KR20210029112A - Film cutting device, film cutting method, wafer laminating method and wafer laminator - Google Patents

Abstract

Provided is a film cutting method, comprising the steps of: providing a multi-layered film including a first film and a second film stacked together; cutting a first film layer by a first cutter to obtain a waste first layer portion attached to a second film layer and a patterned first layer portion; removing the waste first film layer portion from the second film layer; and cutting the second film layer by a second cutter along a cutting path to obtain a second film layer portion to which the patterned first film layer portion is attached. The cutting path surrounds the patterned first film layer portion and is spaced apart from the edge of the patterned first film layer portion. The present invention reduces contamination on the edge and the rear surface of a wafer due to melted dry films.

Description

Film cutting device, film cutting method, wafer laminating method, and wafer laminator {FILM CUTTING DEVICE, FILM CUTTING METHOD, WAFER LAMINATING METHOD AND WAFER LAMINATOR}

The present disclosure relates to a film cutting device and a film cutting method, in particular a film cutting device comprising at least two different cutters and a film performed by at least two different cutters It relates to the cutting method. The present disclosure also relates to a wafer laminator comprising the film cutting device and a wafer laminating method comprising the film cutting method.

With regard to the fabrication of semiconductor integrated circuits and microelectromechanical devices, a thin film may be attached to the upper surface or the back side of the wafer for subsequent processing of the fabrication. Films attached to the wafer include, but are not limited to, a blue adhesive plastic film, a white adhesive plastic film, a thin protective film, a UV film, and a die attach film (DAF). Any particles produced in the process particles can adhere to the thin film, and then the thin film is removed to dislodge the particles from the wafer. In general, the thin film attached to the wafer is a multilayer film comprising at least a dry film layer and a Mylar film layer. The dry film layer is melted by heating and becomes fluid and sticky, so that the dry film layer can be firmly attached to the surface of the wafer.

Currently, the dry film layer and the Mylar film layer are mainly full-cut in a single process using a single cutter, and these two films have the same size, and the size is mainly similar to the wafer size. When the film is attached to the wafer, the heated dry film layer may overflow in the gap between the wafer and the Mylar film layer due to its fluidity, resulting in contamination of the machine or microstructure formed on the wafer surface.

Also, when the dry film layer is heated, it can overflow and solidify to cover the edges of the mylar film layer. In the process of removing the Mylar film layer after the film is attached to the wafer, the solidified dry film layer at the edge of the Mylar film layer may cause a problem that the Mylar film layer is difficult to peel off, and as a result The removal efficiency of the mylar film layer is inferior.

In order to solve the above-described at least one problem, the present disclosure provides a film cutting method and a film cutting apparatus which is advantageous in preventing overflow of a heated dry film. The present disclosure also provides a laminating method and a wafer laminator.

According to an aspect of the present disclosure, a method of cutting a film includes the following steps: providing a multilayer film comprising a first film layer and a second film layer laminated together; Cutting the first film layer by a first cutter to obtain a waste first film layer portion attached to the second film layer and a patterned first film layer portion; Removing a portion of the waste first film layer from the second film layer; And cutting the second film layer by a second cutter along the cutting path to obtain a second film layer portion to which the patterned first film layer portion is attached. The cutting path surrounds the patterned first film layer portion, and an edge of the patterned first film layer portion is spaced apart from the cutting path.

According to another aspect of the present disclosure, a film cutting apparatus includes a film conveyor, a film suction stage, a roller cutter, and a cutter. The film conveyor is configured to convey the multilayer film into or out of the cutting work area. The film suction stage is disposed within the cutting working area. The roller cutter is configured to half-cut the multilayer film, and the cutter is configured to cut the multilayer film entirely. The cutter is movable relative to the film suction stage. The multilayer film can be conveyed to the cutting working area by a film conveyor along the transporting direction, and the roller cutters and cutters are arranged in sequence along the transporting direction.

According to another aspect of the present disclosure, a wafer laminating method includes the following steps: providing a multilayer film comprising a first film layer and a second film layer laminated together; Cutting the first film layer by a first cutter to obtain a waste first film layer portion and a patterned first film layer portion attached to the second film layer; Removing a portion of the waste first film layer from the second film layer; Cutting the second film layer by a second cutter along the cutting path to obtain a second film layer portion to which the patterned first film layer portion is attached-the cutting path surrounds the patterned first film layer portion, The edge of the patterned first film layer portion is spaced from the cutting path; Moving the second film layer portion together with the patterned first film layer portion to a location on the wafer by a laminating apparatus; And attaching a portion of the patterned first film layer to the wafer.

According to another aspect of the present disclosure, a wafer laminator includes a film cutting device and a laminating device. The film cutting apparatus includes a film conveyor, a film suction stage, a roller cutter and a cutter. The film conveyor is configured to convey the multilayer film into or out of the cutting work area. The film suction stage is disposed within the cutting working area. The roller cutter is configured to half-cut the multilayer film, and the cutter is configured to cut the multilayer film entirely. The cutter is movable relative to the film suction stage. The laminating apparatus comprises a lower chamber comprising a wafer loading stage and an upper chamber comprising a film suction chuck. The upper chamber is positioned above the wafer loading stage in the film laminating position, and the upper chamber is positioned above the film suction stage in the film capturing position. The upper chamber can be moved back and forth between the film laminating position and the film capturing position.

According to the present disclosure, the two film layers are cut by different cutters, so that the first film layer and the second film layer have different sizes. The film cutting apparatus may be mounted on the wafer laminator so that the wafer laminator can perform the wafer laminating method. Multilayer film cutting by the method disclosed in the present disclosure includes a dry film characterized by a smaller size than a wafer and a Mylar film characterized by a larger size or substantially the same size than the wafer. Therefore, when the multilayer film is attached to the wafer, the heated dry film (first film layer) can be prevented from overflowing from the gap between the wafer and mylar film (second film layer), due to the molten dry film. It is advantageous to reduce contamination of the edge and back side of the wafer.

In addition, since the size of the cut first film layer is smaller than the size of the second film layer, even if the first film layer is cooled around the second film layer, the edge of the second film layer remains on the solidified first film layer. Not covered by Thus, the second film layer can be peeled off without an influence from the first film layer, which helps to improve the removal efficiency of the second film layer.

1 is a schematic diagram of a film cutting apparatus according to an embodiment of the present disclosure.
2 is a flowchart of a film cutting method according to an embodiment of the present disclosure.
3 to 9 are schematic diagrams of performing a film cutting method by the film cutting apparatus of FIG. 1.
10 is a schematic diagram of a wafer laminator according to an embodiment of the present disclosure.
11 and 12 are schematic diagrams of performing a wafer laminating method by the wafer laminator of FIG. 10.

In the following detailed description, for purposes of explanation, a number of specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown to simplify the drawing.

According to an embodiment of the present disclosure, the film cutting apparatus includes a film conveyor, a film suction stage, a roller cutter, and another cutter. Reference is made to FIG. 1 showing a schematic diagram of a film cutting apparatus according to an embodiment of the present disclosure. In this embodiment, the film cutting device 1 includes a film conveyor 10, a film suction stage 20, a first cutter 30 and a second cutter 40.

The film conveyor 10 includes a first conveyor roller 110, a second conveyor roller 120, a plurality of guiding rollers 130 and two waste collection rollers 140. The cutting working area R is defined between the first conveyor roller 110 and the second conveyor roller 120. The guide roller 130 is disposed on one side of the cutting work area R and is configured to carry a multilayer film roll (not shown in the drawings). The waste collection roller 140 is disposed on the other side of the cutting operation area R and is configured to collect the waste film after the multilayer film is cut. The first conveyor roller 110 and the guide roller 130 are used to guide the multilayer film in a predetermined direction toward the second conveyor roller 120. Accordingly, the film conveyor 10 can transport the multilayer film from the first conveyor roller 110 to the second conveyor roller 120 along the conveying direction D1 in the cutting working area R.

The film suction stage 20 is disposed in the cutting operation area R and is configured to carry the multilayer film in the cutting operation area R. The film suction stage 20 can be moved up and down along a vertical direction D2 orthogonal to the conveying direction D1 by an electric actuator (not shown in the drawing). For example, the first cutter 30 is a roller cutter disposed in the cutting work area R for cutting the film. More specifically, the first cutter 30 may be a rotary die cutter. The first cutter 30 includes a body 310 and at least one blade 320. The body 310 is rotatable about its central axis, and the blade 320 extends from the body 310. In this embodiment, the blade 320 is a ring blade having a thin edge (sharp end) facing the body 310, and the length of the blade 320 is smaller than the thickness of the multilayer film, so that the blade 320 is multilayered The film can be cut in half. The first conveyor roller 110 of the film conveyor 10 is closer to the first cutter 30 than the second conveyor roller 120.

The second cutter 40 is disposed in the cutting work area R and is positioned on the film suction stage 20. The second cutter 40 may be moved relative to the film suction stage 20 in the cutting working area R by an electric actuator (not shown in the drawing), and the second cutter 40 may be applied to the film suction stage 20. ) To cut the multilayer film.

According to an embodiment of the present disclosure, the film cutting apparatus may include a film stretching mechanism. Referring to FIG. 1, the film cutting apparatus 1 further includes a film stretching mechanism 50 disposed in the cutting operation area R for gripping and stretching the multilayer film. The film stretching mechanism 50 includes, for example, a motor and a fixture. The motor drives the fixture to grip the multilayer film and moves the fixture along the stretching direction orthogonal to the conveying direction D1.

According to an embodiment of the present disclosure, the film cutting apparatus may include a track follower (or referred to as a cam follower). Referring to FIG. 1, the film cutting apparatus 1 further includes a track follower 60 disposed on one side of the first cutter 30. The track follower 60 may be in the shape of a cylinder or a disk. When the multilayer film passes through the first cutter 30, the multilayer film is sandwiched between the track follower 60 and the first cutter 30, so that the multilayer film can be in close contact with the first cutter 30.

The present disclosure also provides a method of cutting a film. See FIGS. 2 to 9. 2 is a flowchart of a film cutting method according to an embodiment of the present disclosure. 3 to 9 are schematic diagrams of performing a film cutting method by the film cutting apparatus of FIG. 1. In this embodiment, the film cutting method may be performed by the film cutting device 1, and the film cutting method includes steps S1 to S5.

In step S1, the multilayer film 2 is provided to the film cutting device 1. Referring to FIG. 3, a roll of multilayer film 2 is mounted on a film conveyor 10. The first conveyor roller 110 and the second conveyor roller 120 of the film conveyor 10 rotate to convey the multilayer film 2. In this embodiment, the multilayer film 2 first film layer 21 and second film layer 22 are laminated together. The plastic protective film 2a attached to the first film layer 21 of the multilayer film 2 is peeled in advance, and the peeled plastic protective film 2a is collected by one of the waste collection rollers 140. In this embodiment, the first film layer 21 is a dry film characterized by good adhesion and photosensitivity. The second film layer 22 is a mylar film for protecting the first film layer 21. It is noted that the present disclosure is not limited by the aforementioned materials of each film layer.

In step S2, the multilayer film 2 is gripped and stretched by a film stretching mechanism. Referring to Fig. 4, the film stretching mechanism 50 grips and stretches the multilayer film 2 to remove wrinkles and curls on the multilayer film 2, thereby improving the cutting quality. Note that the present disclosure is not limited by the presence of the film stretching mechanism 50. In some other embodiments, if the guide rollers 130 of the film conveyor 10 are able to successfully draw the multilayer film 2, an additional film drawing mechanism will be unnecessary.

In step S3, the first film layer 21 is cut by the first cutter 30. 5 and 6, the first conveyor roller 110 of the film conveyor 10 may determine a film transport direction. The multilayer film 2 is moved along the conveying direction D1, passes through the space above the film suction stage 20, and is then conveyed to the second conveyor roller 120. The film stretching mechanism 50 can also move along the conveying direction D1 to maintain the surface tension of the multilayer film 2. When the multilayer film 2 passes through the first cutter 30, the track follower 60 presses the multilayer film 2 against the first cutter 30, and the body 310 of the first cutter 30 ) Rotates so that the blade 320 cuts the first film layer 21 of the multilayer film 2. The first film layer 21 cut by the first cutter 30 includes a patterned first film layer portion 21a and a waste first film layer portion 21b, and the patterned first film layer portion ( Both 21a) and the waste first film layer portion 21b are attached to the second film layer 22. Since the length of the blade 320 is smaller than the thickness of the multilayer film 2, the blade 320 does not cut the second film layer 22 entirely.

In this embodiment, the first cutter 30 cuts the first film layer 21 entirely and does not cut the second film layer 22 entirely. That is, the first cutter 30 cuts the multilayer film 2 in half. Here, the phrase "the first cutter 30 cuts the first film layer 21 entirely" means that the first cutter 30 cuts the first film layer 21 to at least the first film layer 21 It means forming two separate parts. The phrase "the first cutter 30 does not cut the entire second film layer 22" means that the first cutter 30 does not cut the second film layer 22 or the first cutter 30 It means cutting the second film layer 22 without penetrating the second film layer 22. The phrase "the first cutter 30 cuts the multilayer film 2 in half" means that the first cutter 30 does not cut the multilayer film 2, and more specifically, the first cutter 30 ) Cuts the first film layer 21 entirely and does not cut the second film layer 22, or the first cutter 30 cuts the first film layer 21 entirely and the second film layer 22 Means to cut it in half.

In step S3, the track follower 60 presses the multilayer film 2 against the first cutter 30 to improve the cutting quality, but the present disclosure is not limited thereto. In some other embodiments, if the blade 320 of the first cutter 30 has a sufficient length and sharpness, the track follower is unnecessary.

In step S4, the waste first film layer portion 21b is removed from the second film layer 22. Referring to FIG. 7, after the first film layer 21 is cut, the second film layer 22 together with the patterned first film layer portion 21a is transported to a position above the film suction stage 20. , The waste first film layer portion 21b is collected by a waste collection roller.

In this embodiment, the cutting of the first film layer 21 by the first cutter 30 (step S3) and the removal of the waste first film layer portion 21b from the second film layer 22 (step S4) are It can be done at the same time. Specifically, when the first cutter 30 rotates to cut the first film layer 21, the waste collection roller 140 of the film conveyor 10 may also rotate. Therefore, the waste first film layer portion 21b generated by cutting of the first film layer 21 is collected by the waste collection roller 140 instead of being collected after the first film layer 21 is completed. It can be collected at the same time. However, in some other embodiments, cutting of the first film layer 21 and removal of the waste first film layer portion 21b may be performed separately.

In step S5, the second cutter cuts the second film layer along the cutting path. 7 and 8, the film conveyor 10 conveys the multilayer film 2 by a predetermined distance and transfers the patterned first film layer portion 21a and the second film layer 22 to a second cutter ( 40) Move to the below position. The film suction stage 20 moves upward along the vertical direction D2 to carry the patterned first film layer portion 21a. The second cutter 40 moves downward to approach the multilayer film 2 in preparation for cutting the second film layer 22.

Referring to FIG. 9, the second cutter 40 moves with respect to the film suction stage 20 along the cutting path P to cut the second film layer 22 entirely. The cutting path P surrounds the patterned first film layer portion 21a, and the edge 211 of the patterned first film layer portion 21a is spaced apart from the cutting path P. After the second film layer 22 is cut by the second cutter 40 to obtain a second film layer portion, the patterned first film layer portion 21a is positioned on the second film layer portion, and the second The film layer portion has a larger size than the patterned first film layer portion 21a. Here, the phrase "the second cutter 40 cuts the entire second film layer 22" means that the second cutter 40 cuts the second film layer 22. That is, the second cutter 40 cuts the entire multilayer film 2.

The multilayer film 2 cut by the first cutter 30 and the second cutter 40 may be attached to the wafer. Reference is made to FIG. 10 showing a schematic diagram of a wafer laminator according to an embodiment of the present disclosure. In this embodiment, the wafer laminator 3 includes the film cutting device 1 and the laminating device 1a described above. An introduction to the constituent elements of the film cutting device 1 may refer to the above description, which will not be repeated hereinafter.

The laminating apparatus 1a includes a lower chamber 80 and an upper chamber 90. The lower chamber 80 includes a wafer loading stage 810 configured to support the wafer 4, and the wafer 4 may be a silicon wafer. The upper chamber 90 includes a film suction chuck 910. In this embodiment, the upper chamber 90 is movable between a film laminating position and a film capturing position. In the film laminating position, the upper chamber 90 is positioned above the lower chamber 80 and the film suction chuck 910 faces the wafer loading stage 810. In the film capturing position, the upper chamber 90 is positioned above the film suction stage 20 and the film suction chuck 910 faces the film suction stage 20. The upper chamber 90 is driven by an electric actuator (not shown in the figure) to move back and forth between the film laminating position and the film capturing position.

See FIGS. 11 and 12. 11 and 12 are schematic diagrams of performing a wafer laminating method by the wafer laminator of FIG. 10. In this embodiment, the wafer laminating method includes a procedure of cutting the multilayer film 2 and another procedure of attaching the multilayer film 2 to the wafer 4. The procedure for cutting the multilayer film 2 may refer to the above-described film cutting method (steps S1 to S5), and will not be repeated thereafter.

After the multilayer film 2 has been cut entirely by the film cutting device 1, the upper chamber 90 picks up the second film layer 22 and moves it to a position on the wafer 4. 11, the upper chamber 90 is in the film capturing position, and the film suction stage 20 moves upward along the vertical direction D2 so that the multilayer film 2 is in the upper chamber 90. Make it close to the film suction chuck 910. After the film suction chuck 910 picks up the second film layer 22, the film suction stage 20 moves downward to its original position.

Next, the patterned first film layer portion 21a is attached to the wafer 4. 12, the upper chamber 90 moves from the film capturing position to the film laminating position. In the film laminating position, the multilayer film 2 is placed over the wafer 4 and the patterned first film layer portion 21a faces the wafer 4. The upper chamber 90 moves downward to adhere the patterned first film layer portion 21a to the upper surface of the wafer 4. The wafer 4 may be preheated to increase the mobility and viscosity of the patterned first film layer portion 21a. Since the patterned first film layer portion 21a has a smaller size than the wafer 4, the molten patterned first film layer portion 21a flows over the edge of the wafer 4 and It is prevented from contaminating the rear surface.

After the above-described patterned first film layer portion 21a is solidified by a cooling process, the second film layer 22 may be removed in a selective manner. Since overflow of the molten patterned first film layer portion 21a is prevented, the patterned first film layer portion 21a does not cover the edge of the second film layer 22. Accordingly, the solidified patterned first film layer portion 21a will not interfere with the removal of the second film layer 22, thus helping to improve the peeling efficiency of the second film layer.

According to the present disclosure, the two film layers are cut by different cutters, so that the first film layer and the second film layer have different sizes. A film cutting apparatus may be mounted on the wafer laminator to enable the wafer laminator to perform the wafer laminating method. Multilayer films cut by the methods disclosed in the present disclosure include dry films characterized by a size smaller than a wafer and Mylar films characterized by a larger size or substantially the same size than a wafer. Therefore, when the multilayer film is attached to the wafer, the heated dry film (first film layer) can be prevented from overflowing from the gap between the wafer and mylar film (second film layer), due to the molten dry film. It is advantageous to reduce contamination of the edge and back side of the wafer.

In addition, since the size of the cut first film layer is smaller than the size of the second film layer, even if the first film layer is cooled around the second film layer, the edge of the second film layer remains on the solidified first film layer. Not covered by Thus, the second film layer can be peeled off without an influence from the first film layer, which helps to improve the removal efficiency of the second film layer.

It will be apparent to those skilled in the art that various modifications and changes may be made to the present disclosure. It is intended that this specification and examples be considered as illustrative embodiments only, and the scope of the disclosure is indicated by the following claims and their equivalents.

Claims (14)

Providing a multilayer film comprising a first film layer and a second film layer laminated together;
The first film layer is formed by a first cutter to obtain a waste first film layer portion and a patterned first film layer portion attached to the second film layer. Cutting;
Removing a portion of the waste first film layer from the second film layer; And
Cutting the second film layer by a second cutter along a cutting path to obtain a second film layer portion to which the patterned first film layer portion is attached-The cutting path is the patterned second film layer. 1 surrounding a portion of the film layer, the edge of the patterned portion of the first film layer being spaced apart from the cutting path;
Containing, film cutting method.
The method of claim 1,
The second film layer is not cut entirely by the first cutter when the first cutter cuts the first film layer, the film cutting method.

The method of claim 1,
The first cutter is a roller cutter, a film cutting method.
The method of claim 1,
The first film layer is a dry film (dry film), the second film layer is a Mylar film (Mylar film), a film cutting method.
The method of claim 1,
The step of cutting the first film layer by the first cutter and the step of removing a portion of the waste first film layer from the second film layer are performed simultaneously.
The method of claim 1,
Before the first cutter cuts the first film layer, the film cutting method further comprises gripping and stretching the multilayer film by a film stretching mechanism.
A film conveyor configured to convey the multilayer film into or out of the cutting work area;
A film suction stage disposed within the cutting operation area;
A roller cutter configured to half-cut the multilayer film; And
A cutter configured to cut the entire multilayer film, the cutter being movable with respect to the film suction stage;
Including,
The multilayer film is conveyed to the cutting work area by the film conveyor along a conveying direction, and the roller cutter and the cutter are arranged in sequence along the conveying direction.
The method of claim 7,
The film conveyor includes a first conveyor roller and a second conveyor roller, the cutting working area is located between the first conveyor roller and the second conveyor roller, and the multilayer film is formed by the first conveyor roller. A film cutting apparatus, conveyed from a conveyor roller to the cutting working area, wherein a first conveyor roller is closer to the roller cutter than to the second conveyor roller.
The method of claim 7,
The roller cutter comprises at least one blade, and the length of the at least one blade is smaller than the thickness of the multilayer film.
The method of claim 7,
Further comprising a track follower disposed on one side of the roller cutter, film cutting apparatus.
The method of claim 7,
The roller cutter and the cutter are different cutters, film cutting apparatus.
The method of claim 7,
The film cutting apparatus further comprising a film stretching mechanism disposed in the cutting operation area and configured to grip and stretch the multilayer film.
Providing a multilayer film comprising a first film layer and a second film layer laminated together;
Cutting the first film layer by a first cutter to obtain a waste first film layer portion and a patterned first film layer portion attached to the second film layer;
Removing a portion of the waste first film layer from the second film layer;
Cutting the second film layer by a second cutter along a cutting path to obtain a second film layer portion to which the patterned first film layer portion is attached-the cutting path is the patterned first film layer portion And the edge of the patterned first film layer portion is spaced apart from the cutting path;
Moving the second film layer portion together with the patterned first film layer portion to a position on the wafer by a laminating apparatus; And
Attaching a portion of the patterned first film layer to the wafer;
Containing, wafer laminating method.
Film cutting device; And
Laminating device;
Including,
The film cutting device,
A film conveyor configured to convey the multilayer film into or out of the cutting work area;
A film suction stage disposed in the cutting operation area;
A roller cutter configured to cut the multilayer film in half; And
A cutter configured to cut the entire multilayer film, the cutter being movable with respect to the film suction stage;
Including,
The laminating device,
A lower chamber including a wafer loading stage; And
An upper chamber comprising a film suction chuck-the upper chamber is located above the wafer loading stage in a film laminating position, and the upper chamber is the film in a film capturing position. Located above the suction stage, the upper chamber being able to move back and forth between the film laminating position and the film capturing position;
Containing, a wafer laminator.

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