JP5324399B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more specifically, an adhesive layer is provided on one surface of a belt-shaped base sheet, and can be divided into a plurality of divided sheets by cutting along an extending direction. The present invention relates to a sheet sticking apparatus and a sticking method suitable for sticking an adhesive sheet to an adherend.

For example, Patent Document 1 discloses an apparatus that uses a semiconductor wafer (hereinafter, simply referred to as a “wafer”) as an adherend and attaches an adhesive sheet to the wafer.
Moreover, as shown in FIG. 4A, there is a case where an adhesive sheet S that can be divided into a plurality of divided sheets S1 and S2 by sticking C is pasted. When such an adhesive sheet S is peeled off from the adherend W, the peeling force can be reduced by peeling off each of the divided sheets S1 and S2.

Japanese Patent No. 37759820

The sheet sticking device disclosed in Patent Document 1 sticks in a state in which a tensile force in the direction opposite to the feeding direction is applied to the adhesive sheet (protective film). When the adhesive sheet S provided so as to be split into the divided sheets S1 and S2 is used and the adhesive sheet S is attached to the adherend W, as shown in FIG. There is an inconvenience that a slack B is generated at the position and a sticking failure occurs.
This may be due to some factor at the time of feeding or winding of the adhesive sheet S, for example, when another is attached to one of the divided sheets and rolled up, or the adhesive layers of one of the divided sheets are adhered to each other. When there is a mismatch in the feed amount (winding amount) between the divided sheets S1 and S2, the tension varies between them, and as a result, the side of the divided sheet having the smaller tension. This is because slackening occurs, and when the sheet is pressed as it is by the pressing means R such as a roller and stuck to the adherend W, the portion of the cut C is torn and a slack B is formed.

[Object of invention]
An object of the present invention is to affix an adhesive sheet that is provided with an adhesive layer on one surface of a belt-like base material sheet and that can be divided into a plurality of divided sheets by cutting along the extending direction. An object of the present invention is to provide a sheet sticking apparatus and a sticking method that can prevent a sticking failure from occurring due to variations in tension applied to each divided sheet.

  In order to achieve the above object, the present invention provides an adhesive sheet in which an adhesive layer is provided on one surface of a belt-shaped base sheet and can be divided into a plurality of divided sheets by cutting along the extending direction. A sheet affixing device for affixing and adhering the adhesive sheet to an adherend, a feeding means for advancing the adhesive sheet, a tension applying unit for applying a tension to the adhesive sheet, and affixing the adhesive sheet by pressing it against the adherend The tension applying means is provided so as to individually apply tension to each of the divided sheets that can be divided by the cutting.

  In this invention, it is good to take the structure that the cutting | disconnection means which cut | disconnects the said adhesive sheet according to the magnitude | size of a to-be-adhered body is further included.

  The separation adhesive means further includes a separation preventing means for separating the divided adhesive sheets, and the separation prevention means mutually connects the cut side edges of the divided sheets between the time when the adhesive sheet is fed and the time when the adhesion is applied to the adherend. It can comprise so that the state which butts may be maintained.

  Furthermore, the present invention provides an adhesive sheet, which is provided with an adhesive layer on one surface of a belt-shaped base sheet, and can be divided into a plurality of divided sheets by cutting along the extending direction. A method of applying, the step of feeding out the adhesive sheet, the step of individually applying tension to each of the divided sheets of the extended adhesive sheet, and pressing the adhesive sheet against an adherend The method of having the process to do is taken.

  In the sheet sticking method, it is preferable to adopt a method of maintaining the state in which the cut side edges of the divided sheets are abutted with each other at least from the time when the adhesive sheet is fed out to the adherend.

According to the present invention, since tension can be individually applied to each divided sheet that can be divided by cutting, there is no variation in the tension of each divided sheet that is applied at the same time. Generation | occurrence | production can be suppressed and the malfunction that a sticking defect generate | occur | produces can be prevented.
Moreover, according to the structure provided with the cutting | disconnection means which cut | disconnects an adhesive sheet, it becomes possible to reduce that it receives restrictions on the shape of an adhesive sheet, and to improve versatility.
Further, in the configuration provided with the separation preventing means, the adhesive sheet is fed out in a state perpendicular to the feeding direction of the adhesive sheet, that is, in a direction in which each divided sheet is separated, so that It is possible to prevent the divided sheets from being separated, and to attach the adhesive sheet in a state where the cut side edges of the divided sheets are abutted without gaps.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The principal part schematic plan view of the said sheet sticking apparatus. The schematic perspective view of an adhesive sheet. (A) is a schematic perspective view which shows the state which stuck the adhesive sheet which can be divided | segmented on the to-be-adhered body, (B) is a schematic perspective view which shows the malfunction of (A).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIG. 1 and FIG. 2, the sheet sticking apparatus 10 is configured to press the adhesive sheet S against the wafer W, the feeding means 12 for the adhesive sheet S, the table 13 that supports the wafer W as the adherend. A pressing means 14 for attaching, a cutting means 15 for cutting the adhesive sheet S in accordance with the outer shape of the wafer W after the adhesive sheet S is attached to the wafer W, and an unnecessary sheet SD generated outside the wafer W by the cutting are wound. The take-up means 18 is provided. Here, as shown in FIG. 3, the adhesive sheet S in the present embodiment is provided with an adhesive layer A on one surface of a belt-shaped base sheet BS, and is a central portion in the width direction, and its extension. A sheet that can be divided into a first divided sheet S1 and a second divided sheet S2 by a cut C provided along the outgoing direction is employed. In addition, the depth of the cut C is provided so as not to penetrate or penetrate through the base sheet BS, or the depth of the cut C reaches the adhesive layer A through the base sheet BS. What penetrated the sheet | seat BS and the adhesive bond layer A can be used.

  The feeding means 12 supports the adhesive sheet S wound in a roll with the release sheet RL, and folds the release sheet RL fed out from the support roller 20 so that the adhesive sheet S is peeled off from the release sheet RL. A peeling member 22 made of a plate-like member that peels from the sheet, a collection roller 23 that winds and collects the release sheet RL, a plurality of guide rollers 25 to 32 disposed between the support roller 20 and the collection roller 23, and The loader 34 that detects the tension of the adhesive sheet S via the guide roller 28 when the adhesive roller S and the adhesive sheet S are attached to the wafer W, and the peeling member 22 and the guide rollers 27 through the frame F1 that can be raised and lowered. 30 and the load cell 34 are integrally supported, and the tension of the adhesive sheet S detected by the load cell 34 is kept constant. It is constituted by a sticking angle maintaining means 36 which can be subjected. The guide rollers 27 and 30 are provided with brake shoes 38 and 39 that sandwich the adhesive sheet S by the operation of the cylinders 38A and 38B and suppress the feeding of the adhesive sheet S. Further, as shown in FIG. 2, the guide roller 28 includes a first guide roller 28A around which the first adhesive sheet S1 is wound and a second guide roller 28B around which the second adhesive sheet S2 is wound. Has been. The load cell 34 includes a first load cell 34A and a second load cell 34B fixed to the frame F1 via an arm 33. The load cells 34A and 34B are angle members 37A and 37B, and the angle members 37A, respectively. 37B, the first and second guide rollers 28A and 28B are rotatably supported via support shafts 81A and 81B that are cantilevered, respectively. In FIG. 2, the first guide roller 28 </ b> A and the second guide roller 28 </ b> B are depicted as being in contact with each other. However, in actuality, for example, the contact is provided by providing an interval of about 0.1 mm to 1 mm. The shafts 81A and 81B supporting them are not in contact with each other. Thereby, the first load cell 34A can detect the tension of the first adhesive sheet S1, and the second load cell 34B can detect the tension of the second adhesive sheet S2.

  The feeding means 12 and the sticking angle maintaining means 36 have substantially the same configuration as that disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and detailed description thereof is omitted here. To do.

  The table 13 includes an outer table 40 having a substantially square shape in plan view and an inner table 41 having a substantially circular shape in plan view. The outer table 40 is provided in a concave shape capable of receiving the inner table 41 in a state where a gap is formed between the outer table 40 and the outer edge of the inner table 41. The inner table 41 is provided so as to be movable up and down with respect to the outer table 40 via the single-axis robot 43, whereby the upper surface height position of the inner table 41 is adjusted according to the thickness of the adhesive sheet S and the thickness of the wafer W. It can be done.

  The pressing means 14 is a pressing roller 45 that presses and adheres the adhesive sheet S to the upper surface of the wafer W and the outer table 40, and is positioned on the upper surface side of the frame 46, and is pressed via a support frame 48 and a support shaft 80. And a cylinder 47 for moving 45 in the Z-axis direction. The frame 46 is provided in a gate shape so as to straddle the table 13 in the direction orthogonal to the paper surface in FIG. 1 (the Y-axis direction in FIG. 2), and the upper support 46B side in FIG. 2 is supported on a rail (not shown) so as to be movable in the X-axis direction.

  The cutting means 15 includes a cutter blade 51 supported on the free end side of a robot main body 50 constituted by a so-called six-axis robot. Since the cutting means 15 has the same structure as that disclosed in Japanese Patent Application No. 2006-15783 filed by the present applicant, detailed description thereof is omitted.

The winding unit 18 includes a tension applying unit 16 that applies tension to the adhesive sheet S that is fed over the wafer W, and a winding roller 63 that sandwiches and winds the unnecessary sheet SD between the driving roller 60. Has been.
The tension applying means 16 includes a driving roller 55 and a pinch roller 58 that sandwiches an unnecessary sheet SD between the driving roller 55. As shown in FIG. 2, the driving roller 55 and the pinch roller 58 include a first driving roller 55A and a first pinch roller 58A that sandwich the first unnecessary sheet SD1, and a second driving roller 55B that sandwiches the second unnecessary sheet SD2. The first and second drive rollers 55A and 55B are individually provided with a rotational force by the first and second motors M1 and M2, respectively. The first drive roller 55A and the second drive roller 55B are not in contact with each other in the same manner as the first guide roller 28A and the second guide roller 28B, and the output shafts 82A of the first and second motors M1 and M2 are used. And 82B are not in contact either. Further, the first and second pinch rollers 58A and 58B are individually swingably supported via the arms 57 located on the inner surface side of the respective frames F2. The first and second pinch rollers 58A and 58B are not in contact with each other in the same manner as the first guide roller 28A and the second guide roller 28B, and the support shafts 83A and 83B are not in contact with each other. With such a configuration, the first and second motors M1 and M2 correspond to the tension detected by the first and second load cells 34A and 34B, or the rotational torque of the first and second drive rollers 55A and 55B or The tension can be individually controlled with respect to the first and second divided sheets S1 and S2 fed out above the wafer W by individually adjusting the rotation speed. In the case of this embodiment, the rotational torque or rotational speed of the motor M2 is the same as the rotational torque or rotational speed of the motor M1 so that the tension of the second divided sheet S2 is the same based on the tension of the first divided sheet S1. It is designed to be controlled.

  The driving roller 60 is given a driving force by the motor M3, and the winding roller 63 is urged toward the driving roller 60 by the force of the spring 62 via the arm 61, and the driving roller 60 rotates, The unnecessary sheet SD is taken up by the take-up roller 63 being rotated following this. The drive roller 60, the arm 61, the spring 62, and the take-up roller 63 are supported by the pair of frames F2 without being in contact with each other like the tension applying unit 16, and the first and second unnecessary sheets SD1, SD2 is provided so that it can be individually wound. Further, the upper frame F2 side in FIG. 2 is supported on the slider 65 of the linear motor 49, and the lower frame F2 side in FIG. 2 is supported on a rail (not shown) so as to be movable in the X-axis direction.

  Separation preventing means 70 are provided between the pressing means 14 and the winding means 18 and on the upper surface of the peeling member 22 in FIG. The separation prevention means 70 includes a roller 71 rotatably supported between the frames F2 via a support shaft 84, and a pair of guide rings provided so as to be movable in the Y-axis direction along the axial direction of the roller 71. 72 and a pair of guide plates 73 provided so as to be movable in the Y-axis direction along the upper surface of the peeling member 22 in FIG. The guide plate 73 has a built-in permanent magnet, and the peeling member 22 is made of a magnetic material, thereby enabling movement in the Y-axis direction. However, the guide plate 73 is limited to such a configuration. There is nothing. By setting the dimension between the inner surfaces of the guide ring 72 and the guide plate 73 to be equal to the width of the adhesive sheet S, the first adhesive sheet is at least from when the adhesive sheet S is unwound to being affixed to the wafer W. The S1 and the second adhesive sheet S2 are prevented from being separated by the cut C, and the adhesive sheet S is fed out and pasted in a state where the cut side edges of the divided sheets S1 and S2 are abutted without gaps. Can be done.

  Next, a method for applying the adhesive sheet S in the present embodiment will be described.

  In the initial setting, as shown in FIG. 1, the adhesive sheet S fed out from the support roller 20 is peeled from the release sheet RL via the release member 22 in the raised position, and the lead end of the release sheet RL is a guide roller. It is fixed to the collection roller 23 via 29-32. On the other hand, the lead end of the adhesive sheet S is fixed to the winding roller 63 via the pressing roller 45, the separation preventing means 70, and the tension applying means 16. At this time, the pressing roller 45 is located away from the upper surface of the outer table 40.

  When the power is turned on, the feeding unit 12 is allowed to feed the adhesive sheet S, and the winding unit 18 winds the first and second divided sheets S1 and S2 by a predetermined length. Here, the “predetermined length” is the length until the hole formed in the adhesive sheet S by the cutting means 15 in the previous sheet sticking operation exceeds the position sandwiched between the drive roller 55 and the pinch roller 58. It is. When the adhesive sheet S is fed out, the adhesive sheet S is fed out by the separation preventing means 70 without generating a gap between the edges of the cuts C.

  When the winding of the first and second divided sheets S1 and S2 is completed, the operation of the winding means 18 is stopped. The first and second load cells 34A and 34B measure the tensions of the first and second divided sheets S1 and S2, respectively, during the winding operation of the respective divided sheets S1 and S2 and after the operation of the winding unit 18 is stopped. To do. In the case of the present embodiment, the tension applying unit 16 uses the tension applied to the first divided sheet S1, that is, the value of the first load cell 34A as a reference, so that the tension of the second divided sheet S2, that is, the value of the second load cell 34B becomes the same. The rotational torque or rotational speed of the motor M2 is adjusted. At this time, if there is a difference between the values of the first and second load cells 34A and 34B, either the first or second divided sheet S1 or S2 is loosened. By making the tension of the second divided sheet S2 the same with the tension of S1 as a reference, no slack occurs. The load cells 34A and 34B may be individually controlled so as to have a predetermined tension. When the values of the load cells 34A and 34B become the same, the brake shoes 38 and 39 come into contact with the guide rollers 27 and 30, respectively, to suppress the feeding of the adhesive sheet S, and the drive rollers 55A and 55B. Becomes locked and enters a standby state.

  Next, after the wafer W is set on the table 13 via a conveying means (not shown), the pressing roller 45 is lowered to press the adhesive sheet S against the upper surface side of the outer table 40. As the pressing roller 45 is lowered, the load cells 34A and 34B detect a change in the tension of the adhesive sheet S and lower the frame F1 so as to be a predetermined value.

  Thereafter, the sticking operation is started by the pressing roller 45 moving to the left in FIG. In this sticking operation, the load cells 34A and 34B detect the change in the tension of the adhesive sheet S and lower the frame F1 to a predetermined value, as described above. Even during this pasting operation, if a difference is detected in each of the load cells 34A and 34B, it can be determined that slack has occurred in either the first or second divided sheet S1, S2. A signal is output via a control means (not shown), and for example, the sticking operation of the sheet sticking apparatus 10 can be stopped, a buzzer can be sounded, or an indicator lamp can be turned on.

  When the application of the adhesive sheet S is completed, the cutting means 15 is activated, and the cutter sheet 51 cuts the adhesive sheet S along the outer peripheral edge of the wafer W. Next, when the wafer W is removed from the table 13 via a transfer device (not shown), the frame F2 is moved to the left side in FIG. 1 and is left outside the wafer W by the driving roller 55 and the pinch roller 58. The unnecessary sheet SD is peeled off from the upper surface of the table 13 and taken up by the take-up roller 63.

  When the winding of the unnecessary sheet SD is completed, the frame F1 is raised while the brake shoes 38 and 39 are separated from the guide rollers 27 and 30 and the adhesive sheet S can be fed out, and at the same time, the pressing roller 45 is raised and pressed. The means 14 and the frame F2 return to the position shown in FIG. Even during this return operation, the load cells 34A and 34B and the motors M1 and M2 are linked and co-operate in the same manner as described above, and the value of the second load cell 34B is made the same based on the value of the first load cell 34A. By adjusting the rotational torque or rotational speed of the motor M2, the new adhesive sheet S is fed out, and thereafter the same operation as described above is performed.

  Therefore, according to such an embodiment, since tension can be individually applied to each of the first and second divided sheets that can be divided by the incision C, the first and second that are applied simultaneously. There is an effect that the tension of the two-divided sheets S1 and S2 does not vary, the occurrence of looseness is suppressed, and inconveniences such as poor sticking can be prevented.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

For example, in the said embodiment, although the structure where the cut C was provided in one place in the center of the width direction of the adhesive sheet S was shown and demonstrated, the formation position of the cut C is not specifically limited. In addition, the incision C is configured so that the roll-shaped adhesive sheet S is supported by the support roller 20 in a state of being formed in advance. You may make it form a notch. Furthermore, in the said embodiment, although the notch C illustrated the adhesive sheet S of one place, it can also make object the adhesive sheet S provided in two or more places, In this case, it is only for the number of division sheets. The guide roller 28, the drive roller 55, the pinch roller 58, the drive roller 60, the take-up roller 63, and the like may be divided so that tension is applied to each divided sheet individually.
In the above-described embodiment, the tension applying unit 16 is provided on the winding unit 18 side. However, the load cell 34 may be provided on the winding unit 18 side, and the tension applying unit 16 may be provided on the feeding unit 12 side. Good. Further, both the load cell 34 and the tension applying means 16 may be provided on the feeding means 12 side, or both of them may be provided on the winding means 18 side. When the tension applying means 16 is provided on the feeding means 12 side, a difference is detected between these values in the load cells 34A and 34B during the bonding operation of the adhesive sheet S, that is, the first and second divided sheets S1. In the case where slack occurs in either of S2 and S2, in addition to the coping method as in the above embodiment, the tension applying means 16 so that the tension of the first divided sheet S1 and the tension of the second divided sheet S2 are the same. By controlling this, the adhesive sheets S1 and S2 can be attached to the wafer W without causing slack.

  Further, the adherend is not limited to the wafer W, and other adherends such as a glass plate, a steel plate, pottery, a wooden plate, or a resin plate can be targeted. The semiconductor wafer is a silicon wafer or a compound. It may be a wafer.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Feeding means 14 Pressing means 15 Cutting means 16 Tension applying means 18 Winding means 70 Separation preventing means A Adhesive layer BS Substrate sheet C Cutting S Adhesive sheet S1 First divided sheet (divided sheet)
S2 Second divided sheet (divided sheet)
SD1 First unnecessary sheet (unnecessary sheet)
SD2 Second unnecessary sheet (unnecessary sheet)
W Semiconductor wafer (adherence)

Claims (5)

Adhesive layer is provided on one surface of the belt-like base material sheet, and sheet adhesive is applied to the adherend by feeding out an adhesive sheet that can be divided into a plurality of divided sheets by cutting along the extending direction. A device,
A feeding means for feeding out the adhesive sheet; a tension applying means for applying tension to the adhesive sheet; and a pressing means for pressing the adhesive sheet against an adherend,
The sheet applying apparatus, wherein the tension applying means is provided so as to individually apply tension to each divided sheet that can be divided by the cutting. The sheet sticking apparatus according to claim 1, further comprising a cutting means for cutting the adhesive sheet according to the size of the adherend. It further includes a separation preventing means for each of the divided adhesive sheets, and the separation preventing means abuts the cut side edges of the respective divided sheets with each other at least from the time when the adhesive sheet is fed out to the adherend. The sheet sticking device according to claim 1 or 2, wherein the sheet sticking device is maintained. An adhesive layer is provided on one surface of a belt-shaped substrate sheet, and an adhesive sheet that can be divided into a plurality of divided sheets by cutting along an extending direction thereof is attached to an adherend. ,
Extending the adhesive sheet;
A step of individually applying tension to each of the divided sheets of the extended adhesive sheet;
And a step of applying the adhesive sheet to the adherend by pressing the adhesive sheet. The sheet sticking method according to claim 4, wherein a state in which the cut side edges of the divided sheets are abutted with each other is maintained at least from the time when the adhesive sheet is fed out until the adhesive sheet is stuck on the adherend.

Images