JP2005136306A - Device and method for sticking - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the warping and deformation of a semiconductor wafer etc., after tapes are stuck to the wafer etc., by preventing the occurrence of tensile forces in the feeding directions of the tapes when sticking the tapes to the wafer etc. <P>SOLUTION: The sticking device 10 selectively sticks a protective tape T1 to the circuit surface of the semiconductor wafer W and a dicing tape to the wafer W and a ring frame R at the time of mounting the wafer W on the frame R. The sticking device 10 comprises a sticking means 12 which sticks the protective tape T1 and dicing tape T2 fed by means of a tape feeding device 17, a wafer table 13 and a ring frame table 14 which can be moved relatively to the sticking means 12 in a state where the wafer W and ring frame R are placed on the tables 13 and 14, respectively, and a driving device 16 which moves the tables 13 and 14 relatively to the sticking means 12. Since the moving speeds of the tables 13 and 14 are controlled so that the speeds may become slower than the feeding speeds of the tapes T1 and T2, the tapes T1 and T2 can be stuck without pulling the tapes T1 and T2 in the feeding directions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a bonding apparatus and a bonding method. More specifically, when a protective tape or a dicing tape is applied to a plate-like member such as a semiconductor wafer, the tape is applied without applying a pulling force in the feeding direction. It is related with the bonding apparatus and bonding method which can be performed.

  In a manufacturing process of a semiconductor wafer (hereinafter simply referred to as a wafer), a back grinding process is employed in which the back surface of the wafer is ground to make it extremely thin. In this back grinding process, a protective tape is applied to protect the pattern on the wafer surface, that is, the circuit surface. As a method for applying the protective tape, for example, as shown in Patent Document 1, the protective tape is applied in a state of protruding outside the outer periphery of the wafer, and then the protective tape is cut along the outer periphery of the wafer. Thus, protection according to the wafer size can be performed.

  In addition, the wafer that has undergone the back grinding process undergoes a process of being mounted on the inner region of the ring frame via a dicing tape in order to perform dicing in the form of ridges. At the time of this mounting process, for example, as disclosed in Patent Document 2, there is a method in which a wafer is arranged inside a ring frame via an appropriate alignment device, and a dicing tape is attached to the upper surface side of the ring frame and the wafer. It has been adopted.

JP 2003-209082 A JP 2000-68293 A

The affixing of the protective tape and the affixing of the dicing tape described above are performed while the tape is being fed out, and are bonded in a state where a certain tension is applied to the tape. Therefore, after the tape is affixed to the wafer or the like, the tape tends to shrink, resulting in deformation such as warpage of the wafer.
In particular, since the wafer after the back grinding process is on the order of extremely thin (several tens of μm), warpage deformation of the wafer is more likely to occur and the wafer is cracked. Moreover, it becomes a factor which reduces remarkably the processing precision in a subsequent dicing process.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose thereof is that when a tape is applied to a plate-like member such as a wafer, a pulling force in the feeding direction is not generated on the tape. Thus, it is providing the bonding apparatus and the bonding method which can prevent effectively the curvature deformation of the plate-shaped member after tape sticking.

In order to achieve the above object, the present invention provides a bonding apparatus for feeding a tape or a film and sticking the tape to a plate member.
The tape feeding device, the pasting means for sticking the tape fed by the feeding device to the plate-like member, the table on which the plate-like member is placed, and the table and the pasting means are moved relative to each other. And a drive device for bonding a tape to the plate-like member,
The table moving speed is set to be slower than the tape feeding speed by the feeding means.

Further, the present invention provides a bonding apparatus for selectively performing affixing of a protective tape on the circuit surface of a semiconductor wafer and affixing of a dicing tape for mounting the semiconductor wafer on a ring frame.
The tape feeding device, the pasting means for pasting the tape fed by the feeding device, the table movable relative to the pasting means in a state where the semiconductor wafer and the ring frame are placed, and the table and pasting And a drive device for attaching a dicing tape to the semiconductor wafer and the ring frame, while attaching a protective tape to the semiconductor wafer by relatively moving the means,
The table moving speed is set to be slower than the tape feeding speed by the feeding means.

The sticking means includes a peel plate for peeling the tape, and a press roller for applying a sticking pressure to the tape peeled by the peel plate,
It is preferable that the table moving speed is set slower than the tape feeding speed so that no pulling force is generated on the tape immediately before the application by the press roller.

Further, the present invention is a pasting method in which a tape or a film is fed out and a tape is stuck to a plate-like member through a predetermined pasting means.
In attaching the tape to the plate-like member while moving the table and the attaching means relative to each other while the plate-like member is placed on the table, the table is moved at a speed slower than the tape feeding speed. A method is adopted in which the tape is affixed to the plate member while keeping the tape from generating a tensile force along the feeding direction.

  At this time, it is preferable to adopt a method in which the tape is drawn out to the extent that the tape is slackened at a position immediately before sticking to prevent generation of a pulling force.

  According to the present invention, since the table moving speed is slower than the tape feeding speed, the pulling force in the feeding direction does not act on the tape stuck by the relative movement of the table and the pasting means. Therefore, the tape after being stuck to the plate-like member does not generate any residual stress that may occur when subjected to a tensile force, and eliminates the inconvenience of causing warpage and deformation of the plate-like member. Can do. Therefore, when the plate-like member is an extremely thin ground wafer, it is possible to prevent the wafer from being cracked due to warping deformation, and to maintain various subsequent processing accuracy with respect to the wafer.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a schematic front view of a bonding apparatus according to this embodiment, and FIG. 2 shows a schematic side view in which some components are omitted. FIG. 3 is a schematic perspective view of the strip material of the protective tape and the strip material of the dicing tape. In these drawings, the laminating apparatus 10 is a process of feeding out a support roller 11 arranged on the right side of the frame F in FIG. 1 and a roll-shaped strip A1 or A2 that is selectively supported by the support roller 11. Affixing means 12 for peeling off and adhering the protective tape T1 or the dicing tape T2, a wafer table 13 for supporting a wafer W as a plate member, a ring frame table 14 for supporting a ring frame R, and these tables 13 and 14 Support means 15 for supporting, a driving device 16 for moving the wafer table 13 and the ring frame table 14 in the lateral direction (left-right direction in FIG. 1) with respect to the sticking means 12 via the support means 15, and a belt-like material A feeding device 17 for feeding out A1 and A2, a meandering preventing means 18 for preventing meandering during feeding of the strips A1 and A2, and a belt It is configured to include a winding means 19 of the release substrate B which constitutes a part of the timber A1, A2.

As shown in FIGS. 3A and 3B, the roll-shaped strips A1 and A2 that are selectively supported by the support roller 11 include the peeling base material B and one of the peeling base materials B. It has a layer structure with a tape base material C attached to the surface, and a closed loop half cut D is previously formed in the surface of the tape base material C. In the strip material A1, the planar size of the protective tape T1 formed by the half-cut D corresponds to the planar size of the wafer W as shown in FIG. 4, while the planar size of the dicing tape T2 in the strip material A2 is The size is set slightly larger than the inner peripheral diameter of the ring frame R. Here, the dicing tape T2 shown in FIG. 4 is applied after the protective tape T1 is applied to the wafer W and the back grinding process is completed. At this time, the protective tape T1 is attached to the lower surface side of the wafer W. Inverted to the state to be aligned.
In the following, for ease of understanding, each part of the apparatus will be described with respect to the belt-like material A1 and the protective tape T1, but it is understood that the same applies to the belt-like material A2 and the dicing tape T2. I want to be.

  In the vicinity of the support roller 11, a branching roller 21 and a waste winding roller 22 are arranged. The waste take-up roller 22 takes up the tape base C existing around the protective tape T1 by the half cut D described above. Accordingly, the belt-like material A1 that passes through the position of the branch roller 21 and is sent to the sticking means 12 side is in a state in which the protective tape T1 is arranged at predetermined intervals on the peeling base material B (FIG. 3A). reference). As shown in FIG. 2, the waste winding roller 22 includes a pulley 24 on a rotating shaft 23, and this pulley 24 is connected to a pulley 26 provided on an output shaft 25 of a motor M <b> 1 via a belt 27. Has been.

  Between the branch roller 21 and the pasting means 12, a back tension roller 29, a pinch roller 30 that sandwiches the strip A 1 between the back tension roller 29, and the pinch roller 30 with respect to the back tension roller 29 A cylinder 32 that moves forward and backward is disposed. A pulley 35 is fixed to the rotary shaft 33 of the back tension roller 29, and a belt 39 is hung between the pulley 35 and a pulley 38 fixed to the output shaft 36 of the motor M2 located in the vicinity thereof. As a result, an urging force in the clockwise direction in FIG. 1 is applied to the back tension roller 29, and a constant tension is applied to the belt-like material A 1 that has passed through the back tension roller 29.

  The affixing means 12 is provided side by side with a peel plate 41 that peels off the protective tape T1 from the peeling substrate B by abruptly reversing the feeding direction of the strip A1, and a front end side (left end side in FIG. 1) of the peel plate 41. And a press roller 42 for attaching the peeled protective tape T1 to the wafer W. As shown in FIG. 2, the press roller 42 is rotatably supported via a downward U-shaped bearing member 43. A plate-like support body 45 is disposed at the upper portion of the bearing member 43, and a cylinder 46 is disposed at an intermediate portion of the support body 45, and the tip (lower end) of the piston rod 47 of the cylinder 46 is the bearing member 43. It is connected to the center of the top. Guide cylinders 49 and 49 are provided on both longitudinal sides on the upper surface side of the support body 45, and the lower ends of shaft members 50 and 50 extending vertically through the guide cylinders 49 are connected to the bearing member 43. As the cylinder 46 operates, the bearing member 43 and the press roller 42 can be moved up and down.

  The wafer table 13 that supports the wafer W is disposed at a substantially circular support surface portion 52 having a plane area slightly larger than the plane area of the wafer W, and at a position approximately 90 degrees apart in the circumferential direction on the lower surface side of the support surface portion 52. And an elevating shaft 53. The wafer table 13 is provided with a number of suction holes (not shown) in the support surface portion 52, and a suction pump 54 (not shown) is connected to the suction pipe 54 provided on the lower surface thereof, and the wafer W is suctioned and held by the operation of the pressure reduction pump. This makes it possible to prevent the wafer W from being displaced when the protective tape T1 is applied to the circuit surface of the wafer W.

  The ring frame table 14 includes an inner hole (not shown) that surrounds the outer peripheral side of the wafer table 13 and has a size that does not interfere with the support surface portion 52 of the wafer table 13, and the outer edge is substantially abbreviated in plan view. A frame body 56 having a rectangular shape and a lifting plate 57 that hangs downward from the lower surfaces of the left and right sides of the frame body 56 in FIG.

  The support means 15 includes a guide plate 59 that guides the lifting shaft 53 of the wafer table 13 in the vertical direction, a connecting plate 60 that connects the lower ends of the lifting plates 57 of the ring frame table 14, and a guide plate 59. And an intermediate plate 61 disposed between the connecting plate 60, adjusting bolts 63, 63 provided between the intermediate plate 61 and the left and right sides of the connecting plate 60 in FIG. The slide base 64 is provided so as to be movable in the left-right direction in FIG. 1, elevating devices 67 and 67 including cylinders disposed on the upper surface of the slide base 64, and fixed to the lower surface side of the connecting plate 60. A coil spring that is interposed between the cylinder device 69 and the connecting plate 60 and the guide plate 59 so as not to fall off. 0, a fine adjustment device 72 disposed between the wafer table 13 and the guide plate 59, and a guide mechanism 73 for guiding the wafer table 13 and the ring frame table 14 in the vertical direction. Yes.

  The guide plate 59 is arranged in parallel with the support surface portion 52 of the wafer table 13 and includes a bearing 75 for guiding the elevating shaft 53 in the vertical direction. The lower end side of the elevating shaft 53 is provided with a length extending through the lower bearing 76 provided in the connecting plate 60 so as to be able to be raised and lowered.

  The intermediate plate 61 has a shape with a hole 61A at the center, and the piston rod 78, the coil spring 70, and the lower bearing 76 of the cylinder device 69 can be disposed in the region of the hole 61A. . Here, the piston rod 78 is kept in a fixed state that restricts the downward movement of the guide plate 59 while the tip (upper end) of the piston rod 78 is in contact with the guide plate 59, while the tip of the piston rod 78 is moved from the guide plate 59. The coil spring 70 supports the guide plate 59 in a state in which the coil spring 70 allows the wafer table 13 to move downward when it is not contacted apart from the lower side. Further, by moving the adjusting bolt 63 provided between the connecting plate 60 and the intermediate plate 61 forward and backward, the distance between the plates 60 and 61 is adjusted, whereby the wafer table 13 and the ring frame table 14 are adjusted. The relative height can be adjusted.

  The slide base 64 can be moved in the left-right direction in FIG. 1 via a feed screw (not shown) driven by a motor M5 of the driving device 16, whereby the wafer table 13 and the ring frame table 14 are moved in the left-right direction. Will be moved to. Accordingly, when the press roller 42 rotates on the wafer W and the ring frame R placed on the upper surfaces of the tables 13 and 14, the protective tape T1 or the dicing tape T2 can be attached. At the time of applying the tape, the moving speed of the slide base 64 by the driving device 16 is set to be slightly slower than the feeding speed by the feeding device 17 as will be described later.

  The elevating device 67 has a piston rod 80 whose tip is fixed to the lower surface side of the intermediate plate 61, and the intermediate plate 61 is moved up and down as the piston rod 80 advances and retreats, thereby connecting the connecting plate 60 and each of them. The tables 13 and 14 can be raised and lowered.

  The fine adjustment device 72 includes a slide block 81 disposed on the upper surface of the guide plate 59, a roller 82 as a rotating body supported on the lower surface side of the support surface portion 52 of the wafer table 13, and the roller 82 as a slide block. A tension spring 84, which is a spring member having a biasing force to be brought into contact with the inclined surface 81A formed on the upper surface of 81, and the slide block 81 are moved to adjust the contact point between the slide block 81 and the roller 82 up and down. And an operation shaft member 85. The operation shaft member 85 is constituted by a screw shaft that extends through the slide block 81 in the left-right direction in FIG. 1, and the slide block 81 moves in the left-right direction by the rotation of the operation shaft member 85 to adjust the contact point in the vertical direction. Is possible. An operation knob 87 is provided at the operation end (left end in FIG. 1) of the operation shaft member 85, and the operation knob 87 is positioned outside the lifting plate 57 of the ring frame table 14. It is provided to be operable from the outside of the apparatus. Therefore, the relative height between the wafer table 13 and the ring frame table 14 can be finely adjusted by rotating the operation knob 87.

  The guide mechanism 73 of the ring frame table 14 includes a guide rail 89 that is vertically arranged on both sides along the moving direction of the slide base 64, and a lifting block 90 provided on the lifting plate 57. .

  As shown in FIG. 1, the feeding device 17 that feeds the strips A <b> 1 and A <b> 2 is provided in the vicinity of the feeding roller 95, a pinch roller 96 in contact with the outer peripheral surface of the feeding roller 95, and the feeding roller 95. The motor M3 includes a pulley 98 fixed to the output shaft 97 of the motor M3 and a belt 101 wound around a pulley 100 fixed to the rotating shaft 99 of the feeding roller 95. A guide roller 102 for the peeling base material B is disposed between the feeding device 17 and the pasting means 12.

  The feeding speed of the strip A1 by the feeding device 17 is higher than the moving speed when the wafer table 13 and the ring frame table 14 are moved to the left in FIG. 1 by the driving device 16 in order to attach the protective label T1 to the wafer W. Slightly faster speed, that is, a speed at which the table moving speed becomes slower than the tape feeding speed is set. Therefore, as shown in FIG. 6, when the wafer W is moved to the left side and the protective labels T1 are sequentially attached, the feeding speed is slightly higher than the table moving speed, so that the peel plate 41 and the press roller 42, a slight slack of the protective tape T1 occurs, whereby the protective tape T1 can be applied to the wafer W without applying a tensile force along the feeding direction to the protective tape T1. It becomes possible. Therefore, warp deformation of the wafer W that can be caused by residual stress when the protective tape T1 is attached to the wafer W in a state where a tensile force is generated can be reliably prevented.

  The meandering prevention means 18 for preventing the meandering of the protective tape T1 and the dicing tape T2 uses a pinch roller 96 constituting a part of the feeding device 17, as schematically shown in FIGS. Configured. More specifically, the meandering prevention means 18 includes the pinch roller 96, a pair of arms 105 and 105, one end of which is connected to rotatably support both axial ends of the pinch roller 96, and the arms 105 A pair of rotation center shafts 106 extending between the other ends of the rollers and supported by the frame F and disposed between the arm 105 and the frame F and biasing the pinch roller 96 toward the upper part of the outer peripheral surface of the feeding roller 95. The springs 108 and 108 and a pair of spring pressure adjusting bolts 109 and 109 disposed on the lower end surface side of the arm 105 are provided.

  The spring 108 is stretched between a pin 110 protruding from the outer surface of the arm 105 and a pin 111 protruding from the inner surface of the frame F. Further, the spring pressure adjusting bolt 109 is screw-engaged with a bracket 113 provided on the inner side surface of the frame F, and is arranged in a state in which the tip abuts against the lower end surface of the arm 105. Accordingly, the pinch roller 96 comes into contact with its own weight and the feeding roller 95 in a state where a constant contact pressure is applied by the biasing force of the spring 108, but the tip positions of the spring pressure adjusting bolts 109 and 109. Is adjusted so that the contact pressure on the both sides in the axial direction of the pinch roller 96 changes with respect to the feeding roller 95, thereby eliminating the uneven pressure distribution in the axial direction of the pinch roller 96 and the feeding roller 95. The meandering of the peeling base material B is prevented, and as a result, the strip-shaped material A1 is not displaced laterally with respect to the feeding direction, and the peeled protective tape T1 can be accurately applied to the circuit surface of the wafer W.

  The winding means 19 of the peeling base material B constituting the strips A1 and A2 includes a winding roller 115, a motor M4 disposed in the vicinity thereof, and a pulley 117 fixed to the output shaft 116 of the motor M4. The belt 118 is wound around the pulley and a pulley (not shown) fixed to the take-up roller 115.

  Next, the sticking operation of the protective tape T1 in this embodiment will be described.

  As an initial operation, the roll-shaped raw material of the protective tape T1 is set on the support roller 11, and the front end side region of the tape base material C is peeled by a predetermined length, and the front end is fixed to the residue winding roller 22. On the other hand, the peeling base material B of the belt-like material A1 is wound around the peel plate 41 and is sandwiched between the feeding roller 95 and the pinch roller 96 through the guide roller 102, and the tip is fixed to the winding roller 115.

  In the meandering prevention means 18, the spring pressure adjusting bolt 109 is adjusted using a pressure detector (not shown) so that the pressures on both sides in the axial direction of the feeding roller 95 and the pinch roller 96 coincide.

  The wafer table 13 and the ring frame table 14 are moved from the left end of the frame F to the left side by moving the wafer table 13 and the ring frame table 14 downward from the position shown in FIG. The wafer W is positioned and arranged on the wafer table 13 via a transfer device that is not, and the wafer W is sucked and fixed to the support surface portion 52 of the wafer table 13. Next, the wafer table 13 is moved to the right side in the figure, the lifting device 67 is operated, and the wafer table 13 is set at the sticking height position. At this time, the left end position of the wafer W is positioned on the right side of the virtual vertical line passing through the center position of the press roller 42. Further, the tip of the piston rod 78 of the cylinder device 69 is in contact with the lower surface of the guide plate 59, and the support surface portion 52 of the wafer table 13 is fixed at a certain flat height in a fixed state that prohibits the lowering of the guide plate 59. Kept in position.

  When a feeding output is given to the strip A1 by driving the feeding device 17 and the lead end of the protective tape T1 positioned immediately before the peel plate 41 is detected by a sensor (not shown), the wafer table 13 and the ring are synchronized with this. The frame table 14 moves to the left in FIG. 1, the lead end of the peeled protective tape T1 coincides with the left end of the wafer W, and the application area is sequentially expanded while receiving the application pressure from the press roller 42. . At this time, the movement of the wafer table 13 and the ring frame table 14 is set at a speed slightly slower than the feeding speed of the strip A1, so that the protective tape T1 is slacked as shown in FIG. Thus, no pulling force in the feeding direction is generated on the protective tape T1, and therefore the warp deformation does not occur on the wafer W after the pasting is completed. Further, since the belt-like material A1 is accurately fed out along the set feeding direction or feeding trajectory by the meandering preventing means 18 described above, that is, does not shift in the width direction, the outer peripheral edge of the protective tape T1 is Then, the wafer W is attached in a state of being coincident with the outer peripheral edge of the wafer W.

  When the sticking of the protective tape T1 is completed in this way, the wafer W is transferred to the back grinding process via a transfer device (not shown) and is ground.

  When sticking the dicing tape T2, the strip A1 is removed from the support roller 11, and the strip A2 is set on the support roller 11 in the manner described above in which the strip A1 is set. Further, the cylinder device 69 is operated to move the piston rod 78 backward to switch to the separated position where the contact state with the guide plate 59 is released. As a result, the guide plate 59 is supported by the coil spring 70.

  In a state where the wafer table 13 and the ring frame table 14 are moved out of the apparatus, the ring frame R is transferred to the ring frame table 14 via a transfer device (not shown), and the wafer W on which the back grinding is performed is applied to the protective tape. The wafer is placed on the wafer table 13 with T1 as the lower surface side. The center position and the relative position of the ring frame R and the wafer W are accurately adjusted via the alignment device.

  Next, the wafer table 13 and the ring frame table 14 are moved further to the right than the position shown in FIG. 1 from the position moved out of the apparatus, and the left end of the ring frame R is from a virtual vertical line passing through the center of the press roller 42. Will also be on the right.

  The wafer table 13 and the ring frame table 14 move to the left side in FIG. 1 in conjunction with the peeling operation of the dicing tape T2, so that the dicing tape T2 is attached to the ring frame R and the wafer W. At this time, since the tip of the piston rod 78 is in a non-contact position with respect to the guide plate 59 when the wafer table 13 receives a pressure applied by the press roller 42, the coil spring 70 is contracted and has a length. Is reduced, and an excessive sticking pressure on the surface of the wafer W is absorbed, whereby cracking of the wafer W is effectively prevented.

  Therefore, according to such an embodiment, since the drawn out protective tape T1 and dicing tape T2 are not attached to the wafer W and the ring frame R in a state of being pulled along the supply direction, the tape after application is applied. Warpage of the wafer W due to residual stress can be reliably prevented. Therefore, cracking of the wafer W can be prevented. In addition, the wafer W can be processed with high precision in the back grinding process and the dicing process. Moreover, as a means for preventing the generation of a pulling force, the drive device 16 is only controlled so that the moving speed of the wafer table 13 and the ring frame table 14 is slower than the tape feeding speed, so that the structure becomes extremely simple, and By adjusting the drive device 16, the speed can be easily adjusted according to the tape characteristics.

The best configuration, method, and the like for carrying out the present invention have been disclosed above, but the present invention is not limited to this.
That is, the invention has been illustrated and described primarily with respect to particular embodiments, but the embodiments described above are within the scope of the technical idea and purpose of the invention. On the other hand, those skilled in the art can make various changes in other detailed configurations such as shape, position, and component configuration.
Therefore, the description limited to the shape, position, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, in the said Example, although the bonding apparatus which sticks the protective tape T1 and the dicing tape T2 to the semiconductor wafer W or the ring frame R was shown and demonstrated, this invention is not limited to this, A tape, The present invention can also be applied to an apparatus for forming a laminate by sticking a film to a thin plate member.
The protective tape T1 and the dicing tape T2 are formed in advance by the half cut D, but the half cut D corresponding to the shape of the protective tape T1 and the dicing tape T2 is formed in the middle of the feeding path of the strips A1 and A2. It is also possible to do.

  The present invention can be used as a semiconductor wafer processing apparatus.

The schematic front view of the bonding apparatus which concerns on this embodiment. The left view of the said bonding apparatus. (A) is a belt-shaped material showing a protective tape, (B) is a belt-shaped material showing a dicing tape. The schematic perspective view which shows the correspondence which affixes a protection tape and a dicing tape on a wafer and a ring frame. The schematic front view which shows the middle of the operation | movement which sticks a protective tape or a dicing tape. Explanatory drawing which shows the correlation with the feeding speed of a strip | belt-shaped material, and the moving speed of the wafer W. FIG. The schematic perspective view of a meandering prevention means. The schematic side view of a meandering prevention means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Bonding device 12 Sticking means 13 Wafer table 14 Ring frame table 16 Drive device 17 Feeding device 41 Peel plate (sticking means)
42 Press roller (sticking means)
A1, A2 Strip material B Release substrate C Tape substrate T1 Protective tape T2 Dicing tape R Ring frame W Semiconductor wafer

Claims (5)

In the laminating apparatus for feeding out the tape or film and sticking the tape to the plate member,
The tape feeding device, the pasting means for sticking the tape fed by the feeding device to the plate-like member, the table on which the plate-like member is placed, and the table and the pasting means are moved relative to each other. And a drive device for bonding a tape to the plate-like member,
The table moving speed is set to be slower than the tape feeding speed by the feeding means. In a bonding apparatus that selectively applies a protective tape to a circuit surface of a semiconductor wafer and a dicing tape to mount the semiconductor wafer on a ring frame,
The tape feeding device, the pasting means for pasting the tape fed by the feeding device, the table movable relative to the pasting means in a state where the semiconductor wafer and the ring frame are placed, and the table and pasting And a drive device for attaching a dicing tape to the semiconductor wafer and the ring frame, while attaching a protective tape to the semiconductor wafer by relatively moving the means,
The table moving speed is set to be slower than the tape feeding speed by the feeding means. The sticking means includes a peel plate for peeling the tape, and a press roller for applying a sticking pressure to the tape peeled by the peel plate,
3. The laminating apparatus according to claim 1 or 2, wherein the table moving speed is set slower than the tape feeding speed so as not to generate a pulling force on the tape immediately before being stuck by the press roller. In the laminating method in which the tape or film is fed out and the tape is pasted on the plate-like member via a predetermined pasting means,
In attaching the tape to the plate-like member while moving the table and the attaching means relative to each other while the plate-like member is placed on the table, the table is moved at a speed slower than the tape feeding speed. A laminating method, wherein the tape is affixed to a plate-like member while keeping the tape from generating a tensile force along the feeding direction. The bonding method according to claim 4, wherein the tape is drawn out to a degree that causes a slack at a position immediately before application, thereby preventing generation of a pulling force.

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