WO2006027953A1 - Tape applicator, tape mounter, and tape mounting method - Google Patents

Tape applicator, tape mounter, and tape mounting method Download PDF

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Publication number
WO2006027953A1
WO2006027953A1 PCT/JP2005/015317 JP2005015317W WO2006027953A1 WO 2006027953 A1 WO2006027953 A1 WO 2006027953A1 JP 2005015317 W JP2005015317 W JP 2005015317W WO 2006027953 A1 WO2006027953 A1 WO 2006027953A1
Authority
WO
WIPO (PCT)
Prior art keywords
tape
device
ring frame
dicing tape
base material
Prior art date
Application number
PCT/JP2005/015317
Other languages
French (fr)
Japanese (ja)
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Kenji Kobayashi
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004-258078 priority Critical
Priority to JP2004258078A priority patent/JP4723216B2/en
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2006027953A1 publication Critical patent/WO2006027953A1/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/6839Separation by peeling using peeling wedge or knife or bar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

A tape applicator, a tape mounter (10) capable of mounting a semiconductor wafer (W) on a ring frame (RF) while peeling off a dicing tape (DT) formed by making closed loop-like slits (C) in a tape base material (TB) in a process for feeding out a band-like web (L), and a tape mounting method. The web (L) is inspected by an inspection device (14) to check whether or not the tape base material causes any defect such as damage before the slits (C) are formed. If any defect is detected by the inspection device, the slits (C) are formed without the defective portion of the tape base material.

Description

 Specification

 Tape sticking device, mounting device, and mounting method

 Technical field

 [0001] The present invention relates to a tape applying device, a mounting device, and a mounting method, and in particular, when a semiconductor wafer is fixed to a ring frame, a tape base material for forming a dicing tape is temporarily provided on one surface of a base sheet. The present invention relates to a tape sticking device, a mounting device, and a mounting method suitable for forming a dicing tape using a worn original fabric, peeling the dicing tape, and fixing a semiconductor wafer to a ring frame.

 Background art

 Conventionally, when a semiconductor wafer with a circuit surface formed is diced, the semiconductor wafer is placed inside the ring frame, and a dicing tape is attached to these surfaces to form the semiconductor wafer into the ring frame. It has been fixed. The dicing tape is affixed by applying a continuous dicing tape in a band shape to the ring frame and the semiconductor wafer, and then cutting off the outer peripheral side of the dicing tape according to the shape of the ring frame using a cutter.

 As another affixing method, for example, as shown in Patent Document 1, a strip-shaped raw material in which a tape base material is temporarily attached to one surface of a base sheet is used, and the tape base material corresponds to the shape of a ring frame. A method is also adopted in which a closed-loop cut is formed, a dicing tape is formed on the inside, and then the dicing tape is peeled off one by one and attached to the ring frame.

Patent Document 1: Japanese Patent Laid-Open No. 6-216242

 Disclosure of the invention

 Problems to be solved by the invention

[0004] In this method, the dicing tape is cut within the surface of the ring frame by applying a continuous dicing tape in a band shape and then cutting off the outer peripheral side of the dicing tape with a cutter according to the shape of the ring frame. Therefore, there is a disadvantage that the ring frame is significantly damaged by the blade of the cutter. In particular, it can be manufactured at low cost and light weight. In order to achieve this, when using a ring frame made of resin, the degree of damage becomes more remarkable.

 [0005] On the other hand, as shown in Patent Document 1, in the method of applying a dicing tape that has been cut into a ring frame shape in advance, a dicing tape that is in the form of a label is previously applied to the surface of the tape base material. The process of forming is needed. Further, when the tape base material is a hard and thick material, there is a disadvantage that the tape base material is peeled off from the base sheet in the course of feeding. Furthermore, since the dicing tape in which the cut is formed in the label shape is wound in a roll shape in a state of being applied to the base sheet via an adhesive, it is provided for each layer along the radial direction of the roll. The dicing tape will not always be wound so that it is exactly overlapped. Therefore, due to the elastic deformation of the adhesive and the edges of the dicing tape that overlap with each other, a pressing mark (step) or a scratch caused by the winding pressure is formed on the surface of the dicing tape, and the plane accuracy is greatly reduced. . When a dicing tape having such a stamp mark or scratch is pasted on a ring frame, it causes air contamination due to a decrease in planar accuracy and causes bad effects such as sticking failure.

 [0006] Incidentally, the dicing tape described above may have scratches in its surface or may have impurities such as dust attached thereto. In such a case, the presence of such scratches or the like causes air to be mixed into the affixing surface between the semiconductor wafer and the dicing tape, resulting in a partial affixing failure. In this regard, conventionally, dicing tape is formed in a predetermined shape at a predetermined interval in advance, and no special countermeasures are taken. For example, even if there is a scratch, it is used as it is for pasting. Therefore, there was an inconvenience that poor sticking could not be avoided.

 [0007] [Object of the invention]

 The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to form a cut tape on a base substrate temporarily attached to a base sheet to form a sticking tape. Inspect whether there is an abnormality in the tape substrate, and if an abnormality is detected, form a notch in the area excluding the abnormal part to form an adhesive tape, and then apply the adhesive tape. It is providing the tape sticking apparatus which can be stuck to a to-be-adhered body.

[0008] Another object of the present invention is to inspect whether or not there is an abnormality in the tape base material and detect the abnormality. Mounting apparatus and mounting method for forming a dicing tape by forming a cut in a region excluding the abnormal portion in the case, and then attaching the dicing tape to the ring frame and the semiconductor wafer and mounting the semiconductor wafer on the ring frame To provide.

 Means for solving the problem

 [0009] In order to achieve the above object, the present invention provides a feeding device that feeds a strip-shaped original fabric in which a tape base material is temporarily attached to one surface of a base sheet, and the tape on the feeding path of the original fabric. A cutting device for forming a tape for sticking by forming a closed loop incision in a base material; a peeling device for peeling the tape for sticking from the base sheet; a support for supporting a predetermined adherend and the peeling A pasting device for pasting the pasting tape on the adherend by moving the device relative to the adherend, and a scraping device for winding up the original fabric after stripping the pasting tape with the stripping device,

 An inspection device for the tape base material is arranged upstream of the cutting device in the feed direction of the raw material. When this inspection device detects an abnormality of the tape base material, the abnormal portion is passed through the cutting device. Form the tape for sticking, t.

[0010] Further, according to the present invention, a ring frame is arranged on a table, a semiconductor wafer is arranged inside the ring frame, and a dicing tape is attached to the ring frame to fix the semiconductor wafer to the ring frame. In the mounting device,

 A feeding device that feeds a belt-shaped raw material with a tape base material temporarily attached to one surface of a base sheet, and a dicing tape by forming a closed-loop cut in the tape base material on the raw material feeding route. A cutting device to be formed, a peeling device for peeling the dicing tape from the base sheet, a pasting device for sticking the dicing tape to the ring frame and the semiconductor wafer by relatively moving the table and the peeling device; A stripping device that winds up the original fabric after the dicing tape is peeled off by the peeling device, and a tape substrate inspection device is arranged upstream of the cutting device in the feed direction of the original fabric. When the apparatus detects an abnormality of the tape substrate, the dicing tape is formed by passing the abnormal part through the cutting apparatus.

[0011] Further, according to the present invention, a ring frame is disposed on a table and the ring frame is arranged. In a mounting method in which a semiconductor wafer is arranged inside a ring and a semiconductor wafer is fixed to the ring frame by attaching a dicing tape to the ring frame.

 A step of inspecting whether there is an abnormality in the tape base material in the middle of feeding a belt-like raw material in which the tape base material is temporarily attached to one surface of the base sheet;

 A cutting step of forming a dicing tape by forming a closed-loop cut in the tape base material that has undergone the inspection step;

 Peeling the dicing tape from the base sheet and attaching the dicing tape to a ring frame and a semiconductor wafer;

 Winding the original fabric after peeling the dicing tape with the peeling device, and when the abnormality of the tape base material is detected in the inspection step, the abnormal portion is excluded and the cut is formed. The method is taken.

The invention's effect

 According to the present invention, a strip-shaped original fabric is formed in a state where the tape base material is adhered to the base sheet, and the original fabric is fed out in a state force wound in a roll shape. A dicing tape is formed on the unrolled raw material by forming a closed-loop cut by a cutting device so as to have a planar shape corresponding to an adherend such as a ring frame and a semiconductor wafer. The dicing tape is peeled off via a peeling device such as a peel plate, and then attached to an adherend such as a ring frame or a semiconductor wafer. Therefore, the process of cutting the film on the ring frame after application becomes unnecessary, and damage to the ring frame can be avoided. In addition, since the dicing tape is formed on the path for feeding out the original fabric, the above-described pressing marks and scratches due to the winding pressure are not formed in the dicing tape. It can be attached to semiconductor wafers and ring frames while maintaining accuracy.

 In addition, abnormalities such as dust adhering to the tape base material and the presence or absence of scratches are detected in the stage before the incision by the cutting device is formed. Therefore, it is possible to avoid the cause of sticking failure due to air mixed between the dicing tape and the semiconductor wafer after sticking.

In the present specification, the term “closed loop” is sufficient if it is endless, and closed in a circular shape. In addition to cases, an ellipse, a polygon, and the like are included.

 Brief Description of Drawings

 FIG. 1 is a schematic front view of a mounting apparatus in the present embodiment.

 FIG. 2 is a schematic plan view of the main part of a die cutting apparatus.

 FIG. 3 is a schematic perspective view of a die cutting apparatus.

 FIG. 4 is a schematic perspective view of the die-cutting apparatus showing a state where the frame plate is omitted.

 FIG. 5 is a schematic perspective view of a die cut roll.

 FIG. 6 is a schematic front view of a die cut roll and a die receiving roll.

 Explanation of symbols

[0014] 10 Mount device (tape application device)

 11 Feeding device

 13 Die cutting device (Cut device)

 14 Inspection equipment

 15 Peeling device

 16 Pasting device

 17 Trapping device

 C notch

 L

 RF ring frame (Substrate)

 S base sheet

 TB tape substrate

 W Semiconductor wafer (Substrate)

 BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic front view of the mounting apparatus according to the present embodiment. In this figure, the mounting apparatus 10 is composed of a lower unit 10A and an upper unit 10B. The lower unit 10A includes a lower frame LF composed of a pair of frame plates F1 arranged in a direction orthogonal to the paper surface in FIG. 1 (up and down direction in FIG. 2), And a feeding device 11 for feeding a strip-shaped original fabric L having a tape base material TB temporarily attached to one surface of the base sheet S, and a closed loop on the tape base material TB on the delivery path of the raw material L Die-cutting device 13 as a cutting device for forming a die-cutting tape DT by forming an incision C (see Fig. 3), and placed upstream of the die-cutting device 13 in the feed direction of the original fabric L The tape substrate TB inspection device 14 is provided.

 [0016] The upper unit 10B includes an upper frame UF formed of a frame plate F2, a peeling device 15 that is disposed in a region of the upper frame UF, and also peels the dicing tape DT from a base sheet S force; Consists of a sticking device 16 for sticking the dicing tape DT to the ring frame RF and the semiconductor wafer W as an adherend, and a scraping device 17 for winding up the raw material after the dicing tape DT is peeled off by the peeling device 15 Has been. A table 19 as a support body movable in the left-right direction in FIG. 1 is arranged on the lower side of the peeling device 15, and the ring frame RF and the semiconductor wafer W are sucked and supported on the upper surface side of the table 19. It has become. In addition, each part of the apparatus in the lower unit 10A and the upper unit 10B is controlled entirely via a control device (not shown).

[0017] The feeding device 11 includes a motor Ml and a support shaft 21 that is rotationally driven by the motor Ml, and supports an original fabric L wound around the support shaft 21 in a roll shape. . The material L fed from the feeding device 11 passes through a guide roll 22, a first dancer roll 23, and guide rolls 25, 26 which are sequentially arranged downstream in the feeding direction, that is, toward the upper unit 10B. A notch C is formed at 13 and is further fed out to the upper unit 10B side through the guide holes 28 and 29. Here, the first dancer roll 23 is provided so as to be vertically movable along a vertically extending slot 30 formed in the frame plate F1, and an upper sensor 32 and a lower sensor 33 are provided at respective positions above and below the slot 30. Is arranged. When the first dancer roll 23 is raised as the raw material L is fed to the die-cutting device 13, the upper sensor 32 detects the raised position and outputs a signal to the control device. A drive signal is output to the motor Ml to feed out the original fabric L from the feeding device 11, while the first dancer roll 23 is lowered by its own weight due to this feeding, and the lower position of the first dancer roll 23 is lowered. The lower sensor 33 detects When this occurs, the operation of stopping the driving of the motor Ml is alternately performed via the control device.

 [0018] As shown in Fig. 2, the die-cutting device 13 is disposed between the frame plates Fl and F1 and the die-cut roll 36 provided with a cutting blade 36A on the outer peripheral surface, and is disposed relative to the die-cut roll 36. The die receiving roll 37, the motor M2 for rotating the die receiving roll 37, the main driving gear 39 fixed to the rotating shaft 38 of the die receiving roll 37, and the rotating shaft 40 of the die cut roll 36 are fixed to the above described A driven gear 42 that meshes with the main driving gear 39 is provided. The die cut roll 36 and the die receiving roll 37 are respectively provided with bearers 43 and 44, whereby the distance between the center axes of the die cut roll 36 and the die receiving roll 37 is maintained constant, and as a result, the cutting blade The tape base TB with 36A can be cut with high accuracy. The cutting blade 36A extends along a trajectory that draws a closed loop circle having a diameter slightly smaller than the diameter of the ring frame RF when the die cut roll 36 rotates, and cuts into the tape base material TB. Is formed at a height to form Further, as shown in FIG. 5, the cutting blade 36A is provided with a region N where no blade exists in the circumferential direction of the die cut roll 36, and as shown in FIG. 6, the cutting blade 36A does not exist. In a state where the region N is located on the die receiving roll 37 side, a clearance CL that can pass through the original fabric L without forming a notch in the original fabric L is maintained by the bearers 43 and 44.

 As shown in FIG. 3, slide blocks 47 and 47 having a bearing function are provided on both sides of the rotary shaft 40 of the die-cut roll 36, and these slide blocks 47 and 47 Arranged in substantially U-shaped notches 49, 49 formed in the plane of the plates Fl, F1. More specifically, the slide block 47 has a substantially H-shaped side end surface, and the slide block 47 is formed by the upper and lower formation end portions 49A of the cutout portions 49 entering the upper and lower grooves 47A. The surface of the frame plate F1 is provided so as not to fall off in a direction perpendicular to the surface. A spring member 51 is interposed between the slide block 47 and the U-shaped bottom portion 49B of the notch 49. In the presence of the spring member 51, the die cut roll 36 is separated from the die receiving roll 37. Is being energized.

[0020] The bearers 43, 43 are located on the outer peripheral surface portion on the opposite side to the corresponding bearers 44, 44. Rollers 53 and 53 that touch each other at the lower two positions are arranged. These rollers 53 are rotatably provided via bearings 55 and 55, and these bearings 55 and 55 are connected to each other via a connecting plate 56. The connecting plate 56 is provided so as to extend between the cutout portions 49 formed on the respective surfaces of the frame plates Fl and F1 and to be movable in the left-right direction in FIG. In addition, the U-shaped open end side of the notch 49 is closed by a plate-like member 59 extending between the frame plates Fl and F1, and the plate-like member 59 has two connecting portions 56 in the longitudinal direction. An adjustment handle 61 for moving the surface position in the left-right direction is provided. In the present embodiment, the connecting plate 56 can be moved in the right direction in FIG. 1 by rotating the adjustment handle 61 in the clockwise direction, and the rollers 55 and 55 of the bearings 55 and 55 fixed to the connecting plate 56 can be moved. The die cut roll 36 can be moved to the die receiving roll 37 side against the biasing force of the spring member 51 via the force bearers 43, 43. The bearer 43 on the die cut roll 36 side and the die receiving roll 37 side can be moved. Adjustment is possible so that the bearer 44 contacts. On the other hand, the die cut roll 36 can be separated from the die receiving roll 37 by the urging force of the spring member 51 by rotating the adjustment handle 61 counterclockwise.

 In the present embodiment, the inspection device 14 provided on the upstream side in the feed direction of the original fabric L with respect to the position of the die cutting device 13 is provided at a position immediately before the guide roll 25. The inspection device 14 can use, for example, an optical sensor such as a CCD camera, and preferably employs a wide-angle sensor that can cover the area of the dicing tape DT with a single imaging. In addition, even if the sensor cannot cover the area of the dicing tape DT, it may be possible to detect an abnormality in the tape base TB by multiple imaging. Inspection data from the inspection device 14 is output to the control device, and when there is no abnormality such as a scratch on the dicing tape DT, a cut C is formed by driving the die cutting device 13, while when an abnormality is detected, Based on the position data, the raw fabric L passes through the die-cutting device 13 so that the region where the abnormality exists is not included in the region of the cut C. Here, for example, when an abnormality is detected in a region where a single dicing tape DT is formed, the drive of the die cutting device 13 is stopped while maintaining the above-described clearance CL until the abnormal portion passes through. It will be.

[0022] The original fabric L in which the cut C is formed in the lower unit 10A is a support (not shown) It is supplied to the upper unit 10B through a pair of rolls 65 and 65 and a guide roll 66 supported by the apparatus.

 [0023] In the upper unit 10B, in the plane of the frame plate F2, a guide roll 70, a second dancer roll 71, a tension roll 72 for applying a predetermined tension to the original fabric L by a motor M3 capable of torque adjustment, and a pinch roll 73, the peeling device 15 is disposed through the guide roll 74, and the dicing tape DT is sequentially peeled by the peeling device 15. The original fabric L after the dicing tape DT is peeled off by the peeling device 15 passes through the drive roll 76 and the roll-up roll 77 driven by the motor M4, the third dancer roll 79, and the guide roll 80. The take-up device 17 is designed to wind up.

 [0024] The second dancer roll 71 is provided so as to be movable along a vertically extending slot 82 provided in the plane of the frame plate F2. An upper sensor 84 and a lower sensor 85 for detecting the rising position and the lowering position of the second dancer roll 71 are provided at the upper and lower portions of the slot 82, respectively. When the upper sensor 84 detects the rising position of the second dancer roll 71, the web L is fed out from the upstream side, and the second dancer roll 71 is lowered by its own weight. Then, when the lower sensor 85 detects the lowering position of the second dancer roll 71, the feeding of the original fabric L from the upstream side stops. The motor M3 urges the tension roll 72 in the reverse feeding direction so that the original fabric between the tension roll 72 and the drive roll 76 becomes a predetermined tension.

[0025] In the present embodiment, the peeling device 15 is constituted by a peel plate 87, and by rapidly reversing the feed direction of the original fabric L at the tip position of the peel plate 87, the original fabric L force is also dicing tape DT. The dicing tape DT is affixed to the ring frame RF on the table 19 and the upper surface of the semiconductor wafer W, which move according to the timing of peeling. At this time, a pressing roll 90 constituting a sticking device is arranged on the front end side of the peel plate 87, and the dicing tape DT peeled off by the pressing roll 90 is placed on the ring frame RF and the surface of the semiconductor wafer W with a predetermined amount. Affixing pressure is applied. A sensor 91 is arranged on the front side of the pressing roll 90 (upstream side in the feed direction of the original fabric L). The sensor 91 detects the leading position of the dicing tape DT in the feed direction, and the movement timing of the table 19 You will be able to make adjustments. [0026] The third dancer roll 79 is provided so as to be movable along a slot 92 provided in the plane of the frame plate F2 and extending in the vertical direction. An upper sensor 94 and a lower sensor 95 for detecting the rising position and the lowering position of the third dancer roll 79 are provided at the upper and lower portions of the slot 92, respectively, and the upper sensor 94 is positioned at the rising position of the third dancer roll 79. In the same manner as the first and second dancer rolls 23 and 71, the third dancer roll 79 is controlled to descend by its own weight, while the lower sensor 95 is controlled by the third dancer roll. When the lowering position of 79 is detected, the material L is wound up by the scraper 17. The scraping device 17 includes a motor M5 and a scraping shaft 97 connected to the motor M5.

 Next, the overall operation of the mounting apparatus 10 in the present embodiment will be described.

 [0028] As an initial operation, the original fabric L is pulled out from the feeding device 11, and the lead end of the original fabric L is fixed to the scraping shaft 97 of the tacking device 17 as shown in FIG. On the other hand, the ring frame RF and the semiconductor wafer W are adsorbed on the upper surface of the table 19 and kept waiting at the position indicated by the solid line in FIG. At the time of this initial work, the die cutting device 13 sets the outer peripheral area where the cutting blade 36A of the die cutting roll 36 does not exist to the die receiving roll 37 side to the initial position where the clearance CL is formed, and the raw material L passes through. Is maintained in an acceptable state.

 [0029] When the power is turned on, the control device generally controls each part of the upper and lower units 10A and 10B. That is, when the motors Ml, M2, M3, M4, and M5 are driven to feed the original fabric L, the first to third dancer rolls 23, 71, 79 reciprocate up and down. The original L feeding operation is performed while keeping the tension of the original L constant. In this feeding process, the inspection device 14 inspects the tape base material TB to inspect for the presence of scratches and dust. On the condition that no abnormality is detected by this inspection, the die cut roll 36 and the die receiving roll 37 rotate to cut the tape base TB, and sequentially form circular cuts C on the tape base TB. Become.

[0030] In this way, the dicing tape DT is formed on the original fabric L with the inner region of the notches formed on the tape base material TB as the dicing tape DT. When the dicing tape DT is detected by the sensor 91 provided in the vicinity of the peel plate 87, the table 19 starts moving to the right in FIG. 1 at the preset timing, and the peel plate The dicing tape DT that is sequentially peeled off at the tip position of 87 is fed out onto the ring frame RF and the semiconductor wafer and stuck by the pressing roll 90.

 [0031] Here, if the inspection device 14 detects an abnormality in the tape base material TB, the abnormal portion force is determined based on the inspection data whether the force belongs to the formation area of the dicing tape! To be judged. That is, even if there is an abnormality in the position off the formation area of the dicing tape DT, there is no problem in forming the cut C thereafter. On the other hand, if it is determined that the abnormality belongs to the formation area of the dicing tape DT, the die-cutting device 13 is in a stopped state while allowing the original fabric L to pass through until the abnormality portion passes. The dicing tape DT is formed at regular intervals by rotating until the next abnormal location is detected after the abnormal location has passed. When a plurality of abnormal locations are detected along the feed direction of the original fabric and they belong to the formation area of one dicing tape DT, the die cut device 13 is passed until the last abnormal location passes through the die cut device 13. Will be stopped.

 [0032] Therefore, according to such an embodiment, the dicing tape DT is formed in the process of feeding the strip-shaped original fabric L in which the tape base material TB is temporarily attached to the base sheet S, and then the ring frame RF and the semiconductor Since it is configured to be affixed to the wafer W, it is possible to eliminate the inconvenience of using an original fabric in which a dicing tape previously formed in a label shape is temporarily attached to a base sheet. In addition, when an abnormality such as a scratch is detected on the tape substrate TB, the dicing tape DT is formed by removing the abnormal part to form the dicing tape DT with excellent surface accuracy. As a result, the dicing tape DT can be applied to the semiconductor wafer W with high accuracy.

 [0033] The best configuration, method, and the like for carrying out the present invention are disclosed in the above description. The present invention is not limited to this.

 That is, the present invention is mainly illustrated and described mainly with respect to specific embodiments, but the embodiments described above without departing from the technical spirit and scope of the present invention. On the other hand, various modifications can be made by those skilled in the art in terms of shape, material, quantity, and other detailed configurations.

Therefore, the description limited to the shape disclosed above facilitates understanding of the present invention. Therefore, the present invention is not intended to limit the present invention. Therefore, the description in the names of members excluding some or all of the limitations such as the shape is included in the present invention. Is.

 For example, in the above-described embodiment, the case where the present invention is applied to a mounting apparatus that forms a dicing tape DT from a raw fabric L and affixes it to the ring frame RF and the semiconductor wafer W has been illustrated and described. The invention is not limited to this, and other adherends such as compact discs (CDs), digital versatile discs (DVDs), display panels, and tape sticking devices using glass as adherends are generally used. Can be applied.

 [0035] Further, in the above embodiment, the force constituting the mounting device 10 as a two-stage configuration of the lower unit 10A and the upper unit 10B. These units 10A and 10B are provided side by side or configured as a single unit. It is also possible. However, when configured as separate units as in the above-described embodiment, versatility that allows these units to be separated and used as independent units is provided.

 Furthermore, in the above embodiment, the die-cutting device 13 is adopted as a cutting device for forming the cut C in the tape base material TB, but other than forming the cut C using a rotary blade along the surface of the tape base material TB. Even a device of.

Claims

The scope of the claims
 [1] A feeding device that feeds a belt-shaped raw material having a tape base material temporarily attached to one surface of a base sheet, and a closed-loop cut in the tape base material on the feeding route of the raw material. A cutting device for forming a sticking tape, a peeling device for peeling the sticking tape from the base sheet, a support for supporting a predetermined adherend, and the peeling device are moved relative to each other for the sticking. A sticking device for sticking the tape to the adherend, and a scraping device for winding up the original fabric after the tape for sticking is peeled off by the peeling device;
 An inspection device for the tape base material is arranged upstream of the cutting device in the feed direction of the raw material. When this inspection device detects an abnormality of the tape base material, the abnormal portion is passed through the cutting device. A tape applicator for forming an adhesive tape.
 [2] In a mounting device in which a ring frame is arranged on a table, a semiconductor wafer is arranged inside the ring frame, and a dicing tape is attached to the ring frame to fix the semiconductor wafer to the ring frame.
 A feeding device that feeds a belt-shaped raw material with a tape base material temporarily attached to one surface of a base sheet, and a dicing tape by forming a closed-loop cut in the tape base material on the raw material feeding path. A cutting device to be formed, a peeling device for peeling the dicing tape from the base sheet, a pasting device for sticking the dicing tape to the ring frame and the semiconductor wafer by relatively moving the table and the peeling device; A stripping device that winds up the original fabric after the dicing tape is peeled off by the peeling device, and a tape substrate inspection device is arranged upstream of the cutting device in the feed direction of the original fabric. When the apparatus detects an abnormality of the tape substrate, the dicing tape is formed by passing the abnormal part through the cutting apparatus. .
[3] In a mounting method in which a ring frame is arranged on a table, a semiconductor wafer is arranged inside the ring frame, and a dicing tape is attached to the ring frame to fix the semiconductor wafer to the ring frame.
 A step of inspecting whether there is an abnormality in the tape base material in the middle of feeding the belt-shaped raw material with the tape base material temporarily attached to one surface of the base sheet;
A dicing tape is formed by forming a closed-loop cut in the tape base material that has undergone the inspection process. A cutting process for forming a loop;
 Peeling the dicing tape from the base sheet and attaching the dicing tape to a ring frame and a semiconductor wafer;
 A step of winding the original fabric after peeling the dicing tape with the peeling device, and when the abnormality of the tape base material is detected in the inspection step, the abnormal portion is excluded and the cut is formed. Mounting method characterized by.
PCT/JP2005/015317 2004-09-06 2005-08-24 Tape applicator, tape mounter, and tape mounting method WO2006027953A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004-258078 2004-09-06
JP2004258078A JP4723216B2 (en) 2004-09-06 2004-09-06 Tape sticking device, mounting device, and mounting method

Publications (1)

Publication Number Publication Date
WO2006027953A1 true WO2006027953A1 (en) 2006-03-16

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Application Number Title Priority Date Filing Date
PCT/JP2005/015317 WO2006027953A1 (en) 2004-09-06 2005-08-24 Tape applicator, tape mounter, and tape mounting method

Country Status (3)

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JP (1) JP4723216B2 (en)
TW (1) TW200618087A (en)
WO (1) WO2006027953A1 (en)

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JP4787713B2 (en) * 2006-10-10 2011-10-05 リンテック株式会社 Sheet sticking device and sticking method
JP4616231B2 (en) * 2006-10-30 2011-01-19 リンテック株式会社 Sheet sticking device and sticking method
JP4913550B2 (en) * 2006-11-07 2012-04-11 リンテック株式会社 Sheet sticking device and sticking method
JP5002267B2 (en) 2007-01-15 2012-08-15 株式会社新川 Die bonder, die bonding and thermobonding tape piece cutting and pasting method and program
JP4713541B2 (en) * 2007-06-04 2011-06-29 リンテック株式会社 Sheet pasting device
JP5139004B2 (en) * 2007-08-21 2013-02-06 リンテック株式会社 Sheet cutting device
JP4922140B2 (en) * 2007-12-03 2012-04-25 リンテック株式会社 Sheet sticking device and sticking method
JP5412260B2 (en) * 2009-12-10 2014-02-12 日東電工株式会社 Adhesive tape pasting method and apparatus using the same
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
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TW200618087A (en) 2006-06-01
JP2006073920A (en) 2006-03-16

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