JP4274902B2 - Table for pasting equipment - Google Patents

Description

  The present invention relates to a bonding table, and more particularly, selectively applying a protective tape for protecting a circuit surface of a semiconductor wafer and a dicing tape for mounting a semiconductor wafer on a ring frame. It is related with the table for bonding apparatuses which can be performed.

  In a manufacturing process of a semiconductor wafer (hereinafter simply referred to as a wafer), a back grinding process is employed in which the back surface of the wafer is ground to make it extremely thin. In this back grinding process, a protective tape is applied to protect the pattern on the wafer surface, that is, the circuit surface. As a method for applying the protective tape, for example, as shown in Patent Document 1, the protective tape is applied in a state of protruding outside the outer periphery of the wafer, and then the protective tape is cut along the outer periphery of the wafer. Thus, protection according to the wafer size can be performed.

  In addition, the wafer that has undergone the back grinding process undergoes a process of being mounted on the inner region of the ring frame via a dicing tape in order to perform dicing in the form of ridges. At the time of this mounting process, for example, as disclosed in Patent Document 2, there is a method in which a wafer is arranged inside a ring frame via an appropriate alignment device, and a dicing tape is attached to the upper surface side of the ring frame and the wafer. It has been adopted.

JP 2003-209082 A JP 2000-68293 A

The pasting of the protective tape and the pasting of the dicing tape are conventionally performed using independent bonding apparatuses. This is because it is necessary to change the sticking pressure of the protective tape and the sticking pressure of the dicing tape according to the respective conditions. More specifically, when applying the protective tape, since there are fine irregularities on the circuit surface of the wafer, it is necessary to set a relatively strong application pressure compared to the application pressure of the dicing tape in the mounting process The protective tape does not enter the recesses on the circuit surface. In such a state, in the subsequent back grinding process, a serious inconvenience that the coolant enters the circuit surface is brought about.
On the other hand, when the wafer is mounted on the ring frame via the dicing tape, since the wafer is ground to an extremely thin (eg, several tens of μm) by the back grinding process described above, it is the same as the pressure applied to the protective tape. If this pressure is applied, there will be a disadvantage that the wafer breaks.
Therefore, conventionally, the bonding apparatus for applying the protective tape and the bonding apparatus for applying the dicing tape must be used as separate and independent devices in the semiconductor manufacturing process, which places a heavy burden on the manufacturing equipment. In addition to this, there is a disadvantage that the productivity of the semiconductor is inferior.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to provide a protective tape that is attached to the circuit surface of the wafer and a dicing tape that is attached when the wafer is mounted on the ring frame. It is providing the table | surface for bonding apparatuses which can selectively affix a tape.

In order to achieve the above object, the present invention provides a bonding apparatus table for attaching a protective tape to a circuit surface of a semiconductor wafer and attaching a dicing tape for mounting the semiconductor wafer to the semiconductor wafer and a ring frame. And
A wafer table for supporting the semiconductor wafer; a ring frame table for supporting the ring frame; and a supporting means for supporting each of the tables.
The wafer table and the ring frame table are provided so as to be movable up and down via the support means,
The support means includes a contact / separation mechanism that enables switching between a function of restricting the movement of the wafer table in the height direction and a function of allowing the wafer table to be displaced downward with respect to the ring frame. When the tape is affixed, the contact / separation mechanism regulates the movement of the wafer table in the height direction to fix the height position of the wafer table, while the dicing tape affixes the contact / separation mechanism when the tape is affixed. The structure is adopted in which the downward pressure is allowed and the sticking pressure is relaxed.

Further, the support means is a connection for connecting a guide plate for vertically guiding a lifting shaft provided on the lower surface side of the wafer table and a plurality of lifting plates provided on the lower surface side of the ring frame table to each other. A plate and a lifting device for moving the connecting plate up and down;
The contact / separation mechanism is configured by a cylinder device provided between the connection plate and the guide plate, and the height direction of the wafer table is such that the tip of the piston rod of the cylinder device is in contact with the guide plate. While the movement of the wafer table is restricted, the wafer table is provided so as to be displaceable in a direction in which the adhesion pressure is reduced in a non-contact state.

  Further, the support means further includes an intermediate plate disposed between the connection plate and the guide plate, and the connection plate is provided so as to be movable up and down via the intermediate plate.

  In addition, a configuration is adopted in which a gap adjusting member is provided between the intermediate plate and the connecting plate, and the height of the ring frame table can be finely adjusted by operating the gap adjusting member in a predetermined manner. Is preferred.

  Further, biasing means is interposed between the connection plate and the guide plate, and this biasing means allows the guide plate to be displaced downward when the tip of the piston rod is not in contact. In this state, an urging force for maintaining the height of the wafer table at a fixed position is applied.

  The wafer table can be provided so that the height position can be finely adjusted via a fine adjustment device.

  The fine adjustment device is disposed on one of the opposing surfaces of the guide plate and the wafer table and has a slider having a height adjustment surface, a rotating body disposed on the other opposing surface, A spring member that keeps the rotating body and the slider in contact with each other; and an operating shaft member that moves the slider to adjust the contact point between the slider and the rotating body up and down. The part may be provided so as to be located outside the device outside the lifting plate of the ring frame.

According to the present invention, when applying a protective tape for protecting the circuit surface of the wafer, the circuit surface position is maintained at a fixed position so that the circuit surface position is not displaced in the height direction by the application pressure. By preliminarily setting the sticking pressure depending on the relative position between the sticking means for sticking to the surface and the wafer table, the protective tape can be stuck on the wafer while keeping the sticking pressure constant.
On the other hand, when the dicing tape for mounting the wafer on the ring frame is affixed to the wafer and the ring frame, the wafer table can be displaced in a direction to relieve the affixing pressure, that is, the wafer table is not subjected to an excessive load. Since it escapes from the attaching means, the dicing tape can be attached while preventing the wafer thinned by the back grinding process from cracking.
Thus, it becomes possible to share the wafer table and the ring frame table as one structure, and the equipment in the semiconductor manufacturing process without separating the bonding device for the protective tape and the bonding device for the dicing tape. The productivity can be improved while simplifying the above.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a schematic front view of a bonding apparatus according to this embodiment, and FIG. 2 shows a schematic side view in which some components are omitted. FIG. 3 is a schematic perspective view of the strip material of the protective tape and the strip material of the dicing tape. In these drawings, the laminating apparatus 10 is a process of feeding out a support roller 11 arranged on the right side of the frame F in FIG. 1 and a roll-shaped strip A1 or A2 that is selectively supported by the support roller 11. Affixing means 12 for separating and adhering the protective tape T1 or the dicing tape T2, a wafer table 13 for supporting the wafer W and a ring frame table 14 for supporting the ring frame R, and a supporting means 15 for supporting these tables 13 and 14. And a driving device 16 for moving the wafer table 13 and the ring frame table 14 in the lateral direction (left and right direction in FIG. 1) with respect to the sticking means 12 through the support means 15 and the strips A1 and A2. The feeding device 17, the meandering preventing means 18 for preventing meandering when the strips A1, A2 are fed, and the strips A1, A2 It is configured to include a winding means 19 of the release substrate B composing parts.

As shown in FIGS. 3A and 3B, the roll-shaped strips A1 and A2 that are selectively supported by the support roller 11 include the peeling base material B and one of the peeling base materials B. It has a layer structure with a tape base material C attached to the surface, and a closed loop half cut D is previously formed in the surface of the tape base material C. In the strip material A1, the planar size of the protective tape T1 formed by the half-cut D corresponds to the planar size of the wafer W as shown in FIG. 4, while the planar size of the dicing tape T2 in the strip material A2 is The size is set slightly larger than the inner peripheral diameter of the ring frame R. Here, the dicing tape T2 shown in FIG. 4 is applied after the protective tape T1 is applied to the wafer W and the back grinding process is completed. At this time, the protective tape T1 is attached to the lower surface side of the wafer W. Inverted to the state to be aligned.
In the following, for ease of understanding, each part of the apparatus will be described with respect to the belt-like material A1 and the protective tape T1, but it is understood that the same applies to the belt-like material A2 and the dicing tape T2. I want to be.

  In the vicinity of the support roller 11, a branching roller 21 and a waste winding roller 22 are arranged. The waste take-up roller 22 takes up the tape base C existing around the protective tape T1 by the half cut D described above. Accordingly, the belt-like material A1 that passes through the position of the branch roller 21 and is sent to the sticking means 12 side is in a state in which the protective tape T1 is arranged at predetermined intervals on the peeling base material B (FIG. 3A). reference). As shown in FIG. 2, the waste winding roller 22 includes a pulley 24 on a rotating shaft 23, and this pulley 24 is connected to a pulley 26 provided on an output shaft 25 of a motor M <b> 1 via a belt 27. Has been.

  Between the branch roller 21 and the pasting means 12, a back tension roller 29, a pinch roller 30 that sandwiches the strip A 1 between the back tension roller 29, and the pinch roller 30 with respect to the back tension roller 29 A cylinder 32 that moves forward and backward is disposed. A pulley 35 is fixed to the rotation shaft 33 of the back tension roller 29, and a belt 39 is hung between the pulley 35 and a pulley 38 fixed to the output shaft 36 of the motor M2 located in the vicinity thereof. As a result, an urging force in the clockwise direction in FIG. 1 is applied to the back tension roller 29, and a constant tension is applied to the belt-like material A 1 that has passed through the back tension roller 29.

  The affixing means 12 is provided side by side with a peel plate 41 that peels off the protective tape T1 from the peeling substrate B by abruptly reversing the feeding direction of the strip A1, and a front end side (left end side in FIG. 1) of the peel plate 41 And a press roller 42 for attaching the peeled protective tape T1 to the wafer W. As shown in FIG. 2, the press roller 42 is rotatably supported via a downward U-shaped bearing member 43. A plate-like support body 45 is disposed at the upper portion of the bearing member 43, and a cylinder 46 is disposed at an intermediate portion of the support body 45, and the tip (lower end) of the piston rod 47 of the cylinder 46 is the bearing member 43. It is connected to the center of the top. Guide cylinders 49 and 49 are provided on both longitudinal sides on the upper surface side of the support body 45, and the lower ends of shaft members 50 and 50 extending vertically through the guide cylinders 49 are connected to the bearing member 43. As the cylinder 46 operates, the bearing member 43 and the press roller 42 can be moved up and down.

  The wafer table 13 that supports the wafer W is arranged at a substantially circular support surface portion 52 having a plane area slightly larger than the plane area of the wafer W and at intervals of about 90 degrees in the circumferential direction on the lower surface side of the support surface portion 52. And an elevating shaft 53. The wafer table 13 is provided with a number of suction holes (not shown) in the support surface portion 52, and a suction pump 54 (not shown) is connected to the suction pipe 54 provided on the lower surface thereof, and the wafer W is suctioned and held by the operation of the pressure reduction pump. This makes it possible to prevent the wafer W from being displaced when the protective tape T1 is applied to the circuit surface of the wafer W.

  The ring frame table 14 includes an inner hole (not shown) that surrounds the outer peripheral side of the wafer table 13 and has a size that does not interfere with the support surface portion 52 of the wafer table 13, and the outer edge is substantially abbreviated in plan view. A frame body 56 having a rectangular shape and a lifting plate 57 that hangs downward from the lower surfaces of the left and right sides of the frame body 56 in FIG.

  The support means 15 includes a guide plate 59 that guides the lifting shaft 53 of the wafer table 13 in the vertical direction, a connecting plate 60 that connects the lower ends of the lifting plates 57 of the ring frame table 14, and a guide plate 59. And an intermediate plate 61 disposed between the connecting plate 60, adjusting bolts 63 and 63 as spacing adjusting members provided between the intermediate plate 61 and the connecting plate 60 on both the left and right sides in FIG. A slide base 64 movably provided in the lateral direction (left and right direction in FIG. 1) by the device 16, elevating devices 67 and 67 including cylinders arranged on the upper surface of the slide base 64, and the lower surface of the connecting plate 60 Cylinder device 69 as a contact / separation mechanism fixed to the side, connecting plate 60 and guide plate 59, A coil spring 70 as an urging means interposed between the wafer table 13 and the guide plate 59, the wafer table 13 and the ring frame table 14; And a guide mechanism 73 that guides the camera in the vertical direction.

  The guide plate 59 is arranged in parallel with the support surface portion 52 of the wafer table 13 and includes a bearing 75 for guiding the elevating shaft 53 in the vertical direction. The lower end side of the elevating shaft 53 is provided with a length extending through the lower bearing 76 provided in the connecting plate 60 so as to be able to be raised and lowered.

  The intermediate plate 61 has a shape with a hole 61A at the center, and the piston rod 78, the coil spring 70, and the lower bearing 76 of the cylinder device 69 can be disposed in the region of the hole 61A. . Here, the piston rod 78 is kept in a fixed state that restricts the downward movement of the guide plate 59 while the tip (upper end) of the piston rod 78 is in contact with the guide plate 59, while the tip of the piston rod 78 is moved from the guide plate 59. The coil spring 70 supports the guide plate 59 in a state in which the coil spring 70 allows the wafer table 13 to move downward when it is not contacted apart from the lower side. Further, by moving the adjusting bolt 63 provided between the connecting plate 60 and the intermediate plate 61 forward and backward, the distance between the plates 60 and 61 is adjusted, whereby the wafer table 13 and the ring frame table 14 are adjusted. The relative height can be adjusted.

  The slide base 64 can be moved in the left-right direction in FIG. 1 via a feed screw (not shown) driven by a motor M5 of the driving device 16, whereby the wafer table 13 and the ring frame table 14 are moved in the left-right direction. Will be moved to. Therefore, when the press roller 42 rotates on the wafer W and the ring frame R placed on the upper surfaces of the tables 13 and 14, the protective tape T1 or the dicing tape T2 can be attached. At the time of applying the tape, the moving speed of the slide base 64 by the driving device 16 is set to be slightly slower than the feeding speed by the feeding device 17 as will be described later.

  The elevating device 67 has a piston rod 80 whose tip is fixed to the lower surface side of the intermediate plate 61, and the intermediate plate 61 is moved up and down as the piston rod 80 advances and retreats, thereby connecting the connecting plate 60 and each of them. The tables 13 and 14 can be raised and lowered.

  The fine adjustment device 72 includes a slide block 81 disposed on the upper surface of the guide plate 59, a roller 82 as a rotating body supported on the lower surface side of the support surface portion 52 of the wafer table 13, and the roller 82 as a slide block. A tension spring 84, which is a spring member having a biasing force to be brought into contact with an inclined surface 81A as a height adjustment surface formed on the upper surface of 81, and the slide block 81 is moved to move the slide block 81 and the roller 82 between An operation shaft member 85 for adjusting the contact point up and down is provided. The operation shaft member 85 is constituted by a screw shaft that extends through the slide block 81 in the left-right direction in FIG. 1, and the slide block 81 moves in the left-right direction by the rotation of the operation shaft member 85 to adjust the contact point in the vertical direction. Is possible. An operation knob 87 is provided at the operation end (left end in FIG. 1) of the operation shaft member 85, and the operation knob 87 is positioned outside the lifting plate 57 of the ring frame table 14. It is provided to be operable from the outside of the apparatus. Therefore, the relative height between the wafer table 13 and the ring frame table 14 can be finely adjusted by rotating the operation knob 87.

  The guide mechanism 73 of the ring frame table 14 includes a guide rail 89 that is vertically arranged on both sides along the moving direction of the slide base 64, and a lifting block 90 provided on the lifting plate 57. .

  As shown in FIG. 1, the feeding device 17 that feeds the strips A <b> 1 and A <b> 2 is provided in the vicinity of the feeding roller 95, a pinch roller 96 in contact with the outer peripheral surface of the feeding roller 95, and the feeding roller 95. The motor M3 includes a pulley 98 fixed to the output shaft 97 of the motor M3 and a belt 101 wound around a pulley 100 fixed to the rotating shaft 99 of the feeding roller 95. A guide roller 102 for the peeling base material B is disposed between the feeding device 17 and the pasting means 12.

  The feeding speed of the strip A1 by the feeding device 17 is slightly higher than the speed when the wafer table 13 and the ring frame table 14 are moved to the left in FIG. 1 in order to attach the protective label T1 to the wafer W. Is set. Therefore, as shown in FIG. 6, when the wafer W is moved to the left side and the protective labels T1 are sequentially attached, the feeding speed is slightly higher than the table moving speed, so that the peel plate 41 and the press roller 42, a slight slack of the protective tape T1 occurs, whereby the protective tape T1 can be applied to the wafer W without applying a tensile force along the feeding direction to the protective tape T1. It becomes possible. Therefore, warp deformation of the wafer W that can be caused by residual stress when the protective tape T1 is attached to the wafer W in a state where a tensile force is generated can be reliably prevented.

  The meandering prevention means 18 for preventing the meandering of the protective tape T1 and the dicing tape T2 uses a pinch roller 96 constituting a part of the feeding device 17, as schematically shown in FIGS. Configured. More specifically, the meandering prevention means 18 includes the pinch roller 96, a pair of arms 105 and 105, one end of which is connected to rotatably support both axial ends of the pinch roller 96, and the arms 105 A pair of rotation center shafts 106 extending between the other ends of the rollers and supported by the frame F and disposed between the arm 105 and the frame F and biasing the pinch roller 96 toward the upper part of the outer peripheral surface of the feeding roller 95. The springs 108 and 108 and a pair of spring pressure adjusting bolts 109 and 109 disposed on the lower end surface side of the arm 105 are provided.

  The spring 108 is stretched between a pin 110 protruding from the outer surface of the arm 105 and a pin 111 protruding from the inner surface of the frame F. Further, the spring pressure adjusting bolt 109 is screw-engaged with a bracket 113 provided on the inner side surface of the frame F, and is arranged in a state in which the tip abuts against the lower end surface of the arm 105. Accordingly, the pinch roller 96 comes into contact with its own weight and the feeding roller 95 in a state where a constant contact pressure is applied by the biasing force of the spring 108, but the tip positions of the spring pressure adjusting bolts 109 and 109. Is adjusted so that the contact pressure on the both sides in the axial direction of the pinch roller 96 changes with respect to the feeding roller 95, thereby eliminating the uneven pressure distribution in the axial direction of the pinch roller 96 and the feeding roller 95. The meandering of the peeling base material B is prevented, and as a result, the strip-shaped material A1 is not displaced laterally with respect to the feeding direction, and the peeled protective tape T1 can be accurately applied to the circuit surface of the wafer W.

  The winding means 19 of the peeling base material B constituting the strips A1 and A2 includes a winding roller 115, a motor M4 disposed in the vicinity thereof, and a pulley 117 fixed to the output shaft 116 of the motor M4. The belt 118 is wound around the pulley and a pulley (not shown) fixed to the take-up roller 115.

  Next, the sticking operation of the protective tape T1 in this embodiment will be described.

  As an initial operation, the roll-shaped raw material of the protective tape T1 is set on the support roller 11, and the front end side region of the tape base material C is peeled by a predetermined length, and the front end is fixed to the residue winding roller 22. On the other hand, the peeling base material B of the belt-like material A1 is wound around the peel plate 41 and is sandwiched between the feeding roller 95 and the pinch roller 96 through the guide roller 102, and the tip is fixed to the winding roller 115.

  In the meandering prevention means 18, the spring pressure adjusting bolt 109 is adjusted using a pressure detector (not shown) so that the pressures on both sides in the axial direction of the feeding roller 95 and the pinch roller 96 coincide.

  The wafer table 13 and the ring frame table 14 are moved from the left end of the frame F to the left side by moving the wafer table 13 and the ring frame table 14 downward from the position shown in FIG. The wafer W is positioned and arranged on the wafer table 13 via a transfer device that is not, and the wafer W is sucked and fixed to the support surface portion 52 of the wafer table 13. Next, the wafer table 13 is moved to the right side in the figure, the lifting device 67 is operated, and the wafer table 13 is set at the sticking height position. At this time, the left end position of the wafer W is positioned on the right side of the virtual vertical line passing through the center position of the press roller 42. Further, the tip of the piston rod 78 of the cylinder device 69 is in contact with the lower surface of the guide plate 59, and the support surface portion 52 of the wafer table 13 is fixed at a certain flat height in a fixed state that prohibits the lowering of the guide plate 59. Kept in position.

  When a feeding output is given to the strip A1 by driving the feeding device 17 and the lead end of the protective tape T1 positioned immediately before the peel plate 41 is detected by a sensor (not shown), the wafer table 13 and the ring are synchronized with this. The frame table 14 moves to the left in FIG. 1, the lead end of the peeled protective tape T1 coincides with the left end of the wafer W, and the application area is sequentially expanded while receiving the application pressure from the press roller 42. . At this time, the movement of the wafer table 13 and the ring frame table 14 is set to a speed slightly slower than the feeding speed of the strip A1, so that the protective tape T1 is slack as shown in FIG. Thus, no pulling force in the feeding direction is generated on the protective tape T1, and therefore the warp deformation does not occur on the wafer W after the pasting is completed. Further, since the belt-like material A1 is accurately fed out along the set feeding direction or feeding trajectory by the meandering preventing means 18 described above, that is, does not shift in the width direction, the outer peripheral edge of the protective tape T1 is Then, the wafer W is attached in a state of being coincident with the outer peripheral edge of the wafer W.

  When the sticking of the protective tape T1 is completed in this way, the wafer W is transferred to the back grinding process via a transfer device (not shown) and is ground.

  When sticking the dicing tape T2, the strip A1 is removed from the support roller 11, and the strip A2 is set on the support roller 11 in the manner described above in which the strip A1 is set. Further, the cylinder device 69 is operated to move the piston rod 78 backward to switch to the separated position where the contact state with the guide plate 59 is released. As a result, the guide plate 59 is supported by the coil spring 70.

  With the wafer table 13 and the ring frame table 14 moved out of the apparatus, the ring frame R is transferred to the ring frame table 14 via a transfer apparatus (not shown), and the wafer W which has been back-ground is attached to the protective tape. The wafer is placed on the wafer table 13 with T1 as the lower surface side. The center position and the relative position of the ring frame R and the wafer W are accurately adjusted via the alignment device.

  Next, the wafer table 13 and the ring frame table 14 are moved further to the right than the position shown in FIG. 1 from the position moved out of the apparatus, and the left end of the ring frame R is from a virtual vertical line passing through the center of the press roller 42. Will also be on the right.

  The wafer table 13 and the ring frame table 14 move to the left side in FIG. 1 in conjunction with the peeling operation of the dicing tape T2, so that the dicing tape T2 is attached to the ring frame R and the wafer W. At this time, since the tip of the piston rod 78 is in a non-contact position with respect to the guide plate 59 when the wafer table 13 receives a pressure applied by the press roller 42, the coil spring 70 is contracted and has a length. Is reduced, and an excessive sticking pressure on the surface of the wafer W is absorbed, whereby cracking of the wafer W is effectively prevented.

  Therefore, according to such an embodiment, it becomes possible to use the wafer table 13 and the ring frame table 14 as a single structure for the application of the protective tape T1 and the dicing tape T2, and the single bonding apparatus 10 can be used. Each tape T1, T2 can be attached.

  Further, when the piston rod 78 of the cylinder device 69 constituting the contact / separation mechanism comes into contact with the lower surface of the guide table 59, the wafer table 13 is reliably maintained at a fixed height position, while the contact state is released. In addition, since the coil spring 70 is configured to support the guide plate 59, the pressure applied when the dicing tape T2 is applied to the wafer W can be kept in a moderate state, and the tape can be reliably prevented while preventing the wafer W from cracking. Affixing can be realized.

  Further, since the fine adjustment device 72 is provided between the guide table 59 and the support surface portion 52 of the wafer table 13, the height position of the contact point between the slide block 81 and the roller 82 constituting the fine adjustment device 72 is adjusted. It is possible to adjust the relative heights of the wafer W and the ring frame R according to the thickness of the wafer W through the adjustment of the height position. Further, in the mechanism in which the support means 15 is moved up and down entirely by the lifting device 67, the screwing position of the adjusting bolt 63 constituting the interval adjusting member can be adjusted, so that the wafer W and the ring frame R to be bonded can be adjusted. Therefore, the wafer table 13 and the ring frame table 14 can be accurately set at the tape bonding height position.

The best configuration, method, and the like for carrying out the present invention have been disclosed above, but the present invention is not limited to this.
That is, the invention has been illustrated and described primarily with respect to particular embodiments, but the embodiments described above are within the scope of the technical idea and purpose of the invention. On the other hand, those skilled in the art can make various changes in other detailed configurations such as shape, position, and component configuration.
Therefore, the description limited to the shape, position, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

  For example, the support means 15 is not limited to the illustrated configuration example, and it is sufficient if the support means 15 is configured to be able to change the application pressure of the protective tape T1 and the dicing tape T2. Further, the slide block 81 and the roller 82 in the fine adjustment device 72 may be reversely arranged. That is, the slide block 81 and the operation shaft member 85 may be provided on the wafer table 13 side, while the roller 82 may be provided on the guide plate 59 side. Furthermore, although the protective tape T1 and the dicing tape T2 are formed in advance by the half cut D, the half cut D corresponding to the shape of the protective tape T1 and the dicing tape T2 is formed in the middle of the feeding path of the strips A1 and A2. It is also possible to do.

  The present invention can be used as a semiconductor wafer processing apparatus.

The schematic front view of the bonding apparatus which concerns on this embodiment. The left view of the said bonding apparatus. (A) is a belt-shaped material showing a protective tape, (B) is a belt-shaped material showing a dicing tape. The schematic perspective view which shows the correspondence which affixes a protection tape and a dicing tape on a wafer and a ring frame. The schematic front view which shows the middle of the operation | movement which sticks a protective tape or a dicing tape. Explanatory drawing which shows the correlation with the feeding speed of a strip | belt-shaped material, and the moving speed of the wafer W. FIG. The schematic perspective view of a meandering prevention means. The schematic side view of a meandering prevention means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Bonding device 12 Bonding means 13 Wafer table 14 Ring frame table 15 Support means 16 Drive device 17 Feeding device 18 Meander prevention means 19 Winding means 41 Peel plate (bonding means)
42 Press roller (bonding means)
53 Lifting shaft 57 Lifting plate 59 Guide plate 60 Connection plate 61 Intermediate plate 63 Adjustment bolt (spacing adjustment member)
64 Slide base 67 Lifting device 69 Cylinder device (contact / separation mechanism)
70 Coil spring (biasing means)
72 Fine adjustment device 81 Slide block 81A Inclined surface 82 Roller (rotating body)
84 Tension spring (spring member)
85 Operating shaft member A1, A2 Strip material B Release substrate C Tape substrate T1 Protection tape T2 Dicing tape R Ring frame W Semiconductor wafer

Claims (7)

Affixing a protective tape on the circuit surface of the semiconductor wafer, and a dicing tape for mounting the semiconductor wafer on the semiconductor wafer and a ring frame for a bonding apparatus table,
A wafer table for supporting the semiconductor wafer; a ring frame table for supporting the ring frame; and a supporting means for supporting each of the tables.
The wafer table and the ring frame table are provided so as to be movable up and down via the support means,
The support means includes a contact / separation mechanism that enables switching between a function of restricting the movement of the wafer table in the height direction and a function of allowing the wafer table to be displaced downward with respect to the ring frame. When the tape is affixed, the contact / separation mechanism regulates the movement of the wafer table in the height direction to fix the height position of the wafer table, while the dicing tape affixes the contact / separation mechanism when the tape is affixed. The table | surface for bonding apparatuses characterized by relieving a sticking pressure by accept | permitting the displacement below. The support means includes a guide plate for vertically guiding a lifting shaft provided on the lower surface side of the wafer table, and a connecting plate for mutually connecting a plurality of lifting plates provided on the lower surface side of the ring frame table. , And further includes an elevating device for raising and lowering the connecting plate up and down,
The contact / separation mechanism is configured by a cylinder device provided between the connection plate and the guide plate, and the height direction of the wafer table is such that the tip of the piston rod of the cylinder device is in contact with the guide plate. the while regulating movement, pasting if table according to claim 1, characterized by being arranged to be displaced in the direction the wafer table in a state in which a non-contact to relieve sticking pressure. It said support means further comprises a arranged intermediate plates between the connecting plate and the guide plate of claim 2, wherein said connecting plate through the intermediate plate, characterized in that it is movable up and down Table for pasting. An interval adjustment member is provided between the intermediate plate and the connecting plate, and the height of the ring frame table is provided so that the height of the ring frame table can be finely adjusted by a predetermined operation of the interval adjustment member. Item 3. A bonding table according to item 3 . An urging means is interposed between the connecting plate and the guide plate, and the urging means allows the guide plate to be displaced downward when the tip of the piston rod is not in contact. The bonding table according to claim 2, 3 or 4, wherein an urging force is applied to keep the height of the wafer table at a fixed position. It said wafer table, bonded engagement table according to any one of claims 1 to 5, characterized in that it finely adjustably provided the height position via a fine adjustment device. The fine adjustment device is disposed on one of the opposing surfaces of the guide plate and the wafer table and has a slider having a height adjustment surface, a rotating body disposed on the other opposing surface, A spring member that keeps the height adjustment surface and the slider in contact with each other; and an operation shaft member that moves the slider to adjust the contact point between the slider and the rotating body up and down. The bonding end table according to claim 6 , wherein the operation end portion is located outside the device outside the lifting plate of the ring frame.

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