TWI738049B - Film cutting device, film cutting method, wafer laminating method and wafer laminator - Google Patents

Film cutting device, film cutting method, wafer laminating method and wafer laminator Download PDF

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Publication number
TWI738049B
TWI738049B TW108131875A TW108131875A TWI738049B TW I738049 B TWI738049 B TW I738049B TW 108131875 A TW108131875 A TW 108131875A TW 108131875 A TW108131875 A TW 108131875A TW I738049 B TWI738049 B TW I738049B
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Taiwan
Prior art keywords
film
layer
cutting
cutter
wafer
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TW108131875A
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Chinese (zh)
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TW202111792A (en
Inventor
陳明宗
曾永村
楊佳裕
賴家偉
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志聖工業股份有限公司
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Priority to TW108131875A priority Critical patent/TWI738049B/en
Priority to JP2020148170A priority patent/JP7071455B2/en
Priority to KR1020200112676A priority patent/KR20210029112A/en
Publication of TW202111792A publication Critical patent/TW202111792A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/22—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter coacting with a movable member, e.g. a roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00—Combinations of several similar cutting apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/384—Cutting-out; Stamping-out using rotating drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/515—Cutting handled material
    • B65H2301/5153—Details of cutting means
    • B65H2301/51532—Blade cutter, e.g. single blade cutter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film

Abstract

A film cutting method is provided. A film including a first layer and a second layer arranged in a stack is provided. The first layer is cut by a first cutter to obtain a patterned first layer portion and a waste first layer portion attached to the second layer. The waste first layer portion removed from the second layer. The second layer is cut by a second cutter which moves along a cutting path to obtain a cut second layer attached with the patterned first layer portion. The cutting path surrounds the patterned first layer portion and is spaced apart from the edge of the patterned first layer portion.

Description

層膜裁切裝置、層膜裁切方法、晶圓貼膜機以及晶圓貼膜方法Layer film cutting device, layer film cutting method, wafer sticking machine and wafer sticking method

本發明係關於一種層膜裁切裝置以及層膜裁切方法，特別是包含兩個不同刀具的層膜裁切裝置以及利用所述兩個刀具的層膜裁切方法。本發明還涉及搭載層膜裁切裝置的晶圓貼膜機以及包含層膜裁切方法的晶圓貼膜方法。 The present invention relates to a layer film cutting device and a layer film cutting method, in particular to a layer film cutting device including two different cutters and a layer film cutting method using the two cutters. The present invention also relates to a wafer attaching machine equipped with a layer film cutting device and a wafer attaching method including a layer film cutting method.

在半導體積體電路和各種微機電的製造過程中，其中一道步驟是在晶圓(Wafer)表面或背面貼上薄膜，以便進行後續相關的晶圓製程。用於貼附於晶圓的薄膜包括但不限於切割藍膜、切割白膜、減薄保護膜、UV膜以及DAF(Die Attach Film)導電膜等。將薄膜貼附於晶圓可黏著晶圓表面或背面的製程微粒，並且薄膜被移除而將製程微粒帶離晶圓表面或背面。一般而言，貼附於晶圓的薄膜為多層膜結構，至少包含了乾膜(Dry film)與麥拉(Mylar)膜。乾膜被加熱後具有流動性與黏著性，因而能夠穩固定附著於晶圓表面。 In the manufacturing process of semiconductor integrated circuits and various micro-electromechanical devices, one of the steps is to stick a thin film on the surface or back of the wafer for subsequent related wafer manufacturing processes. Films used for attaching to wafers include, but are not limited to, cutting blue film, cutting white film, thinning protective film, UV film, and DAF (Die Attach Film) conductive film. Attaching the film to the wafer can adhere the process particles on the surface or back of the wafer, and the film is removed to bring the process particles away from the surface or back of the wafer. Generally speaking, the film attached to the wafer has a multilayer film structure, including at least a dry film and a Mylar film. After the dry film is heated, it has fluidity and adhesion, so it can be firmly attached to the wafer surface.

目前在裁切薄膜時，通常是以刀具在單一製程步驟中完全切割乾膜與麥拉膜，因此乾膜與麥拉膜的尺寸相同，並且兩者的尺寸均與晶圓的尺寸相近。當將薄膜貼附於晶圓時，被加熱的乾膜由於具有流動性，因此容易從晶圓與麥拉膜之間的間隙溢出，導致執行貼膜程序的機台或是晶圓表面的微結構被乾膜汙染。此外，乾膜被加熱時溢出固化而容易包覆麥拉膜邊緣。在完成貼膜程序後執行的撕除麥拉膜程序中，位於麥拉膜邊緣的固化乾膜導致麥拉膜難以被掀離而不易產生剝離破口，因此撕除麥拉 At present, when cutting films, a knife is usually used to completely cut the dry film and Mylar film in a single process step. Therefore, the size of the dry film and the Mylar film are the same, and the sizes of both are similar to the size of the wafer. When the film is attached to the wafer, the heated dry film is fluid, so it easily overflows from the gap between the wafer and the Mylar film, resulting in the machine that performs the filming process or the microstructure of the wafer surface Contaminated by dry film. In addition, the dry film overflows and solidifies when heated and easily covers the edges of the Mylar film. In the Mylar film removal process performed after the filming process, the cured dry film at the edge of the Mylar film makes the Mylar film difficult to be lifted off and does not easily produce peeling tears, so the Mylar film is removed

鑒於以上的問題，本發明揭露一種層膜裁切方法以及層膜裁切裝置，有助於解決被加熱的乾膜會溢出而汙染機台或晶圓的問題。本發明還揭露一種晶圓貼膜方法以及晶圓貼膜機。 In view of the above problems, the present invention discloses a layer film cutting method and a layer film cutting device, which help solve the problem that the heated dry film will overflow and contaminate the machine or wafer. The invention also discloses a wafer sticking method and a wafer sticking machine.

本發明揭露的層膜裁切方法包含：提供一層膜，包含堆疊設置的一第一膜層以及一第二膜層；以一第一刀具裁切第一膜層，而得到貼附於第二膜層上的一圖案化第一膜層部分以及一廢料第一膜層部分；自第二膜層移除廢料第一膜層部分；以及以一第二刀具沿著一裁切路徑裁切第二膜層，而使被裁切的第二膜層貼附有圖案化第一膜層部分。裁切路徑圍繞圖案化第一膜層部分並且與圖案化第一膜層部分的邊緣彼此間隔。 The film cutting method disclosed in the present invention includes: providing a layer of film, including a first film layer and a second film layer arranged in a stack; cutting the first film layer with a first cutter to obtain the second film A patterned first film layer portion and a waste first film layer portion on the film layer; removing the waste first film layer portion from the second film layer; and cutting the first film layer portion along a cutting path with a second cutter Two film layers, so that the cut second film layer is attached with the patterned first film layer part. The cutting path surrounds the patterned first film portion and is spaced apart from the edge of the patterned first film portion.

本發明揭露的層膜裁切裝置包含一層膜輸送機構、一層膜吸附平台、一滾刀以及一刀具。層膜輸送機構用以輸送一層膜進入或離開一裁切工作區。層膜吸附平台設置於裁切工作區。滾刀設置以半切割層膜，且刀具設置以完全切割層膜。刀具可相對層膜吸附平台移動。 The layer film cutting device disclosed in the present invention includes a layer film conveying mechanism, a layer film adsorption platform, a hob and a cutter. The layer film conveying mechanism is used to convey a layer of film into or out of a cutting work area. The film adsorption platform is set in the cutting work area. The hob is set to half-cut the layer film, and the cutter is set to completely cut the layer film. The cutter can move relative to the film adsorption platform.

本發明揭露的晶圓貼膜方法包含：提供一層膜，包含堆疊設置的一第一膜層以及一第二膜層；以一第一刀具裁切該第一膜層，而得到貼附於第二膜層上的一圖案化第一膜層部分以及一廢料第一膜層部分；自第二膜層移除廢料第一膜層部分；以一第二刀具沿著一裁切路徑裁切第二膜層，而使被裁切的該第二膜層貼附有圖案化第一膜層部分，其中裁切路徑圍繞圖案化第一膜層部分並且與圖案化第一膜層部分的邊緣彼此間隔；以一貼膜裝置拾取被裁切的第二膜層至一晶圓上方；以及將貼附於第二膜層上的圖案化第一膜層貼附於晶圓上。 The wafer attaching method disclosed in the present invention includes: providing a layer of film, including a first film layer and a second film layer stacked; A patterned first film layer portion and a waste first film layer portion on the film layer; the waste first film layer portion is removed from the second film layer; the second film layer is cut along a cutting path with a second cutter A film layer, so that the cut second film layer is attached to the patterned first film layer portion, wherein the cutting path surrounds the patterned first film layer portion and is spaced apart from the edge of the patterned first film layer portion ; Pick up the cut second film layer with a film attaching device to the top of a wafer; and attach the patterned first film layer attached to the second film layer on the wafer.

本發明揭露的晶圓貼膜機包含前述的層膜裁切裝置以及一貼膜裝置。貼膜裝置包含一下腔體以及一上腔體。下腔體設置有一晶圓載台。上腔體設置有一吸盤。上腔體於一貼膜位置時位於晶圓載台上方，於 一吸膜位置時位於層膜吸附平台上方，且上腔體可在貼膜位置與吸膜位置之間往復移動。 The wafer sticking machine disclosed in the present invention includes the aforementioned layer film cutting device and a sticking device. The film sticking device includes a lower cavity and an upper cavity. The lower cavity is provided with a wafer carrier. The upper cavity is provided with a suction cup. The upper cavity is located above the wafer carrier at a filming position, at A film suction position is located above the film suction platform, and the upper cavity can move back and forth between the film sticking position and the film suction position.

根據本發明所揭露的層膜裁切方法以及層膜裁切裝置，以不同的刀具分別裁切層膜的兩個膜層，而讓裁切後的第一膜層與第二膜層具有不同尺寸。層膜裁切裝置還可搭載於晶圓貼膜機，以便晶圓貼膜機執行晶圓貼膜方法。採用本發明所揭露的層膜裁切方法裁切的層膜具有尺寸比晶圓小的第一膜層以及尺寸比晶圓大或跟晶圓相等的第二膜層。藉此，當層膜貼附於晶圓時，能防止被加熱的第一膜層從晶圓與第二膜層之間的間隙溢出，有助於避免膜層汙染晶圓的邊緣或背面。 According to the layer film cutting method and the layer film cutting device disclosed in the present invention, the two layers of the layer film are respectively cut with different cutters, so that the first film layer and the second film layer after being cut are different size. The layer film cutting device can also be mounted on a wafer laminator so that the wafer laminator can perform the wafer laminating method. The layer film cut by the layer film cutting method disclosed in the present invention has a first film layer smaller in size than the wafer and a second film layer larger in size or equal to the wafer in size. Thereby, when the layers of the film are attached to the wafer, the heated first film layer can be prevented from overflowing from the gap between the wafer and the second film layer, which helps prevent the film layer from contaminating the edge or back of the wafer.

此外，因第一膜層的直徑尺寸小於第二膜層的直徑尺寸，縱使第一膜層被加熱後會在第二膜層邊緣處固化，卻不會包覆第二膜層邊緣處。藉此，第二膜層不會因為固化第一膜層的阻礙而有難以被掀離的問題，有助於提升後續撕除第二膜層的效率。 In addition, because the diameter size of the first film layer is smaller than the diameter size of the second film layer, even if the first film layer is heated, it will solidify at the edge of the second film layer, but it will not cover the edge of the second film layer. Thereby, the second film layer will not be difficult to be lifted off due to the hindrance of curing the first film layer, which helps to improve the efficiency of subsequent tearing off of the second film layer.

以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理，並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the disclosure and the following description of the embodiments are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

1:層膜裁切裝置 1: Layer film cutting device

10:層膜輸送機構 10: Layer film conveying mechanism

110:第一輸送輪 110: The first conveyor wheel

120:第二輸送輪 120: second conveyor wheel

130:導膜輪 130: film guide wheel

140:廢膜回收輪 140: Waste film recycling wheel

20:層膜吸附平台 20: Layer membrane adsorption platform

30:第一刀具 30: First tool

310:本體 310: body

320:刀刃部 320: Blade

40:第二刀具 40: second tool

50:拉膜機構 50: Film pulling mechanism

60:從動滾輪 60: driven roller

2:層膜 2: layer film

2a:保護膜 2a: Protective film

21:第一膜層 21: The first layer

21a:圖案化第一膜層部分 21a: Patterned first film layer part

211:邊緣 211: Edge

21b:廢料第一膜層部分 21b: The first film layer part of the waste

22:第二膜層 22: second film layer

3:晶圓貼膜機 3: Wafer mounter

1a:貼膜裝置 1a: Film sticking device

80:下腔體 80: Lower cavity

810:晶圓載台 810: Wafer stage

90:上腔體 90: Upper cavity

910:吸盤 910: Suction Cup

4:晶圓 4: Wafer

P:裁切路徑 P: Cutting path

R:裁切工作區 R: Cutting work area

D1:輸送方向 D1: Conveying direction

D2:垂直方向 D2: vertical direction

S1~S5:步驟 S1~S5: steps

圖1為根據本發明一實施例之層膜裁切裝置的示意圖。 FIG. 1 is a schematic diagram of a film cutting device according to an embodiment of the present invention.

圖2為根據本發明一實施例之層膜裁切方法的流程示意圖。 FIG. 2 is a schematic flow chart of a method for cutting a layered film according to an embodiment of the present invention.

圖3至圖9為圖1之層膜裁切裝置執行層膜裁切方法的示意圖。 3 to 9 are schematic diagrams of the layer film cutting method performed by the layer film cutting device of FIG. 1.

圖10為根據本發明一實施例之晶圓貼膜機的示意圖。 FIG. 10 is a schematic diagram of a wafer mounter according to an embodiment of the present invention.

圖11和圖12為圖10之晶圓貼膜機執行晶圓貼膜方法的示意圖。 11 and 12 are schematic diagrams of the wafer attaching method performed by the wafer attaching machine of FIG. 10.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施，且根 據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention will be described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly. According to the content, the scope of patent application and the drawings disclosed in this specification, anyone who is familiar with the relevant art can easily understand the related purposes and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

根據本發明的一實施例，層膜裁切裝置包含層膜輸送機構、層膜吸附平台、滾刀以及刀具。請參照圖1，為根據本發明一實施例之層膜裁切裝置的示意圖。在本實施例中，層膜裁切裝置1包含一層膜輸送機構10、一層膜吸附平台20、一第一刀具30以及一第二刀具40。 According to an embodiment of the present invention, the layer film cutting device includes a layer film conveying mechanism, a layer film adsorption platform, a hob and a cutter. Please refer to FIG. 1, which is a schematic diagram of a film cutting device according to an embodiment of the present invention. In this embodiment, the layer film cutting device 1 includes a layer film conveying mechanism 10, a layer film adsorption platform 20, a first cutter 30 and a second cutter 40.

層膜輸送機構10包含一第一輸送輪110、一第二輸送輪120、多個導膜輪130以及二廢膜回收輪140。第一輸送輪110與第二輸送輪120之間具有一裁切工作區R。導膜輪130設置於裁切工作區R之一側，其用以承載纏繞成圓筒狀的多層膜(未繪示)。廢膜回收輪140設置於裁切工作區R之一側，其用以回收裁切薄膜後殘留下來的多餘廢膜。第一輸送輪110與導膜輪130能夠導引多層膜沿著預定的方向朝向第二輸送輪120移動。藉此，層膜輸送機構10能使多層膜於裁切工作區R沿一輸送方向D1自第一輸送輪110移動至第二輸送輪120。 The layer film conveying mechanism 10 includes a first conveying wheel 110, a second conveying wheel 120, a plurality of film guide wheels 130, and two waste film recycling wheels 140. There is a cutting work area R between the first conveying wheel 110 and the second conveying wheel 120. The film guide wheel 130 is arranged on one side of the cutting work area R, and is used to carry the multilayer film (not shown) wound into a cylindrical shape. The waste film recovery wheel 140 is arranged on one side of the cutting work area R, and is used to recover the excess waste film remaining after the film is cut. The first conveying wheel 110 and the film guide wheel 130 can guide the multilayer film to move toward the second conveying wheel 120 along a predetermined direction. Thereby, the layer film conveying mechanism 10 can move the multilayer film in the cutting work area R from the first conveying wheel 110 to the second conveying wheel 120 along a conveying direction D1.

層膜吸附平台20設置於裁切工作區R，其用以承載進入裁切工作區R的多層膜。透過一驅動裝置(未繪示)可帶動層膜吸附平台20沿著正交於輸送方向D1的垂直方向D2上升或下降。第一刀具30例如為滾刀，其設置於裁切工作區R以切割薄膜。第一刀具30包含一本體310以及至少一刀刃部320。本體310可繞著自身的軸心轉動，且刀刃部320自本體310朝外突出。在本實施例中，刀刃部320為一封閉環形刀刃，並且刀刃部320的長度小於多層膜的厚度，以將多層膜半切割。層膜輸送機構10的第一輸送輪110較第二輸送輪120更靠近第一刀具30。 The film adsorption platform 20 is disposed in the cutting work area R, and is used to carry the multilayer film entering the cutting work area R. A driving device (not shown) can drive the film adsorption platform 20 to rise or fall along a vertical direction D2 orthogonal to the conveying direction D1. The first cutter 30 is, for example, a hob, which is set in the cutting work area R to cut the film. The first cutter 30 includes a body 310 and at least one blade portion 320. The main body 310 can rotate around its own axis, and the blade portion 320 protrudes outward from the main body 310. In this embodiment, the blade portion 320 is a closed annular blade, and the length of the blade portion 320 is less than the thickness of the multilayer film, so as to cut the multilayer film in half. The first conveying wheel 110 of the layer film conveying mechanism 10 is closer to the first cutter 30 than the second conveying wheel 120.

第二刀具40設置於裁切工作區R並且位於層膜吸附平台20的上方。透過一驅動裝置(未繪示)可帶動第二刀具40於裁切工作區R中相對層膜吸附平台20轉動，以使第二刀具40裁切位於層膜吸附平台20上的 多層膜。第一刀具30與第二刀具40為相異的兩個刀具。 The second cutter 40 is arranged in the cutting work area R and above the film adsorption platform 20. A driving device (not shown) can drive the second cutter 40 to rotate relative to the film adsorption platform 20 in the cutting work area R, so that the second cutter 40 cuts the film on the film adsorption platform 20 Multilayer film. The first tool 30 and the second tool 40 are two different tools.

根據本發明的一實施例，層膜裁切裝置更進一步包含拉膜機構。參照圖1，層膜裁切裝置1進一步包含一拉膜機構50，其設置於裁切工作區R以夾持並且撐開多層膜。拉膜機構50例如包含馬達以及夾具。經由馬達驅動夾具夾持多層膜，並且讓夾具沿著相交於輸送方向D1的拉膜方向移動以撐開多層膜。 According to an embodiment of the present invention, the layer film cutting device further includes a film pulling mechanism. 1, the layer film cutting device 1 further includes a film pulling mechanism 50 arranged in the cutting work area R to clamp and stretch the multilayer film. The film pulling mechanism 50 includes, for example, a motor and a clamp. The clamp is driven by the motor to clamp the multilayer film, and the clamp is moved along the film pulling direction intersecting the conveying direction D1 to stretch the multilayer film.

根據本發明的一實施例，層膜裁切裝置更進一步包含從動滾輪。參照圖1，層膜裁切裝置1進一步包含一從動滾輪60，其設置於第一刀具30的一側。從動滾輪60可以是筒狀或圓盤狀。當多層膜通過第一刀具30時，從動滾輪60可以與第一刀具30共同夾持多層膜，以確保多層膜緊貼第一刀具30。 According to an embodiment of the present invention, the film cutting device further includes a driven roller. Referring to FIG. 1, the layer film cutting device 1 further includes a driven roller 60 arranged on one side of the first cutter 30. The driven roller 60 may be cylindrical or disc-shaped. When the multilayer film passes through the first cutter 30, the driven roller 60 can clamp the multilayer film together with the first cutter 30 to ensure that the multilayer film is close to the first cutter 30.

以下說明根據本發明一實施例的層膜裁切方法。請一併參照圖2至圖9，其中圖2為根據本發明一實施例之層膜裁切方法的流程示意圖。圖3至圖9為圖1之層膜裁切裝置執行層膜裁切方法的示意圖。在本實施例中，可經由層膜裁切裝置1執行層膜裁切方法，並且層膜裁切方法包含步驟S1~S5。 Hereinafter, a method for cutting a layered film according to an embodiment of the present invention will be described. Please refer to FIG. 2 to FIG. 9 together, in which FIG. 2 is a schematic flowchart of a method for cutting a film according to an embodiment of the present invention. 3 to 9 are schematic diagrams of the layer film cutting method performed by the layer film cutting device of FIG. 1. In this embodiment, the layer film cutting method can be performed through the layer film cutting device 1, and the layer film cutting method includes steps S1 to S5.

步驟S1係為提供一層膜2至層膜裁切裝置1。如圖3所示，纏繞成筒狀的層膜2被架設於層膜輸送機構10上。層膜輸送機構10的第一輸送輪110和第二輸送輪120轉動以展延層膜2。其中，層膜2包含堆疊設置的一第一膜層21以及一第二膜層22。貼附於層膜2之第一膜層21上的一塑膠保護膜2a被預先撕下並且經由其中一個廢膜回收輪140被回收。在本實施例中，第一膜層21為乾膜，其具有一定的黏性和良好的感光性。第二膜層22為麥拉膜，其能保護第一膜層21。前述膜層的材質並非用以限制本發明。 Step S1 is to provide a layer of film 2 to a layer of film cutting device 1. As shown in FIG. 3, the layer film 2 wound in a cylindrical shape is mounted on the layer film conveying mechanism 10. The first conveying wheel 110 and the second conveying wheel 120 of the layer film conveying mechanism 10 rotate to stretch the layer film 2. The layered film 2 includes a first film layer 21 and a second film layer 22 that are stacked. A plastic protective film 2 a attached to the first film layer 21 of the layered film 2 is torn off in advance and recycled through one of the waste film recycling wheels 140. In this embodiment, the first film layer 21 is a dry film, which has a certain viscosity and good photosensitivity. The second film layer 22 is a Mylar film, which can protect the first film layer 21. The material of the aforementioned film layer is not intended to limit the present invention.

步驟S2係為以拉膜機構夾持並且撐開層膜2。如圖4所示，拉膜機構50拉動並且撐開層膜2，以消除存在於層膜2的任何蜷曲，有助 於提升後續裁切的品質。拉膜機構50的配置並非用以限制本發明。在其他實施例中，若層膜輸送機構10的導膜輪130能夠良好地撐開層膜2，就不需要額外設置拉膜機構。 Step S2 is to clamp and stretch the layered film 2 with the film pulling mechanism. As shown in FIG. 4, the film pulling mechanism 50 pulls and stretches the film 2 to eliminate any curling in the film 2, which helps To improve the quality of subsequent cutting. The configuration of the film pulling mechanism 50 is not intended to limit the present invention. In other embodiments, if the film guide wheel 130 of the film transport mechanism 10 can stretch the film 2 well, there is no need to provide an additional film pulling mechanism.

步驟S3係為以第一刀具30裁切第一膜層21。如圖5和圖6所示，層膜輸送機構10的第一輸送輪110調整層膜2的移動方向，使得層膜2沿著輸送方向D1通過層膜吸附平台20上方，接著再被輸送至第二輸送輪120。拉膜機構50一併沿著輸送方向D1移動以維持層膜2的張力。當層膜2通過第一刀具30時，從動滾輪60將層膜2壓向第一刀具30，並且第一刀具30的本體310轉動，而使刀刃部320裁切層膜2的第一膜層21。被第一刀具30裁切後的第一膜層21分為貼附於第二膜層22上的一圖案化第一膜層部分21a以及一廢料第一膜層部分21b。由於刀刃部320的長度小於層膜2的厚度，因此刀刃部320不會完全切割第二膜層22。 Step S3 is to cut the first film layer 21 with the first cutter 30. As shown in Figures 5 and 6, the first transport wheel 110 of the layer film transport mechanism 10 adjusts the moving direction of the layer film 2 so that the layer film 2 passes over the layer film adsorption platform 20 along the transport direction D1, and then is transported to The second conveying wheel 120. The film pulling mechanism 50 moves along the conveying direction D1 to maintain the tension of the film 2. When the layer film 2 passes the first cutter 30, the driven roller 60 presses the layer film 2 against the first cutter 30, and the body 310 of the first cutter 30 rotates, so that the blade portion 320 cuts the first film of the layer film 2. Layer 21. The first film layer 21 cut by the first cutter 30 is divided into a patterned first film layer portion 21a attached to the second film layer 22 and a waste first film layer portion 21b. Since the length of the blade portion 320 is less than the thickness of the layer film 2, the blade portion 320 will not completely cut the second film layer 22.

在本實施例中，第一刀具30完全切割第一膜層21並且不會完全切割第二膜層22。換句話說，第一刀具30半切割層膜2。此處，所述「第一刀具30完全切割第一膜層21」是指第一刀具30會裁斷第一膜層21，而使第一膜層21形成分離的兩部分。所述「第一刀具30不會完全切割第二膜層22」是指第一刀具30不會裁切第二膜層22，或是雖然裁切第二膜層22但不裁斷第二膜層22。所述「第一刀具30半切割層膜2」則是指第一刀具30不裁斷層膜2，更進一步來說即是指第一刀具30裁斷第一膜層21並且不裁切第二膜層22，或是裁切但不裁斷第二膜層22。 In this embodiment, the first cutter 30 completely cuts the first film layer 21 and does not completely cut the second film layer 22. In other words, the first cutter 30 cuts the layer film 2 in half. Here, the "first cutter 30 completely cuts the first film layer 21" means that the first cutter 30 cuts the first film layer 21 so that the first film layer 21 is formed into two separate parts. The "first cutter 30 will not completely cut the second film layer 22" means that the first cutter 30 does not cut the second film layer 22, or although it cuts the second film layer 22, it does not cut the second film layer. twenty two. The "first cutter 30 half-cut layer film 2" means that the first cutter 30 does not cut the layer film 2, and further means that the first cutter 30 cuts the first film layer 21 and does not cut the second film. The layer 22, or the second film layer 22 is cut but not cut.

於步驟S3中，從動滾輪60將層膜2壓向第一刀具30以提升裁切品質，但從動滾輪60的設置並非用以限制本發明。在其他實施例中，若第一刀具30的刀刃部320具有足夠的長度與鋒利度，就可以不需要額外設置從動滾輪。 In step S3, the driven roller 60 presses the film 2 against the first cutter 30 to improve the cutting quality, but the arrangement of the driven roller 60 is not intended to limit the present invention. In other embodiments, if the blade portion 320 of the first cutter 30 has sufficient length and sharpness, there is no need to additionally provide a driven roller.

步驟S4係為自第二膜層22移除廢料第一膜層部分21b。如圖7所示，當第一膜層21被裁切後，圖案化第一膜層部分21a會隨著第二 膜層22一起被輸送至層膜吸附平台20上，並且廢料第一膜層部分21b被廢膜回收輪140回收。 Step S4 is to remove the waste first film layer portion 21 b from the second film layer 22. As shown in FIG. 7, when the first film layer 21 is cut, the patterned first film layer portion 21a will follow the second The film layer 22 is transported to the layered film adsorption platform 20 together, and the waste first film layer part 21b is recovered by the waste film recovery wheel 140.

在本實施例中，第一刀具30裁切第一膜層21(步驟S3)以及自第二膜層22移除廢料第一膜層部分21b(步驟S4)可以同時進行。詳細來說，當第一刀具30轉動以裁切第一膜層21時，層膜輸送機構10的廢膜回收輪140也同時轉動，因此裁切第一膜層21後所形成的廢料第一膜層部分21b立即經由廢膜回收輪140被移除回收，並不需要等到第一刀具30結束裁切第一膜層21後才移除廢料第一膜層部分21b。然而，在其他實施例中，裁切第一膜層21以及移除廢料第一膜層部分21b兩個步驟可以分開進行。 In this embodiment, the cutting of the first film layer 21 by the first cutter 30 (step S3) and the removal of the waste first film layer portion 21b from the second film layer 22 (step S4) can be performed simultaneously. In detail, when the first cutter 30 rotates to cut the first film layer 21, the waste film recycling wheel 140 of the film transport mechanism 10 also rotates at the same time, so the waste material formed after cutting the first film layer 21 is first The film layer portion 21b is immediately removed and recycled via the waste film recycling wheel 140, and it is not necessary to wait until the first cutter 30 finishes cutting the first film layer 21 before removing the waste first film layer portion 21b. However, in other embodiments, the two steps of cutting the first film layer 21 and removing the waste first film layer portion 21b can be performed separately.

步驟S5係為以第二刀具沿著裁切路徑裁切第二膜層。如圖7和圖8所示，透過層膜輸送機構10將層膜2輸送預定距離，以使圖案化第一膜層部分21a與第二膜層22移動至第二刀具40下方。層膜吸附平台20沿著垂直方向D2上升以承載圖案化第一膜層部分21a。第二刀具40下降靠近層膜2，以裁切第二膜層22。 Step S5 is to cut the second film layer along the cutting path with the second cutter. As shown in FIGS. 7 and 8, the layer film 2 is transported a predetermined distance through the layer film transport mechanism 10 so that the patterned first film layer portion 21 a and the second film layer 22 move below the second cutter 40. The film adsorption platform 20 rises along the vertical direction D2 to carry the patterned first film layer portion 21a. The second cutter 40 descends close to the layer film 2 to cut the second film layer 22.

如圖9所示，第二刀具40相對層膜吸附平台20沿著裁切路徑P移動而完全切割第二膜層22。裁切路徑P圍繞圖案化第一膜層部分21a，並且裁切路徑P與圖案化第一膜層部分21a的邊緣211彼此間隔。於第二膜層22被第二刀具40裁切後，被裁切的第二膜層22仍貼附有圖案化第一膜層部分21a，並且被裁切之第二膜層22的尺寸大於圖案化第一膜層部分21a的尺寸。此處，所述「第二刀具40完全切割第二膜層22」是指第二刀具40會裁斷第二膜層22，也就是說第二刀具40完全切割層膜2。 As shown in FIG. 9, the second cutter 40 moves relative to the film adsorption platform 20 along the cutting path P to completely cut the second film layer 22. The cutting path P surrounds the patterned first film portion 21a, and the cutting path P and the edge 211 of the patterned first film portion 21a are spaced apart from each other. After the second film layer 22 is cut by the second cutter 40, the cut second film layer 22 is still attached with the patterned first film layer portion 21a, and the size of the cut second film layer 22 is larger than The size of the first film layer portion 21a is patterned. Here, the "second cutter 40 completely cuts the second film layer 22" means that the second cutter 40 cuts the second film layer 22, that is, the second cutter 40 completely cuts the layer film 2.

經由第一刀具30和第二刀具40裁切後的層膜2可被黏附於晶圓上。請參照圖10，為根據本發明一實施例之晶圓貼膜機的示意圖。在本實施例中，晶圓貼膜機3包含前述的層膜裁切裝置1以及一貼膜裝置1a。關於層膜裁切裝置1的詳細元件組成請參照前述說明，以下不再贅述。 The layer film 2 cut by the first cutter 30 and the second cutter 40 can be adhered to the wafer. Please refer to FIG. 10, which is a schematic diagram of a wafer mounter according to an embodiment of the present invention. In this embodiment, the wafer sticking machine 3 includes the aforementioned layer film cutting device 1 and a sticking device 1a. For the detailed component composition of the layer film cutting device 1, please refer to the foregoing description, and will not be repeated below.

貼膜裝置1a包含一下腔體80以及一上腔體90。下腔體80 設置有一晶圓載台810，其用以承載一晶圓4，且晶圓4例如為矽晶圓。上腔體90設置有一吸盤910。在本實施例中，上腔體90具有一貼膜位置以及一吸膜位置。於貼膜位置時，上腔體90位於下腔體80上方，並且吸盤910面向晶圓載台810。於吸膜位置時，上腔體90位於層膜吸附平台20上方，並且吸盤910面向層膜吸附平台20。上腔體90可被驅動裝置(未繪示)驅動而在貼膜位置與吸膜位置之間往復移動。 The film sticking device 1a includes a lower cavity 80 and an upper cavity 90. Lower cavity 80 A wafer carrier 810 is provided for carrying a wafer 4, and the wafer 4 is, for example, a silicon wafer. The upper cavity 90 is provided with a suction cup 910. In this embodiment, the upper cavity 90 has a film sticking position and a film suction position. At the film sticking position, the upper cavity 90 is located above the lower cavity 80 and the suction cup 910 faces the wafer stage 810. When in the film suction position, the upper cavity 90 is located above the film suction platform 20, and the suction cup 910 faces the film suction platform 20. The upper cavity 90 can be driven by a driving device (not shown) to move back and forth between the film sticking position and the film sucking position.

請一併參照圖11和圖12。圖11和圖12為圖10之晶圓貼膜機執行晶圓貼膜方法的示意圖。在本實施例中，晶圓貼膜方法包含裁切層膜2的程序以及將層膜2黏附於晶圓4上的程序。裁切層膜2的程序請參照前述的層膜裁切方法(步驟S1~S5)，以下不再贅述。 Please refer to Figure 11 and Figure 12 together. 11 and 12 are schematic diagrams of the wafer attaching method performed by the wafer attaching machine of FIG. 10. In this embodiment, the wafer attaching method includes a process of cutting the layered film 2 and a process of attaching the layered film 2 to the wafer 4. For the procedure of cutting the layered film 2, please refer to the aforementioned layered film cutting method (steps S1 to S5), which will not be described in detail below.

於層膜2被層膜裁切裝置1裁切完成後，以上腔體90拾取被裁切的第二膜層22至晶圓4上方。如圖11所示，上腔體90移動至吸膜位置，並且層膜吸附平台20沿著垂直方向D2上升，使得層膜2靠近上腔體90的吸盤910。於吸盤910吸取第二膜層22後，層膜吸附平台20沿著垂直方向D2的反方向下降復歸至原位置。 After the layer film 2 is cut by the layer film cutting device 1, the upper cavity 90 picks up the cut second film layer 22 to the top of the wafer 4. As shown in FIG. 11, the upper cavity 90 moves to the film suction position, and the film adsorption platform 20 rises along the vertical direction D2 so that the film 2 is close to the suction cup 910 of the upper cavity 90. After the suction cup 910 sucks the second film layer 22, the film suction platform 20 descends along the opposite direction of the vertical direction D2 and returns to the original position.

接著，將圖案化第一膜層21a貼附於晶圓4上。如圖12所示，上腔體90自吸膜位置移動至貼膜位置，使得層膜2位於晶圓4上方，並且圖案化第一膜層部分21a面向晶圓4。上腔體90下降以將圖案化第一膜層部分21a貼附於晶圓4。晶圓4可以被加熱以增加圖案化第一膜層部分21a的流動性與黏性。由於圖案化第一膜層部分21a的尺寸小於晶圓4的尺寸，能夠防止圖案化第一膜層部分21a因為流動溢出至晶圓4的邊緣或背面。 Next, the patterned first film layer 21a is attached to the wafer 4. As shown in FIG. 12, the upper cavity 90 moves from the film suction position to the film attaching position, so that the layered film 2 is located above the wafer 4 and the patterned first film layer portion 21a faces the wafer 4. The upper cavity 90 descends to attach the patterned first film portion 21 a to the wafer 4. The wafer 4 may be heated to increase the fluidity and viscosity of the patterned first film portion 21a. Since the size of the patterned first film portion 21a is smaller than the size of the wafer 4, the patterned first film portion 21a can be prevented from overflowing to the edge or the back surface of the wafer 4 due to flow.

待前述加熱的圖案化第一膜層21a冷卻固化後，可選擇性地撕除第二膜層22。由於圖案化第一膜層部分21a不會過度溢出，在圖案化第一膜層部分21a固化後不會包覆第二膜層22邊緣。因此，固化的圖案化第一膜層部分21a不會干擾第二膜層22的移除，而有助於提升撕除第二膜 層的效率。 After the previously heated patterned first film layer 21a is cooled and solidified, the second film layer 22 can be selectively removed. Since the patterned first film portion 21a will not overflow excessively, the edge of the second film layer 22 will not be covered after the patterned first film portion 21a is cured. Therefore, the cured patterned first film layer portion 21a does not interfere with the removal of the second film layer 22, and helps to improve the tearing of the second film. The efficiency of the layer.

綜上所述，本發明所揭露的層膜裁切方法以及層膜裁切裝置中，以不同的刀具分別裁切層膜的兩個膜層，而讓裁切後的第一膜層與第二膜層具有不同尺寸。層膜裁切裝置還可搭載於晶圓貼膜機，以便晶圓貼膜機執行晶圓貼膜方法。採用本發明所揭露的層膜裁切方法裁切的層膜具有尺寸比晶圓小的乾膜以及尺寸比晶圓大或跟晶圓相等的麥拉膜。藉此，當層膜貼附於晶圓時，能防止被加熱的乾膜(第一膜層)從晶圓與麥拉膜(第二膜層)之間的間隙溢出，有助於避免乾膜汙染晶圓的邊緣或背面。 In summary, in the layer film cutting method and the layer film cutting device disclosed in the present invention, two layers of the layer film are respectively cut by different cutters, and the first film layer and the first film layer after being cut are cut The two film layers have different sizes. The layer film cutting device can also be mounted on a wafer laminator so that the wafer laminator can perform the wafer laminating method. The layer film cut by the layer film cutting method disclosed in the present invention has a dry film with a size smaller than that of a wafer and a Mylar film with a size larger than or equal to that of the wafer. This prevents the heated dry film (first film layer) from overflowing from the gap between the wafer and Mylar film (second film layer) when the film is attached to the wafer, which helps prevent dry film The film contaminates the edge or back of the wafer.

此外，因被裁切的第一膜層的直徑尺寸小於第二膜層的直徑尺寸，縱使第一膜層被加熱後會在第二膜層邊緣處固化，卻不會包覆第二膜層邊緣處。藉此，第二膜層不會因為固化第一膜層的阻礙而有難以被掀離的問題，有助於提升後續撕除第二膜層的效率。 In addition, since the diameter of the first film layer to be cut is smaller than the diameter of the second film layer, even if the first film layer is heated, it will solidify at the edge of the second film layer, but it will not cover the second film layer. At the edge. Thereby, the second film layer will not be difficult to be lifted off due to the hindrance of curing the first film layer, which helps to improve the efficiency of subsequent tearing off of the second film layer.

雖然本發明以前述之實施例揭露如上，然而這些實施例並非用以限定本發明。在不脫離本發明之精神和範圍內，所為之更動與潤飾，均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention is disclosed above with the foregoing embodiments, these embodiments are not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of the patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached scope of patent application.

1:層膜裁切裝置1: Layer film cutting device

10:層膜輸送機構10: Layer film conveying mechanism

110:第一輸送輪110: The first conveyor wheel

120:第二輸送輪120: second conveyor wheel

130:導膜輪130: film guide wheel

140:廢膜回收輪140: Waste film recycling wheel

20:層膜吸附平台20: Layer membrane adsorption platform

30:第一刀具30: First tool

310:本體310: body

320:刀刃部320: Blade

40:第二刀具40: second tool

50:拉膜機構50: Film pulling mechanism

60:從動滾輪60: driven roller

R:裁切工作區R: Cutting work area

D1:輸送方向D1: Conveying direction

D2:垂直方向D2: vertical direction

Claims (14)

一種層膜裁切方法，包含：提供一層膜，包含堆疊設置的一第一膜層以及一第二膜層；以一第一刀具裁切該第一膜層，而得到貼附於該第二膜層上的一圖案化第一膜層部分以及一廢料第一膜層部分；自該第二膜層移除該廢料第一膜層部分；以及以一第二刀具沿著一裁切路徑裁切該第二膜層，而使被裁切的該第二膜層貼附有該圖案化第一膜層部分，其中該裁切路徑圍繞該圖案化第一膜層部分並且與該圖案化第一膜層部分的邊緣彼此間隔。 A method for cutting a layered film includes: providing a layer of film, including a first film layer and a second film layer that are stacked; A patterned first film part and a waste first film part on the film; removing the waste first film part from the second film; and cutting along a cutting path with a second cutter The second film layer is cut so that the cut second film layer is attached to the patterned first film layer portion, wherein the cutting path surrounds the patterned first film layer portion and is connected to the patterned second film layer. The edges of a film portion are spaced apart from each other. 如申請專利範圍第1項所述之層膜裁切方法，其中當該第一刀具裁切該第一膜層時，該第一刀具不會完全切割該第二膜層。 The layer film cutting method described in the first item of the scope of patent application, wherein when the first cutter cuts the first film layer, the first cutter does not completely cut the second film layer. 如申請專利範圍第1項所述之層膜裁切方法，其中該第一刀具為滾刀。 The layer film cutting method described in item 1 of the scope of patent application, wherein the first cutter is a hob. 如申請專利範圍第1項所述之層膜裁切方法，其中該第一膜層為乾膜，且該第二膜層為麥拉(Mylar)膜。 According to the method for cutting a layered film as described in item 1 of the scope of the patent application, the first film layer is a dry film, and the second film layer is a Mylar film. 如申請專利範圍第1項所述之層膜裁切方法，其中同時進行以該第一刀具裁切該第一膜層以及自該第二膜層移除該廢料第一膜層部分。 The layer film cutting method as described in item 1 of the scope of patent application, wherein the first film layer is cut by the first cutter and the waste first film layer portion is removed from the second film layer at the same time. 如申請專利範圍第1項所述之層膜裁切方法，更包含：於該第一刀具裁切該第一膜層前，以一拉膜機構夾持並且撐開該層膜。 The film cutting method as described in item 1 of the scope of the patent application further includes: before the first cutter cuts the first film layer, a film pulling mechanism is used to clamp and stretch the film layer. 一種層膜裁切裝置，包含： 一層膜輸送機構，用以輸送一層膜進入或離開一裁切工作區；一層膜吸附平台，設置於該裁切工作區；一滾刀，設置以半切割該層膜；以及一刀具，設置以完全切割該層膜，且該刀具可相對該層膜吸附平台移動；其中，該層膜輸送機構沿一輸送方向輸送該層膜進入該裁切工作區，且該滾刀與該刀具沿該輸送方向依序設置。 A layer film cutting device, comprising: A layer of film conveying mechanism is used to convey a layer of film into or out of a cutting work area; a layer of film suction platform is set in the cutting work area; a hob is set to half-cut the layer of film; and a cutter is set to The film is completely cut, and the cutter can move relative to the film adsorption platform; wherein, the film conveying mechanism conveys the film in a conveying direction into the cutting work area, and the hob and the cutter are conveyed along the The directions are set in order. 如申請專利範圍第7項所述之層膜裁切裝置，其中該層膜輸送機構包含一第一輸送輪以及一第二輸送輪，該裁切工作區介於該第一輸送輪與該第二輸送輪之間，該層膜被該層膜輸送機構輸送而自該第一輸送輪進入該裁切工作區，且該第一輸送輪較該第二輸送輪更靠近該滾刀。 The layer film cutting device described in item 7 of the scope of patent application, wherein the layer film conveying mechanism includes a first conveying wheel and a second conveying wheel, and the cutting work area is between the first conveying wheel and the first conveying wheel. Between the two conveying wheels, the film is conveyed by the film conveying mechanism and enters the cutting work area from the first conveying wheel, and the first conveying wheel is closer to the hob than the second conveying wheel. 如申請專利範圍第7項所述之層膜裁切裝置，其中該滾刀包含至少一刀刃部，且該至少一刀刃部的長度小於該層膜的厚度。 The layer film cutting device according to item 7 of the scope of patent application, wherein the hob includes at least one blade portion, and the length of the at least one blade portion is less than the thickness of the layer film. 如申請專利範圍第7項所述之層膜裁切裝置，更包含一從動滾輪，設置於該滾刀的一側。 As described in item 7 of the scope of patent application, the film cutting device further includes a driven roller arranged on one side of the hob. 如申請專利範圍第7項所述之層膜裁切裝置，其中該滾刀與該刀具為相異的兩個刀具。 The layer film cutting device described in item 7 of the scope of patent application, wherein the hob and the cutter are two different cutters. 如申請專利範圍第7項所述之層膜裁切裝置，更包含一拉膜機構，設置於該裁切工作區以夾持並且撐開該層膜。 The film cutting device described in item 7 of the scope of patent application further includes a film pulling mechanism, which is arranged in the cutting work area to clamp and stretch the film. 一種晶圓貼膜方法，包含：提供一層膜，包含堆疊設置的一第一膜層以及一第二膜層； 以一第一刀具裁切該第一膜層，而得到貼附於該第二膜層上的一圖案化第一膜層部分以及一廢料第一膜層部分；自該第二膜層移除該廢料第一膜層部分；以一第二刀具沿著一裁切路徑裁切該第二膜層，而使被裁切的該第二膜層貼附有該圖案化第一膜層部分，其中該裁切路徑圍繞該圖案化第一膜層部分並且與該圖案化第一膜層部分的邊緣彼此間隔；以一貼膜裝置拾取被裁切的該第二膜層至一晶圓上方；以及將貼附於該第二膜層上的該圖案化第一膜層貼附於該晶圓上。 A method for attaching a film to a wafer includes: providing a layer of film, including a first film layer and a second film layer that are stacked; Cut the first film layer with a first cutter to obtain a patterned first film layer portion and a waste first film layer portion attached to the second film layer; remove from the second film layer The first film layer portion of the waste material; cutting the second film layer along a cutting path with a second cutter, so that the cut second film layer is attached to the patterned first film layer portion, Wherein the cutting path surrounds the patterned first film portion and is spaced apart from the edge of the patterned first film portion; picking up the cut second film layer onto a wafer with a film sticking device; and The patterned first film layer attached to the second film layer is attached to the wafer. 一種晶圓貼膜機，包含：一層膜裁切裝置，包含：一層膜輸送機構，用以輸送一層膜進入或離開一裁切工作區；一層膜吸附平台，設置於該裁切工作區；一滾刀，設置以半切割該層膜；以及一刀具，設置以完全切割該層膜，且該刀具可相對該吸附平台移動；以及一貼膜裝置，包含：一下腔體，設置有一晶圓載台；以及一上腔體，設置有一吸盤，該上腔體於一貼膜位置時位於該晶圓載台上方，該上腔體於一吸膜位置時位於該層膜吸附平台上方，且該上腔體可在該貼膜位置與該吸膜位置之間往復移動。A wafer sticking machine includes: a layer of film cutting device, including: a layer of film conveying mechanism for conveying a layer of film into or out of a cutting work area; a layer of film adsorption platform arranged in the cutting work area; A knife arranged to half-cut the layer of film; and a knife arranged to completely cut the layer of film, and the knife can move relative to the adsorption platform; and a film sticking device, including: a lower cavity provided with a wafer carrier; and An upper cavity is provided with a suction cup, the upper cavity is located above the wafer carrier when in a film attaching position, the upper cavity is located above the film adsorption platform when in a film suction position, and the upper cavity can be The film sticking position and the film suction position move back and forth.
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