheet base material S at a predetermined tension.
[0052] 前記冷却装置 93は、貼付領域 A1をウェハ Wに貼付する際の温度に対して相対的 に温度降下させる温度調整装置として機能するものである。この冷却装置 93は、下 面側が吸着面として構成された冷却プレート 105と、当該冷却プレート 105上に設け られた温度調整部 106とからなり、シート基材 Sの幅方向後方に配置されたレール 10 7に沿って昇降シリンダ 108を介して昇降可能に支持されているとともに、レール 107 の後方に配置されたシリンダ 109を介してシート基材 Sの幅方向に移動可能に設けら れている。冷却装置 93は、冷却プレート 105の略中心がワークセンター C上に設定さ れた状態で上下に昇降するように設けられて 、る。  [0052] The cooling device 93 functions as a temperature adjusting device that lowers the temperature relatively to the temperature at which the attachment region A1 is attached to the wafer W. The cooling device 93 includes a cooling plate 105 having a lower surface serving as an adsorption surface, and a temperature adjusting unit 106 provided on the cooling plate 105, and a rail disposed rearward in the width direction of the sheet base material S. It is supported so as to be able to move up and down along a 107 through an elevating cylinder 108, and is provided so as to be movable in the width direction of the sheet base material S via a cylinder 109 arranged behind the rail 107. The cooling device 93 is provided so as to move up and down with the substantially center of the cooling plate 105 set on the work center C.
[0053] 前記剥離テーブル 94は、図 4に示されるように、非作動時においてシート基材 Sの 繰出方向下流側に退避した位置を保つ一方、作動時に、中心が前記ワークセンター Cに位置するまで移動するように設けられている。この剥離テーブル 94は、上面側が 貼付テーブル 62のテーブル本体 77と実質的に略同一の構造をなすように設けられ 、当該剥離テーブル 94上に位置するウェハ Wを吸着支持する構成とされている。な お、剥離テーブル 94は、図 5に示されるように、昇降機構 110を介して昇降可能に設 けられている。 As shown in FIG. 4, the peeling table 94 keeps its position retracted to the downstream side in the feeding direction of the sheet base material S when it is not operated, while its center is located at the work center C when it is operated. It is provided to move up to. The peeling table 94 is provided such that the upper surface thereof has substantially the same structure as the table body 77 of the sticking table 62. The wafer W positioned on the peeling table 94 is suction-supported. The peeling table 94 is provided so as to be able to move up and down via an elevating mechanism 110, as shown in FIG.
[0054] 前記剥離ローラー 96、 97は、それらの間にベースシート BSが通過する状態で、ベ ースシート BSの繰出方向上流側に向力つて移動可能に設けられており、これにより、 ウエノ、 Wを剥離テーブル 94で吸着した状態で、剥離ローラー 96, 97が図 12中右側 に移動することで、貼付領域 A1をウェハ Wの面に残して当該貼付領域 A1からべ一 スシート BSを剥離して卷取ローラー 99で順次巻き取るように構成されて 、る。この際 、ダイボンディングシート DSは前述した剥離領域 A2と前記貼付領域 A1を除 ヽた部 分がベースシート BSと共に巻き取られることとなる。  [0054] The peeling rollers 96 and 97 are provided so as to be able to move to the upstream side in the feeding direction of the base sheet BS in a state where the base sheet BS passes between them, whereby the Ueno, W When the release rollers 96 and 97 are moved to the right in FIG. 12 while the base sheet BS is attracted by the release table 94, the base sheet BS is separated from the bonding area A1 while leaving the bonding area A1 on the surface of the wafer W. The winding roller 99 is configured to wind sequentially. At this time, a part of the die bonding sheet DS excluding the peeling area A2 and the sticking area A1 described above is wound together with the base sheet BS.
[0055] 次に、前記シート貼付装置 10の全体的な動作について、図 13ないし図 18をも参 照しながら説明する。  Next, the overall operation of the sheet sticking apparatus 10 will be described with reference to FIGS. 13 to 18.
[0056] 初期設定として、シート基材 Sを引き出し、カバーシート PSをダイボンディングシート DSから剥離して当該カバーシート PSのリード端を卷取ローラー 72に固定する。そし て、カバーシート PSが剥離された後のシート基材 Sのリード端を、第 2の剥離手段 20 を構成する卷取ローラー 102に固定する。  As an initial setting, the sheet base material S is pulled out, the cover sheet PS is peeled off from the die bonding sheet DS, and the lead end of the cover sheet PS is fixed to the winding roller 72. Then, the lead end of the sheet base material S from which the cover sheet PS has been peeled off is fixed to the winding roller 102 constituting the second peeling means 20.
[0057] 装置動作開始前において、貼付テーブル 62,剥離テーブル 94は、図 4中実線で 示される待機位置にあり、また、冷却装置 93は、ワークセンター Cにおけるシート基 材 Sの上方待機位置にあり、切断手段 15のテーブル 30は、ワークセンター Cにおけ るシート基材 Sの下方待機位置にある。  Before the operation of the apparatus, the attaching table 62 and the peeling table 94 are at the standby positions indicated by solid lines in FIG. 4, and the cooling device 93 is at the standby position above the sheet base S in the work center C. The table 30 of the cutting means 15 is at a standby position below the sheet substrate S in the work center C.
[0058] 図示しない電源投入により、搬送手段 12が作動し、収納手段 11のキャリア 22から ウエノ、 Wを一枚吸着して取り出し、ァライメントテーブル 27上に移載する。ァライメント テーブル 27は、ウェハ Wを平面内で回転させてオリエンテーションフラット W1をセン サ 28で検出し、ウェハ Wの位置若しくは向きを決定する。  When the power supply (not shown) is turned on, the transporting means 12 is operated, and a piece of Ueno and W is sucked and taken out from the carrier 22 of the storage means 11 and transferred onto the alignment table 27. The alignment table 27 rotates the wafer W in a plane, detects the orientation flat W1 with the sensor 28, and determines the position or orientation of the wafer W.
[0059] 前記貼付テーブル 62におけるテーブル本体 77の中心がワークセンター Cに移動 すると、ァライメント処理されたウェハ Wが搬送手段 12を介して移載され、その後に、 テーブル本体 77が待機位置に移動し、当該待機位置にて所定時間ウェハ Wを加熱 する。 [0060] 図 13に示されるように、ウェハ Wが前記待機位置にて加熱されている間に、切断手 段 15のテーブル 30が上昇し、切断刃 31がシート基材 S (ダイボンディングシート DS) の下面に略接する位置まで上昇する。同時に、冷却装置 93がシリンダ 109を介して 前方に移動するとともに、昇降シリンダ 108を介して下降し、冷却装置 93の後部下面 側に支持されている切断力付与ローラー 29がシート基材 Sの上面側の前端縁に接 する位置に移動する。この状態で、シリンダ 109により冷却装置 93全体が後方に向 力つて略水平方向に移動すると、つまり、シート基材 Sの繰出方向を横切る幅方向に 移動すると、前記切断刃 31と切断力付与ローラー 29とで挟み込まれた領域における シート基材 Sが切断 (ハーフカット)されることとなり、切断刃 31を構成する第 1ないし 第 3の切断刃 31A、 31B、 31Cに対応した切断線がダイボンディングシート DSに形 成されることとなる（図 3参照)。これにより、ダイボンディングシート DSの領域内に、ゥ ェハ Wの平面形状に対応する貼付領域 A1と、これの繰出方向後部側（上流側）に 隣接する帯状の剥離領域 A2が形成される。 When the center of the table main body 77 in the sticking table 62 moves to the work center C, the aligned wafer W is transferred via the transfer means 12, and thereafter, the table main body 77 moves to the standby position. Then, the wafer W is heated at the standby position for a predetermined time. As shown in FIG. 13, while the wafer W is being heated at the standby position, the table 30 of the cutting means 15 rises, and the cutting blade 31 moves the sheet base material S (die bonding sheet DS). ) Ascends to a position almost in contact with the lower surface of. At the same time, the cooling device 93 moves forward via the cylinder 109 and descends via the elevating cylinder 108, and the cutting force applying roller 29 supported on the lower rear surface side of the cooling device 93 is moved to the upper surface of the sheet substrate S. To the position where it touches the front edge of the side. In this state, when the entire cooling device 93 is moved rearward in the substantially horizontal direction by the cylinder 109, that is, when the entire cooling device 93 is moved in the width direction crossing the feeding direction of the sheet base material S, the cutting blade 31 and the cutting force applying roller are moved. 29 is cut (half-cut) in the area sandwiched by 29 and the cutting lines corresponding to the first to third cutting blades 31A, 31B and 31C constituting the cutting blade 31 are die-bonded. It will be formed on Sheet DS (see Figure 3). As a result, in the area of the die bonding sheet DS, an attaching area A1 corresponding to the planar shape of the wafer W and a strip-shaped peeling area A2 adjacent to the rear side (upstream side) in the feeding direction are formed.
[0061] 前記切断が終了すると、切断力付与ローラー 29は冷却装置 93と共に初期の待機 位置に戻る一方、切断手段 15のテーブル 30も待機位置に戻る。  When the cutting is completed, the cutting force applying roller 29 returns to the initial standby position together with the cooling device 93, and the table 30 of the cutting means 15 also returns to the standby position.
[0062] 次いで、図 14ないし図 17に示されるように、第 1の剥離手段 17が作動して剥離へ ッド 33が待機位置力も剥離領域 A2の直下に移動するとともに、冷却装置 93の冷却 プレート 105がベースシート BSの上面を吸着する。そして、ヒートブロック 42が上昇し て剥離用テープ Tがダイボンディングシート DSの剥離領域 A2に部分的に加熱接着 される。このようにして剥離領域 A2に剥離用テープ Tが加熱接着された後に、剥離 ヘッド 33が下降して剥離用テープ Tを巻き取ることにより、図 17に示されるように、ダ ィボンディングシート DSにおける貼付領域 A1に隣接した繰出方向後部領域が一定 量剥離されることとなり、当該剥離終了後に剥離ヘッド 33が後方待機位置に戻ること となる。  Next, as shown in FIG. 14 to FIG. 17, the first peeling means 17 is actuated, and the peeling head 33 is moved to a position just below the peeling area A2, and the cooling device 93 is cooled. The plate 105 sucks the upper surface of the base sheet BS. Then, the heat block 42 is raised, and the peeling tape T is partially heated and adhered to the peeling area A2 of the die bonding sheet DS. After the peeling tape T is heated and adhered to the peeling area A2 in this way, the peeling head 33 descends and winds up the peeling tape T, thereby forming the die bonding sheet DS as shown in FIG. The rear area in the feeding direction adjacent to the attaching area A1 is peeled by a certain amount, and after the peeling is completed, the peeling head 33 returns to the rear standby position.
[0063] 剥離領域 A2の剥離が行われた状態で、待機位置で加熱されたウェハ Wは、図 18 に示されるように、貼付テーブル 62に載せられた状態でワークセンター C位置まで搬 送される。そして、テーブル本体 77が上昇すると（図 18 (A)参照）、押圧装置 63を構 成する固定用ローラー 89と、プレスローラー 90がベースシート BSの上面位置まで下 降し（図 18 (B)参照）、固定用ローラー 89は、ベースシート BSに下方への押圧力を 付与した状態に固定される一方、プレスローラー 90は回転しながら前記繰出方向下 流側に移動し (図 18 (C)参照）、ベースシート BSに押圧力を付与して前記貼付領域 A1をウエノ、 Wの面に貼付した後に僅かに上昇して繰出方向上流側に戻ることとなる 。この貼付動作中のシート基材 Sは、前述した上流側の駆動ローラー 66と下流側の 駆動ローラー 99とによって所定のテンションに保たれるように制御されている。 [0063] With the peeling of the peeling area A2 being performed, the wafer W heated at the standby position is transported to the work center C position while being placed on the sticking table 62, as shown in FIG. You. When the table body 77 is raised (see FIG. 18A), the fixing roller 89 and the press roller 90 constituting the pressing device 63 are lowered to the upper surface position of the base sheet BS. As shown in FIG. 18 (B), the fixing roller 89 is fixed in a state in which a downward pressing force is applied to the base sheet BS, while the press roller 90 rotates to the downstream side in the feeding direction while rotating. After moving (see FIG. 18 (C)), a pressing force is applied to the base sheet BS to attach the attachment area A1 to the surface of the stencil W, then the ascent slightly rises and returns to the upstream side in the feeding direction. The sheet substrate S during the sticking operation is controlled by the upstream drive roller 66 and the downstream drive roller 99 so as to be maintained at a predetermined tension.
[0064] 貼付領域 A1の貼付が行われると、冷却装置 93が下降してウェハ Wをシート基材 S を挟んで吸着し、前記テーブル本体 77が吸着を解除して、下降して待機位置に復 帰することとなるが、この際、ウェハ Wは、ダイボンディングシート DSの貼付領域 A1 に貼り付けられて 、るため、ウェハ Wはダイボンディングシート DSの下面側に残され ることとなり、その間にウエノ、 W及び基材シート Sを設定温度にまで冷却する。  When the sticking area A1 is stuck, the cooling device 93 descends and sucks the wafer W across the sheet base material S, the table body 77 releases the sucking, and descends to the standby position. At this time, the wafer W is attached to the attaching area A1 of the die bonding sheet DS, so that the wafer W is left on the lower surface side of the die bonding sheet DS. Then, the Ueno, W and the base sheet S are cooled to the set temperature.
[0065] そして、ダイボンディングシート DSの下面に貼り付いてワークセンターに残されるゥ ェハ Wの下面側に、第 2の剥離手段 20を構成する剥離テーブル 94が前記待機位置 力もワークセンター C位置に移動して上昇する。剥離テーブル 94によりウェハ Wが吸 着されると、図 12に示されるように、剥離ローラー 96, 97がベースシート BSの繰出方 向上流側に向力つて移動しつつベースシート BSが貼付領域 A1から剥離されて卷取 ローラー 102によって順次巻き取られることとなる。この際、ダイボンディングシート D Sは、前記貼付領域 A1及び剥離領域 A2が除去された残りの領域がベースシート B Sと共に巻き取られることとなる。  [0065] Then, on the lower surface side of wafer W that is adhered to the lower surface of die bonding sheet DS and left in the work center, a peeling table 94 that constitutes second peeling means 20 is provided at the standby position and the work center C position. Go to and rise. When the wafer W is sucked by the peeling table 94, as shown in FIG. 12, the peeling rollers 96 and 97 move toward the flow side of the base sheet BS in the direction in which the base sheet BS is fed, and the base sheet BS is moved toward the adhering area A1. , And are sequentially wound up by the winding roller 102. At this time, in the die bonding sheet DS, the remaining area where the sticking area A1 and the peeling area A2 are removed is wound together with the base sheet BS.
[0066] 次いで、搬送手段 12がウェハ Wの上面側を吸着し、これを反転させながら収納手 段 11のキャリア 22にウェハ Wを収納し、シート貼付の一連の工程を終了する。  Next, the transfer means 12 sucks the upper surface side of the wafer W, stores the wafer W in the carrier 22 of the storage means 11 while inverting the upper surface side, and ends a series of steps of attaching the sheet.
[0067] 以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示 されている力 本発明は、これに限定されるものではない。  [0067] As described above, the best configuration, method, and the like for carrying out the present invention are those disclosed in the above description. The present invention is not limited to this.
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、 本発明の技術的思想及び目的の範囲から逸脱することなぐ以上説明した実施形態 に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更をカロ えることができるものである。  That is, although the present invention has been particularly illustrated and described mainly with respect to a specific embodiment, the shape, position, or arrangement of the embodiment described above may be changed without departing from the technical idea and the scope of the present invention. For example, those skilled in the art can make various changes as necessary.
[0068] 例えば、前記第 1の剥離手段 17は、図示構成例に限定されるものではなぐ剥離 領域 A2を剥離することができれば足りる。具体的には、剥離領域 A2をピールプレー トを介して鋭角剥離することも可能である。また、剥離領域 A2の前記繰出方向に沿う 長さは、貼付領域 A1の前記繰出方向に沿う中間から、当該貼付領域 A1の後端より 繰出方向上流側に所定距離離れた位置までの長さがあればよい。 [0068] For example, the first peeling means 17 is not limited to the illustrated configuration example. It is enough if the area A2 can be peeled off. Specifically, the peeling area A2 can be peeled at an acute angle via a peel plate. Further, the length of the peeling area A2 along the feeding direction is a length from the middle of the sticking area A1 along the feeding direction to a position away from the rear end of the sticking area A1 by a predetermined distance upstream in the feeding direction. I just need.
[0069] また、前記実施形態では、ウェハ Wがオリエンテーションフラット W1を備えた形状と してが、外周縁に Vノッチが形成されたウェハも対象とすることができる。この場合に は、第 1の切断刃 31Aに Vノッチに対応した刃の領域を形成すれば足りる。また、被 着体がウェハ Wである場合に限らず、ウェハ以外の板状体を被着体とすることもでき る。 Further, in the above-described embodiment, the wafer W has a shape provided with the orientation flat W1, but a wafer having a V-notch on the outer peripheral edge can also be used. In this case, it suffices to form a blade area corresponding to the V notch on the first cutting blade 31A. Further, the present invention is not limited to the case where the adherend is the wafer W, and a plate-like body other than the wafer may be used as the adherend.
[0070] 更に、シート基材 Sは、ダイボンディングシート DSを備えたものに限らず、感熱接着 性の接着シートであればよぐ例えば、被着体の面を保護するための感熱接着性の 保護シートであってもよい。また、特開 2002— 280329号に開示された保護膜形成 用のシートや、ドライレジストフイルムであってもよい。  [0070] Further, the sheet base material S is not limited to the one provided with the die bonding sheet DS, but may be a heat-sensitive adhesive sheet. For example, a heat-sensitive adhesive sheet for protecting the surface of an adherend may be used. It may be a protection sheet. Further, a sheet for forming a protective film disclosed in JP-A-2002-280329 or a dry resist film may be used.
[0071] また、前記実施形態では、感熱接着性のダイボンディングシートの適用例を示した ため、加熱装置や冷却装置を備えたシート貼付装置を説明したが、感熱接着性を有 しないその他のシートである場合には、加熱装置、冷却装置は不要となる。  Further, in the above-described embodiment, since the application example of the heat-sensitive adhesive die-bonding sheet has been described, the sheet sticking device including the heating device and the cooling device has been described. However, other sheets having no heat-sensitive adhesiveness are described. In this case, a heating device and a cooling device are not required.
[0072] 更に、剥離領域 A2は、貼付領域 A1の繰出方向上流側に形成したが、プレスロー ラー 90が繰出方向下流側から上流側に向かって移動することで貼付領域 A1をゥェ ハ Wに貼付する構成の場合は、剥離領域 A2は、前記繰出方向下流側に形成される こととなる。これは、貼付領域 A1の貼付開始側を囲む領域にダイボンディングシート DSが存在していると、切断刃 31で切断を行っても、再接着が発生してしまう傾向が 強くなり、一方、貼付領域 A1の貼付終了側を囲むダイボンディングシート DSを剥離 しなくても、前記再接着は発生しないことが実験により明らかになつたためである。こ のような傾向は、図 18 (B)に示されるように、前記プレスローラー 90が下降した貼付 動作の初期段階において、ウェハ Wと貼付領域 A1の前記繰出方向上流側縁が相 互に接触している時間が相対的に若干長いことに起因するものと推定される。つまり 、本発明は、貼付領域 A1の面に沿ってウェハ Wの一端側力ゝら他端側に押圧力を付 与しながら貼付を行う場合に、その押圧力の付与開始側となる領域に前記剥離領域 A2が形成されてこれを剥離しておけば、前記再接着の問題は生ずることはなぐ最 小限の領域を剥離するだけで足りることとなる。 Further, the peeling area A2 is formed on the upstream side in the feeding direction of the sticking area A1, but the press roller 90 moves from the downstream side in the feeding direction to the upstream side to move the sticking area A1 to the wafer W. In the case of a configuration in which the sheet is affixed to the sheet, the peeling area A2 is formed on the downstream side in the feeding direction. This is because, if the die bonding sheet DS is present in the area surrounding the bonding start side of the bonding area A1, even if the cutting is performed with the cutting blade 31, there is a strong tendency for re-adhesion to occur. This is because it has been clarified by an experiment that the re-adhesion does not occur even if the die bonding sheet DS surrounding the bonding end side of the region A1 is not removed. As shown in FIG. 18 (B), such a tendency is such that in the initial stage of the bonding operation in which the press roller 90 is lowered, the wafer W and the upstream edge of the bonding area A1 in the feeding direction come into contact with each other. It is presumed that this is due to the relatively long time taken. In other words, the present invention is applied to a case where the pressing force is applied to the other end side of the wafer W along the surface of the bonding area A1 while applying the pressing force to the other end side. The peeling area If A2 is formed and peeled off, the problem of re-adhesion does not occur, and it is sufficient to peel off the minimum area.
また、前記実施形態では、貼付テーブル 62は、中間テーブル 79, ベーステーブル 80及びガイドレール 81, 82、加熱装置 84等を備えた構成とした力 本発明はこれに 限定されるものではなぐテーブル本体 79が待機位置からワークセンター Cとの間を 移動可能な構成であれば種々の変更を行うことができる  In the above-described embodiment, the sticking table 62 has a force including an intermediate table 79, a base table 80, guide rails 81 and 82, a heating device 84, and the like. The present invention is not limited to this. Various changes can be made as long as 79 can move from the standby position to work center C.

Claims

請求の範囲 The scope of the claims
[1] 帯状に連続するベースシートと、このベースシートの一方の面に設けられた貼付用の 積層シートとを含むシート基材を用い、当該シート基材を繰り出す過程で積層シート を被着体の平面形状にカットして貼付領域を形成し、当該貼付領域を前記被着体に 貼付するシート貼付装置において、  [1] A sheet base including a continuous base sheet in a strip shape and a laminated sheet for pasting provided on one side of the base sheet, and the laminated sheet is adhered in the process of feeding the sheet base. In a sheet sticking apparatus that cuts into a planar shape to form a sticking region and sticks the sticking region to the adherend,
前記被着体の収納手段力 当該被着体を一つずつ取り出して搬送する搬送手段 と、前記積層シートを被着体の平面形状に合わせて切断して前記貼付領域を形成 するとともに、当該貼付領域に隣接する位置で前記積層シートの繰出方向に沿う前 後を幅方向に切断して剥離領域を形成する切断手段と、前記剥離領域を剥離する 第 1の剥離手段と、被着体を支持して当該被着体に前記貼付領域を貼付する貼付 テーブルを含む貼付手段と、前記ベースシートを貼付領域から剥離する第 2の剥離 手段とを含み、  The means for storing the adherends The conveying means for taking out and transporting the adherends one by one, and cutting the laminated sheet according to the planar shape of the adherend to form the attaching area, and A cutting means for forming a peeled area by cutting the front and rear of the laminated sheet in the width direction at a position adjacent to the area, a first peeling means for peeling the peeled area, and supporting the adherend. And an attaching means including an attaching table for attaching the attaching area to the adherend, and a second removing means for removing the base sheet from the attaching area.
前記搬送手段、切断手段、貼付手段、第 1及び第 2の剥離手段は、順次繰り出され るシート基材に対して予め設定された共通の処理位置をワークセンターとして相互に 干渉することなく移動可能に設けられていることを特徴とするシート貼付装置。  The transporting means, the cutting means, the attaching means, the first and second peeling means can be moved without interfering with each other as a work center at a common processing position set in advance with respect to the sequentially fed sheet base material. A sheet sticking apparatus characterized by being provided in a sheet.
[2] 前記切断手段は、被着体の外縁に沿ってエンドレス形状に設けられた第 1の切断刃 と、当該第 1の切断刃よりもシート基材の繰出方向上流側に離れた位置で前記積層 シートを幅方向に切断する第 2の切断刃と、前記第 1の切断刃に連続するとともに、 前記第 2の切断刃よりも繰出方向下流側で当該第 2の切断刃と略平行に配置された 第 3の切断刃とを備え、  [2] The cutting means includes: a first cutting blade provided in an endless shape along an outer edge of the adherend; and a position separated from the first cutting blade by a position upstream of the first cutting blade in the sheet feeding direction. A second cutting blade that cuts the laminated sheet in the width direction, the second cutting blade being continuous with the first cutting blade, and being substantially parallel to the second cutting blade on the downstream side in the feeding direction from the second cutting blade. With a third cutting blade arranged,
前記第 1の切断刃により前記貼付領域を形成する一方、第 1の切断刃の一部と前 記第 2及び第 3の切断刃とにより前記剥離領域を形成し、当該剥離領域を第 1の剥 離手段で剥離した後に、前記貼付領域を被着体に貼付することを特徴とする請求項 1記載のシート貼付装置。  The pasting area is formed by the first cutting blade, and the peeling area is formed by a part of the first cutting blade and the second and third cutting blades. 2. The sheet sticking apparatus according to claim 1, wherein the sticking area is stuck to an adherend after peeling by a peeling means.
[3] 前記第 1の切断刃と前記第 3の切断刃は継ぎ目なく相互に連続することを特徴とする 請求項 2記載のシート貼付装置。  3. The sheet sticking apparatus according to claim 2, wherein the first cutting blade and the third cutting blade are continuous with each other without a seam.
[4] 前記切断手段はテーブルを更に含み、前記第 1、第 2及び第 3の切断刃は前記テー ブルの上面側に一体成形されていることを特徴とする請求項 2記載のシート貼付装 置。 4. The sheet sticking device according to claim 2, wherein the cutting means further includes a table, and the first, second, and third cutting blades are integrally formed on an upper surface side of the table. Place.
[5] 前記第 1,第 2及び第 3の切断刃は、前記テーブルの上面側をエッチング処理するこ とにより形成されていることを特徴とする請求項 4のシート貼付装置。  5. The sheet sticking apparatus according to claim 4, wherein the first, second, and third cutting blades are formed by etching an upper surface of the table.
[6] 前記第 1の剥離手段は、シート基材の繰出方向を横切る幅方向に剥離用テープを回 行可能に支持する剥離ヘッドを含み、前記剥離用テープを前記剥離領域に接着し て前記剥離用テープを回行させることで、前記剥離領域を前記ベースシートから剥 離することを特徴とする請求項 1記載のシート貼付装置。  [6] The first peeling means includes a peeling head that rotatably supports the peeling tape in a width direction transverse to a feeding direction of the sheet base material, and adheres the peeling tape to the peeling region. 2. The sheet sticking apparatus according to claim 1, wherein the peeling area is peeled off from the base sheet by rotating a peeling tape.
[7] 前記第 1の剥離ヘッドはヒートブロックにより構成され、当該ヒートブロックにより前記 剥離用テープを剥離領域に熱接着することを特徴とする請求項 6記載のシート貼付 装置。  7. The sheet sticking apparatus according to claim 6, wherein the first peeling head includes a heat block, and the heat block thermally bonds the peeling tape to a peeling area.
[8] 前記ヒートブロックは、前記剥離領域の幅方向に沿う複数箇所に配置されていること を特徴とする請求項 7記載のシート貼付装置。  [8] The sheet sticking apparatus according to claim 7, wherein the heat blocks are arranged at a plurality of positions along a width direction of the peeling region.
[9] 前記被着体は表面にバンプが設けられた半導体ウェハであり、 [9] The adherend is a semiconductor wafer provided with bumps on its surface,
前記貼付テーブルは、半導体ウェハのバンプ形成面が下面側となるように当該半 導体ウェハを支持したときに、前記バンプに干渉しな 、ウェハの外縁に沿う閉ループ 状の凸状リング部を備えていることを特徴とする請求項 1記載のシート貼付装置。  The bonding table includes a closed loop-shaped convex ring portion along the outer edge of the semiconductor wafer, which does not interfere with the bump when the semiconductor wafer is supported such that the bump forming surface of the semiconductor wafer is on the lower surface side. The sheet sticking apparatus according to claim 1, wherein
[10] 前記凸状リング部の凸部高さは、バンプの高さに略対応する高さに設けられているこ とを特徴とする請求項 9記載のシート貼付装置。 10. The sheet sticking apparatus according to claim 9, wherein the height of the convex portion of the convex ring portion is provided at a height substantially corresponding to the height of the bump.
[11] 前記貼付テーブルは、前記凸状リング部の内側が半導体ウェハの吸着空間として構 成されて!/ヽるとともに、弾性部材を成形素材として形成されて ヽることを特徴とする請 求項 9又は 10記載のシート貼付装置。 [11] The application table, wherein the inside of the convex ring portion is configured as a suction space for a semiconductor wafer, and the sticking table is formed by using an elastic member as a molding material. Item 9. A sheet sticking apparatus according to Item 9 or 10.
[12] 前記被着体は半導体ウェハであり、前記積層シートは、感熱接着性のダイボンディン グシートであることを特徴とする請求項 1記載のシート貼付装置。 12. The sheet sticking apparatus according to claim 1, wherein the adherend is a semiconductor wafer, and the laminated sheet is a heat-sensitive adhesive die-bonding sheet.
[13] 帯状に連続するベースシートと、このベースシートの一方の面に設けられた貼付用の 積層シートとを含むシート基材を用い、当該シート基材を繰り出す過程で積層シート を被着体の平面形状にカットして貼付領域を形成し、当該貼付領域を前記被着体に 貼付するシート貼付方法にぉ 、て、 [13] A sheet base including a continuous base sheet in a strip shape and a laminated sheet for attachment provided on one surface of the base sheet, and the laminated sheet is adhered to the adherend in the process of feeding the sheet base. A sheet sticking method in which a sticking area is formed by cutting the sheet into the planar shape described above and sticking the sticking area to the adherend,
前記被着体を搬送手段で一つずつ取り出す工程と、前記積層シートに貼付領域と 剥離領域とを形成する切断工程と、前記剥離領域を剥離する第 1の剥離工程と、貼 付領域を被着体に貼付する貼付工程と、前記ベースシートを貼付領域から剥離する 第 2の剥離工程とを含み、 A step of taking out the adherend one by one by a conveying means, A cutting step of forming a peeling area, a first peeling step of peeling the peeling area, a sticking step of sticking the sticking area to an adherend, and a second peeling of the base sheet from the sticking area And a process,
前記切断工程は、被着体の外縁に沿って継ぎ目なく積層シートを切断して貼付領 域を形成する第 1の切断と、当該第 1の切断位置よりもシート基材の繰出方向上流側 に離れた位置で前記積層シートを幅方向に切断する第 2の切断と、前記第 1の切断 線に連続するとともに、前記第 2の切断位置よりも繰出方向下流側で当該第 2の切断 と略平行な方向に積層シートを切断する第 3の切断とを同時に行うことにより達成され 前記第 1の切断によって貼付領域を形成する一方、第 1の切断の一部と前記第 2及 び第 3の切断によって剥離領域を形成し、  The cutting step includes a first cutting in which the laminated sheet is cut along the outer edge of the adherend without a seam to form an attachment area, and an upstream side in the feeding direction of the sheet substrate from the first cutting position. A second cutting in which the laminated sheet is cut in the width direction at a distant position; and a second cutting that is continuous with the first cutting line and substantially downstream of the second cutting position in the feeding direction. This is achieved by simultaneously performing a third cutting for cutting the laminated sheet in a parallel direction, and while forming the attachment region by the first cutting, a part of the first cutting and the second and third cutting are performed. Forming a peeled area by cutting,
前記剥離領域を第 1の剥離手段で剥離した後に前記貼付領域を被着体に貼付し、 前記貼付領域を被着体に残すように前記シート基材を貼付領域から剥離すること を特徴とするシート貼付方法。  After the peeling area is peeled by a first peeling means, the sticking area is stuck to an adherend, and the sheet substrate is peeled from the sticking area so that the sticking area remains on the adherend. Sheet sticking method.
[14] 前記第 1及び第 3の切断は継ぎ目なく連続することを特徴とする請求項 13記載のシ ート貼付方法。 14. The sheet attaching method according to claim 13, wherein the first and third cuts are continuous without a seam.
[15] 前記切断、貼付領域の貼付、第 1及び第 2の剥離は、前記ベースシートの繰り出しを 停止した状態で、予め設定された共通の処理位置をワークセンターとして順次行わ れることを特徴とする請求項 13又は 14記載のシート貼付方法。  [15] The cutting, the sticking of the sticking area, and the first and second peeling are sequentially performed with a preset common processing position as a work center in a state where the feeding of the base sheet is stopped. 15. The sheet sticking method according to claim 13 or 14, wherein
PCT/JP2005/007122 2004-04-19 2005-04-13 Apparatus and method for sticking sheet WO2005104221A1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2004122624A JP4430973B2 (en) 2004-04-19 2004-04-19 Sheet sticking device and sticking method
JP2004122625A JP4509635B2 (en) 2004-04-19 2004-04-19 Pasting table
JP2004-122623 2004-04-19
JP2004-122622 2004-04-19
JP2004-122624 2004-04-19
JP2004122623A JP2005305567A (en) 2004-04-19 2004-04-19 Sheet cutter
JP2004-122625 2004-04-19
JP2004122622A JP4528553B2 (en) 2004-04-19 2004-04-19 Sheet peeling apparatus and peeling method

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EP3026697A1 (en) * 2014-11-28 2016-06-01 Mechatronic Systemtechnik GmbH Welding device for welding a film to a substrate

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JP2003090988A (en) * 2001-09-17 2003-03-28 Seiko Instruments Inc Device and method for cleaning liquid crystal panel
JP2004119573A (en) * 2002-09-25 2004-04-15 Renesas Technology Corp Manufacture of semiconductor device and film sticking apparatus

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JP2004119573A (en) * 2002-09-25 2004-04-15 Renesas Technology Corp Manufacture of semiconductor device and film sticking apparatus

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JP2007317886A (en) * 2006-05-25 2007-12-06 Lintec Corp Sheet pasting device and sheet pasting method
JP4637057B2 (en) * 2006-05-25 2011-02-23 リンテック株式会社 Sheet sticking device and sticking method
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